Thermal management in smartphones: technology · PDF filedesign efforts towards low power/high efficiency ... optimizing thermal transfer in the entire system at chip level ... Apple

©2017 System Plus Consulting | Thermal Management Review in Smartphones 1

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Thermal Management in Smartphones: Technology Comparison 2017

Comparative Analysis of 10 Smartphones of Apple, Samsung, Huawei, Xiaomi, LG

Power report by Elena BARBARININovember 2017 – Version 1

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Table of ContentsOverview / Introduction 3

o Executive Summary

o Methodology

o Glossary

Company Profile 7

o Apple, Samsung, Huawei, Xiaomi, LG

o Smartphone History

Thermal Management Solutions & Comparison 43

o Heating Zones

o Processor Design & Packaging

o Telephone Assembly Thermal Solutions

Physical Analysis 53

o Physical Analysis Methodology

o Apple 55

o iPhone 6s Plus

Package View & Heating Zones

Board PBC & Heat spreader

Processor A9

o iPhone 7 Plus



Processor A10

o iPhone 8



Processor A11

o iPhone X



PCB Integration

o Samsung 139

o Galaxy S7



Processor Snapdragon 820 & Ekynos 8

Heat Pipes

o Galaxy S8



Processor Snapdragon 835

Heat Pipes

o Huawei 211

o P9



Processor Kirin 955

o Mate 9



o LG 264

o G6



Heat Pipes

o Xiaomi 285

o Mi5



Company services 297


Overview / Introductiono Executive Summaryo Methodologyo Glossary

Company Profile & Phone History

Thermal Management Solutions

iPhone Physical Analysis

Samsung Physical Analysis

Huawei Physical Analysis

LG Physical Analysis

Xiaomi Physical Analysis

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Executive Summary• A smartphone contains several components that generate heat and other components sensitive to heat; to maintain

acceptable temperature levels in these small handheld devices, manufacturers propose different solutions whichrequire high performance and design constraints.

• To complement Yole Développement’s Thermal Management in Smartphones report, System Plus Consulting hasconducted a comparative technology review to provide insights into the assembling structure and thermalmanagement technology of 10 flagship smartphones from leading suppliers: Apple, Samsung, Huawei, LG andXiaomi.

• In this report, we highlight the differences and the innovations in the thermal management solutions chosen by theend-user OEMs.

• Whereas some OEMs use standard solutions such as heat spreaders of metal frames, others choose to considermore complex structures such as heat pipes.

• Moreover, as the processor is one of the most important heat sources, we have seen how the PCB design haschanged to improve thermal dissipation and how the packaging of the processor itself has evolved to solve thermalproblems caused by miniaturization and efficiency increase. Located close to the battery and the DRAM chip on themain board, the application processors are packaged using different PoP technologies. Some AP providers, likeHiSilicon or Samsung, use conventional PoP with embedded land-side capacitors; others, like Apple or Qualcomm,use innovative technologies like fan-out PoP or embedded die packaging with advanced PCB substrate.

• This report includes multiple comparisons based on physical analyses of the latest flagship smartphones. It offers theunique possibility of seeing thermal management technology evolution, tracked by manufacturer.










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Why thermal management in smartphones?

• Thermal management for modern electronic systems can follow two fundamental paths: one concentratesdesign efforts towards low power/high efficiency electronic circuits/components, the other implies, wherethe previous one reaches its limits, optimizing thermal transfer in the entire system at chip level, packagelevel, and PCB/assembly level.

• Those technological evolutions could be seen in smartphones because of the big market share. Big marketshare and small devices sizes push the telephone manufacturers to improve the processor performances(low power/high efficiency) and/or optimize thermal transfer in the complete smartphone system.

• Device manufactuers are interested in following these evolutions because they will be then integrated inother electronic systems.










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2016’s Leading smartphone companies BY units sold per year

Market share of leading smartphone suppliers in 2016 by number of smartphones sold.Yole Développement

Samsung, Apple and Huawei were the leading smartphone suppliers in 2016.










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Thermal Management Market

Source: Yole Développement

• TM component value relative to total BoM seems to be extremely low, but considering the huge number of smartphones sold per year, TM components represent important revenue for suppliers.

