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User's GuideSLAU282–April 2009
TSC2117EVM-K
This user’s guide describes the operation of the TSC2117EVM-K evaluation module (EVM). The EVMfeatures a TSC2117 touch screen controller with stereo audio codec, amplifiers for speakers andheadphones and a digital signal processing module. Together with the USB-MODEVM board, theTSC2117 Control Software and a PC running Windows™ XP it is a plug-and-play solution to evaluate thecapabilities of the TSC2117.
The information in a caution or a warning is provided for your protection. Read each caution and warningcarefully.
Contents1 EVM Overview ............................................................................................................... 2
1.1 Introduction .......................................................................................................... 21.2 Box Contents ........................................................................................................ 21.3 Related Documentation From Texas Instruments .............................................................. 2
2 EVM + PC .................................................................................................................... 32.1 EVM Preparation.................................................................................................... 32.2 Control Software .................................................................................................... 42.3 Installation ........................................................................................................... 42.4 Concepts ............................................................................................................. 42.5 Main Window ........................................................................................................ 52.6 Dialogs and Active Objects ........................................................................................ 6
3 EVM Hardware ............................................................................................................. 193.1 Connectors and Jumpers......................................................................................... 193.2 EVM Schematics .................................................................................................. 223.3 EVM Bill of Materials.............................................................................................. 23
Appendix A USB-MODEVM Schematic ...................................................................................... 25Appendix B USB-MODEVM Bill of Materials ................................................................................ 26Appendix C USB-MODEVM Protocol ......................................................................................... 28
List of Figures
1 TSC2117 EVM + USB MODEVM.......................................................................................... 32 Main Window ................................................................................................................. 53 Initialization Script ........................................................................................................... 74 Command Dialog ............................................................................................................ 85 Register Inspector ........................................................................................................... 96 Clock and Digital Signal Routing ......................................................................................... 117 Digital Configuration: Codec Clock / PLL ............................................................................... 128 Advanced Clock Settings. ................................................................................................. 139 Audio Interface.............................................................................................................. 1410 Touch Screen Active Object .............................................................................................. 1511 SAR ADC Data ............................................................................................................. 1612 Automatic Gain Control.................................................................................................... 1713 DRC Transfer Function and DRC Dialog ............................................................................... 18
I2S, I2C are trademarks of Koninklijke Philips Electronics N.V.Windows is a trademark of Microsoft Corporation.SPI is a trademark of Motorola, Inc.
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1 EVM Overview
1.1 Introduction
1.2 Box Contents
1.3 Related Documentation From Texas Instruments
EVM Overview www.ti.com
List of Tables
1 Analog I/O ................................................................................................................... 192 Touch Screen ............................................................................................................... 193 GPI ........................................................................................................................... 194 Jumpers ..................................................................................................................... 205 Expansion Connectors P12/J12 .......................................................................................... 206 Expansion Connectors P22/J22 .......................................................................................... 217 Power Supply ............................................................................................................... 21B-1 USB-MODEVM Bill of Materials .......................................................................................... 26C-1 USB Control Endpoint HIDSETREPORT Request .................................................................... 28C-2 Data Packet Configuration ................................................................................................ 28C-3 GPIO Pin Assignments .................................................................................................... 31
The TSC2117EVM-K features a TSC2117 touch screen controller with stereo audio codec, amplifiers forspeakers and headphones and a digital signal processing module.
Together with the USB-MODEVM board, the TSC2117 Control Software and a PC running Windows XP, itis a plug-and-play solution to evaluate the capabilities of the TSC2117.
The USB-MODEVM board contains a TAS1020B streaming audio USB controller, which enumerates as aUSB audio class device.
When the USB-MODEVM + TSC2117 EVM is connected to a PC running Microsoft Windows XP, it will berecognized as a sound card. Once the TSC2117 is configured using the TSC2117 control software, anyaudio playback and record software on the PC that uses the Windows audio subsystem (sound card) canuse the TSC2117.
Besides configuration, the TSC2117 control software allows evaluation of the touch screen module of theTSC2117. The TSC2117 is compatible with 4 wire resistive touch screens (not provided by TI).
The following items ship with the TSC2117EVM-K:• TSC2117 EVM• USB-MODEVM
The control software required to operate the EVM is available from the TSC2117 product folder athttp://www.ti.com
TSC2117 data sheet (SLAS550)
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2 EVM + PC
2.1 EVM Preparation
TSC2117_RGZ_EVM
SW2
J6 Speakers
J1 Line In
USB-MODEVM
J8
J4 Touchscreen
Headphones
J7 USB
ON OFF
2.1.1 Analog Signal Connections
2.1.2 Touch Screen Connections
www.ti.com EVM + PC
This chapter explains how to use the TSC2117 EVM with a PC running Windows XP.
To interface the TSC2117 EVM with a PC using USB, plug the TSC2117 EVM onto the USB-MODEVM asshown in Figure 2 1. TSC2117 EVM + USB MODEVM.
Figure 1. TSC2117 EVM + USB MODEVM
Note: USB-MODEVM configuration
To control the TSC2117 from the PC via the USB-MODEVM, set switch SW2 position 1, 3, 4,5, 6, 7 to ON and position 2 and 8 to OFF.
• Connect a headphone to J8 (3,5 mm jack)• Connect 8-Ω speakers to J6 (4 screw terminal)
– Left speaker to SPLN and SPLP– Right speaker to SPRN and SPRP
• Connect a line-level audio source to J1 (3,5 mm jack)
The TSC2117 EVM is compatible with 4-wire resistive touch screens. Connect the touch screen to J4 (X+,X–, Y+, Y–).
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2.2 Control Software
2.3 Installation
2.4 Concepts
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The TSC2117 control software exposes most features of the TSC2117 through an intuitive graphical userinterface.
Note: Before Windows on the PC can use the TSC2117EVM-K as a sound card, the TSC2117 onthe EVM must be configured (sampling rate, audio routing, internal amplifier settings etc.)with the TSC2117 control software.
Download the TSC2117 control software (SLAC264) from the TSC2117 product folder at http://www.ti.comand launch the program (SLAC264).
This file is a self-extracting archive. The default target folder is:
C:\Program Files\Texas Instruments\TSC2117Click the Unzip button to complete the installation.
The TSC2117 control software is now available in the target folder. The name of the executable isTSC2117.exe
To launch the TSC2117 control software, navigate to the target folder with the Windows Explorer anddouble click TSC2117.exe.
The TSC2117 control software presents a block diagram view of the TSC2117 (or select modules withinthe TSC2117).
The block diagram consists of active objects that can react to user input (for example switches oramplifiers with variable gain that show a volume control on a mouse click event).
Note: Each active object will change color to red if the mouse cursor is above the object. Clickingthe object will trigger its function.
Some active objects are linked to control register(s) of the TSC2117 in a two way fashion. If an EVM isconnected, the control software will update the appropriate register(s) whenever an active object istriggered. If a register that is linked to an active object is changed via other components (for example thescript interpreter or the register inspector), the active object will change its state accordingly.
The control software will automatically detect a TSC2117EVM-K once it is connected to a USB port of thePC.
If no TSC2117EVM-K is connected to the PC, the control software changes to a simulation mode, where itis possible to retrieve script commands based on user input within the block diagram.
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2.5 Main Window
• Full featured TSC2117
• Playback only
• Record only
• Touch Screen only
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Figure 2. Main Window
At the top of the main window is a tool bar with buttons to change between four different use cases of theTSC2117:
By default, the control software displays the full featured block diagram of the TSC2117.
Each use case has its own initialization script, which will run if a use case is selected by clicking on one ofthe use case buttons. The initialization script contains register settings for the TSC2117 to configure thedevice for a specific use case.
The toolbar contains a control that determines the zoom factor. Change the zoom by selecting the desiredzoom factor.
To move the block diagram, click on a blank area within the block diagram and drag the diagram with themouse.
At the bottom of the main window is a status bar that provides information about the state of thecommunication between the control software and the TSC2117EVM-K. It also shows hints about elementsin the block diagram, for example the I2C page and register / bit location of a selected switch.
Audio signal paths (both digital and analog) will change color from black to• Blue for left audio output• Turquoise for right audio output
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2.5.1 Using Active Objects
2.6 Dialogs and Active Objects
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• Magenta for audio input
once they are activated via switches. This feature visualizes all audio paths and immediately highlights if apath is disabled.
Moving the mouse pointer over an active object will light up the active object (the color of the object turnsred).
For example, the Class-A/B HP Driver left amplifier active object will turn from its inactive state to its activestate when the mouse pointer enters the amplifier symbol:
Clicking the activated object will trigger its function. In the case of the amplifier active object, the functionis a volume control. Moving the volume control slider changes the volume setting of the amplifier (it is alsopossible to change the volume by clicking onto the number within the amplifier symbol and typing the newgain setting).The control software updates the appropriate register in the TSC2117 and as a result thevolume on the headphone output will change accordingly.
