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The Swiss Photonic Packaging Laboratory (SPPL) Christian Bosshard Burgdorf, March 28 2013

The Swiss Photonic Packaging Laboratory (SPPL) · The Swiss Photonic Packaging Laboratory (SPPL) Christian Bosshard Burgdorf, March 28 2013

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Page 1: The Swiss Photonic Packaging Laboratory (SPPL) · The Swiss Photonic Packaging Laboratory (SPPL) Christian Bosshard Burgdorf, March 28 2013

The Swiss Photonic Packaging Laboratory (SPPL)

Christian Bosshard

Burgdorf, March 28 2013

Page 2: The Swiss Photonic Packaging Laboratory (SPPL) · The Swiss Photonic Packaging Laboratory (SPPL) Christian Bosshard Burgdorf, March 28 2013

Copyright 2013 CSEM | The Swiss Photonics Packaging Laboratory – SPPL | Christian Bosshard | Page 2

Photonics – benefits for Europe/Switzerland

• Photonics accepted as a EU key enabling technology

• Photonics components and systems

• Development and integration

• Automation whenever needed

• (Small) series production

• Testing of components

• Benefit for Europe/Switzerland:

• Today assembly of optical systems is moving to Extreme East

• Miniaturization and integration means automation:

• Less dependence on human assembly

• Possibility of relocating/regrowing industry back to Europe

Introduction

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Made in Switzerland

Made in Switzerland

Introduction

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Copyright 2013 CSEM | The Swiss Photonics Packaging Laboratory – SPPL | Christian Bosshard | Page 4

Threat:

From «Made in Switzerland»

to «Engineered in Switzerland» and «Made in China»

to «Engineered and Made in China»

Made in Switzerland

Introduction

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Aims

• To be a one stop shop contact for the Swiss industries for Photonic Packaging.

• To build up a network with all interested research organisations within Switzerland.

• CSEM will serve as entrance point for customer requests.

• Requests will be discussed within the SPPL.

The Swiss Photonic Packaging Laboratory (SPPL)

ensure the best solution for the customer

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Background

• Starting point: CSEM Central Switzerland Center

• The center has a well-equipped photonics packaging infrastructure in a clean

room environment including

• die bonders

• flip-chip bonders

• fine alignment stages

• laser welders

• The center has successfully carried a number of photonic packagaging

projects for Swiss clients including Oclaro, Fisba, Huber + Suhner and Axetris.

The Swiss Photonic Packaging Laboratory (SPPL)

welding, soldering and high-precision (below 1 um) adhesive bonding

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Packaging infrastructure

Infrastructure

• Class 10‘000

• Temperature controlled

• Humidity controlled

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Optical telecom: laser modules

Optical telecom

Amplifier circuitry

Laser module

Page 9: The Swiss Photonic Packaging Laboratory (SPPL) · The Swiss Photonic Packaging Laboratory (SPPL) Christian Bosshard Burgdorf, March 28 2013

Copyright 2013 CSEM | The Swiss Photonics Packaging Laboratory – SPPL | Christian Bosshard | Page 9

Optical telecom: multifiber connectors

Optical telecom

Laser

Page 10: The Swiss Photonic Packaging Laboratory (SPPL) · The Swiss Photonic Packaging Laboratory (SPPL) Christian Bosshard Burgdorf, March 28 2013

Copyright 2013 CSEM | The Swiss Photonics Packaging Laboratory – SPPL | Christian Bosshard | Page 10

Materials processing

Materials processing

DDP 100

Page 11: The Swiss Photonic Packaging Laboratory (SPPL) · The Swiss Photonic Packaging Laboratory (SPPL) Christian Bosshard Burgdorf, March 28 2013

Copyright 2013 CSEM | The Swiss Photonics Packaging Laboratory – SPPL | Christian Bosshard | Page 11

Manufacturing

Small series production

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Proposition - I

• Build up the SPPL to allow the already existing Photonic Packaging Laboratories in

Switzerland to become more competitive on an international level and to even better

serve the needs of the Swiss SMEs.

• The SPPL will lead to a reduction of the overall packaging development costs by

avoiding unnecessary duplication of infrastructure.

The Swiss Photonic Packaging Laboratory (SPPL)

• The partners within the SPPL will offer process development and small series

production: very important as there are currently still hardly any standards in

photonics packaging which is a big cost driver both for development and production.

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Proposition - II

• Starting point: SPPL composed of CSEM (lead) and 2 – 3 partners (to be contacted)

• After an initial consolidation phase, other partners are welcome to join.

• Closed discussions dedicated to specific topics including

• high-precision adhesive fixing materials and technologies

• AuSn and related soldering of optoelectronic components

• wavelength tunability

• …

• These discussions will be combined with laboratory visits at the partners’ sites.

The Swiss Photonic Packaging Laboratory (SPPL)

Page 14: The Swiss Photonic Packaging Laboratory (SPPL) · The Swiss Photonic Packaging Laboratory (SPPL) Christian Bosshard Burgdorf, March 28 2013

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Proposition - III

• Regular steering meetings (e.g. bimonthly) will take place to align the offer of the SPPL.

• Dedicated small equipment purchase: can help the SPPL members to better support

the Swiss industries

The Swiss Photonic Packaging Laboratory (SPPL)

• Exchange of instruments between the SPPL members to allow a better use of the

existing infrastructure.

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Conclusion

• The SPPL will provide many opportunities for the Swiss photonics market including

• the development of robust, reliable and low cost processes designed for

devices/sensors and complete photonic systems

• precision robot systems for automation

• manufacturing capabilities through the building up an extension of an

infrastructure for process development and pilot and small series

The Swiss Photonic Packaging Laboratory (SPPL)

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