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iNEMI HFR-Free
Programs
Bob Pfahl – iNEMI
Stephen Tisdale - Intel
April 14, 2011
Current (Active) Programs
1
HFR-free High Reliability PCB Project
HFR-free Leadership Project
• PCB Materials WG
• Signal Integrity WG
Other Environmental Projects
PVC Alternatives Project
ECO Impact Evaluator for ICT Equipment
2
Status - Low-Halogen Electronics
Various Industry Standards / Guidelines are in place
Supply Chain Alignment / Definition Critical
Driver
Global Environmental Responsibility
Non-Governmental Organization (NGO) pressure to address environmental issues
Materials Involved
All Halogenated Flame Retardants
Brominated Flame Retardants (TBBPA is main FR in substrate & PCB Materials)
All Chlorinated Flame Retardants and PVC
Standards
(PCB Material Only)
IEC 61249-2-21
JPCA-ES-01-1999
IPC - 4101B
Guidelines
(Solid State Devices Only)
JEDEC JEP-709
(Expanding Scope to Include Passives / Connectors)
2
3
iNEMI’s HFR-Free Position
iNEMI supports removal of:
Halogenated Flame Retardants (HFRs)
and Polyvinyl Chloride (PVC)
iNEMI Position Statement Can Be Found Here:
http://thor.inemi.org/webdownload/projects/ese/HFR-Free/Low-Halogen_Def.pdf
3
Low-Halogen Material Changes
HFR-free - What Changed?
5
Low-Halogen changes the flame retardant used for epoxy
laminate (FR4) materials
Tetrabromo bisphenol-A (TBBPA) is the current
halogenated flame retardant for all laminate epoxy systems
Reactive flame retardant that is incorporated into the epoxy chain
and volatilizes at burning temperatures
6
7
Low Halogen (HFR-free) PCB - Challenges
HFR-free PCB Implementation
Potential Impact
Epoxy Backbone Change
– Mechanical degradation of resin strength resulting in lower peel strength & increase material brittleness
– Decomposition temperature (Td) of the resin is increased.
– Change to Glass Transition Temp (Tg)
– Impact to resin electrical properties (Dk and Df) due to moisture absorption
– Change to resin CTE properties affecting via reliability and assembly compatibility.
Fillers – Fillers increase the Dielectric Constant (Dk) of the material impacting impedance targets, crosstalk and other design considerations
– Fillers can lower the CTE and increase the rigidity of the material.
– Fillers can lower the peel strength of the laminate.
– Fillers can degrade the assembly of the laminate affecting process cost and via reliability.
7
Problem Statement
• A potential reduction in performance margin has been observed from the FR-4 laminates being used today
– Loss of margin in thermo-mechanical performance
– Loss of margin in electrical performance
• High-speed bus designs may be problematic due to electrical properties of these materials
– Potential for increasing the cost of the system
• Wider fluctuation of vendor to vendor PCB electrical performance compared to FR4 designs
– Multiple variations of flame retardants in use
8
9
HFR-Free High Reliability Program
Program Manager:
Stephen Tisdale, Intel
April 14, 2011
9
All Materials are Phenolic Resin Based MEB = Material Evaluation Board
MEB MEB Agilent Test Board
Layer Count / Thickness
18 Layer / 0.093” 24 Layer / 0.125” 20 Layer / 0.116
Drill Sizes 8mil / 10mil / 12mil 10mil / 12mil / 14 mil
Pitch 0.8mm / 1.0mm 0.8mm / 1.0mm
Reflow Temps 245C & 260C 245C 260
# Reflows 6x & 10x 6x & 10x 6x & 10x
Focus is on Hi-Reliability (Server) Market Segment Application Space
PCB and PCBA components are BFR-free
Board Thicknesses are 0.093” & 0.125” (MEB’s) & 0.116” (Agilent)
PCB Material should be LF compatible, low / med loss and HVM capable
– 8 BFR-free Materials Identified with 1 Halogenated Material as Control
iNEMI HFR-Free High Reliability PCB Project
10
MEB 93 – 18 Layer
• 22.25” X 15.75” in size
• Modular in design
Test
Category Test Test Method
IST (Gary to Check on this)
IPC TM650 2.6.26 @
150C
CAF (Microtek / Trace etc) IPC TM650 2.6.25
Flexural Modulus ASTM D790
Mechanic
al /
Reliability Cu Peel Strength IPC TM650 2.4.8C
Tg / z-Axis CTE IPC TM650 2.4.24C