The TSC2117 control software contains several dialog windows that give access to additional features.
Most dialogs are linked to active objects and are opened by clicking on the active object.
A few dialogs are not linked to active objects and are opened using the View menu.
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2.6.1 Init Script Dialog
Each use case , , , owns a unique initialization script which will automatically run when a
www.ti.com EVM + PC
TSC2117EVM-K is detected or if the user selects another use case.
To show or edit the initialization script, choose View->Init Script… from the main window menu bar.
Figure 3. Initialization Script
Click the Run button to run the script again. For further information about the script syntax, see Figure 3.
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2.6.2 Command Dialog
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Open the command dialog (View->Command…) to write, edit, load, save and run command scripts.Command scripts are text files that contain commands to communicate with the TSC2117. The syntax isdescribed in Figure 4.
Figure 4. Command Dialog
• The main area of the command dialog is command buffer (editable text) which contains the commandscript. To run the command script, click the Run button.
• The smaller read only text area on the right side of the command dialog displays control data readfrom the TSC2117. The Clear button clears the Read Data field.
• The one line text edit field on the left bottom allows single command execution.• The Record check box enables recording of commands generated by the control software.
Figure 4 shows a recording of the volume control for the left Class-A/B HP Driver amplifier (note that theRecord checkbox is checked).
A single command to read four bytes starting at address 0x28 was executed and the result is displayed inthe Read Data field.
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2.6.3 Register Inspector
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The register inspector dialog (View->Register Inspector…) gives access to all registers of the TSC2117.
Figure 5. Register Inspector
The register inspector displays the content of the TSC2117 registers. The control software will read allTSC2117 registers when a TSC2117EVM-K is detected. To force reading the content of one page, clickthe Refresh button.• The Page edit field selects the page to be displayed.• The addr column shows the address of the registers within the selected page in decimal notation.• The description column contains a description for each register. If the register has no function
assigned, it is declared Reserved.• The data columns show the data of each register (one byte). The first data column uses decimal
notation, the second uses hexadecimal notation. It is possible to change the register value by clickinginto one of the data fields and typing the new value (either decimal or hexadecimal).
• The numbered columns show the register content in binary notation. Read/Write bits are shown solidblack or red; read only bits are gray or dark red. Red numbers represent bits that recently changed. Tochange a single writeable bit, click on the bit and it will flip.
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2.6.4 DAC Filter
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One of the digital signal processing blocks of the TSC2117 implements five digital biquad filters. The DACdigital filter dialog (View->DAC Filter…) allows real time graphical manipulation of the digital filters.
The control software will automatically configure the digital signal processing block when the DAC digitalfilter dialog is opened.
The digital filter dialog limits the range of each digital biquad filter to +/-12[dB] (this is an arbitrary limitationfor demonstration purposes).• Each biquad has its own unique handle with a unique color. Each handle will light up white if the
mouse pointer is in the vicinity, showing that it can be selected. To change the frequency and gain of abiquad, grab and drag its handle.It is also possible to change the gain using the slider for each biquad.
• Each biquad can be configured for parametric EQ, Shelf Treble or Shelf Bass. If it is configured for EQ,press the shift key before selecting the handle to adjust the bandwidth of the EQ using the mousepointer.
• Due to digital range limitations, the biquads will automatically scale, if the biquad coefficients exceedthe limitations.The coordinate system will shift accordingly to reflect the resulting attenuation.
• To avoid clipping, add additional attenuation with the Attenuate slider.• To retrieve the biquad coefficients, open the command dialog (see 0) and check Record.
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2.6.5 Clock and Digital Signal Routing
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The TSC2117 has a flexible and complex clock and digital signal routing architecture.
Two processors can connect to the TSC2117 using two separate I2S™ interfaces: The primary I2Sinterface has dedicated pins whereas the secondary I2S interface signals can be assigned to a selectionof pins.
The TSC2117 has an on-chip clock generation module which can be configured to generate the samplingrate, modulator clocks, converter clocks, bit clock and word clock.
Click on the “Digital Audio Processing Serial Interface” active object (if it is not within the current scope ofthe main window, drag the block diagram to the left until the active object appears). This will change theblock diagram to the clock and digital signal routing diagram:
Figure 6. Clock and Digital Signal Routing
The clock and digital signal routing diagram shows the current state of the TSC2117 routing configurationand allows interactive manipulation.• Each clock or signal source has its own unique color. For example, the BCLK signal from the internal
clock generation module has a turquoise color.• To trace the routing of a specific signal, follow its color. The example in Figure 6 shows that the BCLK
signal from the internal clock generation module is routed to the primary I2C™ BCLK pin (which isconfigured as an output), to the secondary I2S BCLK signal (which is not connected to a pin) and tothe BCLK input of the codec (ADC and DAC within the TSC2117).
• To change the definition of a pin (input or output), click the active object (arrow) that belongs to the pin.Only pins that can change between input and output are linked to such an active object. The clockrouting diagram will automatically change to reflect the new routing.
• Some of the switches within the diagram are active objects, which can be manipulated using themouse pointer. Other switches open or close depending on the state of the associated pin.
• To assign a pin to a signal of the secondary I2S interface, choose one of the available pins in the dropdown box that belongs to the signal. The list of available pins will change automatically depending onthe assignment of other signals to pins.
• Click on the “Back To Codec” active object to return to the previous block diagram.• Click on the “Internal Clock Gen Module” active object to display the digital configuration dialog.
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2.6.6 Digital Configuration
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The digital configuration dialog gives access to the codec clock and PLL settings as well as the audiointerface settings.
To open the digital configuration dialog, navigate to the clock and digital signal routing diagram (seeFigure 6) and click on the “Internal Clock Gen Module” active object.
Figure 7. Digital Configuration: Codec Clock / PLL
The digital configuration dialog contains two tabs, one for the Codec Clock / PLL settings and one for theAudio Interface settings.
The Codec Clock / PLL settings tab (see Figure 7) enables simple generation of PLL and clock dividersettings based on the available input frequency and the desired sample rate:1. Choose the clock input using the Clock Input drop down box.2. Type the available input frequency in the Input Frequency edit field.3. Type the desired sample rate in the Sample Rate edit field of the ADC. By default, the DAC sample
rate equals the ADC sample rate. Uncheck DAC Fs = ADC Fs and enter the DAC sample rate fordifferent sample rates.
4. The Engine OSR and Instructions fields affect the miniDSP. Please contact your TI representative forfurther information about the miniDSP.
5. The Results list shows all clock settings that fulfill the chosen parameters. Double click on one of theresults to program the TSC2117 with the new settings.
Each result has the following columns:
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• PLL: On or Off• P,R,J,D: PLL configuration• NADC, MADC: ADC clock dividers• AOSR: ADC over-sampling factor• FsADC: ADC sampling rate• NDAC, MDAC: DAC clock dividers• DOSR: DAC over-sampling factor• FsDAC: DAC sampling rate
Click the Advanced… button to show the advanced clock settings dialog.
Figure 8. Advanced Clock Settings.
The advanced clock settings dialog gives direct access to the PLL and codec clock dividers. It willrecalculate the clock results dynamically whenever a parameter is changed.
The internally generated bit clock signal (BCLK) can be derived from several sources and divided by aninteger number. Select the desired source with the Source drop down box, choose the divisor and enablepower to the divider, if required.
It is possible to put out a clock signal CLKOUT. Select the clock source, the divider and the destination pinusing the advanced clock settings dialog.
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2.6.7 Audio Interface
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The Audio Interface tab ( see Figure 9) contains controls to manipulate the digital audio interface:
Figure 9. Audio Interface
Use the Format drop down box to change the digital audio interface format:• I2S• DSP• Right Justified• Left Justified
For details about the digital audio interface formats see the TSC2117 data sheet (SLAS550), 5.4 AUDIODIGITAL I/O INTERFACE.
The Word Length drop down box defines the number of bits per audio word.
The DIN/DOUT offset defines where the data for the ADC or from the DAC is located in the bit-stream.This is required for TDM (DSP) interface format.
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2.6.8 Touch Screen
The Touch Screen is implemented as an active object in the block diagram for the full TSC2117 and in
the block diagram for touch screen operation . It is labeled “Touchscreen”.
www.ti.com EVM + PC
Once activated, the touch screen active object configures the TSC2117 touch screen module forConversion Mode 2 and starts polling the TSC2117 touch screen registers with a period of 50 ms.
The inside of the touch screen active object (rectangle) shows the current coordinates (X and Y) and adrawing based on touch screen input.
Figure 10. Touch Screen Active Object
To change the touch screen module parameters, click on the touch screen active object. This will displaythe touch screen dialog.
