THEMIS Mission CDR JacksonUCB, June 14-18, 2004 Critical Design Review THEMIS Mission Assurance Critical Design Review Ron Jackson University of California

THEMIS Mission CDR JacksonUCB, June 14-18, 2004

Critical Design Review

THEMIS

Mission Assurance Critical Design Review

Ron Jackson

University of California - Berkeley

June 14-18, 2004



THEMIS Mission Assurance Team

• Ron Jackson Mission Assurance Manager

• Jorg FisherQuality Assurance Engineer

• Chris Scholz Quality Control Engineer

• Tom Clemons Quality Control Technician



Quality Assurance Flowdown

• UCB-PAIP – released – Pending approval by GSFC

• Swales PAIP – released – Approved by UCB• FGM/TUB PAIP – released – Approved by UCB• SCM/CETP PAIP – released – Approved by UCB• All other vendors - Purchase order Flowdown

Instrument Mission Assurance Requirements Document (MAR) was released on June 25, 2002.

UCB responded with a Performance Assurance Implementation Plan (PAIP):



Responsibilities of Quality Assurance

1.) Review and report on: a) Evaluate/Audit contractors facilities for the ability to

consistently produce quality flight hardware dailyb) Equipment calibration, temperature and humidity monitorsc) Clean room controlsd) Compliance to ESD requirementse) Workmanship procedures/processesf) Material handling and shelf life material storageg) Data packages and logbooksh) Nonconformance reporting / Problem reportsi) Assembly instruction / BOMj) Personnel training and certification to NASA standardsk) Part/Materials Alert Status




2.) Support integration and test activities: a) Verify test set ups at board/instrument and

spacecraft levelsb) Monitor thermal testing at Box/instrument and

spacecraft levelsc) Witness vibration testing at instrument and

spacecraft levelsd) Verify magnetics testing at instrument levelse) All European suppliers – UCB shall review

Acceptance Package Data / Travelers and inspect component/Box upon delivery to U.S.



Responsibilities of Quality Assurance 3.) Provide electrical and mechanical inspections but not limited to:

a) Incoming materialsb) Solder workmanship, through hole and

SMT methods (verify coupon acceptance)c) Conformal coating and staking applicationsd) Witness board or Box closuree) Wire harness build, continuity test, Hi-pot

testing and routingf) Configuration verification, as designed vs.

as built



Contamination Control

• UCB Contamination Control– Class 100k clean room– Air particle count will be monitored– All flight hardware will be placed in clean bags



Software Assurance

• IV &V (IDPU & BAU)– To review software code– Develop metrics (Software risk assessment)– All software problems will be tracked on problem

reports– All software changes will be under configuration

review

• Probe Bus– Under UCB configuration management review– Software problems reports provided to UCB




4.) Communications: a) Provide both written and verbal reports to

THEMIS project management – monthly

b) Participate in program telecons - as required

c) Problem/failure reporting may be informal up to the time of integration with flight hardware



THEMIS Parts Requirements

• 311- INST-001, Level 3– Parts in compliance with 311-INST-001, Level 3 requirements

and Standard Parts.– Use PPL 21 preferred parts, design permitting.

• PIND, per Mil-STD-750 and Mil-STD-883, required for cavity devices.– Impose on manufacture, if possible.– When needed, have DESC approved test facility perform

testing.• CSI and/or DPA for complex or known problem devices.



THEMIS Parts Requirements (continued)• Non-standard EEE parts will require at a minimum: PEM

– DPA, Preconditioning, HAST, CSAM• Radiation Testing

– Total Ionizing Dose Requirement 66 Krads (si)• Review existing test data from GSFC, JPL & Manufacturer• Review NASA “where used” historical data

– Parts o.k. to use if data and/or orbit requirements equals or exceeds THEMIS

• When needed, will perform Cobalt 60 TID testing– Single Event Effects: use existing data or historical use similarity

• Whenever possible, designers will use latchup immune devices• Latchup requirements 37mev• Exceptions are handled on case by case basis with THEMIS Project Office



THEMIS EEE Parts List• UCB QA will maintain EEE Parts Identification List (PIL)

• PIL will contain

– Manufacturer’s generic part number

– Military part number or SCD number

– Manufacturer(s)

– Where used (unique assembly) / Quantity used

– Quantity ordered

– Lot/Date Code

– Radiation status (TID / SEL)

– Project Approval Status

– Alert status

– Comments



THEMIS EEE Parts List (continued)• Parts will be procured to an approved Parts List

– Schedule permitting, Berkeley will do common buy.– Procurement of devices will be based upon design Engineers

Confidence-of-use factor of 70%.• Unique, high dollar items will be at 90% - 100% Confidence

Level– Minimum Attrition / Spares factor of 20% - 30% will be applied

to flight procurement quantities. Standard devices will have higher spares’ factor.

– Schedule and Cost permitting, Engineering test units will use flight qualified part. Especially where minimum buy quantities are imposed.

• ETU and Flight units– Procurements will run concurrently

• Flowdown PAIP requirements on subcontractors.



THEMIS EEE Parts List (continued)Parts Control Board (PCB)

• PCB members: THEMIS QA, Parts Engineer (GSFC), design Engineer and THEMIS – Berkeley Project Manger, or representative.

• PCB shall review EEE part for:– Testing, Screening and Qualification requirements– Alerts– Review non-standard parts requirements

• PCB will disposition EEE parts failures and nonconformance issues.

• UCB QA will coordinate PCB parts issues with GSFC Flight Assurance Manager, or his representative.



GIDEP Alert Review

• Microcircuits- 41 ea. Checked ok- 1 ea. Checked bad

• Semiconductor Devices– 49 ea. Checked ok– 1 ea. Checked bad

• Resistors/Capacitors– 31 ea. Checked ok

• Connectors– 6 ea. Checked ok

• Wire/Harness– 4 ea. Checked ok

• Misc. Materials– 0 ea. Checked

• Mechanical Parts– 0 ea. Checked



Parts Issues

EEE parts Alerts

Actel – FPGAIn-rush current problem

JANTXV1N5711-1ESD /Lead handling problem

Parts at up- screening

CA3080A @ GSFC

OP462HRU @ GSFC

LTC1604 @ GSFC

2N6519 @ GSFC

PT100 @ GSFC

AD5544 @ WYLE



THEMIS Parts Lists Status

Assembly List Developer Status Comments

EFI,SCM,FGE,PCB,LVPS,

DFB,BEB,DCB,ETC,ESA,SST

UCB Parts Status

University of California

In-Review at GSFC

Parts Control Board in-process

Probe,

Probe CarrierSwales Parts Status

Swales In-Review at UCB

Parts list to be submitted to GSFC for review



THEMIS Materials Lists Status

Assembly List Developer Status Comments

EFI,SCM,FGE,PCB,LVPS,

DFB,BEB,DCB,ETC,ESA,SST

UCB Material Status

University of California

In-Review at GSFC

None

Probe,

Probe CarrierSwales Material Status

Swales In-Review at UCB

Material list to be submitted to GSFC for review

Documents

THEMIS Mission CDR JacksonUCB, June 14-18, 2004 Critical Design Review THEMIS Mission Assurance Critical Design Review Ron Jackson University of California