Upload
others
View
8
Download
1
Embed Size (px)
Citation preview
External Use
TM
Supply Chain Management and Manufacturing Strategies for Supply AssuranceFTF-AUT-F0354
A P R . 2 0 1 4
Michelle Marr, Ryan DohseMr. Herbert Nebl - Daimler
TM
External Use 1
Introductions
• Freescale and Daimler have teamed up for a co-operative presentation focusing on automotive supply chain management disciplines from OEM and Semiconductor Supplier Perspective
• Today’s Presenters
• A Question and Answer session will follow each presentation
Daimler – Mercedes-Benz Freescale Supply Chain Operations
Herbert NeblSemiconductor Management -Procurement and Supplier Quality
Michelle MarrSupply Chain Compliance Manager
Ryan DohseGlobal Supply Chain Manager
TM
External Use 2
Agenda• Introductions• Daimler Semiconductor Management• Q&A (Daimler Content)
• Freescale Supply Chain Management and Manufacturing Strategies for Supply Assurance− Manufacturing Network (Internal Facilities, External
Partnerships)
− Automotive Commitment (Technology Alignment and Dual Sourcing)
− OEM / Tier 1 Support
− Allocation Management (Supply Continuity and Risk Mitigation)
• Q&A (Freescale Content)
TM
External Use 4
Agenda• Introductions• Daimler Semiconductor Management• Q&A (Daimler Content)
• Freescale Supply Chain Management and Manufacturing Strategies for Supply Assurance− Manufacturing Network (Internal Facilities, External
Partnerships)
− Automotive Commitment (Technology Alignment and Dual Sourcing)
− OEM / Tier 1 Support (Add something here)
− Allocation Management (Supply Continuity and Risk Mitigation)
• Q&A (Freescale Content)
TM
External Use 5
Daimler: Four Areas of Freescale Strategic Partnership
AllocationManagement
• Disaster/Crisis• Industry Upside• Industry Constraint
Manufacturing Network
• Internal Fab & Assay/Test• External Partnership, Foundry and Backend
Automotive Technology
Commitment
OEM / Tier 1 Support
• Supply Continuity• Flex Sourcing
TM
External Use 6
AllocationManagement
• Disaster/Crisis• Industry Upside• Industry Constraint
Manufacturing Network
• Internal Fab & Assay/Test• External Partnership, Foundry and Backend
Automotive Technology
Commitment
OEM / Tier 1 Support
• Supply Continuity• Flex Sourcing
Daimler: Four Areas of Freescale Strategic Partnership
TM
External Use 7
Freescale Tianjin Final ManufacturingTianjin, China
Freescale KualaLumpur Final
ManufacturingKuala Lumpur, Malaysia
Freescale Chandler Fab – 8”Chandler, AZ
Freescale Oak Hill Fab – 8”Austin, TXFreescale Austin Technology & Manufacturing Fab – 8”Austin, TX
Freescale Manufacturing Facilities
AMERICAS ASIA PACIFIC/JAPAN
Automotive Microcontroller
TM
External Use 8
KESTSMCFab11
Manufacturing Partners – Automotive
EMEAASIA PACIFIC/
JAPAN
AMERICAS
TSMC, UMC, Amkor, Ardentec, ASE
Amkor, ASE, StatsChipPac
Amkor
Global Foundries, UMC, StatsChipPac
Foundry Die Manufacturing
Probe, Assembly & Test
Automotive MicrocontrollerUnderline indicates new/expanded source
TM
External Use 9
Manufacturing Facilities
External Foundries Key Technologies
SOIC, MAPBGA, Sensors, FCPBGA, LQFP, QFN
QFP, QFN, MAPBGA, TSSOP,SOIC
MAPBGA, PBGA
Wafer probe
QFN
Final Test and Burn-in
Automotive Microcontroller
KES
Assembly & Test Manufacturing PartnersExternal
Foundries Key Technologies
Logic/MS CMOS, Native & e-Flash
CMOS, Mixed Signal/Analog, e-Flash & High Performance
Logic CMOS & Mixed Signal Analog
High Performance
Sensors
MOS Capacitors
GaAs
Foundry Relationships
TM
External Use 10
AllocationManagement
• Disaster/Crisis• Industry Upside• Industry Constraint
Manufacturing Network
• Internal Fab & Assay/Test• External Partnership, Foundry and Backend
Automotive Technology
Commitment
OEM / Tier 1 Support
• Supply Continuity• Flex Sourcing
Daimler: Four Areas of Freescale Strategic Partnership
TM
External Use 11
Table of 1st and 2nd sources
AutomotiveTechnology
Primary Source
Secondary Source
.25µ SGF CHD/TSMC3 ATMC
.18µ SGF TSMC11 ATMC/TSMC3
C130FG ATMC TSMC
C90 (i.Mx) TSMC12 UMC12i
C90FG ATMC TSMC14
C65 (i.Mx) TSMC12 TSMC14
C55FG TSMC14 (TSMC12)
C40(i.Mx) TSMC14 (TSMC12)
28TFS TSMC12 TSMC15ATMC= Austin Technology and Manufacturing Center, CHD= Chandler Arizona Both Freescale Internal.