• Despite the small share of thermal management components in total smartphone value, their role is crucial to avoid overheating issues which are undesirable for customers.










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Analysed Telephones

• Ten references of telephones have been analyzed.

End-users OEM

Device Smarthphones

sold (2016)

Apple

iPhone 6S Plus

215.4 MUnits

iPhone 7 Plus

iPhone 8

iPhone X

Samsung

Galaxy S7

287.2 MUnit

Galaxy S8

Huawei

P9

143.6 MUnit

Mate 9

LG G6 43.1 MUnit

Xiaomi Mi5 86.2 MUnit










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Analysed Processor Packaging


Overview / Introduction


Thermal Management Solutionso Synthesiso PCBo Processor






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Why telephones get hot?

There are different reasons for overheating of telephones: these can be related to the design, the construction itself, the utilization mode and the environment.










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Processor Packaging platform

WHICH PACKAGES ARE USED IN SMARTPHONES?

•QFN (quad-flat no-leads)

o Main applications are in automotive; very rare in mobile phones

•Fan-in approach (WLCSP–Wafer-Level Chip Scale Package)

o Interconnects are within the die surface area

o Used in mobile phones, RF devices, power devices

o Limitation by the chip size

•FC-BGA

o FC-CSP/FC-BGA are the most standard packages, used in almost all smartphones today.

•Fan-out approach

o Inter connects not limited by the die size

o Good thermal conductivity

o Good electrical conductivity

o More recent approach, therefore still higher cost compared to traditional packaging solutions










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PoP packaging Technologies

The electrically conductive material (18 in the Shinko patent) can include a solid core formed from a metal like copper, whichsolid core can be coated with a solder.

The copper core solder ball seems to be dropped and reflowed before molding. The copper ball has a small shift during thereflow. The presence of the copper ball prevent a shrink of the solder ball during the reflow and also offers better electrical andheat conductivity.

Theorical Technology

Source : Patent US7782624B2MCeP package from Shinko Electric Industries Co.

Shinko’s PoP for Application Processor (AP)

Chipset

FC-PoP is the conventional PoP packaging. Two actors uses this type of package: Huawei, Samsung. One of the two other actors(Qualcomm) uses different approach whith Shinko’s MCeP who choose advanced substrate to support the AP.










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Package Cross-Section Comparison

In the cross-section, two main choice has been made by the End-Users OEM with the PoP. Apple and Qualcomm choose advanced packaging through TSMC and Shinko. Huawei and Samsung choose conventional packaging through Amkor and Samsung.

TSMC and Shinko managed to get thin packaging compared to traditional PoP.

In each PoP, the memory package has approximatively the same thickness, even if one of them doesn’t use stack memory

The high reliability of copper based through molding via solution is obvious when we compared the cross section of the packages.

Depending on the packaging manufacturer, TMV could have some distortion form or unwanted connection.

Even if Samsung and Amkor use the same PoPtechnology, some differences can be seen. For Samsung, the via have a better definition than Amkor.

With 3 RDL layers, TSMC managed to avoid the use of top PCB with small L/S dimensions.

A10 Package cross-section – SEM view

Kirin 955 Package cross-section – SEM view

Exynos 8 Package cross-section – SEM view

Snapdragon 820 Package cross-section – SEM view










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20 18 16 14 12 10 8 6 4 2

800

1000

1200

1400

1600

1800

2000

I/O

num

be

r

Line/Space (µm/µm)

Application processor I/O count & Line/Space width










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PCB Design

The Printed Circuit Board (PCB) has large potential for smartphone thermal management improvement. In fact the PCB is in contact with the heat generating devices, but it has a large area to dissipate the heat.

There are different parameters to take in account in the analysis of the PCB design










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Heat Spreader

HEAT SPREADER are thin layer of material which are used to distribute heat across the telephoneto prevent hotspot and provide lateral heat conduction.

They can be made of different materials:

• Aluminium

• Graphite

• Copper

• ……

And have different shapes:

• Foils

• Adhesive tapes

• Sheets





iPhone Physical Analysis o Synthesiso Telephone





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Apple Processor Supply Chain History

Apple utilizes a fabless production model. They rely on independent third-party suppliers to perform manufacturing and assembly.

