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| Sample | www.yole.fr | ©2018
From Technologies to Markets
Sample
Thin-Film Integrated
Passives Devices
Publication date: February 2018
Biographies & contacts
2| Sample | www.yole.fr | ©2018
Mattin GRAO TXAPARTEGI, Technology & Market Analyst, Power Electronics
Mattin Grao Txapartegi is a Power Electronics Analyst at Yole Développement. He is in charge of inverter architecture evolutions and passivecomponents (from capacitors to protection devices). Previously, he worked as an intern at the French car maker Renault, designing power convertersfor electric car chargers. He graduated from Grenoble INP with an Engineering degree in Electrical Systems, followed by a specialization in embeddedsystems for transportation. He then earned an advanced master’s degree in Aeronautics Engineering from Arts et Métiers ParisTech. During this time,he oversaw managerial, financial, and marketing fields within the aeronautics industry.
Contact: [email protected]
Amandine PIZZAGALLI, Market & Technology Analyst, Equipment and Materials Manufacturing
Amandine Pizzagalli oversees the equipment and materials fields for the Advanced Packaging and Manufacturing team at Yole Développement. She graduatedwith a degree in Electronics Engineering, specializing in semiconductors and nanoelectronic technologies. Before joining Yole, Amandine worked for AirLiquide with an emphasis on CVD and ALD processes for semiconductor applications.
Contact: [email protected]
Jérôme Azémar, Senior Market & Technology Analyst, Advanced Packaging
Jérôme Azémar is a senior member of the Advanced Packaging & Manufacturing team of Yole Développement. As a technology and market analyst since 2013, Jérôme
provided numerous market research and strategy analysis on Power Electronics, Advanced Packaging and Semiconductor Manufacturing and he performed several
presentations, keynotes and market briefings in semiconductors conferences. Upon graduating from INSA Toulouse with a Master’s in Microelectronics and Applied Physics,
he joined ASML and worked in Veldhoven for three years as an Application Support Engineer, specializing in immersion scanners. During this time, he acquired
photolithography skills which he then honed over a two-year stint as a Process Engineer at STMicroelectronics. Whilst with ST, he developed new processes, co-authored
an international publication and worked on metrology structures embedded on reticules, before joining Yole Développement in 2013.
Contact: [email protected]
Thin-Film Integrated Passives Devices
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COMPANIES CITED IN THE REPORT
3D Glass solutions, Amkor, ASE, AVX/ATC, Broadcom/Avago, CEA-LETI, Crocus Technology, Fraunhofer-IISB institute, Fraunhofer-IZM institute, Georgia Institute of Technology, IMEC, Infineon, Qualcomm/TDK Epcos, Ibiden, Johanson
Technology, Maxim Integrated, Murata/Ipdia, NXP, Onchip devices, ON Semiconductor, Qorvo, Shinko, STATS ChipPAC, STMicroelectronics, Skyworks, Texas Instrument, TSMC, Unimicron, Wavenics, Vishay, and more…
(non-exhaustive list)
Thin-Film Integrated Passives Devices
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REPORT OBJECTIVES
• This report - Yole’s third research update for the IPD market in the field of semiconductor applications - provides an understanding ofapplications, technology trends, and market forecasts, by market segment
• This report’s objectives are to:• Provide detailed information regarding IPD applicability
• Detailed analysis of the major applications using IPD today, and potential applications that could use IPD substrate
• IPD roadmap, by application
• Review the current status of IPD adoption on the market
• Deliver an overview of IPD manufacturing’s technological trends (substrate type, material type)
• Understand IPD key benefits and added value
• How does IPD differ from the other alternative technologies?
• Understand the remaining challenges for IPD implementation
• Offer market metrics at IPD market level for ESD/EMI, RF, and digital/mixed signal applications (2016 - 2022)
• Evaluate market developments in terms of market size (volume, value) and substrate sizes/formats
• Overall 2017 IPD market share -– breakdown by substrate type
• 2017 IPD market share by substrate type, for RF IPD, ESD/EMI IPD, and Digital mixed signal IPD
• Explore the competitive landscape and identify key IPD players in technology development and manufacturing
• Give an overview of who is doing what, and each market’s specificities
• Market share of the key 2017 IPD manufacturers: pure IPD manufacturers: OSATs, IDMs, and foundries and their market share
• Furnish an overview of the technologies available for IPD structuration, and their challenges
• Technology process, specification, supply chain, and value chain
• This report does not cover the following applications where IPD are applied or could be applied:• Thick-film IPD (based on LTCC ceramic substrate)
• IC IPDs
• RF CMOS
Thin-Film Integrated Passives Devices
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TABLE OF CONTENT
• Introduction, definitions & methodology 6
• Objectives of the report
• Who should be interested in this report?
• Companies cited in this report
• Definitions, limitations & methodology
• Glossary
• Executive summary 18
• IPD market segment 57
• IPD segmentation: RF IPD, ESD/EMI IPD, digital mixed signal IPD
• IPD attributes vs applications requirements
• IPD market segment
• IPD drivers
• IPD technologies manufacturing_____________________71
• IPD technology requirements & options
• Inductors (multilayer planar inductors, 3D inductors…)
• Capacitors (planar versus trench geometries, SiO2 versus SiN versus BST versus PZT capacitors…)
• IPD substrate type _103
• Substrate type for IPD manufacturing
• IPD market share – breakdown by substrate type
• IPD devices market forecast 114
• In $M, in wafer eq. with attached growth rates
• Volume shipments for each IPD by application (ESD/EMI, RF IPD,
Digital mixed signal)
• IPD shipments by substrate type (Silicon, Glass, GaAs, SOI…)
• IPD shipments by wafer size (6” / 8” / 12”)
• IPD players and manufacturers suppliers 126
• 2017 IPD player market shares and revenues
• Overall player market shares based on 2017 IPD revenues
• Supply chain 136
• Conclusions________________________________________142
• Appendix
• IPD definition
• IPD integration/packaging platforms
• IPD players (example of IPD products for each player)
Thin-Film Integrated Passives Devices
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REPORT METHODOLOGY
Technology analysis methodology Information collection
Thin-Film Integrated Passives Devices
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REPORT METHODOLOGY
Market forecast methodology
Thin-Film Integrated Passives Devices
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SCOPE OF THE REPORT
Thick film IPD
Rigid
organic
IPD platforms
IPD technologies
Scope of the Report
Thin film IPD
SOCSystem on Chip
technology
Advanced substrate technology (Fan-
Out WLP)
flex
Ceramic LTCC Plastic
laminate
Silicon Glass GaAs SOI Alumina RF CMOS
Traditional substrates
Organic
Thin-Film Integrated Passives Devices
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IPD - BENEFITS AND DRIVERS
IPD added value
Time to Market
Functionalities/
system integration
Performance
Thin-film
IPD driversMiniaturization
Cost-effective solution
• High reliability
• Stable electrical performance
• Better tolerance/precision
• Footprint reduction of the
electronic system
• Low profile and 3D integration
• Low weight
• High-density routing capabilitiesManufacturing cost reduction due to
minimizing passive device placement time
Making a system-in-package (SiP) with
IPD takes less time than making a new
system-on-chip (SoC)
Ascend the value chain by
seizing more system value
Flexibility
• Design flexibility (tunable values and
component characteristics)
• Flexible assembly and integration
Thin-Film Integrated Passives Devices
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ESD + EMI
ESD + MCF (multi component filtering)
ESD + TVS
EMI filtering alone
ESD alone
Thin film IPD applications
ESD/EMI protection Digital & mixed signal RF devices
IPD DEVICES APPLICATIONS
What are the final applications where IPDs are used?
