lution of a rare earth metal salt selected from the group consisting of cerium salts and yt t r ium salts, wherein the chemical concentra- tion of rare earth metal salt is from about 10 to 350 mM.

T W O - C O A T C H I P - R E S I S T A N T E L E C T R O D E P O S I T E D C O A T I N G C O M P O S I T I O N U.S. Patent 6,248,225. June 19, 2001 T. Palaika et al., assignors to PPG Industries Ohio, Inc., Cleveland

A process of electrocoating electri- cally conductive substrates with two electrodeposited layers com- prising electrodepositing an elec- trically conductive coating from a composition comprising a curable ionic resin and an electroconduc- tive pigment; at least partially curing the electrodeposited coat- ing so as to make the coating elec- trically conductive; electrodepos- i t ing a second coating on the electr ically conductive coating, the second coating being depos- ited from a composition compris- ing a curable ionic polyurethane

resin that contains ionic salt ter- minal end groups and a polymeric segment derived from an active h y d r o g e n - c o n t a i n i n g polymer ; and curing the second coating.

M E T A L A L L O Y H A L I D E E L E C T R O P L A T I N G B A T H S U.S. Patent 6,248,228. June 19, 2001 H.D. Billman et al., assignors to Technic, Inc., and Specialty Chemical System, Inc., Cranston, R.I.

A method of improving the plat- ing performance of an aqueous halide ion electrolyte electroplat- ing bath comprising adding an ef- fective amount of a salt of an alkyl and/or alkanol sulfonic acid to the bath to operate the bath at higher current densities, where in the added salt is selected from the group consisting of alkali metal, alkaline earth metal, and ammo- nium or subst i tuted ammonium salts.

W I P E S O L V E N T P R O C E S S

U.S. Patent 6,248,403. June 19, 2001

J.D. Weir and J.S. McLaughlin, assignors to Northrop Grumman Corp., Los Angeles, Calif.

A non-chrome process for the pre- t rea tment of a substrate surface comprising bare aluminum or alu- minum alloy, which comprises de- oxidizing the substrate surface, wiping with a wipe solvent com- position consisting essentially of 95 to 99.9% by volume of at least one environmental ly-acceptable volatile organic solvent and 0.1 to 5% by volume of 3-glycidoxypro- py l t r imethoxy si lane polyfunc- tional coupling agent, which hy- drolyzes to form silanol groups having a bonding affinity for the substrate surface and for a paint p r imer coa t ing to be appl ied thereto.

A D H E S I V E F O R E L E C T R O L E S S P L A T I N G

U.S. Patent 6,248,428. June 19, 2001 M. Asai et al., assignors to Ibiden Co., Ltd., Gifu, Japan

An adhesive for electroless plat- ing formed by dispersing cured

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