17
1 SLLU251 – August 2016 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated TUSB546 USB Type-C™ Enabler EVM USB Type-C is a trademark of USB Implementers Forum, Inc.. All other trademarks are the property of their respective owners. User's Guide SLLU251 – August 2016 TUSB546 USB Type-C™ Enabler EVM The TUSB546 USB Type-C™ Alternate Mode re-driving switch supports data rates up to 10 Gbps for a downstream facing port (host). This guide describes how to bring up the EVM and includes schematics that can be used as a reference design for the alternate mode implementations of the host system with the TUSB546 device. Contents 1 TUSB546EVM-SRC ......................................................................................................... 2 2 TUSB546EVM Configuration ............................................................................................... 2 2.1 TUSB546 EVM Default EQ Configuration ....................................................................... 2 2.2 TUSB546 EQ Control .............................................................................................. 3 2.3 Power ................................................................................................................. 4 3 TUSB546EVM Schematics ................................................................................................. 5 4 Bill of Materials ............................................................................................................. 10 List of Figures 1 TUSB546 EVM ............................................................................................................... 2 2 Test Board Setup ............................................................................................................ 2 3 TUSB546EVM Block Diagram ............................................................................................. 5 4 TUSB546EVM Schematics (1 of 4) ....................................................................................... 6 5 TUSB546EVM Schematics (2 of 4) ....................................................................................... 7 6 TUSB546EVM Schematics (3 of 4) ....................................................................................... 8 7 TUSB546EVM Schematics (4 of 4) ....................................................................................... 9 List of Tables 1 TUSB546 Configuration Pins............................................................................................... 2 2 Configuration Pin-Level Definitions........................................................................................ 3 3 USB 3.1 EQ Settings ........................................................................................................ 3 4 DisplayPort EQ Settings .................................................................................................... 4 5 TUSB546 EVM Bill of Materials .......................................................................................... 10

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Page 1: TUSB546 USB Type-C Enabler EVM - TI.com

1SLLU251–August 2016Submit Documentation Feedback

Copyright © 2016, Texas Instruments Incorporated

TUSB546 USB Type-C™ Enabler EVM

USB Type-C is a trademark of USB Implementers Forum, Inc..All other trademarks are the property of their respective owners.

User's GuideSLLU251–August 2016

TUSB546 USB Type-C™ Enabler EVM

The TUSB546 USB Type-C™ Alternate Mode re-driving switch supports data rates up to 10 Gbps for adownstream facing port (host). This guide describes how to bring up the EVM and includes schematicsthat can be used as a reference design for the alternate mode implementations of the host system withthe TUSB546 device.

Contents1 TUSB546EVM-SRC ......................................................................................................... 22 TUSB546EVM Configuration ............................................................................................... 2

2.1 TUSB546 EVM Default EQ Configuration ....................................................................... 22.2 TUSB546 EQ Control .............................................................................................. 32.3 Power................................................................................................................. 4

3 TUSB546EVM Schematics ................................................................................................. 54 Bill of Materials ............................................................................................................. 10

List of Figures

1 TUSB546 EVM ............................................................................................................... 22 Test Board Setup ............................................................................................................ 23 TUSB546EVM Block Diagram ............................................................................................. 54 TUSB546EVM Schematics (1 of 4) ....................................................................................... 65 TUSB546EVM Schematics (2 of 4) ....................................................................................... 76 TUSB546EVM Schematics (3 of 4) ....................................................................................... 87 TUSB546EVM Schematics (4 of 4) ....................................................................................... 9

List of Tables

1 TUSB546 Configuration Pins............................................................................................... 22 Configuration Pin-Level Definitions........................................................................................ 33 USB 3.1 EQ Settings ........................................................................................................ 34 DisplayPort EQ Settings .................................................................................................... 45 TUSB546 EVM Bill of Materials .......................................................................................... 10

Page 2: TUSB546 USB Type-C Enabler EVM - TI.com

TUSB546EVM-SRC www.ti.com

2 SLLU251–August 2016Submit Documentation Feedback

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TUSB546 USB Type-C™ Enabler EVM

1 TUSB546EVM-SRCFigure 1 illustrates the EVM board.

Figure 1. TUSB546 EVM

The TUSB546EVM-SRC can be used with a legacy DP Source or USB Host system to evaluate the USBType-C implementation. Figure 2 is a typical test setup.

Figure 2. Test Board Setup

The EVM comes with a legacy Type B USB receptacle to connect to USB host systems and a DisplayPortreceptacle to connect to DisplayPort-capable source. The TUSB546 EVM uses the Texas InstrumentsTPS65982 (http://www.ti.com/product/TPS65982) controller for power delivery and CC pin control.

2 TUSB546EVM ConfigurationThis section provides the configuration options available in the TUSB546EVM.

2.1 TUSB546 EVM Default EQ ConfigurationThe headers in Table 1 are provided for TUSB546 EQ configuration by default, configuration settings mayneed to be optimized depending on the amount of loss of each channel in the system.

Table 1. TUSB546 Configuration Pins

Reference Designator JMP Control ConfigurationJMP1 Downstream EQ0 No ConnectJMP2 Downstream EQ1 SHUNT on pin 2–4 (20-kΩ pulldown)JMP3 Upstream SSEQ0 SHUNT on pin 2–1 (1-kΩ pullup)JMP4 Upstream SSEQ1 SHUNT on pin 2–4 (20-kΩ pulldown)JMP5 DP EQ0 SHUNT on pin 2–4 (20-kΩ pulldown)JMP6 DP EQ1 SHUNT on pin 2–4 (20-kΩ pulldown)

Page 3: TUSB546 USB Type-C Enabler EVM - TI.com

www.ti.com TUSB546EVM Configuration

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TUSB546 USB Type-C™ Enabler EVM

2.2 TUSB546 EQ ControlEach of the TUSB546 receiver lanes has individual controls for receiver equalization. Table 2, Table 3,and Table 4 detail the gain values for each available combination for downstream, upstream, and allDisplayPort configurations.

