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T-gard™ 200 SeriesHigh Performance Thermal Interface ProductsThe T-gard™ 200 is a high performance interface pad. Consisting of silicon/boron composites, these fiberglass-reinforced pads are used when the lowest thermal resistance and highest dielectric strength are required

A high-tear, cut-through and puncture-resistant product, the T-gard™ 200 is tough and strong. Burrs cause no problems for the material and the pad will not dry out, crack or fail when pressured between mating parts.

The T-gard™ 200 is available in 0.010" (0.25 mm), 0.020" (0.51 mm) and 0.030" (0.75mm) thicknesses.

Features and Benefits:• HighthermalConductivityof5.0W/mK

• Highdielectricstrengthof>6,000volts

• Resistanttotearsandpunctures

• UL94V0rated

Applications• Audioandvideocomponents

• Automotivecontrolunits

• Generalhighpressureinterfaces

• Motorcontrollers

• Powerconversionequipment

• Powersemiconductorts

-T0packages,M0SFETsandIGBTs

T-gardTM 200 Series

www.lairdtech.com

Sales contact information: USA: +1 800 843.4556Europe: +49 8031.2460.0Asia: +86 755.2714.1166

Any information furnished by Laird Technologies and its agents is believed to be accurate and reliable. Responsibility for the use and application of Laird Technologies materials rests with the end user since Laird Technologies and its agents cannot be aware of all potential uses. Laird Technologies makes no warranties as to the fitness, merchantability, or suitability of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold

pursuant to the Laird Technologies domestic terms and conditions of sale in effect from time to time, a copy of which will be furnished upon request.damages of any kind. All Laird Technologies' products are sold pursuant to the Laird Technologies' domestic terms and conditions of sale in effect from time to

time, a copy of which will be furnished upon request. A13514-00

T-gardTM 200 Series

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THR-SPEC-T-GARD200-0808®2008AllRightsReserved LairdTechnologiesisaregisteredtrademarkofLairdTechnologies,Inc.

T-gardTM 210 T-gardTM 220 T-gardTM 230 Test Method

Construction & Composition

Reinforced boron nitride filled silcone elastomer

Reinforced boron nitride filled silcone elastomer

Reinforced boron nitride filled silcone elastomer

Color White Blue Green Visual

Thickness 0.010” (0.25mm) 0.020” (0.51mm) 0.030” (0.76mm)

Thickness tolerance ±0.002” (±0.05mm) ±0.002” (±0.05mm) ±0.003” (±0.075mm)

Specific Gravity (Density) 1.52 g/cc 1.45 g/cc 1.47 g/cc Helium Pycnometer

Hardness 85 Shore A 80 Shore A 80 Shore A ASTM D2240

Tensile Strength N/A N/A N/A ASTM D412

% Elongation N/A N/A N/A ASTM D412

Outgassing TML (Post Cured) 0.06% 0.06% 0.06% ASTM E595

Outgassing CVCM (Post Cured ) 0.05% 0.05% 0.05% ASTM E595

UL Flammability Rating 94 V0 94 V1 Not Rated E180840

Temperature Range -60ºC to 200ºC -60ºC to 200ºC -60ºC to 200ºC

Thermal Conductivity 5 W/mK 5 W/mK 5 W/mK ASTM D5470

(modified)

Thermal Impedance @ 100 psi @ 689 KPa

0.18°C-in²/W 1.17°C-cm²/W

0.35°C-in²/W 2.26°C-cm²/W

0.40°C-in²/W 2.28°C-cm²/W

ASTM D5470 (modified)

Breakdown Voltage 6,000 VAC 10,000 VAC 20,000 VAC ASTM D149

Volume Resistivity 5x1013 ohm-cm 5x1013 ohm-cm 5x1013 ohm-cm ASTM D257

Dielectric Constant @ 1 MHz 3.32 3.32 3.32 ASTM D150

Standard thicknesses: 0.010" (0.25mm), 0.020" (0.51mm), 0.030" (0.76mm) Please contact Laird Technologies for alternate thicknesses.

Standard sheet sizes: 0.010": 14" x 16" (356mm x 406mm) 0.020" and 0.030": 8" x 8" (203mm x 203mm) and 16" x 16" (406mm x 406mm) Individual die-cut shapes can be supplied.

Pressure sensitive adhesive: Request no adhesive with "AO" suffix. Request adhesive on one side with "A1" suffix. Double-sided adhesive is not available.

Reinforcement: T-gardTM 200 sheets are fiberglass reinforced.

Page 1 05/02/01

` Reliability Test T-gard™ 210

June 9, 2005

To confirm that thermal resistance properties of T-gard 210 are not degraded by repeated long-term exposure to environmental variations. The T-gon 210 material has been renamed to T-gard 210. Material.

• Specimens of T-gard 210 cut in circles with 1 in diameter and placed between two aluminum discs with the same diameter. The clip force of 50 psi is applied to the assembly when in the conditioning environment.

• A 20”X10” sheet of T-gard 500 (for dielectric breakdown voltage test) • An oven set to 150 +/- 50C. (Bake) • Humidity chamber set to 85+/- 3 % RH and 85 +/-3 0F (HAST) • An oven set to cycle between -400C to +1500C. Total cycle time is four hours.

Test Conditions.

• HAST. Material was held in humidity chamber for 1,000 hours. Thermal resistance measurements were

taken at 0, 250, 500, and 1000 hours. Thermal resistance was measured using modified D 5470 test method. The one inch diameter assemblies were used for this test. Time “0” indicates the initial value of the assembly. Three samples were used and the values were averaged to attain the reported value • Thermal Bake.

. The total thermal resistance versus time at 150 °C values used the one inch diameter assemblies as test samples. Three assemblies were used for the evaluation and the values of the three were averaged to attain the reported value. Thermal resistance was measured using modified D 5470 test method. • Thermal Cycling.

Material was put into an oven where the temperature cycles from -40 °C to +150 °C. Material is going through 1,000 cycles (there are 6 cycles in 24 hour period). It takes 6 months to complete the test. Thermal resistance was measured using modified D 5470 test method.

Page 2 05/02/01

5. Data

Thermal Resistance Test Data for Thermal Bake (average of 3 specimen)

% Change in TTr vs. Time @ 150 C

-50%-40%-30%-20%-10%

0%10%20%30%40%50%

0 250 500 750 1000

Hours

% C

hang

e

Thermal Resistance Test Data for Temperature Cycling (average of 3 specimen)

% Change in TTr vs Thermal Cycles

-50%-40%-30%-20%-10%

0%10%20%30%40%50%

0 250 500 750 1000

Cycles

% C

hang

e

Page 3 05/02/01

Thermal Resistance Test Data for H.A.S.T. (average of 3 specimen)

% Change in TTr vs Time @ 85F/85%RH

-50%-40%-30%-20%-10%

0%10%20%30%40%50%

0 250 500 750 1000

Hours

% C

hang

e

6. Conclusion: T-gard 210 exhibits no significant change in thermal resistance due to the environmental

conditions to which it was subjected in these tests. Therefore, T-gard 210 is not expected to degrade in thermal performance while in transport or application under conditions simulated by these tests.

Our customers are reminded that they bear the responsibility for testing Laird Technologies materials for their proposed use. Any information furnished by Laird Technologies and its agents is believed to be accurate and reliable, but our customers must bear all responsibility for the use and application of Laird Technologies materials since Laird Technologies and its agents cannot be aware of all potential uses. Laird Technologies makes no warranties as to the fitness, merchantability, or suitability of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies domestic terms and conditions of sale in effect from time to time, a copy of which will be furnished upon request.