ucc.colorado.eduucc.colorado.edu/allen-bradley/5000621.pdfBecause of the variety of uses for the products described in this publication, those responsible for the application and use

Pyramid Integrator

Design Manual

Allen-Bradley Automation

https://industrialautomation.co/product-category/allen-bradley/page/3045/

Because of the variety of uses for the products described in thispublication, those responsible for the application and use of this controlequipment must satisfy themselves that all necessary steps have been takento assure that each application and use meets all performance and safetyrequirements, including any applicable laws, regulations, codes andstandards.

The illustrations, charts, sample programs and layout examples shown inthis guide are intended solely for purposes of example. Since there aremany variables and requirements associated with any particularinstallation, Allen-Bradley does not assume responsibility or liability (to include intellectual property liability) for actual use based upon theexamples shown in this publication.

Allen-Bradley publication SGI-1.1, Safety Guidelines for the Application,Installation, and Maintenance of Solid State Control (available from yourlocal Allen-Bradley office), describes some important differences betweensolid-state equipment and electromechanical devices that should be takeninto consideration when applying products such as those described in thispublication.

Reproduction of the contents of this copyrighted publication, in whole orin part, without written permission of Allen-Bradley Company, Inc., isprohibited.

Throughout this manual we use notes to make you aware of safetyconsiderations:

ATTENTION: Identifies information about practices orcircumstances that can lead to personal injury or death, propertydamage or economic loss.

Attention statements help you to:

identify a hazard avoid the hazard recognize the consequences

Important: Identifies information that is critical for successful applicationand understanding of the product.

Important User Information

Summary of Changes

i

Summary of Changes

In general, we improved the format and added greater detail to this manual.The table below lists specific changes we made:

We have: To chapter/appendix:

added I/O scanner (RS5) information 1

added Color CVIM module and CVIM2 module information 2

re�organized this chapter to contain the general informationof the remote and local I/O

3

re�organized this chapter to contain the remote I/Oinformation only

4

added this chapter to contain the local I/O information only 5 (new chapter)

reflected the two new memory sizes for the logic processor 6

added the system faults for the RS5 scanner 10

re�organized and updated the information 14

included new information A

added this appendix to contain the I/O modules use ofdata table

B (new appendix)

We have re-organized and added new worksheets per the changes we made inthe manual.

To help you find new or updated information in this release of the manual, wehave included change bars as shown to the left of this paragraph.

Additional Information



Important User Information I. . . . . . . . . . . . . . . . . . . . . . . .

Summary of Changes �i. . . . . . . . . . . . . . . . . . . . . . . . . . . .

Additional Information �i. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Using this Manual iii. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Manual Objectives iii. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Who Should Use this Manual iii. . . . . . . . . . . . . . . . . . . . . . . . . . .

Preparing to Use this Manual iv. . . . . . . . . . . . . . . . . . . . . . . . . . .

How to Use this Manual vi. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Related Publications viii. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Terms and Conventions viii. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Catalog Numbers ix. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Overview of the PI System 1�1. . . . . . . . . . . . . . . . . . . . . . . . .

Chapter Objectives 1�1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

PI Concept 1�1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Basic PI Components 1�2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

PLC�5/250 Programmable Controller 1�18. . . . . . . . . . . . . . . . . . . . . .

CVIM Module 1�20. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

OSI Interface Module 1�23. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

EI Module 1�25. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

KA Module 1�25. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Information Processing 1�26. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

PI Configurations 1�30. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Fault Handling 1�31. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

PI Memory Structure 1�32. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Planning to Use the Vision Processor Modules 2�1. . . . . . . . .


Define the Vision Application 2�1. . . . . . . . . . . . . . . . . . . . . . . . . . . .

Prepare a Design Specification 2�1. . . . . . . . . . . . . . . . . . . . . . . . . .

Select CVIM, CVIM2 and Color CVIM Hardware 2�5. . . . . . . . . . . . . .

Plan for Module I/O 2�5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Plan for Module Installation 2�5. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Plan for Camera Power 2�6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

CVIM, CVIM2 and Color CVIM Specifications 2�6. . . . . . . . . . . . . . . .

Table of Contents

Table of Contentsii

Planning I/O Configuration 3�1. . . . . . . . . . . . . . . . . . . . . . . . .


Planning the I/O Links 3�1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Select 1771 I/O Modules 3�3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1771 I/O Addressing Concepts 3�4. . . . . . . . . . . . . . . . . . . . . . . . . .

More than 4096 I/O (Duplicate I/O Location Addressing) 3�8. . . . . . . .

Duplicate Addressing of Adjacent I/O Modules 3�9. . . . . . . . . . . . . . .

Duplicate Addressing of a Pair of I/O Chassis 3�10. . . . . . . . . . . . . . . .

Assign I/O Modules and Devices to Chassis and Channels 3�11. . . . . .

Select Power Supplies 3�15. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Record I/O Addresses 3�15. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

RS Specifications 3�15. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Planning to Use Remote I/O with the RS Module 4�1. . . . . . . .


Remote Block�Transfer Timing 4�1. . . . . . . . . . . . . . . . . . . . . . . . . .

Plan for Direct Communication Mode (Adapter Mode) 4�5. . . . . . . . . .

Specify RS Configuration 4�10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Planning to Use Local I/O with the RS5 Module 5�1. . . . . . . . .


Understanding Single�Transfers and Block�Transfers 5�1. . . . . . . . . .

Multiplexing Between Single�Transfer and Block�Transfer 5�3. . . . . . .

Calculating Single�Transfer Scan Time 5�4. . . . . . . . . . . . . . . . . . . . .

Calculating Worst�Case Block�Transfer Execution Time 5�4. . . . . . . . .

Planning to Use the LP Module 6�1. . . . . . . . . . . . . . . . . . . . .


Create a Design Specification 6�1. . . . . . . . . . . . . . . . . . . . . . . . . . .

Determine the Number of LP Modules You Need 6�3. . . . . . . . . . . . . .

Select Which LP 6�5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Select Memory for the RM Module 6�6. . . . . . . . . . . . . . . . . . . . . . . .

Provide Information to the Hardware Installer 6�6. . . . . . . . . . . . . . . .

Specify Configuration Parameters 6�7. . . . . . . . . . . . . . . . . . . . . . . .

LP Specifications 6�8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Planning to Use a MicroVAX Information Processor 7�1. . . . . .


Choose a MicroVAX Information Processor Configuration 7�1. . . . . . .

Select Software 7�3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Determine Disk Storage Requirements 7�3. . . . . . . . . . . . . . . . . . . .

Select Hardware 7�3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Create a Design Specification for the Application Program 7�3. . . . . . . Allen-Bradley Automation


Table of Contents iii

Provide Information to the Hardware Installer 7�5. . . . . . . . . . . . . . . .

Provide Information to the Software Installer 7�5. . . . . . . . . . . . . . . . .

MicroVAX Information Processor Specifications 7�5. . . . . . . . . . . . . .

Planning for Communication 8�1. . . . . . . . . . . . . . . . . . . . . . .


PI Communication 8�2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Choose Communication Options 8�2. . . . . . . . . . . . . . . . . . . . . . . . .

Configuring Communication Parameters 8�9. . . . . . . . . . . . . . . . . . .

Choose DH or DH+ Link (Channel 2 or Channel 3) 8�9. . . . . . . . . . . .

Plan Cable Layout and Select Hardware 8�10. . . . . . . . . . . . . . . . . . .

Specify Communication Needs for PLC Programmer 8�11. . . . . . . . . . .

Specify Switch Settings for DH/DH+ Communication 8�11. . . . . . . . . . .

Estimating DH/DH+ Network Performance 8�11. . . . . . . . . . . . . . . . . .

Channel 1 8�24. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Specify Configuration Parameters 8�25. . . . . . . . . . . . . . . . . . . . . . . .

Specify Switch Settings on the OSI Interface Module 8�27. . . . . . . . . . .

Ethernet/DECnet Link 8�28. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Privileges 8�29. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Communication Among PI Modules 8�32. . . . . . . . . . . . . . . . . . . . . . .

Planning Data Storage 8�33. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

DH+ Message Routing 9�1. . . . . . . . . . . . . . . . . . . . . . . . . . . .


Design Requirements for DH+ Message Routing 9�1. . . . . . . . . . . . .

Common Uses of DH+ Message Routing 9�2. . . . . . . . . . . . . . . . . . .

Using Basic and Advanced DH+ Message Routing 9�5. . . . . . . . . . . .

Completing Worksheets 9�8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Application Timeout 9�8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Communication Errors 9�9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Link Diagnostic Counters 9�10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Planning for PI Fault Handling 10�1. . . . . . . . . . . . . . . . . . . . . .


Types of Faults 10�1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

How the PI System Handles Minor Faults 10�7. . . . . . . . . . . . . . . . . . .

How the PI System Handles Major Faults 10�7. . . . . . . . . . . . . . . . . . .

How the PI System Handles Critical Faults 10�8. . . . . . . . . . . . . . . . . .

Select Responses to Major and Minor Faults 10�8. . . . . . . . . . . . . . . .

Specify User�Defined Faults 10�9. . . . . . . . . . . . . . . . . . . . . . . . . . . .

Specify Fault Routines 10�9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Plan for Fault Reporting 10�10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Table of Contentsiv

Selecting PI Hardware 11�1. . . . . . . . . . . . . . . . . . . . . . . . . . . .


Materials You Need 11�1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Selecting a PI Chassis 11�1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Assign Modules to Slots in Chassis 11�1. . . . . . . . . . . . . . . . . . . . . . .

Select a Power Supply 11�1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Select a Fan Assembly 11�2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Preparing Mounting Documentation 12�1. . . . . . . . . . . . . . . . .


What You Have Already Completed 12�1. . . . . . . . . . . . . . . . . . . . . . .

Determine the Positions of the Components 12�1. . . . . . . . . . . . . . . . .

Choose an Enclosure 12�17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Complete Mounting Diagram 12�17. . . . . . . . . . . . . . . . . . . . . . . . . . . .

Preparing Grounding Documentation 13�1. . . . . . . . . . . . . . . .


What You Must Ground 13�1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Follow these Guidelines 13�2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

If You Need More Grounding Information 13�3. . . . . . . . . . . . . . . . . . .

What the Hardware Installer Will Do 13�3. . . . . . . . . . . . . . . . . . . . . . .

Complete the Grounding Documentation 13�4. . . . . . . . . . . . . . . . . . .

Preparing ac Wiring Documentation 14�1. . . . . . . . . . . . . . . . .


What You Have Completed 14�1. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Raceway Layout Considerations 14�1. . . . . . . . . . . . . . . . . . . . . . . . .

Prepare ac Wiring Documentation 14�5. . . . . . . . . . . . . . . . . . . . . . . .

Power Distribution 14�5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Complete ac Wiring Documentation 14�12. . . . . . . . . . . . . . . . . . . . . . .

Surge�Suppression 14�14. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Ferrite Beads 14�18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Enclosure Lighting 14�18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Avoiding Unintentional Momentary Turn�on of Outputs 14�19. . . . . . . . . .



Table of Contents v

PLC�5/250 Instruction Execution Times and Memory Requirements A�1. . . . . . . . . . . . . . . . . . . . . . . .

I/O Modules Use of Data Table B�1. . . . . . . . . . . . . . . . . . . . . .

Appendix Objectives B�1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Worksheets

Worksheet 2.1Vision Application Questionnaire 1. . . . . . . . . . . . . . . . . . . . . .

Worksheet 2.2CVIM Information for Hardware Installer 5. . . . . . . . . . . . . . . . .

Worksheet 2.3CVIM Hardware 7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Worksheet 3.1Identify Chassis Locations 9. . . . . . . . . . . . . . . . . . . . . . . . . . .

Worksheet 3.2List I/O and Select Modules 11. . . . . . . . . . . . . . . . . . . . . . . . . .

Worksheet 3.3Tally I/O Modules 13. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Worksheet 3.4List All I/O Modules 15. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Worksheet 3.5Selecting Power Supplies 17. . . . . . . . . . . . . . . . . . . . . . . . . . .

Worksheet 3.6Assign Rack and Group Numbers 19. . . . . . . . . . . . . . . . . . . . .

Worksheet 3.7I/O Addresses 21. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Rules for I/O Image Addressing 21. . . . . . . . . . . . . . . . . . . . . . . .

Worksheet 3.8I/O Hardware 23. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Worksheet 4.1Assign I/O Modules to Remote I/O Chassis 25. . . . . . . . . . . . . . .

To Calculate Remote Block�Transfer Time: 25. . . . . . . . . . . . . . . . . .

Worksheet 4.2Calculate Worst Case Channel I/O Scan Time 27. . . . . . . . . . . . .

Worksheet 4.3RS Termination Resistors (RS2 only) 29. . . . . . . . . . . . . . . . . . .

Worksheet 4.4Configuration Parameters for RS 31. . . . . . . . . . . . . . . . . . . . . .

Worksheet 5.1Configuration Parameters for RS5 35. . . . . . . . . . . . . . . . . . . . .

Worksheet 6.1Logic Processors 37. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Worksheet 6.2Program Size and Execution Time 39. . . . . . . . . . . . . . . . . . . . .

Worksheet 6.3Estimate LP Performance 41. . . . . . . . . . . . . . . . . . . . . . . . . . .

Table of Contentsvi

Worksheet 6.4Select Memory Sizes for LP Modules and RM 43. . . . . . . . . . . . .

Worksheet 6.5LP Information for Hardware Installer 45. . . . . . . . . . . . . . . . . . .

Worksheet 6.6LP Configuration 47. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Worksheet 7.1Choosing Industrial Disks for the MicroVAX Information Processor(Cat. No. 5730�CPU1) 51. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Worksheet 7.2Hardware for the MicroVAX Information Processor(Cat. No. 5730�CPU1) 53. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Worksheet 7.3MicroVAX Information Processor (5730�CPU1)Information for the Hardware Installer 55. . . . . . . . . . . . . . . . . . .

Worksheet 7.4MicroVAX Information Processor (5730�CPU1)Information for the Software Installer 57. . . . . . . . . . . . . . . . . . . .

Worksheet 7.4 (continued)MicroVAX Information Processor (5730�CPU1)Information for the Software Installer 59. . . . . . . . . . . . . . . . . . . .

Worksheet 7.5Choosing Industrial Disks for the MicroVAX Information Processors EP and EE (Cat. Nos. 5731�CPU1, �CPU2) 61. . . . . . . . . . . . . . . . . . . . . . .

Worksheet 7.6Hardware for the MicroVAX Information Processors EP or EE(Cat. Nos. 5731�CPU1,�CPU2) 63. . . . . . . . . . . . . . . . . . . . . . . .

Worksheet 7.7MicroVAX Information Processor EP or EEInformation for the Hardware Installer 65. . . . . . . . . . . . . . . . . . .

Worksheet 7.8MicroVAX Information Processor EP or EEInformation for the Software Installer 67. . . . . . . . . . . . . . . . . . . .

Worksheet 8.1Setting Switches on the RM and KA module 71. . . . . . . . . . . . . .

Worksheet 8.2Setting Jumpers on the RM and KA Module 73. . . . . . . . . . . . . . .

Worksheet 8.3RM Installation 75. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Worksheet 8.4KA Module Installation 77. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Worksheet 8.5Information for PLC Programmer 79. . . . . . . . . . . . . . . . . . . . . .

Worksheet 8.6Parameters for CH 1 83. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Worksheet 8.6 (continued)Parameters for CH 1 89. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Worksheet 8.7Communications Parameters for CH 2 and CH 3 91. . . . . . . . . . . Allen-Bradley Automation


Table of Contents vii

Worksheet 8.8Privilege Classes 93. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Worksheet 8.9Record File Usage 95. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Worksheet 8.10Record Structure/Word/Bit Usage 97. . . . . . . . . . . . . . . . . . . . . .

Worksheet 8.11Determine Number of Required KA Modules 99. . . . . . . . . . . . . .

Worksheet 8.12Determine Station Number for DTL Port 101. . . . . . . . . . . . . . . . .

Worksheet 8.13Setting Switches on the OSI Interface Module 103. . . . . . . . . . . . .

Worksheet 8.14OSI Interface Installation 105. . . . . . . . . . . . . . . . . . . . . . . . . . . .

Worksheet 8.15EI Installation 107. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Connecting to an Ethernet Network 108. . . . . . . . . . . . . . . . . . . . . . .

Worksheet 9.1Configure DH+ Routing Networks 109. . . . . . . . . . . . . . . . . . . . . .

Worksheet 9.2Remote Addressing for each DH+ Programming Device 111. . . . . .

Worksheet 10.1User�Defined Major Faults 113. . . . . . . . . . . . . . . . . . . . . . . . . . .

Worksheet 10.2Specify Fault Routines 115. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Worksheet 10.3Fault Reporting Requirements 117. . . . . . . . . . . . . . . . . . . . . . . .

Worksheet 11.1Selecting a PI Chassis 119. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Worksheet 11.2Assigning Modules to Chassis Slots 121. . . . . . . . . . . . . . . . . . . .

Worksheet 11.3Determining Power Requirements 123. . . . . . . . . . . . . . . . . . . . .

Worksheet 11.4Selecting a Fan Assembly 125. . . . . . . . . . . . . . . . . . . . . . . . . . .

Worksheet 11.5PI Hardware 127. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Preface

iii

Using this Manual

Read this manual to learn how to:

select appropriate hardware and software for a Pyramid Integrator application

make application design decisions, document the design, and provideinformation to those responsible for hardware installation,programming, start-up and integration

Use this manual if you are responsible for any design for a PyramidIntegrator system. For example, use this manual if you:

select hardware and software for a Pyramid Integrator application

make high-level design decisions about a Pyramid Integrator application

prepare design documentation

prepare instructions for installers, programmers, or integrators

break the project down into manageable components and defineapplication operation at a specific hardware or software level

This manual provides specific information relevant to the PyramidIntegrator system. We assume that you are:

an experienced engineer or technician with a good background incontrol system application

familiar with PLC processor, vision, and communication applications.

For additional information, see the related publications listed on page viii.

Manual Objectives

Who Should Use this Manual



PrefaceUsing this Manual

iv

This manual assumes that a functional specification for your system hasbeen prepared, and that a decision has been made to use the PyramidIntegrator system to perform one or more functions of your system.

Functional Specification

The functional specification, as it relates to the Pyramid Integrator system,should define:

functions to be performed by the Pyramid Integrator system

requirements of users of the Pyramid Integrator system

constraints, such as existing equipment, systems, interfaces;environmental constraints; etc.

inputs to the Pyramid Integrator system (actions and signals, ranges,quantities, timing, tolerances, units of measure, validation requirements,errors to be detected and responses)

processing that the Pyramid Integrator system must perform (requiredalgorithms, intermediate stages, errors to be detected and responses,performance constraints)

outputs (quantities, units of measure, timing, tolerances, ranges,validation methods, method of reporting invalid outputs, locations,methods of data output, physical requirements)

interfaces (operator, software, hardware)

performance requirements (accuracy, maximum and minimumtransaction times, memory size limitations, interface timing, operatorresponse timing, adherence to standards such as IEEE or ANSI, etc.)

plans for future expansion or use in other environments

failure modes and recovery methods

security requirements

maintenance requirements

Preparing to Use this Manual


v

For an overview of Pyramid Integrator components and configurations, seechapter 1 of this manual, or the following publications:

Publication: Publication number:

Pyramid Integrator System System Overview 5000�2.3

PLC�5/250 Product Data 5000�2.17

MicroVAX Information Processor Product Data 5000�2.20

CVIM Descriptive Product Bulletin 5370�1.1

Pyramid Integrator OSI Interface Module Product Data 6632�2.11

At project launch time, the project design engineer typically establishes acourse of action to meet the goals set forth in the functional specification.A design specification is generated that defines how the application willperform each function, including hardware and software specifics. If theapplication consists of multiple components, there will be a designspecification created for each component.

Design Specification

This manual helps you translate from the generic language of thefunctional specification into the hardware-specific language of the design specification.

The process of generating a design specification is critical to the success ofthe project. It determines the quantity and type of I/O required, thesequence of operations, the allocation of system resources, data typesrequired, and information flow. It reaffirms the goals set forth in thefunctional specification and helps ensure their accomplishment.

Gathering InformationTo gather the information needed for a design specification, use:

this manual and the manuals it references the functional specification applicable codes, laws, or standards




vi

Creating the Design SpecificationCreation of design-level documentation is the primary task addressed bythis manual. You can accomplish this through a top-down approach:

examine the application and define the component functions or tasksassociated with the application level (chapter 1).

examine each component, further analyzing it into sub-components,each with its own design specification (chapters 2 – 10).

There is no single method for accomplishing this “task decomposition.”We recommend that components be functional blocks of the “parent,” andthat the parent design specification identify these blocks and theirrelationships. Address issues of data flow, formats, and system resourceallocation for sub-components at the parent level.

For example, consider a Pyramid Integrator application that includesseveral PLC-5/250 processors controlling distributed operations, a visionprocessor, and a MicroVAX Information Processor module. An overalldesign specification would define the operations performed by theapplication and assign tasks to each of the Pyramid Integrator components(PLC-5/250 processors, vision processor, MicroVAX InformationProcessor module).

After defining major functions at the application level and assigning thesein logical groups to the various components, you can further define andassign functions at each component level. Once functions are clearlydefined, you can determine the I/O type, quantity, and distribution.

The design process is an iterative process that requires constant review andmodification to make sure that the original project goals are met and thatnew information discovered during the design process can be incorporatedto assure project success.

Use the following guidelines in using this manual:

read the chapters in order. If a chapter does not pertain to yourapplication, you can skip it.

use the chapters to help you make design decisions.

use the worksheets at the back of the manual to record your decisions. Ifyou use other documentation methods, check to make sure the decisionsmade on the worksheets are also included in your documentation.

Use Figure 1 to determine which chapters to read.

How to Use this Manual


vii

Figure 1How to Read this Manual

Read preface & chapter 1

Does theapplicationuse a CVIM

module?

Read chapter 2Yes

No

Does theapplication

use I/Odevices?

Read chapter 3Yes

No

Does theapplication use

local I/Odevices?

Read chapter 4Yes

No

Read chapter 5Yes

No

Does theapplication involve

communications on DH,DH+, DECnet, or MAP

network?

Read chapter 8 � 9Yes

No

Plan for Fault Handlingchapter 10

Prepare for installationchapter 12 � 14

Select PI hardware and softwarechapter 11

No

A

A

Read chapter 6Yes

No

Does theapplication use aPLC�5/250 logic

controller?

Does theapplication use a

MicroVAX InformationProcessormodule?

Read chapter 7Yes

Does theapplicationuse remoteI/O devices?




viii

For additional information on topics related to Pyramid Integrator design,see these publications:

Publication: Catalog Number /Publication Number:

Allen�Bradley Data Highway Cable Layout Manual 1770�6.2.1

Pyramid Integrator Installation Manual 5000�6.2.10

CVIM User Manual 5370�ND001

CVIM Communications Manual 5370�ND002

CVIM Quick�Start Self�Training Guide 5370�ND003

INTERCHANGE Software for PI MicroVAX Documentation Set 5730�DTLD

Pyramid Integrator OSI Interface Software User's Manual 5820�6.5.1

INTERCHANGE Software Documentation Set 5820�ICDOC

INTERCHANGE Software for HP�UX (Ethernet) Documentation Set 5840�HPUD

PLC�5/250 Programming Software Documentation Set 6200�N8.002

Allen�Bradley MAP Station Manager Software User's Manual 6630�6.5.2

We refer to certain types of equipment and terms throughout this manual.To make the manual easier for you to read and understand, we avoidrepeating full product names where possible.

We refer to the: As the:

Data Highway link DH link

Data Highway Plus link DH+ link

Resource manager module RM

Logic processor module LP

Remote scanner 5150�RS2 and �RS5 modules RS. Unless noted otherwise, RSdenotes both modules.

Configurable Vision Input Module CVIM module or vision processor

Data Highway/Data Highway Plus Interface Module KA module

Open Systems Interconnect Module OSI interface module or Cx module

MicroVAX Information Processor, MicroVAX InformationProcessor EP and MicroVAX Information Processor EE

MicroVAX information processors

MicroVAX Information Processor with expandedprocessor (16 Mbytes)

MicroVAX information processor EP

MicroVAX Information Processor with expandedprocessor (32 Mbytes)

MicroVAX information processor EE

Pyramid Integrator system PI system

Ethernet Interface module EI module

When we refer to words of memory in PI modules, we mean 16-bit wordsunless otherwise stated.

Related Publications

Terms and Conventions


ix

Table A lists all the catalog numbers associated with the modules andsoftwares used in the PI systems.

Table ACatalog Numbers

Module: Catalog number:

I/O board 1771�JMB

12" black and white monitor 2801�N6

Rack mount color monitor 2801�N8

9" black and white monitor 2801�N9

Camera 2801�YB, �YC, �YD, �YE

PI chassis 5110�A4/B, �A8/B

Fan assembly 5110�FAN8

Power supply 5120�P1/B

KA 5130�KA

RM 5130�RM1, �RM2

RS 5150�RS2, �RS5

LP 5250�LP1, �LP2, �LP3, �LP4

Vision processor 5370�CVIM, �CVIM2, �CVIMC

User interface box 2801�N22, �N26

I/O interface box 2801�N21, �N27

4�port distribution panel 5710�DPI

Industrial disk 5710�ID4, ID5, �ID6, �ID75730�ID3

Program loader 5710�PL/B or higher

Ethernet Interface module 5820�EI

MicroVAX information processor 5730�CPU1

MicroVAX information processorEP or EE

5731�CPU1, �CPU2

6200 software 6201�5250, 6203�5250,6211�5250, 6213�5350,6233�5VDL, �5VTL,6223�5VDL

INTERCHANGE software 5730�DTLS, 5830�VS,5840�HPUS, 5850�DKTS,5850�WKTS, 5850�WES

Catalog Numbers



Chapter 1

1-1

Overview of the PI System

This chapter provides an overview of the PI system. To read about:

The: Go to page:

PI concept 1�1

basic components of the PI system 1�2

PI capabilities and features 1�18

types of configurations of modules you can use 1�30

sharing of data among PI modules 1�32

The PI system links programmable control, machine vision, andinformation processing functions through a common backplane that formsa high-speed communication link among them as shown in Figure 1.1.

Figure 1.1PI Concept

MicroVAXInformationProcessor

PLC-5/250ConfigurableVision Input

Module

PI backplane

Plant

computer

Plant floor devicesMachine vision

PI chassis

Discrete I/O

Processor

Local humaninterface

Chapter Objectives

PI Concept

Chapter 1Overview of the PI System

1-2

Various PI modules perform these processing functions. Select themodules you need to meet your specific application, and install them in acommon chassis. Memory on each module stores data relevant to thatmodule’s function. Information processing and LP modules can read datafrom and write data to other modules, allowing data to be shared amongthe modules in the chassis. Communication links to plant-floor devicesand higher level computers allow information to be communicatedplant-wide.

All PI applications require these components:

Component: Function:

Chassis 4� or 8�slots to house modules

Power supply to supply power for modules

Resource Manager to arbitrate backplane communication among modules and providecommunication ports (standalone vision systems do not require the RM)

Important: The 5120-P1 series A power supply cannot be used with the5110-A4 series B or 5110-A8 series B chassis. There is no means to applypower to the backplane.

A fan assembly is required if you use a MicroVAX Information Processoror if the power supply load is over 170 watts.

Figure 1.2 shows all the available PI components.

Basic PI Components




1-3

Figure 1.2PI Components

8�slotChassis w/ Brackets

4�slotChassisw/ Brackets

PowerSupply

RMModule

LPModule

RS5Module

EthernetInterfaceModule

OSICarrierbandInterfaceModule

KA Module

CVIM Module

OSIBroadbandInterfaceModule

MicroVAX InformationProcessor EE or EP

MicroVAXInformationProcessorModule

19750

Fan Assembly


1-4

PI Chassis

The PI chassis provides the backplane over which various modulescommunicate and provides a common housing for the modules and powersupply. The chassis is industrialized to protect modules against harshplant-floor environments.

SizesThe chassis comes in 4-slot and 8-slot versions (Figure 1.3). You can leaveempty slots for future expansion; install filler plates in empty slots to helpmaintain proper air flow and minimize electrical noise susceptibility.

MountingMovable mounting brackets let you mount your chassis either on a panel orin a rack. The 8-slot chassis fits a standard 19-inch rack.

Figure 1.3PI Chassis

241 mm(9.5 in)

Allow 16�inch cabinet depth overall for cable andmodule installation and removal.

19751

8�slot chassis(cat. no. 5110�A8/B) 4�slot chassis

(cat. no. 5110�A4/B)

429 mm(16.9 in)

406 mm(16 in)

257 mm(10.1 in)

241 mm(9.5 in)




1-5

Power Supply

The power supply provides power for the modules in thechassis (Figure 1.4).

Important: The 5120-P1 series B power supply works with both series Aand B chassis. The 5120-P1 series A power supply does not work with theseries B chassis.

Figure 1.4PI Standard Power Supply (5120�P1/B)

OVERTEMP: Red indicatesthat an over�temperaturecondition exists (70° C).

DC ON: Greenindicates that outputvoltages are on andwithin specifications.

Fan assembly/power supply connector

ac inputconnections

Customer interlockrelay connections

Backplane voltageON/OFF switch

19752

Fuses


1-6

Specification: 5120�P1/B power supply:

input requirements 85-132 or 170-264V ac RMS47-63 Hz, single phase

isolation (tested) input line to output: 1.5KV dc minimum, for 1 minute or equivalentinput line to chassis: 1.5KV dc minimum, for 1 minute or equivalent

efficiency 70% minimum at full load over entire input range

on/off controlled by toggle switch on front of power supply

input line protection fuses in L1 and L2, accessible from front panel

input connections connector on front panel

interlock relay common, NO, and NC contacts rated at 240V ac, 1A resistive, with RC snubber included

outputs +5 Vdc, 4 to 35 A+12 Vdc, 0 to 3 A-12 Vdc, 0 to 1 A

transient response output voltage within 1% of final value within 1mS after a 20% step load changeapplied at 1A/microS. Maximum deviation less than 5% of final value

voltage overshoot less than 5% of final value for each output at turn�on and turn�off

overcurrent protection +5V: 45 A ±7 A+12V: 4.5 A ±1.5 A-12V: 1.75A ±0.75A

an overcurrent may cause power supply shutdown. Recover by cycling input voltageoff/on, or cycling backplane voltage switch.

dc undervoltage protection all outputs: 85% ±10% of nominal output

an undervoltage causes power supply shutdown if ac input is above undervoltage point

dc overvoltage protection +5V: 120% ±10% of nominal output (electronic overvoltage sense)

±12V: 120% ±10% of nominal output (crowbars)

a dc overvoltage causes power supply shut�down. Recover by cycling input voltage off/on or cycling backplane voltage switch.

overtemperature protection warning at 65°C ±4° or when fan assembly faults

power supply shut�down at 4°C higher than overtemperature warning ±2°.

after power supply has cooled, recover by removing input voltage for 20 sec. or cycling backplane voltage switch.

input voltage interruption without system shutdown

1/2 ac cycle

The power supply is protected against overcurrent, overtemperature,overvoltage, and undervoltage. The on/off switch, input line fuses andinput line connections are accessible on the front panel. The line voltageswitch is accessible without disassembling the module.




1-7

Table 1.AMaximum AC Load

If your configuration is: Then the ac load is:

120 V 4.8 A rms

220 V 2.8 A rms

The power supply fits in a dedicated double-wide slot at the left end of thePI chassis (not counted in the 4- or 8-slot designations). A front panelpower switch shuts off dc power to the backplane when a module isinstalled or removed.

ATTENTION : Do not install or remove modules unless youhave shut off the dc power.

Important: The backplane voltage on/off switch is a logic switch, it doesnot remove ac power.

Fan Assembly

The fan assembly provides forced-air cooling for modules in the 8-slotchassis (Figure 1.5). You must install a fan assembly if the chassiscontains a MicroVAX Information Processor, or if the power supply load isover 170 watts.


1-8

Figure 1.5Fan Assembly for 8�Slot Chassis

Side viewFront view

5.75"(146mm)

16.85"(427mm)

9.26"(235mm)

16988

256 mm(10.08 in)

Front view

406 mm1

(16.01 in)

Side view

267 mm(10.5 in)

481 mm2

(18.94 in)(fits in standard 19 in rack)

465 mm(18.31 in)

406 mm overall depth (16 in)

(allow for installing andremoving modules and cables)

Attach fan assembly to thebottom of the chassis

The fan assembly attaches to the bottom of the 8-slot chassis. You can adda fan assembly to your system at any time, provided the required spacebelow the chassis is available. Each fan assembly has its own powersupply. A metal mesh air filter, removable for cleaning, protects the fansand PI components from particulate matter in the air.




1-9

Resource Manager Module

The RM arbitrates communication among the modules on the backplaneand provides 3 channels for communication to external plant-floor devices(Figure 1.6). It handles system power-up, power-down, and systemconfiguration. It plays a major role in system fault handling and recording.