To clear the touch screen drawing, open the touch screen dialog and click on the Clear button.
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2.6.9 SAR ADC Data
the block diagram for the full TSC2117 .
EVM + PC www.ti.com
The results of the SAR ADC data conversions are available in an active object labeled SAR Data within
Once activated, the SAR data active object configures the TSC2117 touch screen module for ConversionMode 9 and starts polling the TSC2117 SAR data registers with a period of 50 ms.
The inside of the SAR data active object (rectangle) shows the conversion results for IN1, IN2, BAT andTEMP.
Figure 11. SAR ADC Data
To change the SAR ADC module parameters, click on the SAR data active object. This will display theSAR ADC dialog.
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2.6.10 AGC
within the block diagram for the full TSC2117 .
www.ti.com EVM + PC
The TSC2117 has an automatic gain control module, which is accessible by an active object labeled AGC
Clicking on the AGC active objects opens the AGC Dialog:
Figure 12. Automatic Gain Control
If the AGC is enabled, the TSC2117 will adjust the gain of the analog audio input signal amplifier so thatthe input signal level for input signal amplitudes above the noise threshold approximates the target level.• The main display in the AGC dialog shows the Amplitude of the ADC output data in decibel with 0dB
equal to a full scale signal.•
– The target level line can be adjusted using the mouse pointer. It will change color to red if it themouse pointer is in the vicinity, indicating that it can be moved (click and drag).
– The noise threshold line is also adjustable• The small display on the left shows the ADC output data• The AGC Gain field shows the applied gain (if the AGC is enabled) and allows setting a maximum gain
using the slider.
Advanced AGC controls are available by clicking the More button. This will reveal further controls to adjustvarious AGC parameters.
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2.6.11 Digital Volume Control and DRC
Each is accessible by a active objects labeled DVol within the block diagram for the full TSC2117 and
the playback use case .
EVM + PC www.ti.com
The TSC2117 has digital volume control and dynamic range compression modules for each DAC channel.
Clicking on the DVol active object opens the DAC Vol dialog, which contains a slider to set the digitalvolume and several options. Checking the DRC option reveals the DRC transfer function.
Figure 13. DRC Transfer Function and DRC Dialog
The horizontal axis of the DRC transfer function shows the input to the DRC and the vertical axis showsthe output of the DRC. The green line shows the gain below the DRC threshold, the magenta coloredhorizontal line shows the DRC threshold and the red line shows the gain above the DRC threshold.
The DRC transfer function will change depending on the digital volume setting and the DRC threshold.
Click on the DRC transfer function to reveal the DRC dialog, which contains a slider to change the DRCthreshold.
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3 EVM Hardware
3.1 Connectors and Jumpers
www.ti.com EVM Hardware
This chapter contains information about the EVM Hardware (switches, jumpers, schematics).
Table 1. Analog I/OConnector FunctionJ1 MIC/LINE inJ2 1 IN1
2 IN23 IN34 AGND
J3 1 REF2 AGND
J5 1 LN (speaker filtered)2 LP (speaker filtered)3 RN (speaker filtered)4 RP (speaker filtered)
J6 1 SPLN (speaker)2 SPLP (speaker)3 SPRN (speaker)4 SPRP (speaker)
J7 1 BATT2 GND
J8 HeadphonesJ9 Headphones (filtered)J10 1 HPL
2 AGND3 HPR
Table 2. Touch ScreenConnector FunctionJ4 1 Y–
2 X–3 Y+4 Y–
P11 10 Y–12 X–14 Y+16 Y–
Table 3. GPIConnector Function
W19 1 GPI12 GPI23 GPI3
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EVM Hardware www.ti.com
Table 4. JumpersJumper Function Positions Default
W1 IOVDD select 1-2: 1.8V 1-2: 1.8V2-3: 3.3V
W9 MIC bias select 1-2: TSC2117 1-2: TSC21172-3: 3.3V
W10 IN1 select 1-2: ext J2 not populated2-3: on-board V
W11 IN2 select 1-2: ext J2 not populated2-3: on-board V
W12 IN3 select 1-2: ext J2 not populated2-3: on-board V
W13 REF select 1-2: ext J3 not populated2-3: on-board V
W14 HPL 16 Ω load 1-2: add load not populatedW15 HPR 16 Ω load 1-2: add load not populatedW16 HPL CAP bypass 1-2: bypass not populatedW17 HPR CAP bypass 1-2: bypass not populatedW18 Firmware select 1-2: select EVM 1-2: select EVMW19 HPL CAP bypass 1-2: bypass 1-2: TSC2117
2-3: 3.3VW20 Reset source 1-2: reset from USB-MODEVM not populated
Table 5. Expansion Connectors P12/J12Pin Number Signal DescriptionP12.1/J12.1 NCP12.2/J12.2 NCP12.3/J12.3 SCLK SPI™ Serial ClockP12.4/J12.4 DGND Digital GroundP12.5/J12.5 NCP12.6/J12.6 NCP12.7/J12.7 SS SPI Chip SelectP12.8/J12.8 NCP12.9/J12.9 NCP12.10/J12.10 DGND Digital GroundP12.11/J12.11 MOSI SPI MOSI Slave Serial Data InputP12.12/J12.12 NCP12.13/J12.13 MISO SPI MISO Slave Serial Data OutputP12.14/J12.14 RESET TAS1020B ResetP12.15/J12.15 NCP12.16/J12.16 SCL I2C Serial ClockP12.17/J12.17 NCP12.18/J12.18 DGND Digital GroundP12.19/J12.19 NCP12.20/J12.20 SDA I2C Serial Data Input/Output
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www.ti.com EVM Hardware
Table 6. Expansion Connectors P22/J22Pin Number Signal DescriptionP22.1/J22.1 NCP22.2/J22.2 NCP22.3/J22.3 BCLK Audio Serial Data Bus Bit ClockP22.4/J22.4 DGND Digital GroundP22.5/J22.5 NCP22.6/J22.6 NCP22.7/J22.7 WCLK Audio Serial Data Bus Word ClockP22.8/J22.8 NCP22.9/J22.9 NCP22.10/J22.10 DGND Digital GroundP22.11/J22.11 DIN Audio Serial Data Bus Data InputP22.12/J22.12 NCP22.13/J22.13 DOUT Audio Serial Data Bus Data OutputP22.14/J22.14 NCP22.15/J22.15 NCP22.16/J22.16 NCP22.17/J22.17 MCLK Master Clock InputP22.18/J22.18 DGND Digital GroundP22.19/J22.19 NCP22.20/J22.20 NC
Table 7. Power SupplyPin Number SignalP23.1/J23.1 NCP23.2/J23.2 NCP23.3/J23.3 +5VAP23.4/J23.4 NCP23.5/J23.5 DGNDP23.6/J23.6 AGNDP23.7/J23.7 +1.8VDP23.8/J23.8 NCP23.9/J23.9 +3.3VDP23.10/J23.10 +5VD
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3.2 EVM SchematicsEVM Hardware www.ti.com
The schematic diagram for the TSC2117EVM is provided as a reference.
TSC2117EVM-K22 SLAU282–April 2009Submit Documentation Feedback
1 2 3 4 5 6
A
B
C
D
654321
D
C
B
Ati
6730 SOUTH TUCSON BLVD., TUCSON, AZ 85706 USA
TITLE
SHEET OF FILE
SIZE DATE REVdd MMM yyyy
DRAWN BY
ENGINEER
REVISION HISTORYREV ENGINEERING CHANGE NUMBER APPROVED
B
DATA ACQUISITION PRODUCTSHIGH-PERFORMANCE ANALOG DIVISION
SEMICONDUCTOR GROUP
FRYE D. ZERKETTS
I. C. SPOTTS
???