Automotive MicrocontrollerAutomotive Intent Microcontroller
Dual Sourcing / Crisis Recovery Timing
Front-end Manufacturing Facilities & Supply ContinuityMultiple Sources for Key Automotive MCU Technologies
TM
External Use 12Automotive Microcontroller
Dual Sourcing / Crisis Recovery Timing
Ass
embl
y Pa
ckag
ing
Fina
l Tes
t
Back-end Manufacturing Facilities & Supply ContinuityMultiple Sources for All Key Automotive MCU Package Technology
TM
External Use 13
AllocationManagement
• Disaster/Crisis• Industry Upside• Industry Constraint
Manufacturing Network
• Internal Fab & Assay/Test• External Partnership, Foundry and Backend
Automotive Technology
Commitment
OEM / Tier 1 Support
• Supply Continuity• Flex Sourcing
Daimler: Four Areas of Freescale Strategic Partnership
TM
External Use 14
Freescale and OEM/Tier1 Collaboration ImportanceSpecify requirements for next generation car platform• Technical Features for next. gen. ADAS, Cluster, Powertrain etc.• Safety requirements-> ASIL Level C,B D• SW requirements -> Autosar 3.x,4.x
Establish timing of product development, qualification milestones and ramp requirements• NPI must fit with Car platform Schedule • Technology roadmap align to manufacturability • Autosar and dev. Tools should be available in Time• Manufacturing capacity supports early launch, growth and sustaining volumes
Define approval acceptance criteria for our products• Logistic -> Leadtime, Capacity, Buffers• Quality -> Low PPM, ISO26262 etc• Support -> Sales, FAE dedicated support
Proactively engage in supply chain continuity risk mitigation activities• Dual sourcing / qualification• Mid to Long Range Forecasting• Consistent order coverage ≥ quoted leadtimes (26 weeks ideal)
TM
External Use 15
Freescale Dual Sourcing Strategy
A/T = Assembly and Test
TM
External Use 16
Manufacturing Cycle Time vs. Order Lead Time
• Typical semiconductor cycle time from wafer start to finished good test out is 20-26 weeks*• Die and Finished Goods buffers established based on forecasted run rates can help reduce customer
order lead times to more manageable levels; typical automotive lead times in the 12-14 week range• Forecasts and order coverage (actual orders placed ≥ LT) extremely important to help keep lead times
lower; unexpected / un-forecasted increases can quickly diminish buffer levels, resulting in lead times extending to 16-20+ weeks
Typical Semiconductor Cycle Time = Manufacturing Cycle Time = 20 + weeks
01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 16 17 18 19 20 21
Front End ManufacturingBackend
Manufacturing & Logistics
DIE & Piece partInventory2 to 4 wks
Wafer Fab / Bump*BI + TestAssayProbe PackDie Bank FG Inv.