All PI configurations, except the standalone vision configuration, requireone RM, and can have no more than one. You must install the RM in thePI chassis slot immediately to the right of the power supply. This is theonly module that must be installed in a particular slot.

Figure 1.6RM Module

If the terminal is usedfor programming, CH2must be configured forDH+ link.Allen�Bradley 1785�T47, 6160�T53, or 6160�T70 terminal.

orIBM computer or compatible running 6200 series software.

The serial port can beconfigured for master/slave, DF1, orASCII protocol and forRS�232�C, RS�422, orRS�423 electrical characteristics.

Serial device, suchas printer, modem,1770�KF2, 1771�KG,1785�KE, etc.

1779�KFL

DH II link

DH+ link

1779�KP5 1785�KA 1785�KA3 T47 T53 PLC�5processor

PLC�3 withS5 Scanner

PLC�2 processor

DH I link

DH II link

DH link

1785�KA 1785�KA

PLC�5processor

PLC�2processor

1771�KA2 PLC�3 withS5 Scanner

DH+ link

Channels 2 and 3 canbe separately configuredfor either DH or DH+ link.

CH2A and CH2B connectorsare connectedinternally in parallel.

16989

RM


1-10

Communication ChannelsThe RM provides 3 communication channels. Two of these can beindependently configured for connection to either DH or DH+ networks.You can connect a programming terminal (Allen-Bradley 1784-T47,6160-T53, 6160-T70 or IBM personal computer) to a DH+ channel forprogram development and system configuration. For channel 2, you havea choice of connecting to one of two different connectors.

The third communication channel can be configured for RS-232-C,RS-422, or RS-423 communication with DF1, ASCII, ormaster/slave protocol.

Using 6200 series software, you can configure parameters for eachcommunication channel, such as signalling speed, protocol, and dataformat. With switches on the RM, you select a default channel, protocol,signalling speed, error check method, and parity for one of the channels.This provides a default communication channel for use when softwareconfiguration is not available. These hardware settings override softwaresettings for the same parameters.

System Privilege ControlUsing 6200 series software, you can configure up to eight privilege classes,each of which allows access to a set of PI features that you specify. Youcan control access to PI features by assigning privilege classes infour ways:

you assign a default privilege class to each communication channel. Alldevices on a channel have the default privilege class unless you assign aspecific privilege class.

you can assign specific privilege classes (different than the default) toindividual stations on each channel.

you assign a password; you can allow an individual station to select aprivilege class other than the default.

you can assign access to program files and data table files.

For more information on system privilege control, see chapter 9, “Planningfor Communication.”

Module MemoryThe RM contains system memory and global data files that are accessiblefrom other PI modules. Module memory is contained on a detachabledaughter board with on-board battery backup. Two sizes of memoryare available:

128K words (included in 5130-RM1) 384K words (included in 5130-RM2)Allen-Bradley Automation



1-11

System Mode ControlThe RM module has a key-lock switch from which you can set the mode ofthe system or enable mode selection from the programming terminal.

If you want to: Set the key�lockswitch to:

The system responds by:

select the program mode and disable anyonefrom changing the mode from theprogramming terminal

Program switching immediately tothe program mode

select the run mode and disable anyone fromchanging the mode from theprogramming terminal

Run switching immediately tothe run mode

enable someone to change the mode from theprogramming terminal

Remote staying in the mode inwhich it has been untilchanged at theprogramming terminal

Based on the Program or Run switch position, the programming terminalselection in the remote switch position or the detection of an unrecoverablemajor fault, the system is always in one of the following modes.

The systementers this mode:

By any of thesemeans:

In this mode:

Program • Program switchposition

• from theprogrammingterminal (Remoteswitch position)

• all outputs are turned off

• program scan is stopped

• DH/DH+ communication continues butmessage instructions are not executed

• you can download and edit programs

• you can configure the system

• you can create and delete data files

Test • from theprogrammingterminal (Remoteswitch position)

• all outputs are turned off

• program scan is enabled

• DH/DH+ communication continues (programand message instructions are being executed)

• program editing and configuring are enabled

Run • Run switch position

• from theprogrammingterminal (Remoteswitch position)

• all outputs are enabled

• program scan is enabled

• DH/DH+ communication is enabled

• program editing and configuring are enabled

Fault • automatically upondetection of anunrecoverablemajor fault

• all outputs are turned off or held in last statebased on I/O chassis switch settings

• program scan is stopped

• DH/DH+ communication continues butmessage instructions are not executed

• programming and configuring are disabled

• in the Program or Run switch position, to returnto the previous mode, you must switch to theRemote position and back

• in the Remote switch position, to return to theprevious mode, you must clear the fault fromthe programming terminal


1-12

Logic Processor Module

The LP executes ladder logic (Figure 1.7). The LP communicates withother modules on the backplane these ways:

the LP can read from or write to a MicroVax Information Processor oran EI module (INTERCHANGE software must be running in thecomputer)

the MicroVAX Information Processor can read or write to a LP the LP can read input data and write output data directly to all

scanner modules the LP can read and write data table directly to all modules that have

user-accessible memory

Figure 1.7LP Module

+

–LPModule

Memory Daughter Board:256K, 512K, 1024K, or 2048K words

4 hardware processorinterrupt inputs

+12 to24V dcpower supply(customer-supplied)

Common

16993

Devices on a DH or DH+ link (CH2 and CH3 on the RM) can send datadirectly to the LP and the LP can send data to these devices.

Feature: Characteristics:

concurrentprocessing

when you have multiple LP modules, each module can execute its own logicprogram independently of the others. Some coordination of multiple LPmodules can be done using sequential function charts.

I/O capacity through RS2/RS5 modules, the PLC�5/250 processor can address up to1024/4096 inputs/outputs. A maximum of 4096 inputs and outputs areavailable per system.




1-13

Programming Considerations

Programmingfeatures:

Description:

on�and off�line

programming

use 6200 series software to develop ladder logic programs on�line (with theprogramming terminal connected to the LP via DH+ link or the PI backplane)or off�line (with the programming terminal not connected to the LP).

compiledprograms

all programs are compiled and stored in memory on the LP. This makesprogram execution significantly faster than in controllers that useinterpreted code.

sequential

function charts

lets you organize your program as a sequence of individual steps separatedby transitions. The LP executes one step repeatedly until its associatedtransition condition goes true, then moves to the next step. Only the stepsthat need to be scanned at a particular time in the process are executed.Consequently, corresponding program scans can be shortened.

processor inputinterrupts (PII)

each LP has four +12�to�24V dc inputs for event�driven interrupts. When oneof these inputs goes high, the processor immediately stops programexecution and executes a user�specified interrupt routine. When the interruptroutine is completed, program execution resumes where it left off.

selectable timedinterrupts (STI)

each LP can execute up to eight interrupt routines at user�specifiedtime intervals.

independentbackground

programs (IBP)

you can configure the LP to divide execution time between foreground andbackground program execution. IBPs let you run programs independentlyand asynchronously from main program execution. You can program up tofour independent background tasks per LP. Each IBP task can contain anynumber of program files, with up to 32 in queue.

MemoryThe LP has memory for storing logic programs and data files. Four sizesare available:

LP: Memory in 16�bit Words:

5250�LP1/B 256K

5250�LP2/B 512K

5250�LP3/B 1024K

5250�LP4/B 2048K

See chapter 6 for information on configuring the LP.


1-14

Remote/Local Scanner Module

The RS transfers I/O data between the PI chassis and various devices suchas PLC processors, 1771-I/O and RediPANEL on the I/O link. The datatype is discrete I/O or block-transfer.

The RS connects the PI system to 1771 I/O modules and other devicesconnected to the remote I/O link (Figure 1.8). The RS5 can also connect to1771 I/O modules through a local I/O link. LP, EI module and MicroVAXInformation Processors can read-from and write-to I/O image files to setoutputs and read the status of inputs from the image file. The RS scans I/Oasynchronously to the program scan. On each I/O scan, the RS:

reads inputs updates the input image file controls output module terminals according to the states of

corresponding output image bits

To provide a synchronous input function, you can configure the LP to copythe RS input image files once per program scan, and use the copy duringprogram execution.

Table 1.BDifference between the 5150�RS5 and 5150�RS2 Scanners

5150�RS5 scanner: 5150�RS2 scanner:

four channels of remote I/O two channels of remote I/O

one channel of extended local I/O (LIO) none

address maximum of 32 I/O racks total address maximum of 8 I/O racks total

address maximum of 14 I/O racks per link 1 address maximum of 8 I/O racks per link 1

4096 inputs/outputs 1024 inputs/outputs

1 Both scanners support 32 adapters on an I/O link.

CH1CH2

CH3CH4

CH5

5150�RS519777

5150�RS2




1-15

Characteristics

RS: Characteristic: Description:

RS2 I/O capacity each RS2 has two I/O channels that are scannedindependently. You can connect a maximum of eight I/O racks(1024 discrete I/O) to each scanner, divided among the twochannels in any combination. Within the 8�rack limit, you canconnect 32 adapters per channel.

block�transfer you can block�transfer a maximum of 64 words of data at atime to or from I/O modules. The RS2 can execute oneblock�transfer per I/O chassis per I/O scan. Block�transferrequests from LP modules or a MicroVAX InformationProcessor are sent to the specific adapter module in the I/Ochassis. If a chassis contains more than one block�transfermodule, block�transfers are queued at the adapter until theycan be performed.

direct communicationmode (adapter mode)

you can configure one or both channels of the scanner asadapters on another remote I/O link for communication with asupervisory PLC controller. RS2 can do block�transfer to onlyslot 0 (zero) of the rack.

RS5 I/O capacity each RS5 has four remote I/O channels and one local I/Ochannel that are scanned independently. You can connect amaximum of 32 I/O racks (4096 discrete I/O) to each scanner,divided among the four channels. A maximum of 14 racks canbe addressed on one remote I/O channel. Within the 14�racklimit, you can connect 32 adapters per remote I/O channel, and16 adapters per local I/O channel.

remote block�transfer you can block�transfer a maximum of 64 words of data at atime to or from I/O modules. The RS5 can execute oneblock�transfer per I/O chassis per I/O scan. Block�transferrequests from LP modules or a MicroVAX InformationProcessor are sent to the specific adapter module in the I/Ochassis. If a chassis contains more than one block�transfermodule, block�transfers are queued at the adapter until theycan be performed.

local block�transfer the RS5 can execute one local block�transfer per adapter perlocal I/O scan.

direct communicationmode (adapter mode)

you can configure one or all four channels of the scanner asadapters on another remote I/O link for communication with asupervisory PLC controller. RS5 can do block�transfer to allthe slots in the rack.

The 5150-RS5 scanner is compatible with the 5150-RS2 scanner if thesystem firmware base line is A08 or later. You can have both scanners inthe same chassis and operate in the system without problems.

The local I/O channel (LIO) functions similarly to the remote I/O, exceptthat the LIO has a faster speed on transferring discrete data andblock-transfer. See chapter 5 for more information on LIO.


1-16

Figure 1.8RS5 Module

19754

RS5 module

Memory board

PanelViewOperator terminal

1771�ASB with1771 I/O modules


1395 dc drive with PLCprocessor interface module


PLC�5 processorwith local I/O

Operator RediPANEL module

Direct communication module withPLC�2 processor local I/O

Remote I/O link

Remote I/O link

1771�ALX with1771 I/O modules

LocalI/O link

ConfigurabilityFor each RS, you can use 6200 series software to configure:

Characteristic: Description:

signalling speed (I/Ocommunication rate)

57.6k bit/s or 115.2k bit/s or 230.4k bit/s (remote I/O only)

channel mode direct communication (adapter on another I/O link), I/O scan, or inactive

fault mode for each I/O chassis, whether a fault is considered minor or major




1-17

Pushwheel RangeOn the RS2 modules, the pushwheel sets the range of I/O racks itaddresses. See Table 1.C.

Table 1.CRS2 Pushwheel Numbers vs. I/O Racks Addressed

RS2 pushwheel number: I/O racks addressed (in octal)

1 00 �07

2 10 � 17

3 20 � 27

4 30 � 37

On the RS5 modules, two pushwheels are used.

The pushwheel on the: Designates the:

left first logical scanner present on the RS5.

right last logical scanner present on the RS5.

A logical scanner represents eight I/O racks, 2048 block-transfer datawords and 128 internal storage words. A logical scanner rack rangecorresponds to the pushwheel setting of a RS2 module. For example,when the pushwheels are set to 1-4, the RS5 is configured for logicalscanners one through four. In other words, the one RS5 handles logicalracks 00-37, providing the same I/O data table size as four RS2 modules.See Table 1.D.

In setting scanner pushwheels, follow these rules:

one scanner must be set to address I/O racks 00 - 07 any additional ranges of I/O racks must be configured such that the

addresses are contiguous no two scanners can overlap in addressing of I/O racks


1-18

Table 1.DRS5 Pushwheel Numbers vs. I/O Racks Addressed

RS5 pushwheel number(left � right):

Contains logicalscanners:

I/O racks addressed(in octal)

1�1 1 00 � 07

1�2 1, 2 00 � 17

1�3 1, 2, 3 00 � 27

1�4 1, 2, 3, 4 00 � 37

2�2 2 10 � 17

2�3 2, 3 10 � 27

2�4 2, 3, 4 10 � 37

3�3 3 20 � 27

3�4 3, 4 20 � 37

4�4 4 30 � 37

The PI system performs plant-floor control functions with the PLC-5/250processor. The table below and Figure 1.9 show an example configurationof a PLC-5/250 processor.

Module: Number allowedper chassis:

Function:

Powersupply 1

1 (in left most slotof chassis)

supplies power to modules

RM 1 1 (next to powersupply)

arbitrates backplane communication, and provides connectionto DH or DH+ link, programming terminal, RS�232�C, RS�422,or RS�423 devices.

LP up to 4 executes ladder logic programmed on� or off�line with 6200series software.

RS up to 4 interfaces 1771 I/O modules and other devices. Can also beused in adapter mode as a remote device on anotherI/O network.

1 You must have this module in the PLC�5/250 processor.

PLC�5/250 ProgrammableController




1-19

Figure 1.9Example of a PLC�5/250 Configuration

19753

RS5

LPRM

Power supply

4�slot chassis

DH+ link

Remote I/O link

Remote I/O link

Programming terminal

Serial communications(RS�232�C, RS�422, or RS�423,ASCII, DF1, or Master/Slave)




OperatorRediPANEL module


Up to 4096 inputs/outputs32 I/O racks per PLC�5/250 system

ComputerProcessorinput interrupts

PLCprocessor

DH and/or DH+ link(if a programming terminalis connected to CH2A, thenCH2B must be configuredas DH+ link)

LP

1395 DC drive withPLC interface module


1-20

6200 Series Software

You can run 6200 series software on a programming terminal(Allen-Bradley 1784-T47, 6160-T53, 6160-T70, or IBM personalcomputer) to:

create, edit, or monitor ladder logic create, edit, or monitor a sequential function chart document ladder logic generate and print program documentation reports configure processor and terminal communication configure PI modules communicate to other PI modules and devices on the

communication links

The PI system offers non-contact monitoring and image analysis with theCVIM module. The CVIM module processes digitized video data fromone or two cameras for visual comparison.

To: Use this function:

compare an object's image to stored image data to determine part identity

recognition

locate a feature on an object location

locate and precisely measure features on an object gauging

decide if it is a go/no�go testing of objects based on stored image inspection

isolate features of a particular size; to make a go/no�go decision object extraction

perform mathematical and logical operations on inspection results MATH�PAK operation(optional)

Memory

Results of the vision analysis are stored in shared memory on the module.Other PI modules can access this memory. Trigger inputs acquire a cameraimage and can be written to this memory by other PI modules.

Figure 1.10 shows an example of a stand-alone vision configuration. TheCVIM module can also be included in a chassis with other modules.

Configuration

You can configure the CVIM module to perform two independent visionanalysis tasks using two separate tool sets. Configuration is done using amonitor and light pen and easy-to-use pop-up menus.

CVIM Module




1-21

You can store tool-configuration data on either a 64 Kbyte memory card ora 512 Kbyte memory card, both of which are about the size of a creditcard. You can insert the card in the slot on the module and upload aconfiguration to memory or download a configuration from memory to thememory card.

Figure 1.10Example of a Stand�alone Vision Configuration

19755

4�slotchassis

RS�232�C serialcommunication

Empty slotswith filer plate

CVIM module

Remote I/O link

PLC�5 processor with local I/O

Adapter node

2 cameras

Not required

1771�JMBmodule

2 triggerinputs

14 outputs

I/O board andinterface boxes

Light pen

Monitor

Analysis Capabilities

The module can use two cameras for one inspection, or use each camerafor different inspections. One CVIM module can thus support twoinspection lines, or one inspection line with two analysis tasks (gross andfine, for example), or one line with 2 cameras in different locations (e.g.top of bottle and side of bottle).


1-22

Analysis tools include:

12 reference tools automatically compensate for random part positioning and rotation. Thereare 2 sets of reference tools and each set consists of 3 sets of referencelines and 3 sets of reference windows.

48 windows specify a window area on the image and the type of inspection to be usedinside it. For example, a window can be programmed to count white orblack pixels within the window or for gray�scale template matching.

64 line gauges locate a line gauge on the image and specify the type of inspection to beapplied on the line. For example, a line gauge could count white or blackpixels, or accomplish gray�scale edge detection.

Inspection Rate

The CVIM module can inspect up to 1800 parts per minute.

Adapter Port

You can connect the CVIM module on a universal remote I/O link by usingthe adapter port on the CVIM module. The CVIM module is treated as onecomplete I/O rack. This allows an external PLC controller (e.g. PLC-5 inmaster mode) to be used as a supervisory PLC controller for the CVIM module.

Module I/O

You can connect a 1771-JMB single-point I/O board to the visionprocessor through a dedicated connector on the module. This provides twotrigger inputs and 14 configurable outputs, two of which can be strobes.Other outputs can be used for vision analysis results.

Shared Memory

The CVIM module contains memory that is used to store the results ofvision analysis and module status. Other PI modules can read thismemory. In addition, the module memory can accept trigger inputs andsecondary control inputs from other PI modules.

Serial Interface

An RS-232-C serial port on the CVIM module allows it to be connected todevices such as PLC processors and personal computers.

Figure 1.11 shows some of the features of the CVIM module.




1-23

Figure 1.11CVIM Module

Pushwheel switchsets moduleaddress (1�4)

Use credit card typememory to storeconfiguration image data

Inspection to otherPI modules trigger or otherinput to CVIM module

optional

Black & whitemonitor

Colormonitor Light pen

Serial digitalI/O breakput box

I/O board (1771�JMB)16 I/O

RS�232

User interfacebreakout box

16907

19�inch rack mount togetheror mount separately

cameras

The Open Systems Interconnect (OSI) is a standard that provides theframework for defining the process of communication between systems.The OSI interface module is a software-based module that provides thebasis for connecting open systems and communication in amulti-vendor environment.

You install the OSI interface module in your PI chassis or system anddownload the OSI Interface Software to the module from the A-B MAPStation Manager. When you initially install the OSI interface module, it isset to partially operational mode.

OSI Interface Module


1-24

There are two operational modes:

Operational: Description:

partially allows you to load the OSI Interface Software (cat. no. 5820�OS)

fully allows for application�to�application communication using the protocolstack (normal operating mode)

Communication Channels

The A-B PI OSI interface module is either a carrierband (single-slot) or abroadband (double-slot) module. You can connect the OSI interfacemodule to a carrierband MAP 802.4 token-passing network as shown inFigure 1.12. The OSI interface module enables the PI system tocommunicate with other vendors of MAP products.

Table 1.ECommunication Across Networks

If your OSI Interface Module is a: Then it is:

broadband 10 Mbit/s

carrierband 5 Mbit/s

Figure 1.12PI OSI Interface

Allen�Bradley T70 terminal orIBM PC/AT or IBM PS/2 orcompatible running A�B MAPStation Manger Software(cat. no. 6630�PMC)

802.4

A�B MAPStationManagersoftware

PI OSIInterface

PLC�3 processor

Thirdpartydevice

OSI Broadband orCarrierband interfacemodule

See the A�B MAP Station ManagerSoftware User Manual (6630�6.5.2)for additional information on configuring software

18386

The RS-232 connection is used only for local station management purposesas shown in Figure 1.12.Allen-Bradley Automation



1-25

The EI module (Figure 1.13) provides communication with higher-levelplant computers via Ethernet. The EI module uses the TCP/IP protocol forcommunication through its ENET port. A-B supports one EI moduleper chassis.

Figure 1.13EI Module

EI Module

Ethernet TCP/IP

Computer EI Module18534

The KA module (DH/DH+ interface module) provides three additionalchannels for communication to plant-floor devices (Figure 1.14). Theseare the same communication channels as available on the RM.

You can have up to four KA modules in one chassis.

EI Module

KA Module


1-26

Figure 1.14KA Module

If the terminal is used for programming,CH2 must be configured for DH+ link

Allen�Bradley 1785�T47, 6160�T53, 6160�T70 terminal or

IBM computer or compatible running 6200 Series Software

The serial port can be configuredfor master/slave, DF1, or ASCIIprotocol and for RS�232�C,RS�422, or RS�423 electricalcharacteristics

Serial device, suchas printer, modem,1770�KF2, 1771�KG,1785�KE, etc.

1779�KFL

DH II linkDH+ link

DH II link

DH I link

1779�KP5 1785�KA 1785�KA3 T48 T53 PLC�5processor

PLC�3 processorwith S5 Scanner

PLC�2processor

DH link

1785�KA 1785�KA 1771�KA2

PLC�5processor

PLC�2processor

DH+ link

PLC�3 processorwith S5 Scanneror 1775�KA

Channels 2 and 3 canbe separately configuredfor either DH or DH+ link

CH2A andCH2B connectorsare connectedinternally in parallel

17974

The PI system offers information processing capability in VMSenvironments with a MicroVAX Information Processor:

Module: RAM:

MicroVAX Information Processor (5730�CPU1) 8 Mbytes

MicroVAX Information Processor EP (5731�CPU1) 16 Mbytes

MicroVAX Information Processor EE (5731�CPU2) 32 Mbytes

Information Processing




1-27

MicroVAX Information Processor Family

A MicroVAX Information Processor processes the plant-floor informationit reads from other PI modules or other A-B devices, connected by DH orDH+ communication links. It can also write data to other PI modules orother A-B devices connected by DH, DH+, and remote I/O communicationlinks (Figure 1.15).

Communication with Other PI ModulesUsing INTERCHANGE software, a library of routines supplied by A-B, aMicroVAX Information Processor can retrieve data from PI modules andconvert it into a form suitable for processing by the MicroVAXInformation Processor. The INTERCHANGE software supports both Cand FORTRAN programming languages and follows standard VMScalling conventions.

Data can also be received from PLC processors or DH/DH+ link viaunsolicited messages.

Ethernet DECnet PortA MicroVAX Information Processor connects to other computers via anEthernet link using DECnet protocols. You can connect to eitherThinWire or thickwire Ethernet cable with a suitable transceiver.

Disk DrivesYou can connect multiple industrial disk drives for program storageand loading.

You can only use: With the MicroVAX Information Processor Catalog Number:

5730�ID3 disk drive 5730�CPU1

5710�ID4, �ID5, �ID6and �ID7

5731�CPU1, and �CPU2

To decide which industrial disk to use with your MicroVAX InformationProcessor, MicroVAX Information Processor EP or EE, see Table 1.F.

Table 1.FIndustrial Disk Selection

Total Capacity 5710�ID4 5710�ID5 5710�ID6 2 5710�ID7 2

209 Mbyte one

418 Mbyte two 1

480 Mbyte one

627 Mbyte one one

836 Mbyte two

960 Mbyte one one

1 You can also use one 5710�ID5.2 You can also use one 5710�ID7. The only difference between these two is their SCSI addresses.

5710�ID6 is fixed at 0 and1, 5710�ID7 is fixed at 2 and 3.


1-28

You can use the MicroVAX Information Processor without a disk byconnecting the processor to a DECnet network that includes a VAX bootnode (Local Area VAXcluster ).

Figure 1.15Example of a PI System with MicroVAX Information Processor

DH+

DF1

19756

DECnet

MicroVAX processor

8�slot chassis

Ethernet transceiver

LP

RS5

RMPower supply

LP modules

Empty slot with filler plate

Terminal(customersupplied)

Disk drives159 or 480 Mbytes each

Fan assemblyRemoteI/O links




2705 OperatorRediPANEL


Up to 4096 inputs/outputs;32 logical racks per PLC�5/250 system

1395 dc drive withPLC processor interface module

Processorinput interruptsComputer

PLCprocessor

DH and/or DH+ link(if a programming terminalis connected to CH2A, thenCH2B must be configuredas DH+ link)

Serialcommunications

Programming terminal

4�port distribution panel




1-29

Program LoaderA program loader that stores and loads programs from TK-50 tapes can beconnected to a MicroVAX Information Processor.

Serial PortsBy attaching a distribution panel to a MicroVAX Information Processor,four 25-pin D-shell serial ports become available. One port is RS-232-Ccompatible with modem control. The other three are DEC-423 compatiblewith data lines only. You can use these ports to connect:

a modem for remote diagnostics or operation. The serial ports operateat up to 19.2 bit/s and support printers and VT series terminals.

serial devices such as printers, CRTs, or bar code readers.

SoftwareA-B offers various software packages that run on a MicroVAX InformationProcessor. Besides the software listed below, you can also run third-partyapplication programs on a MicroVAX Information Processor.

If you use thissoftware package:

This software package:

VMS System softwaremedia

contains the VMS operating system, system management utilities, andlicense. The single�user VMS license includes the license for DECnet

software, DECwindows , and VAXcluster software. A five�user VMSlicense option is also available. The software is supplied in DigitalTK�50 format. The operating system software containsthese packages:

• VMS (singer user)• DECnet VAX End Node• DECwindows• Local area VAXcluster

INTERCHANGEsoftware

gives VMS applications read and write access to all data files in the PIchassis and to all 1771 I/O modules connected to a RS, including:

• global memory on the RM• module memory on the LP• I/O image files on the RS• block�transfer modules attached to a RS• shared memory on other PI modules, such as the CVIM module

The INTERCHANGE routines support:

• data conversion between PLC formats and user formats, includingword, unsigned word, long, and float

• 40 outstanding requests per task

The INTERCHANGE software also gives access to many types of A�Bdevices connected to the DH/DH+ ports of the RM modules andKA modules.

Supported Programming LanguagesA MicroVAX Information Processor can support most of the programminglanguages and utilities that other standard VMS processors can. ForINTERCHANGE routines, A-B supports the C and FORTRANprogramming languages.


1-30

System UtilitiesAll VMS utilities are available, including the following:

software installation utility to install VMS and application packages

system configuration utilities to set signalling speeds and devicemnemonics for all addressable communication ports

system backup and restore utilities to save hard disk files to a backuptape (program loader) and to restore either single files or entiredisk volumes

text editor VMS EDT/TPU to modify test and configuration files

system monitor utility to view both CPU memory use and task states forapplications running on the coprocessor.

Use of various PI components affects the number of other components youcan have in one chassis. Table 1.G shows the maximum number of eachtype of module you can have in an 8-slot chassis. Table 1.H showssystem compatibility.

Table 1.GMaximum Number of Modules You Can Have in a 8�slot Chassis

Module: Maximum allowed in a8�slot chassis:

RM 1

LP 4

RS 4

CVIM module 4

OSI carrierband interface module 3

OSI broadband interface module 1

MicroVAX Information Processor module 1

EI module 1

KA module 4

PI Configurations




1-31

Table 1.HSystem Compatibility

The number of: You can have in the chassis with these modules:

PLC�5/250processor

CVIM module MicroVAXInformationProcessor

OSIcarrierbandinterfacemodule

OSI broadbandinterfacemodule

KA module EI module

1RM 1 required1 maximum

0 required1 maximum

1 required1 maximum

1 required1 maximum

1 required1 maximum

1 required1 maximum

1 required1 maximum

LP 1 required4 maximum

0 required4 maximum

0 required4 maximum

0 required4 maximum

0 required4 maximum

0 required4 maximum

0 required4 maximum

RS 1 required4 maximum

0 required4 maximum

0 required4 maximum

0 required4 maximum

0 required4 maximum

0 required4 maximum

0 required4 maximum

CVIM module 0 required4 maximum

1 required4 maximum

0 required4 maximum

0 required4 maximum

0 required4 maximum

0 required4 maximum

0 required4 maximum


0 required1 maximum

0 required1 maximum

1 required1 maximum

0 required1 maximum

0 required1 maximum

0 required1 maximum

0 required0 maximum

OSI carrierbandinterface module

0 required3 maximum

0 required3 maximum

0 required3 maximum

1 required3 maximum

0 required3 maximum

0 required3 maximum

0 required3 maximum

OSI broadbandinterface module

0 required1 maximum

0 required1 maximum

0 required1 maximum

0 required1 maximum

1 required1 maximum

0 required1 maximum

0 required1 maximum

KA module 0 required4 maximum

0 required4 maximum

0 required4 maximum

0 required4 maximum

0 required4 maximum

1 required4 maximum

0 required4 maximum

EI module 0 required1 maximum

0 required1 maximum

0 required0 maximum

0 required1 maximum

0 required1 maximum

0 required1 maximum

1 required1 maximum

1If you put another module in a chassis with a CVIM module, you need a RM.

Important: Any PI configuration must not exceed the current capabilities of the PI power supply: +5 V dc at 4 to 35A and +12 and -12 V dc at 0 to 1A.

The PI system is designed with fault tolerance, so that it can continuefunctioning despite the presence of some faults. Depending on the type offault, the PI system:

continues running and records the warning or fault

runs a user-developed program to correct the fault or attempts to do anorderly shutdown of the application

records the source of the fault and attempts an orderly shutdown of theapplication

There are four fault levels:

system warnings minor faults major faults critical faults

See chapter 10 for more information.

Fault Handling


1-32

Each PI module has a memory area on board as shown in Figure 1.16.Memory areas on different modules store different types of data:

Module: Description:

RM contains global memory that can be accessed by other PI modules and by devices on DH and DH+ orEthernet link. You use global memory to store files that must be accessed by multiple LP modules.

LP each LP contains local memory for storage of program files steps (including STIs and PIIs), transitions, IBPs and local data files. The memory on a given LP cannot be accessed by any other LP, but can be accessedby a MicroVAX Information Processor module and by devices on DH and DH+ or Ethernet link.

RS the RS module's memory stores I/O image files, internal storage bits, force tables, and block�transfer data andcontrol information. RS memory can be accessed by other PI modules and by devices on DH and DH+ link orEthernet link.

CVIM module the CVIM module contains a shared memory area that can accept trigger inputs and stores the results of visionanalysis tasks it performs. This shared memory can be accessed by other PI modules and by devices on DHand DH+ or Ethernet link.

MicroVAX InformationProcessors

a MicroVAX Information Processor module can access disk memory for application programs and data onboard memory retains clock and boot configuration data. A MicroVAX Information Processor module can readdata�from and write data�to all other PI modules.

KA Module the KA module's communication ports can be accessed by other modules. There is no module memory thatcan be accessed.

OSI interface module the OSI interface memory is for module internal use only.

EI module the EI module memory is for module internal use only.

Figure 1.16PI System Memory

Systemstatus

Systemglobalmemory

128 Kwords or384 Kwords of global memory

256 Kwords512 Kwords1024 Kwords or2048 Kwordsof memory

Moduledatafiles

Moduleprogram

Inputimagefiles*

Input/outputimagefiles

Internalstorage

Blocktransferdata/control

Forcetables

48 Kwordsmemory

1 Kwordmemory

Sharedmemory

No user�accessiblememory




8, 16, or 32MbytesRAM

* When using synchronous input mode

PI backplane

RM LP RS CVIMmodule

KAmodule

OSIcarrierbandinterfacemodule

EImodule

OSIbroadbandinterfacemodule

MicroVAXinformationprocessor

18517

PI Memory Structure



Chapter 2

2-1

Planning to Use the VisionProcessor Modules

This chapter helps you plan for using the CVIM module, CVIM2 andColor CVIM in your PI application. In this chapter, you will:

define your vision application prepare a design specification for the vision tasks to be performed select the number of vision processors you need plan for CVIM module, CVIM2 module and Color CVIM module I/O supply information to the hardware installation team choose a power source for your vision cameras

See chapter 1 for an overview of the vision processor module’s function.

Use Worksheet 2.1 to help define your vision processor’s application. Fillit out and use it as the working document for your application.

Your application can contain up to four CVIM modules. Each CVIMmodule can perform two independent vision analysis tasks, based onimages supplied by one or two cameras.

Each CVIM2 module can have up to six camera inputs. You can use theCVIM2 module for synchronous/asynchronous inspection. Using oneCVIM2 module, you can inspect three lines at one time (asynchronous), oryou can have three inspection stations along a single line (synchronous).The CVIM2 module can also handle twice the camera resolution (1024 x1024 pixels) than that of the standard CVIM module. The CVIM2module also accepts input from up to two RGB color cameras. For moreinformation, see the New CVIM2 Machine Vision: Easy, Flexible and FastProduct Profile (5370-1.2).