Table 2. Configuration Pin-Level Definitions

Level Settings0 Option 1: Tie 1 kΩ 5% to GND

Option 2: Tie directly to GNDR Tie 20 kΩ, 5% to GNDF Float (leave pin open)1 Option 1: Tie 1 kΩ 5% to VCC

Option 2: Tie directly to VCC

Table 3. USB 3.1 EQ Settings

USB3.1 Downstream Facing Ports USB3.1 Upstream Facing PortEQ1 Pin

LevelEQ0 Pin

LevelEQ Gain @ 5 GHz (dB) SSEQ1 Pin

LevelSSEQ0 Pin

LevelEQ Gain @ 5 GHz (dB)

0 0 0 0 0 00 R 1 0 R 10 F 2 0 F 20 1 3 0 1 3R 0 4 R 0 4R R 5 R R 5R F 6 R F 6R 1 7 R 1 7F 0 8 F 0 8F R 9 F R 9F F 10 F F 10F 1 11 F 1 111 0 12 1 0 121 R 13 1 R 131 F 14 1 F 141 1 15 1 1 15

Page 4: TUSB546 USB Type-C Enabler EVM - TI.com

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TUSB546 USB Type-C™ Enabler EVM

Table 4. DisplayPort EQ Settings

All DisplayPort LanesDPEQ1 Pin Level DPEQ0 Pin Level EQ Gain @ 5 GHz (dB)

0 0 00 R 10 F 20 1 3R 0 4R R 5R F 6R 1 7F 0 8F R 9F F 10F 1 111 0 121 R 131 F 141 1 15

2.3 PowerThe EVM is designed to operate off of the VBUS from a USB host connected via USB Type B J4. Noexternal power is to be applied via J14 unless standalone operation is desired.

If testing the DisplayPort only, or if bypassing VBUS power, the EVM must be powered via J14 (5-V, 1-Ainput).

Page 5: TUSB546 USB Type-C Enabler EVM - TI.com

TUSB546(Socket Option)

USB Type-BReceptacle

US

B-C

(TM

)C

on

ne

cto

r

TPS65982

Standard DP SinkConnector

3P3V

3P3V 5 V

AUX

AUX

DP0

DP1

DP2

DP3

SSTX

SSRX

C_SSTX1

C_SSTX2

C_SSRX1

C_SSRX2

Type_C VBUS

5V_IN

VBUS_5V

5 V to 3.3 V3.3 V

3.3 V5 V

SBU

SBU

Copyright © 2016, Texas Instruments Incorporated

www.ti.com TUSB546EVM Schematics

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TUSB546 USB Type-C™ Enabler EVM

3 TUSB546EVM SchematicsFigure 3 displays the block diagram of the EVM.

Figure 3. TUSB546EVM Block Diagram

Page 6: TUSB546 USB Type-C Enabler EVM - TI.com

SILKSCREEN:

1046_EN/CTL1

AMSEL/CTL0

POL/FLIP

1KPU

EQ0

SILKSCREEN

1KPD20KPD

1KPU

EQ1

SILKSCREEN

1KPD20KPD

1KPU

SSEQ0

SILKSCREEN

1KPD20KPD

1KPU

SSEQ1

SILKSCREEN

1KPD20KPD

1KPU

DPEQ0

SILKSCREEN

1KPD20KPD

1KPU

DPEQ1

SILKSCREEN

1KPD20KPD

1KPU20KPD

SILKSCREEN

1KPDI2CEN

I2C_EN Header Config

1046_EQ* Config

1046_SSEQ* Config

1046_DPEQ* Config

SilkScreen:

Pad Sharing

TUSB546

FLIP CTL0 CTL1

X LOW LOW POWER DOWN

4-lane Orientation 1

4-lane Orientation 2

2-lane Orientation 1

2-lane Orientation 2

LOW

LOW

HIGH

HIGH

HIGH

HIGH

HIGH

HIGH

LOW

LOW

HIGH

HIGH

AMSELPOL EN Mux Operation

USB3.1 only Orientation 1

USB3.1 only Orientation 2

LOW

LOW

HIGH

HIGH

LOW

HIGH

Input fromTPS65982

1046_3P3V

SilkScreen:

BRD_3P3V

SilkScreen:

