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Thermal noise in the monolithic final stage. Ronny Nawrodt Matt Abernathy, Nicola Beveridge, Alan Cumming, Liam Cunningham, Giles Hammond, Daniel Heinert, Jim Hough, Iain Martin, Peter Murray, Stuart Reid, Sheila Rowan, Christian Schwarz, Paul Seidel, Marielle van Veggel - PowerPoint PPT Presentation
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Nawrodt 05/2010
Thermal noise in the monolithic final stage
Ronny NawrodtMatt Abernathy, Nicola Beveridge, Alan Cumming, Liam Cunningham, Giles
Hammond, Daniel Heinert, Jim Hough, Iain Martin, Peter Murray, Stuart Reid, Sheila Rowan, Christian Schwarz, Paul Seidel, Marielle van Veggel
GWADW2010 Meeting, Kyoto 19/05/2010
Institut für Festkörperphysik, Friedrich-Schiller-Universität JenaSonderforschungsbereich Transregio 7 „Gravitationswellenastronomie“
Institute for Gravitational Research, University of GlasgowEinstein Telescope Design Study, WP2 „Suspension“
Nawrodt 05/2010
Overview
• Motivation and demands
• Thermal noise in suspension elements
• 3rd generation detectors
– Cooling issues– Material selection– Thermal noise
• Summary
#2/19GWADW2010 Kyoto/Japan
Nawrodt 05/2010 GWADW2010 Kyoto/Japan
Introduction
• sensitivity enhancement by a factor of 10 between 1 Hz and 10 kHz
100
101
102
103
104
10-25
10-24
10-23
10-22
10-21
10-20
10-19
frequency [Hz]
h [1
/ H
z]1st generation2nd generation3rd generation
seismicsuspensionradiation pressure
photon shot noise
thermal noise (test masses)
#3/19[w
ww
.et-g
w.e
u]
Nawrodt 05/2010
Demands
• support the test mass (proper breaking strength)
• ability to produce (quasi-)monolithic suspension
• „proper“ dynamics (mode frequencies, mode separation, etc.)
• low thermal noise– low mechanical loss– „good“ thermal properties (thermo-elastic noise)
• high thermal conductivity to transport thermal load from test masses into the thermal bath
#4/19GWADW2010 Kyoto/Japan
Nawrodt 05/2010
Material selection
• possible materials are dependent on the test mass material:
– fused silica
– sapphire– silicon
• important „boundary condition“:
– fabrication of suspension elements (cutting, polish, …)– design and shaping of suspension fibre/ribbons
– keep crystalline structure in order to obtain a high thermal conductivity
#5/19GWADW2010 Kyoto/Japan
can be bonded by means of catalysis-hydroxide bonding[e.g. van Veggel 2009, Dari 2010]
Nawrodt 05/2010
Thermal noise in suspension elements
• pendulum mode
• violin mode
#6/19GWADW2010 Kyoto/Japan
24
0
2220
20B4
M
TkS pendulum
n nnn
nnnBvioline
LTkS42222
22
)()()(4
2222 12)(
nMLLn
2
2
22 n
LMg
n with and
[e.g. Saulson 1992]
M
, L, n
Lg
20with
Adding internal stiffness of fibre or ribbon leads to more realistic models. [e.g. Gonzalez 2000]
Nawrodt 05/2010
Mechanical loss in suspension elements -1-
#7/19GWADW2010 Kyoto/Japan
[Gretarsson, Harry 1999]
[Cagnoli, Willems 2002]
• mechanical loss of suspension material is a key parameter and can be assumed to consist of 3 contributions:
– bulk loss ,
– surface loss ,
– thermoelastic loss unstressed fibre
fibre under tension • with a proper choice of it is possible to cancel TE loss in
suspension elements
Nawrodt 05/2010
Dilution factor
• The mechanical loss within a fibre contributes inhomogeneously into the thermal noise calculation.
• for pendulum energy is stored in grav. potential (loss free) and the elastic potential of the fibre material (bending!)