The Color CVIM module allows you to inspect in full color. In addition,all the tools available in the standard CVIM module are available in ColorCVIM module. For more information, see the Get a Complete ColorVision Inspection Package with the Allen-Bradley Color CVIM Starter KitProduct Profile (5370-905).

Chapter Objectives

Define the Vision Application

Prepare a Design Specification

Chapter 2Planning to Use the Vision Processor Modules

2-2

Using a monitor and light pen, the vision developer uses the menu-drivenuser interface of the CVIM module to configure the inspection tools youneed to perform the desired analysis. To help the vision developerconfigure the inspection tools to perform the required tasks, prepare adesign specification for the vision application.

The design specification should include:

a series of statements that describe the machine or process operation the list of specified equipment to monitor and control the machine or

process operation a hardware diagram that shows the placement of the machinery,

switches, sensors, motors, actuators, etc. identify how configuration data is to be handled describe the vision application and analysis tasks in very specific

statements that have the form “When this event occurs, take this action.” identify all inputs and outputs identify all measurements, tests, and consequences, allowed

tolerances, etc.

Consult with the vision developer and see the CVIM User Manual(5370-800) for more information about the specification required. Makesure the vision developer receives a copy of your design specification.

Example of Design Specification for CVIM Module

In this example application (Figure 2.1), the CVIM module is inspectinglabels on jars to detect:

absence or presence of a label label position (horizontal and vertical) label skew (rotation) whether the label is the proper one

Each labeling line runs 2 sizes of jars. The CVIM module is installed in aPI system that also includes a PLC-5/250 processor and a MicroVAXInformation Processor.

Camera A inspects the small size jar using toolset #1. Camera B inspectsthe large size jar using toolset #2. Two photoswitch trigger signals arehardware controlled through the RS and PLC-5/250 LP. If small size jarsare running, photoswitch 1 is enabled and a trigger at input 1 allowscamera A, strobe output A, and toolset #1 to accomplish the inspection. Iflarge size jars are running, photoswitch 2 is enabled and a trigger at input 2allows camera B, strobe output B, and toolset 2 to accomplish the inspection.




2-3

The PLC-5/250 processor reads test results from the shared memory on theCVIM module and controls reject handling. It provides results informationthat is made available to a MicroVAX Information Processor for analysisand transmission to plant computers.

Figure 2.1Example Vision Application

Small Jars

Large Jars

Camera ACamera B

Photoswitch 1

Photoswitch 2

List of I/O

Input Source Description

trig 1 from PLC�5/250 LP triggers strobe, analysis (task 1) for small jars

trig 2 from PLC�5/250 LP triggers strobe, analysis (task 2) for large jars

Output 1 Destination Description

label present shared memory the jar has a label

position shared memory X Y position is within tolerance

label skew shared memory angle from vertical is within tolerance

label correct shared memory label is correct label

acquisition fault shared memory image acquired is inadequate for analysis

data valid shared memory results of analysis OK to read

busy shared memory CVIM module is performing another task

1There are 2 sets of outputs, one for task 1 (small jars) and one for task 2 (large jars).

Narrative of Machine OperationThe functional specification describes one cycle of machine operation.

1. Line is running at a rate of 900 jars per minute.

2. When a jar trips photoswitch 1, send a trigger input to the CVIMmodule (this function is performed by the PLC-5/250 processor).

3. When a trigger is received, and if the CVIM module is not busy,initiate the inspection cycle by triggering the strobe and acquiring animage, then initiate the analysis task.


2-4

4. In the analysis portion of the inspection cycle, perform the following tests:

Is theacquired imageadequate for analysis?

Reject the jarNo

Yes

Is a label present?

No

Yes

Can youlocate the label withmeasurement gages?

No Is the label skewed?

Does thelabel image matchesthe stored data?

No

Yes

Is the data valid?

No

Yes

Pass the test

Is the label in the correct location?

No

Yes

A

A

Yes

Reject the jar

Reject the jar

Reject the jar

Reject the jar

Reject the jar

Yes

Is the label rotated fromvertical by morethan +/-15°?

Yes

No

No

5. Ladder logic reads results, handles rejects, and can reinsert a jar in theline for reinspection.

6. MicroVAX Information Processor reads results and compilesstatistical data.




2-5

Based on your consultation with a vision specialist, and your designspecification, select the CVIM hardware you require for your application.Record your selections on Worksheet 2.3.

Use the following guidelines to determine the number of CVIM modulesyou require:

each PI chassis can contain up to four CVIM modules depending on configuration.

each CVIM module can execute two vision analysis tasks, each basedon input from one camera.

analysis toolsets can be changed by downloading from a MicroVAXInformation Processor, a PLC-5/250 LP, a PLC processor connected tothe Node Adapter port, or credit-card-type memory.

each CVIM module can accept input from two cameras.

You must specify how the following inputs and outputs are to be handled:

triggers –– there can be one trigger input for each analysis task. Atrigger initiates the inspection cycle by simultaneously triggering astrobe (if used) and image acquisition from the camera. The CVIMmodule coordinates all these activities to ensure proper timing.

strobe outputs –– these are caused by the trigger signals.

results outputs –– these depend on the inspection tools used in visionanalysis. They can be on/off outputs or data which is accessed by ahigher level controller.

Choose I/O Methods

I/O for the CVIM module can be handled in several ways:

use a 1771-JMB module connected to the CVIM module’s user I/O port

use the PI backplane (input from PLC-5/250 LP or MicroVAXInformation Processor)

use the RS-232-C serial port on the CVIM module

use the node adapter connection

Use Worksheet 2.3 to record the number of 1771-JMB I/O modules andI/O interface boxes you require.

Use Worksheet 2.2 to provide information to the hardwareinstallation team.

Select CVIM, CVIM2 and ColorCVIM Hardware

Plan for Module I/O

Plan for Module Installation


2-6

Cameras used with the CVIM module require 24 V dc to operate. Incertain cases, you can use the +12 and –12V dc outputs of the standard PIpower supply to provide the 24V dc for up to 4 cameras. Otherwise, youmust use a separate power supply that you provide. Use the following tableto determine which method you will use.

If the PI chassis contains: Then set the switch on the back of the CVIMmodule to use:

no more than two CVIM modules ANDno other modules

the +12 and -12V dc outputs of the standardpower supply to power up to four cameras.

more than two CVIM modules OR anymodule other than the CVIM module

an external supply for camera power. Connect anexternal power supply that provides 24V dc at .25Afor each camera to the fan assembly connector onthe standard PI power supply.

If you are using an external power supply, you must order an additionalpower supply cable to connect it to the PI power supply.

If the PI chassis contains: Then order: This cable:

at least one CVIM module and a MicroVAXInformation Processor

PI power supply to fan chassis andExternal Power Source Cable(5120�CP2)

brings fan status to the power supply andconnects 24 Volts from an externalpower supply to the backplane.

more than two CVIM modules OR at leastone CVIM module and a PLC�5/250 controller

PI power supply to External PowerSource Cable (5120�CP3)

connects 24 Volts from an externalpower supply to the backplane.

Table 2.A lists the physical specifications for CVIM, CVIM2 and ColorCVIM modules.

Table 2.ACVIM, CVIM2 and Color CVIM Specifications

Physical specifications: CVIM: CVIM2: Color CVIM:

current draw on:+5V supply+12V supply�12V supply

4.5 A65 mA75mA

9 A1 A1 A

5.5 A60 mA80 mA

operating temperature 0 - 60°C (32 - 140°F) 0 - 60°C (32 - 140°F) 0 - 60°C (32 - 140°F)

storage temperature -40 - 85°C (-40 - 185°F) -40 - 85°C (-40 - 185°F) -40 - 85°C (-40 - 185°F)

humidity 5% - 95% non�condensing 5% - 95% non�condensing 5% - 95% non�condensing

physical dimensionsH x W x D (in./mm)

15.97" x 3.34" x 9.38"406mm x 85mm x 238mm

15.97" x 3.34" x 9.38"406mm x 85mm x 238mm

15.97" x 3.34" x 9.38"406mm x 85mm x 238mm

weight (lb/kg) 3.70 lbs (1.68 kg) 7.97 lbs (3.62 kg) 3.70 lbs (1.68 kg)

Plan for Camera Power

CVIM, CVIM2 and ColorCVIM Specifications



Chapter 3

3-1

Planning I/O Configuration

This chapter helps you design the remote I/O interface for the PI systemusing the RS. In this chapter you will:

learn remote I/O concepts for the PI system decide whether to use complementary I/O select the devices you will place on the remote I/O link select the appropriate 1771 I/O modules assign 1771 I/O modules to I/O chassis assign I/O chassis to I/O channels and scanner modules document the 1771 I/O structure

This section provides an overview of the tasks you must perform to planthe I/O links. To plan the I/O links, you must:

1. For I/O that requires a short I/O scan time, select 1771-ALX adaptersto be used in local I/O links to interface with the 1771 I/O modules.

2. Select remote I/O link adapter devices — Many adapter devicescan be connected on the remote I/O link, including, but not limited to:

remote I/O adapter module, 1771-ASB, to interface with 1771 I/Omodules. These modules accommodate a wide variety of discretedigital and analog inputs and outputs. A number of intelligent I/Omodules are also available for specialized applications such asmotion and process control. You need to select the appropriatemodules for your application’s inputs and outputs.

devices with I/O adapter capability, including the vision processormodule, a RS on another PI system, some A-B servo drives,operator interface devices such as the A-B 2705 RediPANELpush-button and keypad modules, A-B CNCs, etc.

the T70 Industrial workstation

the 1771-DCM direct communication module

PLC-5 family processors in adapter mode

Chapter Objectives

Planning the I/O Links

Chapter 3Planning I/O Configuration

3-2

3. Configure I/O channels — Each RS channel operatesasynchronously, independently of the others. Given the devices youhave selected, you need to determine how to divide them among theavailable I/O channels for best performance. For example, you willneed to consider the number of I/O chassis on a channel and thenumber of BT modules on a channel.

RS2 RS5

Remote I/O channels 2 4

Extended local I/O channel 0 1

I/O racks 1 8 (1024 inputs/outputs)

up to 32 (4096 inputs/outputs)

Number of adapters per channel 32 32

1 I/O rack is an I/O addressing unit that can contain a maximum of 128 I/O with unique addressing of I/O

modules or 256 I/O with duplicate addressing of I/O modules.

Devices other than the 1771 I/O chassis behave as a certain numberof equivalent or partial racks. I/O can be divided between thedifferent channels in any combination of 1/4 racks.

4. Specify I/O fault type and setting of last-state switch — For eachI/O chassis, you must specify whether the system is to handle anadapter fault as a major or minor fault. In addition, each chassis hasswitches that determine how outputs are treated in case of a majorfault. Outputs can either be left in their “last states” or turned off.

5. Select power supplies — Each I/O chassis requires a power supplyfor the I/O modules installed in it. You need to consider the currentrequirements of each I/O module installed in a chassis to select theappropriate power supply.

6. Record I/O addresses — Every I/O circuit has an address based onits rack number and module placement. You need to record addressesaccording to the configuration of chassis and devices youhave chosen.

7. Specify RS configuration — RS2 modules have jumpers thatdetermine whether built-in termination resistors for the remote I/Olink are inserted; RS5 modules have no built-in termination resistorsor jumpers, and terminator resistors must be added externally. EachRS must be configured using 6200 series software. You must specifythe jumper settings for the termination resistors and the parametersfor RS configuration.




3-3

Do the following to make decisions and record your I/O configuration.

1. Identify the locations in your plant that require installation of at leastone I/O chassis. Use Worksheet 3.1.

Although I/O may be wired to chassis in the same physical area,separate them into different groups if:

different ac power disconnects or phases are used you want to logically separate any groups of I/O there are high and low voltage I/O.

Consider each group to be a separate “location.”

As you identify chassis locations, make sure each one has facilitiesfor making a permanent and continuous connection from the chassisto earth ground. See chapter 3, “Grounding the Components,” in thePyramid Integrator Installation Manual (5000-6.2.10).

After you identify chassis locations, you may want to prepare asketch or diagram of your plant that shows the location of the PIsystem and the locations of all I/O chassis.

2. List each discrete digital and analog I/O and its electricalcharacteristics. For each chassis location you identified in step 1, usea copy of Worksheet 3.2 to record your data.

When you have listed the characteristics of each I/O, match eachwith an I/O module. For a list of I/O modules that are available, seethe Automation Products Catalog (AP 100).

Also list I/O for intelligent I/O modules. A variety of intelligent I/Omodules is available, including modules for axis positioning,peripheral interface, I/O communication, process control, andspecialized applications. These modules are also listed in theAutomation Products Catalog (AP 100).

8-, 16-, or 32-Bit I/O ModulesThree types of discrete digital I/O modules are available:

I/O modules: Each module contains a maximum of:

8�bit 8 I/O

16�bit 16 I/O

32�bit 32 I/O

Select 1771 I/O Modules


3-4

You can select any combination of 8-, 16-, and 32-bit discrete I/Omodules. However, to simplify I/O addressing and to help reduce thenumber of spare modules you need to keep on hand, you may want tochoose one type for all discrete I/O modules.

Use the following chart to help you make a choice.

If you already have: Or want to minimize the: Or: Then select

8�bit I/O modules in your plant cost per module need separately fused inputs/outputs 8�bit I/O modules

16�bit I/O modules in your plant cost per I/O point do not need separately fusedinputs/outputs

16�bit I/O modules

32�bit I/O modules in your plant number of modules want to minimize the space requiredfor I/O chassis

32�bit I/O modules

3. Determine the number you require of each I/O module you identifiedin step 2. For each I/O chassis location, use a copy of Worksheet 3.3.

4. List the intelligent I/O modules you require at the bottomof Worksheet 3.3.

5. List other devices you wish to include on the remote I/O link onWorksheet 3.3. Several such devices are listed at the beginning ofthis chapter. Consult your Allen-Bradley representative or localdistribution for more information about possibilities.

6. Finally, tally the I/O modules and devices you require onWorksheet 3.4. List each module and device you recorded onWorksheet 3.3, then enter the locations and quantities for each item.Use this worksheet as a guide to ordering 1771 I/O modules.

The next task in configuring remote I/O is to assign the modules you haveidentified to I/O chassis and to allocate chassis to remote I/O channels.Before we present the procedure for that, we provide an overview of howmemory on the RS is allocated for remote I/O. You need to know theseconcepts to complete the procedures in this chapter.

To perform the procedure that follows, you need to understand thefollowing concepts about how memory on the RS is allocated toI/O modules:

memory files for I/O I/O group and I/O rack I/O module density

1771 I/O Addressing Concepts




3-5

Memory Files For I/O

The RS includes files that store input and output information:

The: Does this:

input image file stores the status of inputs connected to the RS. The RS updates theinput image file once per I/O scan according to the states of the inputsconnected to it via the remote or local (RS5) I/O link. The LP andother PI modules can read the status of inputs from the inputimage file.

ATTENTION: You should not write bits to the input image area of thePI database that is being used to store input information from any I/Odevices attached to the RS5.

output image file stores the desired status of the outputs connected to the RS. LPmodules, a MicroVAX Information Processor, and other PI moduleswrite to the output image files to control outputs. The RS updatesoutputs once per I/O scan according to the contents of the outputimage table.

block�transfer memory block�transfer�write�files store data to be sent to block�transfermodules. Block�transfer�read�files store data received fromblock�transfer modules.

ATTENTION: You should not write bits to the block transfer data areaof the PI database that is being used to store block transferinformation from any I/O devices attached to the RS5.

Each digital discrete input module has a corresponding 8, 16, or 32 bits inthe input image file where the RS writes the input status from the inputmodule. Each digital discrete output module has a corresponding 8, 16, or32 bits in the output image file where the RS reads the output status itwrites to the output module.

Other I/O modules have corresponding bits (8, 16, or 32) in both the inputand output image files to allow bi-directional communication. In additionto the input and output image file bits, each block-transfer module requiresa block-transfer data table write block for sending data out to the moduleand/or a block-transfer data table read block for receiving data comingfrom the module.

I/O Module Density

The density of an I/O module is the number of input or output image tablebits that correspond to it. For example, an 8-input-bit module has a densityof 8. Similarly, a bi-directional module with 8 input bits and 8 output bitshas a density of 8. Density has no relevance with slave modules because aslave module only communicates with its master; it does not communicatedirectly with the adapter. In the procedure that follows,“Assign I/OModules and Devices to Chassis and Channels” on page 3-11, select anaddressing mode based on the density of your I/O modules. For moreinformation on density, see appendix B.


3-6

I/O Groups and I/O Racks

The RS allocates memory in the input and output image sections in units of16-bit words that reflect the status in I/O groups (Figure 3.1). One I/Ogroup corresponds to one word in the input image section and one word inthe output image section.

Figure 3.1Memory Allocated For I/O Groups and Racks

0

1

2

3

4

5

6

7

0 1 2 3 4 5 6 7

Word

Input image file16�bit words

Output image file16�bit words

I/O group

One I/O rack17090




3-7

A set of eight contiguous I/O groups (0 – 7) is called an I/O rack. EachI/O rack corresponds to 8 input words and 8 output words. Each RS2 canaddress up to 8 I/O racks and each RS5 can address up to 32 I/O racks:

The groups in each rack are numbered 0 – 7.

2�Slot, 1�Slot, and 1/2�Slot Addressing

By setting switches on each I/O chassis, you determine how I/O groups areallocated to slots in the chassis (Figure 3.2):

Figure 3.2I/O Addressing Methods

I/Ochassis

Group 01 slot

Group 11 slot

Group 12 slots

Group 02 slots

Group 01/2 slot

Group 11/2 slot

I/Ochassis I/O

chassis

Output image file Output image file Output image file

Input image fileInput image fileInput image file

2�slot Addressing 1�slot Addressing 1/2�slot Addressing

16712

If you set switches on anI/O chassis so there are:

Then input and output image memory is allocated asfollows:

And the addressingmethod is known as:

2 slots per I/O group one input image word (16 bits) and one output image word(16 bits) for each 2 slots

2�slot addressing

1 slot per I/O group one input image word (16 bits) and one output image word(16 bits) for each slot

1�slot addressing

1/2 slot per I/O group one input image word (16 bits) and one output image word(16 bits) for each 1/2 slot [two input image words (32 bits)and two output image words (32 bits) for each slot

1/2�slot addressing


3-8

Depending on how you assign modules to slots in I/O chassis, some of thebits in an I/O group may not be used. For example, if you set a chassis for1-slot addressing (16 input bits and 16 output bits allocated in memory foreach slot) and install a 16-bit input module in a slot, the 16 input imagebits allocated for that slot will correspond to the inputs of the module, butthe 16 output bits will not be used. Similar considerations apply for othercombinations of addressing method and module density. Careful selectionof an addressing method will make sure that you get the most efficient useof available memory.

The location address of an I/O circuit is its I/O rack number, its I/O group(word) number within the I/O rack, and its I/O number within its I/Ogroup. A maximum of 4096 I/O can be uniquely addressed in aPLC-5/250 processor. If more than 4096 I/O are needed, the I/Oconfiguration cannot provide a unique location address for each I/O.However, by duplicating I/O location addresses, you can configure amaximum of 4096 inputs plus 4096 outputs. You can duplicate I/Oaddresses by either of the following ways:

duplicate addressing of adjacent I/O modules duplicate addressing of a pair of I/O chassis

If you duplicate I/O addresses by either of these ways, you must followthese rules:

An output module can have the same location address as another outputmodule; however, these parallel outputs will be controlled by the sameoutput-image-table bits. This is parallel output addressing.

An input module cannot have the same location address as another inputmodule, although an input module can have the same location address asan output module. This is complementary I/O addressing.

Some I/O modules require bi-directional communication with thePLC-5/250 processor, using both input bits and output bits in memory.A block-transfer is always bi-directional. Because it requires both inputbits and output bits in memory, each bi-directional I/O module must beassigned a unique location address.

If you duplicate the address of adjacent I/O modules within an I/Ochassis such that I/O location addresses are duplicated, do not duplicatethe address of those modules in another chassis.

If you duplicate the addresses of I/O modules from one I/O chassis toanother, do not duplicate the address of adjacent I/O modules withineither of those I/O chassis.

More than 4096 I/O (DuplicateI/O Location Addressing)




3-9

Duplicate Addressing of Adjacent I/O Modules

A pair of adjacent I/O modules in a chassis will have the same locationaddress in either of the following configurations:

16-bit modules in a chassis configured for 2-slot addressing 32-bit modules in a chassis configured for 1-slot addressing

In either case, both modules in an even-odd pair of slots are addressed bythe same set of input and output image bits. Therefore, this type ofconfiguration cannot work if both modules are trying to use the inputimage bits. Figure 3.3 shows duplicate addressing of a 16-input moduleand a 16-output module in a 2-slot I/O group for complementaryI/O addressing.

Figure 3.3A pair of 16�bit I/O modules in a 2�slot I/O group illustratingcomplementary I/O the input module uses only the input image word the output module uses only the output image word

17 16 15 14 12 10 07 06 05 03 02 01 00041113

00010203040506071011121314151617

00010203040506071011121314151617

InputTerminals

OutputTerminals

2�slot I/O Group

15559

Output image word corresponding to the I/O group

Input image word corresponding to the I/O group

17 16 15 14 12 10 07 06 05 03 02 01 00041113


3-10

Duplicate Addressing of a Pair of I/O Chassis

You can configure a pair of I/O chassis such that the location address of theI/O modules on one are duplicated on the other if you adhere to thefollowing rules:

1. The two I/O chassis with duplicate addresses must be on two differentremote I/O links of the same scanner.

2. The two I/O chassis must have the same I/O rack number, the samestarting I/O group number, and the same number of I/O groups.

3. In an I/O chassis configured for 2-slot addressing within an I/Ogroup, both modules must be inputs or both must be outputs for thoseaddresses to be duplicated in another chassis.

4. If you configure a pair of I/O chassis for duplicate addressing, youcan install a block-transfer module into only one of them. The I/Ochassis that needs block-transfer must be configured before it’sduplicate chassis is configured. In the duplicate chassis, the moduleslot corresponding to the block-transfer module must be either leftempty or used for a power-supply module or other module that doesnot use any I/O image bits.

Where a module in one chassis has the same (duplicate) address as amodule in another chassis, both are addressed by the same set of input andoutput image bits. Therefore, this type of configuration cannot work ifboth modules are trying to use the input image bits. Figure 3.4 shows I/Omodules in one I/O chassis with addresses that duplicate the addresses ofI/O modules in another chassis.




3-11

Figure 3.4Example of a pair of I/O chassis with I/O�group addresses on oneduplicated on the other for complementary I/O addressing

RS5Scanner

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1

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3

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2

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0

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1

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I/O Rack 1

I/O Rack 1

Input�module I/O groups in the CH�1chassis and output�module I/O groups inthe CH�2 chassis complement each other.Output�module I/O groups in the CH�1chassis and output�module I/O groups inthe CH�2 chassis complement each other.

Since the CH�1 chassis contains a block�transfer module, thecorresponding slot in the CH�2chassis is left empty.

CH 1

CH 2

After you select the I/O modules you need for each chassis location, youcan begin the process of assigning them to chassis. Use Worksheet 4.1 andWorksheet 4.2 and follow the instructions below. You’ll need one copy ofWorksheet 4.1 for each I/O chassis, and one copy of Worksheet 4.2 foreach I/O channel on each RS.

Important: You will probably have to make adjustments to your initialmodule assignments, or re-configure the chassis on an I/O channel to meetperformance requirements. You may need to repeat this procedure. Makeextra copies of the worksheets, or use pencil to fill them out in caseadjustments must be made.

Assign I/O Modules andDevices to Chassis andChannels


3-12

1. Choose an addressing method from Table 3.A. Your choiceinfluences the way you can assign modules to I/O chassis slots.

Important: You select the addressing method for each I/O chassisindependently by setting switches on the chassis. You can selectdifferent addressing methods for different chassis. To reduceconfusion, however, we recommend that you choose one addressingmethod for all I/O chassis, or at least minimize the variations.

Table 3.AChoosing an Addressing Method

If the densest I/Omodule has a density of:

Then use: And place I/O modules:

8 bits 2�slot addressing any mix of 8�bit modules in adjacent module slots.

assign one rack number per 16�slot I/O chassis.

16 bits 1�slot addressing any mix of 8�bit and/or 16�bit I/O modules inadjacent module slots.

assign two rack numbers per 16�slot I/O chassis.

2�slot addressing wherever you place a 16�bit I/O module, in theadjacent slot of an even/odd pair, you can onlyplace a module that is complementary to it. Inputs and outputs complement each other.

32 bits 1/2 slot addressing any mix of 8�bit, 16�bit, and/or 32�bit I/O modulesin adjacent module slots.

assign 4 rack numbers per 16�slot I/O chassis.

1�slot addressing wherever you place a 32�bit I/O module, in theadjacent slot of an even/odd pair, you can onlyplace a module that is complementary to it. Inputs and outputs complement each other.

assign 2 rack numbers per 16�slot I/O chassis.

2. Select the number of I/O you want to use in your system. An I/Ochannel is a group of one or more chassis connected together and isscanned independently of other channels.

Each RS2 can accommodate two remote I/O channels. You canassign up to 8 unique full rack addresses, or a maximum of 32adapters (addressing 1/4 racks), per RS2, for a total of 1024 inputsand outputs.




3-13

Each RS5 can accommodate four remote I/O channels. You canassign up to 32 unique full rack addresses, or a maximum of 128adapters (addressing 1/4 racks), per RS5, for a total of 4096 inputsand outputs.

RS2 pushwheelsetting:

I/O racks addressed (in octal):

1 00 - 07

2 10 - 17

3 20 - 27

4 30 - 37



I/O racks addressed(in octal):

1�1 1 00 � 07

1�2 1, 2 00 � 17

1�3 1, 2, 3 00 � 27

1�4 1, 2, 3, 4 00 � 37

2�2 2 10 � 17

2�3 2, 3 10 � 27

2�4 2, 3, 4 10 � 37

3�3 3 20 � 27

3�4 3, 4 20 � 37

4�4 4 30 � 37

You can divide the total I/O between the two channels of the RS2 orfour channels of the RS5 on 1/4 rack boundaries. Chassis in differentlocations can be connected on the same channel.

You can include up to four RS modules in each PI chassis.

For each: Count:

RS2 2 remote I/O channels.

RS5 4 remote I/O channels.

Important: You must have at least baseline A08 firmware for theRS5 to work properly.

3. Assign the modules to I/O chassis. List your assignments onWorksheet 4.1.

Each RS2 can address 8 I/O racks. Each RS5 can address 32 I/Oracks. You can divide racks into chassis of 2, 4, 6 or 8 I/O groups.You can divide the chassis between the channels in any combinationwithin the rack addressing restrictions. Use the guidelines in thefollowing table when assigning modules to chassis.


3-14

If the addressingmethod is:

Then assign modules this way (see notes):method is:

8�bit modules: 16�bit modules: 32�bit modules:

2�slot addressing any mix one input and one output module inan even/odd pair of slots

not allowed

1�slot addressing only if necessary any mix. Should be the majority ofmodules.

one input and one output module inan even/odd pair of slots

1/2�slot addressing only if necessary only if necessary any mix

NOTES:

chassis size 16�slot, 12�slot, 8�slot, and 4�slot chassis are available. Each chassis requires a separate adapter module andpower supply.

block�transfer modules If you assign each block�transfer module to a separate chassis, a block transfer can be performed foreach module on each remote I/O scan, but overall scan time will be increased because of the increased number of transfers and chassis.

If you assign more than one block�transfer module to a chassis, the number of chassis may be reduced, thus reducing overall I/Oscan time, but not every block�transfer module can be serviced on each scan. This increases the effective throughput times forblock transfers.

analog I/O modules Analog I/O modules draw considerable current from the chassis power supply. While it may be desirableto isolate analog I/O modules in a separate chassis, you may also want to distribute them among chassis to distribute the currentrequirement and improve the scan time per analog I/O channel.

input and output modules Unless your addressing mode demands it, separate input and output modules to reduce electricalnoise effects.

high and low power modules Separate high and low power I/O modules to minimize radiation of electrical noise interferenceinto low level modules (i.e. separate low level dc from ac).

4. Use the following table to choose a signalling speed for each I/Ochannel. Record your choice on Worksheet 4.1.

If the I/O link is: And/or: Then choose thissignalling speed:

more than 5,000 cable feet, but less than10,000 cable feet long

OR some devices on the link require it 57.6k bit/s

less than 5,000 cable feet long AND all devices on the link can operateat the higher rate

115.2k bit/s

less than 2,500 cable feet long AND all devices on the link can operateat the higher rate

230.4k bit/s

5. Use Worksheet 4.2 to calculate the block-transfer time of eachblock-transfer module in each chassis.

Important: The calculation in Worksheet 4.2 only provides the timerequired to complete the transfer on the remote I/O link. It does notinclude any of the other steps in the block-transfer process. Wepresent these calculations to help you determine worst case I/O scantime and make necessary adjustments. For total block-transfertiming considerations, see chapter 4.




3-15

Each I/O chassis requires a power supply. Use Worksheet 3.5 to selectpower supplies for your I/O chassis. Use one copy of Worksheet 3.5per chassis.

When you have selected the power supplies, fill in the power supplysection of Worksheet 3.8.

Use Worksheet 3.6, Worksheet 3.7 and Worksheet 3.8 to record the I/Oaddress and symbolic name (if any) of each I/O.

With no more than 4096 I/O, each I/O chassis, module, and terminal has aunique address that the PLC programmer uses to identify it. The codedformat of the I/O address in the I/O image file corresponds to the physicallocation in the I/O chassis.

Table 3.B lists the physical specifications for RS modules.

Table 3.BRS Specifications

Physical specifications: RS2: RS5:

current draw on:+5V supply+12V supply

2.2 A14 mA

5 A16 mA

memory support (battery) ÀA' lithium battery ÀA' lithium battery

operating temperature 0 - 60°C (32 - 140°F) 0 - 60°C (32 - 140°F)

storage temperature -40 - 85°C (-40 - 185°F) -40 - 85°C (-40 - 185°F)

humidity 5% - 95% non�condensing 5% - 95% non�condensing


406mm x 85mm x 238mm15.97" x 3.34" x 9.38"

406mm x 85mm x 238mm15.97" x 3.34" x 9.38"

weight (kg/lb) 1.67 kg (3 lbs, 11.0 oz) 1.35 kg (2 lbs, 15.6 oz)

Select Power Supplies

Record I/O Addresses

RS Specifications

Chapter 4

4-1

Planning to Use Remote I/O with theRS Module

Read this chapter to learn how to design the remote I/O channels on theRS module.

Block-transfer times depend on several RS and adapter considerations.The main factors in determining the length of time of a block-transferare the:

number of adapters on the remote I/O link number of racks for which each adapter is configured number of block-transfer modules associated with the adapters number of simultaneous block-transfer read (BTR) and block-transfer

write (BTW) operations number of queued block-transfer requests response time of the block-transfer module

Figure 4.1 shows how the RS processes a block-transfer request. Use thesteps in this diagram and the steps that follows the diagram to estimate theamount of time it takes to complete each step of a block-transfer request.

Chapter Objectives

Remote Block�TransferTiming



Chapter 4Planning to Use Remote I/O with the RS Module

4-2

Figure 4.1How a RS Processes a Block�Transfer Request

BT Control FilesBT DataTable

I/O Image Table

Ladder Program

BT InstructionInput Output

Input Output

BT Queue

I/O Image Table

BT Module

PLC-5/250 Chassis

I/O Chassis

1

8

10

Adapter

6

RS LP

Buffer

2

8

9

3

4

5

7

2

The following steps list the block-transfer process (Figure 4.1):

1. A LP executes a block-transfer instruction and sends a block-transferrequest to the appropriate RS.

2. RS writes the command byte to the output image table. This timedepends on how many adapters ahead of the subject adapter have ablock-transfer to process. If you have a RS5, for a block-transferwrite (BTW), the RS5 reads the block of data into a buffer.

3. At the next I/O scan, the RS delivers the block-transfer request to theI/O adapter’s output image table. Depending on the time at which theRS receives the block-transfer request, there may be a delay of up toone I/O scan before the request is delivered to the I/O adapter.

4. Remote I/O adapter passes the block-transfer request to theappropriate block-transfer module as part of the discrete I/O transfer.

5. When the block-transfer module is ready to perform the requestedtransfer, it informs the adapter module in its chassis. A delay of atleast one I/O channel scan is introduced here. The total delay variesdepending on the time required by the block-transfer module toprepare for block-transfer.


4-3

6. If other block-transfer requests are queued in the adapter moduleahead of the desired request, these will be executed first. This adds adelay of one I/O channel scan per queued block-transfer.

7. Adapter returns the block-transfer request to the RS stating that theblock-transfer module is ready to transfer.

8. The desired block-transfer is performed. The time it takes to performthe transfer is per the formulas in Worksheet 4.1.