Matching
Filtering
Baluns
Diplexers
Couplers
Pull-ups / Pull-downs
Decoupling,
tank and blocking
capacitors
Analog filtering
Capacitors, resistors, inductorsCapacitors, resistors, inductors +
diodes zenerThin-Film Integrated Passives Devices
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IPD TYPE - MARKET SEGMENT BY FUNCTION
IPD type - Segmentation by electronic function
• 3 key IPD categories of applications have been identified depending on their electronic functions they canprovide
RF IPD
(or hyper, microwave) passive devices
• Matching, filtering, RF decoupling, RF ESD protection
• Integration of R, L, C, baluns, diplexers, waveguides,…
ESD/EMI protection
(ESD/EMI IPD)
• ESD protection, transient voltage suppression (TVS), and signal conditioning
• Integration of Zener diodes, R, L, C
• Submounts with embedded Zener diodes for High Brightness LED’s
Digital and mixed-signal passive devices
(logic and mixed signal IPD)
• Pull-ups, pull-downs for circuit versioning, power decoupling, tank and blocking capacitors, analog filtering, DC/DC conversion…
• Combinations of R,L,C, resistor and capacitor networks, discrete Thin-Film devices, silicon capacitors
• Digital interposers (MCU,CPU, GPU, FPGA)
Thin-Film Integrated Passives Devices
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ImportantPrimary attribute: very important
IPD ATTRIBUTES VS APPLICATION REQUIREMENT
RF IPD(or hyper, microwave) passive devices
ESD/EMI IPD(ESD/EMI protection)
Digital & mixed signal
IPD
Miniaturization
Density integration
Tolerance/Accuracy
Functionalities/ System
integration
Cost effective
Time to market
Technology
Drivers
1 2 Less critical3 4 Not very important
1
3
1
2
3
1
4
4
2
3
1
3
Thin-Film Integrated Passives Devices
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IPD APPLICATIONS
Where are IPDs used?
Understand in what
applications IPDs
are used…
And where they
are emerging
Thin-Film Integrated Passives Devices
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IPD AT A GLANCE: APPLICATION MARKETS
Type of markets segment integrating IPD devices by integrated systems (end-products)
Digital and mixed signal IPD ESD/EMI IPDRF IPD
Consumer
Industrial / Scientific / Medical (ISM)
Network & server equipment
Buildings & homes utilities equipment
Automotive Automotive
Defense & aerospace
Thin-Film Integrated Passives Devices
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Mobile Phones
Notebook & tablets
High volumes
Network & server
equipment
WHERE DO WE FIND IPD DEVICES
Highest market volume integrating IPD devices
Consumer
market
segment is the
key domain
application for
IPD devices
Low volume
Gaming Devices / Stations
Industrial & home
networking
Military &
aerospace
Medical &
life ScienceTransportation
(automotive)
IPD devices
> 2B units
< 1M units
Thin-Film Integrated Passives Devices
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MORE SLIDES EXTRACTS
IPD technology overview
IPD technology
overview
Thin-Film Integrated Passives Devices
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THIN-FILM IPD DEVICES SUBSTRATE TYPE
Substrate type for IPD manufacturing
• There are numerous potential substrate type that could be used for IPD manufacturing
Six type of substrates canbe used for IPD manufacturing
IPD substrate type
Sapphire
SiliconHigh resistivity
Glass GaAs
Alumina wafer
SOI
Thin-Film Integrated Passives Devices
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MORE SLIDES EXTRACTS
Which substrates are used by which company?
Information about the substrate types used by each
IPD market
Thin-Film Integrated Passives Devices
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IPD MARKET FORECAST- BREAKDOWN BY IPD TECHNOLOGY
Breakdown per application
The overall IPD
market is
mostly driven
by the ESD/EMI
IPDs market
which stands
for more than
60% of the total
IPD market
ESD/EMI IPDs
RF IPDs
Mixed Signal IPD market
Silicon (Si)
Si Glass GaAs
AluminaSOI
Si
Thin-Film Integrated Passives Devices
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MORE SLIDES EXTRACTS
IPD markets: Market forecasts 2016-2022
IPD forecasts by market segments,
substrates and applications
As well as market shares
by market
Thin-Film Integrated Passives Devices
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2017 IPD VOLUME – BREAKDOWN BY SUBSTRATE TYPE
IPD volume split by substrate type
Siliconsubstrate isthe main IPD substratetechnologyin 2017, withmore than80% marketshare
Thin-Film Integrated Passives Devices
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MORE SLIDES EXTRACTS
Supply chain: Key IPD manufacturers' positioning, by IPD application area
Explanations of how Yole sees the different business models
related to IPDs
Reasons why some business models
works better than other
Thin-Film Integrated Passives Devices
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RELATED REPORTS
Discover more related reports within our bundles here.
