Top Ten Ways to Commercialize Microtechnology

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  • Successful MEMS Implementation

    in a Downturn: A Top 10 List

    Dr. James Wylde

    04 Mar 2004

  • Table of Contents

    Bookham Technology

    Optical Attenuators

    Integrated MEMS Technology

    Top ten commercialization tips

    Conclusion

    COMS2004

  • Caswell

    Actives R & D

    InP/GaAs wafer fab assembly

    Milton, Abingdon

    Headquarters

    ASOC R & D

    ASOC wafer fab and assembly

    Bookham (Nov 02) Intro of NNOC

    Paignton (UK)

    Actives and Amps R&D

    Assembly

    Zurich (Switzerland)

    Pump chips R&D

    Pump chip wafer fab

    Ottawa (Canada)

    InP wafer fab

    Actives R&D

  • Ottawa (Carling)InP Wafer Fab

    R&D

    Milton (Oxford)ASOC

    PaigntonTx/Rx

    EDFA

    Zurich+ Poughkeepsie980 Pump laser

    CaswellGaAs & InP Wafer FabsMMIC; DBR Tunable Laser

    Bookham Locations

  • Introduction

    MEMS became a force in optical telecom in late 1990s

    Large scale Optical Cross Connect Switches

    Passive Silicon Optical Benches

    Optical Attenuators

    2000 Days of the M&A

    Xros/Nortel: $3.25B

    Coretek/Nortel: $900M

    Cronos/JDSU: CHECK

    2002 Days of the Shutdown

    Xros: closed

    Coretek: closed

    Cronos: sold to MEMSCap for $10M

    However, several Optical MEMS efforts have thrived

  • Optical Attenuators

    Nature of fiber is that different wavelengths are attenuated at

    different rates through a fiber

    Water Curve

  • Optical Attenuators

    Links are also amplified @ ~80klm

    Different wavelengths can be attenuated and amplified at different

    gains

    Tx Amplifier Amplifier Rx

    Receivers must deal with large changes in power level for various

    wavelengths

  • Optical Attenuators

    Typical links used discrete optical attenuators to balance the power

    in channels

    Typically expensive ($300 ea) and

    Require 1 - 2m of fiber

    Occupy 3-4 cm2 of board space

    Variable Optical Attenuator

    Linear

    Amplifier e

    -Photo-

    detector

  • Market Background

    Competing Technologies (LCD, EO) MEMS bad rap Industry in survival mode

    BUT:

    Customers feeling the same squeeze Technology barriers to existing solutions

    = Opportunity for MEMS

    Integrated MEMS Rx

  • The PTV/ATV 10G combines a 10Gb/s receiver with a MEMS based VOA in one package

    Enables increased density and lower cost to system vendors (density x2, CR ~300/ch)

    Integrated MEMS Rx

    Fiber

    A

    B

    C

    D

    E

    F

    G

    H

    I

  • Integrated MEMS Rx

  • Performance: The proof in the pudding

    VMV=0V, 0dB atten

    Amplifier well into

    overload

    VMV=12V, 20dB atten

    Signal extinguished

    VMV=9V, 5dB atten

    Eye recovered

    VMV=10V, 8dB atten

    Signal attenuated

    Integrated MEMS Rx

  • Performance: The proof in the pudding

    temp' dependance of VOA attenuation

    -40

    -35

    -30

    -25

    -20

    -15

    -10

    -5

    0

    5

    10

    4 5 6 7 8 9 10 11 12 13

    Bias voltage

    att

    en

    ua

    tio

    n/b

    ias c

    urr

    en

    t

    Iatt @ 0

    0degC

    85degC

    Iatt @ 25

    Iatt @ 85

    25degC

    Integrated MEMS Rx

  • #10

    Terminology Everyone has to speak the same language

    3000 word glossary (MANCEF estimate)

    MST, Micromachine, Microtechnology, Nanotechnology,

    MEMS, NEMS, Microsystems!?!?!?!?!?!?!

  • #9

    Reliability Speak in terms your customer understands

    Only in Canada eh?

  • #8

    Standards Again, talk in terms customers understand

    Telcordia 1221 + 468

    3 MEMS standards, 100+ semiconductor standards

  • #7

    Specifications Again, talk in terms customers understand

    Be careful of spec creep!

  • #6

    Look for places where small tech works

    but other technologies dont! LCD, EO competitors!

  • #5

    Integrate with technologies that are

    proven!

  • #4

    Need to provide a REAL benefit: cost?

    Performance? Size?

  • #3

    Set realistic expectations with customers.

  • #2

    Remember: MEMS Inside doesnt sell!

  • #1

    Have Fun! Smile!

  • Conclusion

    Integrated devices offer significant space and cost savings

    Integration offers design challenges with additional DOF

    MEMS Solution viable for unique applications

    Other solutions dont fit!

    Combination of design tools and shortloop experiments

    enabled faster TTM

    Successful implementation of MEMS by:

    Adapting technology to the required solution

    Identify the market need and design the MEMS to fit the need

    A significant challenge to the widespread acceptance of

    small tech is the lack of a sound reliability model