For a RS5, if you have a block-transfer read, the block-transfermodule transfers data to the block-transfer data table; if you have ablock-transfer write, the data is transferred from the buffer to theblock-transfer module.

9. The RS informs the LP that the block-transfer is complete.

10. Ladder program updates status bits in block-transfer control file.

After you assign remote I/O to chassis, do the following:

1. Assign the I/O chassis to the available I/O channels.

Assign all time-critical chassis to the channel with the fewestadapter modules and other devices to help reduce scan time.

Place all non-time critical chassis on another channel. If necessary to improve I/O scan time or to enhance logical or

functional grouping, further divide the chassis into more chassis ofsmaller sizes.

List the chassis in each channel on Worksheet 4.2.

This will be a preliminary assignment. You may have to change yourconfiguration after calculating I/O scan times.

2. Use Worksheet 4.2 to calculate the worst case I/O scan time foreach channel.

If worst case scan time is too high to meet your performancerequirements, reassign modules to reduce scan time. You may needto create additional channels to accommodate critical I/O.

3. When you have finished assigning modules to chassis andconfiguring channels, record the number of chassis, I/O adaptermodules, RS modules, and cables on Worksheet 3.8. Also documentthe chassis on each channel on Worksheet 3.7.

For more information, see the PLC-5/250 Programming SoftwareProgramming Manual (5000-6.4.8).




4-4

RS5 Limitations

A total of 46 buffers are available for block-transfers and single-transferscanning within a given remote I/O link. If you have multipleblock-transfers active simultaneously within a chassis, you must determinethe number of buffers your block-transfers require. To do that, followthese steps:

1. List each scan list entry (SLE) on the link.

There is one SLE per rack in a chassis. If you have 2 racks perchassis, you have 2 SLEs.

2. List the number of block-transfers (SBT) within the SLE that couldbe executed simultaneously by the ladder logic.

3. Subtract each number of SBTs by 1 and write down the results.

4. Add all the results from step 3.

5. Determine the number of different I/O rack numbers on that link.You can have a maximum of 14 racks per link.

6. Add the results from steps 4., 5. and 1.

If the total is greater than 46, you cannot use the formula inWorksheet 4.1 to calculate the block-transfer time. If you exceed 46,simultaneous block-transfers cannot get into the queue because theyare waiting for buffers that are already used. To overcome this, youshould provide queuing logic in your ladder program so that theseblock-transfers will not be executed simultaneously.

If the total is less than 46, all the simultaneous block-transfers will beexecuted in sequence because buffers are available for them to getinto the queue.

SLE SBT SBT - 1

1

2

3

4

5

2

3

2

5

0

1

2

1

4

0

Total 8

Example:

Total for SBT-1 = 8I/O racks = 14SLE = 5

27

Less than 46, okay.

More than 46,warning

SLE = Scan List Entry

SBT = Simultaneous Block�Transfer


4-5

In addition to scanning remote I/O devices, you can set up a remote I/Ochannel in the RS to be in direct communication with a supervisoryprocessor, such as a PLC-3 or PLC-5 processor. In this set-up, the RSchannel appears as a 1771-ASB adapter module on the remote I/O link ofthe supervisory processor. The communication with the supervisoryprocessor is through the I/O image corresponding to an I/O rack assignedto the RS.

When a channel of the RS is configured for direct communication with asupervisory processor, the PLC-5/250 processor and the supervisoryprocessor can exchange data in real time. The two processors cansingle-transfer up to seven words of data (plus a status word) and/orblock-transfer up to 64 words of data each scan in either direction perblock-transfer instruction.

Important: RS2 can only send block-transfer requests to slot 0; whereasRS5 can send block-transfer requests to all slots.

Figure 4.2 shows an example set-up for direct communication.

Figure 4.2Example of Direct Communication Mode

19757

RMPower supply

LP

RS5 modules

Supervisor processor

1771�ASB adapter

Remote I/O chassis

Remote I/O linkOne channelof 1775�S5A

To additionalremote I/O chassis

4�slotchassis







This I/O port is inadapter (DCM) mode

Plan for Direct CommunicationMode (Adapter Mode)




4-6

When single-transferring I/O data, the supervisory processor transfers anI/O rack of its output image data word-by-word to the corresponding inputimage address specified in the RS input image file. At the same time, theLP transfers data word-by-word from the output image address you specifyfor the RS channel to the corresponding input image rack address in thesupervisory processor. Figure 4.5 shows this data transfer.

Single-transfers of I/O data take place automatically at each remoteI/O scan.

Figure 4.3Single�Transfer of I/O Data in Direct Communication Mode

Rack 7

SupervisoryProcessor

Rack 7

Memory

Rack 3

Rack 3OutputImage

File

InputImage

File

Program

PLC-5/250 Processor

OutputImage

File

InputImage

File

To the adapter-mode processor, the supervisory processor looks like one ofthe I/O racks of the adapter-mode processor. In this example, theadapter-mode PLC-5/250 processor addresses the scanner as if it wererack 3 of the adapter-mode processor.

To the supervisory processor, the adapter-mode processor looks like anyother I/O chassis of its remote I/O link.


4-7

Of the 8 input-image words and 8 output-image words, only words 1through 7 can be used for single-transfer of I/O image data. You canblock-transfer in up to 64 words and block-transfer out a maximum of 64words with each block-transfer instruction. If you have more than oneblock-transfer instruction, each block-transfer can address a separate byte.Once that byte is used, you cannot use the same byte for single-transfer.

bit

071017Word

0 Status Block�transfer only

1

2

3

4

5

6

7

Can be usedfor single�transferand block�transfer.

Choosing to Use Direct Communication Mode

Use direct communication mode when you have a communication of arelatively small amount of data at regular, predictable intervals. Anotherway to transfer data between other PLC processors and the PI system is viathe DH or DH+ links connected to the RM. Use the following table to helpyou choose the method best suited to your application:

If communication: Or: And: Then use:

must be at frequent,predictable intervals

a remote I/O linkalready exists

involves a smallnumber of words

direct communicationmode

can be at a lesspredictable rate

involves a variety ofstations other thanPLC controllers

involves large amountsof data

DH or DH+ network

must take place on aprogramming network

--




4-8

Tasks You Must Perform

If you choose to use direct communication mode, you must specify the:

RS(s) and channel(s) to be used for direct communication

I/O image areas to be used for direct communication in both thesupervisory processor and the RS

data to be communicated between the PLC-5/250 processor and thesupervisory processor

Assign the Channel for Direct Communication ModeAny remote I/O channel on any RS can be used for direct communicationmode. You can configure all four remote channels of a RS5 to be used indirect communication mode.

For best discrete data-transfer performance, limit the number of adaptermodules and other direct communication mode slave processors on thesupervisory processor’s remote I/O link. This number is dependent on thelink’s block-transfer loading: increase it for less block-transfer loading;decrease it for more loading.

Record your choice on Worksheet 4.4.

Assign I/O Image AreasThe RS must set aside some memory to store data received from thesupervisory processor, and to store data to be transmitted to the supervisoryprocessor. Specify each of the following:

I/O rack number starting I/O group number amount of data to transfer

Select a rack address for both the supervisory processor (master) and theRS channel reserved for direct communication mode. You can make theaddress numbers for these areas the same (for simplicity) or different.Then, select a starting I/O group number for each I/O image area.


4-9

Supervisory Processor Rack Number — is the rack number of themaster’s I/O image table assigned to the slave. Treat the slave RS as if itwere another remote I/O adapter module (1771-ASB). Assign a racknumber that corresponds to the physical location of the RS in the master’sremote I/O link. The following table lists the rack number ranges of somerepresentative masters (other masters could include the PLC-2/30, Q-Busscanner, or PLC-5/VME processors):

Supervisory processor: Range of rack numbers (octal):

PLC�5/11 processor 1 � 3



PLC�5/25, �5/30 processor 1 � 7

PLC�5/250 processor 00 � 37 (depends on RS address)

PLC�3 processor 00 � 37

PLC�5/40, �5/40L processor 1 � 17

PLC�5/60, �5/60L processor 1 � 27


Supervisory Processor Starting I/O Group Number — is the startingI/O group number within the I/O rack area in the supervisory processor.

Size — the starting I/O group number of the processor plus the number ofsingle-transfer words must equal 8 or less. This makes sure that the rackaddress area assigned for direct communication mode does not spill intoanother rack address area.

RS Rack Number — is the I/O rack number assigned to the RS channeldedicated to direct communication (adapter) mode.

If the channel for Direct CommunicationMode is on logical scanner:

Choose a rack number in this range(octal):

1 00 � 07

2 10 � 17

3 20 � 27

4 30 � 37

RS Starting I/O Group Number — is the starting I/O group numberwithin the I/O rack area in the RS.

Size — the starting I/O group number of the RS plus the number ofsingle-transfer words must equal 8 or less. This ensures that the areaassigned for direct communication mode does not spill into another rackaddress area.




4-10

Assign Data to TransferPrepare a design specification that details the data to be transferredbetween the supervisory processor and the RS in adapter mode. Alsospecify the programming that must be included in the PI system to preparedata for transmission to the supervisory processor and to process the datareceived from it. Pass the design specification to the PLC-5/250program developer.

The RS2 has jumpers that must be set and a number of parameters thatmust be specified in PLC-5/250 programming software. UseWorksheet 4.3 to record your choices.

Configure Termination Resistors for RS2

The RS2 has an internal 150-Ohm termination resistor for each remote I/Ochannel. Each resistor has a jumper that controls whether the resistor isconnected across the link or not. See Table 4.A to configure yourtermination resistors.

Table 4.ADetermine Termination�Resistor Configuration for RS2

If transmission rate is: And RS2 is physicallylocated:

Then put the internal 150�Ohmtermination resistor jumper in the:

57k bits/s or 115.2k bits/s middle of remote I/O link out position

end of remote I/O link in position

230.4k bits/s middle of remote I/O link out position

end of remote I/O link out position, and attach 82�Ohmtermination resistor between pins 1and 3

See Worksheet 4.3 for further instruction.

Configure Termination Resistors for RS5

For RS5, you need to use external termination. If the RS5 is physicallylocated at the end of the remote I/O link, attach the resistor between pins 1and 3. For 57k or 115.2k bit/s, use 150-Ohms; for 230.4k bit/s, use82-Ohms.

Configuration Parameters

In PLC-5/250 programming software, the system integrator sets thechannel mode to I/O scan mode, direct communication mode, or inactive.

Specify RS Configuration

Chapter 5

5-1

Planning to Use Local I/O with theRS5 Module

Read this chapter to learn how to configure the local I/O for your system.

The local I/O scan is independent of and asynchronous to the remote I/Oscans and the program scan. The local I/O scan is faster than the remoteI/O scans. The local I/O channel single-transfers and block-transfers I/Odata between the RS5 scanner and ALX adapters.

Single�Transfer Scan Procedure

1. Write output image data to each ALX adapter in sequence.

2. Read input image data from each ALX adapter in sequence.

Write toALX #1

Read fromALX #1

Write toALX #2

Write toALX #3

Read fromALX #2

Read fromALX #3

Start of single�transfer scan

End of single�transfer scan

Chapter Objectives

UnderstandingSingle�Transfers andBlock�Transfers



Planning to Use Local I/O with the RS5 ModuleChapter 5

5-2

Block�Transfer Scan Procedure

1. For the first ALX adapter, if a block-transfer command is queued upat the scanner, the scanner sends the command to the adapter.

In the case of a write, the write-block data is included in thecommand packet.

2. For that same first ALX adapter, if a block-transfer reply is ready, theadapter sends the reply to the scanner.

In the case of a read, the read-block data is included in thereply packet.

3. For each additional ALX adapter, a command is sent if queued up inthe scanner and a reply is sent if ready in the adapter.

Start of block�transfer scan

End of block�transfer scan

If BT in queue for ALX #2,send command to ALX #2.If BTW, include data block.

If ALX #1 has BT reply,send it to scanner. If BTR, include data block.





BT = block�transfer BTW = block�transfer writeBTR = block�transfer read


5-3

For a given number of I/O adapters and I/O racks on the local I/O link, thetime required to single-transfer all I/O image data is constant. Thissingle-transfer scan occurs at the start of each local I/O scan. When youconfigure the local I/O channel, you can select the total time periodbetween starts of single-transfer scans to be either 10, 20, 30, 40, 50, 60,70, 80, 90, or 100ms. You must select a value greater than thesingle-transfer scan time. The remainder of the time between the end ofeach single-transfer scan and the start of the next single-transfer scan isused by the link for block-transfer. For example, if the single-transfer scantakes 5ms, and you set the time period between starts of single-transferscans as 20ms, the last 15ms of each local I/O scan is used to execute asmany block-transfers as possible.

5ms

Single�transfer Time

Block�transfer Time

Time20msExample with scan

period set to 20ms

With this selection, you balance the need for quick single-transfer responsewith the need for quick block-transfer response. Select the largest periodbetween starts of single-transfer that still provides the single-transferresponse you need; this will optimize the block-transfer response.

Alternatively, you can enter a value of 0 (zero) for the scan period. This isthe default value and is a special case. With a value of zero selected for thescan period (instead of a fixed period being set), after completing asingle-transfer scan, the scanner goes through one complete block-transferscan of all ALX adapters before beginning the next single-transfer scan.For a description of a complete block-transfer scan of all ALX adapters,see “Block-Transfer Scan Procedure” on page 5-2.

Single�transfer Time

Block�transfer for ALX #1

TimeExample with scan period set to 0 forconfiguration with 4 ALX adapters




Multiplexing BetweenSingle�Transfer andBlock�Transfer




5-4

The time required for the local I/O channel to complete a single-transferscan is:

ST = (A x 0.32ms) + (R x 0.13ms)

Where: Is:

ST the single�transfer scan time

A the number of ALX adapters

R the number of local I/O racks

The time required for the local I/O channel to complete a specificblock-transfer (using worst-case assumptions) from the time it is queued upuntil the done bit can be set is:

BT = R x ((2 x B x M) + (0.1 x W)) ms

If the value set for the scan period between starts of single-transfer scans is0 (zero):

R = ———————B + ST

B

and if the value set for the scan period between starts of single-transferscans is 10 – 100ms:

R = ———————SP

SP – ST

Where: Is:

BT the worst�case total time it takes for a specific block�transfer command to getthrough the queue and adapter to the module, and then the reply to get throughthe adapter back to the scanner

B the number of I/O chassis with active block�transfer modules

M the number of active block�transfer modules in the I/O chassis in question

W the number of words in the block to be transferred

ST the single�transfer scan time

SP the value set for the scan period between starts of single�transfer scans

Calculating Single�TransferScan Time

Calculating Worst�CaseBlock�TransferExecution Time

Chapter 6

6-1

Planning to Use the LP Module

This chapter helps you plan for using LP modules in your PI application.In this chapter, you will:

create a design specification for the PLC program developer select the appropriate number of LP modules for your application estimate the memory size required for each LP provide the hardware installer with information about installation of the

LP modules

Follow the instructions presented and use the worksheets.

In this chapter, you will estimate the number of LP modules and memorysizes you need. The PLC-5/250 program developer might do a moredetailed program analysis and suggest changes to the number of LPmodules and their memory capacities. Consult with the program developerwhile performing the tasks of this chapter to make sure your estimates areas accurate as possible.

The number of LP modules required depends to a large extent on the needsof the PLC program. To help analyze these needs, prepare a designspecification for the PLC program that includes:

a series of statements that describe the machine or process operation

the list of specified equipment to monitor and control the machine orprocess operation

a hardware block diagram that shows the placement of the machinery,switches, sensors, motors, actuators, etc.

See the PLC-5/250 Programming Manual (5000-6.4.8) for moreinformation about the specification required. Make sure the programdeveloper receives a copy of your design specification.

Use the design specification you create to help you perform the other tasksin this chapter.

Chapter Objectives

Create a Design Specification



Chapter 6Planning to Use the LP Module

6-2

Example of Programming Specification

Hardware Block Diagram

OFF

AUTO

Advanceassembly

Drillmotor

NC LS2

Held open

LS3 NO LS4NO

LS1

LS5

FWD

Conveyormotor

FWD

Clamp

CL1

16914

List of Hardware

Input: Part: Description:

AUTO selector switch select automatic mode

LS1 limit switch part in place

LS2 limit switch drill station home

LS3 limit switch drill motor on

LS4 limit switch drill station at full depth

LS5 limit switch cycle complete

Output: Part: Description:

DSF drive motor move drill station forward

DSB drive motor move drill station back

DM drill motor drill motor on

Output: Part: Description:

CL1 electric clamp clamp 1 on

CMF drive motor move conveyor forward

TMR1 timer dwell timer


6-3

Narrative of Machine Operation

When this happens: Do this:

the operator selects AUTO start the conveyor

the operator puts a block of wood on the conveyor --

the wood moves into position and actuates LS1 stop the conveyoractuate CL1 to clamp the woodmove the drill station forward

the drill station moves forward and closes LS3 turn on the drill motor

the drill station moves to full depth and closes LS4 stop forward motion of the drill stationinitiate a 2�second dwell

the 2�second dwell ends back up the drill station

the drill station releases LS3 stop the drill motor

the drill station reaches home and opens LS2 stop the drill stationopen the clampstart the conveyor forward

the ejected wood toggles LS5 cycle is complete

To determine the number of LP modules you need, consider these factors.Use Worksheet 6.1 to record the results of your selection process.

Consider PI Limits

Each PI chassis can contain up to 4 LP modules.

Consider Logical Divisions of the Program

Examine the design specification and divide the various program functionsinto logical groups. For example, some possible logical divisions are:

control of the machine or process operation (there may be separatelogical groups for independent processes or machines)

fault detection and handling

data gathering and report generation

message display

Determine the Number of LPModules You Need




6-4

Consider assigning logical groups of functions to separate LP modules if itis important to:

improve performance by utilizing concurrent processing — separate LPmodules execute their programs independently and simultaneously, or ascoordinated by your sequential function chart.

add memory — one LP4 can store up to 2048K words of compiled logiccode. If this is insufficient for your program, you need to addanother LP.

Record your logical divisions on Worksheet 6.1. You may have to revisethis worksheet as you consider other factors.

Consider Program Performance

For each LP, use Worksheet 6.2 to estimate program size and executiontime. Use Worksheet 6.3 to estimate performance and decide if additionalLP modules are necessary.

If your configuration can accommodate no more LP modules, you mayneed to reassign functions to existing LP modules or consider other designtechniques, such as distributed architecture. You may have to considerother techniques to reduce program size, such as using local PLC-5processors on the remote I/O link or DH link instead of the PLC-5/250processor to perform some functions. Such techniques may also provideother advantages, such as speed.

Consider LP Limits

Each LP has limits within which you must apply it:

LP limits: Description:

four processor inputinterrupts (PII)

each LP has four inputs for PIIs. When one of these 12 - 24V dcinputs goes high, the LP stops executing its program and executes apre�defined logic file.

eight selectable timedinterrupts (STI)

each LP can execute up to eight STIs. An STI routine, stored in aprogram file, is executed in the LP background task at pre�definedtime intervals. See Worksheet 6.6.

four independentbackground tasks

each LP can execute up to four independent background tasks. Eachtask can contain any number of independent background programs(IBPs), with up to 32 queued for execution. These tasks are executedin the LP background execution.

Use Table 6.A to help you choose the number of LP modules required tomeet your needs for PIIs, STIs, and IBPs. Remember that the total numberof LP modules you can include in your system also depends on the othermodules in the system.


6-5

Table 6.ADetermine the Number of LP Modules You Need

If you need to use: And the number required is: Then you need :

processor input interrupts less than 4 1 LP

5 - 8 2 LPs

9 - 12 3 LPs

13 - 16 4 LPs

selectable timed interrupts less than 8 1 LP

9 - 16 2 LPs

17 - 24 3 LPs

18 - 32 4 LPs

independent background tasks less than 4 1 LP

5 - 8 2 LPs

9 - 12 3 LPs

13 - 16 4 LPs

Use Worksheet 6.4 to choose which LP to use based on memory. Foursizes are available: 256, 512, 1024, and 2048K word.

Consider Memory Function

See the memory map in the 6200 software to determine how muchmemory is available on the LP.

Consider Program Size

Worksheet 6.2 will help you estimate program size. Because thePLC-5/250 controller uses compiled code, it might be useful to have a veryrough way to compare the memory required for a PLC-5/250 program tothat required for program storage on a PLC-3 controller.

LP memory size: PLC�3 equivalent programsize (worst case):

PLC�3 equivalent programsize (typical):

Cat. no.: Maximum data table size:

Comments:

256K words 48K words 96K words 5250�LP1/B 256K words Actual equivalentwill vary

512K words 85K words 170K words 5250�LP2/B 512K wordswill vary,depending onprogram structure

1024K words 170K words 340K words 5250�LP3/B 1024K wordsprogram structure,instruction mix,a d othe facto s

2048K words 341K words 682K words 5250�LP4/B 1024K wordsand other factors.

Select Which LP




6-6

The RM is available with 2 sizes of memory: 128 and 384K words. Selectthe size you need based on how much global data you need to store. Datathat must be accessed by more than one LP must be stored on the RM.You can also use the RM data storage area to store local data for a LP inorder to free up LP memory for program storage.

Use your estimates of program size (Worksheet 6.2) and data requirementsto estimate the amount of global data storage you require. Use thefollowing table to choose which RM to use. Record your choiceon Worksheet 6.4.

If your requirement for globaldata storage is:

Then use this RM:

small 5130�RM1 (128Kwords)

large 5130�RM2 (384Kwords)

Complete a copy of Worksheet 6.5 for each LP to be installed. Thisworksheet identifies how to set the pushwheel switch, the chassis and slotin which the module should be installed, and the devices to be connected tothe processor interrupt inputs.

Determine Pushwheel Setting

Assign pushwheel numbers to your LP modules in order beginning with 1and working up: 1, 2, 3, 4. For example, if the chassis has 2 LP modules,they must be labelled 1 and 2. Each LP in a chassis must have a uniquepushwheel setting.

Select Chassis Slot

You can install a LP in any slot of the PI chassis except slot 1 (immediatelyright of the power supply). The RM must be installed in slot 1, making itunavailable for the LP.

You don’t have to install all the LP modules next to each other, or in anyparticular relationship to the other modules in the chassis.

Document PII Inputs

Create a wiring diagram for the hardware installer that identifies thesources of the PII inputs for each LP. Show the required wiring andterminal numbers. Include the power source.

Select Memory for theRM Module

Provide Information to theHardware Installer


6-7

With 6200 series software, you can configure several parameters for theLP. Use Worksheet 6.6 to learn about and specify these parameters. Manyof the parameters may require input from the PLC-5/250 programmer.

The main program execution screen of 6200 series software allows you todo the following:

set the watchdog timer specify how the LP processes the main program files specify input mode specify last scan mode

Table 6.B lists the features of 6200 series software and also tells you whatcharacteristics you can configure.

Table 6.BFeatures of 6200 Series Software

Features: Description of feature: Characteristics of feature:

watchdogtimer

lets you specify how long itshould take the main program torun. If you select this option, thesystem displays a watchdogscreen

• specify the number of ms (10�32,000) in 10 ms intervals that the main program can run.If the main program runs longer than the set value, the system generates a major fault.

• display the longest program scan (to the nearest 10 ms) since the last time this valuewas reset.

• display the time (ms) of the last scan period before you displayed this screen.

programprocessing

you can specify how the LP runsthe main program

• specify the amount of time the LP spends running the main program. Your options are40%, 50%, 60%, 70%, and 80%. The default is 80%. The remaining percentage ofprocessing time accounts for running IBPs and handling internal tasks.

• specify a fixed amount of time that the processor spends running the main program or avariable amount of time the processor spends running the main program. The default isvariable.

PII processor input interrupts • activate or deactivate a PII.• assign a priority to a PII.• specify a PII overlap as a major or minor fault .• specify the file that contains the ladder logic for the PII.

STI selectable timed interrupts • activate or deactivate a STI.• specify a priority to a STI.• specify whether an STI overlap should indicate a major or minor fault .• specify the file that contains the ladder logic for the STI.• specify the amount of time (10�655350 ms) in increments of 10 ms the LP should wait

between each run of this STI.

IBP independent backgroundprograms

• control the processor at power up.• control fault routine.• control non�critical timing issues.

Specify ConfigurationParameters




6-8

Table 6.C lists the physical specifications for LP.

Table 6.CLP Specifications

Physical specifications: LP:

current draw on:+5V supply+12V supply

2 A18 mA

memory support (battery) ÀA' lithium battery

operating temperature 0 - 60°C (32 - 140°F)

storage temperature -40 - 85°C (-40 - 185°F)

humidity 5% - 95% non�condensing


15.97" x 3.34" x 9.38"406mm x 85mm x 238mm

weight (lb/kg) 3 lbs, 13.5 oz (1.74 kg)

LP Specifications

Chapter 7

7-1

Planning to Use a MicroVAXInformation Processor

This chapter helps you plan for using a MicroVAX Information Processor.In it, you will:

choose a MicroVAX Information Processor configuration record your software choices determine your disk storage requirements list the hardware you will need create a design specification for the MicroVAX application programmer prepare information for hardware and software installers

Use the worksheets according to the instructions below.

Use Figure 7.1 to choose a MicroVAX Information Processorconfiguration. The choices in Figure 7.1 show the three basic ways theMicroVAX Information Processor can be configured.

Chapter Objectives

Choose a MicroVAXInformation ProcessorConfiguration



Chapter 7Planning to Use aMicroVAX Information Processor

7-2

Figure 7.1MicroVAX Information Processor Module Configurations and Hardware

Standalone

Local Network

VAXcluster

If your application is: Select this hardware:

• MicroVAX Information Processors (cat. nos. 5731�CPU1, 5731�CPU2, or5730�CPU1)

• terminal (VTxxx, user�supplied)• program loader (cat. no. 5710�PL/B (optional, one per site sufficient, use to

install software or back up data))• disk drive (cat nos. 5710-ID4, 209 Mbyte formatted, 5710�ID5, 418 Mbyte

formatted, 5710�ID6, �ID7, 480 Mbyte formatted, or 5730�ID3, 159 Mbyte formatted)

• second disk drive (optional, see Worksheet 7.1 or Worksheet 7.5)• 4�port distribution panel (cat. no. 5710�DP1)

This MicroVAX Information Processor boots from the local disk.


• program loader (cat. no. 5710�PL/B (optional, one per site sufficient, use toinstall software or back up data))

• disk drive (cat nos. 5710-ID4, 209 Mbyte formatted, 5710�ID5, 418 Mbyteformatted, 5710�ID6, �ID7, 480 Mbyte formatted, or 5730�ID3, 159 Mbyte formatted)

• second disk drive (optional, see worksheet 6.1 or 6.5)• Ethernet transceiver (cat. no. 5810�AXMH or 5810�AXMT)• Transceiver cable (cat. no. 5810�TC02 or 5810�TC15)

(2 or 15 meters)• 4�port distribution panel (cat. no. 5710�DP1)

This MicroVAX Information Processor does not boot from a boot node on thenetwork, although the network may contain a boot node.


• Ethernet transceiver (cat. no. 5810�AXMH or 5810�AXMT)• Transceiver cable (cat. no. 5810�TC02 or 5810�TC15)

(2 or 15 meters)• 4�port distribution panel (cat. no. 5710�DP1)• optional disk drive (cat nos. 5710-ID4, 209 Mbyte formatted, 5710�ID5, 418

Mbyte formatted, 5710�ID6, �ID7, 480 Mbyte formatted, or 5730�ID3,159 Mbyte formatted)

• second disk drive (optional)

This MicroVAX Information Processor is part of a local area VAXcluster.

• No connection to Ethernet• Software loaded from local disk or program loader

• Connected to Ethernet• Software loaded from local disk or program loader

• Connected to Ethernet• Software loaded from VAX Server via Ethernet

MicroVAXInformation Processor



Disk Disk

Disk

Disk

Disk

Disk

Disk

Disk

Disk

Disk

VAX

Terminalserver

Terminalserver

Graphicsworkstation

Graphicsworkstation

Programloader

Programloader Tape

drive

Terminal User supplied

Tapedrive

VAX server(3xxx)

16713

Optional


7-3

The MicroVAX Information Processor ships with the following softwareunder a single-user system license:

VMS VAXcluster DECnet DECwindows

Use the INTERCHANGE software for reading and writing datato-and-from other modules in the PI chassis and other stations on DH/DH+links connected to the PI system. You will need FORTRAN or Cprogramming tools to create application programs that use theINTERCHANGE routines.

In addition, you can install third-party application software that is availablefrom several vendors.

Record your software choices on Worksheet 7.1, Worksheet 7.4,Worksheet 7.5 and Worksheet 7.8.

Use Worksheet 7.1 (for the MicroVAX Information Processor) orWorksheet 7.5 (for the MicroVAX Processors EP and EE) to determine thedisk storage capacity you need. This will help you determine whether youneed more than one disk for your system.

Use Worksheet 7.2 or Worksheet 7.6 to list your hardware choices for theMicroVAX Information Processors. Use Figure 7.1 to select hardware thatmatches your application. Use Worksheet 7.1 or Worksheet 7.5 todetermine whether you need a second disk drive.

Whether you elect to write your own application program for theMicroVAX Information Processor or to use a third-party software, create adesign specification for the program that includes the followinginformation. The programmer will write a program to perform thefunctions you specify, or use the third-party software to perform them.

Select Software

Determine Disk StorageRequirements

Select Hardware

Create a Design Specificationfor the Application Program




7-4

The following steps are meant to provide guidelines for developing aprogram specification. You may need to include additional information orpresent it in a different form or order. The important point is that aprogram specification will help make sure that desired functionsare performed.

1. List the functions to be performed by the MicroVAX InformationProcessor. Specify the sequence and timing of all operations. Thefunctional specification for your application should containthis information.

2. Specify all data to be gathered from other devices (both on the PIbackplane and via Ethernet or via DH/DH+ link). For each dataitem, specify:

name type (BCD, decimal, integer, floating point, etc.) a description of the data read and write address sampling interval scaling or calculations required

3. Specify data to be created in the MicroVAX Information Processor byperforming calculations on the data gathered from other devices. Foreach data item, specify:

name type format a description of the data address calculations to be performed and expressions to be used recalculation interval

4. Specify reports to be generated by the MicroVAX InformationProcessor. For each report, specify:

data to be included format of the report frequency of generation communications requirements the process or method for forming the report


7-5

5. Specify control actions to be taken by the MicroVAX InformationProcessor. For each action, specify:

the action to be performed the devices involved the conditions under which the action is to be performed

6. Specify events to be monitored by the MicroVAXInformation Processor.

Fill out Worksheet 7.3 or Worksheet 7.7 to provide information to thehardware installer.

Fill out Worksheet 7.4 or Worksheet 7.8 and give it to your softwareinstaller to provide information about the software to be installed on aMicroVAX Information Processor. You may need to consult your systemmanager for help in providing this information.

The MicroVAX Information Processor family is designed to withstand thestresses of the factory-floor environment. The modules and disk conformwith all PI environmental specifications.