Thin-Film Integrated Passives Devices
Today, miniaturization and integration are key drivers in electronic devices. This is even more critical in several consumer applications, where thinner devices mean higher integration levels, necessitating low-profile components.
The thin-film IPD process offers finer pitch feature, better tolerance control, higher flexibility, and packages possessing higher integration than other commonly available technologies, i.e. PCB and low temperature co-fired ceramic (LTCC) technologies. These aspects explain IPD’s expansion over the last years, and its promising continued growth.
Today, electrostatic discharge (ESD) and electromagnetic interference (EMI) protection are IPD’s primary applications, but RF front-end modules requiring IPD baluns, diplexers, matching, etc. are fast-increasing too. Currently, consumer applications (especially smartphones) are the big consumers of IPDs in RF front-end modules, or for ESD/EMI protection. Miniaturization, low cost, and high-value precision are the added-values IPDs bring to these applications. Planar structure capacitors, inductors, and resistors are built
using thin-film deposition technologies with high-performance results. A wide variety of dielectric and resistive materials are proposed by a large number of companies, depending on the desired performance of the IPD.
3D structure technologies have also been available for a couple of years now, especially for achieving excellent capacitance density values in silicon-trench capacitors. This new technology has opened new business opportunities for IPDs in other applicative markets, as was demonstrated with the iPhone 7 and its A10 processor, which integrates several silicon-trench capacitors under the microprocessor’s bumps. In the digital & mixed signal market, integration density and miniaturization are the priorities - therefore conventional planar technologies can’t be used since the capacitance densities are currently far from what’s required.
In this report, Yole Développement explains each application’s different requirements, and the IPD technologies being used to answer increasing demand.
THIN-FILM INTEGRATED PASSIVE DEVICESMarket & Technology report - January 2018
DRIVEN BY MINIATURIZATION, HIGHER PERFORMANCE, AND LOWER COST, IPD DEVICES OFFER GREAT OPPORTUNITIES IN THE SMARTPHONE MARKET
Driven by application diversification, IPDs (integrated passive devices) continue their promising growth.
KEY FEATURES OF THE REPORT Get the sample of the report on www.i-Micronews.com• Overview of the IPD device
market, segmented by IPD type and application
• Update of our 2016 - 2022 IPD market forecast, segmented by application: RF IPD, ESD/EMI IPD, and digital mixed signal IPD
• Overview of the substrate type used for thin-film IPD, segmented by IPD application
• Update of key 2017 IPD manufacturers’ market share, by IPD type
• Overall IPD market share - breakdown by substrate type
• Analysis of 2017 IPD market share, by substrate type for each IPD application: RF IPD, ESD/EMI IPD, and digital mixed signal IPD
• Update of our 2016 - 2022 IPD market forecast, by substrate type and wafer size
• Key technical insights into IPD technology trends and challenges
• Overview and status of the IPD technologies applied today for each key application
• In-depth analysis of the different market segments using RF IPD, ESD/EMI IPD, and digital mixed signal IPD
• Comprehensive overview of the competitive landscape and market share for all main laser equipment manufacturers involved in the semiconductor industry
• Important technical insights and a detailed analysis of IPD solutions/trends/requirements/challenges, by application
• IPD roadmap for new technology adoption
ESD + EMI
ESD + MCF
ESD + TVS
EMI filtering alone
ESD alone
Thin film IPD applications
ESD/EMI protection
Digital & mixed signal RF devices
Matching
Filtering
Baluns
Diplexers
Couplers
Pull-ups / Pull-downs
Decoupling, tank and blocking capacitors
Analog filtering
Capacitors, resistors, inductors Capacitors, resistors, inductors + diodes zener
ESD: Electrostatic Discharge EMI: Electromagnetic Interference TVS: Transient Voltage Suppresor MCF: Multi Component Filtering
(Yole Développement, January 2018)
Thin film IPD application overview
THIN-FILM INTEGRATED PASSIVE DEVICES
DIFFERENT BUSINESS MODELS AND DIFFERENT EXPECTATIONS FOR A COMPLEX SUPPLY CHAIN
As mentioned earlier, IPDs have a variety of applications and high potential in numerous areas. This, combined with large range of solutions, creates a diversified supply chain - depending on the end-application targeted. This diversity is actually even more complex considering the different types of manufacturers and their business models: pure players, OSATs, IDMs, foundries, etc. Many producer types can be involved in IPDs but with different resources and objectives.
IDMs/foundries use IPDs as options to complete their offers and make them more appealing for customers.
The focus is not to make a pure business of IPD, but to use it as an added-value for their products. The most illustrative example is TSMC promoting its decoupling capacitors to save more space and increase efficiency in Apple’s processors – a solution that has opened the door for IPD in large volumes for advanced applications.
OSATs have a similar approach in terms of priority and promotion, but with different integration capabilities. Most OSATs have IPD offers in their portfolio and implement them upon customer request. Their solutions are either more standardized IPDs, or supplied from pure players to integrate them in packages afterwards.
Pure players like IPDiA (now part of Murata) are, by definition, pushing for the spread of IPD solutions. These solutions must convince customers that they are vital for implementing passives in their integration. In order for this to happen, IPDs must be seen either as an easily-outsourceable commodity or as a differentiator justifying new supplies. In both cases strong development is required, which pure players are pushing for.
This report analyzes the different business models, rationales for IPD manufacturing, and expectations for this market according to various offers.
In 2017 the overall IPD market generated a revenue exceeding $750M, and is expected to peak at more than $1B by 2022. As of 2017, this market is driven mostly by the ESD/EMI IPDs market, which represents more than 60% of the total IPD market, followed by RF IPD. Mixed signal IPD did not represent a significant volume and is still an emerging IPD market.
Although it is difficult to predict the success of digital mixed signal IPD, we see a small penetration rate (driven mainly by decoupling applications) in smartphone processors, where miniaturization is a key driver. Moreover, a few medical applications also
require decoupling capacitors in IPD format, where again miniaturization and high capacitance density are essential.
