TM

Products & Services

Micross is committed to delivering differentiated value to our customers throughout all of our sites. We continually monitor internal metrics & business processes and our team consistently strives to provide customers with industry-leading quality services and products while upholding our long-tenured reputation of strict standards for quality and reliability.

· AS9100/ ISO 9001

· ITAR-Registered

· DMEA Trusted Source

· DLA Certified

· MIL-PRF-38534, Class H

· MIL-PRF-38535, Class Q & V Level Assembly & Test

· MIL-PRF-38535, Class Q / V / Y CGA / Column Attach

· MIL-STD-883, Laboratory Suitability

· MIL-STD-883, Hi-Rel Micro Laboratory

· MIL-STD-202, Laboratory Suitability

· MIL-STD-750, Laboratory Suitability

· AS6081: A1, A3, A4, A5, A6, FSC 5962 Limited Electrical Test per QTSL-5961 / 5962 3.1.3

· Nadcap AC7120

· ANSI / ESD-S20.20

· AS9100D 7 BS EN ISO 9001:2015

· ISO14001

· JOSCAR Registered

· HM Government - Cyber Essentials

US Sites

UK Sites

Quality Certifications

Largest global Bare Die Distributor; Turnkey Wafer Processing and

Value-added Services

Next-Gen Wafer-Level Packaging & Wafer Bumping and 2.5/3D

Heterogeneous Integration

Hermetic, Plastic (CSP/BGA/QFN), Multi-chip SiP Packaging;

Precision Die Attach & Optoelectronic Assembly

BGA Reballing, Lead Attach, Robotic Hot Solder Dip,

Trim & Form, Column Attach, Counterfeit Mitigation Services

Based in Manchester, New Hampshire & Round Rock,

Texas and Crewe, UK

FPGA, ASIC, RF Test; PEMs and COTS

Upscreening and Qualification

HTOL – Dynamic/Static DC/RF, LTOL, Advanced Chamberless

Burn-in (ACBI), HAST

Micross is the one source, one solution global provider of mission-critical microelectronic components and services including six distinct business units formed to provide an unparalleled array of high-reliability electronic product, packaging, test and modification services servicing the US, European and Global markets.

Hi-Rel Products SMD/5962, Hi-Rel Memory, Analog & Power, COTS/Retail+

Based in Orlando, Florida

Bare Die & Wafer Processing

Advanced Interconnect Technology

Packaging and Assembly

ComponentModification

Advanced Testing: Electrical Test

Advanced Testing: Environmental Test

Based in Orlando, Florida & Norwich, UK

Based in Orlando, Florida & Norwich, UK

Based in Orlando, Florida & Milpitas, California

Based in Orlando, Florida & Milpitas, California

Based in Raleigh, Research Triangle Park, North Carolina

Business Units

· Complete array of capabilities qualified to meet customers’ most demanding requirements

· Most experienced in-house engineering support team – design application & engineering solutions

Micross’ key partnerships with over thirty of the world’s leading semiconductor manufacturers give our customers direct and authorized access to a variety of proprietary and high performance products. Our customers benefit from a complete array of post-wafer fab processing capabilities and services that are unmatched in the industry and have been qualified to meet the demanding requirements of aerospace & defense, space, medical and industrial harsh environment applications.

BROADEST AUTHORIZED LINE CARD IN THE INDUSTRY

Broadest Authorized Line Card in the Industry

Leveraging our Bare Die Line Card for You

Die Distribution

Largest Global One Source Provider ofBare Die, Wafer & Value-Added Services

FULL TURNKEY WAFER PROCESSING

DICING

· ±1µ tolerance

· Wafer sizes up to 12”/300mm

· Multi-project wafer dicing

· Step-cutting & advanced dicing techniques

DIE SORT/PICK & PLACE

· Automated, virtually contactless handling of singulated die

· Compatible with all electronic wafer maps

· Multiple bin/grade die picking

DIE INSPECTION

· Commercial, military, space grades & custom

· Automated Optical Inspection

PROBE

· Direct dock 12”/300mm wafer probers

· Elevated & low temperature

· Full parametric testing, functional test

· Speed or trim binning

WAFER BUMPING

· Solder, gold & copper pillar bump

WAFER THINNING

· Ability to saw, sort & inspect wafers down to 50 microns

CUSTOMIZED OUTPUT

· Waffle tray or Gel-Pak

· Reconstructed wafer

· Tape-and-reel (pocket, blister or Surf Tape®)