For a list of the: See:

characteristics of the MicroVAX Information Processor Table 7.A

characteristics of the MicroVAX Information Processor backplane Table 7.B

physical specifications of the MicroVAX Information Processor Table 7.C

specifications of the industrial disk Table 7.D

Provide Information to theHardware Installer

Provide Information to theSoftware Installer

MicroVAX InformationProcessor Specifications




7-6

Table 7.AMicroVAX Information Processor Characteristics

Processorcharacteristics:

MicroVAX InformationProcessor (5730�CPU1):

MicroVAX InformationProcessor EP (5731�CPU1):

MicroVAX InformationProcessor EE (5731�CPU2):

relative VAX 11/780performance

.9 VUP (VAX Unit ofProcessing)

3.8 VUP (VAX Unit ofProcessing)

3.8 VUP (VAX Unit ofProcessing)

memory capacity 8 Mbyte DRAM 16 Mbyte DRAM 32 Mbyte DRAM

I/O bus 32 Bit Internal 32 Bit Internal 32 Bit Internal

floating�point processor Standard MicroVAXFloating�Point Unit

Standard MicroVAXFloating�Point Unit

Standard MicroVAXFloating�Point Unit

time of yearclock//non�volatile memory

8500 Hours Battery BackupTime With System Power Off



serial port 1 RS�232 compatible and 3DEC�423 compatibleasynchronous ports

1 RS�232 compatible and 3DEC�423 compatibleasynchronous ports

1 RS�232 compatible and 3DEC�423 compatibleasynchronous ports

Ethernet port IEEE 802.3 ThinWire orThick Wire

IEEE 802.3 ThinWire or ThickWire

IEEE 802.3 ThinWire or ThickWire

mass storage 159 - 318 Mbytes (formatted)Allen�Bradley industrial disks;2 volumes

480 � 960 Mbytes (formatted)Allen�Bradley industrial disks;4 volumes

480 - 960 Mbytes (formatted)Allen�Bradley industrial disks;4 volumes

program loader interface Modified SCSI (TK50 tape) Modified SCSI (TK50 tape) Modified SCSI (TK50 tape)

cache on chip -- 1 Kbyte 1 Kbyte

cache on board -- 32 Kbytes 32 Kbytes

Table 7.BMicroVAX Information Processor Backplane Characteristics

Backplane interfacespecifications:

MicroVAX InformationProcessor:

MicroVAX InformationProcessor EP:

MicroVAX InformationProcessor EE:

68020 CPU running at 16 MHz

1.7 MIPS 1.7 MIPS 1.7 MIPS

memory capacity 3 Mbytes 3 Mbytes 3 Mbytes

dual�ported memory interfacewith MicroVAX processor

128 Kbytes 128 Kbytes 128 Kbytes

I/O bus Pyramid Pyramid Pyramid


7-7

Table 7.CMicroVAX Information Processor Physical Specifications

Physical specifications: MicroVAX InformationProcessor:

MicroVAX InformationProcessor EP:

MicroVAX InformationProcessor EE:

current draw on PI powersupply

0.7 A 0.7 A 0.7 A

memory support (battery) ÀA' lithium battery ÀA' lithium battery ÀA' lithium battery

operating temperature 0 - 60°C (32 - 140°F) 0 - 60°C (32 - 140°F) 0 - 60°C (32 - 140°F)

storage temperature -40 - 60°C (-40 - 140°F) -40 - 60°C (-40 - 140°F) -40 - 60°C (-40 - 140°F)

humidity 5% - 95% non�condensing 5% - 95% non�condensing 5% - 95% non�condensing


15.97" x 3.34" x 9.38"406mm x 85mm x 238mm

15.97" x 3.34" x 9.38"406mm x 85mm x 238mm

15.97" x 3.34" x 9.38"406mm x 85mm x 238mm

weight (lb/kg) 9 lbs, 6 oz (4.22 kg) 8 lbs, 6.5 oz (3.78 kg) 8 lbs, 6.5 oz (3.78 kg)

Table 7.DIndustrial Disk Specifications for 5730�ID3

Physical specifications: 5730�ID3:

average access time 38.3 ms

transfer rate 5 Mb/sec

form factor 5.25"

protocol ST506

operating temperature 0 - 60°C (32 - 140°F)

storage temperature -40 - 60°C (-40 - 140°F)

humidity 5% - 95% non�condensing


16.69" x 18.33" x 11.63"419mm x 465mm x 295mm

weight 63 lbs, 12 oz (28.95 kg)

Table 7.EIndustrial Disk Specifications for 5710�ID4, �ID5, �ID6, �ID7

Physical specifications: 5710�ID4: 5710�ID5: 5710�ID6: 5710�ID7:

average access time 24.3 ms 24.3 ms 16.0 ms 16.0 ms

transfer rate 1.25 Mbytes/sec 1.25 Mbytes/sec 3.8 Mbytes/sec 3.8 Mbytes/sec

form factor 3.5" 3.5" 3.5" 3.5"

protocol SCSI SCSI SCSI SCSI

operating temperature 0 - 60°C (32 - 140°F) 0 - 60°C (32 - 140°F) 0 - 60°C (32 - 140°F) 0 - 60°C (32 - 140°F)

storage temperature -40 - 60°C (-40 - 140°F) -40 - 60°C (-40 - 140°F) -40 - 60°C (-40 - 140°F) -40 - 60°C (-40 - 140°F)

humidity 5% - 95% non�condensing 5% - 95% non�condensing 5% - 95% non�condensing 5% - 95% non�condensing


16.69" x 18.33" x 11.63"419mm x 465mm x 295mm

16.69" x 18.33" x 11.63"419mm x 465mm x 295mm

16.69" x 18.33" x 11.63"419mm x 465mm x 295mm

16.69" x 18.33" x 11.63"419mm x 465mm x 295mm

weight 58 lbs (26.3 kg) 58 lbs (26.3 kg) 58 lbs (26.3 kg) 58 lbs (26.3 kg)Allen-Bradley Automation


Chapter 8

8-1

Planning for Communication

This chapter will help you plan for communication between externaldevices and your PI system and among various modules in the PI chassis.In it, you will:

choose whether to use a DH or DH+ network for communication withplant-floor devices

estimate performance characteristics of a DH and DH+ network

select the protocol, electrical standard, and hardware for using the CH 1port on the RM and KA modules

choose whether to use MAP when you have multi-vendor applicationsand need to share data

provide information to the PLC programmer aboutcommunication requirements

provide information to the hardware installer about the RM andKA modules

choose whether to use the Ethernet network for communication withhigher-level plant computers

This chapter also explains the data PI modules communicate amongthemselves and other devices.

Chapter Objectives

Chapter 8Planning for Communication

8-2

For the RM and KA module, you can configure two of the ports (CH 2 andCH 3) independently for communication on either a DH or DH+ link. Oneport has two connectors (CH 2A and CH 2B):

screw-terminal connection to DH+ cable D-shell connection to a programming terminal

The PI system also supports OSI communication via the OSI interfacemodule utilizing either carrierband or three different broadband channels.

LP modules in the PI chassis can send and receive messages through thesecommunication module ports. Devices on the communication links canread-from and write-to all PI modules except the KA module and the OSIinterface module. Data to or from a MicroVAX Information Processor canbe communicated using the unsolicited message feature ofINTERCHANGE software. Data can be communicated to or from othercomputers on an Ethernet network using an EI module andINTERCHANGE software. The KA module and the OSI interface moduledo not have a data table.

The RM, KA module, OSI interface module, EI module, and a MicroVAXInformation Processor can communicate via local area networks to otherdevices in your plant. RS modules can communicate with plant floordevices via the remote I/O link. RS5 modules can also communicate with1771-ALX adapter module via the local I/O channel (CH5). UseFigure 8.1 to help choose communication methods for various needs.Figure 8.1 through Figure 8.7 give an overview of the communicationcapabilities of the PI system.

PI Communication

Choose CommunicationOptions




8-3

Figure 8.1Communication Features of the RM and the KA Module

19758

The connectors on the RMfor channel 2A and channel2B are connected internally.

If the terminal is used forprogramming, CH2 mustbe configured for DH+ link.

T47, T53, or T70IBM or compatiblecomputer

The CH1 port can beconfigured formaster/slave, DF1, orASCII protocols andfor RS�232�C, RS�422and RS�423 electricalcharacteristics. DH+ link

DH+ link

DH+ linkDH+ link

1785�KE

1771�KE

1770�KF2

1771�KG

1779�KP5 1785�KA 1785�KA3 T47 T53 T70PLC�5processor

1775�S5

1785�KA

DH link

DH II link

1. With switches and jumpers on the RM and the KA modules, you configure a default communicationchannel (CH1, CH2, or CH3). Other channels are configured with 6200 Series Software.

2. Channels 2 and 3 can be configured separately for either DH or DH+ link.

PLC�3processor

PLC�3processor

1785�KA 1785�KA

PLC�5processor

1771�KA2 1775�KA

DH link

PI chassis

The KA module hasthe same connectionsas the RM.


8-4

Figure 8.2Communication Features of the RS5 Module

19759

RS5

PI chassisPLC�5 processorin adapter mode

PLC�5/250 processor in directcommunication mode

1395 dc drivewith PLC processorinterface module

1771�DCM 1771�DCM

PLC�3processor

PLC�2processor

1784�F30D 1771�ASB

1784�T30terminal

1771�I/Omodules

1771�ALX with1771�I/O modules

Figure 8.3Communication Features of the MicroVAX Information Processor

0

1

2

3

19760

MicroVAX Information Processor EE or EP

Serial devices(TTA0, 1, and 2)

Console orserial device (OPA0)

PI chassisTerminalserver

MicroVAXprocessor

VAXcomputer

Ethernet network




8-5

Figure 8.4Communication Features of the OSI Interface Module

19761

MAP/OSI broadbandinterface module

Note:A�B MAP station managercan be connected to theRS�232 port.

MAP/OSI carrierbandinterface module

PI chassis

MAP 802.4 LAN

A�B MAPstationmanager

PI OSIinterface

PLC�3processor

Thirdpartydevice

orCat. no. 5820�CC is used foron an 802.4 carrierband network

Broadband versions of the OSI interface module transmit and receive onthe following frequency channel pairs:

Cat. no.: MAP channel: Transmit channel: Transmit frequency: Receive channel: Receive frequency:

5820�CBA A 3'/4' 59.75 - 71.75 MHz P/Q 252 - 264 MHz

5820�CBB B 4A'/5' 71.75 - 83.75 MHz R/S 264 - 276 MHz

5820�CBC C 6'/FM1 83.75 - 95.75 MHz T/U 276 - 288 MHz


8-6

Figure 8.5Plant MAP Network

19762

DH link

PLC�5/25 processor


PI with OSI module

Manufacturing productioncontrol

Figure 8.6Communication Features of the EI Module

19763

EI module

Ethernet networkPI chassis

Computer EI moduleAllen-Bradley Automation



8-7

Figure 8.7Integrated Control System

19764

PI

PLC�5/250 processor EI module

PLC�3processor

PLC�3/10processor

PLC�2processor

DH link




1771�ASB

Manufacturingengineering

HP�9000 hostwith networkINTERCHANGEHP�UX software

HP�9000 hostwith networkINTERCHANGEHP�UX software

TCP/IP


8-8

Table 8.API Communication Options

For communication between: Use:

PLC�5/250 processor and devices on DHor DH+ link

RM CH 2B or CH 3or DH+ link

KA module CH 2B or CH 3

PLC�5/250 processor and local serialdevices such as printers, bar code

RM CH 1de ces suc as p e s, ba codereaders, etc. or remote serial devicesvia modems

KA module CH 1

PLC�5/250 processor and localprogramming terminal

RM CH 2A (must be DH+ protocol)programming terminal

RM CH 1 (protocol must be DF1)

KA module CH 2A (protocol must be DH+)

KA module CH 1 (protocol must be DF1)

PLC�5/250 processor and remoteprogramming terminal

RM CH 2B or CH 3programming terminal


MicroVAX Information Processor EPmodule802.3 ENET

MicroVAX Information Processor EEmodule 802.3 ENET

MicroVAX Information Processor 802.3 CHANNEL A

PLC�5/250 processor and a device onOSI/MAP network

OSI interface module

MicroVAX Information Processor andnetwork devices, such as othercomputers terminal servers

MicroVAX Information Processor EPmodule 802.3 ENET

computers, terminal servers,workstations, storage devices, etc.

MicroVAX Information Processor EEmodule 802.3 ENET

MicroVAX Information Processor 802.3CHANNEL A

MicroVAX Information Processor andlocal serial devices, such as printers,console or terminal, etc.

MicroVAX Information Processor serialdistribution panel

MicroVAX Information Processor anddevices on DH or DH+ link

RM module CH 2B or CH 3devices on DH or DH+ link


EI module and network devices, such asother computers, terminal servers,workstations, storage devices, etc.

EI module ENET channel

CVIM module and RS modules CVIM module node adapter

CVIM module and general purposecomputing devices

CVIM module RS�232 interface




8-9

The RM and the KA modules each have three communication channels.Using switches on each of the modules, you choose one of thecommunication channels to be the default channel and set its most criticalparameters. This allows communication through the default channel withor without any software selections.

With 6200 series software selections, you can:

set other parameters for the default channel configure the other two communication channels

You configure the OSI interface modules using the A-B MAP/OSI StationManager (cat. no. 6630-PMC). The switch-configured parameters for thedefault channel cannot be configured through software selections.

For more information on configuring parameters for communicationchannels, see chapter 9, “Configuring a Communication Module(RM/KA),” in the PLC-5/250 Configuration and Maintenance Manual(5000-6.4.7).

You can connect the CH 2B and CH 3 ports on the RM and KA moduleseither to DH or DH+ links.

Use Figure 8.8 to choose the protocol to use for each port. Record yourchoices on Worksheet 8.1 and Worksheet 8.3.

Configuring CommunicationParameters

Choose DH or DH+ Link(Channel 2 or Channel 3)


8-10

Figure 8.8Algorithm for Choosing DH or DH+ Link

Do youwant to use

existing DH+ link?

Will you connect T53 or T47 to network toprogram the PLC�5/250

processor (includesCH2A)?

Your networkwill contain mostly PLC�5and PLC�3 processors?

Yes

No

Yes

Yes

No

Do youwant to use existing

DH link?

Yes

No

NoDH+ linkDH link

See the DH/DH+/DH II/DH-485 Cable Installation Manual (1770-6.2.1),for information about how to design and install a DH/DH+ cable system.

Plan Cable Layout andSelect Hardware




8-11

Through use of the message instruction (MSG), the PLC-5/250 processorcan send messages through the CH 2 and CH 3 ports to other stations onthe network and can read messages from other stations. You must providethe PLC programmer with complete information about what messages areto be passed on the networks.

Fill out Worksheet 8.5 to specify communication needs for thePLC programmer.

With switches on the RM and KA module, you choose one of thecommunication channels to be the default channel and set its most criticalparameters. This allows communication through the default channel withor without any software selections. With 6200 series software selections,you can set other parameters that are not switch-selectable on the defaultchannel. However, the switch-configured parameters of the defaultchannel cannot be configured through software selections.

Worksheet 8.1 lists the choices you have for the default channelparameters. Record your choices on the appropriate worksheet(s) and passit to the hardware installer, who will set the switches.

There are many factors that affect the performance of your DH+ network,which include:

nodes size and number of messages message destination internal processing time

Nodes

Nodes affect transmission time in the following ways:

During one complete token rotation, each node on the DH+ networkreceives the token whether or not it has something to send.

Each node spends from 1.5 ms (if it has no messages to send) to 38 ms(maximum time allotted) with the token, assuming there are no retries.

Specify CommunicationNeeds for PLC Programmer

Specify Switch Settings forDH/DH+ Communication

Estimating DH/DH+ NetworkPerformance

DH+ network

Max. 38 mswith the token

Min. 1.5 mswith the token Station

1

Station2

Station3

Station4

Station5

Example: token passing


8-12

Size and Number of Messages

A PLC controller encodes messages into packets for transmission on theDH+ network. The maximum number of data words in a packet dependson the sending station and command type as shown in Table 8.B. Thislimit comes from the network protocol, which limits a station totransmitting a maximum of 271 bytes per token pass. A station can sendmore than one message in a token pass, provided that the total number ofcommand and data bytes does not exceed 271.

However, if a message exceeds the maximum packet size allotted, thesending station will require more than one token pass to complete themessage. For example, if a PLC-5 processor wants to send a 150-wordmessage, it will have to receive the token twice to complete the message.Table 8.B shows that the maximum packet size for a PLC-5 processor tosend a typed WRITE is 90 words.

Table 8.BMaximum Packet Sizes for PLC�5 Processors

Processor:1 Command type: Maximum packet size(data words):

PLC�5 processor typed READ/WRITE 90

PLC�5 processor word range READ/WRITE 120

PLC�5/40, �5/60, �5/250 processors typed READ/WRITE 112

PLC�3, �5/40, �5/60, �5/250processors

word range READ/WRITE 121

1 Different types of PLC controllers can be on the same DH+ link.

The number of messages a station has to send also affects throughput time.For example, if a station has three messages queued and a fourth isenabled, the fourth message may have to wait until the previous threeare processed.




8-13

Message Destination

Throughput times vary depending on whether a receiving station canprocess the message and generate a reply before that station receives thetoken. Example 1 assumes that station 1 wants to send a message tostation 4. Station 1 has the token. Only the station that has the token cansend a message. Station 1 sends the message to station 4. Now station 1must pass the token on to the next highest station number, which is station 2. Station 2 has the token. Assume that station 2 has messages tosend and holds the token for 30 ms. During this time, station 4 hasprocessed the message from station 1 and has a reply queued up. Whenfinished, station 2 passes the token on to the next highest station number,which is station 4. Station 4 can now reply to the message from station 1.This completes the message transaction.

In example 1, station 4 has had time to process the message and generate areply. But, that is not the case with station 2 in example 2.

In example 2, we assume that station 1 wants to send the identical messageas shown in example 1, but to station 2. Station 1 has the token. Station 1sends the message to station 2 and then passes the token on to station 2.Now station 2 has the token but has not had time to generate a reply tostation 1. So station 2 sends any other messages it has queued and thenpasses the token on to station 4. Stations 4, 5, and 1 all receive the tokenin order and send any messages they have queued. The token then returnsto station 2, which then sends its reply to station 1. In this example, ittook an extra token pass around the network to complete the messagetransaction even though the message was identical to the one shown inexample 1.

Internal Processing Time

Internal processing time depends on how busy a given processor on thenetwork is when sending or receiving a message.

Example 1: Controller A has just received a READ request fromcontroller B on the network. If Controller A already has three messages ofits own to send, the reply to the READ request from controller B will haveto wait until the station completes the processing of the messages queuedahead of it.

Example 2: A chassis contains a PLC-5/250 processor and a MicroVAXInformation Processor. A message transaction being sent from a LP to aRM may be delayed due to backplane activity caused by the MicroVAXInformation Processor.

Station

StationStation

Station

2

1

4

5message

Example 1

Example 2

Station

StationStation

Station

2

1

4

5

message


8-14

Estimating Throughput Times

All of the above factors affect message throughput. Although it is difficultto accurately predict the throughput of any individual message, we canestimate maximum throughput times.

To estimate maximum throughput time determine the number of tokenpasses required to send the message, multiply by the number of packetsthat will be sent out on the network during the token passes, and multiplyby 70 ms., as shown in the following examples. In Figure 8.9 throughFigure 8.12, we assume there are no other messages queued other than theones shown.

Important: The approximate time to send a packet on a DH+ networkis 70 ms.

The formula for calculating the maximum throughput time (MTT) on aDH+ network is:

(token passes) X (number of stations transmittingmessages) X 70 ms = MTT

Where: Is:

tokenpasses

the number of times the particular station will need the token in order tocomplete its message transaction; this is determined using Table 8.B. Forexample, if you have a PLC�5 processor sending a 300�word typed WRITEthen the number of token passes required = number of packets required =300 ÷ by 90 = 3.3. Round the result to the next whole number. There will befour packets required to send the message and therefore four token passes.

number ofstationstransmit-tingmessages

the total number of stations that may transmit packets on the DH+ networkduring the time required to send the given message. For example, if youhave a four�station network and want to send a 300�word message fromstation 1 to station 4 with the following message activity on the other stations(see Table 8.B):

• station 2: no messages• station 3: 150�word message once every second• station 4: continuous 50�word message it will take 4 token passes

During the four token passes, station 2 will send nothing, and station 3 maysend its 150�word message. Using Table 8.B, we see that a 150�wordmessage will require two packets. So, on 2 of the 4 token passes, station 3may be transmitting. Station 3 will then stop transmitting for one second aftersending its message. So on the other two token passes, station 3 will sendnothing. Since station 4 is doing continuous messages, we must assume itmay send a packet on all four token passes. Therefore, the number ofstations transmitting would look as they do in Table 8.C.




8-15

Table 8.CStations Transmitting Messages

Token pass: Stations transmitting: Total number of stations:

1 1, 3, 4 3

2 1, 3, 4 3

3 1, 4 2

4 1, 4 2

70 ms = the time to send a single packet on the DH+ network.

Using the above example, the MTT is:

(2 token passes with 3 stations transmitting) + (2token passes with 2 stations transmitting)

= (2 X 3 X 70) + (2 X 2 X 70) = 420 + 280 = 700 ms

Examples of Throughput Calculations

The following method of calculating throughput is designed to give you anidea of the maximum amount of time it may take to send a message.Factors such as message destination and internal processing time, all havean effect on the actual throughput of any given message. These factorshave all been taken into account when deriving the MTT. The nextsection, “Average DH+ Response Time Test Results,” page 8-19 gives youan idea of average response times on the DH+ network.

If you have a programming terminal on your DH+ link, assume that theterminal sends a packet at every token pass. When a programmingterminal is connected and monitoring ladder logic or data table, it isconstantly requesting updates to the information being displayed. Manynetworks also contain ControlView operator interface terminals. Theseterminals can be configured to collect data in a variety of ways. If theControlView operator interface is configured to collect data as fast aspossible, you must assume that it will send a packet during eachtoken pass.

Important: If you use a typed READ command from a PLC-5/250processor, you must add one extra packet to the total number of packetscalculated to send the message. For example, a 150-word message wouldrequire 3 packets instead of 2 if a typed READ was used in a PLC-5/250processor application.


8-16

The following four examples assume the data table used by the PLC-5/250processor is located on the RM. If the data table used in messaging islocated on the LP, the network performance will degrade. The longer theprogram scan of the LP, the more noticeable the degradation.

Example 1: Assume all stations in Figure 8.9 are PLC-5/250 processors.Station 1 has the token and wants to send a 90-word message. Each of theother stations also want to send 90-word messages, as shown in Figure 8.9.According to Table 8.B, a 90-word message fits into one packet (regardlessof command or processor type). If each station wants to send a 90-wordmessage, there will be a total of five packets sent out during the token pass.So the estimated MTT to send a 90-word message from station 1 is:

1 X 5 X 70 = 350 ms (MTT)

Figure 8.9PLC�5/250 Stations With 90�Word Messages

Station

StationStation

Station Station

DH+ network

1

2

34

5

90�word message

90�word message

90�word message90�word message

90�word message

Est. 70 ms per packet




8-17

Example 2: Figure 8.10 shows 5 stations. Station 1 has the token andwants to send an 80-word message to station 5. Station 4 has nothing tosend. Stations 3 and 5 have 80-word messages to send, and station 2 has a150-word message to send. According to Table 8.B, all of the messagescan be encoded into one packet per message except station 2’s message.Station 2 requires two packets to send a 150-word message. Whenestimating throughput times, be more concerned with the sending station’srequirements. In this case, station 1 has an 80-word message to send. Thisrequires one packet and, therefore, only one token pass. The fact thatstation 2 requires two packets to send its message is insignificant inrelation to the throughput time of station 1, since it can complete itsmessage in one token pass.

When estimating the throughput times, you need only to determine thenumber of packets the sending station will need to transmit the givenmessage, which determines the number of times it will require the token.Then, determine how many stations on the network may transmit amessage in a given token pass and multiply that by 70 ms. In this case, itwill take one token pass, and in that one token pass four stations may sendone message each. So the estimated MTT to send the 80-word messagefrom station 1 to station 5 is:

1 X 4 X 70 = 280 ms

Figure 8.10Estimating Throughput Time

Station

StationStation

Station Station

DH+ network

Est. 70 ms per packet 1

2

34

5

80�word message

150�word message

80�word message

80�word message


8-18

Example 3: Figure 8.11 shows 5 stations. Station 1 has the token and hasa 150-word message it wants to send. Stations 2 and 5 have 90-wordmessages, which are to be sent once every 2 seconds, and stations 3 and 4have nothing to send. Using the above information, we can determine thatit will require two token passes to send the message; two other stationshave messages they may send. The estimated MTT for the 150-wordmessage to be sent from station 1 is:

1 X 3 X 70 = 210 ms (1st token pass)

1 X 1 X 70 = 70 ms (2nd token pass)

Total = 280 ms

Figure 8.11Estimated Maximum Throughput Time

Station

StationStation

Station Station

DH+ network

Est. 70 ms per packet 1

2

34

5

150�word message

90�word message90�word message

Using the same example, let’s assume that stations 2 and 5 have continuous90-word messages to send. Since the messages are continuous, they couldbe sent on any given token pass. In this case, we must assume that on bothtoken passes, three stations may send a message (including station 1).The estimated MTT for the 150-word message is:

2 X 3 X 70 = 420 ms




8-19

Example 4: Figure 8.12 shows 5 stations. Station 1 has the token and hasa 250-word message to send. Station 2 has 80-, 90-, and 150-wordmessages, stations 3 and 4 have nothing to send, and station 5 has 80- and150-word messages to send. The estimated MTT to send the 250-wordmessage from station 1 is:

3 X 3 X 70 = 420

since it will require three token passes to send the 250-word message, andduring the three token passes, three stations may send a packet.

Figure 8.12Maximum Throughput Time for Three Packets

Station

StationStation

Station Station

DH+ network

Est. 70 ms per packet1

2

34

5

250�word message

80�word message

90�word message

150�word message

150�word message

80�word message

Average DH+ Response Time Test Results

The previous examples showed methods for predicting the MTT of amessage on a given DH+ network. However, in most cases, networkperformance is much better. This section shows the results of testingperformed on a DH+ network.

Test SetupOne to 22 PLC-5 processors were used with one programming terminalon-line. Each PLC-5 processor executes 1K of ladder logic.

Initial testing was done with one PLC-5 processor writing data to anotherPLC-5 processor and recording the response time. Additional PLC-5processors were added to the network, each writing the same amount ofdata to a PLC-5 processor at the next highest station address. Fourseparate tests were run using data transmissions of 50, 100, 250, and500 words.

Figure 8.13 shows the average response time of a message of varying sizeon a DH+ network with varying numbers of stations. Figure 8.13 alsogives you an idea of the typical response time you can expect on a givenDH+ network.


8-20

Figure 8.13Average Response Time for all PLC�5 Processors

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22

Number of PLC�5 Processors

Response

Time

(Sec)

50 W

100 W

250 W

500 W

+

•

X

Figure 8.14 shows the effect of a programming terminal on messageresponse time under various configurations.

Figure 8.14Response Time Increase (%)

0

5

10

15

20

25

30

35

40

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22

Number of PLC�5 Controllers

Response

Time

(%)

Effecton

%

%

%

%

%

%

%

%

%

50 W

100 W

250 W

500 W

+

•X

Important: Table 8.D through Table 8.G present approximate guidelinesonly. Your network performance may vary somewhat, depending onyour application.Allen-Bradley Automation



8-21

Trunk LoadingTrunk loading is the rate at which packets are being generated on thenetwork. See Table 8.D.

Table 8.DTrunk Loading Performance for DH and DH+ Links

If it is a: And trunk loading is:1 Then:

DH network less than 10 packets per second performance is likely to be acceptable

10 to 20 packets per second there may be a problem if node loading orresponse time is approaching its limit

greater than 20 packets per second this network needs a close look. Acceptabilitydepends on packet size and your expectations

DH+ network (with lessthan 10 stations)

less than 10 packets per second performance is likely to be acceptable

10 to 25 packets per second there may be a problem if response time or nodeloading is approaching its limit

greater than 25 packets per second this network needs a close look. Acceptabilitydepends on packet size and your expectations.

1Divide message size (in words) by 100 to estimate the number of packets in the message.

Response TimeResponse time is the time from when a device determines that it needs tosend a command message packet until it receives a reply message packetthat the command message packet was received at the destination.(Table 8.E). Use Table 8.E and Table 8.F to help evaluate response time.


8-22

Table 8.EEvaluating Response Time for DH Link

If thereceivingstation is:

And thesendingstation is:

And desired responsetime is:

Then:

PLC�3processor

PLC�3processor

greater than 500 ms performance is likely to be acceptable.processoror PI

processoror PI

200 to 500 ms there may be a problem if trunk loading or node loading is approaching its limit.or PIsystem

or PIsystem 150 to 200 ms this system needs a very close look.

less than 150 ms this is not recommended, except for very short packets.

computerthroughserial DH

greater than 700 ms performance will probably be acceptable if there is no other traffic at the computer to causequeuing delays (or add 250 ms per packet at the computer).

serial DHinterface 300 to 700 ms there may be a problem if trunk loading or node loading is approaching its limit.

150 to 300 ms this system needs a very close look.


PLC�2processor

greater than 1 second performance will probably be acceptable if there is no other traffic at the PLC�2 processor tocause queuing delays (or add up to 750 ms per packet at the PLC�2 processor).

700 ms to 1 second there may be a problem if trunk loading or node loading is approaching its limit.

150 to 700 ms this system needs a very close look (depends mostly on packet size).


PLC�2processor

computerthroughserial DHinterface

greater than 2 seconds performance will probably be acceptable if there is no other traffic at either end to causequeuing delays (or add up to 750 ms per packet at the PLC�2 processor or 250 ms perpacket at the computer).

interface1 to 2 seconds there may be a problem if trunk loading or node loading is approaching its limit.

150 ms to 1 second this system needs a close look (depends mostly on packet size).


PLC�2processor

greater than 2 seconds performance will probably be acceptable if there is no other traffic at either end to causequeuing delays (or add up to 750 ms per packet at each end).

1.5 to 2 seconds there may be a problem if trunk loading or node loading is approaching its limit..

150 ms to 1.5 seconds this system needs a close look (depends mostly on packet size).

Less than 150 ms this is not recommended, except for very short packets.

PLC�2processor

PLC�3processoror PI

greater than 1 second performance will probably be acceptable if there is no other traffic at the PLC�2 to causequeuing delays (or add up to 750 ms per packet at the PLC�2 processor).

or PIsystem 700 ms to 1 second there may be a problem if trunk loading or node loading is approaching its limit.

150 to 700 ms this system needs a very close look (depends mostly on packet size).


For PLC�5 times (via 1785�KA), add 50 ms to the comparable PLC�3 processor time for each PLC�5 processor involved in the transaction, if neither trunk loading nor node loading is approaching its limit.




8-23

Table 8.FEvaluating Response Time for DH+ Link

If thereceivingstation is:

And thesendingstation is:

And desired responsetime is:

Then:

PLC�3processor

PLC�3processor

greater than 250 ms performance will probably be acceptable.processor,PLC�5processor

processor,PLC�5processor

100 to 250 ms there may be a problem if trunk loading or node loading is approaching its limit

processor,or PI system

processor,or PI system 50 to 100 ms this system needs a close look (depends mostly on packet size).


PLC�2processor orcomputer

greater than 700 ms performance will probably be acceptable if there is no other traffic at the computer tocause queuing delays (or add up to 250 ms per packet at the computer)

computer(through serial

300 to 700 ms there may be a problem if trunk loading or node loading is approaching its limit.(through serialDH+ interface) 150 to 300 ms this system needs a close look.


PLC�2processor

PLC�3processor,PLC 5

greater than 700 ms performance will probably be acceptable if there is no other traffic at the computer tocause queuing delays (or add up to 250 ms per packet at the computer)

PLC�5processor,

300 to 700 ms there may be a problem if trunk loading or node loading is approaching its limit.processor,or PI system 150 to 300 ms this system needs a close look.


PLC�2processor

PLC�2processor

greater than 2 seconds performance will probably be acceptable if there is no other traffic at either end tocause queuing delays (or add up to 750 ms per packet at the PLC�2 or 250 ms perpacket at the computer)

1 to 2 seconds there may be a problem if trunk loading or node loading is approaching its limit

150 ms to 1 second this system needs a close look (depends mostly on packet size)


Node LoadingNode loading is the peak load that each device on the network will see,both sending and receiving. This is expressed in packets per second.See Table 8.G.


8-24

Table 8.GEvaluating Node Loading for DH and DH+ Links

Device: Maximum node loading: Notes:

PLC�2/1771�KA2 1 to 20 packets per second, dependingon packet size

buffer capacity for ten 100�word packets is available. Thenumber of packets that can be buffered increases withsmaller packet size.

PLC�3/1775�KA 15 to 20 incoming packets per second buffer capacity for 2 packets. Rate and buffer capacity arenot significantly affected by packet size.

outgoing packets limited to one at a time rate is a direct function of response time (e.g. if responsetime is 200 ms. the rate is 5 packets per second). SeeTable 8.E and Table 8.F. The outgoing queue holds 3messages regardless of the number of packetsper message.

PLC�3/1775�S5 15 to 20 packets per second in or out buffer capacity for 6 incoming packets plus 8outgoing packets.

PLC�5 processor 15 to 20 packets per second in or out 19 total messages can be queued

PI system 15 to 20 packets per second in or out 31 total messages can be queued per DH+ module

Important: Programming terminals connected to DH or DH+ networks increase node loading.

You can use the CH 1 port on the RM and KA module for communicationwith a monitor, modem, printer, or other device. You can configure theprotocol, electrical characteristics, and communication parameters ofthis port.

Choose a Protocol

Use the following table to help choose the protocol for CH 1.

If the application is: Then choose:

multi�drop, half duplex link for SCADA master or slave

point�to�point, full duplex serial link DF1

ASCII data input and output for printer or similar device ASCII

Choose Electrical Characteristics

You can configure CH 1 to use RS-232-C, RS-422, or RS-423 electricalcharacteristics. Choose the standard to match the device you will connectto the CH 1 port.

Channel 1




8-25

The 6200 series software lets you configure communication parameters forCH 1, CH 2 and CH 3. Worksheet 8.6 and Worksheet 8.7 list theparameters you can configure. Use these worksheets to specify yourchoices for parameter values.

For the: And channel Record your choices on:

RM/KA module 12 & 3

Worksheet 8.6Worksheet 8.7

Modem configuration options for the asynchronous CH 1 are available onthe 5130-RM module. These selections tell the channel how to monitorand control the different handshaking control lines (i.e., DCD, DSR, DTR).For each selection, six conditions hold true as shown in Table 8.Hthrough Table 8.M.