A
1 1
untitled
DOCUMENT CONTROL NO.1234567
Daughtercard_InterfaceDaughtercard_Interface.Sch
TSC2117_RGZTSC2117_RGZ.Sch
1 2 3 4 5 6
A
B
C
D
654321
D
C
B
Ati
12500 T.I. Boulevard, Dallas, Texas 75243 USA
TITLE
SHEET OF FILE
SIZE DATE REV5-Nov-2008
DRAWN BY
ENGINEER
REVISION HISTORYREV ENGINEERING CHANGE NUMBER APPROVED
B
DATA ACQUISITION PRODUCTSHIGH-PERFORMANCE ANALOG DIVISION
SEMICONDUCTOR GROUP
MIKE TSECOURAS
STEVE LEGGIO
A
2 2
TSC2117_RGZ_EVM
DOCUMENT CONTROL NO.N/A
+5VAA0(+)
2A1(+)
4A2(+)
6A3(+)
8A4
10A5
12A6
14A7
16REF-
18REF+
20
A0(-)1
A1(-)3
A2(-)5
A3(-)7
AGND9
AGND11
AGND13
VCOM15
AGND17
AGND19
J21
CONN_EVM_ANALOG
-VA2
-5VA4
AGND6
VD18
+5VD10
+VA1
+5VA3
DGND5
+1.8VD7
+3.3VD9
J23
CONN_EVM_POWER
-VA2
-5VA4
AGND6
VD18
+5VD10
+VA1
+5VA3
DGND5
+1.8VD7
+3.3VD9
P23
CONN_EVM_POWER
GPIO02
DGND4
GPIO16
GPIO28
DGND10
GPIO312
GPIO414
SCL16
DGND18
SDA20
CNTL1
CLKX3
CLKR5
FSX7
FSR9
DX11
DR13
INT15
TOUT17
GPIO519
P12
CONN_EVM_SERIAL
GPIO02
DGND4
GPIO16
GPIO28
DGND10
GPIO312
GPIO414
SCL16
DGND18
SDA20
CNTL1
CLKX3
CLKR5
FSX7
FSR9
DX11
DR13
INT15
TOUT17
GPIO519
J12
CONN_EVM_SERIAL
GPIO02
DGND4
GPIO16
GPIO28
DGND10
GPIO312
GPIO414
SCL16
DGND18
SDA20
CNTL1
CLKX3
CLKR5
FSX7
FSR9
DX11
DR13
INT15
TOUT17
GPIO519
P22
CONN_EVM_SERIAL
GPIO02
DGND4
GPIO16
GPIO28
DGND10
GPIO312
GPIO414
SCL16
DGND18
SDA20
CNTL1
CLKX3
CLKR5
FSX7
FSR9
DX11
DR13
INT15
TOUT17
GPIO519
J22
CONN_EVM_SERIAL
MCLK
BICK
WCLK
DIN
DOUT
MISO
MOSI
/SS
SCLK
/RESET
SDA
SCL
GPIO1
BOTTOM SIDE
TOP SIDE
BOTTOM SIDE
TOP SIDE
BOTTOM SIDE
TOP SIDE
BOTTOM SIDE
+1.8VD
+3.3VD
TP3AGND
TP4DGND
TP2AGND
TP5DGND
TP1AGND
TP6DGND
+3.3VA
C210uF
C10.33uF
R1
100K
R2
100K
C310uF
1GND3
1EN4
1IN5
1IN6
2GND9
2EN10
2IN11
2IN12
2OUT17
2OUT18
2RESET22
1OUT23
1OUT24
1RESET28
1FB25
U1
TPS767D301PWP
R3
56K
R5
30.1K
+3.9VA+5VA
TP7
+5VA
TP8
+3.3VA
TP9
+3.9VA
R420K
TP11+1.8VD
TP12+3.3VD
1
2
3
W1
IOVDD
IOVDD
TP10
IOVDD
X+
X-
Y+
Y-
A0(+)2
A1(+)4
A2(+)6
A3(+)8
A410
A512
A614
A716
REF-18
REF+20
A0(-)1
A1(-)3
A2(-)5
A3(-)7
AGND9
AGND11
AGND13
VCOM15
AGND17
AGND19
P11
CONN_EVM_ANALOG
A0(+)2
A1(+)4
A2(+)6
A3(+)8
A410
A512
A614
A716
REF-18
REF+20
A0(-)1
A1(-)3
A2(-)5
A3(-)7
AGND9
AGND11
AGND13
VCOM15
AGND17
AGND19
J11
CONN_EVM_ANALOG
TOP SIDE
BOTTOM SIDE
GPIO2
1 2 3 4 5 6
A
B
C
D
654321
D
C
B
A
Revision History
REV ECN Number Approved
ti12500 T.I. Boulevard, Dallas, Texas 75243 USA
TITLE
SHEET OF FILE
SIZE DATE REV5-Nov-2008
DRAWN BY
ENGINEER
A
DATA ACQUISITION PRODUCTSHIGH PERFORMANCE ANALOG DIVISION
SEMICONDUCTOR GROUP
STEVE LEGGIO
MIKE TSECOURAS
A
1 2
TSC2117_RGZ_EVM
DOCUMENT CONTROL NO.N/A
TP36SDA
TP35SCL
SCL
SDA
SD
A
SC
L
TP37MCLK
DIN
WCLK
BICK
TP40DIN
TP39WCLK
TP38BICK
DIN
WC
LK
BIC
K
MC
LK
DOUT
TP41DOUT
DO
UT
+1.8VD
C100.1uF
C1610uF
12
W7
+3.3VD
C110.1uF
C1710uF
12
W8
IOVDD33
DVDD18
TP46MOSI
MOSI
TP45/SS
TP44SCLK
SCLK
TP43GPIO1
TP42GPIO2
GPIO1
MOSI
/SS
SCLK
GPIO1
GPIO2
TP49GPI1
TP47MISO
MISO
GP
I1
/RESET
MISO
C56
47uF
C57
47uF
TP34
HPR
TP33
HPL
HP
L
HP
R
TP30SPRN
TP29SPLP
TP28SPLN
TP31SPRP
L1
0 ohm L2
0 ohm L3
0 ohm L4
0 ohm
C51NI
C50NI
C48NI
C49NI
C44
.022uF
R21402
TP24LN
C45
.022uF
R22402
TP25LP
C46
.022uF
R23402
TP26RN
C47
.022uF
R24402
TP27RP
SPLN
SP
LP
SP
RN
SP
RP
Y-
X-
Y+
X+
+3.3VA
C5
0.1uF
C14
10uF
12W3
AV
DD
33
+3.3VA
C9
0.1uFC15
10uF1
2
W6
SVDD
C8
0.1uFC19
22uF
12
W5
SV
DD
2
HV
DD
33
+3.3VA
C4
0.1uFC13
10uF
12
W2
SVDD
C7
0.1uF
C18
22uF
12
W4
SVDD1
TSVDD33
C60.1uF
C1210uF
1
2
J3
EXT VREF
TP19VREF
R20
220
VR
EF
R7
2.2K
C20
0.1uF
1
2MK1
MD9745APZ-F
EXT MIC IN
ONBOARD MIC
TP13LIN
C21NI
R6
0
C22NI
C21 - C22 are optional noise filtering caps for microphone and bias lines.
MPWR
LIN
LIN
1
2
3
4
J2
EXT. INPUTS
GND
R16
220
R17
220
R18
220
C310.1uF
C330.1uF
C340.1uF
TP18IN3
TP16IN1
TP17IN2
IN1
IN2
IN3
C2510uF
R8
1.0K
123
W9MIC BIAS SEL+3.3VA
TP14MPWR
R1050K R11
49.9K
+3.3VA
TP15VOL
C260.22uF
VO
L
MP
WR
C24NI
C23NI
MCLK
/SS
R32
0
RED
C62
0.1uF
1A1
1B2
1Y7
VCC8
GND4
2Y3
2B6
2A5
U6 SN74LVC2G00
21
3
SW2
/RESET+3.3VD
R3710K
+3.3VD
R3610K
TP48/RESET
R34
332
C61
0.1uF
+3.3VDD5/RESET
A1
B2
Y4
VCC5
GND3
U5 SN74LVC1G08
/RESET
R35
4.7K
+3.3VD
1 2
W20
W10
W12
W11
GND_F1
GND_S2
IN4
OUT_F6
ENABLE3
OUT_S5
U2 REF3225
+5VA
"RESET"
SHOWN POSITION"/RESET"
C30
0.1uF
R1922
C39
2.2uF
C38
47uF
C32
0.1uF
C29
0.1uFC37
47uF
C28
0.1uFC36
47uF
C27
0.1uFC35
47uF
W13
VCC8
VSS4
SDA5
SCL6
A01
A12
A23
WP7
U4
MICROCHIP_24AA64
C60
0.1uF
+3.3VD
R292.7K
12
W18
R302.7K
R312.7K
+3.3VD
1
2
3
J10
HEADPHONE
R12
10K
R13
10K
R14
10K
R15
10K
C5847nF
12
W1
4
R25100
R2716 C59
47nF
12
W1
5
R26100
R2816
C430.1uF
C420.1uF
C410.1uF
C400.1uF
TP22Y+
TP21X-
TP20Y-
TP23X+
3
12
D3
3
12
D4
3
12
D1
3
12
D2
+3.3VAD1-4 can be installed for extra ESD protection, or reducing touch panel noise.C40-43 can be installed for noise filtering. However adding the caps will slow down the SAR Conversion speed.