CARRIER OPTIONS

· Sawn wafer on film-frame and ring-frame

· Automated in-feed grinding of wafers

· Reconstructed wafer

VALUE-ADDED SERVICES · Lot Acceptance Testing: Class H & Class K

· Kitting, KANBAN and VMI Programs

· Extensive Die-specific Failure Analysis

· Part parametric search & cross-reference

· Systematic wafer lot traceability

· Mechanical & electrical verification of capacitors

· BOM analysis & logistics management

DIE BANKING & OBSOLESCENCE MANAGEMENT

· Die and finished product banking (multiple global storage sites)

· Production continuation

· Long-term risk mitigation and logistics

Wafer Processing

· ITAR-Registered & Trusted Source Facility

· Premier Center for Wafer-Level Packaging (WLP) and 3D Heterogeneous Integration (HI)

· Supports wafer sizes up to 200mm with established WLP processes and the flexibility to tailor unique solutions for your most demanding interconnect requirements

WLCSP and flip chip wafer bumping with Pb-based and Pb-free solder alloys

Advanced Interconnect

FULL INTEGRATION & PACKAGING TECHNOLOGIES INCLUDE: · 3D integration technology: TSV, TGV, Si interposers, 3D IC

· Advanced interconnect and packaging technologies: Solder bumping, Cu pillar, Cu-based microbumps and assembly

· Flip-chip & Multi-chip module assembly, including patented PADS fluxless assembly process

· Microstructure fabrication and packaging: Monolithic integration, novel microfabrication and wafer-level vacuum packaging

HETEROGENEOUS INTEGRATIONMicross AIT 2.5D/3D integration technology platform is based on several enabling process modules, which include; Through-silicon via (TSV) interconnects:

· High density 3D IC applications, filled 2-20 µm diameter, up to 10:1 aspect ratio

· Wafer thinning (to < 20 µm Si thickness) & processing on temporary carrier wafer

· Flip-chip & high-density metal-metal interconnects and assembly, down to

COMPLETE PACKAGING CAPABILITIES

· Hermetic Packaging: Ceramic & Metal Can

· Wafer-level Vacuum/Hermetic Packaging

· Plastic Packaging: CSP/BGA/LGA/QFN

· Flip-Chip/MCM/SiP

· Die Stacking 2.5D/3D

· Custom Packaging

· Customer-specific Package Solutions for standard OEM Devices

HERMETIC PACKAGING CAPABILITIES

· Ceramic 600 & 400 mil DIP SOJ

· Two-sided LCC / Four-sided LCC

· Gull Wing

· QFP

· PGA

· Flat Pack / Formed-leaded Flat Pack

· Metal Can

PLASTIC PACKAGING CAPABILITIESExtended Temperature (-55˚C to 125˚C)

· CSP (Chip Scale Package)

· BGA (Ball Grid Array)

· LGA (Land Grid Array)

· MCM (Multi-Chip Module)

· QFN (Quad Flat No-Leads)

· SiP (System in Package)

ADVANCED ASSEMBLY CAPABILITIES · Optoelectronics

- Optical to Electronic Transceiver Placement

- SiP Opto Devices

· Precision Die Placement with accuracies better than +/- 0.5 microns

· Flip-Chip & highly integrated devices

· SiP

- Critical tolerance assembly, die attach and wirebond - SMT placement down to 01005

ADVANCED DIE ATTACH & FLIPCHIP · Precision Die Attach: Epoxy, Eutectic, Lead, Lead-free Solder and Thermal Compression

· Wire Bond: Au & Al Wire, Ball/Wedge Bonding, Wedge/Wedge, Heavy Gauge Wedge/Wedge