For this condition: See:

half�duplex modem type (ASCII, master) Table 8.H

half�duplex modem type without continuous carrier (slave) Table 8.I

half�duplex modem type with continuous carrier (slave) Table 8.J

full�duplex modem type (ASCII, DF1) Table 8.K

full�duplex modem type (for master only) Table 8.L

no handshaking Table 8.M

Table 8.HHalf�Duplex Modem Type (ASCII, Master)1

Description of condition: Input/output: Condition:

request to send (RTS) output from RM is only active when trying to transmit

clear to send (CTS) input to RM must be active before we can transmit

received line signal detector (DCD) input to RM must be active when receiving but does not need to becontinuously active

data terminal ready (DTR) output from RM is made active at power�up

data set ready (DSR) input to RM must be active before any activity except sending out strings

1Choose this selection if your application is using half�duplex modems or a half�duplex null�modem cable.

Specify ConfigurationParameters


8-26

Table 8.IHalf�Duplex Modem Type without Continuous Carrier (Slave)1




received line signal detector (DCD) input to RM must be active when receiving but doesn't need to becontinuously active



1This selection is functionally equivalent to half�duplex modem type.

Table 8.JHalf�Duplex Modem Type with Continuous Carrier (Slave)1




received line signal detector (DCD) input to RM must be active when receiving. If inactive for more than 10sec:

1. The driver will enter an auto�hangup sequence where it will remove data terminal ready for about 350uS

2. Driver restarts itself.



1This selection is only used for the slave driver; it is only useful when the master is configured for full�duplex modem type. This selection allows the slave a chance to have auto�hangup

capabilities.

Table 8.KFull�Duplex Modem Type (ASCII, DF1)1




received line signal detector (DCD) input to RM must be active when receivingif inactive for more than 10 sec:

1. The driver will enter an auto�hangup sequence where it will remove data terminal ready for about 350uS

2. Driver restarts itself.



1Choose this selection if your application is using full�duplex modems or a full�duplex null�modem cable.




8-27

Table 8.LFull�Duplex Modem Type (for master only)1




received line signal detector (DCD) input to RM must be active when receiving but doesn't need to becontinuously active



1Choose this selection if your master is using full�duplex modems and the slaves are using either half�duplex with or without continuous carrier.

Table 8.MNo Handshaking1


request to send (RTS) output from RM is never asserted

clear to send (CTS) input to RM is always ignored

received line signal detector (DCD) input to RM is always ignored

data terminal ready (DTR) output from RM is asserted at power�up

data set ready (DSR) input to RM is always ignored

1Use this selection when a cable is being used that doesn't have the control lines jumpered and just 3�line communication is desired.

Using 6200 series software, you can configure the communicationparameters of CH 1. Worksheet 8.6 lists the parameters you can set.

There are four switches on the OSI interface module.

Important: Set the switches before you put the module in the chassis andpower up.

All four switches are preset by Allen-Bradley. Table 8.N describes howyou can use switches 1 and 2 on the carrierband and broadband modules.

Specify Switch Settings onthe OSI Interface Module


8-28

Table 8.NSwitches 1 and 2 on the Carrierband and Broadband Modules

Switch: Position: Description:

1 up if there is a valid image in non�volatile memory, the OSI interface module will enter fully operationalmode after:

• a power cycle, regardless of the mode preceding the power cycle• you enter a reset command from the A�B MAP Station Manager, regardless of the mode

preceding the reset• you enter a change mode to Fully Operational from the A�B MAP Station Manager

If there is not a valid image in non�volatile memory, the OSI interface module will not enter fullyoperational mode but will enter Partially Operational mode.

down the OSI interface module will enter partially operational mode after:


preceding the reset• you enter a change mode to Partially Operational from the A�B MAP Station Manager

2 up the OSI interface module uses user defaults, if available, at power�up or reset (see the PI OSI Interface

Software User's Manual for a list of user defaults). If user defaults are not available, the interface willuse the A�B communication defaults.

down the OSI interface module uses A�B communication defaults at power�up or reset.

3 up reserved

set at A�B. Do not change.

4 up reserved


Important: Keep switches 3 and 4 in the up position, otherwise; PI system stays in power�up and will not initialize.Note: Bold indicates switches set at A�B Company, Inc.

Record your choices on Worksheet 8.13 and pass it to the hardwareinstaller, who will set the switches. Complete installation by filling outWorksheet 8.14.

The ENET CH A port on the MicroVAX Information Processor or theENET port on the MicroVAX Information Processor EP or EE lets youconnect it via Ethernet network to higher-level plant computers. TheMicroVAX Information Processors use the DECnet protocol forcommunication through this port. You can also execute VAXclustersoftware over Ethernet link to configure several MicroVAX InformationProcessors around a single VAX computer that serves as a boot node (localarea VAXcluster), or to connect remote terminals or workstations.

Ethernet/DECnet Link




8-29

By attaching a distribution panel to the 37-pin D-shell connector labelledSerial CH A on the MicroVAX Information Processor or to the connectorlabelled COMM PORT on the MicroVAX Information Processors EP andEE, you gain access to 4 serial communication ports:

Port: Electrical characteristics: Typical use:

Port 0 (TTA0 ) DEC �423 compatible data l d l

general purpose serialcommunication

Port 1 (TTA1)

pleads only communication

Port 2 (TTA2) RS�232�C compatible with limitedmodem control

Port 3 (OPA0) DEC�423 compatible data leads only console

For more information about the Ethernet connection on the MicroVAXInformation Processors, see chapter 6. Also see the “Workstations andMicroVAX 2000 Network Guide,” Digital Equipment Corporationpublication, available through your Digital representative. The ordernumber is EK-NETAB-UG-002.

The ENET channel on the EI module lets you connect PI systems via anEthernet network to higher-level plant computers. The EI module uses theTCP/IP protocol for communication through this port. Worksheet 8.15lists the choices you have for the ENET channel.

Table 8.O shows the channels on PI modules that let you connect toEthernet and DECnet links.

Table 8.OConnecting Ethernet and DECnet Links

This module: Has this channel:

MicroVAX Information Processor ENET CH A

MicroVAX Information Processor EP and EE ENET

Ethernet Interface module ENET

You can configure up to eight privilege classes for your PI system. Foreach class, you specify a group of features to which that class permitsaccess. After configuring privilege classes, you can assign:

each communication channel a default privilege class — all stations onthe channel have this privilege class unless you specify otherwise

read and write privileges to individual program and data files privilege class to a channel privilege class to a station specific privilege classes that override channel defaults to individual

stations on communication channels a password to any privilege class that limits access to that class to only

users that know the password

Privileges


8-30

Figure 8.15Privilege Hierarchy Example


User's Terminal

Channel privileges apply hereunless overridden by stationprivileges.

Program file privileges/data file privilegesare checked here. If the file allows read/write, station 005 can read/write; stations6 and 7 can only read due to channel privileges. If the file was read only, then allstations could only read.

No station privileges assigned. So, channel privileges apply whenaddressing PLC�5/250 processor.

Class 3: Read only privileges

User's Terminal

PLC� 5 processorClass 2 (read and write privileges)station privileges assigned. Whenaddressing the PLC�5/250 processor,the processor overrides channel privileges of station 001 (Class 3).

Station 001

Station 005 Station 006 Station 007

11873�I

General guidelines for assigning privileges are:

Define privilege Class 1 to have all privileges. Class 1 can then be thesystem manager.

Define the remaining seven classes to have less privileges than thesystem manager.

You can specify per file which classes are allowed to read and write to aprogram or data file.

Control who has the ability to modify program files by assigning theappropriate privilege class to a link through a channel on the RM.(Figure 8.15).

All stations on a channel are assigned channel privileges by default. Ifyou need a station on the link to have different privileges than thechannel, you can assign the station another privilege class. A station’sprivilege class overrides a channel’s privilege class.

You can log onto a station (terminal) and override that station’sprivileges provided you know the password for the privilege class youwant. This is useful when the system manager needs to use a station onthe plant floor to fix a problem.




8-31

Record the features you want to include in each privilege class and specifyprivilege assignments on Worksheet 8.8. Table 7.F lists the privileges youcan include in each privilege class.

Table 8.PConfigurable Privileges

If you want to be able to: Enable this privilege:

change privileges through the privilege screens and configuration (6200series software)

privilege modification (cannot bedeleted from privilege class 1)

create or delete data files and elements in either system or module memory data table file create/delete

create or delete program files in system or local module memory program file create/delete

access memory with an ASCII extended address (e.g. E0.2.0.1.2.3) ASCII extended address

write to program and data file areas of memory with any command other thanphysical write commands;save a processor memory file with a logical address

logical write (cannot be deleted fromprivilege class 1)

save a processor memory file with a physical address (execute physicalwrite commands)

physical write

restore a processor memory file with a physical address (read from programand data areas of memory with physical read commands)

physical read

write to the system status file system public status write

write to the internal processor status area system private status

enter or change a symbol (tag) for a device in the symbol table symbol table write

enter or change inputs / outputs input image write / output image write

force an internal storage bit FIST write

write to a block transfer data file BT data write

write to a block transfer control file BT control write

change the I/O adapter status area adapter status write

force any I/O force ON and OFF bits write

change shared data memory (e.g. on CVIM module) shared data write

write to a Processor Input Interrupt (PII) area of memory I/O interrupt write

change processor mode when the keyswitch on the processor is in REMOTE mode change

change PLC�5/250 configuration using 6200 series software configuration

edit a program file ladder on�line edit

enable or disable forces in the system, force individual transitions on or off, orclear all system forces

I/O force

enable or disable SFC forces, force individual transitions on or off, or to clearall SFC forces

SFC force

clear major or minor faults clear fault

clear memory clear memory

restore a complete processor memory file complete download

restore an SFC, along with the processor memory file SFC download


8-32

Each PI module contains memory that stores data related to themodule’s function:

Module: Function:

RM stores system status information. It also stores global data that youdefine. Global data on the RM can be accessed by all LP modules,the MicroVAX Information Processor, and devices on the RM, KAmodule, and the OSI interface module.

LP stores the logic program you create and local data that you define.Local data stored on a LP cannot be accessed by other LP modules,but can be accessed by the MicroVAX Information Processor anddevices on the communication modules' communication links. Datathat you want shared by other LP modules should be placed in globalmemory on the RM.

if you use synchronous input mode, the LP also stores a copy of theinput image files from the RS modules in the system. In synchronousinput mode, the LP copies the input image files from the RS modulesonce each program scan, then uses this copy during programexecution. In the alternative asynchronous input mode, the LP readsinputs and sends outputs directly to the I/O image files on the RSmodules as called on to do so by the logic program.

RS stores an I/O image of the I/O devices connected to it. It also storesblock transfer control information and block transfer data, force tables,and internal stores. The I/O image and other data on the RS can beaccessed by all LP modules, the MicroVAX Information Processor, anddevices on the RM communication links.

CVIM Module the CVIM module has a �shared memory" area that stores the resultsof vision analysis tasks it performs, and module status. LP modules,the MicroVAX Information Processor, and devices on networksconnected to the RM, KA module, and the OSI interface module canaccess this data. The CVIM module also accepts trigger inputs into itsmemory from either LP modules or MicroVAX Information Processor.

OSI interface module the A�B PI OSI interface module is either a single�slot module(carrierband) or a double�slot module (broadband) that can read anyaddressable memory in the PI system. You can connect the OSIinterface module in an Allen�Bradley PI system to a carrierband orbroadband MAP 802.4 token�passing network. The OSI interfacemodule enables the PI system to communicate with MAP productsproduced by other vendors.

EI module network INTERCHANGE software enables an EI module to directlyaccess other PI modules.

MicroVAX InformationProcessor

INTERCHANGE software enables a MicroVAX Information Processorto access data in all other modules that have data tables.

The LP and MicroVAX Information Processors execute user-createdprograms. The LP, under program control, can write data-to and readdata-from the:

RS I/O image files CVIM module shared memory RM data table devices on the RM communication links devices on the MAP network

Communication Among PI Modules




8-33

A MicroVAX Information Processor, under program control, can writedata-to and read data-from all other PI modules that have data tables, aswell as devices connected to the PI chassis by DH/DH+ networks.

The RM, RS, and CVIM modules update their own memories constantly,but do not read data-from or send data-to other modules. The OSIinterface module can read data from any data table in the PI system.

This section helps you organize the data that must be communicatedamong the PI modules and external devices.

Concept of Data Storage

Data used by the PLC-5/250 processor and a MicroVAX InformationProcessor is stored in files in data storage areas of memory. You use datastorage areas to store:

data received from input modules

data to be sent to output modules that represents decisions made by yourladder programs

intermediate results made by the logic program

pre-loaded data such as presets and recipes

data to be sent out on the DH link to external devices and data receivedfrom external devices

data to be gathered by a MicroVAX Information Processor and dataoutput from a MicroVAX Information Processor

The role data storage plays is shown in Figure 8.16.

Figure 8.16Data Storage in the PLC�5/250 Processor

Digital Inputs

Analog Inputs

Digital Outputs

Analog Outputs

Examine Data Return Results

Logic Program

PI memorydata storage files

Data storage is divided among the various PI modules (Figure 8.17). Thishelps achieve quickest performance. When you need to access data, youspecify the module it is stored on.

Planning Data Storage


8-34

Data storage is further divided into sections with different formats andranges to accommodate different types of data. You select where to storeyour data by matching the type of data with the section for storing thatdata. When you need to access data, you specify the section the data isstored in. Figure 8.17 shows the concept of data storage sections.

Figure 8.17Some Data Storage Sections of Pyramid Integrator Memory

Integer Section Block�TransferSection

Status Section Control Section Floating�PointSection

Long�IntegerSection

rangeformat

rangeformat

rangeformat

rangeformat

rangeformat

rangeformat

DATA STORAGE

Each section can be divided into many files to let you group and organizelogically related data (Figure 8.18). When you need to access data, youspecify which file the data is stored in.

Figure 8.18An Example of Files within a Data Section

Integer Section

File 0

File 1

File 2

File 9999

recipe �A" data

recipe �B" data

recipe �C" data




8-35

In some sections, files are made up of words (Figure 8.19). When youneed to access this data, you specify it with a formatted address.

Figure 8.19An Example of the Words of a Data File

2

40567

64

777999888

Integer Section

File 0

File�1 Data

File 1

File 2

File 9999

3

0

64

2

Word No.

1

In some sections, each word contains 16 bits (Figure 8.20). In somesections (floating-point, long integer) each word contains 32 bits. A bit isthe smallest unit of data. A bit contains a value of 0 or 1. When you needto access this data, you specify it with a formatted address.

Figure 8.20An Example of the Bits in a Word

0276 0 0 0 0 0 0 1 0 0 0 1 0 1 0 0

Bit pattern for 276

Integer File


8-36

Some types of files are divided into structures used to control instructionelements (Figure 8.21). These structures are subdivided into members atthe bit or word level. When you need to access this data, you specify itwith a formatted address.

Figure 8.21An Example of the Structures of a Timer File

.TT

2760

432

1

Timer File

Timer�0 Structure

Structure Members

Timer�1 Structure

Timer�2 Structure

Timer�9999

.PRE (preset)

.ACC (accumulated)

Structure

01

.DN.EN

In addition to the processor-defined organization of files, you can organizethe data within files into data blocks that help group and organizelogically related data (Figure 8.22). When you need to access this data,you specify only the starting address within the file (and length) instead ofeach individual address.

Figure 8.22An Example of Data Blocks within a Data File

File

Starting addr

Device�A Data

Device�B Data

Device�C Data

End of block

Starting addr

End of block

Starting addr

End of block




8-37

Selecting the Module for Data Storage

Some modules in the system contain a data storage area. Use the followingtable to select the module for storing a particular type of data.

Store this type of data: In this module:

digital and analog I/O valuesforce values1

status of I/O adapter modules

RS

data accessed by more than one LP system status RM module

data accessed by only one LP2 processor status LP

1 Forcing lets you override ladder logic to set or reset an addressed bit. Use it to check outputs or

debug programs during start�up.2 One LP cannot access data files of another LP, but can access data in the RS modules, RM, and

CVIM module. A MicroVAX Information Processor can access data stored in all other modules.

Selecting the Section

Use the following tables to select the proper section for each type of data.

For a list of data types forthese modules:

See:

RS Table 8.Q

RM, LP Table 8.R

Table 8.QRS Data Storage Sections

Store this type of data: In this section: Using this specifier:

input data from input modules input image I

output data to output modules output image O

block�transfer I/O data to/from I/O modules block�transfer data BTD

forcible internal storage internal storage IS

control of block�transfer read instructions block�transfer read control BR

control of block�transfer write instructions block�transfer write control BW

I/O communication and remote I/O adapter status adapter status AS


8-38

Table 8.RData Storage Sections on RM and LP modules

When you need: In this format: In this range: In this default displayformat:

Then choose thissection:

With thisspecifier:

bit�level data 16�bit signed binary -32768 to +32767 binary binary B

decimal data 16�bit signed binary -32768 to +32767 decimal integer N

32�bit signed binary -2,147,483,647 to+2,147,483,647

decimal long integer L

decimal data IEEE format +/- 2.939 E-39 to+/- 1.701 E+38

engineering units floating point F

ASCII data ASCII 82 characters perstructure

ASCII string ST

timer status and control special structure to support timer instructions timer T

counter status andcontrol

special structure to support counter instructions counter C

PID status and control special structure to support PID instruction PID PD

message status andcontrol

special structure to support MSG instruction message MSG

file instruction statusand control

special structure to support file�level instructions control structure R

system status special status S

Worksheets for Recording Data Storage

Use Worksheet 8.9 and Worksheet 8.10 to record data storage assignments.Pass copies of these worksheets to the PLC-5/250 and MicroVAXInformation Processor programmers.



Chapter 9

9-1

DH+ Message Routing

This chapter provides you with the information you need to completethese tasks:

know the difference between basic and advanced DH+ routing decide which type of routing fits your application review Worksheet 9.1 and Worksheet 9.2 use Worksheet 9.1 and Worksheet 9.2 to document configuration

information that you will enter into 6200 series software later

Areas covered include:

common uses of DH+ message routing using basic and advanced DH+ message routing completing worksheets application timeout communication errors link diagnostic counters design requirements for DH+ message routing

A device that uses PI routing must be able to:

generate remote DH+ packets support remote DH+ protocol send and receive messages

Figure 9.1 shows a typical DH+ routing configuration. The PI chassiscontains one RM and two KA modules. Some devices in Figure 9.1 havethe same station number because they are on different links. However,devices on the same link must have unique station numbers, which youarbitrarily assign.

Chapter Objectives

Design Requirements forDH+ Message Routing

Chapter 9DH+ Message Routing

9-2

Figure 9.1Typical DH+ Routing Configuration

PLC�5/25 processorstation number: 20




KA modulesRM (CH2station number: 10)

PI chassis

DH+ link 4

DH+ link 3

DH+ link 2

DH+ link 1

T47station number: 77

19771

DH+ message routing allows communication between devices onphysically separate DH+ links, provided both links are connected to PIsystems in a DH+ network (such as the ones shown in Figure 9.2and Figure 9.3).

Important: DH+ message routing is supported through channels 2 and 3of the RM and KA module, firmware revision A07 and later. DH+ routingis not supported through channel 1 of either the RM or KA module.

Common Uses of DH+Message Routing




9-3

Figure 9.2DH+ Routing Allows Communications Between 2 Stations on 2 DifferentDH+ Links

RMKA module

PI chassis

DH+ link

DH+ link

Routed messagesover the backplane

PLC�5/60 processor PLC�5/40 processor19765

Example: A PLC processor on a DH+ link connected to a channel of theRM can initiate messages to a PLC processor on a DH+ channel of the KAmodule. The reverse is also true. See Figure 9.3.

Figure 9.3Initiating Messages

19766PLC processor PLC processor

DH+ link

DH+ link

PI chassis

KA moduleRM


9-4

The PI system can route messages received from an initiating station onone DH+ channel and re-transmit the message out any other DH+ channelto the destination station. You can have a maximum of one RM and amaximum of four KA modules per chassis (CH 2 and CH 3 can each beconfigured DH+ link). Each channel of each module can be connected to aseparate link. Hence, you can have up to 10 DH+ links per chassisdirectly connected.

The RM or KA module can process packets coming into one DH+ port androute them directly out its other DH+ port or over the backplane to anothermodule, which then routes the message out one of its DH+ ports to thedestination station.

Using the Programming Terminal for Remote Links

The following examples also illustrate the DH+ routing functionality.

Example: A programming terminal connected to one link on a PI systemcan program any device on any DH+ link connected to the PI system asshown in Figure 9.4.

You can connect a programming terminal to CH 2B on a RM in order toprogram a PLC-5 processor that is connected to the RM’s other port, CH 3,or the KA module’s CH 2 and CH 3 (Figure 9.4). You do not have tophysically connect together all your stations in one large link (in order forthem to all communicate with each other). Simply connect each link to thePI system and route messages.

When you divide a DH+ network into smaller links, you increase themessage throughput time because you shorten the time to access the linkby having less stations on the link.

If your system is: Then the T47 in Figure 9.4:

with DH+ routing can program any of the PLC�5 processors.

without DH+ routing can only program the PLC�5/25 processor.




9-5

Figure 9.4Message Routing Enables a T47 to Program any PLC�5 Processor inthe Network

19767

DH+ linkDH+ link

DH+ link


PLC�5 processor

PLC�5 processor


T47

RM KA module

PI chassisRouted messagesover the backplane

DH+ link DH+ link

Because DH+ message routing allows any station to send messages to astation on a remote link in the network, it:

eliminates the need to move the connector to other links

eliminates the need for a separate drop on each link for aprogramming terminal

enables you to have a central point for programming and monitoring

enables you to divide a DH+ network into smaller links; you increasethe message throughput because you shorten the time to access the linkby having less stations on the link

Before you can design a PI system to meet your application needs, beaware of the difference between basic and advanced DH+ routing. Onceyou identify the type of DH+ routing to use in your application, you needto record your design decisions on a worksheet like the model worksheetsshown in this chapter. After you complete the worksheets, you then enterthat configuration information using 6200 series software.

Using Basic and AdvancedDH+ Message Routing


9-6

Basic DH+ Message Routing

Basic DH+ routing is the transfer of data between two links connected tothe same bridge. For instance, in Figure 9.5, a message from the T47 isaccepted by the port on the RM, which routes the message out a channel onthe KA module to the PLC-5 processor.

Figure 9.5Basic DH+ Routing

19768

DH+ link 2

PLC�5 processor

PI chassis

KA moduleRM

T47 (using 6200series software)

DH+ link 1


Advanced DH+ Message Routing

Advanced DH+ message routing is the transfer of data between DH+ linksthat are not connected to the same bridge; the messages must be routedthrough more than one bridge.

Figure 9.6 and Table 9.A show the difference between basic routing andadvanced routing.

Example Worksheet for Basic DH+ Routing




9-7

Figure 9.6Advanced DH+ Routing

DH+ link 1

DH+ link 2

DH+ link 3

PLC�5/25 processorstation number: 15 PLC�5/40 processor

station number: 45


19769

PI system #1RM

KA module KA moduleRM

PI system #2

Station number: 25 Station number: 55


Numbers represent link numbers, which you arbitrarily assign.

The bridge station number is that of the next bridge needed to routemessages to the remote link.

Example of a bridge station number: If PI system #1 (Figure 9.6)receives a message addressed to station number 65 of link 3, it will send itout port 3 of the KA module (PI system #1) to station number 55, which isthe bridge to link 3.

Table 9.ABasic and Advanced DH+ Routing

Communicationbetween:

Means thetype of routingis:

Because there is a:

Which means that:

station 15 on link 1 and station 45 on link 2(Figure 9.6)

basic transfer betweenonly two DH+ links

the RM (PI system #1) receives the message from the PLC�5/25processor and routes it to the KA module (PI system #1). The KA module(PI system #1) then transmits the message to station 45 of link 2.

station 15 on link 1 and station 65 on link 3(Figure 9.6)

advanced multiple DH+ linktransfer

the RM (PI system #1) receives the message from the PLC�5/25processor and routes it to the KA module (PI system #1), which thentransmits the message to station 55 of link 2. The RM (PI system #2) thenroutes the message to the KA module (PI system #2), which thentransmits the message to station 65 of link 3.


9-8

Before entering configuration information into 6200 series software,you must:

determine whether you have basic or advanced routing using theinformation in this section (Table 9.A)

assign link numbers make sure you meet the design requirements for DH+ message routing complete Worksheet 9.1 and Worksheet 9.2 (pages 109 through 111) enter DH+ routing configuration information into 6200 series software.

For instructions, see the PLC-5/250 Programming Manual (5000-6.4.8)

Important: You can configure a maximum of 24 local and remote linksper PI system.

When an error occurs while sending a message to a remote link, it willappear to the sending station as an application timeout because errormessages are not routed back. It is difficult to re-route an error message tothe sender. So, when a message occurs during routing, it is dropped tomake the system more efficient.

Let’s assume that station address 65 (Figure 9.6) refuses a message sentfrom station address 15 because its buffers are full. Nothing is returned to15, but an application timeout appears in the message instruction.

If your system is: If the message is not completed:

with DH+ message routing it will eventually time out. Since errors are not routed back, thesending station reports an application timeout whenever anerror occurs. As you can see in Figure 9.6, the same errormessage, application timeout, appears for several reasons.

without DH+ messagerouting

the sending station receives the reply that the destinationstation's buffers are full.

Example: A PLC-5/40 processor sends a message to a PLC-5/25processor, and the PLC-5/25 processor’s buffers are full (Figure 9.7).Three things happen:

the PLC-5/25 processor doesn’t send a reply message back to thePLC-5/40 processor because the buffers are full

the originator, in this case, a PLC-5/40 processor, detects anapplication timeout

the originator increments its error count

The PLC-5/40 processor can do a retry later.

Completing Worksheets

Application Timeout




9-9

Figure 9.7Example of an Application Timeout

I detect anapplication timeout. There will be an increment in the error count



DH+ link 2

my buffers are full

KA moduleRM

DH+ link 1


PI chassis

19770

Any communication error is returned to the originator later on as anapplication timeout. Access and error counts on the link show how farmessages get sent. Whenever there is an error in executing the command,the error status is returned.

There are three system-level diagnostic counters. The counters indicatewhich links are unreachable and how well messages are being routed.

Diagnostic counter: Description:

links unreachable diagnostic error count of how many times a routing link wasunreachable. Links Unreachable can be a result of a link beingmarked as purging, faulted, or unresolved. The message will bethrown out.

lifetime expired diagnostic error count of how many routed packets were discardedbecause the lifetime was expired.

mailbox full diagnostic error count of how many routed packets were discardedbecause the backplane target mailbox was full.

Communication Errors


9-10

Fault Reporting

When you use the DH+ message routing feature, you have the option in6200 series software of configuring a routing error to be a minor fault.Regardless of whether or not you configure 6200 series software to declareminor faults, there is an increment in the diagnostic counter each time anerror occurs. See chapter 10 for more information about faults.

There is a count (measured in increments) of how many times youroute messages.

Diagnostic counter: Description:

access counter there is an increment each time a message is successfullyrouted to that link.

error counter there is an increment each time the system is unable to route amessage destined for that link.

Link Diagnostic Counters



Chapter 10

10-1

Planning for PI Fault Handling

This chapter describes the types of fault conditions that can occur in the PIsystem and helps you decide how to handle them. After learning whattypes of faults the PI system can generate and how the system responds tothem, you will decide:

what faults are to be considered minor, major or critical what fault routines should be created to respond to major faults how fault information is to be reported when and how to clear faults

The PI system has four kinds of faults.

System Warnings

System warnings are logged by the system. The three systemwarnings are:

low battery overtemperature (the sensor is in the power supply) ac power fail

For a: The:

battery low condition red Battery Low LED on the module that has the low�voltage batteryturns on.

fan chassis fault oran overtemperature

warning (OTW)

power supply causes an OTW (low true) backplane signal tobe generated.

These states are available to the user program as addressablememory locations. The Over Temp LED will go to on red when anovertemperature shutdown occurs.

Minor Faults

Minor faults are recorded but do not stop system operation. The RM has acircular buffer that records the fault, its location, and a time stamp for theeight most recent minor faults. Minor faults include communication errorsand arithmetic errors, such as overflow, underflow, and division by zero.

They may also include I/O faults, STI interrupt overlaps, and PII interruptoverlaps if you configure these faults as minor.

Chapter Objectives

Types of Faults

Chapter 10Planning for PI Fault Handling

10-2

Major Faults

Major faults include software/firmware watchdog timeout, missing files,invalid label number, and corrupt memory, among others. In addition, youcan configure I/O faults, STI interrupt overlaps, and PII interrupt overlapsto be major faults. Major faults are reported to the RM, which decideswhether or not a user-supplied fault routine should be run by a LP.

If the fault routine is executed and clears the fault, no information isrecorded and program execution resumes. If no fault routine is executed,or if the fault routine does not clear the fault, fault information is recordedin a buffer on the RM and the system enters fault mode. In fault mode,system communication is maintained but all scanners are sent an I/O resetcommand. Outputs are reset or maintain their last states based on thesetting of the last-state switch on each I/O chassis. The fault buffer on theRM stores information for the first four major faults, and saves up to fourprevious major faults.

Critical Faults

Critical faults are those from which the system cannot recover, such ashardware watchdog timeout or memory parity error. When a critical faultoccurs, the system responds as it does in the case of a major fault, exceptthat no fault routine is executed.

The system records as much fault information as possible and attempts anorderly shutdown of the process.

For a list of: See:

system warnings Table 10.A

fault responses Table 10.B

minor faults Table 10.C

major faults Table 10.D

critical faults Table 10.E

Table 10.ASystem Warnings

System warning signal: Description:

ACPWR AC power supply out of specification

OVRTEMP operating environment too hot or fan not operating properly

LOW BATTERY low battery condition on one or more modules




10-3

Table 10.BFault Response

Effect of a system fault on: Minor fault: Major fault:1 Critical fault:

RS

Outputs no effect off/last state off/last state

Inputs updated updated not updated

LP

Execution no effect stop stop (no longer active on backplane)

RM

Communication (CH1, CH2, CH3) active active stop (no longer active on backplane or network)

KA module

Communication (CH1, CH2, CH3) active active stop (no longer active on backplane or network)

CVIM module

Execution no effect configurable stop (no longer active on backplane or network)

Outputs no effect off off

OSI interface module no effect no effect stop (no longer active on network)

MicroVAX Information Processors

Execution no effect no effect no effect

External Communication active active active

Backplane Communication active active stop (no longer active on backplane but still active on network)

EI module

Execution no effect no effect stop (no longer active on network)

External Communication active active stop (no longer active on network)

Backplane Communication active active stop

System mode: no effect fault mode fault mode (halted)

LEDs:

Execution no effect off no effect

Outputs no effect off no effect

Faults no effect on (red) no effect (red)

Pass/Fail on (green) on (green) on (red)

1 If fault routine does not successfully clear the fault.

For information on industrial disk LEDs, see chapter “Checking theHardware,” in the PI Installation Manual (5000-6.2.10).


10-4

Table 10.CMinor Faults

Presented by modules:

Fault: RM LP RS CVIMmodule

OSIinterfacemodule


EImodule

KAmodule

Imaginary arithmetic result x

Arithmetic overflow x

Arithmetic underflow x

Division by zero x

I/O error (if configured as minor) x

Communication error x x x

Selectable timed interrupt overlap (STI) (if configured as minor)

x

Processor input interrupt overlap (PII)(if configured as minor)

x

Duplicate communication node (if configured as minor)

x x x

Vision module faulted x

Communication transmitter error x

Plug failure x

Accumulator preset negative x

Duplicate ABT address x

Module faulted x

TPC MSG not completed x x

TPC MSG not in system x x

TPC module not in system x x

Message routing fault x x

Data transfer watchdog expired x

Faulted MAC (media access control) x

Missing MAC setup data x

Modem error x

Faulty transmitter x

Background CRC check error x

Background prom checksum error x

Toolkit (software) error x

OE (software) errors x




10-5

Table 10.DMajor Faults



OSIinterfacemodule


EImodule

KAmodule

Software watchdog timeout x x x

Array bound violation x

Subroutine file to be executed missing x

I/O error x

Communication error x x x

Selectable timed interrupt overlap (STI) (if configured as major)

x

Processor input interrupt overlap (PII) x

Duplicate communication node x x x x

Powerup fault x x x

PID instruction fault x

Illegal run�time library entry point x

Bad label number x

Subroutine stack overflow/underflow x

Corrupt memory during access x x

Memory verification error x x

Fault encountered during fault handler file execution x

Detection of a bad prom checksum after power�up x x x

SFC file missing x

PII file missing x

STI file missing x

Bit coprocessor error x

Array index out of bounds x

Power�up (if configured as fault) x

illegal parameter transfer to a global subroutine x

Data table missing x

Bad immediate input x

SFC processor missing x x

Communication transmitter error x

Plug failure x

Invalid SMF parameter x

Data transfer watchdog expired x1

PSUR file missing x

PID instruction run�time error x

Internal Firmware x x x

Background prom checksum error x x

1 This applies to RS5 only.


10-6

Table 10.ECritical Faults1



OSIinterfacemodule


EI module KAmodule

Incorrect PROM checksum x x x

Bit coprocessor error x

Firmware detected Internal Error x x x

System fault x x x

Application fault x x

Hardware fault x x

Hardware watchdog timeout x x x x x x x x

Backplane arbiter timeout x

Bus hog watchdog timeout x x

Memory parity error x x x x x x x x

Bus error/Parity error x x x x x x x x

PROM/RAM error x x x x x x x x

Z80 hardware/firmware fault x x

29K illegal trap exception x2

Plug 1 negotiate fail x2

Plug 2 negotiate fail x2

Plug 1 configuration fail x2

Plug 2 configuration fail x2

Plug 1 scan list bad instance table x2

Plug 2 scan list bad instance table x2

Excessive pushwheel range x2

Low pushwheel exceeds highpushwheel

x2

Channel 1 domino fifo buffer full x2




Incompatible domino prom x2

1If the industrial disk's (5730�ID3, 5710�ID6, 5710�ID7) external environment temperature exceeds 60°C or drops below 0°C, you have nine minutes to shutdown the

system in an orderly fashion. After 9 minutes the disk shuts itself down and your data may be lost. You can wire an out�of�temperature warning device to the disk to letyou know when the temperature has exceeded or fallen below its limits.