In terms of substrate material, although silicon remains the only mainstream solution for ESD/EMI IPD and digital mixed signal (presently 100% in these IPD commercial devices), there are a wide variety of substrates available for RF IPD manufacturing. Indeed, advanced requirements such as substrate loss are considered for RF applications. Also, due to the limitation in terms of insertion loss as well as dielectric loss for silicon, various alternative substrates such as glass and GaAs are being integrated into some RF IPD products manufactured by STMicroelectronics, Murata, Qorvo, and others.
Glass is an appealing choice for high-frequency applications requiring low dielectric loss and low insertion loss. Meanwhile, GaAs is especially advantageous for its smaller size and higher performance in terms of linearity and noise characteristics, especially at high frequencies. Consequently, we expect these substrates to take market share in the RF IPD market.
This report offers a comprehensive overview of the substrates used in each IPD manufacturing process, a detailed analysis of technology trends, and a market forecast by IPD application type. Moreover, an IPD market forecast split by wafer size and substrate type has been calculated for the 2016 - 2022 timeframe.
IPD forecasts : breakdown by technology type - 2017
(Yole Développement, January 2018)
Si
Si Glass GaAs
Alumina SOI
Si
Total IPD revenue > $750M
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
2016 2017 2018 2019 2020 2021 2022
in t
erm
s of
rev
enue
Mixed Signal IPD market RF IPDs ESD/EMI IPDs
IPD passives devices supply chain
(Yole Développement, January 2018)
ESD/EMI protection RF IPD Digital & Mixed signal
Pure IPD manufacturers
IDMs & foundries
Substrate & packaging
OSATs
R&D institutes
DESPITE SILICON’S DOMINATION IN THE IPD MARKET, ALTERNATIVE SUBSTRATES ARE DISRUPTING THE RF IPD MARKET
Find more details about
this report here:
MARKET & TECHNOLOGY REPORT
COMPANIES CITED IN THE REPORT (non exhaustive list)3D Glass Solutions, Amkor, ASE, AVX/ATC, Broadcom/Avago, CEA-LETI, Crocus Technology, Fraunhofer-IISB Institute, Fraunhofer-IZM Institute, Georgia Institute of Technology, IMEC, Infineon, Qualcomm/TDK Epcos, Ibiden, Johanson Technology, Maxim Integrated, Murata/Ipdia, NXP, Onchip Devices, ON Semiconductor, Qorvo, Shinko, STATSChipPAC, STMicroelectronics, Skyworks, Texas Instruments, TSMC, Unimicron, Wavenics, Vishay, and more...
AUTHORSAs an Senior Technology and Market analyst, Jérôme Azémar is member of the Advanced Packaging & Manufacturing team of Yole Développement (Yole). Jérôme is daily managing the production of technology & market reports as well as custom consulting projects. He also takes part in the business development of these activities. Upon graduating from INSA Toulouse (France) with a master’s in Microelectronics & Applied Physics, he joined ASML in the Netherlands and worked as Application Support Engineer for three years. Then he honed over a two-year stint as a Process Engineer at STMicroelectronics (France).
Introduction, definitions & methodology 6
> Report objectives > Who should be interested in this report?> Companies cited in this report> Definitions, limitations & methodology> Glossary
Executive summary 18
IPD market segment 57
> IPD segmentation: RF IPD, ESD/EMI IPD, digital mixed signal IPD
> IPD attributes vs. application requirements> IPD market segment> IPD drivers
IPD technologies manufacturing 71
> IPD technology requirements and options> Inductors (multilayer planar inductors, 3D inductors, etc.)> Capacitors (i.e. planar vs. trench geometries, SiO2 vs.
SiN vs. BST vs. PZT capacitors)
IPD substrate type 103
> Substrate type for IPD manufacturing> IPD market share - breakdown by substrate type
IPD devices - market forecast 114
> In $M and wafer eq., with attached growth rates > Volume shipments for each IPD, by application (ESD/
EMI, RF IPD, digital mixed signal)> IPD shipments, by substrate type (silicon, glass, GaAs, SOI) > IPD shipments, by wafer size (6” / 8” / 12”)
IPD players and manufacturers’ suppliers 126
> 2017 IPD player market share and revenue> Overall player market share based on 2017 IPD revenues
Supply chain 136Conclusions 142Appendix
> IPD definition> IPD integration/packaging platforms > IPD players (example of IPD products for each player)
Yole Développement presentation
TABLE OF CONTENTS (complete content on i-Micronews.com)
Mattin Grao Txapartegi is a Technology & Market Analyst, Power Electronics at Yole Développement (Yole). He is engaged in many custom studies and reports dedicated to the evolution of inverters architecture and passive components. And today, he investigates power packaging to understand the latest technical challenges and market evolution. Previously he acquired a comprehensive expertise in the design of power converters for EV at Renault. As an engineer, Mattin is graduated from Grenoble INP (FR) with specialization in embedded systems for transportation.
• TSMC Deep Trench Capacitor Land-Side Decoupling Capacitor in Apple’s A10 Application Processor
• Silicon Capacitor Technology and Cost Review• 5G’s Impact on the RF Front-End Industry• Glass Substrate Manufacturing in the
Semiconductor Field
Find all our reports on www.i-micronews.com
RELATED REPORTS
OBJECTIVES OF THE REPORT• Provide detailed information regarding IPD devices’ applicability • Detailed analysis of the major applications using IPD today, and potential applications that could require
an IPD substrate • Offer an IPD device application roadmap • Discuss the current status of IPD adoption in the market• Present an overview of IPD manufacturing’s technological trends (substrate type, material type) • Understand IPD devices’ key benefits and added-value • Review the remaining challenges for IPD device implementation • Provide market metrics at IPD market level for ESD/EMI, RF, and digital/mixed signal applications (2016 - 2022)• Evaluate market developments in terms of market size (volume, value) and substrate sizes/formats• Reveal a competitive landscape and identify key IPD players in technology development and manufacturing• Analyze technology process, specification, supply chain, and value chain
Amandine Pizzagalli is a Technology & Market Analyst at Yole Développement (Yole). Amandine is part of the development of the Advanced Packaging & Semiconductor Manufacturing Business Unit with the production of reports and custom consulting projects. She is in charge of comprehensive analyses focused on equipment, materials and manufacturing processes. Amandine is graduated in Electronics from CPE Lyon (France), with a technical expertise in Semiconductor & Nano-Electronics and has a master focused on Semiconductor Manufacturing Technology, from KTH Royal Institute of Technology (Sweden).