• only energy stored in bending is dissipated to a fraction
#8/19GWADW2010 Kyoto/Japan
Most of the bending occurs at the suspension point
[e.g. Saulson 1992]
Nawrodt 05/2010
Mechanical loss in suspension elements -2-
#9/19GWADW2010 Kyoto/Japan
100
101
102
103
104
10-12
10-10
10-8
10-6
10-4
10-2
frequency [Hz]
mec
hani
cal l
oss
Fused Silica Sapphire Silicon
100
101
102
103
10410
-12
10-10
10-8
10-6
10-4
10-2
frequency [Hz]
mec
hani
cal l
oss
100 101 102 103 10410-12
10-10
10-8
10-6
10-4
10-2
frequency [Hz]
mec
hani
cal l
oss
100
101
102
103
10410
-12
10-10
10-8
10-6
10-4
10-2
frequency [Hz]
mec
hani
cal l
oss
100
101
102
103
10410
-12
10-10
10-8
10-6
10-4
10-2
frequency [Hz]
mec
hani
cal l
oss
100
101
102
103
10410
-12
10-10
10-8
10-6
10-4
10-2
frequency [Hz]
mec
hani
cal l
oss
thermoelastic(unstressed)
bulk Brownian surface total
300 K 300 K 300 K
20 K 20 K 20 K
all dia. 1 mm
Nawrodt 05/2010
Surface loss in silicon suspension elements
#10/19GWADW2010 Kyoto/Japan
as = 0.5 pmLow surface loss in silicon (surface lossparameter ~1 order of magnitude lower than fused silica).[see talk by C. Schwarz]
Nawrodt 05/2010
Cancelation of TE loss in silicon
• cancellation of TE noise due to proper strength in fibre not needed (although possible) for crystalline fibres at low temperatures (TE peak shifts towards high frequencies while cooling – reason: large thermal conductivity)
• dY/dT < 0 for silicon compensation
possible for a<0 (18-125 K)
#11/19GWADW2010 Kyoto/Japan
0 50 100 150 200 250 300-0.5
0
0.5
1
1.5
2
2.5
3x 10
-6
temperature [K]
ther
mal
exp
ansi
on c
oeffi
cien
t [1/
K]
a < 0
Nawrodt 05/2010
Cooling issues
• residual optical absorption causes heating of the test masses• heat capacity is very low at cryogenic temperatures (Debye T3
law) small absorption causes large temperature change• suspension will provide the operational temperature which will
also be defined by the mirror material (in case of silicon: <22K)
• suspension will operate in Casimir regime (phonon mean free path is limited by geometry) thinner elements will have smaller thermal conductivity
• thinner elements will have their peak in TE loss at higher frequencies tradeoff between thermal noise and conductivity
#12/19GWADW2010 Kyoto/Japan
Nawrodt 05/2010
Multi-stage design -1-
#13/19GWADW2010 Kyoto/Japan
Thermal bath
„Universe“
TM
5 m, 300 Kj = 10-4
j = 10-3
1 m, 300 Kj = 10-6
[Majorana, Ogawa 1997, VIR-0015E-09]
10-2
10-1
100
101
102
10-20
10-18
10-16
10-14
10-12
10-10
frequency [Hz]
ther
mal
noi
se [m
/ H
z]
Nawrodt 05/2010
Multi-stage design -1-
#14/19GWADW2010 Kyoto/Japan
Thermal bath
„Universe“
TM
5 m 300 K, 20 Kj = 10-4
1 m300 K, 20 Kj = 10-6
[Majorana, Ogawa 1997, VIR-0015E-09]
10-2
10-1
100
101
102
10-20
10-18
10-16
10-14
10-12
10-10
frequency [Hz]
ther
mal
noi
se [m
/ H
z]
Nawrodt 05/2010
Multi-stage design -3-
#15/19GWADW2010 Kyoto/Japan
Thermal bath
„Universe“
TM
5 m j = 10-4
1 mj = 10-6
300 K
5 K
20 K
[Majorana, Ogawa 1997, VIR-0015E-09]
10-2
10-1
100
101
102
10-20
10-18
10-16
10-14
10-12
10-10
frequency [Hz]
ther
mal
noi
se [m
/ H
z]
300K, 5K, 20K20K, 20K, 20K
Nawrodt 05/2010
Towards a monolithic design using silicon -1-
• fabrication:
– fabrication of (poly-)crystalline fibres was shown [Pisa group, µ-PD technique]
– possible fabrication of ribbon-like structures (thin flexures for measuring coating thermal noise), limitted to wafer diameter (approx. substrate diameter, ~ dia. 500 mm)
– possible fabrication of long ribbons/fibres from thinner but long single crystal ingots (fabrication + surface quality currently unclear), length up to several meters possible
– use of ribbons might be justified by bonding method to be used for jointing the different parts (natural flat surface for ribbons)
#16/19GWADW2010 Kyoto/Japan
Nawrodt 05/2010
Towards a monolithic design using silicon -2-
• bonding + thermal conductivity:– silicate bonding possible with promising mechanical properties
[talk by S. Reid]– initial measurements of the thermal conductivity of the bond by
colleagues at Florence show a high thermal conductivity
#17/19GWADW2010 Kyoto/Japan
[M. Lorenzini, WP2,3 workshop Jena 03/2010]
Nawrodt 05/2010
Shaping the suspension elements
• Willems et al. 1999 -> TN in non-uniform fibres (neck region)• shaping allows a further decrease of thermal noise +
tayloring the different mode types (pendulum, suspension, bounce, etc.)
#18/19GWADW2010 Kyoto/Japan
[Cumming et al. CQG 26 2009]
Nawrodt 05/2010
Conclusion
• Summary– suspension design algorithm developed for AdvDetectors can be
applied to 3rd generation as well– new material properties (cryogenic regime) do not cause problems– multi-stage suspension weak coupling from upper to lower
stages close to resonance– application to possible ET design: see talk tomorrow
• open questions:
– monolithic suspension will be operated in non-thermal equilibrium impact on thermal noise?
– thermal conductivity through bonds needs detailed study– Investigation of direct bonding and lattice mismatch onto thermal
conductivity
#19/19GWADW2010 Kyoto/Japan