Solder Mask Adhesion TM650 2.4.28B
Insulation resistance TM650 2.5.7
Solder Float / Cross
Section TM650 2.6.8E
Microhardness
Future Tech
Microhardness
Permittivity (Dk) and Loss
Tangent (Df) up to 30GHz VNA
Electrical
Moisture Diffusivity
Impacts on Insertion Loss VNA
Capacitance TM650 2.5.2A
CAT Trace and Space Portable CAT Tester
Drill Registration Intel Hand Probe
Temp Cycle (HATS) HATS
Assembly Transient Bend Instron
Rework
Board Side Ball Pull Dage 4000
11
Intel MEB 125 – 24 Layer
• 22.25” X 15.75” in size• Modular in design
12
iNEMI HFR-Free High Reliability PCB Status
13
1.7 of the 8 HFR-free material have completed TV
Builds and Simulated Assembly Reflows
2.1 HFR-free and the Brominated FR-4 control
material continue to be built– estimated
completion end of April’11
3.Testing has been initiated on all completed TVs
13
Project Timeline
Milestone Date
• Complete all remaining testing on the July 1st
original 7 materials
• Write interim report Aug 22nd
• iNEMI Webinar Sept / Oct
• Complete testing on remaining Oct 1st
2 materials
• Write Final Report Dec 1st
14
Original Project Members
HFR-Free High Reliability
15
16
HFR-Free Leadership Program
Program Manager:
Stephen Tisdale, Intel
HFR-Free Signal IntegrityChair: Stephen Hall, Intel
Co-chair: David Senk, Cisco
HFR-Free PCB MaterialsChair: John Davignon, Intel
April 14, 2011
16
Consortium Objectives
iNEMI HFR-Free Leadership Program
1717
1. Identify technology readiness, supply chain capability, and
reliability characteristics for “HFR-free” alternatives to
conventional printed circuit board materials and assemblies
– Spans electrical and mechanical properties
2. Define technology limits for HFR-free materials across all market
segments
– Initial focus is on client platforms (desktop, notebook) in 2011 timeframe
– Goal is to drive laminate supplier slash sheet content
HFR-free Technology Leadership Project
18
Stephen Tisdale, Intel – ChairHFR-Free Leadership
Program
HFR-Free PCB MaterialsChair: John Davignon –
Intel
HFR-Free Signal IntegrityChair: Stephen Hall - Intel
Co-Chair: David Senk - Cisco
Identify key thermo-mechanical performance characteristics and determine if they are in the critical path for the HFR-
free PCB material transition.
Ensure there is no degradation of electrical signals in HFR-free PCB materials, base on investigation of permittivity and loss as well
as how they are impacted by moisture absorption in new HFR-free materials.
iNEMI HFR-freePCB Materials
Chair: John Davignon, Intel
1919
iNEMI HFR-free PCB Materials WG Strategy
2020
• Define and implement quantifiable data into the HF Laminate Suppliers Datasheets that will assist in material selection by users
• Define a “Test Suite Methodology” which meets the
quality and reliability requirements of the chosen market
segments
• Ensure the Industry Laminate Suppliers have the
capability and capacity to support the industry HF
laminate requirements
Test Suite Methodology
21
Glass Transition Temperature (Tg) Stiffness/Flexural Strength
Decomposition Temperature (Td) Pad Adhesion (CBP/Hot Pin Pull)
Coefficient of Thermal Expansion (x,y,z) Interconnect Stress Test (IST)
Moisture absorption Conductive Anodic Filament (CAF)
Rework (Pad Peeling) Lead Free Reflow Test: Delamination
Permittivity (Dk) Charpy Impact Test
Total Loss (Df) Simulated Reflow Test
Test Methods Under Evaluation
10 Layer Mobile Stack-up
Description Layer Type
Layer 1 Plated 1/2 oz Cu 1.6 mils
Prepreg 3 mils - 1 ply 1080
Layer 2 Unplated 1 oz Cu 1.3 mils
Core 4 mil core - 1 ply 2116
Layer 3 Unplated 1 oz Cu 1.3 mils
Prepreg 4.2 mils - 1 ply 2116
Layer 4 Unplated 1 oz Cu 1.3 mils
Core 4 mil core - 1 ply 2116
Layer 5 Unplated 1 oz Cu 1.3 mils
Prepreg 4.2 mils - 1 ply 2116
Layer 6 Unplated 1 oz Cu 1.3 mils
Core 4 mil core - 1 ply 2116
Layer 7 Unplated 1 oz Cu 1.3 mils
Prepreg 4.2 mils - 1 ply 2116
Layer 8 Unplated 1 oz Cu 1.3 mils
Core 4 mil core - 1 ply 2116
Layer 9 Unplated 1 oz Cu 1.3 mils
Prepreg 3 mils - 1 ply 1080
Layer 10 Plated 1/2 oz Cu 1.6 mils
