TM

Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. Airfast, BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MagniV, MXC, Platform in a Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, Ready Play, SafeAssure, the SafeAssure logo, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2012 Freescale Semiconductor, Inc..

TM 2Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. Airfast, BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MagniV, MXC, Platform in a Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, Ready Play, SafeAssure, the SafeAssure logo, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. ©2012 Freescale Semiconductor, Inc.

• Customers pay for functionality• Supplier responsibility to ensure functionality• Semiconductor market over time : − Design Complexity− Test Cost − Product Sales Price

End Goal: Test is FREE @ 100% coverage

TM 3Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. Airfast, BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MagniV, MXC, Platform in a Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, Ready Play, SafeAssure, the SafeAssure logo, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. ©2012 Freescale Semiconductor, Inc.

• Profit margin

• GM = Price – CostPrice

• Die Cost

• Package Cost

• Test Cost

Gross Margin (GM)Gross Margin (GM)Gross Margin (GM) Cost ElementsCost ElementsCost Elements

Challenge : Improve gross margin over life of the product

TM 4Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. Airfast, BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MagniV, MXC, Platform in a Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, Ready Play, SafeAssure, the SafeAssure logo, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. ©2012 Freescale Semiconductor, Inc.

• What is Production Test?− Screen out manufacturing defects Stuck-at devices Weak devices ‘Connected’ devices Assembly defects

• How many defects need to be caught?− Requirements dependent upon market and technology

What is it NOT?Characterize every part that is shipped

TM 5Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. Airfast, BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MagniV, MXC, Platform in a Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, Ready Play, SafeAssure, the SafeAssure logo, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. ©2012 Freescale Semiconductor, Inc.

First opportunity –product-specfic fab defects

Part stressing only –no pass/fail

Package-parasitic dependent

Room temperature (typically)

Emulate years of life in hours

Temperature/Voltagedependent

Performance-constrained Highly parallel At-speed

Wafer Probe Burn In (Where Necessary) Final Test

Test Sequence

TM 6Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. Airfast, BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MagniV, MXC, Platform in a Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, Ready Play, SafeAssure, the SafeAssure logo, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. ©2012 Freescale Semiconductor, Inc.

Probe and Final Test Cost Elements Tester / Handler Equipment

Probe cards / Loadboards

Facilities

Labor

Other

Test Cost Impact• Gross Margin• Capital

Wafer Probe Burn In (Where Necessary) Final Test

Test Sequence

TM 7Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. Airfast, BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MagniV, MXC, Platform in a Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, Ready Play, SafeAssure, the SafeAssure logo, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. ©2012 Freescale Semiconductor, Inc.

1 2 3 4 5 6 7 8 9 101 2 3 4 5 6 7 8 9 10

Normalized Gross Margin

Normalized Cost

Year of Life

Sales price degrades faster than costs

Impact :: Reduced profit

Gross Margin Target

TM 8Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. Airfast, BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MagniV, MXC, Platform in a Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, Ready Play, SafeAssure, the SafeAssure logo, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. ©2012 Freescale Semiconductor, Inc.

1 2 3 4 5 6 7 8 9 10

Normalized Gross Margin

Normalized Cost

Year of Life

Gross Margin Target

To hit Target GM:Active Cost Reduction Activity Required

TM 9Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. Airfast, BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MagniV, MXC, Platform in a Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, Ready Play, SafeAssure, the SafeAssure logo, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. ©2012 Freescale Semiconductor, Inc.

• Profit Impact – 9.4% Test time reduction

• Example:• Test time A: 8.75 seconds / unit • Test time B: 8.0 seconds / unit• Test time = 25% of Product Cost

Impact : 1.2% Gross Margin improvement

8.75 sec 8.0 sec

51.2%50%

TM 10Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. Airfast, BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MagniV, MXC, Platform in a Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, Ready Play, SafeAssure, the SafeAssure logo, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. ©2012 Freescale Semiconductor, Inc.