WHAT’S NEW• Status of the IPD industry, and evolution since 2012• Update of our 2016 - 2022 IPD market forecast for RF IPD, ESD/EMI, and digital mixed signal IPD • Update and market share for key 2017 IPD manufacturers: pure IPD manufacturers, OSATs,
IDMs, and foundries• New analysis based on the competitive landscape and market share of IPD manufacturers, by
IPD applications covered in this report (RF, ESD/EMI, digital mixed signal)• Overall IPD market share - breakdown by substrate type• New analysis of 2017 IPD market share by substrate type, for RF IPD, ESD/EMI IPD, and digital
mixed signal IPD• Key technical insights and detailed analysis of IPD solutions, trends, requirements, and
challenges - by application
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Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media and corporate finance services, reverse engineering and reverse costing services and well as IP and patent analysis. With a strong focus on emerging applications using silicon and/or micro manufacturing, the Yole group of companies has expanded to include more than 80 collaborators worldwide covering MEMS and image sensors, Compound Semiconductors, RF Electronics, Solid-state lighting, Displays, software, Optoelectronics, Microfluidics & Medical, Advanced Packaging, Manufacturing, Nanomaterials, Power Electronics and Batteries & Energy Management.The “More than Moore” market research, technology and strategy consulting company Yole Développement, along with its partners System Plus Consulting, PISEO and KnowMade, support industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to grow their business.
CONSULTING AND ANALYSIS• Market data & research, marketing analysis• Technology analysis• Strategy consulting• Reverse engineering & costing• Patent analysis• Design and characterization of innovative optical systems• Financial services (due diligence, M&A with our partner)More information on www.yole.fr
MEDIA & EVENTS• i-Micronews.com website & related @Micronews e-newsletter• Communication & webcast services• Events: TechDays, forums…More information on www.i-Micronews.com
REPORTS• Market & technology reports• Patent investigation and patent infringement risk analysis• Teardowns & reverse costing analysis• Cost simulation toolMore information on www.i-micronews.com/reports
CONTACTSFor more information about :• Consulting & Financial Services: Jean-Christophe Eloy ([email protected])• Reports: David Jourdan ([email protected]) Yole Group of Companies• Press Relations & Corporate Communication: Sandrine Leroy ([email protected])
© 2018
Yole Développement
FromTechnologies to Market
Source: Wikimedia Commons
2©2018 | www.yole.fr | About Yole Développement
FIELDS OF EXPERTISE COVERED BY OUR 35+ ANALYSTS
MEMS & Sensors
Solid State Lighting(LED, OLED, …)
Compound Semi.
Imaging
Photonics
MedTech
Manufacturing
Advanced
Packaging
Batteries / Energy Management
Power Electronics
Displays
RF
Devices &
Techno.
Advanced
Substrates
Software
3©2018 | www.yole.fr | About Yole Développement
3 BUSINESS MODELS
o Consulting and Analysis
• Market data & research,
marketing analysis
• Technology analysis
• Strategy consulting
• Reverse engineering & costing
• Patent analysis
• Design and characterization of
innovative optical systems
• Financial services (due diligence,
M&A with our partner)
www.yole.fr
o Reports
• Market & technology reports
• Patent investigation and patent
infringement risk analysis
• Teardowns & reverse costing
analysis
• Cost simulation tool
www.i-Micronews.com/reports
o Media
• i-Micronews.com website
• @Micronews e-newsletter
• Communication & webcast
services
• Events: TechDays, forums,…
www.i-Micronews.com
4©2018 | www.yole.fr | About Yole Développement
6 COMPANIES TO SERVE YOUR BUSINESS
Due diligence
www.yole.fr
Manufacturing costs analysis
Teardown and reverse engineering
Cost simulation tools
www.systemplus.fr
Market, technology and strategy
consulting
www.yole.fr
IP analysis
Patent assessment
www.knowmade.fr
Innovation and business maker
www.bmorpho.com
Design and characterization of
innovative optical systems
www.piseo.fr
Yole Group of Companies
5©2018 | www.yole.fr | About Yole Développement
OUR GLOBAL ACTIVITY
30%of our business
40%of our business 30%
of our business
Greater
China office
Yole Japan
HQ in Lyon
Nantes
Paris
Nice
Vénissieux
Europe office
Frankfurt
Hsinchu
Tokyo
Yole Inc.
Phoenix
Yole Korea
Seoul
Palo Alto
6©2018 | www.yole.fr | About Yole Développement
ANALYSIS SERVICES - CONTENT COMPARISON
Technology
and Market
Report
Leadership
Meeting
Q&A
Service
Depth of the analysis
Bre
adth
of th
e a
nal
ysis
Meet the
Analyst
Custom
Analysis
High
High
Low
7©2018 | www.yole.fr | About Yole Développement
SERVING THE ENTIRE SUPPLY CHAIN
Our analysts provide market analysis,
technology evaluation,
and business plans along the entire
supply chain
Integrators and
end-users
Device manufacturers
Suppliers: material, equipment,
OSAT, foundries…
Financial investors, R&D centers
8©2018 | www.yole.fr | About Yole Développement
SERVING MULTIPLE INDUSTRIAL FIELDS
We workacross
multiples industries to understand
the impact of More-than-
Moore technologies from deviceto system
From A to Z…
Transportation
makers
Mobile phone
and
consumer
electronics
Automotive
Medical
systems
Industrial
and defense
Energy
management
9©2018 | www.yole.fr | About Yole Développement
o Yole Développement, System Plus Consulting, KnowMade and PISEO, all part of Yole Group of Companies, keep on increasing their collaboration to offer, in 2018, a
collection of 150+ reports. Combining respective expertise and methodologies from the 4 companies, the reports aim to provide market & technology analysis, patent
investigation and patent infringement risk analysis, teardowns & reverse costing analysis.They cover:
o You are looking for:
• An analysis of your product market
• A review of your competitors evolution
• An understanding of your manufacturing and production costs
• An understanding of your industry technology roadmap and related IPs
• A clear view on the evolution of the supply chain…
Our reports are for you!