· Lid Seal/Encapsulation

· Material: Ceramic, Metal, Plastic

· Epoxy, Solder, Resistance Weld, Parallel Seam Seal

· Marking / Lead Finishing

Packaging & Assembly

One Source for Complete Packaging Packaging & Advanced Assembly Solutions

COMPONENT SOLUTIONS · Robotic Hot Solder Dip (RHSD)

· BGA Reballing

· Lead Attach

· Trim & Form and Reconditioning

TEST & INSPECTION · Fine & Gross Leak Testing

· Acoustic Microscopy

· X-ray Inspection

· X-ray Fluorescence Analysis

PCB SOLUTIONS · Assembly

· Rework

· Repair

· Component Harvesting

SUPPORT SOLUTIONS · Tape and Reel

· 3D Scan

· Bake and Package

· Marking & Labeling

BGA Reballing

Robotic Hot Solder Dip

Component Modification

ROBOTIC HOT SOLDER DIP · Established Center of Excellence in Manchester, NH (63,000 sq. ft.) & pioneered Robotic Hot Solder Dip Technology (RHSD) since 1984.

· Unparalleled robotic capacity supporting industry-leading quality & lead-times.

· Robotic Hot Solder Dip (RHSD) for Tin Whisker Risk Elimination, Gold Removal and Restoration of Solderability

· RoHS Compliance – removes SnPb & replaces it with SAC305 or specified alloy

· Post-Process Testing: Solderability, XRF Solder Characterization, Ionic Cleanliness

· Proprietary ultra-flat finish for bottom termination packages (QFN, MLF, LCC)

TIN WHISKER ELIMINATION per automated process removes 100% of the pure tin and replace with SnPb (tin-lead) RHSD per: GEIA-STD-0006 and Nadcap AC 7120

Industry-leading provider of Component Modification Solutionsdriven by proprietary processes and innovative technologies

BGA REBALLING / BALL ATTACH · Established Center of Excellence in Round Rock, TX (25,000 sq. ft.) supports proprietary robotic processes to deliver guaranteed BGA reballing yields & industry-leading turnaround times.

· BGA reballing converting RoHS BGAs to SnPb or Sn/Pb to SAC305

· Ball attach to LGA, QFN and DFN packages

· BGA re-work & repair

· LGA Gold Removal & Reballing

· Ball pitch from 0.40mm min/Ball diameter from 0.152mm

· Component size from .858mmx.858mm, pitch 0.4mm and expertise with plastic and ceramic components (Flip Chip & MCM)

· CTE Mismatch Mitigation · Options include: HMPS spheres, BTCE Micross patent, Non-collapsible spheres

LEAD ATTACH · Reduce solder joint stress through attachment of J-shape and L-shape leads to LCC’s using thermo-compression bond or proprietary hi-temp solder process

· Lead Replacement: Restoration & Repair of bent/damaged leads

· Lead Material: CDA 102 Copper, ASTM B-170 Grade 2

· Attachment verified by Lead Integrity & Bond Pull Testing

LEAD TRIM & FORM and RECONDITIONING

· Forms and trims straight leads for surface mount placement per customer’s drawing or spec (an RHSD process typically follows to coat leads & prevent oxidation)

· Reconditioning of Bent or Damaged Leads: Robotic process realigns bent leads and scans to verify results

· Trim & Form for J-Leaded, SOIC, SOJ, DIP, PSOP, TSOP, FP, QFP & other package outlines; Compliant to J-STD-001

CGA ATTACH · 2,500+ Column Placement Capable

· Column composition Sn10Pb90 or Sn20Pb80

· 1mm/1.27mm pitch tooling available

· DLA Certified

Component Modification

COUNTERFEIT MITIGATION SERVICESMicross Clearwater provides screening services for customer-supplied parts to mitigate the risk of counterfeit component entering the DIB Supply Chain.

