The+LED+Industry ps

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Sig Isswww.LEDJournal.com

Spring 2011 | LED Journal 3www.LEDJournal.com

Volume 6, Issue 1

Editor & PublisherDavid Webster

Director of Content

Shannon Given

Associate EditorsHeather Krier

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Manager of AdministrationMarsha Grillo

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Circulation/Data EntryRoss Webster

Ofce Manager Julie Williams

Advertising Sales and MarketingLaura Mayo, Account Executive

Julie Hammond, Production Manager Jennifer Graham, Marketing Assistant

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The Magazine of Solid-State Lighting

co

FeatureS

A “Just the Facts” Approach to Clear Up Market Confusion . . . 4

Lightfair International 2011: Overview. . . . . . . . . . . . . . . . . . . . . 6

The LED Industry: Riding the Display Wave, Looking

For Lighting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

On the Cover: Bridge Comes to Life at Sunset with All-White

Interactive LED Light Show. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

departmentS

2011 Annual Resource Guide . . . . . . . . . . . . . . . . . . . . . . . . . 11

Application Proles . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Arrays, Modules & Components. . . . . . . . . . . . . . . . . . . . . . . . . .19

Materials, Testing & Manufacturing. . . . . . . . . . . . . . . . . . . . . . .23

Applications & Integrations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25

Industry News . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26


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Light emitting diodes (LEDs) have served

markets such as automotive, signage and in-

dicators for many years. The LED industry

entered into a new phase in 2010, as the mar-ket for LED backlights in large-area liquid

crystal displays (LCDs), particularly for TVs,

took off. At the same time, the industry is

looking ahead to an even larger market, gen-eral illumination. This rapid growth has been

enabled by the ongoing cost reductions and

performance improvements in LED per-

formance over the past two decades. At thesame time, the larger size and more demand-

ing requirements (most notably in terms of

cost) of these new markets are having ef-

fects on the industry structure and driving new technology developments.

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The properties of LEDs, solid state de-

vices that with narrow and accurately con-

trolled spectrum, fast response time, rigidity,

low power consumption, high efcacy andlong lifetime, are transforming the LCD in-

dustry and enabling a switch from the legacy

CCFL backlights. LED backlights allow for

faster switching of the display (higher framerates), wider color gamut and higher con-

trast, in thinner and lower-power packages.

Led by notebook PC displays, LED back-

lights are taking over the key applicationsfor large LCD panels (Figure 1).

In particular, the conversion of LCD

TVs, with their large sizes, to LED back-

lights is driving demand for LED chips; new applications in lighting are also contributing

to growth (Figure 2). Conventional bulbs

and halogen lamps in automotive applica-

tions have been replaced with LEDs due tobenets including low power consumption,

compact design and long life. LED lamps

and street lights are regarded as key light-

ing markets for LEDs. These applicationsare supported by governments with large

budgets, as initial installation costs can be

quite high, although the long lifetime re-

The LeD InDusTry:riig h disly Wv, Lookig fo Lighig

By Paul Semenza, Senior Vice President • DisplaySearch

Figure 1. LED backlights are used in more than half of all large-area TFT LCD panels.

Source: DisplaySearch Q3'10 Quarterly LED Backlight Report

Figure 2. Total LED

demand will pass 100

billion chips in 2011

Source: DisplaySearch

Q3'10 Quarterly LED

Backlight Report

duces maintenance costs, resulting in lowerlifecycle costs.

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As the LED industry has geared up to

pursue the display and lighting markets,

incumbent makers have focused more on

the opportunity to expand downstream,particularly into lighting, leaving the dis-

play backlighting market somewhat open

to new entrants. Longstanding market par-

ticipants include Nichia, a developer of low current white LED along with YAG

phosphor technology and IP, as well asCree, Osram and Philips Lumileds, rst-

tier LED makers of high-power chips, tar-geting lighting applications. Osram is also

leading the exterior automotive LED mar-ket with high power technology.

Given the longer history of LED use in

mobile device and notebook PC displays

(Figure 1), Japanese LED makers includ-ing Nichia and Toyoda Gosei have estab-

lished dominant positions in side view

LEDs for mobile phone and notebook

PC applications with low forward voltagetechnology. However, the rapid shift in


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f

backlight technology for LCD TVs and monitors created more

demand than could be handled by the existing suppliers, who also viewed these applications as commodity markets. Thus, to secure

supplies of LEDs for backlights, nearly every panel maker includ-

ing Samsung, LG, AUO, and ChiMei Innolux, has entered LED

manufacturing through shared investments, joint ventures, or set-

ting up new companies.The impact of this new demand and competition is beginning to

be seen in LED package prices (Figure 3 on page 10), which are fall-

ing consistently, particularly in the 5630 packages used in LCD TV backlights. LED unit price depends on factors including intensity,

package type, color, bin selection and patent rights. In addition to

market competition and demand, improvements in manufacturing

process technology continue to drive down production costs.

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The growing demand is driving advances throughout the LED

supply chain, for example in epitaxial growth processes using

MOCVD equipment. These processes enable higher manufactur-ing capacity and luminous efciency. MOCVD equipment has been

rapidly improving, moving from 2 inch wafers to 4, 6, and 8 inch

wafers, as well as increasing throughput and improving yields. Therehas been a boom in MOCVD equipment sales, with more than 200

machines installed in both Korea and Taiwan in 2010. As demand

has grown, incumbent players such as Aixtron and Veeco have been

joined by new competitors, including Applied Materials and several

Korean rms.The total LED package efciency includes chip efciency, phos-

phor efciency and package efciency. Sapphire (Al2O

3 ) is the most

widely used substrate material for LED epitaxial growth with gal-

lium nitride compounds, due to its relatively low cost and maturity.

