The 6th generation Intel

CPU Challice Genes t

J ocelyn Lazo

Outline

- Cover Broadwell/ Skylake - What are they? - Differences ?

- What was added/ removed?

- Compare to Has well;Benchmarks

What are we talking about?

Intel Centra l Proces s ing Units

- Intel has been producing cpus s ince the 4-bit 4004 in 1971 to the modern day 6th generation models in 2015 (coming up on 2016).

- Focus ing on 6th generation of intels new CPU architectues : Broadwell and Skylake

Overview Broadwell - Intel’s primary objective when creating Broadwell was to create a mobile,

low-power CPU des igned to decrease battery consumption with minimal los s of performance.

- The new des ign was built us ing the 14nm Finfet lithography. The mos t recent des igns used a 22nm mos fets . The new Finfets require les s power to keep on.

- Broadwell will not completely replace the range of Haswells - Broadwell is the ‘Tick’ in Intel’s ‘Tick-Tock’ des ign philosophy. - Released in Summer of 2014

M-5Y70 (Broadwell) vs i7-4600U (Has well)

- With all other things constant there is an increase in operating frequency/TDP efficiency of 263%

- Battery Life+ at a reasonable cost of performance for the average, non-gaming user*

*peasant

Memory Bandwidth

- M-5Y71

- i7-4600U

Overview Skylake - The ‘Tock’ represents a new architecture - Released September 2015 (lower power m-core models ) - Brings greater CPU and GPU performance - A fresh architecture. There are a few high end models , but overall there

hasn’t been any s ignificant improvement in anything but power efficiency.

M7-6Y75 (Broadwell) vs i7-4600U (Has well)

Memory Bandwidth

- M7-6Y75

- i7-4600U

Memory Speeds for high end chips

Game Benchmarks for higher end chips

Game Benchmarks for higher end chips

Broadwell vs Skylake - Skylake is ditching the FIVR (Voltage regulator) used to consolidate a ll

incoming voltages . This is likely due to the effectivenes s of a s ingle regulator doesn’t jus tify the cos t.

What is a FinFet? - Developed by researchers from the Univers ity of California , Berkeley - Conducting channel is wrapped by thin s ilicon known as the “fin”

- Provides better electrical control over the channel - Which reduces current leakage and other short-channel effects

Appendix

http:/ / www.intel.com/ content/ www/ us / en/ proces sors / core/ core-m-proces sors -new.html

http:/ / wccftech.com/ intel-abandon-internal-voltage-regulator-skylake-microarchitecture/

http:/ / www.cpu-world.com/ Compare/ 897/ Intel_Core_M_5Y70_vs_Intel_Core_i7_Mobile_i7-4600U.html

Appendix

http:/ / wccftech.com/ intel-ice-lake-return-fvir-wip/

http:/ / www.techdes ignforums .com/ practice/ guides / finfets /

http:/ / www.laptopmag.com/ articles / intel-core-m-details

http:/ / www.techdes ignforums .com/ practice/ guides / finfets /