TP32
SVDD
C5510uF
1
2
J7
BATT. SVDD
C520.1uF
+3.9VA
L5
SVDD
C5347uF
C5447uF
21
3
SW1
BATTHPR
HPL
R90
MISO1
MOSI2
GPIO15
BIC
K1
3
WCLK12
DIN11
DOUT10
DVDD189
DVDD_IO8
IOVSS7
GPIO26
SCLK4
/SS3
/RE
SE
T4
8
GP
I14
7
GP
I24
6
GP
I34
5
HP
R4
4
DV
SS
43
HV
DD
33
42
HP
L4
1
SP
RP
40
SR
VS
S3
9
SR
VD
D3
8
SP
RN
37
SPLP36
SLVDD35
SLVSS34
SPLN33
TSVDD3332
XP31
YP30
DVSS29
XM28
YM27
TSVSS26
VB
AT
24
AV
DD
33
23
AV
SS
22
IN2
21
IN1
20
MIC
19
MIC
BIA
S1
8
VO
L1
7
SC
L1
6
SD
A1
5
MC
LK
14
VREF25
PPAD0
U3
TSC2117IRGE
1 2
W16
HPL
1 2
W17
HPR
5
1
3
4
2
J8
SJ1-3515-SMT
5
1
3
4
2J1
SJ1-3515-SMT
12
W2
1
12
W2
2
1
2
3
4
J6
SPEAKER OUTPUT
1
2
3
4
J5
SPEAKER FILTERED
1
2
3
4
J4
TOUCH SCREEN
Y+
X-
X+
Y-
TP50GPI2
TP51GPI3
GP
I3
GP
I2
GPIO2
1
2
3
W19
GPI
R33
0
TEST ONLY
5
1
3
4
2J9
SJ1-3515-SMT
HEADPHONE
R38
100K
3.3 EVM Bill of Materialswww.ti.com EVM Hardware
Qty Value Ref Des Description4 0 R6, R9, R32, R33 RES 0 Ω 1/10W 5% 0603 SMD4 0 L1, L2, L3, L4 RES 0 Ω 1 1/4W 5% 1206 SMD2 16 R27, R28 RES 16 Ω 1W 5% 2512 SMD1 22 R19 RES 22 Ω 1/10W 5% 0603 SMD2 100 R25, R26 RES 100 Ω 1/10W 1% 0603 SMD4 220 R16, R17, R18, R20 RES 220 Ω 1/10W 5% 0603 SMD1 332 R34 RES 332 Ω 1/10W 1% 0603 SMD4 402 R21– R24 RES 402 Ω 1/10W 1% 0603 SMD1 1.0K R8 RES 1.00 kΩ 1/10W 1% 0603 SMD1 2.2K R7 RES 2.2 kΩ 1/10W 5% 0603 SMD3 2.7K R29, R30, R31 RES 2.7 kΩ 1/10W 5% 0603 SMD1 4.7K R35 RES 4.7 kΩ 1/10W 5% 0603 SMD6 10K R12–R15, R36, R37 RES 10 kΩ 1/10W 5% 0603 SMD1 20K R4 TRIMPOT 20 kΩ 4MM TOP ADJ SMD1 30.1K R5 RES 30.1 kΩ 1/10W 1% 0603 SMD1 49.9K R11 RES 49.9 kΩ 1/10W 1% 0603 SMD1 50K R10 POT 50 kΩ 3/8" SQ CERM SL ST1 56.0K R3 RES 56.0 kΩ 1/10W 1% 0603 SMD3 100K R1, R2, R38 RES 100 kΩ1/10W 1% 0603 SMD4 .022uF C44–C47 CAP CER 0.022 µF 50V X8R 10% 06032 .047uF C58, C59 CAP CER 47000 pF 50V X7R 10% 06038 0.1uF C4–C11 CAP CER .10UF 6.3V X5R 10% 040217 0.1uF C20, C27–C34, C40–C43, CAP CER 0.1 µF 25V X7R 0603
C52, C60–C621 .22uF C26 CAP CER 0.22 µF 16V X7R 10% 06031 .33uF C1 CAP CER 0.33 µF 16V X7R 06031 2.2uF C39 CAP 2.2 µF 25V CERAMIC X5R 12107 10uF C12–C17, C25 CAP CERAMIC 10 µF 6.3V X5R 06032 10uF C2, C3 CAP CERAMIC 10 µF 10V X5R 08051 10uF C55 CAP CER 10 µF 16V X5R 20% 12062 22uF C18, C19 CAP CER 22 µF 6.3V X5R 20% 08058 47uF C35–C38, C53, C54, C56, CAP CER 47 µF 10V X5R 1210
C571 U1 Dual-Output Low-Dropout (LDO) Voltage Regulators1 U2 2.5V 4ppm/Degrees C, 100uA SOT23-6 Series (Bandgap) Voltage Reference1 U3 Audio Codec1 U4 IC SERIAL EEPROM 64K 1.7V 8SOIC1 U5 Single 2-Input Positive-AND Gate1 U6 Dual 2-Input Positive-NAND Gate1 600 L5 FERRITE CHIP 600 Ω 500mA 08051 D5 LED THIN 635NM RED DIFF 0805 SMD1 MK1 Omnidirectional Microphone Cartridge or alternate2 SW1, SW2 SWITCH SLIDE SPDT 30V.2A PC MNT3 J1, J8, J9 3,5mm Audio Jack, T-R-S, SMD2 J3, J7 Screw Terminal Block, 2 Position1 J10 Screw Terminal Block, 3 Position4 J2, J4–J6 Screw Terminal Block, 4 Position1 P23 10 Pin SMT Plug Header
SLAU282–April 2009 TSC2117EVM-K 23Submit Documentation Feedback
EVM Hardware www.ti.com
Qty Value Ref Des Description1 J23 10 pin SMT Socket Header3 P11, P12, P22 20 Pin SMT Plug Header4 J11, J12, J21, J22 20 pin SMT Socket Header6 TP1–TP6 TEST POINT PC MULTI PURPOSE BLK7 W2–W8 Bus Wire (18-22 Gauge)8 W14– W18, W20–W22 2 Pin Thru-hole Plug Header (Jumper), 0 .1" spacing7 W1, W9–W13, W19 3 Position Jumper , 0 .1" spacing
TSC2117EVM-K24 SLAU282–April 2009Submit Documentation Feedback
Appendix A USB-MODEVM Schematic
www.ti.com Appendix A
The schematic diagram for USB-MODEVM Interface Board is provided as a reference.
SLAU282–April 2009 USB-MODEVM Schematic 25Submit Documentation Feedback
1 2 3 4 5 6
A
B
C
D
654321
D
C
B
Ati
6730 SOUTH TUCSON BLVD., TUCSON, AZ 85706 USA
TITLE
SHEET OF FILE
SIZE DATE REVdd MMM yyyy
DRAWN BY
ENGINEER
REVISION HISTORYREV ENGINEERING CHANGE NUMBER APPROVED
B
DATA ACQUISITION PRODUCTSHIGH-PERFORMANCE ANALOG DIVISION
SEMICONDUCTOR GROUP
FRYE D. ZERKETTS
I. C. SPOTTS
???