The combined team of 60+ experts (PhDs, MBAs, industry veterans…) from Yole Développement, System Plus Consulting, KnowMade and PISEO, collect information,identify the trends, the challenges, the emerging markets, the competitive environments and turn it into results to give you a complete picture of your industrylandscape.
In the past 20 years, we worked on more than 1 700 projects, interacting with technology professionals and high level opinion makers from the main players of theindustry.
o In 2018, Yole Group of Companies plan to publish +150 reports. Gain full benefit from our Annual Subscription offers and receive at least a 36% discount.
REPORTS COLLECTION
www.i-Micronews.com
• MEMS & Sensors
• RF devices & technologies
• Imaging
• Medical technologies (MedTech)
• Photonics
• Advanced packaging
• Manufacturing
• Advanced substrates
• Power electronics
• Batteries and energy management
• Compound semiconductors
• Solid state lighting
• Displays
• Software
10©2018 | www.yole.fr | About Yole Développement
OUR 2018 REPORTS COLLECTION (1/3)
MEMS & SENSORS
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of the MEMS Industry 2018 - Update
− Silicon Photonics 2018 - Update
− Consumer Biometrics: Sensors & Software 2018 - Update
− MEMS Pressure Sensors 2018
− Air Quality Sensors 2018
− Sensors for AR/VR 2018
o REVERSE ENGINEERING & COSTING REVIEW – by System Plus Consulting
− Gas & Particles Sensors
− MEMS Pressure Sensors
− Piezo MEMS 2018 *
o PATENT ANALYSES – by KnowMade
− MEMS Microphone – Patent Landscape Analysis
RF DEVICES AND TECHNOLOGIES
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− RF Front End Module and Connectivity for Cellphones 2018 – Update
− 5G Impact on RF Industry: From Wireless Infrastructure to Cellphone Terminals
2018 - Update
− RF GaN 2018 – Update
− Advanced RF System-in-Package for Cellphones 2018 – Update *
− Radar Technologies for Emerging Applications 2018 *
− Radar Technologies for Automotive 2018
− RF & Photonic Technologies for 5G Infrastructure 2018
o REVERSE ENGINEERING & COSTING REVIEW – by System Plus Consulting
− RF Front-End Modules in Smartphones
− RF GaN *
o PATENT ANALYSES – by KnowMade
− RF Front End Module – Patent Landscape Analysis
− RF GaN – Patent Landscape Analysis
IMAGING & OPTOELECTRONICS
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of the CMOS Image Sensor Industry 2018 – Update
− Status of the Compact Camera Module Industry 2018 - Update
− 3D Imaging and Sensing 2018 - Update
− Imaging for Industry and Automation 2018
− Sensors for Robotic Vehicles 2018
− Imagers and Detectors for Security and Smart Buildings 2018
− LiDARs 2018
o QUARTERLY UPDATE – by Yole Développement
− CMOS Image Sensors 2018 *
o REVERSE ENGINEERING & COSTING REVIEW – by System Plus Consulting
− CMOS Image Sensors
− Compact Camera Modules
o PATENT ANALYSES – by KnowMade
− LiDAR – Patent Landscape Analysis
− Time-of-Flight IR Sensor in the Apple iPhone 7 Plus - Patent-to-Product Mapping
SOFTWARE
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Consumer Biometrics: Sensors & Software 2018 - Update
− Processing Hardware and Software for AI: Integration Challenges 2018
Update : 2017 version still available / *To be confirmed
11©2018 | www.yole.fr | About Yole Développement
OUR 2018 REPORTS COLLECTION (2/3)ADVANCED PACKAGING
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of Advanced Packaging Industry 2018 - Update
− Status of Advanced Substrates 2018: Embedded Die and Interconnects, Substrates
Like PCB Trends
− Fan-Out Packaging 2018 – Update
− 3D TSV and Monolithic Business Update 2018 – Update
− Advanced RF System-in-Package for Cellphones 2018 – Update *
− Power Packaging Modules 2018 - Update
− Discrete Power Packaging 2018 – Update
− MEMS Packaging and Testing 2018 – Update
− Memory Packaging Market and Technology Report 2018 – Update
− Status of Panel Level Packaging 2018
− Trends in Automotive for Advanced Packaging 2018
− Processing Hardware and Software for AI: Integration Challenges 2018
− Integrated Passive Devices (IPD) 2018
o REVERSE ENGINEERING & COSTING REVIEW – by System Plus Consulting
− RF Front-End SiP
− Fan-Out Packaging *
o PATENT ANALYSES – by KnowMade
− Hybrid Bonding for 3D Stack – Patent Landscape Analysis
MANUFACTURING
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Manufacturing Wafer Starts for More than Moore 2018
− Equipment for More than Moore: Technology & Market Trends for Lithography &
Bonding/Debonding 2018
− Equipment for More than Moore: Technology & Market Trends for Thin Film
Deposition & Etching 2018
o REVERSE ENGINEERING & COSTING REVIEW – by System Plus Consulting
− Wafer Bonding Technology Overview 2018
MEMORY
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Emerging Non Volatile Memory 2018 – Update
− Memory Packaging Market and Technology Report 2018 – Update
o QUARTERLY UPDATE – by Yole Développement
− Memory Market 2018 (NAND & DRAM)
o MONTHLY UPDATE – by Yole Développement
− Memory Pricing 2018 (NAND & DRAM)
o REVERSE ENGINEERING & COSTING REVIEW – by System Plus Consulting
− DRAM Technology & Cost Review 2018
− NAND Memory Technology & Cost Review 2018
COMPOUND SEMICONDUCTORS
MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of Compound Semiconductor Industry 2018 *
− Power SiC 2018: Materials, Devices, and Applications - Update
− Power GaN 2018: Materials, Devices, and Applications – Update
− RF GaN 2018 – Update
− GaAs Materials, Devices and Applications 2018
− InP Materials, Devices and Applications 2018
o REVERSE ENGINEERING & COSTING REVIEW – by System Plus Consulting
− Power SiC Devices
− Power GaN Devices
o PATENT ANALYSES – by KnowMade
− Power SiC – Patent Landscape Analysis
− Status of the GaN IP – Patent Landscape Analysis
Update : 2017 version still available / *To be confirmed
12©2018 | www.yole.fr | About Yole Développement
OUR 2018 REPORTS COLLECTION (3/3)
POWER ELECTRONICS
MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of Power Electronics Industry 2018 - Update