48.2
Thickness
iNEMI Materials WG - Phase 2 Update
• Two Proof of Concepts (POC) lots have been built to verify the Test Suite Methodology test vehicle/coupon design and test methods. 80% of Test Methods have been ratified
– Focus on determining the repeatability and reproducibility of the test methods across multiple sites
• Final “Test Suite Methodology” Design completed with all test structures finalized
– Test Vehicle design has been finalized and Gerber data loaded to the iNEMI ftp site
• All laminate builds are completed (6 HFR and 3 FR4 laminates)
• Phase 2 Schedule:
– 9 laminate builds have been completed
– Laminate Testing Scheduled Completion Q2’11
– Final analysis of Phase 2 results Q2’11
22
PCB Summary - Benefits
• We are changing the way that data is reported on the Laminate datasheets.
– The test methods will be precisely defined
– The test methods will be performed on a “product like” construction for more relevant data
• The data reported will enable:
– A true comparison of material properties and responses between laminates
– OEM/ODM’s to set envelopes for the material properties based on the market/BU sector that mitigate risk factors for that sector
– PCB Designers to pick cost effective laminate materials that are suitable to their products/market segment
– Method of directing Laminate Suppliers how to improve laminates by specific properties or responses
23
iNEMI HFR-freeSignal Integrity
Chair: Stephen Hall, IntelCo-Chair: David Senk, Cisco
2424
iNEMI HF Signal Integrity WG Strategy
• Identify HFR-free electrical “envelopes” required by each
company in the consortium
• Develop a common measurement methodology
• Characterize available HF dielectrics & map into
requirements
• Communicate requirements to the material vendors so
they know what the industry wants
25
Performance of HF PCB vs. FR4
26
HFR-free PCB materials on the market tend to have higher permittivity (Dk) values than FR4 HFR-free Dk ~ 4.2 – 5.0 (1080) FR4 Dk ~ 3.6-3.9 (1080)
3.4
3.6
3.8
4
4.2
4.4
4.6
4.8
5
15 17 19 21 23 25
Eye Area (ps-volts)
perm
itti
vit
y
Eye from lower limit of 1080 FR4
Eye from upper
range of HF
materials on the
market
37.5% margin degradation
vo
lta
ge
Time, ps
vo
lta
ge
Time, ps
Nominal 1080 FR4 permittivity
Simulation of three coupled 10” 50W microstrip lines;
dielectric thickness varied to maintain Zo; layout rules
similar to DDR buses (W/S/W=4/12/4)
Higher permittivity (Dk) reduces bus performance
- Thicker layers for same Z0
increases crosstalk- High crosstalk drives
increased trace separation & more layers (increased cost)
HFR-free losses tend to be better than FR4 & help compensate for crosstalk for some buses
Scaling HFR-free bus speeds
27
Margin reductions gets worse for faster buses- HFR-free materials with high permittivity may be adequate for lower
speed buses, but can be problematic at higher speeds- FR4 also places limitations on high-speed buses, but HFR-free
exacerbates problems on crosstalk dominated buses like DDR- HFR-free PCBs can make it more difficult for buses to scale with
Moore’s Law
A B
r = 5.0
r = 3.6
vo
lta
ge
Time, ps
0.10
0.05
0
-0.05
-0.10
0 100 200 300 400
2000 Mbits/sec
vo
lta
ge
Time, ps
0.2
0.15
0.1
0.05
0
-0.05
-0.1
-0.15
-0.20 500 1000 1500
667 Mbits/sec
Simulation of three
coupled 10” 50Wmicrostrip lines with
layout rules similar to
DDR buses
(WSW=4/12/4)
Critical Electrical Parameters
28
In addition to Permittivity, other critical electrical parameters of HFR-free materials must be assessed
- Each new formulation of flame retardants will have unique electrical parameters non-standard electrical behavior
- Must ensure all critical electrical parameters remain within acceptable bounds
Parameter Other names Design influences
PermittivityDk, er, dielectric
constant
Characteristic impedance,
Propagation velocity,
crosstalk
Loss tangentDf, tand, dissipation
factorSignal attenuation
Moisture absorptionEnvironmental effects,
humidity
When dielectric materials
absorb water, Dk & Df
increase.