A
1 1
untitled
DOCUMENT CONTROL NO.1234567
MCLKBCLKLRCLKI2SDINI2SDOUTMISOMOSISSSCLKRESETINTPWR_DWNP3.3P3.4P3.5P1.0SDASCLP1.1P1.2P1.3
Daughtercard InterfaceDaughtercard Interface
MCLKBCLK
LRCLKI2SDIN
I2SDOUT
INT
MISOMOSI
SSSCLK
RESET
PWR_DWN
SDASCL
P3.3P3.4P3.5P1.0
P1.1P1.2P1.3
USB InterfaceUSB Interface
1 2 3 4 5 6
A
B
C
D
654321
D
C
B
Ati
6730 SOUTH TUCSON BLVD., TUCSON, AZ 85706 USA
TITLE
SHEET OF FILE
SIZE DATE REV3-Apr-2007
DRAWN BY
ENGINEER
REVISION HISTORYREV ENGINEERING CHANGE NUMBER APPROVED
B
DATA ACQUISITION PRODUCTSHIGH-PERFORMANCE ANALOG DIVISION
SEMICONDUCTOR GROUP
RICK DOWNS
ROBERT BENJAMIN
C:\01_TI\designs\USB_MODEVM\usb-modevm_revD\USB Motherboard - ModEvm.ddb - Documents\SCH\Daughtercard Interface
D
2 2
USB-MODEVM INTERFACE
DOCUMENT CONTROL NO.6463996
GPIO02
DGND4
GPIO16
GPIO28
DGND10
GPIO312
GPIO414
SCL16
DGND18
SDA20
CNTL1
CLKX3
CLKR5
FSX7
FSR9
DX11
DR13
INT15
TOUT17
GPIO519
J12
DAUGHTER-SERIAL
+5VD
+5VA
1 2JMP2
1 2JMP1
JPR-2X1
+5VA +5VD
J2+5VA
J3+5VD
+5VA +5VDC2
10uF
C3
10uF
J4+1.8VD
J5+3.3VD
C4
10uF
C5
10uF
J1-5VA
C1
10uF
A0(+)2
A1(+)4
A2(+)6
A3(+)8
A410
A512
A614
A716
REF-18
REF+20
A0(-)1
A1(-)3
A2(-)5
A3(-)7
AGND9
AGND11
AGND13
VCOM15
AGND17
AGND19
J11
DAUGHTER-ANALOG
GPIO02
DGND4
GPIO16
GPIO28
DGND10
GPIO312
GPIO414
SCL16
DGND18
SDA20
CNTL1
CLKX3
CLKR5
FSX7
FSR9
DX11
DR13
INT15
TOUT17
GPIO519
J17
DAUGHTER-SERIAL
+5VD
+5VA
A0(+)2
A1(+)4
A2(+)6
A3(+)8
A410
A512
A614
A716
REF-18
REF+20
A0(-)1
A1(-)3
A2(-)5
A3(-)7
AGND9
AGND11
AGND13
VCOM15
AGND17
AGND19
J16
DAUGHTER-ANALOG
+1.8VD
+3.3VD
+1.8VD+3.3VD
1 2 3
JMP5
12
JMP3
12
JMP4
R2
2.7K
R1
2.7K
IOVDD
-5VA
-5VA
-5VA
MCLK
BCLK
LRCLK
I2SDIN
I2SDOUT
MISO
MOSI
SS
SCLK
RESET
P3.1-P3.2
PWR_DWN
P3.3
P3.4
P3.5
P1.0
SDA
SCL
P1.1
P1.2
P1.3
TP1 TP2 TP3
TP5
TP4
TP7AGND
TP8DGND
R21390
R22390
D7SML-LX0603GW-TR
GREEN
D6SML-LX0603GW-TR
GREEN
J11A (TOP) = SAM_TSM-110-01-L-DV-PJ11B (BOTTOM) = SAM_SSW-110-22-F-D-VS-
J12A (TOP) = SAM_TSM-110-01-L-DV-PJ12B (BOTTOM) = SAM_SSW-110-22-F-D-VS-
J13A (TOP) = SAM_TSM-105-01-L-DV-PJ13B (BOTTOM) = SAM_SSW-105-22-F-D-VS-
J16A (TOP) = SAM_TSM-110-01-L-DV-PJ16B (BOTTOM) = SAM_SSW-110-22-F-D-VS-
J17A (TOP) = SAM_TSM-110-01-L-DV-PJ17B (BOTTOM) = SAM_SSW-110-22-F-D-VS-
J18A (TOP) = SAM_TSM-105-01-L-DV-PJ18B (BOTTOM) = SAM_SSW-105-22-F-D-VS-
-VA2
-5VA4
AGND6
VD18
+5VD10
+VA1
+5VA3
DGND5
+1.8VD7
+3.3VD9
J13
DAUGHTER-POWER
-VA2
-5VA4
AGND6
VD18
+5VD10
+VA1
+5VA3
DGND5
+1.8VD7
+3.3VD9
J18
DAUGHTER-POWER
GND1
A12
A23
A34
A45
A56
A67
A78
A89
A910
A1011
A1112
B1113
B1014
B915
B816
B717
B618
B519
B420
B321
B222
B123
GATE24
U6
SN74TVC3010PW
IOVDD
+3.3VD
R6
200k
C29
0.1uF
IOVDD
R7
200k
R8
200k
+3.3VD
RA210k
IOVDD
INT
IOVDD
IOVDD
1 2 3 4 5 6
A
B
C
D
654321
D
C
B
Ati
6730 SOUTH TUCSON BLVD., TUCSON, AZ 85706 USA
TITLE
SHEET OF FILE
SIZE DATE REV3-Apr-2007
DRAWN BY
ENGINEER
REVISION HISTORYREV ENGINEERING CHANGE NUMBER APPROVED
B
DATA ACQUISITION PRODUCTSHIGH PERFORMANCE ANALOG DIVISION
SEMICONDUCTOR GROUP
RICK DOWNS
ROBERT BENJAMIN
C:\01_TI\designs\USB_MODEVM\usb-modevm_revD\USB Motherboard - ModEvm.ddb - Documents\SCH\USB Interface
D
1 2
USB-MODEVM INTERFACE
J9
CUI-STACK PJ102-BH
YELLOW
2.5 MM
6VDC-10VDC IN
C150.1uF
DOCUMENT CONTROL NO.
CS
CH
NE
32C
RE
SE
T34
CS
YN
C35
CD
AT
I36
CS
CLK
37M
CLK
O1
39M
CLK
O2
40R
ES
ET
41V
RE
N42
SD
A43
SC
L44
XTALO46
XTALI47
PLLFILI48
PLLFILO1
MCLKI3
PUR5
DP6
DM7
MR
ES
ET
9
DVSS4
DVSS16
DVSS28
AVSS45
TE
ST
10
EX
TE
N11
CD
AT
O38
RS
TO
12
NC
20
NC
22
P3.
013
P3.
114
P3.
2/X
INT
15
P3.
317
P3.
418
P3.
519
AVDD2
DVDD33
DVDD21
DVDD8
P1.023
P1.124
P1.225
P1.326
P1.427
P1.529
P1.630
P1.731
U8TAS1020BPFB
VCC1
D-2
D+3
GND4
J7
897-30-004-90-000000
R9
1.5K
R10
27.4
R11
27.4 C1347pF
C1447pF
1 2 3
JMP6PWR SELECT
C20
100pFC21
.001uF
R12
3.09K
X1
MA-505 6.000M-C0
C18
33pF
C19
33pF
+3.3VD
VCC8
VSS4
SD
A5
SC
L6
A0
1
A1
2
A2
3
WP
7
U1
24LC64I/SN
+3.3VD
C90.1uF
TP9
TP10
R32.7K
R52.7K
+3.3VD
MCLK
BCLK
LRCLK
I2SDIN
I2SDOUT
INT
MISO
MOSI
SS
SCLK
R13
649
+3.3VD
R410
C100.1uF
C110.1uF
C120.1uF
USB SLAVE CONN
EXT PWR IN
6.00 MHZ
6463996
RED
IOVDD
IOVDD
C23
0.1uF
C22
0.1uF
IOVDDC27
0.1uF
+3.3VD
C26
0.1uF
+3.3VD
IOVDD
+3.3VD
IOVDD
TP11
MRESET
3.3VD ENABLE1.8VD ENABLE C17
0.33uF
C7
10uF
1GND3
1EN4
1IN5
1IN6
2GND9
2EN10
2IN11
2IN12
2OUT17
2OUT18
2RESET22
1OUT23
1OUT24
1RESET28
U9
TPS767D318PWP
R17
100K
+3.3VD
C810uF
D5
SM
L-LX
0603
IW-T
R
D2
SML-LX0603YW-TR
D4SML-LX0603GW-TR
R19220
GREEN
USB I2SUSB MCKUSB SPI
USB SPI
USB I2S
USB MCK
+1.8VD
RESET
C240.1uF
USB ACTIVE
USB RST
USB RST
246
1357 89 1011 12
J15
EXTERNAL SPI
246
1357 89 1011 12
J14
EXTERNAL AUDIO DATAPWR_DWN
J10EXT MCLK
R20
75
+3.3VD
12345678
16151413121110
9
SW2
SW DIP-8
EXT MCK
24
13
J6
EXTERNAL I2C
IOVDD
SDA
SCL
+5VD
R1510K
R1610K
1423
SW1
REGULATOR ENABLE
VIN3
VOUT2
GN
D1
U2REG1117-5D1
DL4001 C160.33uF
C610uF
P3.3
P3.4
P3.5
P1.0
P1.1
P1.2
P1.3
J8
ED555/2DSTP6D3
SM
L-LX
0603
GW
-TR R14
390
GREEN
A0A1A2
24
15
3
U10
SN74LVC1G125DBV
C28
0.1uF RA110K
VREF12
VREF27
EN8
GND1
SCL26
SDA25
SCL13
SDA14
U11
PCA9306DCT
C30
0.1uFR23
200k
C31
0.1uF
+3.3VD
IN1
GND2
EN3
OUT5
FB4
U14
TPS73201DBV
11621531441351261171089
SW3
IOVDD SELECT
C25
10uF
1.2V1.4V1.6V1.8V2.0V2.5V3.0V3.3V
R27
25.5k
R29
28k
R35
46.4k
R36
30.9k
R34
36.5k
R32
48.7k
R31
32.4k
R33
39.2k
R25
22.1k
R26
137k
R28
76.8k
R30
56.2k
R18
30.1k
R37
52.3k
C370.1uF
VCCA1
DIR12
1A14
1A25
2A16
2A27
DIR23
GND8
GND9
OE214
2B210
2B111
1B212
1B113
OE115
VCCB16
U3
SN74AVC4T245PW
+3.3VD C34
0.1uF
VCCA1
A3
GND2
VCCB6
B4
DIR5
U7
SN74AVC1T45DBV
C42
0.1uF
VCCA1
A3
GND2
VCCB6
B4
DIR5
U5
SN74AVC1T45DBV
C35
0.1uF
IOVDD
IOVDD
VCCA1
DIR12
1A14
1A25
2A16
2A27
DIR23
GND8
GND9
OE214
2B210
2B111
1B212
1B113
OE115
VCCB16
U12
SN74AVC4T245PW
+3.3VDIOVDD C32
0.1uF
C33
0.1uF
EXT MCK
VCCA1
DIR12
1A14
1A25
2A16
2A27
DIR23
GND8
GND9
OE214
2B210
2B111
1B212
1B113
OE115
VCCB16
U4
SN74AVC4T245PW
C43
0.1uF
+3.3VD24
15
3
U17
SN74AUP1G125DBV
C40
0.1uF
IOVDD
1 2 3JMP7JPR-1X3
12
JMP8JPR-2X1
2 4
15
3
U15
SN74LVC1G126DBV
+3.3VD C410.1uF
VCCA1
A3
GND2
VCCB6
B4
DIR5
U13
SN74AVC1T45DBV
C36
0.1uF
C38
0.1uF
+3.3VDIOVDD
IOVDD
+3.3VD
+3.3VD
C39
0.1uF
D8
SML-LX0603GW-TR
R24220
GREEN
IOVDD
P3.1-P3.2
C441uF
+3.3VD
2 4
53
U16
SN74LVC1G06DBV
R38
10M
IOVDD
Appendix B USB-MODEVM Bill of Materials
Appendix B www.ti.com
The complete bill of materials for USB-MODEVM Interface Board is provided as a reference.