GND

Config Switch

SILKSCREEN

DCI_CLK

SILKSCREEN

DCI_DAT

HPD_OUT in I2C Mode1046 DP ENABLE in GPIO Mode

HPD_OUT in GPIO ModeDCI_CLK in I2C Mode

AUX Snoop EN in GPIO modeDCI_DAT in I2C mode

23 CTL1/HPDIN

DCI non-DCI

DP ENABLE in GPIO modeHPD in I2C mode

DP Enable in GPIO mode,Unused in I2C mode

29 CAD_SNK/DCI_DAT AUX Snoop EN in GPIO modeDCI_DAT in I2C mode

32

AUX Snoop EN in GPIO modeEN in I2C mode

DCI_CLK HPD in GPIO modeDCI_CLK in I2C mode

HPD

TUSB546 - INT017A USB-C(TM) Enabler Board

AMSEL

CAD_SNK_LCAD_SNK

1046_EQ0

1046_I2C_EN

1046_EQ1

1046SSEQ0 1046SSEQ1

1046DPEQ0 1046DPEQ1

1046_EN

CRX1N

CRX1P

CRX2P

CRX2N

DCI_DAT

APU_DP_TX0N

APU_DP_TX0P

APU_DP_TX1P

APU_DP_TX1N

APU_DP_TX2P

I2C_SCL1046

APU_DP_TX2N

APU_DP_TX3P

APU_DP_TX3N

I2C_SCL_ExtPOL

I2C_SDA1046I2C_SDA_Ext

1046_EN

1046SSEQ1

1046DPEQ1

1046_EQ0

1046_EQ1

1046DPEQ0

1046_I2C_EN

1046SSEQ0

CSBU2_1046

CSBU1_1046

CTX2P_C

CTX2N_C

CTX1P_C

CTX1N_C

CTX2N

CTX2P

CTX1P

CTX1N

DCI_CLK

CAD_SNK

POL

1046_3P3V

BOARD_3P3V BOARD_3P3V

BOARD_3P3V BOARD_3P3V

BOARD_3P3V BOARD_3P3V

BOARD_3P3V

LDO_1V8D

1046_3P3V

1046_3P3V

1046_3P3V

BOARD_3P3V1046_3P3V

SSRXP_UP pg3SSRXM_UP pg3

SSTXP_UP pg3SSTXM_UP pg3

I2C_SCL_Ext pg4

1046_DP_AUXPpg31046_DP_AUXNpg3

POLpg3,4

I2C_SDA_Ext pg4I2C_SDA1046 pg4

CSBU1_1046 pg3

CSBU2_1046 pg3

I2C_SCL1046 pg4

CRX2P pg3

CRX2N pg3

CRX1N pg3

CRX1P pg3

CTX2P pg3

CTX2N pg3

CTX1N pg3

CTX1P pg3

APU_DP_TX0Ppg3

APU_DP_TX0Npg3

APU_DP_TX1Ppg3

APU_DP_TX1Npg3

APU_DP_TX2Ppg3

APU_DP_TX2Npg3

APU_DP_TX3Ppg3

APU_DP_TX3Npg3

AMSELpg4

1046_ENpg4HPD_OUTpg2,3,4

HPD_OUT pg2,3,4

R1161K +/- 5%

LP5

R156 0

R113 NC, 0

R720

R153NC,4.7K

LP3

C32 0.1uF0201

JMP5

4 Pin-T Berg Jumper

123

4

C260.1uF

R155 NC, 0

R165 0

R730

JMP1

4 Pin-T Berg Jumper

123

4

R15410K

C33 0.1uF0201

C28 0.1uF0201

C34

10uF

JMP6

4 Pin-T Berg Jumper

123

4

R149 DNI, 20

SW1

4-POS 50-MIL SMT

11

22

33

44

55667788

JMP7

4 Pin-T Berg Jumper

123

4

FB4

220 @ 100MHZ

R18NC,10K

C29 0.1uF0201

R1321K +/- 5%

C270.1uF

R740

R12720K +/- 5%

R1171K +/- 5%

R164 0

R12520K +/- 5%

R1231K +/- 5%

R150 DNI, 20

R194.7K

R12120K +/- 5%

R1201K +/- 5%

LP4

C30 0.1uF0201

R104 0

R1020

R1241K +/- 5%

J16

NC, HEADER 2

12

C350.1uF

R162 DNI, 0

R1341K +/- 5%

C31 0.1uF0201

R1191K +/- 5%

R13120K +/- 5%

J17

NC, HEADER 2

12

R1221K +/- 5%

C360.1uF

R163 0

R1291K +/- 5%

R1261K +/- 5%

R1141K +/- 5%

R174.7K

JMP2

4 Pin-T Berg Jumper

123

4

R1301K +/- 5%

JMP3

4 Pin-T Berg Jumper

123

4

JMP4

4 Pin-T Berg Jumper

123

4

R151NC,10K

R11520K +/- 5%

R103NC,10K

R1281K +/- 5%

R11820K +/- 5%

R13320K +/- 5%

TUSB1046

U1

DP0P9

DP0N10

SSEQ0_A011

DP1P12

DP1N13

DPEQ0_A114

DP2P15

DP2N16

I2C_EN17

DP3P18

DP3N19

VCC20

CAD_SNK/DCI_DAT/EN29

RX1P30

RX1N31

HPDIN/DCI_CLK32

TX1P33

TX1N34

EQ135

TX2N36

TX2P37

EQ038

RX2N39

RX2P40

GND41

VC

C1

DP

EQ

12

SS

EQ

13

SS

RX

N4

SS

RX

P5

VC

C6

SS

TX

N7

SS

TX

P8

FLIP

_S

CL

21

CT

L0_S

DA

22

CT

L1/H

PD

IN23

AU

XP

24

AU

XN

25

SB

U2

26

SB

U1

27

VC

C28

R152NC,4.7K

Copyright © 2016, Texas Instruments Incorporated

TUSB546EVM Schematics www.ti.com

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TUSB546 USB Type-C™ Enabler EVM

Figure 4 through Figure 7 show the EVM schematics.

Figure 4. TUSB546EVM Schematics (1 of 4)

Page 7: TUSB546 USB Type-C Enabler EVM - TI.com

ML1N

ML1P

ML3P

ML3N

ML2N

ML2P

ML0P

ML0N

DisplayPort Source Connection

A10

VBUS

GND

A11

A12

SSRXP1SSRXP2

SSRXN1SSRXN2

B9

B8

B7

B6

B5

B4

B3

B2

B1

AUXP

DN2

SBU2

GND

VBUS

B12

B11

B10

CC1

GND

AUXP

DP1

DN1

AUXNSBU1

VBUS

SSTXP1SSTXP2

SSTXN1SSTXN2

SSRXP2SSRXP1

SSRXN2SSRXN1

AUXN

DP2

SSTXP2SSTXP1

SSTXN2SSTXN1

GND

VBUS

CC2

TypeC Connector and SourcePin Mapping

ML0N

ML0P

ML2P

ML2N

ML3N

ML3P

ML1P

ML1N

A1

A2

A3

A4

A5

A6

A7

A8

A9

NOTE: ALL DIFF PAIRS AREROUTED 85 TO 90 OHMSDIFFERENTIAL AND 50 OHMSCOMMON MODE. ALL OTHERTRACES ARE 50 OHM.

GND

HPD

Test PurposeHeaders andOptions

place near J2 Type-C connector

SILKSCREEN

GND

GND

GND

SILKSCREEN: DP_PWR

ESDComponents

Share Pads:R11 and R12

Share Pads:R9 and R10

SILKSCREEN:

