Technologies Leading at Specialty

S C ChienVP of Specialty

Technology and Corporate Marketing

27th May, 2015

Outline

• Paving the Way for IoT• Greener and Smarter Automotive• Summary

2

IoT Redirects Foundry Focus

Smart Transport

Smart Retail/

Logistic

Main IoT Applications & Key Technologies

LP MCU LP MCU LP MCU LP MCU LP MCU LP MCU

: eNVM

HP AP HP AP HP AP

: Cutting Edge Logic/MM

BT/BLE

ZigbeePLCWiFi

BT/BLE

ZigbeePLCWiFi

BT/BLE

ZigbeeBT/BLE

2G/3G/4G

RFID NFC GPS

RFID NFC GPS

: MMRF

Sensor

Sensor

Sensor

Sensor

Sensor Sensor

: CIS, MEMS

Display

Display Display Display

Display Display

: eHV

Charger PMIC

PMIC Charger PMIC

Energy Harvesting

Charger PMIC

Charger PMIC PMIC

: BCD

IOT

Wearable Smart CitySmart Home/

Building

Remote Healthcare

4

IoT Redirects Foundry Focus

• Power Behavior:• From “Active/Standby” to “Sleep/Wakeup”• Low Power Throughout All Design stages

• Specialty Outweighs Logic• Sensing & Connecting Major, Computing Minor• Mainstream Nodes Major, Leading Nodes Minor

• Deep Fusion Outweighs Single Variant• eNVM + RF + Logic

5

timetime

PowerPower ActiveActive

SleepSleep

Low Power Throughout All Design Stages

• More Sleep Modes Are Applied• Active Power Reduced by Lower Vcc and DVFS

ActiveActive

SleepSleep

6

Specialty Outweighs Logic – Complete Portfolios

Logic/MS

RF

BCD

Updated Nov, 2014

CIS

eNVM

HV

.6um .5um .35um .25um .18um .15um .13um.11um

90nm80nm

65nm55nm

40nm 28nm 14nm

Available Developing JDP/Customization

10nm

MEMS

RF SOI uLP option

7

eNVM 8”/12” Logic/MMRF

40nm uLPeNVM

55nm uLPeNVM

110nm AE (Al)eNVM

8” 12”

28nm uLP

180nm LLeNVM

Ultra Low Power Logic/MM/RF + eNVM Technology

Deep Fusion Rather Than Single Variant

Time

Tech. Node

8

IoT/ uLP Solutions

Ultra Low Power Fusion Solution

Standard Cell LibuLP Standard Cell LibuLP Memory ComplierBLE 4.1

uLP +RFCMOSPlatform

High performance SST Cost effective SONOSHigh performance SST

Low Vcc 5V LDMOS uHVt/LVt device uLP SRAM bit-cell

uLP eFlashuLP eFlashuLP DeviceuLP Device

uLP IPuLP IP

10

Advantages of uLP Solutions

• Example: 40nm Power Saving to Extend Battery Lifetime

SRAM Cell Leakage

save 75%

Device Leakage

10 times lower

ActivePower

save 35%

11

eFlash Macro Density

8Mb

eFlash Macro Area % of a Chip

High performance

Cost effective solution

Optimized Solutions by Applications

12

(SST)

(SONOS)

IoT Summary

• IoT Redirects Foundry Focus• Power > Cost > Performance• From “Active/Standby” to “Sleep/Wakeup”• Specialty Outweighs Logic• Deep Fusion Outweighs Single Variant

• UMC, Your Best IoT Foundry Partner• Full Spectrum Offering and Through Nodes’

Experience on Specialty Technologies• Ultra Low Power Fusion Solutions Offered for

Designs• Best C/P Solution

13

Future Automotive Industry Steering Deeper Supply Chain Collaboration

IC Technology Enables Greener & Smarter Car

Greener

SmarterFuel engine efficiency

EV or HEV Infotainment

ADAS

15

More ECU/IC Used in a Car

• ADAS, Infotainment, EV/HEV and Fuel Efficiency Require More ECU (electronic control unit)

50

75

100

Average # of ECU in a car

Source: iHS 20142011 2015 2019

$350

$495

’11 ‘15

Chip content per car:

IC insight

16

Comprehensive Portfolios for Auto

Logic/MS

RF

PMIC

Updated May 2015

CIS

eNVM

HV

.6um .5um .35um .25um .18um .15um .13um.11um

90nm80nm

65nm55nm

40nm 28nm 14nm

Available Developing

10nm

MEMS

JDP/Customization Automotive Product17

Biz Continuity

Auto Grade Technology Solution

AEC Q-100 Qual

Turnkey Service

Auto Service Pkg

Certification, TS16949 etc.

Full Scope Auto Solutions

Liability

Capacity

Productivity

Reliability

Quality

Longevity

ECU Module/ComponentMakers’ Requirements

Full Scope ofFoundry Solutions

18

Production Proven Services

• Porting Approach• Long History with IDM/Fab-lite Proprietary

Technology Porting Success. Including Logic/MM, RFCMOS, eNVM and BCD etc.

• Platform Solutions• Main Stream MCU and PMIC Applications

• Tj 175oC Characterization for Grade 0• Auto Grade Process, IP, Modeling

19

Automotive Standard Certification

• Continuous TS16949 Certification for All Sites Since 2004

TS16949:2013Hsinchu site

TS16949:2013Tainan site

TS16949:2013Singapore site

TS16949:2013China site

Validity : 2013/6/3 ~2016/6/2

Validity : 2013/6/3 ~ 2016/6/2

Validity : 2013/6/3 ~ 2016/6/2

Validity : 2013/4/6 ~ 2016/4/5

20

UMC’s Automotive Achievement

40+ technology families established for automotive products

240K+ wafers shipped (2010~)

70+ production T/O (2010~)

UMC’s auto process adopted by 8+ major car OEMs

Qualify grade-0 product within10 quarters

21

Summary

• Auto Certified Foundry With Full Scope of

Automotive Solutions

• UMC is Awarded DJ Sustainability Foundry

• Commit to Auto Longevity Production Support

• Your Trusted Foundry Partner to Grow Together

22

Thank You !!!