Table B-1. USB-MODEVM Bill of MaterialsDesignators Description Manufacturer Mfg. Part Number
R4 10Ω 1/10W 5% Chip Resistor Panasonic ERJ-3GEYJ1300V
R10, R11 27.4Ω 1/16W 1% Chip Resistor Panasonic ERJ-3EKF27R4V
R20 75Ω 1/4W 1% Chip Resistor Panasonic ERJ-14NF75R0U
R19 220Ω 1/10W 5% Chip Resistor Panasonic ERJ-3GEYJ221V
R14, R21, R22 390Ω 1/10W 5% Chip Resistor Panasonic ERJ-3GEYJ391V
R13 649Ω 1/16W 1% Chip Resistor Panasonic ERJ-3EKF6490V
R9 1.5KΩ 1/10W 5% Chip Resistor Panasonic ERJ-3GEYJ1352V
R1–R3, R5–R8 2.7KΩ 1/10W 5% Chip Resistor Panasonic ERJ-3GEYJ272V
R12 3.09KΩ 1/16W 1% Chip Resistor Panasonic ERJ-3EKF3091V
R15, R16 10KΩ 1/10W 5% Chip Resistor Panasonic ERJ-3GEYJ1303V
R17, R18 100kΩ 1/10W 5%Chip Resistor Panasonic ERJ-3GEYJ1304V
RA1 10KΩ 1/8W Octal Isolated Resistor Array CTS Corporation 742C163103JTR
C18, C19 33pF 50V Ceramic Chip Capacitor, ±5%, NPO TDK C1608C0G1H330J
C13, C14 47pF 50V Ceramic Chip Capacitor, ±5%, NPO TDK C1608C0G1H470J
C20 100pF 50V Ceramic Chip Capacitor, ±5%, NPO TDK C1608C0G1H101J
C21 1000pF 50V Ceramic Chip Capacitor, ±5%, NPO TDK C1608C0G1H102J
C15 0.1µF 16V Ceramic Chip Capacitor, ±10%, X7R TDK C1608X7R1C104K
C16, C17 0.33µF 16V Ceramic Chip Capacitor, ±20%, Y5V TDK C1608X5R1C334K
C9–C12, C22–C28 1µF 6.3V Ceramic Chip Capacitor, ±10%, X5R TDK C1608X5R0J1305K
C1–C8 10µF 6.3V Ceramic Chip Capacitor, ±10%, X5R TDK C3216X5R0J1306K
D1 50V, 1A, Diode MELF SMD Micro Commercial Components DL4001
D2 Yellow Light Emitting Diode Lumex SML-LX0603YW-TR
D3– D7 Green Light Emitting Diode Lumex SML-LX0603GW-TR
D5 Red Light Emitting Diode Lumex SML-LX0603IW-TR
Q1, Q2 N-Channel MOSFET Zetex ZXMN6A07F
X1 6MHz Crystal SMD Epson MA-505 6.000M-C0
U8 USB Streaming Controller Texas Instruments TAS1020BPFB
U2 5V LDO Regulator Texas Instruments REG1117-5
U9 3.3V/1.8V Dual Output LDO Regulator Texas Instruments TPS767D318PWP
U3, U4 Quad, 3-State Buffers Texas Instruments SN74LVC125APW
U5–U7 Single IC Buffer Driver with Open Drain o/p Texas Instruments SN74LVC1G07DBVR
U10 Single 3-State Buffer Texas Instruments SN74LVC1G125DBVR
U1 Microchip 24LC64I/SN64K 2-Wire Serial EEPROM I2C
USB-MODEVM PCB Texas Instruments 6463995
TP1–TP6, TP9–TP11 Miniature test point terminal Keystone Electronics 5000
TP7, TP8 Multipurpose test point terminal Keystone Electronics 5011
J7 USB Type B Slave Connector Thru-Hole Mill-Max 897-30-004-90-000000
J13, J2–J5, J8 2-position terminal block On Shore Technology ED555/2DS
J9 2.5mm power connector CUI Stack PJ-102B
J130 BNC connector, female, PC mount AMP/Tyco 414305-1
J131A, J132A, J21A, J22A 20-pin SMT plug Samtec TSM-110-01-L-DV-P
J131B, J132B, J21B, J22B 20-pin SMT socket Samtec SSW-110-22-F-D-VS-K
J133A, J23A 10-pin SMT plug Samtec TSM-105-01-L-DV-P
J133B, J23B 10-pin SMT socket Samtec SSW-105-22-F-D-VS-K
J6 4-pin double row header (2x2) 0.1" Samtec TSW-102-07-L-D
J134, J135 12-pin double row header (2x6) 0.1" Samtec TSW-106-07-L-D
JMP1–JMP4 2-position jumper, 0.1" spacing Samtec TSW-102-07-L-S
26 USB-MODEVM Bill of Materials SLAU282–April 2009Submit Documentation Feedback
www.ti.com Appendix B
Table B-1. USB-MODEVM Bill of Materials (continued)Designators Description Manufacturer Mfg. Part Number
JMP8–JMP14 2-position jumper, 0.1" spacing Samtec TSW-102-07-L-S
JMP5, JMP6 3-position jumper, 0.1" spacing Samtec TSW-103-07-L-S
JMP7 3-position dual row jumper, 0.1" spacing Samtec TSW-103-07-L-D
SW1 SMT, half-pitch 2-position switch C&K Division, ITT TDA02H0SK1
SW2 SMT, half-pitch 8-position switch C&K Division, ITT TDA08H0SK1
Jumper plug Samtec SNT-100-BK-T
SLAU282–April 2009 USB-MODEVM Bill of Materials 27Submit Documentation Feedback
Appendix C USB-MODEVM Protocol
C.1 USB-MODEVM Protocol
Appendix C www.ti.com
The USB-MODEVM is defined to be a Vendor-Specific class and is identified on the PC system as anNI-VISA device. Because the TAS1020B has several routines in its ROM which are designed for use withHID-class devices, HID-like structures are used, even though the USB-MODEVM is not an HID-classdevice. Data is passed from the PC to the TAS1020B using the control endpoint.
Data is sent in a HIDSETREPORT (see Table C-1).
Table C-1. USB Control EndpointHIDSETREPORT Request
Part Value DescriptionbmRequestType 0x21 00100001bRequest 0x09 SET_REPORTwValue 0x00 don't carewIndex 0x03 HID interface is index 3wLength calculated by hostData Data packet as described in Table C-2.
The data packet consists of the following bytes, shown in Table C-2:
Table C-2. Data Packet ConfigurationBYTE NUMBER TYPE DESCRIPTION
0 Interface Specifies serial interface and operation. The two values are logically ORed.Operation:
READ 0x00WRITE 0x10
Interface:GPIO 0x08SPI_16 0x04I2C_FAST 0x02I2C_STD 0x01SPI_8 0x00
1 I2C Slave Slave address of I2C device or MSB of 16-bit reg addr for SPIAddress
2 Length Length of data to write/read (number of bytes)3 Register address Address of register for I2C or 8-bit SPI; LSB of 16-bit address for SPI
4..64 Data Up to 60 data bytes could be written at a time. EP0 maximum length is 64. The returnpacket is limited to 42 bytes, so advise only sending 32 bytes at any one time.