2 This applies to RS5 only.




10-7

As the PI system detects minor faults, it maintains up to eight minor faultrecords in a FIFO buffer. When a module detects a minor fault, themodule reports the fault to the RM, which takes the following action:

sets a bit to indicate detection of a minor fault sets a bit to identify the type of fault records minor fault information in a 16-word record sets a bit to indicate that at least one fault record has been recorded sets a bit if it detects more than eight minor faults (buffer overflow)

since the last time minor faults were cleared

You can clear minor fault information in any of three ways:

cycle power to the PI system use the fault clearing function of 6200 series software program an instruction in the PLC-5/250 program

When the PI system detects a major fault, it follows the algorithm shownin Figure 10.1. In addition, the system:

sets a bit to indicate detection of a major fault sets a bit to identify the type of fault if allowed, sets a bit to indicate that the specified LP is executing the

fault routine and clears this bit when the LP is finished if the fault is not cleared by the fault routine, records fault information

in a 16-word record in a major fault buffer if the fault is not cleared, sets outputs according to the setting of the last

state switch on each I/O chassis

You can clear major faults in any of four ways:

cycle power to the PI system use the Clear Minor Section function in 6200 series software clear the fault code in memory with ladder logic programming

(some faults) turn the mode keyswitch on the RM to PROGRAM, or to REMOTE then

back to PROGRAM

How the PI System HandlesMinor Faults

How the PI System HandlesMajor Faults


10-8

Figure 10.1Major Fault Handling in the PI System

LP halts program execution and reportsthe fault to the RM

Does thefault allow executionof a fault routine?

Is faultroutine correctlyprogrammed and specified?

Does thefault routine clear the fault?

Yes YesProgram executionresumes at the nextrung (does not return tointerrupted rung)

Yes

Fault routineexecutes to completion

No

RM declares fault,records fault data, andswitches to fault mode

Other PI modules changeto fault mode operation

NoNo

When a critical fault is detected, the PI system responds as it does for amajor fault, except that no fault routine is executed. The system records asmuch information as possible in the major fault buffer and goes intofault mode.

You decide whether the PI system responds to any of the following faultsas major or minor faults. If you make the faults minor faults, you do notneed to specify a fault routine response.

Fault: Use:

STI overlap occurs when you set the interrupt interval too short, preventingthe LP from completing the scan of the STI program file.

Worksheet 6.6

PII overlap occurs when the LP receives another input from the same PIIsource before it can complete the scan of the PII program file.

Worksheet 6.6

remote I/O fault occurs when the RS detects a hardware fault on a remoteI/O channel.

Worksheet 3.6

How the PI System HandlesCritical Faults

Select Responses to Major andMinor Faults




10-9

In addition to the system-defined major faults, you can define processconditions that you want the system to treat as major faults. That is, whenone of these conditions occurs, the PI system will record fault information,execute a fault routine (if specified), and enter fault mode if the fault is notcleared. The PLC-5/250 programmer must create a file of informationabout user-defined major faults. Use Worksheet 10.1 to specify:

the condition that is to cause the major fault

any fault-dependent information you want to be included in the faultrecording (eight 16-bit words are available for fault-dependentinformation. The system will automatically time and date stamp thefault and record the module that detected the fault)

When a major fault occurs, the PI system can execute a fault routine if oneis specified. The fault routine performs the functions that are programmedin it. We recommend that you program the fault routine to examine themajor fault information recorded by the system and decide whether to dothe following before the system enters fault mode:

set an alarm clear the fault store or reset data for an orderly start-up later shut down in an orderly manner

You can write multiple fault routine programs and store them in multiplefault routine files. See chapter 10, “Programming Considerations forWriting a Fault Routine,” in the PLC-5/250 ProgrammingManual (5000-6.4.8).

However, only one fault routine program can be executed when a majorfault occurs. The fault routine the system executes is specified in adesignated memory location. You specify the initial fault routine via 6200series software. Your logic program can change the specified fault routine.If you use Sequential Function Chart programming, you can specify a faultroutine for each step:

1. Assign a LP number (1-4) to the fault routine. This number indicateswhich LP runs the fault routine.

2. Assign an IBP file number (0-999) to the fault routine.

Important: The LP automatically gives the highest task priority to runninga fault routine.

Use Worksheet 10.2 to specify the fault routines you want developed andthe actions they must perform (LP = x; IBP file number = y).

The fault-handling routine is a PLC-5/250 processor ladder logic file thatyou create to deal with major faults. In it you can perform an orderlyshutdown of the process or try to correct the fault.

When a major fault occurs, the system reads the fault routine number andLP number that is currently active and executes it.

Specify User�Defined Faults

Specify Fault Routines


10-10

The PLC-5/250 logic program can access the fault records the systemrecords and transfer them to a data file for processing or for gathering by aMicroVAX Information Processor. Use Worksheet 10.3 to specify theinformation you want to include in fault reports. The information availablefor different types of faults varies:

minor faults — The PI system records fault information for minorfaults in a FIFO buffer that can hold information for the most recenteight faults. Information recorded includes:

- module type and number that detected the fault- date and time of the fault- fault dependent information (additional information to identify and

isolate the fault, such as memory location, I/O channel and rack,communication channel and node addresses, etc.)

The PLC-5/250 program can access these records and process theinformation for reporting or presentation to a MicroVAXInformation Processor.

major faults — When a major fault occurs, the PI system stores a16-word record of fault information in a temporary buffer.

If the fault is: Then:

cleared by afault routine

no information about it is stored in the major fault buffer. So if you wantthe information for reporting, it must be taken from the temporary buffer.

not cleared bya fault routine

this fault information is transferred to a buffer that stores information forthe first four major faults that occur.

Information in a major fault record includes:

- module type and number that detected the fault- date and time of the fault- fault-dependent information (further specification of the fault type

or location)

The RM stores records for up to four major faults. Your LP programcan access these records directly.

The major fault buffer stores records for the first four major faults thatoccurred since major faults were last cleared. When major faults arecleared, the four “current” fault records are transferred to a “previous”faults buffer.

critical faults — Critical faults are treated as major faults, but no faultroutine is executed. Information for critical faults is recorded in themajor fault buffer as described above.

Fault Status When a fault occurs, bits are set in the fault status area of memory toindicate that a fault has occurred and the type of fault. This fault statusdata is available to the PLC program for processing or reporting.

Plan for Fault Reporting



Chapter 11

11-1

Selecting PI Hardware

After you read chapters 2 through 9 (those that apply for your application),read this chapter. It will help you select a PI chassis, power supply andauxiliary hardware.

When you have finished this chapter, your PI hardware selection willbe complete.

To perform the tasks described in this chapter, you’ll need the followingworksheets from previous chapters:

Worksheet 2.3 — CVIM module hardware Worksheet 3.8 — 1771 I/O hardware list Worksheet 6.1 — logic processor hardware list Worksheet 7.2 or Worksheet 7.6 — MicroVAX Information

Processor hardware

Use Worksheet 11.1 to select a PI chassis.

Record your chassis selection on Worksheet 11.5, PI hardware.

When you know the size of your chassis and the modules you must installin it, use Worksheet 11.2 to assign the modules to the slots in the chassis.Pass this information on to the hardware installer.

Given the chassis and module configuration listed on Worksheet 11.2, youcan select a power supply for the chassis by using Worksheet 11.3. Recordyour selection on Worksheet 11.5.

Chapter Objectives

Materials You Need

Selecting a PI Chassis

Assign Modules to Slots inChassis

Select a Power Supply

Chapter 11Selecting PI Hardware

11-2

Power Requirements for your PI Chassis

The following table lists PI chassis backplane current loads for the PIchassis power supply:

Module: A+5V dccurrent

B+12V dccurrent

C-12V dccurrent

4�slot chassis (5110�A4/B) 2.0 A 0 0

8�slot chassis (5110�A8/B) 2.0 A 0 0

RM with 128Kword memory (5130�RM1) 2.9 A 0.07 A 0.05 A


LP with 256Kword memory (5250�LP1) 1.82 A 0.02 A 0




RS with memory (5150�RS5) 4.85 A 0.02 A 0

RS with memory (5150�RS2) 2.18 A 0.0139 0

CVIM module (5370�CVIM) 4.5 A2 0.065 A2 .075 A2

OSI carrierband interface module (5820�CC) 5.0 A 0.225 A 0.05 A

OSI broadband interface module (5820�CBx) 5.8 A 0.55 A 0.1 A

MicroVAX Processor EP (5731�CPU1) 13.1 A 0.55 A .058 A

MicroVAX Processor EE (5731�CPU2) 13.4 A 0.55 A .058 A

MicroVAX Information Processor (5730�CPU1) 11.2 A 0.60 A 0.1 A

EI module (5820�EI) 5.0 A .50 A 0

KA module (5130�KA) 2.9 A 0.07 A 0.05 A

1 Available power in a 60°C ambient environment without a fanchassis is 170 watts, with a fan chassis is 225 watts.

35 A 3 A 1 A

2 We assume you have one Allen�Bradley Ethernet transceiver. These current loads do not include the camera.

ATTENTION: You must install a fan assembly if the chassiscontains a MicroVAX Information Processor, or if the powersupply load is over 170 watts.

For some configurations of PI modules, a fan assembly is required to coolthe components. Use Worksheet 11.4 to determine whether or not youneed a fan assembly. If you select a fan assembly, record your selection onWorksheet 11.5. If you have a MicroVAX Information Processor and/or aCVIM module, you will also select an alternate power supply/fanassembly cable.

Select a Fan Assembly



Chapter 12

12-1

Preparing Mounting Documentation

This chapter guides you in preparing the mounting documentation that thehardware installer will use to mount the system.

To prepare the mounting documentation, you must:

determine the positions of the components determine the positions of raceways for the wires and cables choose an enclosure appropriate for your application

Before you begin the mounting documentation, determine which of thefollowing hardware you are using:

For the: See page:

4� or 8�slot chassis 12�3

fan assembly 12�3

industrial disk 12�4

4�port distribution panel 12�5

user interface box 12�6

I/O interface box 12�8

I/O board 12�10

rack mount color monitor 12�11

black and white monitor 12�12

cameras 12�13 and 12�14

I/O chassis, I/O modules, andpower supply

12�15

To determine the position of the components, you must consider:

the environment in which you can install the components additional guidelines the dimensions

Chapter Objectives

What You Have AlreadyCompleted

Determine the Positions of theComponents

Chapter 12Preparing Mounting Documentation

12-2

Environment

The environment you install your system in must meet the followingenvironmental conditions:

Condition: Specifications:

operating temperature 0 to 60°C (32 to 140°F)

program loader 10 to 35°C (50 to 95°F)

storage temperature �40 to 85°C (�40 to 185°F)

program loader �30 to 50°C (�22 to 122°F)

industrial disk �40 to 65°C (�40 to 140°F)

relative humidity 0 to 95% (noncondensing)

program loader 20 to 85%

industrial disk 5 to 95%

Separate the PI chassis from other equipment and plant walls to allow forconvection cooling. Convection cooling draws a vertical column of airupward over the chassis. This cooling air must not exceed 60°C (140°F)at any point immediately below the processor and industrial disk.

Additional Guidelines

Follow these additional guidelines when planning the positions ofthe components.

for rack mounting use #10/32 screws, nuts and washers. for panel mounting use #10/32 mounting bolts, nuts and washers. do not mount an I/O chassis above a PI chassis. mount each chassis horizontally. leave any excess space at the top of the enclosure where the temperature

is highest. leave room for transformers, fusing, a disconnect switch, a master

control relay, and terminal strips.

make sure you follow the minimum spacing requirements by allowing:

6 vertical inches above and below all chassis. When you use morethan one chassis in the same area, allow 6 vertical inches betweeneach chassis.

4 horizontal inches on the sides of each chassis, when you mountthe chassis beside other components. When you use more than onechassis in the same area, allow 6 horizontal inches between eachchassis.

2 inches vertically and horizontally between any chassis and thewiring duct or terminal strips

sufficient space in front of the chassis for installing and removingmodules, and for cabling that attaches to the front of modulesAllen-Bradley Automation



12-3

Dimensions

The following figures show the dimensions of each component and theminimum spacing requirements to allow for convection cooling. Use thefigures to layout your mounting diagrams.

8-Slot ChassisThe 8-slot chassis (Figure 12.1) can be mounted on an 19-inch rack or ona panel.

4-Slot Chassis The 4-slot chassis (Figure 12.1) can be mounted on a rack or panel. Forrack mounting, an extension plate (user-supplied) is required.

Figure 12.1Dimensions: 4�Slot Chassis (5110�A4/B), 8�Slot Chassis (5110�A8/B) andFan Assembly (5110�FAN8)

235 mm(9.26 in)

256 mm(10.08 in)

19772

Front view

406 mm1

(16.01 in)

Side view

311 mm(12.25 in)

481 mm2

(18.94 in)(fits in standard 19 in rack)

465 mm(18.31 in)

1 Allow 6" above and below each chassis or each chassis and fan assembly

2 If chassis is installed with other PI chassis, allow 6"between chassis. Otherwise, allow 4" left and right ofthe chassis.

3 If using program loader, position chassis within 6"of program loader so the data cable can beconnected to the MicroVAX Information processor.

406 mm overall depth (16 in)

(allow for installing andremoving modules and cables)

427 mm(16.85 in)

146 mm(5.75 in)

Front View

309 mm2

(12.13 in)

292 mm(11.50 in)

311 mm(12.25 in)

406 mm1

(16.01 in)


12-4

Industrial DiskThe industrial disk (Figure 12.2) can be mounted in a 19-inch rack or on a panel. It must be mounted within 1.82 cable-meter (6 cable-feet) ofthe information processors (6 feet is the length of the cable). If you mounta second disk it must be mounted within 1.82 cable-meter (6 cable-feet) ofthe first disk.

Figure 12.2Dimensions of Industrial Disk (5730�ID3, 5710�ID4, �ID5, �ID6, and �ID7)

Top view

245 mm(9.66 in)

447 mm(17.58 in)

419 mm(16.49 in)

465 mm(18.33 in)

Front view

295 mm(11.63 in)

17086




12-5

4-Port Distribution PanelThe distribution panel (Figure 12.3) is 19-inch rack mountable and must bemounted within 1.82 cable-meter (6 cable-feet) of the informationprocessor (6 feet is the length of the cable).

Figure 12.3Dimensions of the 4�Port Distribution Panel (5710�DPI)

0.8 mm(0.03 R)

465 mm(18.33 in)

Allow at least 3 inches of depth forconnectors and cables

13 mm(0.5 in)

22 mm(0.86 in)

45 mm(1.75 in)

88 mm(3.47 in)

17067


12-6

User Interface BoxThe user interface box (Figure 12.4) connects to the I/O board and must bemounted within the following cable distances of the CVIM module:

2m (6.56 ft) (2801–NC18) 5m (16.40 ft) (2801–NC18A) 10m (32.80 ft) (2801–NC18B) 25m (82.02 ft) (2801–NC18C)

Figure 12.4Dimensions of the User Interface Box (2801�N22)

10 mm(0.38 in)

70 mm(2.75 in)

5 mm(0.19 in)

68 mm(2.69 in)

77 mm(3.03 in)

14 mm(0.56 in)

35 mm(1.38 in)

4 mm (0.152 in)

17016




12-7

Figure 12.5Dimensions of the User Interface Box (2801�N26) -- for CVIM2 only

89 mm(3.50 in)

76 mm(3.00 in)

6 mm(0.25 in)

9 mm(0.35 in)

66 mm(2.61 in)

79 mm(3.12 in)

7 mm(0.26 in)

14 mm(0.56 in)

33 mm(1.31 in)

19902


12-8

I/O Interface BoxThe I/O interface box (Figure 12.6) connects to the I/O board and must bemounted within 2 cable-meters (6.56 cable-feet) of the CVIM module (2meters is the length of the cable).

Figure 12.6Dimensions of the I/O Interface Box (2801�N21)

4 mm(0.16 in)

5 mm(0.19 in)

4 mm (0.166 in)

76 mm(3 in)

48 mm(1.88 in)

13 mm(0.5 in)

24 mm(0.94 in)

86 mm(3.38 in)

21 mm(0.81 in)

17020




12-9

Figure 12.7Dimensions of the I/O Interface Box (2801�N27)

83 mm(3.28 in)

5 mm(0.19 in)

86 mm(3.38in)

76 mm(3.0 in)

16 mm(0.63 in)

54 mm(2.13 in)

94 mm(3.69 in)

13 mm(0.5 in)

65 mm(2.56 in)

19903


12-10

I/O BoardThe I/O board (Figure 12.8) when attached to the user interface box andI/O interface box can be mounted on a 19-inch rack. It must be mountedwithin 2 cable-meters (6.56 cable-feet) of the CVIM module.

Figure 12.8Dimensions of I/O Board (1771�JMB)

343 mm(13.5 in)

89 mm(3.5 in)

37 mm(1.44 in)

19 mm(0.75 in) Non�metallic

threaded spacer (#4�40)

Metallic standoffwith clearance for #6hardware (4 places)

2 mm(0.06 in)

16 mm (0.63 in)Ref. Comp. Ht.

368 mm(14.47 in)

356 mm(14 in)

6 mm(0.25 in)

76 mm(3 in)

6 mm(0.25 in)

17092




12-11

Rack Mount Color MonitorThe rack mount color monitor is 19-inch rack mountable and must bemounted within 508 cable-mm (20 cable-inches) of the user interface box.See the Vision Color Monitor Installation Manual (2801-800) for more information.

Figure 12.9Dimensions of the Rack Mount Color Monitor (2801�N8)

448 mm(17.62 in)

464 mm(18.25 in)

19 mm(0.75 in)

483 mm(19 in)

465 mm(18.31 in)

19 mm(0.75 in)

310 mm(12.22 in)

9 mm(0.34 in)

57 mm(2.25 in)

89 mm(3.5 in)

38 mm(1.5 in)

89 mm(3.5 in)

(8) Mtg. holes plus (10) studsand cutout used for panel Mtg.(Mtg. with #10 hardware).

(8) Mtg. are used forstandard 19 inch(482 mm) rack Mtg.#10 hardware

18520


12-12

Black and White MonitorThe black and white monitor comes in two sizes — a 12-inch and a 9-inchmonitor (Figure 12.10 and Figure 12.11). You can mount this monitor onslides and place it in a 19-inch rack or you can mount it in on a shelf ortable. The monitor must be mounted within 504 cable-mm (20 cable-inches) of the user interface box.

Figure 12.10Dimensions of 12" Black and White Monitor (2801�N6)

Front view Rear view

Allow 343 mm (13.5 in) depth231 mm(9.1 in)

304 mm(11.9 in)

284 mm(11.2 in)

17083

Figure 12.11Dimensions of 9" Black and White Monitor (2801�N9)

17084

Front view Rear view

165 mm(6.5 in)

220 mm(8.66 in)

Allow 254 mm (10 in) depth

220 mm(8.66 in)




12-13

CamerasThe cameras (Figure 12.12 through Figure 12.14) can be mounted on abracket that you supply and enclosed in an optional enclosure (2801-E1) tohelp protect it. Each camera can be mounted the following cable distancesfrom the CVIM module:

For cameras 2801�YB, �YD: For camera 2801�YC:

5m (16.40 ft) 2801�NC 5 5m (16.40 ft) 2801�NC 14

10m (32.80 ft) 2801�NC 6 10m (32.80 ft) 2801�NC 15

25m (82.02 ft) 2801�NC 7 25m (82.02 ft) 2801�NC 16

You have to determine and indicate where you want the camera placed and how it should it mounted.

Figure 12.12Dimensions of Camera (2801�YB)

Front view Side view

154.4 mm(6.1 in)

37 mm(1.46 in)

43.2 mm(1.7 in)

19117

Figure 12.13Dimensions of Camera (2801�YC)

50.3 mm(1.98 in)

Dust cap

129.5 mm(5.10 in)

54.6 mm(2.15 in)60.2 mm

(2.37 in)

17082


12-14

Figure 12.14Dimensions of Camera (2801�YD)

Front view Side view

39 mm(1.54 in)

73 mm(3.08 in)

60.1 mm(2.56 in)

45.9 mm(1.81 in)

6.9 mm(0.27 in)

19118

Figure 12.15Dimensions of Camera (2801�YE)

32 mm(1.26 in)

Front viewSide view

148 mm(5.83 in)

130 mm(5.12 in)

52 mm(2.06 in)

16 mm(0.63 in)

21 mm(0.83 in)

42 mm(1.65 in)

19900

I/O Racks and Power SuppliesI/O racks and power supplies (Figure 12.16 and Figure 12.17) are rack andpanel-mountable. The figures below show the dimensions and minimumspacing requirements for:

4, 8, 12, and 16 slot I/O chassis 4, 8, 12, and16 slot I/O chassis with power supplies.




12-15

Figure 12.16Mounting Dimensions of 1771�A3B 12�slot I/O Chassis with Power Supply

Use .25" dia.mounting bolts

(4 places)

Clearance depth is 221mm (8.7")

293mm(11.53")

315mm(12.41")

115mm(4.53")

Depth is 183mm (7.2")

A 1771�PS7 power supply cannot be mounted on theside of the 1771�A3B I/O chassis. See the installationdata for the 1771�PS7 power supply for moreinformation on mounting the supply to the I/O chassis.

1 cable-foot

Front

12452�I

46mm(1.8")

339mm(13.53")

465mm(18.31")

484mm(19")

9mm(.34")

26mm(1.02")

178mm(7.01")

130mm(5.10")


12-16

Figure 12.171771�A1B, �A2B, �A3B1 and �A4B Mounting Dimensions with a Power Supply

315mm(12.41")

610mm(24.01")

16-slot 1771-A4B483mm(19.01") 12-slot 1771-A3B1

356mm(14.01")229mm

(9.01")

8-slot 1771-A2B

4-slot 1771-A1B

254mm(10")

12-slot

8-slot

4-slot

16-slot

1771�P11771�P21771�P7

1771�PS7Power Supply

Use .25" diamounting bolts

(4 places)

12451�I

91mm(3.6")

591mm(23.25") 464mm

(18.25")337mm(13.25") 210mm

(8.25")

Clearance depth is 204 mm (8 in) for 8 I/O connection points per module.




12-17

You provide the enclosures for your system. The enclosure helps protectthe system from atmospheric contaminants such as oil, moisture, dust, andcorrosive vapors, or other harmful airborne substances.

Follow these guidelines in selecting an enclosure:

The enclosure for the PI chassis should be at least 403.2 mm(16 inches) deep.

The enclosure should be large enough to comply with the productspacing requirements around and between components.

The air flow within the enclosure should not be restricted.

Use a steel enclosure to help guard against electro-magneticinterference (emi).

If the enclosure door has a viewing window, it should be a laminatedscreen or a conductive optical substrate to block emi.

Place the enclosure in a position that lets you fully open the doors toaccess the system

Complete the mounting diagram, making sure you indicate:

the name or catalog number of each chassis rack or panel mounting spacing requirements mounting holes size screws, nuts, and washers to use space reserved for disconnect, transformer, control relays, motor starters

or other devices raceway positions and the type of wires that each contains

Figure 12.18 shows an example mounting diagram.

Choose an Enclosure

Complete Mounting Diagram


12-18

Figure 12.18Example Mounting Diagram

465 mm(18.312 in)(292 mm(11.5 in))4�slot

233 mm(9.16 in)

16445 mm(64.75 in)

1320 mm(51.93 in)

1025 mm(40.3 in)

692 mm(27.25 in)

483 mm(19 in)

359 mm(14.125 in)

268 mm(10.5 in)

Optional AC outletfor programmingterminal, etc.

Cabinet bottom

Panel203 mm(8 in min.)

Industrial disk drive

466 mm(18.33 in typ.

I/O interface box

I/O board.112�40UNF�2B1 hole required

227 mm(9.06 in)

User interface box

.138�32UNF�2B6 holes required

64 mm(2.53 in)

2470 mm(97.25 in)

.25�20UNC�2B4 holes required

Removable filter

PI 8�slot chassis

10�32UNF�2B(.25�20UNC�2B, max)4 holes required

203 mm(8 in)

232.5 mm(9.156 in)(146 mm(5.75 in))4�slot

Cabinet top

17231

343 mm(13.5 in)

165 mm(6.5 in)

Industrial disk drive

Powersupply

Fan assembly



Chapter 13

13-1

Preparing Grounding Documentation

This chapter guides you in preparing the grounding documentation that thehardware installer will use to ground the system. Read this entire chapterbefore you prepare the grounding documentation.

You will have to ground the following components, if your systemincludes them:

4-slot or 8-slot chassis industrial disk chassis 4-port distribution panel I/O board (for vision) rack mount color monitor I/O chassis and power supply rack or panel power supply

Important: The camera for use with the CVIM module is not grounded.We recommend you use the insulated mounting bracket supplied with thecamera to install it.

Chapter Objectives

What You Must Ground

Chapter 13Preparing Grounding Documentation

13-2

Follow these guidelines when designing your grounding documentation.

Should have a short ground wire from power supply connector to studon rack, with no other wire to the power supply ground connector. Usewire #14 (15 inches long).

Do not “daisy chain” grounds between components.

Do not have the installer connect more than two lugs to any bolt. Theconnection can become loose due to compression of the metal lugs.

All earth ground connections must be permanent and continuous toprovide a low-impedance path to earth ground for noise currents andfault currents.

Follow all applicable codes and standards when grounding thecomponents. An authoritative source for grounding requirements is theNational Electrical Code published by the National Fire ProtectionAssociation of Boston, Massachusetts. See article 250 of the Code forsuch data as the size and types of conductors and methods of safelygrounding electrical components.

For a component with a ground stud, use the ground stud as thegrounding point. The following components have ground studs:

4-slot chassis 8-slot chassis I/O chassis

For components without a ground stud, use a mounting bolt as thegrounding point.

Use 8 AWG copper wire minimum for the grounding-electrodeconductor to help guard against emi. The National Code specifies safetyrequirements for the grounding-electrode conductor.

Follow these Guidelines




13-3

For additional information about grounding guidelines, see:

Publication Index (Allen-Bradley publication SD499) — this lists allcurrent Allen-Bradley publications.

Application Considerations for Solid-State Controls (Allen-Bradleypublication SGI-1.1) — this is an aid to the user of solid-state controlswho has considerable familiarity with relay-type controls but may havelimited electronic experience and knowledge.

Industrial Automation Wiring and Grounding Guidelines (Allen-Bradleypublication 1770-4.1) — this publication gives you general guidelinesfor installing an A-B industrial-automation system.

National Electrical Code (ANSI/NFPA 70) — Article 250 of this codeprovides information about the types and sizes of conductors andmethods for safely grounding electrical equipment and components.

IEEE Recommended Practice for Grounding of Industrial andCommercial Power Systems (ANSI C114.1 - 1973)

Grounding for the Control of EMI (by Hugh W. Denny — publisher,Don White Consultants Inc., 1973)

Electromagnetic Interference and Compatibility, Volume 3 (by R.J.White — publisher, Don White Consultants, Inc., 1981)

Military Handbook 419, “Grounding, Bonding, and Shielding forElectronic Equipment and Facilities”

IEEE Guide for the Installation of Electrical Equipment to MinimizeElectrical Noise Inputs to Controllers from External Sources (IEEE Std 518-1982)

The hardware installer will use your grounding documentation to groundthe system by following these steps:

1. The installer will make equipment-grounding conductors consistingof stranded copper wire with ring lugs on each end.

The power supply ground wire only has a lug at one end.

2. Connect one end of the equipment-grounding conductor to a groundstud or mounting point on the component.

3. Run the other end of equipment-grounding conductor to the groundbus and connect it.

If You Need MoreGrounding Information

What the HardwareInstaller Will Do


13-4

4. Connect one equipment-grounding conductor from the ground bus tothe rack or panel.

5. Connect a grounding-electrode conductor from the ground bus to thegrounding electrode system.

Make sure all grounding points are marked on yourgrounding documentation.

Complete the grounding documentation. Make sure you indicate:

which points to ground what gauge wire to use the approximate lengths of each ground cable assembly

Figure 13.1 shows an example grounding diagram.

Figure 13.1Example Grounding Diagram

Area reserved for disconnect,transformer, control relays,motor starters or otheruser devices.

36"

5110 - FAN8

GroundingStud 5110 - A8

Equip.Gnd.

1771 - P716 - slot chassis

GroundStud

24"

8 AWG

Ground Bus

GroundingElectrodeSystem

6"

16910

14 AWG

15"

Complete the GroundingDocumentation



Chapter 14

14-1

Preparing ac Wiring Documentation

This chapter guides you in preparing the ac wiring documentation that thehardware installer will use to wire ac power to the system.

You should have determined what type of transformer you are going to use.

The raceway layout of a system is reflective of where the different types ofI/O modules are placed in I/O chassis. Therefore, you should determineI/O-module placement prior to any layout and routing of wires. However,when planning your I/O-module placement, segregate the modules basedupon the conductor categories published for each I/O module so that youcan follow these guidelines. These guidelines coincide with the guidelinesfor “the installation of electrical equipment to minimize electrical noiseinputs to controllers from external sources” in IEEE standard 518-1982.

Categorize Conductors

Segregate all wires and cables into the following three categories(Table 14.A). See the publication for each specific I/O module forindividual conductor-category classification of each I/O line.

Chapter Objectives

What You Have Completed

Raceway LayoutConsiderations

Chapter 14Preparing ac Wiring Documentation

14-2

Table 14.AFollow these Guidelines for Grouping Conductors

Group conductor cables fitting this description:Into thiscategory: Examples:

control & ac power high�power conductors that aremore tolerant of electrical noise than category 2conductors and may also cause more noise to bepicked up by adjacent conductors

• corresponds to NEC article�725 class 1

• corresponds to IEEE levels 3 (low susceptibility) & 4 (power)

category 1 • ac power lines.

• high�power digital ac I/O lines to connect ac I/Omodules rated for high power and high noise immunity

• high�power digital dc I/O lines to connect dc I/Omodules rated for high power or with input circuits with longtime�constant filters for high noise rejection. They typicallyconnect devices such as hard�contact switches, relays, andsolenoids.

signal & communication low�power conductors thatare less tolerant of electrical noise than category�1conductors and should also cause less noise to bepicked up by adjacent conductors (they connect tosensors and actuators relatively close to the I/Omodules)

• corresponds to NEC article�725 classes 2 & 3

• corresponds to IEEE levels 1 (high susceptibility) & 2 (medium susceptibility)

category 2 • analog I/O lines and dc power lines for analog circuits

• low�power digital ac/dc I/O lines to connect to I/Omodules that are rated for low power such as low�powercontact�output modules

• low�power digital dc I/O lines to connect to dc I/Omodules that are rated for low power and have input circuitswith short time�constant filters to detect short pulses. Theytypically connect to devices such as proximity switches,photo�electric sensors, TTL devices, and encoders

• communication cables (remote I/O, extended�local I/O, DH+,DH�485, RS�232�C, RS�422, RS�423 cables) to connectbetween processors or to I/O adapter modules,programming terminals, computers, or data terminals

intra�enclosure interconnect the systemcomponents within an enclosure

• corresponds to NEC article�725 classes 1, 2 & 3

• corresponds to IEEE levels 1 (high susceptibility) & 2 (medium susceptibility)

category 3 • low�voltage dc power cables provide backplane powerto the system components

• communication cables to connect between systemcomponents within the same enclosure

Remote I/O and DH+ cables must be made of catalog number 1770�CD cable or a cable from the approved�vendor list. DH�485 cables must be made of a cable from theapproved�vendor list.