However, sapphire has a high level of lattice dislocation, so someLED makers are trying GaN or SiC, ZnO and Si substrate materials

to improve epitaxial performance.

To reduce heat in the chip and to increase chip efciencyimproving light extraction is an area of focus; utilizing surface

roughness or surface patterns to reduce total internal reection

in the chip can improve extraction. Another area of improvement

has been in the chip structure, with the development of verticalstructure LEDs.

Chip packaging and driver ICs are also important aspects to

high-volume LED manufacturing. The package must meet specif-

ic electrical, optical, mechanical and thermal requirements, whilereducing materials and assembly costs. For displays, top and side

view packages have been developed, and packages such as ceramicand arrays are used in lighting. Wafer-level packaging and ip-chip

techniques can also improve manufacturing efciency. In driver

ICs, the trend is toward higher levels of integration, although largearea backlights continue to use external MOSFET devices due to

the output requirements.

Phosphor performance has a directly impact on LED color gam-

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ut, luminous intensity and lifetime. YAG

(Nichia), TAG (Osram), BOSE (Intematix, Toyoda Gosei, Merck and others), and Ni-

tride (Mitsubishi Chemical, Denki Kagaku)

mainly use phosphor compositions. White

LEDs typically use GaInN chips that emit

in the blue, along with a yellow phosphorthat converts most of the blue into a broad

band. Other approaches to producing white

light include using red and green phosphors with a blue emitter, as well as a UV emitter

with red, green and blue phosphors. These

approaches result in higher CRI (color ren-

dering index, a measure of how “natural”the light appears, which is important in

lighting), but lower luminous efciencies.

An alternate approach is to combine red,

green, and blue emitters in a multi-chippackage, which tends to have high cost.

Two of the most common yellow phos-phors are YAG (Y

3 A

l5O

12 ), originally de-

veloped by Nichia, and TAG (Tb3 A

l5O

12 ),

developed by Osram; both are typically activated with trivalent cerium (Ce). An al-

ternative class of materials use silicate phos-

phors; intellectual property for these materi-

als has been asserted by a group called theBOSE consortium (consisting of Tridonic,

Toyoda Gosei, Leuchtstoffwerk Breitungen

and Litec GbR), which has signed a cross-

licensing agreement with Intematix. Recent-

ly, phosphors have been developed aroundSiAlON materials by Denka and nitrides by

Mitsubishi Chemical.

These different types of phosphors canbe complex to create, and are typically

protected by patents, resulting in materials

costs in the thousands of dollars per ki-

logram. These materials are also limited inefciency and can suffer from thermal de-

cay. This has led to continued development

of inorganic phosphorescent and uores-

cent materials, as well as new luminescentmaterials based on nano-scale semiconduc-

tors, called quantum dots.Quantum dots are nanometer-sized

semiconductor crystals that use materialsfrom periodic groups II-VI, III-V or IV-

VI, typically synthesized in the liquid phase,

and appear similar to colored inks. Quan-

tum dots provide the stability and reliabil-ity of inorganic semiconductor materials,

and since they can be “tuned” through se-lection of material and crystal size, and areprocessed in solution. Companies pursuing

these technologies include QD Vision and

Nanosys, both of whom are working with

backlight and display makers to commer-cialize these materials.

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Until 2010, the LED industry grew

through development of multiple applica-tions, including automotive, mobile phonebacklight and keypad lights, and notebook

PC display backlighting, as well as indica-

tors, signage and illumination. With the

rapid adoption of LED backlights in LCD TVs and monitors, the industry is undergo-

ing a boom in investment, and new compa-

nies are entering the market. Developments

in manufacturing, materials and packaging have all contributed to the increased output

and falling prices for LED devices, which

in turn is what made the widespread adop-

tion in display backlights possible. But theincreased scale of manufacturing is driving

additional improvements in LEDs, and on-

going materials and process development

will likely further performance. This willopen up the ultimate market for LEDs,

general illumination.

Paul Semenza is senior vice presidentof analyst services at DisplaySearch and

covers at-panel displays, consumer

electronics and solar energy. Prior to

joining DisplaySearch, Paul served as

vice president of Display Research for

iSuppli Corp. from 2000 to 2008 and for

Stanford Resources, Inc. from 1997 to

2000. Prior to Stanford Resources, Paul

was a program ofcer at the Computer

Science and Telecommunications Board

of the National Research Council,

where he directed studies on IT policy,and he was an analyst for the US Con-

gress Ofce of Technology Assessment

(OTA), covering emerging technologies

such as at panel displays. Paul started

his career in engineering, working for

The Analytic Sciences Corp. from 1985

to 1992. Paul has a bachelor’s degree in

electrical engineering and a master’s de-

gree in electro-optics from Tufts Univer-

sity and a master’s degree in public pol-

icy from the Harvard Kennedy School.

He can be reached at Paul.Semenza@

Displaysearch.com.

Figure 3. Prices of LED packages used in LCD backlights falling, particularly those used in TV back-

lights Source: DisplaySearch Monthly LED Pricing Report

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