5V_IN

USB HostConnection

USB and DP Connectors

TUSB546 - INT017A USB-C(TM) Enabler Board

APU_DP_TX3PAPU_DP_TX3N

APU_DP_TX2PAPU_DP_TX2N

APU_DP_TX0PAPU_DP_TX0NAPU_DP_TX1P

APU_DP_TX1N

APU_CFG1P

HPD

APU_DP_AUXPAPU_DP_AUXN

CSBU1CSBU2

HPD

DP_PWR

APU_CFG2MHPD_OUT

C_CC1C_CC2

C_CC1

C_CC2

CTX1NCTX1P

CRX1NCRX1P

C_CC1C_CC2

CSBU1CSBU2

C_CC1C_CC2

CSBU1CSBU2

CTX1NCTX1P

CRX1NCRX1P

C_T_DMC_T_DP

C_B_DPC_B_DM

CRX2PCRX2N

CTX2NCTX2P

CTX2NCTX2P

CRX2NCRX2P

C_USB_TNC_USB_TP

C_USB_BPC_USB_BN

C_USB_TNC_USB_TP

C_USB_BNC_USB_BP

APU_DP_AUXP APU_DP_AUXN

APU_CFG1P

5V_COM

SSRXP_UPSSRXM_UP

SSTXP_UPSSTXM_UP

C_CC2

C_CC1

APU_DP_AUXNAPU_DP_AUXP

POL

BOARD_3P3V BOARD_3P3V

BOARD_3P3V

TypeC_VBUS

BOARD_3P3V BOARD_3P3V

5V_COMVBUS_TYPEB

C_CC1 pg4C_CC2 pg4

HPD_OUT pg2,4

CSBU1_65982 pg4

CSBU2_65982 pg4C_USB_TP pg4C_USB_TN pg4

C_USB_BP pg4C_USB_BN pg4

APU_DP_TX2N pg2APU_DP_TX2P pg2

APU_DP_TX0N pg2APU_DP_TX0P pg2

APU_DP_TX3Npg2APU_DP_TX3Ppg2

APU_DP_TX1Npg2APU_DP_TX1Ppg2

CTX2P pg2CTX2N pg2

CTX1N pg2CTX1P pg2

CRX2P pg2CRX2N pg2

CRX1N pg2CRX1P pg2

SSRXM_UPpg2SSRXP_UPpg2

SSTXM_UPpg2SSTXP_UPpg2

CSBU1_1046 pg2CSBU2_1046 pg2

AUXP_65982 pg4AUXN_65982 pg4

1046_DP_AUXP pg21046_DP_AUXN pg2

HPD pg4

DM_UPpg4DP_UPpg4

POL pg2,4

J3 DP SINK-SIDE CONNECTOR

ML_LANE3(n)1

GND2

ML_LANE3(p)3

ML_LANE2(n)4

GND45

ML_LANE2(p)6

ML_LANE1(n)7

GND18

ML_LANE1(p)9

ML_LANE0(n)10

GND311

ML_LANE0(p)12

CONFIG113

CONFIG214

AUX_CH(p)15

GND216

AUX_CH(n)17

HPD18

RTN_DP_PWR19

DP_PWR20

21

Shld

22

Shld

23

Shld

24

Shld

R9 0

R4

NC, 10K

D2

LED Green 0805

TP4

NC, TEST POINT

1

D1

PMEG3050EP, 115

12

U2

TPD4E05U06

D1+1

D1-2

GND3

D2+4

D2-5

NC66NC77GND8NC99NC1010

R1

NC, 10K

R25

330

0402

5%

TP1

TEST POINT

1

J2

TypeC_Receptacle_DualSMT_TOP

GND0A1

SSTXP1A2

SSTXN1A3

VBUS1A4

CC1A5

DP1A6DN1A7

SBU1A8

VBUS2A9

SSRXN2A10SSRXP2A11

GND1A12

GND2B1

SSTXP2B2

SSTXN2B3

VBUS3B4

CC2B5

DP2B6

DN2B7

SBU2B8

VBUS4B9

SSRXN1B10SSRXP1B11

GND3B12

Shield11 Shield22 Shield33 Shield44 Shield55 Shield66

Shield88

Shield77

Shield1010

Shield99

R107 NC, 0

U5

TPD4E05U06

D1+1

D1-2

GND3

D2+4

D2-5

NC66NC77GND8NC99NC1010

TP6

TEST POINT

1

C210uF

R7 NC, 0

R3 NC, 0

U3

TPD4E05U06

D1+1

D1-2

GND3

D2+4

D2-5

NC66NC77GND8NC99NC1010

R105 0

TP5

TEST POINT

1

R108 NC, 0

R20

NC, 100k

TP7

TEST POINT

1

R10 NC, 0

R15 0

R77

NC, 1M

R2

NC, 1M

U4

TPD4E05U06

D1+1

D1-2

GND3

D2+4

D2-5

NC66NC77GND8NC99NC1010

R21

NC, 100k

R6 NC, 0

TP2

TEST POINT

1

C1

10uF

R16 0

R106 0

R78

NC, 1M

R24

NC, 5M

TP3

TEST POINT

1

R12 0

R5

NC, 1M

J4

USB3_TYPEB_CONNECTOR

VBUS1

DM2

DP3

GND4

SSTXN5

SSTXP6

GND7

SSRXN8

SSRXP9

SHIELD010

SHIELD111

R75

NC, 1M

R22 DNI, 0

R11 0

R76

NC, 1M

R23 0

J1

12

R8 0

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TUSB546 USB Type-C™ Enabler EVM

Figure 5. TUSB546EVM Schematics (2 of 4)

Page 8: TUSB546 USB Type-C Enabler EVM - TI.com

GND

982_3V3

TPS65982PDController

NOTE: OPEN by default

PD CTRL

SILKSCREEN:

GPIO1

DEBUG3

DEBUG4

I2CADDR

DBGCTL1

DBGCTL2

BUSPWRz

SILKSCREEN:

SILKSCREEN: PD Test Headers

Pad Sharing

SILKSCREEN: PD Test Headers

SILKSCREEN:

SILKSCREEN:

PDRST

MRST

Place near the edge

KeilDebuggerHeader

SPIProgrammingHeader

SILKSCREEN:

SPI

NOTE: ALL DIFF PAIRS AREROUTED 85 TO 90 OHMSDIFFERENTIAL AND 50 OHMSCOMMON MODE. ALL OTHERTRACES ARE 50 OHM.

