Upload
nguyentu
View
215
Download
1
Embed Size (px)
Citation preview
Ke Wu
Canada Research Chair in Radio-Frequency and Millimetre-Wave EngineeringPoly-Grames Research Center
Center for Radio-Frequency Electronics Research (CRÉER) of QuebecDepartment of Electrical Engineering
Ecole Polytechnique (University of Montreal), [email protected]
Substrate Integrated Circuits (SICs) and Systems for RF and Millimeter-wave Applications
2
IntroductionDrawbacks of standard planar transmission line technologies
Need for compact, low-loss, low-cost integrated waveguides and circuits
Integration issues
Substrate Integrated Circuits (SICs) and SystemsPerformance of substrate embedded waveguides
Recent achievements in the field of substrate integrated circuits (SICs)
System-on-Substrate (SoS) Concepts
Future challenges and possibilities
Conclusions
OUTLINE
3
Drawbacks of current technologies
EM field singularities cause high current densities in the conductor edges→ high conductor lossesSemi-opened and/or unbounded planar circuits are subject to packaging problem and radiation losses→ high cross-talk and transmission losses
Microstrip Coplanar Waveguide (CPW)
Introduction
4
Performance gap at mmW frequencies
• Electrically large mmW components rely on low loss technology• Gap between lossy planar waveguides and bulky metal waveguides needs to be
closed.
5
Design Examples of Microstrip to Rectangular Waveguide Transition
a) Probe Type b) Ridge Type
6
(a) (b) (c)
(d) (e) (f)
Synthesized Waveguides and Substrate Integrated Circuits (SICs)non-planar structure in planar form
7
Substrate Integrated Circuits (SICs)
☺ Complete integration of planar circuits (surface type) and non-planar circuits (volume type) on the same dielectric substrate and fabrication process
☺ Synthesized waveguides made of metallic fences and/or dielectric contrasts compatible with planar substrate (electrically, mechanically, and thermally)
☺ Potential hybrid and monolithic features such as planar multilayer, miniaturization, self-packaging, tunability, electro-optical control and conversation
8
Substrate Integrated Waveguide
Early version of SIW filter
9
Substrate Integrated Non-Radiative Dielectric Waveguide
SINRD LSM11 mode(only half the structure is shown) Early SINRD filter
(7th order, without cover)
10
Substrate Integrated Image Guide
Fundamental Ey11 mode
(only half the structure is shown)
Silicon SIIG prototype
11
Interfacing / Transitions
wS
lS
w
b
ar
p
x
z
y
Courant electriqueChamp magnetique
Waveguide ↔ SIIG
CPW ↔ SIW
Microstrip ↔ SIW
CPW ↔ SIIG
12
In-Line Four-Pole Dual-Mode Filter
13
Substrate Integrated Waveguide Antennasλg/2 3λg/4
lf of
ae slotted antenna
leaky-wave antenna
Ondes
de fui
te
14
Integrated SIW antenna/feeder module
Antipodal Linearly Tapered Slot Antenna (ALTSA)
1 x 16 SIW-ALTSA field profile
1x 8 SIW-ALTSA photo
Measured radiation pattern
of 1x 8 SIW-ALTSA at
10 GHz with18.76dBi gain
15
Substrate Integrated Waveguide Directional Couplers
Weff
LaLs
Ws
L1
L2
L1
L2
(a) (b)
1 4
2 3 2 3
1 4
Weff
16
Substrate Integrated Waveguide OscillatorL
b
W
90Ω
JP1 JP2
P_INJ
P_OSC
P_AP_B
ATF36077AMPLIFIER
SIW CAVITY
W c
Gc
Wp
LpLx
PHASE STUBS
LOOP LENGTH
17
Integrated FMCW Radar System on Substrate (SoS)
18
Synthesized or Substrate Integrated NRD-Guide
Standard NRD Guide Generalized NRD Guide Substrate Integrated NRD Guide
εR εRεR1 εRεR1
Air Holes
19
94 GHz 3rd Order Alumina SINRD Guide Filter
S1 S2
L1L2
Wt
S1
L2L1
L1 = 0.180mm, L2 = 0.449mm S1 = 1.082mm, S2 = 1.118mm, Wt = 0.737mm
20
Simulated and Measured Results
87 89 91 93 95 97 99 101 103-50
-45
-40
-35
-30
-25
-20
-15
-10
-5
0
5
GHz
dBS
11(sim) S
21(sim) S
11(mea) S
21(mea)
21
System-on-Substrate (SoS) Concepts
Advanced Technological Features
☺ Nano-structured “zero” loss and agile/tunable substrates☺ Traveling-wave electro-optical devices☺ Mixed integration of different waveguides on substrate☺ High-density multilayer integration☺ Monolithic integration of “passive” and “active” circuits on substrate including
antennas☺ (Sub)millimeter-wave VLSI (very-large scale integration)☺ Terahertz electronics and photonics☺ Bridging the gap between electronic and optical systems
22
Complementary Modal Field Profiles
a) b)
E field E field
23
Other Examples of Multi-port SICs
SIW cruciform directional coupler or cross-over
1
3 2
4
5
68
7
W-band multi-port receiver circuit
Substrate integrated waveguide circulator
24
24/77 GHz dual band antenna system
140-280 GHz think-film SIW band-pass filter(Prof. Ian Robertson, University of Leeds, UK)
(b)
Traveling-wave photodetector and modulator
25
Substrate Integrated Folded Waveguide (SIFW)(from Dr. Paul R. Young, University of Kent, UK)
a
a/2
a/3a/4 4 layer
3 layer
26
SIW and Half-Mode SIW (HMSIW) Structures
Evolution of HMSIW from SIW
HMSIW
SIW
Dominant modes in HMSIW and SIW
27
SIIG W-band Antennas
94-GHz SIIG planarDielectric rod antenna
94-GHz SIIG array antenna
28
Substrate Integrate Circuits (SICs)→ Combining planar and synthesized non-planar guiding structures
Example of a substrate integrated circuit
29
Conclusions
☺ Substrate integrated circuits (SICs) for low-cost/high-density RF/millimeter-wave/terahertz and photonic wireless ICs and system applications
☺ Hybrid design platforms such as planar-substrate integrated waveguide (SIW) & planar-substrate integrated dielectric guides
☺ Potential monolithic SICs with semiconductor and/or smart substrate towards System-on-Substrate (SoS) approach for future millimeter-wave and photonic wireless applications
☺ Bridging the technological gap between electronics and photonics for GHz and THz innovations and discoveries
30
Acknowledgements
☺ Many year contributions by the speaker’s students and research fellows as well as technical support of technologists at the Poly-Grames Research Center have made this presentation possible
☺ The speaker is grateful to Canadian NSERC (Natural Sciences and Engineering Research Council) and Quebecois funding agency (FQRNT) for their financial support through multiple grants
☺ Worldwide collaborators including Prof. Wei Hong and his team at Southeast University (China), Prof. Maurizio Bozzi and his colleagues at University of Pavia (Italy) and others have made contributions to this presentation