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On behalf of the Organizing Committee, we are delighted to invite you to participate in the 3rd International Conference on High Performance Big Data

and Intelligent Systems (HPBD&IS 2021), to be held on December 5-7, 2021, Macau, China. HPBD&IS 2021 will provide an effective platform for

professionals, scientists, engineers, educators, students, and researchers worldwide to share and exchange their scientific ideas, views, innovations and

experiences in the vast areas of High-Performance Computing, Big Data & Intelligence Systems with fellow researchers and participants. We warmly

invite you or anyone interested in the area, to take part in this unique and timely conference with your enthusiasm to develop, your desire to apply,

and your willingness to mature the High Performance, Big Data and Artificial Intelligence technologies and applications.

Topics of interest include, but are not limited to:

1. High Performance Computing Technology and Its Applications

High Performance Computer Architecture

High Performance Computer System Software

High Performance Computing Environments

High Performance Micro Processor

High Performance Storage Technology

Multi-Core and Multi-Threaded Architecture Methods

Architecture, Software and Algorithm of Parallel and Distributed System

High Performance Ubiquitous Computing

High Performance Adaptive and Evolutionary Computing

High Performance Blockchain Technology

High Performance Application

Parallel Processing of Big Data

Hardware/OS Acceleration for Big Data

2. Big Data Technology and Its Applications

Big Data Model, Processing Algorithm and

Programming Technology

Representation of Multimedia Big Data

Big Data Learning and Analytics

Big Data Durability and Storage

Big Data Quality and Source Control

Big Data Protection Integrity and Privacy

Big Data Storage and Computing Fusion

Technology

Big Data Search and Mining

Big Data Management and Visualization

Analytics

Big Data Business Model Innovation

Big Data Applications

3. Intelligent Systems and Its Applications

Neural Network and Learning Systems

Computer Vision

Robotic Science and Control Engineering

Smart Sensor and Sensor Fusion

Intelligent Storage Device and System

Real Time System

Blockchain System

Adaptive System

AR/VR/MR

Complex Systems and Networks

Intelligent Manufacturing

Pattern Recognition

Simultaneous Localization and Mapping

All papers will be reviewed based on technical quality, relevance, originality, significance, and clarity. The peer review process will take 2-3 weeks from submission to a decision notification. All accepted papers will be published in the conference proceedings of HPBD&IS 2021. Accepted papers will be submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore’s scope and quality requirements. Outstanding accepted papers will be invited to be extended and published in SCI-indexed journals Concurrency and Computation Practice and Experience (CCPE), EI-indexed journals Chinese Journal of Computers, Optoelectronics Letters et al. Please submit your paper at: https://easychair.org/conferences/?conf=hpbdis2021 For more details, please check http://www.hpbdis.org/public/portal/list/index/id/9.html

Full Paper Submission(extended)： Notification of Acceptance： Final paper Submission： Early Bird Registration：

15 Oct 2021 31 Oct 2021 15 Nov 2021 15 Nov 2021

HPBD&IS 2021 The 3rd International Conference on High Performance Big Data and Intelligent Systems

Macau, China (Physical & Online)

December 5-7, 2021

Submit Now! Home page: http://www.hpbdis.org/

Conference Secretary: Email: hpbdis@semi.ac.cn Tel: +86-10-82304554 Phone: +86-15210613490

Conference Website: http://www.hpbdis.org/

Sponsors

Committees

Organizers

Technical Sponsor

General Chair: Xian-He Sun, Illinois Institute of Technology, USA. Cheng-Zhong Xu, University of Macau, China.

Geoffrey Fox, Indiana University, USA.

Program Chair: Weijun Li, Institute of Semiconductors, Chinese Academy of Sciences, Shenzhen DAPU Microelectronics Co., Ltd., China. Kejiang Ye, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, China Zhiguo Gong, University of Macau, China.

Publication Chair: Xin Ning, Institute of Semiconductors, Chinese Academy of Sciences, China. Liang Yuan, Institute of Computing Technology, Chinese Academy of Sciences, China

Chen Wang, Beihang University, China

Publicity Chair: Wenfa Li, Beijing Union University, China Yufei Tang, Florida Atlantic University, USA.