− Power Packaging Modules 2018 - Update
− Discrete Power Packaging 2018 - Update
− EV/HEV Market Expectations and Technology Trends - Update
− Wireless Charging Market Expectations and Technology Trends 2018
− Integrated Passive Devices (IPD) 2018
o QUARTERLY UPDATE – by Yole Développement
− Power ICs Market 2018 – Update
o REVERSE ENGINEERING & COSTING REVIEW – by System Plus Consulting
− Power ICs Market 2018 *
− Power Modules *
BATTERY AND ENERGY MANAGEMENT
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of Battery Industry Update with Focus on Manufacturing 2018 *
− Battery Pack Technology and Business Opportunities 2018 - Update
o PATENT ANALYSES – by KnowMade
− Solid-State Batteries – Patent Landscape Analysis
SOLID STATE LIGHTING
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− IR LEDs and Lasers 2018 - Update
− Automotive Lighting 2018 – Update
− UV LEDs 2018 - Update
− VCSELs 2018
− Lasers 2018
− Light Shaping Technologies 2018
− LiFi 2018
o REVERSE ENGINEERING & COSTING REVIEW – by System Plus Consulting
− VCSELs 2018
− UV LEDs 2018 *
DISPLAYS
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− MicroLED Displays 2018 – Update
− Quantum Dots and Wide Color Gamut Display Technologies 2018 - Update
− Organic Thin Film Transistor 2018: Flexible Displays and Other Applications -
Update *
− Displays for AR / VR / MR 2018
− Non Display Applications of MicroLEDs 2018 *
o PATENT ANALYSES – by KnowMade
− MicroLED Display – Patent Landscape Analysis
MEDTECH
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of the BioMEMS Industry 2018 - Update
− Point-of-Need Testing: Application of Microfluidic Technologies 2018 - Update
− Neuro-Technologies for Healthcare and Consumer Applications 2018
− CRISPR Technology: From Lab to Industries 2018
− Portable Medical Imaging 2018
− Inkjet for Additive Manufacturing in the Micro-Electronics Industry 2018
− Liquid Biopsy 2018: From Isolation to Downstream Applications
− Chinese Microfluidics Industry 2018
o PATENT ANALYSES – by KnowMade
− Microfluidic IC Cooling – Patent Landscape Analysis
− Circulating Tumor Cell Isolation – Patent Landscape Analysis
− Organ-on-a-Chip – Patent Landscape Analysis
Update : 2017 version still available / *To be confirmed
13©2018 | www.yole.fr | About Yole Développement
OUR 2017 PUBLISHED REPORTS (1/3)MEMS & SENSORS
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of the MEMS Industry 2017
− High End Inertial Systems Market and Technology 2017
− Magnetic Sensors Market and Technologies 2017
− MEMS and Sensors for Automotive - Market and Technology Trends 2017
− Acoustic MEMS and Audio Solutions 2017
− Sensors and Sensing Modules for Smart Homes and Buildings 2017
− Fingerprint Sensor Applications and Technologies – Consumer Market Focus 2017
o REVERSE COSTING REPORT – by System Plus Consulting
− Continental SRL1: State-of-the-art LiDAR for Advanced Driver Assistance Systems –
Reverse Costing Report
− Bosch Mobility Ultrasonic Sensor – Reverse Costing Report
− MEMS Packaging 2017 - Reverse Costing Review
− Bosch BMP380 Pressure Sensor – Reverse Costing Report
IMAGING & PHOTONICS
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of the CMOS Image Sensor Industry 2017
− 3D Imaging and Sensing 2017
− Uncooled Infrared Imaging Technology & Market Trends 2017
− Camera Module Industry Market and Technology Trends 2017
o REVERSE COSTING REPORT – by System Plus Consulting
− FLIR Boson – a small, innovative, low power, smart thermal camera core – Reverse
Costing Report
− Camera Module Physical Analyses Overview 2017
RF DEVICES AND TECHNOLOGIES
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− RF Front End Modules and Components for Cellphones 2017
− Advanced RF System-in-Package for Cell Phones 2017
− 5G Impact on RF Front-End Industry 2017
ADVANCED PACKAGING
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of the Advanced Packaging Industry 2017
− Embedded Die Packaging: Technology and Market Trends 2017
− Fan-Out: Technologies and Market trends 2017
− Advanced Substrates Overview: From IC Package to Board 2017
− 3D TSV and 2.5D Business Update - Market and Technology Trends 2017
− Advanced RF System-in-Package for Cellphones 2017
− Memory Packaging Market and Technology Report 2017
− MEMS Packaging 2017
− Emerging Non-Volatile Memory 2017
o REVERSE COSTING REPORT – by System Plus Consulting
− NVIDIA Tesla P100 - Reverse Costing Report
− MEMS Packaging - Reverse Technology Review
− Advanced RF SiP for Cellphones 2017 - Reverse Costing Review
SOFTWARE
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Embedded Software in Vision Systems
MEDTECH
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of the Microfluidics Industry 2017
− Solid-State Medical Imaging 2017
− Organs-On-Chips 2017
− Connected Medical Devices Market and Business Models 2017
− Artificial Organ Technology and Market analysis 2017
− Medical Robotics Technology & Market Analysis 2017
14©2018 | www.yole.fr | About Yole Développement
OUR 2017 PUBLISHED REPORTS (2/3)
MANUFACTURING
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Laser Technologies for Semiconductor Manufacturing 2017
− Equipment and Materials for 3D TSV Applications 2017
− Equipment and Materials for Fan-Out Packaging 2017
− Glass Substrate Manufacturing in the Semiconductor Field 2017
BATTERIES & ENERGY MANAGEMENT
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of the Rechargeable Li-ion Battery Industry
− Market Opportunities for Thermal Management Components in Smartphones
DISPLAYS
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− MicroLED Displays
− Quantum Dots and Wide Color Gamut Display Technologies
− Phosphors & Quantum Dots 2017 - LED Downconverters for Lighting & Displays
SOLID STATE LIGHTING
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− LED Packaging 2017: Market, Technology and Industry Landscape
− CSP LED Lighting Modules
− IR LEDS and VCSELs - Technology, Applications and Industry Trends
− LED Lighting Module Technology, Industry and Market Trends 2017