60 %

Die Manufacturing

Package Manufacturing

Package Technology

FC-PoP FC-PoP inFO-PoP

2014 2015 2016 2017

40 %

Gate-last HKMG 20 nm

89 mm²

FinFET 14 nm

96 mm²

FinFET 16 nm

104.5 mm²

FinFET 16 nm

125 mm²Die Technology

& Area

FinFET 10 nm

87.7 mm²

inFO-PoP










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Apple iPhone 6s Plus Teardown

Apple iPhone 6s Plus Front View Apple iPhone 6s Plus SideViewApple iPhone 6s Plus Front View

15

8.2

mm

77.9 mm 7.3 mmTelephone surface: 12,323 mm2










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Apple iPhone 6s Plus Heating zones










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Apple iPhone 6s Plus Processor Board






Samsung Physical Analysiso Synthesiso Telephone




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PCB iPhone 6s Plus










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A9 Package Cross-Section










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Apple iPhone 7 Plus Opening










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Apple iPhone 7 Plus Teardown










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Apple iPhone 7 Plus Teardown










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PCB cross section










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Apple iPhone X Teardown










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Apple iPhone X Heating zones










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Apple iPhone X Processor Board










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Samsung Smartphone History & Major Players










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Samsung Galaxy S7 Teardown – European Version










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Samsung Galaxy S7 Teardown EMI (US version)










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Exynos 8 Package Cross-Section










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Exynos 8 Package Cross-Section










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Samsung Galaxy S8 Teardown










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Heat Pipes










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Heat Pipes







Huawei Physical Analysiso Synthesis



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Huawei Smartphone History & Major Players










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Huawei P9 Opening










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Huawei P9 Processor Board










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Kirin 955 Package View & Dimensions








LG Physical Analysiso Synthesiso Telephone


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LG Smartphone History & Major Players








LG Physical Analysiso Synthesiso Telephone


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LG G6Opening










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REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING

Packaging• Advanced RF SiPs for Cell Phones: Reverse

Costing Overview• 2016 Comparison of Application Processor

Packaging

Related Reports

MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT

Batteries / Energy Management• Market Opportunities for Thermal Management

Components in Smartphones

http://www.systemplus.fr/reverse-costing-reports/advanced-rf-sips-for-cell-phones-reverse-costing-overview/

http://www.systemplus.fr/reverse-costing-reports/2016-comparison-of-application-processor-packaging/

http://www.systemplus.fr/reverse-costing-reports/2016-comparison-of-application-processor-packaging/

https://www.i-micronews.com/report/product/market-opportunities-for-thermal-management-components-in-smartphones.html

COMPLETE TEARDOWN WITH:

Detailed photos

Precise measurements

Internal packaging structures

Thermal management solutions

PCB package cross-sections

Processor package analysis

Thermal Management in Smartphones: Technology Comparison 2017

Title: Thermal Management in Smartphones: Technology Review 2017

Pages: 150

Date: November 2017

Format: PDF & Excel file

Price: Full report: EUR 3,490

Bundle offer with Market Opportunities for Thermal Management Components in Smartphones Report by Yole Développement

Comparative analysis of thermal management solution analysis of 10 flagship smartphones from Apple, Samsung, Huawei, LG and Xiaomi.

Whereas some OEMs use standard solutions such as heat spreaders of metal frames,others choose to consider more complex structures such as heat pipes.

Moreover, as the processor is one of the most important heat sources, we have seenhow the PCB design has changed to improve thermal dissipation and how the packagingof the processor itself has evolved to solve thermal problems caused by miniaturizationand efficiency increase. Located close to the battery and the DRAM chip on the mainboard, the application processors are packaged using different Package-on-Package(PoP) technologies. Some AP providers, like HiSilicon or Samsung, use conventional PoPwith embedded land-side capacitors; others, like Apple or Qualcomm, use innovativetechnologies like fan-out PoP or embedded die packaging with advanced PCB substrate.

This report includes multiple comparisons based on physical analyses of the latestflagship smartphones. It offers the unique possibility of seeing thermal managementtechnology evolution, tracked by manufacturer.

A smartphone contains several components that generateheat and other components sensitive to heat; to maintainacceptable temperature levels in these small handhelddevices, manufacturers propose different solutions whichrequire high performance and design constraints.