• Manufacturing Impact – 9.4% Test time reduction

• Example:• Test time A: 8.75 seconds / unit • Test time B: 8 seconds / unit• Volume: 100M units• 1 Tester = 25Msec

** Assumption 1 Tester ~ 25M sec 8.75 sec 8.0 sec

32

35

Impact : 3 Testers for every 100M units

TM 11Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. Airfast, BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MagniV, MXC, Platform in a Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, Ready Play, SafeAssure, the SafeAssure logo, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. ©2012 Freescale Semiconductor, Inc.

• Prerequisites− Volume production data− Technology ‘reasonably’ stable

• Eliminate temperature insertion• Eliminate burn-in• Eliminate re-test• Eliminate ‘zero’ fail tests• Eliminate ‘correlation’ fail tests• Cost trade-off yield/test time between test stages• Increase parallelism• Rework high-fallout / high test-time tests

• Yield improvement

TM 12Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. Airfast, BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MagniV, MXC, Platform in a Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, Ready Play, SafeAssure, the SafeAssure logo, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. ©2012 Freescale Semiconductor, Inc.

• Understand test savings opportunity− Does it reduce test cycles? − Does it enable higher parallelism?− Does it reduce tester memory?− Is it an overall product trade-off? e.g. grows tester cycles @ probe for benefit @ final test

• Understand die impact− Is it a required test feature or ‘nice-to-have’?− Is there another way without growing the die?− Is the tester capable of using this feature?− Is there a better way than ‘traditional’?

TM 13Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. Airfast, BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MagniV, MXC, Platform in a Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, Ready Play, SafeAssure, the SafeAssure logo, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. ©2012 Freescale Semiconductor, Inc.

99.00%

99.50%

100.00%

100.50%

101.00%

Option 1 Option 2 Option 3 Option 4

Option 1 Option 2 Option 3 Option 4

Normalized Test Cycles

Normalized Area Impact

11% Reduction

Impact : • < 0.3 % Area increase • 11% Scan Test Cycle improvement

• Four scan in / scan out settings analyzed• Equivalent Fault Coverage

• All options normalized to baseline:• 1:1 – Scan in = Scan out pincount

1:1 2:1 3:1 5:1

1:1 2:1 3:1 5:1

TM 14Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. Airfast, BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MagniV, MXC, Platform in a Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, Ready Play, SafeAssure, the SafeAssure logo, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. ©2012 Freescale Semiconductor, Inc.

Impact : Area –• Clear crossover points

Scan Flops

Scan Latches

Compiler 1

Compiler 2

Number of Bits (depth * width)

Dedicated BIST

Normalized Area

Use RAM’s

• Four options analyzed• 2 RAM compilers• Scan Latches• Scan Flip Flops

• Comparable speed

• Dedicated memory BIST ‘wrapper’overhead for reference

Impact : Area –• Clear crossover points

Test –• ‘Grey’ Area• Compiler 2:

Leverage core, if possible• Compiler 1:

Dedicated BIST

Test – ‘Grey’ Area

Use Flops

Use Latches

TM 15Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. Airfast, BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MagniV, MXC, Platform in a Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, Ready Play, SafeAssure, the SafeAssure logo, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. ©2012 Freescale Semiconductor, Inc.

• Example Test pattern : • I/O measurement

• Change from tester-controlled pattern• Allow tester memory pattern overlay• Result:

•Test vector memory reduction

Leverage the Core• Targeted analog on-die measurements • Replaced direct tester measurements• Result:

• Test time reduction• Pincount reduction

Analog BIST

9% Reduction

Tester Memory

Tester-Controlled Test

Core-Controlled Test

Tester Time

Pincount

10x Reduction

2x Reduction

Tester-Controlled Test

On-die Measurement Test

TM 16Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. Airfast, BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MagniV, MXC, Platform in a Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, Ready Play, SafeAssure, the SafeAssure logo, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. ©2012 Freescale Semiconductor, Inc.

Leverage On-Die Resources – Overall Impact : • Manufacturing :

• Reduced chip-level pincount • Enables higher parallelism

• Eliminates tester requirement• Time-to-Market :

• Simulate tests prior to Tape Out• Re-use from chip-to-chip within technology

• Cost : • Faster test time• Die area increase

• High speed source-synchronous interfaces• AC Spec on-die measurement • Excludes package-effects• Result:

• Test time reduction

High Performance IO - BIST

96% Reduction

Test Time

Tester-Measured Test

On-die Measured Test

TM 17Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. Airfast, BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MagniV, MXC, Platform in a Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, Ready Play, SafeAssure, the SafeAssure logo, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. ©2012 Freescale Semiconductor, Inc.