Pad Sharing

TUSB546 - INT017A USB-C(TM) Enabler Board

17309_D

HV

_G

AT

E1

HV_GATE2

17309_S

65982_VBUS

GPIO0GPIO1GPIO2GPIO3GPIO6GPIO7GPIO8

LDO_1V8ALDO_BMC

GPIO4_HPDGPIO5_HPD

DEBUG1DEBUG2

DEBUG4DEBUG3

LSX_R2PLSX_P2R

SPI_MOSISPI_CLK

SPI_SSZSPI_MISO

SWD_CLKSWD_DAT

UART_RXUART_TX

I2C_SCL1I2C_SDA1

I2C_ADDR

I2C_IRQ1Z

I2C_SCL2I2C_SDA2

I2C_IRQ2Z

PD_RESETZPD_MRESET

PD_BUSPWRZ

SPI_SSZSPI_MISOSPI_MOSISPI_CLKSPI_HOLD#

SPI_WP#

PD_SYS_RST

I2C_ADDR

GPIO1DEBUG3DEBUG4

DBG_CTL1DBG_CTL2PD_BUSPWRZ

GPIO1_HDEBUG3_HDEBUG4_H

DBG_CTL1_HDBG_CTL2_HPD_BUSPWRZ_3V3PD_BUSPWRZ_1V8

982_CC1982_CC2

J15.8 PD_RESETZ

J15.10 I2C_SCL1

GPIO5_HPDSPI_SSZSWD_DATSWD_CLK

SWD_DAT

DEBUG2DEBUG4

DBG_CTL2

AUXP_65982AUXN_65982

GPIO0

LSX_P2RLSX_R2P

J15_1J15_3

GPIO6_8

DEBUG1DEBUG3

GPIO4_HPD

PD_MRESET

GPIO8GPIO6

SPI_MISOSPI_MOSI

I2C_IRQ1ZSPI_SSZ

DEBUG1_3

DEBUG2_4

I2C_SCL2

I2C_SDA2

I2C_SCL1046

I2C_SDA1046

I2C_SCL1

I2C_SDA1

UART_RXUART_TX

I2C_SDA1

I2C_IRQ2Z

J17_11J17_13

I2C_SCL2

I2C_SDA2

I2C_SCL1

I2C_SDA1J17_17

PD_SYS_RST

PD_MRESETSWD_CLKSWD_DAT

I2C_SCL2

I2C_SDA2

I2C_SCL1

I2C_SDA1SPI_MISOSPI_CLK SPI_MOSISPI_SSZ

GPIO1

GPIO2GPIO0

I2C_SCL_Ext

I2C_SDA_Ext

GPIO1

SPI_CLKJ17_13

J17_18J17_20

1046_EN

AMSEL

J17_12J17_14

GPIO7

GPIO3J17_12

J17_14

J17_16

SPI_MISOSPI_MOSI

J17_10

J17_16 DBG_CTL1

POL

J17_10 GPIO2HPD

J17_11

I2C_SCL1046I2C_SDA1046

DBG_CTL1

DBG_CTL2

DBG_CTL1_RDBG_CTL2_R

BOARD_3P3V

LDO_3V3

LDO_3V3LDO_3V3

LDO_1V8D

LDO_3V3

VOUT_3V3

BOARD_12V

BOARD_20V

65982_5V

65982_3P3V

TypeC_VBUS

LDO_1V8DLDO_3V3

5V_COM

BOARD_20V

BOARD_12V

5V_COM

SYS_DC_OUT

5V_COM LPad_5V

LPad_3P3V

BOARD_3P3V

BOARD_3P3V65982_3P3V

BOARD_3P3V

TypeC_VBUS

LPad_5V LPad_5VLPad_3P3V

C_USB_TP pg3C_USB_TN pg3

C_USB_BP pg3C_USB_BN pg3

CSBU1_65982 pg3CSBU2_65982 pg3

C_CC1 pg3,4C_CC2 pg3,4

DP_UPpg3DM_UPpg3

AUXP_65982pg3AUXN_65982pg3

HPD_OUTpg2,3

I2C_SCL1046pg2

I2C_SDA1046pg2

POL pg2,3AMSEL pg21046_EN pg2

I2C_SCL_Extpg2

I2C_SDA_Extpg2

C_CC1 pg3,4

C_CC2 pg3,4

HPD pg3

R80 NC, 0

C80.1uF

R136 NC, 0

R67 0

R32NC, 0

R62 3.3K

R90 NC, 0

C201uF

R421K

R109 0

D5

PMEG3050EP, 115

12

C220.01uF

R13 0

C141uF

R36 15K

R94 0

R401K

R101 NC, 0

R146 NC, 0

R79 NC, 0

R85 NC, 0

R68 0

LP1

R38 NC, 0

D6

DNI, PMEG3050EP, 115

12

R46100K

R110 0

C110.01uF

R65100K

R158 NC, 0

R82 NC, 0

R14 0

J7

Header 5x2 0.1" RA thru-hole

246810

13579

R441K

R81

NC, 0R

R97 NC, 0

R87 NC, 0

R160 0

R86 NC, 0

J6

NC, HEADER 2

12

R391K

R111 0

D3

B340A-13-F

R159 NC, 0

R95 0

C90.01uF

R50100K

C310uF

R141 NC, 0

R161 0

R157

NC, 0R

R661K

R431K

LP2

R26

0.01, 1%, 0.25W

R35 0

R96 0

R143 0

TP8

TEST POINT

1

TP9

TEST POINT

1

R142 NC, 0

R88 NC, 0

R112 0

C510uF

R573.3K

U7

W25Q80

/CS1

DO2

/WP3

GND4VCC8

CLK6 DI5

/HOLD7

C100.01uF

J5

NC, HEADER 2

12

R451K

J12

NC, HDR10x2 M .1 Receptacle

31 2

45 67 89 10

11 1213 1415 1617 1819 20

R98 NC, 0

SW4SWITCH SPST-NO

14

23

R91 NC, 0

R138 0

FB3

21 @ 100MHZ

C210.01uF

J18

12

R144 0

R37 0

R47100K

R99 0

SW3B3SN-3012

1 4

2 3

C1710uF

C15220pF

R280

CSD17309Q3

Q1

4321 8

765

9

R583.3K

R59 3.3K

J15

NC, HEADER 2

12

J8

Header 5x2 0.1" Shroud RA thru-hole

246810

13579

R92 0

R147 0

R31 0

R5310K

R60 3.3K

R543.3K

C181uF

C1310uF

R63 3.3KR553.3K

R5610K

C191uF

R148 NC, 0

R29 0

R411K

FB1

21 @ 100MHZ

R89 0

SW28-POS 50-MIL SMT

12345678

161514131211109

C120.01uFR34 0

R70 0

C60.1uF

C40.22uF

R33NC, 0

CSD17309Q3

Q2

43218

765

9

R139 0

R61 NC, 3.3K

R30 0

R51100K

R100 NC, 0

R137 0

J14

12

R48100K

C722uF

