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CORE-S SDK for LabVIEW
The new CORE-S moduleNew Infrared TechnologiesLow-cost uncooled MWIR readout module with USB output
Available with MATRIX 1024 imaging FPA, LUXELL linear arrays & linear array for MWIR spectroscopy
MATRIX 1024 CORE-S LUXELL CORE-S
FPA compatibility MATRIX 1024 FPA(imaging FPA, 32x32 pixels)
All LUXELL linear FPA versions (including LUXELL 128 for spectroscopy)
FPA included YesIntegration time 2 - 100 μs, selectable
Frame rate (max) 100 frames per second LUXELL 64 FPA: 1,200 lines per secLUXELL 128 FPA: 600 lines per secLUXELL 256 FPA: 300 lines per sec
Intelligent dark current substraction Yes (on-board)Start-up time < 5 secondsDimensions (mm) 57 x 40 x 40Weight (grams) 60 gNETD (mK) < 100 mK (*)Optimum temperature detection range > 70 CMicrocontroller ARM CORTEX M3System communication and control USB 2.0, full speed, raw format, 14 bitsPower 1 W - USB powered (5 VDC, 0.2 A)Software supplied CORE-S SW SUITE (Acquisition+Visualization SW)API for programming CORE-S SDK for LabVIEW (accessory)
Technical characteristics
Optional optics available for CORE-S modules
Available accessories
CORE-S version NFoV WFoV UWFoV
MATRIX 1024 FPA f=48mm / F# 2.4FoV=3.8º x 3.8º
f=24mm / F# 1.2FoV=7.6º x 7.6º
f=9mm / F# 0.7FoV=20º x 20º
LUXELL 64 FPA f=48mm / F# 2.4FoV=7.6º x 1.2º
f=24mm / F# 1.2FoV=15.2º x 2.4º Not available
LUXELL 128 FPA & spectroscopy version
f=70mm / F#2.0FoV=10.5º x 0.8º
f=35mm / F#1.1FoV=21.0º x 1.6º Not available
LUXELL 256 FPA f=70mm / F#2.0FoV=12.6º x 0.5º
f=35mm / F#1.1FoV=25.2º x 1.0º Not available
* Excluding version for spectroscopy
Front plate with lens holderIncludes:• M35x1screwforoptics• Screwfortripodmount,2
positions:0º-90ºDimensions(mm):65x48
Metallic housing Includes:• M35x1screwforoptics• Screwfortripodmount,bottom
side• USBconnectorDimensions(mm):80x50x45
For the latest information, visit us at www.niteurope.com, contact us at [email protected] or suscribe to our Twitter channel: @niteurope
MATRIX 1024 CORE-S (IMAGING FPA)
LUXELL CORE-S (LINEAR ARRAYS)
FPA format:Pixel size: Spectral response:Detection (lpeak):D*(lpeak) (typ):Optimum range of detection:Operating temperature:Integration time:Frame rate (max): Dark current substraction:Start-up time: Dimensions (mm):Weight (grams):Microcontroller: System communication & control:Data output:Power: Software:
32x32 (1024 pixels)100 x 100 μm2
1-5 microns3.7 microns2·109 Jones
Target > 70 C5 C - 70 C
2 - 100 μs, selectable100 fps
On-board< 5 second
57 x 40 x 4060
ARM CORTEX M3USB 2.0 full speed
Raw digital data, 14 bits1W (5 VDC, 0.2 A) (USB powered)
CORE-S Software Suite
FPA format:Pixel size:
Spectral response:Detection (lpeak):D*(lpeak) (typ):Optimum range of detection:Operating temperature:Integration time:Frame rate (max):
Dark current substraction:Start-up time: Dimensions (mm):Weight (grams):Microcontroller: System communication & control:Data output:Power: Software:
Linear (64, 128 & 256 pixels)64&128px: 100 x 1000 μm2 /
256px: 60 x 600 μm2 1-5 microns3.7 microns2·109 Jones
Target > 70 C5 C - 70 C
2 - 100 μs, selectable64px: 1200 lps; 128px: 600 lps
256px: 300 lpsOn-board
< 5 second57 x 40 x 40
60ARM CORTEX M3USB 2.0 full speed
Raw digital data, 14 bits1W (5 VDC, 0.2 A) (USB powered)
CORE-S Software SuiteNote: The spectroscopy version is based on a LUXELL 128 FPA (128 pixels) and includes a linear variable filter for spectral measurements between 3.0 and 4.6 um (60 nm/px of spectral resolution)
SOME APPLICATIONS OF THE NEW CORE-S MODULE
LASER MANUFACTURING PROCESS CONTROL (welding, cutting, tempering, etc)
GLASS CONTAINER HOT-END INSPECTION & QUALITY CONTROL
GAS AND FIRE DETECTION, GAS DYNAMICS MONITORING, PLUME STUDY
STEEL MANUFACTURING PROCESSES MONITORING (seam welding, etc)
LASER & LED SOURCE CHARACTERIZATION
AEROSPACE INDUSTRY, JET TURBINE MONITORING, R+D
The CORE-S module is a product from New Infrared Technologies, S.L.For more information, visit us at www.niteurope.com, our DirectIndustry virtual booth, contactus at [email protected] or suscribe to our Twitter channel: @niteurope(C) New Infrared Technologies, S.L. - 01/2013 - All rights reserved - The information shown in this document is property of New Infrared Technologies and subject to changes without prior communication.