To complement Yole Développement’s MarketOpportunities for Thermal Management Components inSmartphones report, System Plus Consulting has conducteda comparative technology review to provide insights intothe assembling structure and thermal managementtechnology of 10 flagship smartphones from leadingsuppliers: Apple, Samsung, Huawei, LG and Xiaomi.

In this report, we highlight the differences and theinnovations in the thermal management solutions chosenby the end-user OEMs.

TABLE OF CONTENTS

Overview / IntroductionCompany Profile

Apple, Samsung, Huawei, Xiaomi, LG

Smartphone History

Thermal Management Solutions and Comparison

Heating Zones

Processor Design and Packaging

Telephone Assembly Thermal Solutions

Physical Analysis

Physical Analysis Methodology

Apple

iPhone 6s Plus: Package view and heating zones, board PCB and heat spreader, processor A9

iPhone 7 Plus: Package view and heating zones, board PCB and heat spreader, processor A10

iPhone 8: Package view and heating zones, board PCB and heat spreader, processor A11

iPhone X: Package view and heating zones, board PCB and heat spreader, PCB integration

Samsung

Galaxy S7: Package view and heating zones, board PCB and heat spreader, processor Snapdragon 820 and Exynos 8, heat pipes

Galaxy S8: Package view and heating zones, board PCB and heat spreader, Qualcomm Snapdragon 835, heat pipes

Huawei

P9: Package view and heating zones, board PCB and heat spreader, processor Kirin 955

Mate 9 Pro: Package view and heating zones, board PCB and heat spreader

LG

G6: Package view and heating zones, board PCB and heat spreader, heat pipes

Xiaomi

Mi5: Package view and heating zones, board PCB and heat spreader

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AUTHORS:

3D-Package CoSim+

ANALYSIS PERFORMED WITH OUR COSTING TOOLS 3D-PACKAGE COSIM+

System Plus Consulting offerspowerful costing tools to evaluatethe production cost and selling pricefrom single chip to complexstructures.

3D Package Cosim+

Cost simulation tool to evaluate thecost of any Packaging process:Wafer-level packaging, TSV, 3Dintegration…

3D Package CoSim+ is a processsbased costing tool used to evaluatethe manufacturing cost per waferusing your own inputs or using thepre-defined parameters included inthe tool.

It is possible to enter any Packageprocess flow.

Power Electronics and Compound

Semiconductors. She has a deep

knowledge of Electronics R&D and

Manufacturing environment. Elena

holds a Master in Nano-

technologies and a PhD in Power

Electronics.

Elena

Barbarini

Elena is in charge of

costing analyses for

laboratory. He previously worked

for 25 years at Atmel Nantes

Technological Analysis Laboratory

as fab support in physical analysis,

and for three years at Hirex

Engineering in Toulouse, in a

destructive physical analysis lab.

YvonLe Goff (Lab)

Yvon joined SystemPlus Consulting in2011 to set up its

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4.7 The deadlines that the Seller is asked to state for the mailing of the Products are given for information only and are not guaranteed. If such deadlines are not met, it shall not lead to any damages or cancellation of the

orders, except for non acceptable delays exceeding [4] months from the stated deadline, without information from the Seller. In such case only, the Buyer shall be entitled to ask for a reimbursement of its first down

payment to the exclusion of any further damages.

4.8 The Seller does not make any warranties, express or implied, including, without limitation, those of sale ability and fitness for a particular purpose, with respect to the Products. Although the Seller shall take

reasonable steps to screen Products for infection of viruses, worms, Trojan horses or other codes containing contaminating or destructive properties before making the Products available, the Seller cannot guarantee that

any Product will be free from infection.

5. Force majeure

The Seller shall not be liable for any delay in performance directly or indirectly caused by or resulting from acts of nature, fire, flood, accident, riot, war, government intervention, embargoes, strikes, labor difficulties,

equipment failure, late deliveries by suppliers or other difficulties which are beyond the control, and not the fault of the Seller.

6. Protection of the Seller’s IPR

6.1 All the IPR attached to the Products are and remain the property of the Seller and are protected under French and international copyright law and conventions.