iNEMI Signal Integrity WG Status
• Common measurement method developed by CISCO to characterize
the critical parameters (S3 method)
– Material vendors (in the WG) agreed to use this method for reporting numbers
on the data-sheet
• S3 measurements compared to split post resonator measurements (SPR assumed to
be the golden standard for accuracy)
• Completed round robin testing phase; proved the reproducibility
and repeatability of the S3 test method
– Round robin results show excellent reproducibility of measurements across 6
members
• Lab-Lab variation within 4% for Dk, 5% for Df.
– Within lab repeatability quantified to be within 1% for Dk, 2% for Df
• 5 measurements taken over 5 sequential days
29
Electrical Summary
• HFR-Free Laminates have increased permittivity (Dk)
• Higher Dk impacts high speed buses; Biggest impact is
DDR interface
• Limits can be placed on the permittivity so that FR4 and
HFR-free PCBs are interchangeable for a single design
for 2011 Platforms
30
Proposed Timeline
3131
2009 2010
Condense
brainstorm
list
PCB Material & SI
Workgroup
membership
finalized. Assign
owners and/or
subteam
Complete
EOM/ODM
Verification
Testing
Complete analysis of data
from Phase 2 test suite
builds and start verification
OEM/ODM builds
Identified Test
Methods, Test
Structures and
Critical dielectric
parameters/limits
Decide on TV
construction
and start Test
Structure
designs
Deliver the HF dielectric
electrical requirements to
the material suppliers and
ODMs
Final
Report
with
Webinar
Complete
POC Test
Structure
Validation
Build
Test Methods
verified,
Phase 2 build
complete and
under test
Phase #1 Phase #2 Phase #3
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
2009 2010 2011
Firms Participating in the Program
32
Questions
3333
HFR-Free
Technology
Transition Timing
34
iNEMI Whitepaper Tracks Members’ Progress
toward, and Timeline for, HFR / PVC-Free
Desktop and Notebook Computers
White Paper :
http://www.nemi.org/cms/newsroom/PR/2010/PR112910.html
Industry Collaboration – HFR-Free Technology
Transition Timing
iNEMI – Industry Leadership
• “Dell is committed to phasing out HFRs and PVC as part of our drive toward adopting environmentally
preferable materials in our products,” said Albert Tsang, Dell environmental affairs. “The work and
interactions invested by iNEMI and the project members clearly demonstrate the importance of working
together to decrease the impact on our environment.”
• “With the transition to low-halogen components and assemblies in our products, we needed to assure we
maintained quality, safety and performance,” said Rob J. Taylor, director of environmental affairs at
Lenovo. “During 2010, Lenovo has made a lot of progress and will have a significant number of
low-halogen offerings to announce in the 2011 timeframe. iNEMI, along with many OEMs and their
partners, have worked together to develop best practices as well as to identify many technical challenges
with the transition to low-halogen.”
• “Sustainability is a core value of DSM, the global chemical leader in the Dow Jones Sustainability Index,”
said Dr. Tamim Sidiki, global marketing manager, DSM Engineering Plastics. “The elimination of
hazardous substances is high on our agenda, along with our newly introduced bio-based performance
materials, recycling programs and eco-efficiency solutions. DSM offers entirely halogen and red
phosphorous free solutions for connectors and sockets as well as cable and wires. We strongly believe
that the conversion to halogen-free electronics is of comparable dimension and complexity as the
previous switch to lead-free soldering; and the platform offered by iNEMI enables a further
industry alignment.”