Example usage:Write two bytes (AA, 55) to device starting at register 5 of an I2C device with address A0:
[0] 0x11[1] 0xA0[2] 0x02[3] 0x05[4] 0xAA[5] 0x55
28 USB-MODEVM Protocol SLAU282–April 2009Submit Documentation Feedback
www.ti.com USB-MODEVM Protocol
Do the same with a fast mode I2C device:
[0] 0x12[1] 0xA0[2] 0x02[3] 0x05[4] 0xAA[5] 0x55
Now with an SPI device which uses an 8-bit register address:
[0] 0x10[1] 0xA0[2] 0x02[3] 0x05[4] 0xAA[5] 0x55
Now, do a 16-bit register address, as found on parts like the TSC2101. Assume the register address(command word) is 0x10E0:
[0] 0x14[1] 0x10 → Note: the I2C address now serves as MSB of reg addr.[2] 0x02[3] 0xE0[4] 0xAA[5] 0x55
In each case, the TAS1020 returns, in an HID interrupt packet, the following:
[0] interface byte | statusstatus:
REQ_ERROR 0x80
INTF_ERROR 0x40
REQ_DONE 0x20
[1] for I2C interfaces, the I2C address as sentfor SPI interfaces, the read back data from SPI line for transmission of the corresponding byte
[2] length as sent[3] for I2C interfaces, the reg address as sent
for SPI interfaces, the read back data from SPI line for transmission of the corresponding byte[4..60] echo of data packet sent
SLAU282–April 2009 USB-MODEVM Protocol 29Submit Documentation Feedback
USB-MODEVM Protocol www.ti.com
If the command is sent with no problem, the returning byte [0] is the same as the sent one logically ORedwith 0x20 - in the preceding first example, the returning packet is:
[0] 0x31[1] 0xA0[2] 0x02[3] 0x05[4] 0xAA[5] 0x55
If for some reason the interface fails (for example, the I2C device does not acknowledge), it comes backas:
[0] 0x51 → interface | INTF_ERROR[1] 0xA0[2] 0x02[3] 0x05[4] 0xAA[5] 0x55
If the request is malformed, that is, the interface byte (byte [0]) takes on a value which is not as previouslydescribed, the return packet is:
[0] 0x93 → the user sent 0x13, which is not valid, so 0x93 returned[1] 0xA0[2] 0x02[3] 0x05[4] 0xAA[5] 0x55
The preceding examples used writes. Reading is similar:Read two bytes from device starting at register 5 of an I2C device with address A0:
[0] 0x01[1] 0xA0[2] 0x02[3] 0x05
30 USB-MODEVM Protocol SLAU282–April 2009Submit Documentation Feedback
C.2 GPIO Capability
C.3 Writing Scripts
www.ti.com GPIO Capability
The return packet is:
[0] 0x21[1] 0xA0[2] 0x02[3] 0x05[4] 0xAA[5] 0x55
assuming that the values written starting at Register 5 were actually written to the device.
The USB-MODEVM has seven GPIO lines. Access them by specifying the interface to be 0x08, and thenusing the standard format for packets—but addresses are unnecessary. The GPIO lines are mapped intoone byte (see Table C-3):
Table C-3. GPIO Pin AssignmentsBit 7 6 5 4 3 2 1 0
x P3.5 P3.4 P3.3 P1.3 P1.2 P1.1 P1.0
Example: write P3.5 to a 1, set all others to 0:
[0] 0x18 → write, GPIO[1] 0x00 → this value is ignored[2] 0x01 → length - ALWAYS a 1[3] 0x00 → this value is ignored[4] 0x40 → 01000000
The user can also read back from the GPIO to see the state of the pins. Assume the previous examplewas just written to the port pins.
Example: read the GPIO
[0] 0x08 → read, GPIO[1] 0x00 → this value is ignored[2] 0x01 → length - ALWAYS a 1[3] 0x00 → this value is ignored
The return packet is:
[0] 0x28[1] 0x00[2] 0x01[3] 0x00[4] 0x40
A script is simply a text file that contains data to send to the serial control buses.
Each line in a script file is one command. No provision is made for extending lines beyond one line, exceptfor the > command. A line is terminated by a carriage return.
The first character of a line is the command. Commands are:
i Set interface bus to user Read from the serial control busw Write to the serial control bus> Extend repeated write commands to lines below a w# Commentb Breakd Delay
f Wait for Flag
SLAU282–April 2009 USB-MODEVM Protocol 31Submit Documentation Feedback
Writing Scripts www.ti.com
The first command, i, sets the interface to use for the commands to follow. This command must befollowed by one of the following parameters:
i2cstd Standard mode I2C busi2cfast Fast mode I2C busspi8 SPI bus with 8-bit register addressingspi16 SPI bus with 16-bit register addressinggpio Use the USB-MODEVM GPIO capability
For example, if a fast mode I2C bus is to be used, the script begins with:
i i2cfastA double quoted string of characters following the b command can be added to provide information to theuser about each breakpoint. When the script is executed, the software's command handler halts as soonas a breakpoint is detected and displays the string of characters within the double quotes.
The Wait for Flag command, f, reads a specified register and verifies if the bitmap provided with thecommand matches the data being read. If the data does not match, the command handler retries for up to200 times. This feature is useful when switching buffers in parts that support the adaptive filtering mode.The command f syntax follows:f [i2c address] [register] [D7][D6][D5][D4][D3][D2][D1][D0]
where 'i2c address' and 'register' are in hexadecimal formatand 'D7' through 'D0' are in binary format with values of 0,1 or X for don't care.
Anything following a comment command # is ignored by the parser, provided that it is on the same line.
The delay command d allows the user to specify a time, in milliseconds, that the script pauses beforeproceeding. The delay time is entered in decimal format.A series of byte values follows either a read or write command. Each byte value is expressed inhexadecimal, and each byte must be separated by a space. Commands are interpreted and sent to theTAS1020B by the program using the protocol described in Section C.1.
The first byte following an r (read) or w (write) command is the I2C slave address of the device (if I2C isused) or the first data byte to write (if SPI is used—note that SPI interfaces are not standardized onprotocols, so the meaning of this byte varies with the device being addressed on the SPI bus). Thesecond byte is the starting register address that data will be written to (again, with I2C; SPI varies—seeSection C.1 for additional information about what variations may be necessary for a particular SPI mode).Following these two bytes are data, if writing; if reading, the third byte value is the number of bytes toread, (expressed in hexadecimal).
For example, to write the values 0xAA 0x55 to an I2C device with a slave address of 0x30, starting at aregister address of 0x03, the user writes:#example script
i i2cfast
w 30 03 AA 55
r 30 03 02
This script begins with a comment, specifies that a fast I2C bus will be used, then writes 0xAA 0x55 to theI2C slave device at address 0x30, writing the values into registers 0x03 and 0x04. The script then readsback two bytes from the same device starting at register address 0x03. Note that the slave device valuedoes not change. It is unnecessary to set the R/W bit for I2C devices in the script; the read or writecommands does that.
USB-MODEVM Protocol32 SLAU282–April 2009Submit Documentation Feedback
www.ti.com Writing Scripts
If extensive repeated write commands are sent and commenting is desired for a group of bytes, the >command can be used to extend the bytes to other lines that follow. A usage example for the > commandfollows:#example script for '>' command
i i2cfast
# Write AA and BB to registers 3 and 4, respectively
w 30 03 AA BB
# Write CC, DD, EE and FF to registers 5, 6, 7 and 8, respectively
> CC DD EE FF
# Place a commented breakpoint
b "AA BB CC DD EE FF was written, starting at register 3"
# Read back all six registers, starting at register 3
r 30 03 06
The following example demonstrates usage of the Wait for Flag command, f:#example script for 'wait for flag' command
i i2cfast
# Switch to Page 44
w 30 00 2C
# Switch buffers
w 30 01 05
# Wait for bit D0 to clear. 'x' denotes a don't care.
f 30 01 xxxxxxx0
Any text editor can be used to write these scripts; Jedit is an editor that is highly recommended for generalusage. For more information, go to: http://www.jedit.org.
Once the script is written, it can be used in the command window by running the program, and thenselecting Open Script File... from the File menu. Locate the script and open it. The script is then displayedin the command buffer. The user can also edit the script once it is in the buffer and save it by selectingSave Script File... from the File menu.
Once the script is in the command buffer, it can be executed by pressing the Execute Command Bufferbutton. If there are breakpoints in the script, the script executes to that point, and the user is presentedwith a dialog box with a button to press to continue executing the script. When ready to proceed, push thatbutton and the script continues.
SLAU282–April 2009 USB-MODEVM Protocol 33Submit Documentation Feedback
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