6.2 The Buyer agreed not to disclose, copy, reproduce, redistribute, resell or publish the Product, or any part of it to any other party other than employees of its company. The Buyer shall have the right to use the

Products solely for its own internal information purposes. In particular, the Buyer shall therefore not use the Product for purposes such as:

- Information storage and retrieval systems;

- Recordings and re-transmittals over any network (including any local area network);

- Use in any timesharing, service bureau, bulletin board or similar arrangement or public display;

- Posting any Product to any other online service (including bulletin boards or the Internet);

- Licensing, leasing, selling, offering for sale or assigning the Product.

6.3 The Buyer shall be solely responsible towards the Seller of all infringements of this obligation, whether this infringement comes from its employees or any person to whom the Buyer has sent the Products and shall

personally take care of any related proceedings, and the Buyer shall bear related financial consequences in their entirety.

6.4 The Buyer shall define within its company point of contact for the needs of the contract. This person will be the recipient of each new report in PDF format. This person shall also be responsible for respect of the

copyrights and will guaranty that the Products are not disseminated out of the company.

6.5 In the context of annual subscriptions, the person of contact shall decide who within the Buyer, shall be entitled to access on line the reports on I-micronews.com. In this respect, the Seller will give the Buyer a

maximum of 10 password, unless the multiple sites organization of the Buyer requires more passwords. The Seller reserves the right to check from time to time the correct use of this password.

6.6 In the case of a multisite, multi license, only the employee of the buyer can access the report or the employee of the companies in which the buyer have 100% shares. As a matter of fact the investor of a company,

the joint venture done with a third party etc..cannot access the report and should pay a full license price.

7. Termination

7.1 If the Buyer cancels the order in whole or in part or postpones the date of mailing, the Buyer shall indemnify the Seller for the entire costs that have been incurred as at the date of notification by the Buyer of such

delay or cancellation. This may also apply for any other direct or indirect consequential loss that may be borne by the Seller, following this decision.

7.2 In the event of breach by one Party under these conditions or the order, the non-breaching Party may send a notification to the other by recorded delivery letter upon which, after a period of thirty (30) days without

solving the problem, the non-breaching Party shall be entitled to terminate all the pending orders, without being liable for any compensation.

8. Miscellaneous

All the provisions of these Terms and Conditions are for the benefit of the Seller itself, but also for its licensors, employees and agents. Each of them is entitled to assert and enforce those provisions against the Buyer.

Any notices under these Terms and Conditions shall be given in writing. They shall be effective upon receipt by the other Party.

The Seller may, from time to time, update these Terms and Conditions and the Buyer, is deemed to have accepted the latest version of these terms and conditions, provided they have been communicated to him in due

time.

9. Governing law and jurisdiction

9.1 Any dispute arising out or linked to these Terms and Conditions or to any contract (orders) entered into in application of these Terms and Conditions shall be settled by the French Commercial Courts of Lyon, which

shall have exclusive jurisdiction upon such issues.

9.2 French law shall govern the relation between the Buyer and the Seller, in accordance with these Terms and Conditions.

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Headquarters21 rue La Noue Bras de Fer44200 NantesFRANCE+33 2 40 18 09 [email protected]

Europe Sales OfficeLizzie LEVENEZFrankfurt am MainGERMANY+49 151 23 54 41 [email protected]

America Sales OfficeSteve [email protected]

www.systemplus.fr

Asia Sales OfficeTakashi [email protected]

Mavis WANGGREATER [email protected]

NANTESHeadquarter

FRANKFURT/MAINEuropa Sales Office

LYONYOLE HQ

TOKYOYOLE KK

GREATER CHINAYOLE

PHOENIXYOLE Inc.

KOREAYOLE

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In EURBank code : 30056 - Branch code : 00955 - Account : 09550003234 IBAN: FR76 3005 6009 5509 5500 0323 439

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Contact: EMAIL: [email protected]: +33 2 40 18 09 16

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ABOUT SYSTEM PLUS CONSULTING

Name (Mr/Ms/Dr/Pr):......................................................................................Job Title:......................................................................................Company:......................................................................................Address:......................................................................................City: State:......................................................................................Postcode/Zip:......................................................................................Country:......................................................................................VAT ID Number for EU members: ......................................................................................Tel:......................................................................................Email:.....................................................................................