• Great progress made to date in moving computer system major sub
assemblies to materials that have the potential to minimize
environmental impacts across the full product lifecycle
Major system components of a typical desktop computer
Industry Transition to HFR-Free Technology
Key Sub-Assembly Level Transitions
Summary of Computer Product Advancements Made to Date
Key System Elements
Notebook Status2H 2010 New Products
Desktop Status2H 2010 New Products
CPU heat sink HFR –free HFR-free
CPU socket HFR-free HFR-free
CPU fan HFR-free not available HFR-free not available
CPU HFR-free HFR-free
Memory modules HFR-free HFR-free
Power supply HFR-free and PVC-free not available HFR-free and PVC-free not available
Hard drive & DVD burner
HFR-free HFR-free
Video/graphics card or module
HFR-free HFR-free
Mother board (excluding high-end circuits required for workstations & servers)
Low volume, specific SKUs only Not HFR-free(iNEMI teams addressing)
System enclosure PVC-free PVC-free
Low Power Socket & Connector TransitionConnector and Socket HFR-Free Advancements by iNEMI Members
Connector Type/FunctionNotebook Status
Q1 2011 New Products
Desktop StatusQ1 2011 New
ProductsCPU socket HFR-free HFR-freeDDR3 SIMM slots HFR-free HFR-freeLCD backlit subcard HFR-free HFR-freeContactless smart card HFR-free HFR-freeUSB/SATA combo edgecard HFR-free HFR-freeFan connector HFR-free Not HFR-freeDocking connector HFR-free HFR-freeDisplay port/USB combo HFR-free HFR-freeRJ45 LED connectors HFR-free HFR-freeExternal CRT connector HFR-free HFR-freeMini PCI-E socket; WWAN & WLAN HFR-free HFR-freeDC In cable/connector HFR-free HFR-freeLCD cable connector HFR-free HFR-freeKeyboard connector HFR Free HFR-freeSATA bay connector HFR Free HFR-freeRTC battery socket HFR Free HFR-freeTouchpad connector HFR Free HFR-freeSmart card I/F connector HFR Free HFR-freeSATA HDD connector HFR Free HFR-freeSpeaker connector HFR Free HFR-freeMain battery connector HFR Free HFR-freeMain power supply connectors HFR Free HFR-freeMDC & SIM connectors HFR Free HFR-freeExpress card IF connector HFR Free HFR-free
-Promising new polymers are
being introduced by specific
vendors into specific part numbers,
with lower power components
being the first to benefit
-The table shows the primary
functions of the connectors, along
with their status and the timing for
their transition to BFR / CFR /
PVC-free materials
- These dates have been defined by
iNEMI’s desktop and notebook
OEM members plus their material
suppliers; and they apply to new
desktop and notebook products
from those OEMs that will begin to
ship by 1Q 2011. Great progress
has been made.
SUMMARY
Table 3. Targeted Timeline for Transition of Notebook and Desktop Products to HFR-Free Components by iNEMI Members
Focus Complete byEvaluate and qualify HFR-free alternatives for high-performance PCBs Q4 2011Transition to PVC-free alternatives for notebook/desktop power cords Q4 2011Transition to HFR-free sockets/connectors for notebook/desktop systems (for at least 95% of the part numbers on new products shipping in 1Q 2011)
Q1 2011
iNEMI’s OEM members that produce notebook and desktop computers, along with members from
the supplier side of the industry, have made excellent progress in their efforts to deliver
environmentally friendly alternatives.
• Their work has been focused on areas of high impact
• Most major sub-assemblies in these computer products are now both PVC/HFR-free.
• The remaining complex set of challenges for delivering HFR-free printed circuit boards that affect
system motherboards, graphic cards and power supplies are aggressively being driven by two iNEMI
teams.
• An iNEMI team is also working the complex set of issues associated with delivering PVC-free power
cords.
• The last large set of opportunities exists with connectors and sockets, which represent 25% of the
volume on a desktop computer. Research underway at key iNEMI members will work through the
remaining few issues and challenges
The overall goals for these teams are to deliver by the dates shown in Table 3, which will thus affect
a large portion of the OEM volume and supply chain for computer products.