Xuanhua Shi, Huazhong University of Science and Technology, China Iftikhar Ahmed Saeed, University of Lahore, Pakistan

Organizing Chair: Lina Yu, Institute of Semiconductors, Chinese Academy of Sciences, China. Xiao Bai, Beihang University, China

Leong Hou U, Ryan, University of Macau, China Baoli Lu, Institute of Semiconductors, Chinese Academy of Sciences, China

Local Chair: Xiang Li, Shenzhen International Robot City Industrial Park, Shenzhen Longgang District Robot association, China Minxian Xu, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, China

Zhenning Li,University of Macau, China

Financial Chair: Xidai Li, Technical Committee of HPC, China Computer Federation, China

Website Chair: Sheng Li, Zhongnan University of Economics and Law, China

Session Chair: Fei Wu, Huazhong University of Science and Technology, China

Awards Chair: Jidong Zhai, Tsinghua University, China

Steering Commitee: Qing Yang, Professor, IEEE Fellow, University of Rhode Island, Shenzhen DAPU

Microelectronics Co., Ltd.

Haibo He, Professor, IEEE Fellow, Editor-in-Chief for IEEE Trans. on Neural Networks and Learning Systems, University of Rhode Island.

Hong Jiang, Professor, IEEE Fellow, University of Texas, Arlington.

Weijun Li, Professor, Institute of Semiconductors Chinese Academy of Sciences,

Shenzhen DAPU Microelectronics Co., Ltd.

Yuan Xie, Professor, IEEE Fellow, Editor-in-Chief for ACM Journal on Emerging Technologies in Computing Systems (JETC), University of California, Santa Barbara.

Xian-He Sun, Professor, IEEE Fellow, Illinois Institute of Technology.

Ahmed Louri, Professor, IEEE Fellow, Editor in Chief of IEEE Transaction on Computer, Marilyn Karlgaard Endowed Chair Professor of ECE, Director of High performance Computing Architecture and Technology Lab, George Washington University.

Cheng-Zhong Xu, Professor, IEEE Fellow, Chair of Technical Committee on Distributed

Processing (TCDP) of IEEE Computer Society, Dean of Faculty of Science and Technology, Chair Professor of Computer Science, University of Macau.

Yunquan Zhang, Institute of Computing Technology, Chinese Academy of Sciences

Technical Program Committee (Part of the list): Imane El Alaoui, University of Ibn Tofail, Morocco. Aniello Castiglione, University of Naples Parthenope, Italy. Kasidit Chanchio, Thammasat University, Thailand. Bhaskar Chaudhury, Dhirubhai Ambani Inst. of Information and Communication Technology, India. Yiqiang Chen, Institute of Computing Technology, Chinese Academy of Sciences, China Jian Cheng, Institute of Automation, Chinese Academy of Sciences, China. Xiaoxin Cui, Peking University, China. Aleksey G. Finogeev, Penza State University, Russia. Mohammad Samadi Gharajeh, Islamic Azad University, Iran. Daniel Grosu, Wayne State University, USA. Song Guo, The Hong Kong Polytechnic University, China. Xubin He, Temple University, USA. Song Jiang, University of Texas at Arlington, USA. Hamid Khayyam, Royal Melbourne Institute of Technology University, Australia. Yuhong Liu, Santa Clara University, USA..

Rui Oliveira, University of Minho and INESC TEC, Portugal. Calton Pu, Georgia Institute of Technology, USA. M. Mustafa Rafique, Rochester Institute of Technology, USA Jiwu Shu, Tsinghua University, China. Bo Tang, Mississippi State University, USA. António Amaro Costa Vieira, University of Minho, Portugal. Donghui Wang, The Institute of Acoustics of the Chinese Academy of Sciences, China. Jianping Wang, City University of Hong Kong, China. Pulasthi S. Wickramasinghe, Indiana University, USA. Christopher Woods, University of Bristol, UK. Qingyao Wu, South China University of Technology, China. Feng Yan, University of Nevada, Reno, USA. Jun Yan, Concordia University, Canada. Xiaorong Zhang, California State University. SF., USA. Jose Luis Calvo Rolle, University of A Coruña, Spain.

The conference of HPBD&IS 2019 and 2020 had been held successfully！

HPBD&IS 2019 was successfully held in Longgang, Shenzhen, bringing together the world's top experts, scholars and

outstanding talents in the industry, and conducting open discussions around international hot topics, core key

technologies, industrial development and challenges. And with due regard to the safe and healthy environment in

China and the global, HPBD&IS 2020 had been successfully held online on May 23, 2020.

The conference proceedings of HPBD&IS 2019 and 2020 have been published by IEEE Xplore® and indexed by EI.

More than 30% of them have been published in the Special Issue of SCI indexed journal-Concurrency and

Computation Practice and Experience (CCPE) after expansion.

Home page: http://www.hpbdis.org/