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Please process my order for “Thermal Management in Smartphones: Technology Review 2017” Reverse Costing Report

Full Reverse Costing report: EUR 3,490*

Annual Subscription (including this report as the first of the year):

System Plus Consulting is specialized in the cost analysis of electronics from semiconductor devices to electronic systems. A complete range of services and costing tools to provide in-depth production cost studies and to estimate the objective selling price of a product is available.

Our services:

TECHNOLOGY ANALYSIS - COSTING SERVICES - COSTING TOOLS - TRAININGS

www.systemplus.fr - [email protected]

o 3 reports EUR 8 400*o 5 reports EUR 12 500*

o 7 reports EUR 16 000*o 10 reports EUR 21 000*o 15 reports EUR 27 500*

*For price in dollars please use the day’s exchange rate *All reports are delivered electronically in pdf format *For French customer, add 20 % for VAT*Our prices are subject to change. Please check our new releases and price changes on www.systemplus.fr. The present document is valid 6 months after its publishing date: November 2017

Ref.: SP17369




TERMS AND CONDITIONS OF SALES

1.INTRODUCTIONThe present terms and conditions apply to the offers, sales and deliveries of services managed by System Plus Consultingexcept in the case of a particular written agreement.Buyer must note that placing an order means an agreement without any restriction with these terms and conditions.

2.PRICESPrices of the purchased services are those which are in force on the date the order is placed. Prices are in Euros and workedout without taxes. Consequently, the taxes and possible added costs agreed when the order is placed will be charged onthese initial prices.System Plus Consulting may change its prices whenever the company thinks it necessary. However, the company commitsitself in invoicing at the prices in force on the date the order is placed.

3.REBATES and DISCOUNTSThe quoted prices already include the rebates and discounts that System Plus Consulting could have granted according to thenumber of orders placed by the Buyer, or other specific conditions. No discount is granted in case of early payment.

4.TERMS OF PAYMENTSystem Plus Consulting delivered services are to be paid within 30 days end of month by bank transfer except in the case of aparticular written agreement.If the payment does not reach System Plus Consulting on the deadline, the Buyer has to pay System Plus Consulting a penaltyfor late payment the amount of which is three times the legal interest rate. The legal interest rate is the current one on thedelivery date. This penalty is worked out on the unpaid invoice amount, starting from the invoice deadline. This penalty issent without previous notice.When payment terms are over 30 days end of month, the Buyer has to pay a deposit which amount is 10% of the total

invoice amount when placing his order.

5. OWNERSHIPSystem Plus Consulting remains sole owner of the delivered services until total payment of the invoice.

6.DELIVERIESThe delivery schedule on the purchase order is given for information only and cannot be strictly guaranteed. Consequentlyany reasonable delay in the delivery of services will not allow the buyer to claim for damages or to cancel the order.

7.ENTRUSTED GOODS SHIPMENTThe transport costs and risks are fully born by the Buyer. Should the customer wish to ensure the goods against lost ordamage on the base of their real value, he must imperatively point it out to System Plus Consulting when the shipment takesplace. Without any specific requirement, insurance terms for the return of goods will be the carrier current ones(reimbursement based on good weight instead of the real value).

8.FORCE MAJEURESystem Plus Consulting responsibility will not be involved in non execution or late delivery of one of its duties described inthe current terms and conditions if these are the result of a force majeure case. Therefore, the force majeure includes allexternal event unpredictable and irresistible as defined by the article 1148 of the French Code Civil?

9.CONFIDENTIALITYAs a rule, all information handed by customers to system Plus Consulting are considered as strictly confidential.A non-disclosure agreement can be signed on demand.

10.RESPONSABILITY LIMITATIONThe Buyer is responsible for the use and interpretations he makes of the reports delivered by System Plus Consulting.Consequently, System Plus Consulting responsibility can in no case be called into question for any direct or indirect damage,financial or otherwise, that may result from the use of the results of our analysis or results obtained using one of our costingtools.

11.APPLICABLE LAWAny dispute that may arise about the interpretation or execution of the current terms and conditions shall be resolvedapplying the French law.It the dispute cannot be settled out-of-court, the competent Court will be the Tribunal de Commerce de Nantes.

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