· Independent Third-party ITAR-Registered Lab

Complies with AS6081 & AS6171 Requirements

· Value-add Solutions in Final Manufacturing & Test

· Highly-Experienced & Personalized Service

NEXT-GEN TEST SOLUTIONS

· Device Characterization Testing: FPGA, ASIC, RF

· High-Speed Digital

· Element Evaluation

· Failure Analysis: Engineering & Analytical Services

· Leading-edge Sub 28nm Test

EXTENSIVE IN-HOUSE TEST CAPABILITIES

· Testing for Memory, Analog, Logic, ASICs, Processor, Mixed Signal & Discrete

· Full Static & Dynamic Burn-in

· Controlled Chamber Testing

· Capability to -65°C to +320°C forced air

· 300mm Wafer Probe over Temp (-55°C to 125°C)

· Probe of partial wafers & singulated die

TEST PLATFORMS

· Verigy 93K, Pin Scale, Smart Scale

· LTX ASLX Mixed Signal Test/ LTX TS80 Linear/Mixed Signal Test

· ATS 8256 High Voltage CMOS

· Teradyne J937-50/100 MHz, 361/O’s

· Credence Diamond D10

· Testronics 201C Discrete Component Test

RF TEST SOLUTIONS

· High-speed RF Component Test using standalone bench and in conjunction with an ATE

· 24-48 RF Ports on ATE

· ATE Hybrid testing platform based on best-of-breed equipment

· Higher throughput and less device damage compared to rack-and-stack systems

· RF 6-110 GHz

PEMS (Plastic Encapsulated Microcircuits)

· One Complete Turnkey Solution to support the use of COTS Devices in critical Aerospace & Defense applications

· Extensive Knowledge of All EEE Parts: Discretes, Passives, Linears, Memory, FPGA, Microcontrollers, A/D, D/C

· Advanced Automated Test Capabilities: VLSI & RF

· Comprehensive In-house Test Capabilities: HAST, Temp Cycle, Dynamic Burn-in and Full Electrical Testing of devices

· In partnership with Hi-Rel Labs; the premier authority in DPA

· Destructive Physical Analysis (DPA) and Failure Analysis Capabilities for Both Military and Space Applications (adheres to DLA Standards)

· Laser Ablation for Advanced Decapsulation of Copper Bond Wire ICs

Electrical Test

World’s leading independent qualification & production testing capabilitiesfor mission-critical ASICs, FPGAs & RF Components

KEY RELIABILITY TEST SERVICES · Life Test/Burn-in (HTOL/LTOL), Junction Regulated

· HTOL – Dynamic/Static/DC/RF Junction Controlled

· Pre-Conditioning/MRT

· Temperature & Power Cycling

· Temperature Humidity Bias (THB)

· HAST, Thermal Shock

· Autoclave

· Mechanical Shock, Vibration, Acceleration

· Fine/Gross Leak — Kr85

· Temperature/Power Cycle Operating Life

· Thermal Shock

· EFR Analysis

· ESD/Latch-up

· Acoustic Microscopy

· X-Ray

· Shadow Moiré/Warpage Analysis

· Solderability

· Salt Atmosphere

· Particle Impact Noise Detection

· Other Level III & Sub System

RELIABILITY ANALYSISEvaluate parts with a wide array of environmental and mechanical stresses

LEVEL I & LEVEL II QUALIFICATIONEvaluate die, package and board-level reliability

QUALIFICATION REGIME

ESD, EFR, IME, Smart Burn-in, ACBI™

CUSTOMIZED RELIABILITY TESTS

Customized qualification plans. Specialized set-ups, real-time in-situ monitoring and data-logging capabilities

FAILURE ANALYSISIn-depth investigation of process, field failures and elemental analysis

CUSTOMIZED UPSCREENING CAPABILITYCapability to evaluate and screen parts as per customer requirements for Flight, ITAR and Hi-rel Applications

Environmental Test

Offers a broad range of Advanced Level I and II Reliability Qualification Testingincluding proprietary ACBI™ (Advanced Chamberless Burn-in) Technology