DesignDesign--Test Architecture During Development Test Architecture During Development

Test PatternDevelopment

IP-Dependent Test Development

IP / Test Verification & ValidationIP Prototype Production

IP Design

Test PatternDevelopment

IP-Dependent Test Development

IP / Test Verification & Validation

IP Prototype Production

IP Design

Test ArchitectureTime

Saved

• What can be done to enable parallelism at high volume?• On-die resources• Optimize pincount/tester memory trade-off• Low power partitioning

• How can the on-die/IP resources be leveraged to reduce tester requirements?

• What can be done to enable concurrent test? • Power/IR-drop constraints• Control bus• Leverage-the-core

•What are the coverage requirements for pass/fail – NOT characterize?

• Market Tier• Technology• ATPG Fault Models• Memory• Analog• IO

TM 18Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. Airfast, BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MagniV, MXC, Platform in a Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, Ready Play, SafeAssure, the SafeAssure logo, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. ©2012 Freescale Semiconductor, Inc.

Total Semiconductor Market Growth Continues

Ele

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nic

cost

as

% o

f tot

al c

ar c

ost

1950 1960 1970 1980 1990 2000 2005 2010

35%

30%

22%

15%

10%

5%2.5%

Electronic Fuel Injection

AirbagABS / ESP

Body ElectronicsMultiplexing

Advanced Driver AssistanceActive-Passive Safety

Green PowertrainRadar / Vision

TelematicsInfotainment

“80% percent of innovation is electronic”

“Impossible to comply with regulation without electronic systems”

-Automotive OEM

50%

?

Electronic Content Going Up

1998 2015* Data from iSuppli, Sept 2011

• Overall semiconductor market forecast • Revenue increasing through 2015

• Continued growth in electronic content for key market spaces

• General market push for system integration increasing

TM 19Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. Airfast, BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MagniV, MXC, Platform in a Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, Ready Play, SafeAssure, the SafeAssure logo, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. ©2012 Freescale Semiconductor, Inc.

Global Asynchronous/Locally Synchronous Designs,Cross Die Variability, Multiple Power Domains,

Statistical Timing Analysis

90nm90nm 65nm65nm 45nm45nm 28nm28nm 20nm20nm 14nm14nm

High Speed Mixed Signal Integration,Static Timing Analysis,

Formal Verification

Signal Integrity, Litho Checks,Beneficial Skew, Physical Synthesis,

Low Power Design

Aging, Soft Error Rates,Clock Domain Crossing Checks,

Software Virtual Platforms

3D structures, Design for reliability

216M1 core

350M1-2 cores

700M2-8 cores

>1.5 B16- 32 cores

Increasing Transistor Count

Increasing Fault Coverage

> 4 B32 – 128 cores

DL=1 – Y (1-T)

Williams and Brown 1981

DL=Defect Level Y = Yield T = Fault Coverage

TM 20Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. Airfast, BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MagniV, MXC, Platform in a Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, Ready Play, SafeAssure, the SafeAssure logo, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. ©2012 Freescale Semiconductor, Inc.

• New Processes:− 3D Graphene transistors− Carbon Nanotubes

• New Packaging− 3D packaging − Extreme System-In-Package

• New Architectures− Optical Interconnect− 1000 CPU’s on a chip

New Processes:

New Packages:

New Architectures:

Challenge: • Industry cannot afford ‘evolutionary’ test costs• What is the next Test ‘Revolution’ ?

Image source : IBM -Extremetech.com

MEMSLogicAnalog

RFDRAMMPU

Theoretical Carbon Nanotube DiodeImage source : US Department of Energy

Graphene sheet Image source : AlexanderAIUS

SMPNode+Router

SMPNode+Router

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Peripherals and IOsPeripherals and IOs

Peripherals and IOs

Peripherals and IOs

Perip

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