Buffer Buffer
POST FAB WIP Inventory3-5 wks
FG Inv.1 to 3 wks
SHIP
Total Inventory Management Strategy: 6-12 weeks range (Die + Wip + FGs)Additional Inventory Strategies (JIT Consignment) available (conditions apply)
High Volume Avg. Order Lead Times = 12-14 wks
* certain technologies have significant layer count which could result in CT exceeding 26 weeks
TM
External Use 17
AllocationManagement
• Disaster/Crisis• Industry Upside• Industry Constraint
Manufacturing Network
• Internal Fab & Assay/Test• External Partnership, Foundry and Backend
Automotive Technology
Commitment
OEM / Tier 1 Support
• Supply Continuity• Flex Sourcing
Daimler: Four Areas of Freescale Strategic Partnership
TM
External Use 18
FSL Corporate Crisis
Management and
Business Continuity
Site Crisis Management
Product Supply
Procurement Supply
Protection of Information
Freescale Business Continuity Strategy
Each tier focuses on specific risk area
Manage major business interruptions Assess potential risks to operations/supply
Standard procedures for each tier
Take actions to prevent high-risk incidents from occurring and prepare for high-risk incidents that cannot be prevented
Establish the known factsAssess the impacts (consider worst case scenarios)Identify key issuesSet prioritiesInvolve the appropriate peopleAssign actions and deadlinesCommunicate core messages internally and externally
Establish Command Center
Assure that crisis response plans are in place and have been tested
TM
External Use 19
FSL Corporate Crisis
Management and
Business Continuity
Site Crisis Management
Product Supply
Procurement Supply
Protection of Information
Freescale Business Continuity Strategy
Assures rapid recovery of business operations and facilities from a business interruption
Safeguards our facilities infrastructure from a business interruption
Formal risk management assessmentsScenario planning
Earthquakes, weatherProactive planning
CDC outbreaksLocal rescue drills
Contracts with local temporary agencies
Work closely with local law enforcement
Regular drills with onsite EMT Evacuation drills
TM
External Use 20
Site Classification EMEA
ASIA PACIFIC/JAPANAMERICAS
Type A Site Type B Site Type C Site
Freescale conducts its business and operations in approximately 75 sites and in over 25 countries worldwide
MFG sites
>500
Design Centers
>150 <500
SalesRemote
>150
TM
External Use 21
FSL Corporate Crisis
Management and
Business Continuity
Site Crisis Management
Product Supply
Procurement Supply
Protection of Information
Freescale Business Continuity Strategy
Assures product delivery to customers
Decision MakerProduct allocationSite infrastructureDelivery status
Communication protocolsInternalExternal (customers, suppliers)
Information repository for communicationand event responses
Playbooks to ensure the continuousdelivery of critical services and products
Work directly with the customer
TM
External Use 22
FSL Corporate Crisis
Management and
Business Continuity
Site Crisis Management
Product Supply
Procurement Supply
Protection of Information
Freescale Business Continuity Strategy
Assures the delivery of raw materials to Freescale sites
Require subcons to comply with adetailed risk assessment to mitigate risk offacility, human, equipment or naturaldisaster business interruptions
Dual source strategies
Manage self-assessment audits ofsuppliers
Raw material buffers
Proactive risk assessment for suppliersRequire service agreements for suppliers
TM
External Use 23
Procurement Supply
Supplier Management • Proactive risk analysis
• Financial Health, Market Share Analysis and Capacity Availability, Geographic analysis based on proximity of 2nd source
• Procurement Personnel located close proximity of suppliers
Assurance of Supply• Fast track qualification process for raw materials• Documented methods and expectations for issue escalations• All critical suppliers must comply with a detailed risk assessment to
mitigate risk of Utility, Human, Equipment or Natural Disaster business interruptions
TM
External Use 24
FSL Corporate Crisis
Management and
Business Continuity
Site Crisis Management
Product Supply
Procurement Supply
Protection of Information
Freescale Business Continuity Strategy
Addresses the recovery of Freescale data systems
Data backup strategies
Frequent system testing
Executing restoration procedures andoperations
Hardware: mainframe, servers, network,end user
Software: applications, operating systems, utilities
Communications (network andtelecommunications)
Site data recovery plans
TM
External Use 25
Supply Risk Response Timeline
0-1 hr 1- 48 hrs hrs to weeks*
Emergency Response
Business/SupplyContinuity
Crisis Management
PreventiveRisk Control
SupplyRisk
Preparedness before Supply Risk Process after Supply Risk and BCP Team is Deployed
Identify & mitigate criticalrisks (earthquake, flood, utility,fire, IT, etc.)