SRAM 256Kb to 16Mb Mono, 16Mb MCM, 5V & 3.3V, 10ns to 100ns, x8/x16/x32

SDRAM

SDR – 64Mb, 128Mb, 256Mb, 512Mb, PC100 or PC133

iPEM SDR – 1.2Gb, 25mm x 32mm

iPEM DDR – 1.2Gb, 2.4Gb, 25mm x 32mm & 16mm x 23mm

iPEM DDR2 – 2.1Gb, 2.4Gb, 4.2Gb, 4.8Gb, 25mm x 32mm & 16mm x 23mm

Sync SRAM 4.0Mb to 36Mb, 100-250MHZ, 3.3V, Pipeline, Flow-Through & ZBL

Legacy DRAM 256Kb to 64Mb, 5V, x1 and x4 LCC, Flatpack and DIP

DRAM DDR2 & DDR3

EEPROM 1Mb Mono, 4Mb MCM, 5V, in Flatpack, LCC, CSOJ, PGA, and CQFP

Flash 1Mb & 4Mb Mono, 16Mb to 64Mb MCM, 5V & 3V, 60ns to 150ns, multiple packages including DIP, Flatpack, LCC and CQFP

UVEPROM 256Kb to 1Mb Mono, 55ns to 200ns, in LCC, DIP

VRAM 1Mb/4Mb, 100ns to 200ns, in LCC, DIP and CSOJ

HI-REL MEMORY

RETAIL+ PRODUCT LINEMicross Retail+ Product Line enables customers to use industry-leading components that were not previously available for their hi-rel, long-life applications. Micross purchases COTS components and enhances them for use in military, aerospace, transportation, industrial and medical applications.

Retail+ Products are converted from RoHS Pb-free solder metallurgies to tin-lead (SnPb 63/37) based metallurgies. Pb-free BGA packages are reballed and Pb-free leaded and non-leaded packages go through a solder dip exchange using our established processes that brings them up to standards for use in hi-reliability applications.

Available Products: DDR/Flash, Processors, Power Management Integrated Circuits (PMIC)

Hi-Rel Products

Offers the broadest range of built-to-stock portfolio of up-screened Hi-Rel componentsincluding a portfolio of 5962-certified products accredited by DLA

SMD/5962 • Memory • Analog & Power • COTS/Retail+

Micross OrlandoDie Distribution & Hermetic/Plastic Packaging(Precision Die Attach & SiP Assembly)7725 N. Orange Blossom TrailOrlando, FL 32810-2696407.298.7100sales@micross.com

Micross AITAdvanced Interconnect Technology(WLP / Wafer Bumping3D Heterogeneous Integration)3021 East Cornwallis RoadPO Box 110283Research Triangle Park, NC 27709919.248.1800

Micross Manchester (formerly Corfin)Component Modification Services(Robotic Hot Solder Dip/Lead Attach)1050 Perimeter RoadManchester, NH 03103603.893.9900Solutions.MHT@micross.com

Micross ExpressDie Distribution400 W. Cummings Park #6900Woburn, MA 01801-6532express@micross.com781.938.0866

Micross MelvilleMicross Holdings Ltd.225 Broadhollow Road, Suite 305 Melville, NY 11747 407.298.7100sales@micross.com

Micross STSSilicon Turnkey Solutions(Electrical / Environmental Test)1804 McCarthy Blvd.Milpitas, CA 95035408.904.0200

Micross Round Rock (formerly Corfin)Component Modification Services(BGA Reballing)33 Cypress Blvd., Suite 400Round Rock, TX 78665512.833.5868Solutions.RR@micross.com

Micross ClearwaterCounterfeit Mitigation Services & DNA Marking4400 140th Ave North, Suite 140Clearwater, FL 33762727.532.1777

Micross NorwichDie Distribution & Specialty Packaging/Assembly2-4 Hellesdon Park Road, Drayton High RoadNorwich, NR6 5DR, UKBareDie@micross.com+44 (0) 1603 788 967

Micross CreweComponent Modification Services(Robotic Hot Solder Dip/Reballing/Lead Attach)15 Orion WayOff University WayCrewe, Cheshire, CW1 6NG, UK+44 (0) 1270 252 566

US Locations

UK Locations

Contact Us

TM

@microsscomps

company/micross-components

sales@micross.com

Oct. 21, 2020 Rev 2.0

@microsscomps

www.micross.com