R641K

J11

NC, HDR10x2 M .1 Receptacle

31 2

45 67 89 10

11 1213 1415 1617 1819 20

R83 NC, 0

R69 0

R270

R135 NC, 0

C16220pF

R93 0

FB2

220 @ 100MHZ

R140 0

R52NC, TBD

U6

TPS65982

GN

DA

1

LDO_1V8DA2

SPI_CLKA3

SPI_MISOA4

I2C_SDA2A5

PP_HV1A6

PP_HV2A7

PP_HV3A8

HV

_G

AT

E2

A9

SE

NS

EN

A1

0

PP_5V0_2A11

VDDIOB1

GPIO0B2

SPI_SSZB3

SPI_MOSIB4

I2C_SCL2B5

I2C_IRQ2ZB6

PP_HV4B7

GN

DB

8

HV

_G

AT

E1

B9

SE

NS

EP

B1

0

PP_5V0_1B11

I2C_IRQ1ZC1

GPIO1C2GPIO4

C10

PP_5V0_3C11

I2C_SDA1D1

I2C_SCL1D2

DBG_CTL2D5H

RE

SE

TD

6

GPIO7D7

GN

DD

8

GPIO2D10

PP_5V0_4D11

LDO_BMCE1

UART_TXE2

DBG_CTL1E4

GN

DE

5

GN

DE

6

GN

DE

7

GN

DE

8

GPIO5E10

MRESETE11

I2C_ADDRF1

UART_RXF2

SWD_DATF4

GN

DF

5

GN

DF

6

GN

DF

7

GN

DF

8

BUSPOWERZF10

RESETZF11

LDO_3V3G1

R_OSCG2

SWD_CLKG4G

ND

G5

GN

DG

6

GN

DG

7

GN

DG

8

GPIO6G10GPIO3G11

VIN_3V3H1

VOUT_3V3H2

GN

DH

4

GN

DH

5

GPIO8H6

SS

H7

GN

DH

8

PP_CABLEH10

VBUS1H11

AUX_PJ1

AUX_NJ2

VBUS2J10VBUS3J11

LDO_1V8AK1

DEBUG2K2

DEBUG4K3

LSX_P2RK4

USB_RP_NK5

C_USB_TPK6

C_USB_BPK7

C_SBU1K8

RPD_G1K9

RPD_G2K10

VBUS4K11

GN

DL

1

DEBUG1L2

DEBUG3L3

LSX_R2PL4

USB_RP_PL5

C_USB_TNL6

C_USB_BNL7

C_SBU2L8

C_CC1L9

C_CC2L10

NCL11

D4

PMEG3050EP, 115

12

R145 0

R49100K

R84 NC, 0

Copyright © 2016, Texas Instruments Incorporated

TUSB546EVM Schematics www.ti.com

8 SLLU251–August 2016Submit Documentation Feedback

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TUSB546 USB Type-C™ Enabler EVM

Figure 6. TUSB546EVM Schematics (3 of 4)

Page 9: TUSB546 USB Type-C Enabler EVM - TI.com

NOTE: POPULATE JUMPER BY DEFAULT

Power

20V DC_OUTSILKSCREEN:

SILKSCREEN:

5V_IN

5V DC Input

TUSB546 - INT017A USB-C(TM) Enabler Board

U3_SW

U3_PG

5V_IN

BOARD_3P3V

5V_COM

SYS_DC_OUT

5V_COM

J9

12R71

178K

C24

10uF

J10

DC_POWER_JACK

1

2

3

C23

10uF

J13

JPD1135-509-7F

POWER12

SENSE1

POWER23

GND14GND25

SHIELD16SHIELD27SHIELD38SHIELD49

L1

1uH

C25

22uF

D7

PMEG3050EP, 115

12

U8

TPS62082DSGT

VIN8

EN1

MODE3

GND2

Pw

Pd

9

FB4

VOS5

SW7

PG

6

Copyright © 2016, Texas Instruments Incorporated

www.ti.com TUSB546EVM Schematics

9SLLU251–August 2016Submit Documentation Feedback

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TUSB546 USB Type-C™ Enabler EVM

Figure 7. TUSB546EVM Schematics (4 of 4)

Page 10: TUSB546 USB Type-C Enabler EVM - TI.com

Bill of Materials www.ti.com

10 SLLU251–August 2016Submit Documentation Feedback

Copyright © 2016, Texas Instruments Incorporated

TUSB546 USB Type-C™ Enabler EVM

4 Bill of MaterialsTable 5 lists the TUSB546EVM bill of materials (BOM).

Table 5. TUSB546 EVM Bill of Materials

Item Qty Reference Part Manufacturer Manufacturer Part Number PCB Footprint1 9 C1,C2,C3,C5,C13,C17,C23,C24

,C3410uF Murata GRM188R61C106MA73D 603

2 1 C4 0.22uF Murata GRM152R61A224KE19D 4023 12 C6,C8,C26,C27,C28,C29,C30,C

31,C32,C33,C35,C360.1uF Murata GRM155R61A104KA01D 402

4 2 C7,C25 22uF Murata GRM188R60J226MEA0D 6035 6 C9,C10,C11,C12,C21,C22 0.01uF Murata GRM155R71C103KA01D 4026 4 C14,C18,C19,C20 1uF Murata GRM155R60J105ME19D 4027 2 C15,C16 220pF Murata GRM1555C1H221JA01D 4028 5 D1,D4,D5,D6,D7 SCHOTTKY NXP PMEG3050EP,115 SOD-1289 1 D2 LED Green 0805 Lumex SML-LX0805GC-TR 80510 1 D3 B340A-13-F Diodes Inc B340A-13-F11 2 FB1,FB3 21 @ 100MHZ Taiyo Yuden FBMJ2125HM210NT12 2 FB2,FB4 220 @ 100MHZ MuRata BLM18EG221SN1D13 7 JMP1,JMP2,JMP3,JMP4,JMP5,

JMP6,JMP74 Pin-T Berg Jumper berg2x3tee

14 4 J1,J9,J14,J18 CON02 FCI 68001-402HLF HDR_THVT_1X2_100_M15 1 J2 TypeC_Receptacle_DualSMT_T