− Automotive Lighting: Technology, Industry and Market Trends 2017
− Horticultural LED Lighting: Market, Industry, and Technology Trends
POWER ELECTRONICS
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of the Power Electronics Industry 2017
− Thermal Management Technology and Market Perspectives in Power Electronics and
LEDs 2017
− Gate Driver Market and Technology Trends 2017
− Power MOSFET 2017: Market and Technology Trends
− Power Module Packaging: Material Market and Technology Trends 2017
− IGBT Market and Technology Trends 2017
o QUARTERLY UPDATE – by Yole Développement
− Power Management ICs Market 2017
o REVERSE COSTING REPORT – by System Plus Consulting
− EPC2045 100V GaN-on-Silicon Transistor – Reverse Costing Report
− Silicon Capacitor - Technology and Cost Review
− Industrial 100V MOSFET - Technology and Cost Review
− InvenSense ICM-20789: High Performance 6-Axis Motion Sensor and Pressure Sensor
Combo – Reverse Costing Report
COMPOUND SEMICONDUCTORS
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Bulk GaN Substrate Market 2017
− RF Power Market and Technologies 2017: GaN, GaAs and LDMOS
− Power SiC 2017: Materials, Devices, Modules, and Applications
− Power GaN 2017: Epitaxy, Devices, Applications, and Technology Trends
15©2018 | www.yole.fr | About Yole Développement
OUR 2017 PUBLISHED REPORTS LIST (3/3)
OUR PARTNERS’ REPORTS
PATENT ANALYSES – by KnowMade
− Wireless Charging Patent Landscape Analysis
− RF Acoustic Wave Filters Patent Landscape Analysis
− NMC Lithium-Ion Batteries Patent Landscape Analysis
− Pumps for Microfluidic Devices Patent Landscape
− III-N Patent Watch
− FLUIDIGM Patent Portfolio Analysis
− Knowles MEMS Microphones in Apple iPhone 7 Plus Patent-to-Product Mapping 2017
− Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping
− Patent Licensing Companies in the Semiconductor Market - Patent Litigation Risk and Potential Targets
− Microfluidic Technologies for Diagnostic Applications Patent Landscape
TEARDOWN & REVERSE COSTING – by System Plus Consulting
More than 60 teardowns and reverse costing analysis and cost simulation tools published in 2017
MORE INFORMATION
o All the published reports from theYole Group of Companies are available on our website www.i-Micronews.com.
o Ask for our Annual Subscription offers: With our bundle offer, you choose the number of reports you are interested in and select the related offer. You then have up
to 12 months to select the required reports from the Yole Développement, System Plus Consulting and KnowMade offering. Pay once and receive the reports
automatically (multi-user format). Contact your sales team according to your location (see the last slide).
16©2018 | www.yole.fr | About Yole Développement
MICRONEWS MEDIA
o About Micronews Media
To meet the growing demand for market,
technological and business information,
Micronews Media integrates several tools able
to reach each individual contact within its
network.We will ensure you benefit from this.
ONLINE ONSITE INPERSON
@Micronews e-newsletter
i-Micronews.com
i-Micronewsjp.com
FreeFullPDF.com
Events Webcasts
Unique, cost-effective ways
to reach global audiences.
Online display advertising
campaigns are great strategies
for improving your
product/brand visibility. They
are also an efficient way to
adapt with the demands of the
times and to evolve an effective
marketing plan and strategy.
Brand visibility, networking
opportunities
Today's technology makes it
easy for us to communicate
regularly, quickly, and
inexpensively – but when
understanding each other is
critical, there is no substitute
for meeting in-person. Events
are the best way to exchange
ideas with your customers,
partners, prospects while
increasing your brand/product
visibility.
Targeted audience
involvement equals clear,
concise perception of your
company’s message.
Webcasts are a smart,
innovative way of
communicating to a wider
targeted audience. Webcasts
create very useful, dynamic
reference material for
attendees and also for
absentees, thanks to the
recording technology.
Benefit from the i-Micronews.com
traffic generated by the 11,200+
monthly unique visitors, the
10,500+ weekly readers of
@Micronew se-newsletter
Several key events planned for
2018 on different topics to
attract 120 attendees on average
Gain new leads for your business
from an average of 340
registrants per webcast
Contact: Camille Veyrier ([email protected]), Marketing & Communication Project Manager
17©2018 | www.yole.fr | About Yole Développement
CONTACT INFORMATION
o CONSULTING AND SPECIFIC ANALYSIS
• North America: Steve LaFerriere, Director of Northern America Business DevelopmentEmail: [email protected] – +1 31 06 008 267
• Japan & Rest of Asia: Takashi Onozawa, General Manager, Asia Business DevelopmentEmail: [email protected] - +81 3 4405 9204
• Greater China: Mavis Wang, Director of Greater China Business DevelopmentEmail: [email protected] - +886 979 336 809
• RoW: Jean-Christophe Eloy, CEO & President, Yole DéveloppementEmail [email protected] - +33 4 72 83 01 80
o REPORT BUSINESS
• North America: Steve LaFerriere, Director of Northern America Business DevelopmentEmail: [email protected] – +1 31 06 008 267
• Europe: Lizzie Levenez, EMEA Business Development ManagerEmail: [email protected] - +49 15 123 544 182
• Rest of Asia: Takashi Onozawa, General Manager, Asia Business DevelopmentEmail: [email protected] - +81 3 4405 9204
• Japan:
• Miho Othake, Account ManagerEmail: [email protected] - +81 3 4405 9204
• Itsuyo Oshiba, Account ManagerEmail: [email protected] - +81-80-3577-3042
• Greater China: Mavis Wang, Director of Greater China Business DevelopmentEmail: [email protected] - +886 979 336 809
o FINANCIAL SERVICES (in partnership with Woodside Capital Partners)
• Jean-Christophe Eloy, CEO & PresidentEmail: [email protected] - +33 4 72 83 01 80
o GENERAL
• Public Relations: [email protected] - +33 4 72 83 01 89
• Email: [email protected] - +33 4 72 83 01 80
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