Emergency Response TeamTraining/Drills
Effectiveness verification via scenario test
Dual sourcing
Buffer strategies
Life safety protection &contamination(first responders)
Protect employee safetyvia evacuation plan
Emergency ResponseTeam activation
Compile detailed lists ofaffected factories/sites,resources, products,customers
Damage evaluation*
Stakeholdercommunication
Production recovery orRelocation
Facility recovery
Compile initial finishedgoods supply plan andinitial customer supplyplans based on allocationguidelines
Activate back-up plan forcritical production processor service
Communicate
TM
External Use 26
Freescale Communication Flow
Activate Supply Risk Team
Manufacturing(Freescale, Foundry)
ProcurementContinuity (Suppliers)
Product SupplyContinuity (Delivery)
Information (Systems)
CustomerSales/
Customer Supply Chain
Factory
Business & Production Planning
Command CenterDaily/Weekly
Utilize appropriate roles to keep communication consistent, cohesive and in fastest timeframe possible
TM
External Use 27
Communication Flow - Product Supply Continuity (Delivery)
Customer Supply Chain / Sales
Business and Production Planning
Factory
Product Command Center
Daily/Weekly
Demand rates and required delivery datesAcceptable alternatives & exceptions
Gathering of Drop Dead Req’tsReport to Factory (War room)Communication of Supply TrackerAllocation DecisionsExecutive Escalation
WIP PositionsCapacity Allocation DecisionsSupply Tracker Update and PublishManufacturing Execution
Supply
Tracker
Customer Supply PlansGap Analysis & ClosureMinimum Demand RatesExpedite Options
CustomerSales /Customer Supply Chain
Typical Communication To/From
TM
External Use 28
Conclusion
• Manufacturing Footprint− Combines and internal network of front end Fab/Probe operations and backend
Assembly and Test with external foundry partners (front end) and A/T subcontractors− Enables primary and secondary sourcing for supply risk mitigation and continuity
• Freescale and OEM continuous collaboration is key for requirements specification, roadmap timing and approval/qualification acceptance
• Dual Sourcing Strategies in place to ensure supply continuity and risk mitigation
• Sufficient customer forecasts and order coverage (ordering ≥ quoted leadtime) enables Freescale to implement buffer strategies thus reducing order leadtimes
• Freescale deploys a continuous closed loop communication flow to gather requirements from customer and communicate to/from our manufacturing network and planning community
TM
External Use 29
Backup Slides
TM
External Use 30
Semiconductor Manufacturing Cycle Time
C90FG State of the Art Power Architecture™
• 32-bit MCU• ~350 Wafer Fab Process Steps• ~83 Million Transistors
Manufacturing ProcessTypical
Duration (weeks)
Wafer Fab Process Diffusion – Photo – Etch – Implant – Metal/Film – CMP 18
Wafer Probe Sorts plus Data Retention Bake 3
Package Assembly Backgrind -> Saw -> Die Bond -> Plasma Clean -> Wire Bond -> Mold -> Mark -> Plating / Ball Attach -> Singulation -> Scan 2
Final Test Burn-in -> Tri-temp Test Inserts 2
Ship Pack: Bake -> Scan -> Tape & Reel -> Dry Pack -> Label -> Ship 1
Total Cycle Time 26
Metal 6
Metal 5
Metal 4
Metal 3
Metal 2
Metal 1
Via 4Via 3
Via 2Via 1
TM
External Use 31
Wafer Processing Overview
Raw SiliconSubstrate
DiffusionGrows or deposits a layer of oxide, nitride, poly, or similar material.
PhotoSpins on photoresist, aligns reticle and exposes wafer with reticle pattern. Develop removes resist from exposed areas.
EtchRemoves film layer that was uncovered during develop. Strips resist.
Metals/Films Connects devices electrically and isolates circuit pathways.
CMPPolishing techniqueto keep surfaces flat somore layers can be added.
Implant Dopants are implanted for electrical characteristics.
E
Oxide Growth
Chemical deposits
Poly/Nitride/TEOS Coat
Chemical deposits
• IC Manufacturing uses a recursive deposition and masking process to define patterns of doped areas, isolation films, and metal conductors to create solid state devices.
SubstrateDoped Region
Probe/TestTest Device Functions
Silicon Wafer
TM
External Use 32
Wafer SawWafer Backgrind WaferClean & Mount Die Bonding Die Attach Cure
Plasma CleanWire BondingMoldPost Mold CureLead Plating & Post Plating Bake
Solder Ball Attach Flux Clean Trim & Form or Pkg Singulation
Lead / Ball Integrity Scan
Final VisualInspection
Assembly Package Process Flow
Laser Mark
BGA
QFP
QFPBGA
TM
External Use 33
Burn-in24 hrs, 125º C or Equivalent
Functional Test – Cold
Functional Test – Hot
Functional Test – Room
QC RHC Gate
Bake
Lead / Ball Integrity Scan
Tape & Reel(optional)
Dry Pack & Ship
Final Test Process Flow
TM
External Use 34
Wafer Sourcing
TM
External Use 35
Tester Sourcing
TM
© 2014 Freescale Semiconductor, Inc. | External Use
www.Freescale.com