OPFoxconn UT12113-11601-7H USB_TYPEC_UT1211

16 1 J3 DP SINK-SIDE CONNECTOR Molex Inc 472720001 con_DP_SD-47272-00117 1 J4 USB3_TYPEB_CONNECTOR Amphenol Commercial Products GSB4211311WEU usb3_typeb_ak4aa00918 5 J5,J6,J15,J16,J17 NC, HEADER 2 Omron Electronics Inc-EMC Div XG8T-0231 berg1x219 1 J7 Header 5x2 0.1" RA thru-hole FCI 68021-210HLF HDR_THRT_6802020 1 J8 Header 5x2 0.1" Shroud RA

thru-hole3M 20210-5002HB HDR_THRT_2X5_100

21 1 J10 DC_PWR_JACK CUI Inc. PJ-202AH pj-202ah22 2 J11,J12 NC, HDR10x2 M .1 Receptacle Sullins PPPC102LFBN-RC HDR_THVT_2x10_100_F23 1 J13 JPD1135-509-7F Foxconn JPD1135-509-7F Jack_THRT_JPD113524 2 LP1,LP5 LP Keystone Electronics 5011 THM Test Point25 3 LP2,LP3,LP4, Keystone Electronics 5010 THM Test Point26 1 L1 1uH Taiyo Yuden NR3015T1R0N IND_NR301527 2 Q1,Q2 MOS_P_4D_3S Texas Instruments CSD17309Q3 Q3_SON-8

Page 11: TUSB546 USB Type-C Enabler EVM - TI.com

www.ti.com Bill of Materials

11SLLU251–August 2016Submit Documentation Feedback

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TUSB546 USB Type-C™ Enabler EVM

Table 5. TUSB546 EVM Bill of Materials (continued)Item Qty Reference Part Manufacturer Manufacturer Part Number PCB Footprint28 2 R1,R4 NC, 10K Panasonic Electronic Components ERJ-2GEJ103X 40229 6 R2,R5,R75,R76,R77,R78 NC, 1M Panasonic Electronic Components ERJ-2GEJ105X 40230 34 R3,R6,R7,R10,R32,R33,R38,R7

9,R80,R82,R83,R84,R85,R86,R87,R88,R90,R91,R97,R98,R100,R101,R107,R108,R113,R135,R136,R141,R142,R146,R148,R155,R158,R159

NC, 0 Panasonic Electronic Components ERJ-2GE0R00X 402

31 53 R8,R9,R11,R12,R13,R14,R15,R16,R23,R27,R28,R29,R30,R31,R34,R35,R37,R67,R68,R69,R70,R72,R73,R74,R89,R92,R93,R94,R95,R96,R99,R102,R104,R105,R106,R109,R110,R111,R112,R137,R138,R139,R140,R143,R144,R145,R147,R156,R160,R161,R163,R164,R165

0 Panasonic Electronic Components ERJ-2GE0R00X 402

32 2 R17,R19 4.7K Panasonic Electronic Components ERJ-2GEJ472X 40233 3 R18,R103,R151 NC,10K Panasonic Electronic Components ERJ-2GEJ103X 40234 2 R20,R21 NC, 100k Panasonic Electronic Components ERJ-2GEJ104X 40235 2 R22,R162 DNI, 0 Panasonic Electronic Components ERJ-1GN0R00C 20136 1 R24 NC, 1M Panasonic Electronic Components ERJ-1GEF1004C 20137 1 R25 330 Panasonic Electronic Components ERJ-2GEJ331X 40238 1 R26 0.01, 1%, 0.25W Panasonic Electronic Components ERJ-6BWFR010V 80539 1 R36 15K Panasonic Electronic Components ERJ-2RKF1502X 40240 9 R39,R40,R41,R42,R43,R44,R45

,R64,R661K Panasonic Electronic Components ERJ-2GEJ102X 402

41 7 R46,R47,R48,R49,R50,R51,R65 100K Panasonic Electronic Components ERJ-2GEJ104X 40242 1 R52 NC, 100 Panasonic Electronic Components ERJ-2GEJ101X 40243 3 R53,R56,R154 10K Panasonic Electronic Components ERJ-2GEJ103X 40244 8 R54,R55,R57,R58,R59,R60,R62

,R633.3K Panasonic Electronic Components ERJ-2GEJ332X 402

45 1 R61 NC, 3.3K Panasonic Electronic Components ERJ-2GEJ332X 40246 1 R71 178K Panasonic Electronic Components ERJ-3EKF1783V 60347 2 R81,R157 NC, 0R Vishay Dale RCL12250000Z0EG 251248 14 R114,R116,R117,R119,R120,R1

22,R123,R124,R126,R128,R129,R130,R132,R134

1K +/- 5% Panasonic Electronic Components ERJ-2GEJ102X 402

Page 12: TUSB546 USB Type-C Enabler EVM - TI.com

Bill of Materials www.ti.com

12 SLLU251–August 2016Submit Documentation Feedback

Copyright © 2016, Texas Instruments Incorporated

TUSB546 USB Type-C™ Enabler EVM

Table 5. TUSB546 EVM Bill of Materials (continued)Item Qty Reference Part Manufacturer Manufacturer Part Number PCB Footprint49 7 R115,R118,R121,R125,R127,R1

31,R13320K +/- 5% Panasonic Electronic Components ERJ-2GEJ203X 402

50 2 R149,R150 DNI, 20 Panasonic Electronic Components ERJ-2GEJ200X 40251 2 R152,R153 NC,4.7K Panasonic Electronic Components ERJ-2GEJ472X 40252 1 SW1 4-POS 50-MIL SMT CampersandK(ITT-CANNON) TDA04H0SB1R sw_smvt_dip_4pos_853 1 SW2 8-POS 50-MIL SMT CampersandK(ITT-CANNON) TDA08H0SB1R SW_SMVT_SPST_TDA0854 1 SW3 Pushbutton Switch Omron Electronics Inc-EMC Div B3SN-3012P switch_b3sn55 1 SW4 SWITCH SPST-NO CampersandK Components KMT221G HF LFS kmt2_switch56 8 TP1,TP2,TP3,TP5,TP6,TP7,TP8

,TP9TEST POINT Samtec HTSW-101-07-G-S berg1x1

57 1 TP4 NC, TEST POINT Keystone Electronics 1035 berg1x158 1 U1 TUSB546 Texas Instruments TUSB54659 4 U2,U3,U4,U5 TPD4E05U06 Texas Instruments TPD4E05U06 DQA60 1 U6 TPS65982 Texas Instruments TPS65982 ZQZ_BGA_9661 1 U7 W25Q80 WINBOND W25Q80DVSNIG SOIC_8_197x157_5062 1 U8 TPS62082DSGT Texas Instruments TPS62082DSGT dsg

Page 13: TUSB546 USB Type-C Enabler EVM - TI.com

STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or

documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein.Acceptance of the EVM is expressly subject to the following terms and conditions.1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility

evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are notfinished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. Forclarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditionsset forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software

1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or productionsystem.

