TDMG Brochure_Electronics Cooling

8/14/2019 TDMG Brochure_Electronics Cooling

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MECHANICAL ENGINEERING CONSULTANTSELECTRONICS COOLING & TESTING SERVICES


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www.tdmginc.comTDMG Inc

Design functional and reliable electronicequipment that will work in the intendedenvironmental conditions.

Save money by understanding the thermalissues early and correcting them before theyare too serious to fix in a cost-effective

manner.

Use prototyping as a means to validatedesigns rather than as a means to do designiterations and save a significant amount ofhardware and test related costs.

Ensure that marketing requirements aresatisfied before product specifications arecommitted to potential customers.

The Benefits of Our Thermal Engineering Services


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How We Can Help You Achieve These Benefits

Evaluation of concept design options for racks, shelves.

Quick modeling capability provides accurate information

about channel air flow, fan operating points, and system

pressure drop, even at the early conceptual stages of the

design.

CONCEPT LEVEL ANALYSIS OF

TELECOMMUNICATION SHELF

Component placement evaluation on PCBs

Board level analysis can assist in determining

the optimum component layout.

T (Deg C)

106.3

32.3

41.5

50.8

60.0

69.3

78.6

87.8

97.1

COMPONENT PLACEMENT ANALYSIS

LAYOUT 1 LAYOUT 2


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DETAILED COMPONENT ANALYSIS INCLUDES

CONNECTORS, PCB VIAS, AIR GAPS, AND COPPER SLUG

Detailed component modeling

Detailed modeling allows us to accurately evaluate

the component heat loads and establish accurate

case and junction temperatures.

The level of detail can be as fine as necessary

depending on the actual situation.

Two-resistor and Delphi models can be used to

simulate the components.

ICs and multi-component packages can be

modeled in detail and characterized at the early

stages of the design avoiding costly design

iterations.

DETAILED COMPONENT ANALYSIS INCLUDES DIE, DIE

ATTACH, BOND WIRES, SUBSTRATE VIAS, SOLDER

BALLS, ETC


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Heatsink optimization

Heatsink optimization allows verification of

performance under various conditions.

The design of components or systems can be

optimized for one specific environment, or in

some cases optimization is required such that

the heatsink can perform as well in various

positions or orientation.

PEDESTAL HEATSINK OPTIMIZED FOR PLACEMENT

OF DEVICE IN ANY POSITION ON PCBELLIPTICALLY SHAPED FINS

HEATSINK FINS OPTIMIZED FOR ORIENTATION IN VERTICAL OR 45 ORIENTATIONTHERMAL ANALYSIS FOR VGA FANSINK APPLICATION


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System level analysis for racks, shelves.

The system level modeling provides crucial

information about the operating temperatures of

boards and components.

With this type of analysis, we can investigate the

effects of fan-failed scenarios, establish fan-control

points, investigate transient operation, operations

at altitude conditions, impact of on-line replacement

of cooling unit, etc.

Our capabilities includes design of liquid cooled

systems.

New cards can easily be introduced into the

existing shelf model for investigation of new

hardware.


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Results presentation

With our analysis tools, results can be clearly

presented to allow our customers to make the right

engineering decisions early in the design phase.

Results can be presented in the following forms to

ensure that the data is properly communicated:

Velocity vector plots

Temperature plots

Surface plots

Flow animations

Fan operating pointsSpreadsheet summary, etc

0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0 100 200 300 400 500 600 700

CFM

IN.

H2O


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Compa ct M od el Pow er (W ) Max Al lowable Temp.

(deg C)2 Resistor M odel

PD(W)

Max Allowable Temp.

(deg C) 2 Resistor Model

Data Card

FPGA456

4 125 Theta JC = 8

OEM Theta JB = 23

PD(W)

Max Allowable Temp.


Data Card

FPBGA289 1 105 Theta JC = 6

OEM Theta JB = 20

PD(W)

Max Allowable Temp.


Data Card

SFP 1 85 NA

OEM (T-case)

Tj or Tc (deg

C)

Tj or Tc (deg

C)Pass/ Fail?

Tj or Tc (deg

C)

Tj or Tc (deg

C)Pass/ Fail ?

Tj or Tc (deg

C)

Tj or Tc (deg

C)Pass/ Fail ?

Tj at 23C

Ambient

Tj at 55C

Ambi ent P ass/ Fa il?

Tj at 23C

Ambient

Tj at 40C

Am bi ent Pa ss/ F ail ?

Tj at 23C

Ambient

Tj at 40C

Am bi ent Pa ss/ Fa il ?

120.00 152.00 FAIL 105.00 122.00 FAIL 120.00 137.00 FAIL

-27 >5C 3 >5C -12 >5C

Tj at 23C

Ambient

Tj at 55C


Tj at 23C

Ambient

Tj at 40C


Tj at 23C

Ambient

Tj at 40C


65.00 97.00 Marginal 72.00 89.00 Pass 68.00 85.00 Pass

8 >5C 16 >5C 20 >5C

Tc at 23C

Ambient

Tc at 55C


Tc at 23C

Ambient

Tc at 40C


Tc at 23C

Ambient

Tc at 40C


45.00 77.00 Marginal 42.00 59.00 Pass 40.00 57.00 Pass

8 >5C 26 >5C 28 >5C

Main Unit

Air Filter

Tamb(C): 55 C Tamb(C): 40 C Tamb(C): 40 C

Front Right Fan FailedAll Fans Operating Front Center Fan Failed

Results presentation

Spreadsheet format provides clear information regarding the status of all components of interest

for different operating conditions.

The sample spreadsheet below shows the pass/fail status for each component of interest for all

fans operating and 2 different fan failed scenarios.


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Testing

TDMG has an 850 sq ft test facility with windtunnel in order to

perform validation testing of cooling solutions. It is often

necessary to characterize components (cards, heatsinks, fan

trays, ect) or to perform validation testing of the complete system.

Our facilities allow us to test systems from a few CFM up to 1000

CFM.


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Custom Cooling Products

TDMG provides custom cooling products of many of its customers. Oursupplier base is

international with access to both local and foreign manufacturing capabilities for prototype and

production level systems. A few of the cooling systems developed are shown here:


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Capabilities

TDMG has been performing Electronics Cooling analysis since 1999. Electronicscooling analysis represents a significant part of our work, however, TDMG has been

performing other types of analyses as well.

As an example, our capabilities have developed to include analysis of built systems

(such as clean-room and data center analysis), hydrogen out gassing in batterycabinets, fire modeling and toxic gas concentrations, and other general CFD

applications.

In addition, over the last few years, we have been performing significantly more

stress and vibration analysis, a capability that was always available in-house, but

that we have been successfully expanding recently.

For more information regarding our full suite of capabilities, please visit our website

at www.tdmginc.com.


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Contact Us

Please contact us for an informal review of your thermal issues. It will be our

pleasure to discuss these with you and give you our initial feedback, including

whether thermal and CFD simulation is even required.

Brun o ZoccaliTDMG Inc

100 Alex is Niho n, Suite 102

St Laurent , Quebec

H4M 2N6

Tel: 514-381-9115 x.200

www.tdmginc .com

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TDMG Brochure_Electronics Cooling