System Test Status Report R. D’Alessandro 1 TIB System Test Report Where were we ….., Mechanics (layer 3 prototype) Mother Cable & Interconnect Board System

System Test Status ReportR. D’Alessandro

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TIB System Test TIB System Test Report Report

• Where were we …..,• Mechanics (layer 3 prototype)• Mother Cable & Interconnect Board• System Test Setup (TIB)• Results from the TIB System Test


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TIB system test TIB system test (July (July 2002)2002)

• Not only for PS but “evolving” into a fully fledged mechanical and electrical test– NEEDS optical decoupling to achieve

meaningful results

• At first we needed a relatively good understanding of an optical system compared to a copper one:– Many measurements made, we gained

full confidence.– Thanks to Roberto Cecchi for TIST.


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La baraLa bara

CCU25

DOH

Power distribution PCB


4Input/Output temporary connections on the back of module carrier

Final Kapton cable could be even shorter than this one

Short distance APV-AOH

Brico & FlexibilityBrico & Flexibility


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MechanicsMechanics

•Prepared by Pisa•Layer 3 mock-up•Up to 4 cooling loops (12 modules)•Final dimensions


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Mother Cable (1)Mother Cable (1)


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Mother cable (2)Mother cable (2)


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Interconnect boardInterconnect board

•Connects up to 4 MC•Redundancy implemented•Distributes also LV and HV•Jumper disable of Hard Reset


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What went on the What went on the mechanical structuremechanical structure

• 3 modules: 180, 168, 177 (14 APV25)• 3 Analog OptoHybrids (3 fibres each)

• 50 Ohms termination (100 Ohms in the future)

• 1 CCU25 + DOH + Interconnect Board• Mother Cable with slight mods.• Power: Caen (counting room)

prototype • 150 m cable LIC (100m Outer + 50m Inner)• 40 uF TOTAL LOAD CAPACITORS!• Battery for the control loop (5V for the DOH)


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CablesCables


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CCU25

AOH

Fibre SPAGHETTI!

Cooling loops

DLink

3Modules 3Modules (complete (complete MC)MC)


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Results Results

• Bias = 200 V on 3 modules simultaneously

• <1 microA total for the 3 modules• HV test with 1 module to 300V, on MC

without modules to 450V• Able to read out pedestals and noise

on all 3 modules at the same time• Calibration one module at a time


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PedestalsPedestals

deconv

peak

Strip no.

Strip no.

AD

C

valu

e

AD

C

valu

e


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Common mode noiseCommon mode noise

Module 180

Module 177200V biasnon-inv, peak

ADC channels

ADC channels


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50nF cap

22k

Bias line

Analog optohybrid

TIB System test in Florence


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New New TIB hybrid TIB hybrid layout (layout (DecDec. . 202002 02

v11)v11) Bias ring

DCU input

From J.

D. Bers

t


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First and last strip ~12 ADC counts

Unbonded strips

2 noisy neighbours

TIB HV 300V on ARC Peak-Inverter on


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Edge effect reduced

Furthermore only one strip is now affected

…also the common mode is reduced

Same module but with 50nF capacitor to ground


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Same module on sys-Same module on sys-testtest

Module 180 without cap

Module 177 with capPeak mode


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Signal shapesSignal shapesA

DC

valu

e

AD

C

valu

e

ns

ns


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Noise distribution Noise distribution (1)(1)

Peak modeNoise very lowCMN is lower still

S/N ratioPeak ~ 65Ical=80!

ADC channels


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Noise distribution Noise distribution (2)(2)

Deconv mode

S/N ratioDeconv ~ 52Ical=80!

ADC channels


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LV behaviourLV behaviour

HARD RES (14 APVs + 9 Lasers)

V=280 mV

2.5V

200 mV/div200 us/div

10 mV/div20 us/div

Noise on 2.5V line


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ConclusionsConclusions• So far we have witnessed an excellent

behaviour of the system. • Mother Cable is very well thought out,

signals are clean, voltage drops negligeable. (Thanks to Giuseppe De Robertis)

• The interconnect board has delivered at first go. (Thanks to Roberto Ciaranfi)

• This Pisa-Florence common endeavour is getting along fine (incredible though this might seem)


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FutureFuture• Need to go to 4 strings (12

modules)– MC are being loaded with components

• Test redundancy (2nd DOH and CCU25s from CERN)

• AOHs will be modified (100 Ohms)• We have started Xdaq migration.• This mock-up will be upgraded,

while a new one is under construction ready for the next MC type.

• New MC being designed (final version …)

• DOM (DOH carrier) design underway


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Interconnect Board Interconnect Board (redundancy is implemented)(redundancy is implemented)

Documents

System Test Status Report R. D’Alessandro 1 TIB System Test Report Where were we ….., Mechanics (layer 3 prototype) Mother Cable & Interconnect Board System