2 Limited Warranty and Related Remedies/Disclaimers:2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software

License Agreement.2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM

to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatmentby an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in anyway by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications orinstructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or asmandated by government requirements. TI does not test all parameters of each EVM.

2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during thewarranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects torepair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shallbe warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) daywarranty period.

3 Regulatory Notices:3.1 United States

3.1.1 Notice applicable to EVMs not FCC-Approved:This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kitto determine whether to incorporate such items in a finished product and software developers to write software applications foruse with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unlessall required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not causeharmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit isdesigned to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority ofan FCC license holder or must secure an experimental authorization under part 5 of this chapter.3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:

CAUTIONThis device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may notcause harmful interference, and (2) this device must accept any interference received, including interference that may causeundesired operation.Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority tooperate the equipment.

FCC Interference Statement for Class A EVM devicesNOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 ofthe FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment isoperated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if notinstalled and used in accordance with the instruction manual, may cause harmful interference to radio communications.Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required tocorrect the interference at his own expense.

SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

Page 14: TUSB546 USB Type-C Enabler EVM - TI.com

FCC Interference Statement for Class B EVM devicesNOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 ofthe FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residentialinstallation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordancewith the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interferencewill not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, whichcan be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or moreof the following measures:

• Reorient or relocate the receiving antenna.• Increase the separation between the equipment and receiver.• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.• Consult the dealer or an experienced radio/TV technician for help.

3.2 Canada3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210

Concerning EVMs Including Radio Transmitters:This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:(1) this device may not cause interference, and (2) this device must accept any interference, including interference that maycause undesired operation of the device.

Concernant les EVMs avec appareils radio:Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitationest autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doitaccepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.

Concerning EVMs Including Detachable Antennas:Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna typeand its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary forsuccessful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna typeslisted in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibitedfor use with this device.

Concernant les EVMs avec antennes détachablesConformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type etd'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillageradioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotroperayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Leprésent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans lemanuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antennenon inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation del'émetteur

3.3 Japan3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に

輸入される評価用キット、ボードについては、次のところをご覧ください。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page

3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certifiedby TI as conforming to Technical Regulations of Radio Law of Japan.

If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law ofJapan to follow the instructions below with respect to EVMs:1. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal

Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule forEnforcement of Radio Law of Japan,

2. Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect toEVMs, or

3. Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japanwith respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please notethat if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.

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【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けていないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用

いただく。2. 実験局の免許を取得後ご使用いただく。3. 技術基準適合証明を取得後ご使用いただく。

なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ

ンスツルメンツ株式会社東京都新宿区西新宿6丁目24番1号西新宿三井ビル

3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page

SPACER4 EVM Use Restrictions and Warnings:

4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOTLIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.

4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handlingor using the EVM, including without limitation any warning or restriction notices. The notices contain important safety informationrelated to, for example, temperatures and voltages.

4.3 Safety-Related Warnings and Restrictions:4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user

guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable andcustomary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to inputand output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, orproperty damage. If there are questions concerning performance ratings and specifications, User should contact a TIfield representative prior to connecting interface electronics including input power and intended loads. Any loads appliedoutside of the specified output range may also result in unintended and/or inaccurate operation and/or possiblepermanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting anyload to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuitcomponents may have elevated case temperatures. These components include but are not limited to linear regulators,switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using theinformation in the associated documentation. When working with the EVM, please be aware that the EVM may becomevery warm.

4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with thedangers and application risks associated with handling electrical mechanical components, systems, and subsystems.User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronicand/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safelylimit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility andliability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors ordesignees.

4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes allresponsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility andliability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and localrequirements.

5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurateas possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites asaccurate, complete, reliable, current, or error-free.

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SPACER6. Disclaimers:

6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THEDESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHERWARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANYTHIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.

6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS ANDCONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANYOTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRDPARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANYINVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OFTHE EVM.

7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITSLICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANYHANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATIONSHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANYOTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.

8. Limitations on Damages and Liability:8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,

INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESETERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HASBEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITEDTO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODSOR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALLBE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.

8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATIONARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVMPROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDERTHESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCEOF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS ANDCONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.

9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not ina resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicableorder, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),excluding any postage or packaging costs.

10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating tothese terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive reliefin any United States or foreign court.

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2015, Texas Instruments Incorporated

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IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and otherchanges to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latestissue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current andcomplete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of salesupplied at the time of order acknowledgment.TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s termsand conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessaryto support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarilyperformed.TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products andapplications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provideadequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, orother intellectual property right relating to any combination, machine, or process in which TI components or services are used. Informationpublished by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty orendorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of thethird party, or a license from TI under the patents or other intellectual property of TI.Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alterationand is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altereddocumentation. Information of third parties may be subject to additional restrictions.Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or servicevoids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirementsconcerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or supportthat may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards whichanticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might causeharm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the useof any TI components in safety-critical applications.In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is tohelp enable customers to design and create their own end-product solutions that meet applicable functional safety standards andrequirements. Nonetheless, such components are subject to these terms.No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the partieshave executed a special agreement specifically governing such use.Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use inmilitary/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI componentswhich have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal andregulatory requirements in connection with such use.TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use ofnon-designated products, TI will not be responsible for any failure to meet ISO/TS16949.

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Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2016, Texas Instruments Incorporated