Route Conductors

To guard against coupling noise from one conductor to another, followthese general guidelines (Table 14.B) when routing wires and cables (bothinside and outside of an enclosure). Where we state that cables must be inseparate raceways, they can be routed in the same ladder or trough ifbarriers are used as required and defined by NEC to provide the separationspecified in Table 14.B. Use the spacing given in these general guidelineswith the following exceptions:

where connection points (for conductors of different categories) on enddevice are closer together than the specified spacing

application-specific configurations for which the spacing is described ina publication for that specific applicationAllen-Bradley Automation



14-3

Table 14.BFollow these Guidelines for Routing Cables

Route this categoryof conductor cables: According to these guidelines:

category 1 These conductors can be routed with machine power conductors of up to 600V ac (feeding up to 100 hp devices) if this doesnot violate local codes.

category 2 General guidelines these guidelines apply in all cases.

• If it must cross power feed lines, it should do so at right angles.

• Route at least 5 ft from high�voltage enclosures, or sources of rf/microwave radiation.

• If the conductor is in a metal wireway or conduit, each segment of that wireway or conduit must be bonded to eachadjacent segment so that it has electrical continuity along its entire length, and must be bonded to the enclosure at theentry point.

For Unrestricted Applications these guidelines apply unless you can meet the restricted�application guidelines.

• Properly shield (where applicable) and route in a raceway separate from category�1 conductors. They can be routed inthe same ladder or trough with category�1 conductors if barriers are used as required by NEC to provide the separationspecified in the following items.

• If in a contiguous metallic wireway or conduit, route at least 0.08m (3 in) from category�1 conductors of less than 20A;0.15m (6 in) from ac power lines of 20A or more, but only up to 100 kVA; 0.3m (1 ft) from ac power lines of greater than100 kVA.

• If not in a contiguous metallic wireway or conduit, route at least 0.15m (6 in) from category�1 conductors of less than20A; 0.3m (1 ft) from ac power lines of 20A or more, but only up to 100 kVA; 0.6m (2 ft) from ac power lines of greater than100 kVA.

For Restricted Applications remote�I/O, DH+, and DH�485 cables can be bundled together with category�1 conductorsin a molded composite cable if the application can meet these guidelines.

• All category�2 conductors must be bundled together inside a common grounded 95% braided shield to separate them fromthe category�1 conductors in the larger bundle.

• Category�1 conductors must carry no more than 15A maximum at 120V maximum to power�supply loads, I/O�circuitnon�inductive loads, or I/O�circuit inductive loads that are not switched by hard contacts.

• The total cable length of the remote�I/O, DH+, or DH�485 link must be limited to 456 meters (1,500 feet) maximum.

category 3 Route conductors external to all raceways in the enclosure or in a raceway separate from any category�1 conductors with thesame spacing listed for category�2 conductors, where possible.

Article 300�3 of the National Electrical Code requires that all conductors (ac and/or dc) in the same raceway must be insulated for the highest voltage applied to any one of the conductors in the raceway.

Important: These guidelines assume that you follow thesurge-suppression guidelines (page 14-14). While these guidelines applyto the majority of installations, certain electrically harsh environments mayrequire additional precautions.


14-4

The use of the guidelines in Table 14.B are illustrated in Figure 14.1.

Figure 14.1Mounting Assembly Details

Category�2Conductors

Enclosure Wall

12618�I

I/O Block

TransformerUse greater spacing withoutconduit

Tighter spacing allowed with conduit

Tighter spacing allowed where forced by spacingof connection points

Place modules to comply with spacingguidelines if possible

Category�1Conductors(ac Power Lines)

Category�2Conductors

Conduit

1771 I/O Chassis

Conduit




14-5

If you have the following components in your system, prepare ac wireconnections for them.

Component: Catalog number:

standard power supply 5120�P1/B

480 Mbyte industrial disk 5710�ID6, �ID7

159 Mbyte industrial disk 5730�ID3

fan assembly 5110�FAN8

I/O power supply see Table 14.C

You should also plan connections for a master control relay andtransformer. The following sections describe ac power connections for the above components.

Your system should include the following:

master control relay, and emergency stops transformers

To distribute the power, connect:

the power supplies directly to the secondary of a transformer(Figure 14.2 and Figure 14.3). The transformer provides dc isolationfrom other equipment not connected to the transformer secondary.

the transformer primary to the ac source the high side of the transformer secondary to the L1 terminal of the

power supply the low side of the transformer secondary to the neutral (common)

terminal of the power supply

Connect one input directly to the L1 side of the line, on the load side of theCRM contacts, to detect whether the CRM contacts are closed. In theladder logic, use this input to hold off all outputs anytime the CRMcontacts are open (refer to your programming manual). If you fail to dothis, closing the CRM contacts could generate transient emi becauseoutputs are already turned on. To have outputs turned on when CRMcontacts are closing would be analogous to squeezing the trigger on a handtool as you’re plugging it in.

These connections should be shown in your ac wiring diagrams.Figure 14.2 shows a grounded ac power distribution system. Figure 14.3shows an ungrounded ac power distribution system.

Prepare ac WiringDocumentation

Power Distribution


14-6

Figure 14.2Grounded ac Power Distribution System with Master Control Relay

PI, industrial�disk,fan�assembly, and/orI/O chassis power supply

Enclosure

+ -

Wall

Back�panel Step�downTransformer

2

FUSE

Multiple E�stop switches Start

CRM

Grounded Conductor

Connectwhen applicable

Grounding�electrodeConductor toGrounding�electrodeSystem

Equipment�GroundingConductors

To DC I/Oactuators/

CRM

User DCSupply

Output ModuleWiring Arm

InputModuleWiringArm

InputSensor

CRM

L1 N or L2

GND

CRM

sensors

X1 X2

1FUL1

2FUL2

3FUL3

L1

L2

L3

To MotorIncoming

Disc.

StartersAC

H1

H2H3

H4

Ground Bus

The I/O circuits form a net inductive load switched by theCRM contacts. Therefore, asuppressor is neededacross the line at the loadside of the CRM contacts.

Suppressor1

Suppressor1

Suppressor3

1 To minimize emi generation, connect a suppressor across an inductive load. For suppressors to use, see Figure 14.6 and Table 14.D or the Electrocube catalog.

2 In many applications, a second transformer provides power to the input circuits and power supplies for isolation from the output circuits.

3 Connect a suppressor here to minimize emi generation from the net inductive load switched by the CRM contacts. In some installations, a 1�f

220� suppressor (Allen�Bradley 700�N5) or a 2�f 100� suppressor (Electrocube PN RG1676�7) has been effective. For suppressors to use, refer toFigure 14.6 and Table 14.D or the Electrocube catalog.

19241

OutputActuator




14-7

Figure 14.3Ungrounded ac Power Distribution System with Master Control Relay

PI, industrial�disk,fan�assembly, and/orI/O chassis power supply

1 To minimize emi generation, connect a suppressor across an inductive load. For suppressors to use, see Figure 14.6 and Table 14.D or theElectrocube catalog.

2 In many applications, a second transformer provides power to the input circuits and power supplies for isolation from the output circuits.

3 Connect a suppressor here to minimize emi generation from the net inductive load switched by the CRM contacts. In some installations, a 1�f220� suppressor (Allen�Bradley 700�N5) or a 2�f 100� suppressor (Electrocube PN RG1676�7) has been effective. For suppressors to use,see Figure 14.6 and Table 14.D or the Electrocube catalog.

+ -

InputSensor

InputModuleWiringArm

Output ModuleWiring Arm To DC I/O

actuators/

CRM

User DCSupply

Connectwhen applicable

Grounding�electrodeConductor toGrounding�electrodeSystem

EnclosureWall

Back�panelGround Bus

FUSE FUSE

Equipment�GroundingConductors

Multiple E�stop switches Start

CRM

CRM

GND

L1 N or L2

CRM

19240

sensors

CRM

X1 X2

1LT 2LT

Step�downTransformer

2

1FUL1

2FUL2

3FUL3

L1

L2

L3

To MotorIncoming

Disc.

StartersAC

H1

H2H3

H4

The I/O circuits form a net inductive load switched by theCRM contacts. Therefore, asuppressor is neededacross the line at the loadside of the CRM contacts.

Suppressor3

Suppressor1

Suppressor1

OutputActuator


14-8

PI Power Supply

The power supply connects to:

the devices you want disabled by the interlock relay line voltage

You can use the interlock relay contacts for alarm signal generation ormachine system shutdown. The interlock relay is de-energized when:

the power is switched off the system is in program mode a major fault exists a module pass/fail red light is on a critical fault has occurred the outputs are off (the system is not in run mode)

The line voltage connection connects the PI chassis to ac power.

The power supply has connectors that the installer wires and then plugsinto the the power supply. Use the specifications in the table and graphbelow when planning ac wiring.

Item: Specifications:

operating Voltage 120 or 220V ac (switch selectable)

frequency 47 - 63 Hz

input Voltage Range 85 - 132V ac170 - 264V ac

isolation 1.5 KV rms minimum

relay Connection 240V ac @ 1 A maximum

Back�planePowerLoad(Watts)

50

100

150

200

250

0 100 200 300 40050

100

150

200

250

0 100 200 300 400 50050

100

150

200

250

0 200 400 600 800

Real Power (Watts) Apparent Power (VA) Transformer Sizing (VA)




14-9

Use the tables below to diagram the power supply’s interlock relay andline-voltage connections

Interlock Relay Wiring

This terminal: Provides this connection to the relay contacts:

1 N/O

2 Common

3 N/C

Line Voltage Wiring

Wire this terminal: To the:

EQUIP/GND* chassis (see Figure 13.1)

L2/N low side of the transformer (see Figure 14.2)

L1 high side of the transformer (see Figure 14.2)

Industrial Disk (5730�ID3, 5710�ID4, �ID5, �ID6, and �ID7)

The industrial disk is connected to ac power. Use the specifications in thetable below when planning ac wiring.

Item: 5730�ID3: 5710�ID4: 5710�ID5: 5710�ID6: 5710�ID7:

real Power (max) 600 W 525 W 525 W 525 W 525 W

apparent Power (max) 850 W 775 W 775 W 775 W 775 W

transformer Size (max) 1500 W 1320 W 1320 W 1320 W 1320 W

operating Voltage 100/115 or 230 Vac (switch selectable)

frequency 47 -63 Hz

input Voltage Range 90 - 132, 180 - 264V ac rms

Use the table below to diagram the disk’s ac connections.

Wire the terminal labeled: To:

1 L1

2 L2/Neutral

3 ground bus 1

1 This connection is not necessary if you ground the chassis.

1

2

3


14-10

Fan Chassis

The fan chassis connects to ac power. Use the specifications in the tablebelow when planning ac wiring:

Item: Specification:

real power (max) 24 W

apparent power (max) 39 VA

transformer size (max) 60 VA

operating voltage 110/120 or 220V

frequency ac @ 47 - 63Hz

input line voltage range 90 - 132, 180 - 264V ac rms

Use the table below to diagram the fan chassis’ ac connections. Operatingvoltage is switch-selectable.


GND ground

L2/N L2/Neutral

L1 L1

I/O Power Supply

There are two types of power supplies for I/O:

external power supplies, which do not fit into an I/O chassis internal power supplies, which fit into an I/O chassis

Use the tables below to complete your ac wiring diagrams for eachpower supply.

For External Power Supplies


L1 L1

L2 L2/Neutral

GND ground bus 1

1 On the 1771�P7 and 1771�PS7 power supplies, this connection isnecessary even if you ground the chassis.




14-11

For Power�Supply Modules


L1 L1

N L2/Neutral

GND ground bus

Table 14.CPowering a Remote I/O Chassis (containing a 1771�AS or �ASB) or anExtended�Local Chassis (containing a 1771�ALX)

PowerSupply

Input Power

Output Current (in Amps)

Output Current (in amps) When Parallel With: Power SupplyLocationSupply Power (in Amps)

P3 P4 P4S P4S1 P5 P6S P6S1Location

1771�P3 120V ac 3 6 11 11 chassis, 1�slot

1771�P4 120V ac 8 11 16 16 chassis, 2�slot

1771�P4S 120V ac 8 11 16 16 chassis, 1�slot

1771�P4S1 100V ac 8 16 chassis, 1�slot

1771�P4R 120V ac 8/16/24 1 chassis, 1�slot

1771�P5 24V dc 8 16 chassis, 2�slot

1771�P6S 220V ac 8 16 chassis, 1�slot

1771�P6S1 200V ac 8 16 chassis, 1�slot

1771�P6R 220V ac 8/16/24 1 chassis, 1�slot

1771�P1 120/220V ac 6.5 external2

1771�P2 120/220V ac 6.5 external2

1771�P7 120/220V ac 16 external2

1771�P10 3 125V dc 8 chassis, 2�slot

1771�PS7 120/220V ac 16 external2

1777�P2 120/220V ac 9 external2

1777�P4 24V dc 9 external2

1 See publication 1771�2.136 for more information.

2 You cannot use an external power supply and a slot�based power�supply module to power the same chassis; they are not compatible.

3 You can parallel a 1771�P10 with another 1771�P10 to provide an output current of 16 AMPS.


14-12

Complete the ac wiring documentation. Make sure you indicate:

the connections labels for each wire connection to power supply connection to disk drive (159 Mbyte, 209 Mbyte, 418 Mbyte, or 480

Mbyte), if your system has a disk drive connection to transformer connection to master control relay

Under�Voltage Shutdown

Each power supply with under-voltage shut-down protection generates ashut-down signal on the backplane when the ac line voltage drops below itslower voltage limit. The power supply removes the shut-down signalwhen the line voltage comes back above the lower voltage limit. Thisshut-down is to guard against invalid data being stored in memory.

Because a capacitive-input power supply converting ac to dc draws poweronly from the peak of the ac voltage wave-form, the external transformerload (in VA) of each power supply is 2.5 times its real power dissipation(in Watts). If the transformer is too small, the peaks of the sine wave areclipped. Even if the voltage is still above the lower voltage limit, thepower supply senses the clipped wave as low voltage and sends theshut-down signal.

Sizing the Transformer

To determine the required rating of the transformer, add theexternal-transformer load of the power supply and all other powerrequirements (input circuits, output circuits). The power requirementsmust take into consideration the surge currents of devices controlled by theprocessor. Choose a transformer with the closest standard transformerrating above the calculated requirements.

For example, the external-transformer rating of a 1771-P4S power-supplymodule at maximum backplane load current is 140VA (2.5 x 56W = 140).A 140VA transformer could be used if a 1771-P4S power-supply modulewere the only load. A 500VA transformer should be used if there were360VA of load in addition to that of the 1771-P4S power-supply module.

Second Transformer

Allen-Bradley power supplies have circuits that suppress electromagneticinterference from other equipment. However, isolate output circuits frompower supplies and input circuits to help prevent output transients frombeing induced into inputs and power supplies. In many applications,power is provided to the input circuits and power supplies through asecond transformer (Figure 14.4).

Complete ac WiringDocumentation




14-13

Isolation TransformerFor applications near excessive electrical noise generators, an isolationtransformer (for the second transformer) provides further suppression ofelectromagnetic interference from other equipment. The output actuatorsbeing controlled should draw power from the same ac source as theisolation transformer, but not from the secondary of the isolationtransformer (Figure 14.4).

Figure 14.4Power Supplies and Input Circuits Receiving Power through aSeparate Transformer

Isolation/Constant�VoltageTransformer

To power suppliesand input circuits

To output circuits

19242

1FUL1

2FUL2

3FUL3

L1

L2

L3

To MotorIncoming

Disc.

Step�down

Starters

Transformer

AC

H1

H2H3

H4

X2X1

H1

H2H3

H4

X2X1

1 To minimize transient emi generation when power is interrupted by the interruptswitch, connect a suppressor across the primary of the transformer. See Figure 14.6and Table 14.D for suppressors to use.

Suppressor1

Constant-Voltage TransformerIn applications where the ac power source is especially “soft” and subjectto unusual variations, a constant-voltage transformer can stabilize the acpower source to the processor and minimize shutdowns. Theconstant-voltage transformer must be of the harmonic neutralizing type.


14-14

If the power supply receives its ac power through a constant-voltagetransformer, the input sensors connected to the I/O chassis should alsoreceive their ac power from the same constant-voltage transformer. If theinputs receive their ac power through another transformer, the ac sourcevoltage could go low enough that erroneous input data enters memorywhile the constant-voltage transformer prevents the power supply fromshutting down the processor. The output actuators being controlled shoulddraw power form the same ac sources as the constant-voltage transformer,but not from the secondary of the constant-voltage transformer(see Figure 14.4).

Ground Connection

When bringing ac power into the enclosure, do not ground its raceway tothe ground bus on the back-panel. Connecting the raceway to the groundbus may introduce fault currents that cause the processor to fault. SeeArticle 250-21 of the National Electrical Code for recommended methodsof reducing the objectionable ground current.

When ac power is supplied as a separately derived system through anisolation/step-down transformer, you can connect it as a grounded acsystem or an ungrounded ac system.

For: Connect one side of:

a grounded ac system the transformer secondary to the ground bus as in Figure 14.2.

an ungrounded ac system each test switch for the ground�fault�detector lights to theground bus as in Figure 14.3.

We do not recommend an ungrounded system. Follow the NationalElectrical Code and local codes in determining whether to use agrounded system.

Transient emi can be generated whenever inductive loads such as relays,solenoids, motor starters, or motors are operated by “hard contacts” such aspushbutton or selector switches. The wiring guidelines are based on theassumption that you guard your system against the effects of transient emiby using surge-suppressors to suppress transient emi at its source.Inductive loads switched by solid-state output devices alone do not requiresurge-suppression. However, inductive loads of ac output modules that arein series or parallel with hard contacts require surge-suppression to protectthe module output circuits as well as to suppress transient emi.

Surge�Suppression




14-15

Figure 14.5 shows 3 examples of where to use suppressors. In example 1,although the motor-starter coil is an inductive load, it does not need asuppressor because it is switched by a solid-state device alone. Inexample 2, the relay coil needs a suppressor because a hard-contact switchis in series with the solid-state switch. However, in both examples 1 and 2,we show a suppressor on the motor and solenoid because it is an inductiveload switched by the hard contacts of the motor starter or relay. Even ifthey have no interaction with the control system, regularly cycledloads of this type need suppression if conductors connecting to theseloads are: 1) connected to the same separately derived system as thatof the control system; 2) or routed in proximity with conductors of thecontrol system as per the routing guidelines.

In example 3, the pilot light has a built-in step-down transformer that needsa suppressor because it is an inductive load being switched by the hardcontacts of a contact output module; without suppression, the transient emiwould be generated inside the I/O chassis. Lights with built-in step-downtransformers that are switched by hard contacts external to any I/O chassismay not need to be suppressed because the noise spike they can generatemay be only approximately one tenth that of a relay or motor starter.

In all cases, the ac power coming into the I/O modules must be switchedby the CRM contacts. Therefore, a suppressor is needed across the line atthe load side of the CRM contacts as shown in Figure 14.2 andFigure 14.3.


14-16

Figure 14.5Examples of where to use Suppression

12597�I

ac output module

solid�state

L1 L2

1MS

L1

switch

1MS1M

suppressor

L2

Although the motor starter is aninductive load, it does not need asuppressor because it is switchedby a solid�state device.

The motor needs supressorsbecause it is an inductive loadswitched by hard contacts.

ac output module

solid�state

L1 L2

1CR

switch

suppressor

The interposing relay needs asupressor because it is an inductiveload switched by hard contacts.

contact output module L1 L2

suppressor

The pilot light needs asupressor because it is aninductive load switched by hardcontacts.

Example 1: An ac output modulecontrols a motor starterwhose contacts control themotor.

Example 2: An ac output modulecontrols an interposingrelay, but the circuit can beopened by hard contacts.The relay contacts controla solenoid.

Example 3: A contact output modulecontrols an inductive load.

L1

1CR1S

suppressor

L2

The solenoid needs a supressorbecause it is an inductive loadswitched by hard contacts.

pilot light with built�instep�down transformer

suppressor

supp

ress

or

1MS

1MSL1

Figure 14.6 shows typical suppression circuitry for different types of loads.Allen-Bradley bulletin 700 relays and bulletin 509 and bulletin 709 motorstarters have surge-suppressors for their coils available as an option.Table 14.D lists some Allen-Bradley products and their suppressors. Seethe Allen-Bradley Industrial Control Catalog for more information onsuppressors including Bulletin 1492 surge-suppressor terminal blocks.




14-17

Figure 14.6Typical Suppression Applications

+ -

230/460V ac120V ac

Cat. No. 700�N24

3�PhaseMotor

120/240V acV dc

700�Nx

12057

Electrocube 1676�13

For 3�phase apparatus, a suppressor is needed across each phaseFor small apparatus (realays, solenoids, and motorstarters up to size 1)

Cat. No. 599�K04 or 599�KA04or ITW Paktron 104M06QC100

For large apparatus (contacts up to size 5) For dc relays

Table 14.DAllen�Bradley Suppressors

Allen�Bradley Equipment Coil Voltage Allen�Bradley Suppressor

Bulletin 509 motor starter 120V ac 599�K04

240V ac 599�KA04

Bulletin 100 contactor 120V ac 199�FSMA1 1

240V ac 199�FSMA2 1

Bulletin 709 motor starter 120V ac 1401�N10 1

Bulletin 700 type R or RM relays ac coil None required

Bulletin 700 type R relay 12V dc 700�N22

24V dc 700�N10

48V dc 700�N16

115 - 125V dc 700�N11

230 - 250V dc 700�N12

Bulletin 700 type RM relay 12V dc 700�N28

24V dc 700�N113

48V dc 700�N17

115 - 125V dc 700�N14

230 - 250V dc 700�N15

Bulletin 700 type N, P, or PK relays 150V max ac or dc 700�N5 or 700�N24 1

Miscellaneous electromagnetic deviceslimited of 35 sealed VA,1 Not recommended for use with 1746 and 1747 triac outputs, because they could cause damage to triacs. For suppression of1746 and 1747 triac outputs, use varistors instead.


14-18

Surge-suppressors are usually most effective when connected at theinductive loads. They are still usable when connected at the switchingdevices; however, this may be less effective because the wires connectingthe switching devices to the inductive loads act as antennas that radiateemi. You can see the effectiveness of a particular suppressor by using anoscilloscope to observe the voltage wave form on the line.

Ferrite beads can provide additional suppression of transient emi.Fair-Rite Products Corporation manufactures a ferrite bead(part number 2643626502) which can be slipped over category-2 and -3conductors. You can secure them with heat-shrink tubing or tie-wraps.With a ferrite bead located near the end of a cable (or cable segment in thecase of a daisy-chain or dropline configuration) transient emi induced ontothe cable can be suppressed by the bead before it enters the equipmentconnected to the end of the cable.

Fluorescent lamps are also sources of emi. If you must use fluorescentlamps inside an enclosure, the following precautions may help guardagainst emi problems from this source as shown in Figure 14.7:

install a shielding grid over the lamp use shielded cable between the lamp and its switch use a metal-encased switch install a filter between the switch and the power line, or shield the

power-line cable

Figure 14.7Installation Requirements for Suppressing Noise from FluorescentLamps Inside an Enclosure

12619�I

Filter

Shielding�grid over lamp

Shieldedcable

Metel�encased switch

Line�filter or shieldedpower line

ac power

Ferrite Beads

Enclosure Lighting




14-19

Unintentional turn-on of outputs as the power source is connected ordisconnected, even if momentary, can result in injury to personnel as wellas damage to equipment. The danger is greater with fast-responseactuators. You can help minimize the probability of unintentionalmomentary turn-on of ac and dc circuits by following each of theseguidelines according to your specific application:

follow the surge-suppression guidelines in this publication

follow the bonding and grounding guidelines in this publication

do not unnecessarily disconnect the power source from output circuits

where possible, turn off all outputs before using CRM contacts tointerrupt the output circuit power source

hold off all outputs anytime the CRM contacts are open to be certainthat they are off as power is reconnected

Even if unintentional momentary turn-on does occur, the effects can beminimized if:

actuators have a home position, i.e. defined by a spring return

for latching actuators, in the ladder logic, use non-retentive energize(OTE) instructions with hold-in (seal-in) paths to maintain theestablished position until power turn-off and leave outputs off initially atpower turn-on

each input or other load device connected to an output has an input-filtertime constant no lower than necessary for the application

After designing and installing your system following these guidelines tominimize unintentional momentary turn-on and any effects thereof, test thesystem by de-energizing and re-energizing the CRM relay (Figure 14.2 andFigure 14.3).

Avoiding UnintentionalMomentary Turn�on ofOutputs

Appendix

A

A�1

PLC�5/250 Instruction Execution Times andMemory Requirements

For the address column the following abbreviations are used:

abbreviation: description:

local address is in the logic processor where the ladder logic is stored

global address is in the RM

I/O address is in the RS

N integer values used in the calculation

F floating�point values used in the calculation

Instruction: Address(es): Execution time in µs: Comments: Memory words:

TRUE FALSE

AFI Local 0.40 - 1

BRK Local 2.20 2.40 11

BSL Local, N 40.57 15.00 50

BSR Local, N 43.07 15.30 50

BTR Scanner 20.9 22.9 These times are the times for the processor to actupon the instruction, not the total time to complete ablock transfer or message.

48

BTW Scanner 20.9 22.9 These times are the times for the processor to actupon the instruction, not the total time to complete ablock transfer or message.

48

CMP Local, N 4.34 7.03 word > word 34

Local, N 4.47 8.53 word < word 34

Local, N 4.21 9.53 word = word 34

Local, N 4.21 9.53 word = word 34

Local, N 4.21 9.53 word > word 34

Local, N 5.21 9.53 word < word 34

CPT Local, N 2.05 0.55 move constant to word 4*

Local, F 3.23 0.55 move constant to word 4*

Local N 2.47 0.55 move word to word 4*

Local, F 3.31 0.55 move word to word 4*



Appendix APLC�5/250 Instruction Execution Timesand Memory Requirements

A�2

Instruction: Memory words:Comments:Execution time in µs:Address(es):

FALSETRUE

CPT Local, N 9.81 0.55 word + const --> word 4*

Local, N 10.44 0.55 word + word --> word "

Local, F 56.70 0.55 word + const --> word "

Local, F 51.84 0.55 word + word --> word "

CPT Local, N 9.54 0.55 word - const --> word 4*

Local, N 10.14 0.55 word - word --> word "

Local, F 55.30 0.55 word - const --> word "

Local, F 60.07 0.55 word - word --> word "

Local, N 13.03 0.55 word * word --> word 4*

Local, F 54.81 0.55 word * word --> word "

Local, N 20.11 0.55 word / word --> word "

Local, F 54.43 0.55 word / word --> word "

Local, N 1996.31 0.55 word **3 --> word "

Local, N 15.23 0.55 word mod 5 --> word "

CPT Local, N 9.96 0.55 word and word --> word 4*

Local, N 9.76 0.55 word or word --> word "

Local, N 9.20 0.55 word not word --> word "

Local, N 10.56 0.55 word x or word --> word "

CPT Local, N 8.97 0.55 word >> 3 --> word 4*

Local, N 9.54 0.55 word << 3 --> word "

CPT Local, N 19.77 0.55 FLT word --> F 4*

Local, F 35.47 0.55 INT word --> N "

CPT Local, F 57.80 0.55 RAD (word) --> word 4*

Local, N 106.71 0.55 RAD (word) --> word "

Local, F 59.30 0.55 DEG (word) --> word "

Local, N 109.47 0.55 DEG (word) --> word "

CPT Local, N 51.67 0.55 TOBCD (word) --> word 4*

Local, F 82.61 0.55 TOBCD (word) --> word "

Local, N 32.87 0.55 FRBCD (word) --> word "

Local, F 69.07 0.55 FRBCD (word) --> word "

CPT Local, F 9.03 0.55 ABF (word) --> word 4*

Local, F 9.43 0.55 IEF (word) --> word "

PLC�5/250 Instruction Execution TimesAppendix A

and Memory Requirements

A�3


FALSETRUE

CPT Local, N 13.37 0.55 ABS (word) -->word 4*

Local, F 7.73 0.55 ABS (word) --> word "

Local, N 14.11 0.55 SGN (word) --> word "

Local, F 24.97 0.55 SGN (word) --> word "

Local, N 2005.74 0.55 SQR (word) --> word "

Local, F 1946.80 0.55 SQR (word) --> word "

CPT Local, F 45.17 0.55 RND (word) --> word 4*

Local, F 44.34 0.55 TRN (word) --> word "

Local, F 131.90 0.55 RAN --> word "

Local, F 59.63 0.55 RAS (word) --> word "

CPT Local, N 33.67 0.55 MIN (word 1...word 5) --> word 4*

Local, F 194.00 0.55 MIN (word 1...word 5) --> word "

Local, N 34.17 0.55 MAX (word 1...word 5) --> word "

Local, F 184.50 0.55 MAX (word1...word 5) --> word "

CPT Local, N 939.37 0.55 LOG (word) --> word 4*

Local, F 891.23 0.55 LOG (word) --> word "

Local, N 882.77 0.55 LN (word) --> word "

Local, F 826.96 0.55 LN (word) --> word "

Local, N 1023.14 0.55 EXP (word) --> word "

Local, F 977.80 0.55 EXP (word) --> word "

CPT Local, F 3.46 0.55 PI --> word 4*

CPT Local, F 1180.96 0.55 SIN (word) --> word 4*

Local, F 1157.66 0.55 COS (word) --> word "

Local, F 2296.50 0.55 TAN (word) --> word "

Local, F 1013.46 0.55 ATN (word) --> word "

Local, F 1105.96 0.55 ATN2 (word) --> word "

CTD Local 10.93 15.90 16

CTU Local 10.50 15.70 16

Global 17.43 23.20 16

DDT See next row 22.6 110

DDT True Execution Time = (55 + .16 x) + m (21 + 16.3y) Where:

x = number of bits being comparedm = 0 if no mismatchesm = 1 if any mismatchesy = number of mismatchesAllen-Bradley Automation



A�4


FALSETRUE

FAL-Move Local, N 60 + 28n 30.0 n = number of words operated on per file per scan 62 *

Local, F 60 + 28n 30.0 n = number of words operated on per file per scan 62 *

FAL - Add Local, N 60 + 40.2n 30.0 n = number of words operated on per file per scan 62 *

Local, F 60 + 78.5n 30.0 n = number of words operated on per file per scan 62 *

FAL - Sub Local, N 60 + 40.2n 30.0 n = number of words operated on per file per scan 62 *


FAL - Mult Local, N 60 + 42.5n 30.0 n = number of words operated on per file per scan 62 *


FAL - Div Local, N 60 + 50n 30.0 n = number of words operated on per file per scan 62*

Local, F 60 + 83n 30.0 n = number of words operated on per file per scan 62*

FAL - **3 Local, N 60 + 111.9n 30.0 n = number of words operated on per file per scan 62*

FAL - mod 3 Local, N 60 + 39.8n 30.0 n = number of words operated on per file per scan 62*

FAL - And Local, N 60 + 39.8n 30.0 n = number of words operated on per file per scan 62*

- Or Local, N 60 + 39.8n 30.0 n = number of words operated on per file per scan 62*

- X Or Local, N 60 + 39.8n 30.0 n = number of words operated on per file per scan 62*

- Not Local, N 60 + 33.8n 30.0 n = number of words operated on per file per scan 62*

FAL - >> Local, N 60 + 33.8n 30.0 n = number of words operated on per file per scan 62*

- << Local, N 60 + 33.8n 30.0 n = number of words operated on per file per scan 62*

FAL - SQR Local, N 60 + 2005n 30.0 n = number of words operated on per file per scan 62*

- SQR Local, F 60 + 1940.2n 30.0 n = number of words operated on per file per scan 62*

FAL - TOBCD Local, N 60 + 70.3n 30.0 n = number of words operated on per file per scan 62*

Local, F 60 + 104.1n 30.0 n = number of words operated on per file per scan 62*

FAL - FRBCD Local, N 60 + 57.0n 30.0 n = number of words operated on per file per scan 62*


FAL - RAD Local, N 60 + 131.3n 30.0 n = number of words operated on per file per scan 62*


- DEG Local, N 60 + 131.3n 30.0 n = number of words operated on per file per scan 62*


FAL - ABS Local, N 60 + 37.9n 30.0 n = number of words operated on per file per scan 62*


FAL - SGN Local, N 60 + 38.5n 30.0 n = number of words operated on per file per scan 62*


FAL - RND Local, F 60 + 71.8n 30.0 n = number of words operated on per file per scan 62*

- TRN Local, F 60 + 68.5n 30.0 n = number of words operated on per file per scan 62*



A�5


FALSETRUE

FAL - LOG Local, F 60 + 890.8n 30.0 n = number of words operated on per file per scan 62*

- LN Local, F 60 + 837.9n 30.0 n = number of words operated on per file per scan 62*

- EXP Local, F 60 + 980.3n 30.0 n = number of words operated on per file per scan 62*

FAL - SIN Local, F 60 + 1074.9n 30.0 n = number of words operated on per file per scan 62*

- COS Local, F 60 + 1011.6n 30.0 n = number of words operated on per file per scan 62*

- ATN Local, F 60 + 1015.1n 30.0 n = number of words operated on per file per scan 62*

- ATN2 Local, F 60 + 1016.4n 30.0 n = number of words operated on per file per scan 62*

FBC See next row 22.6 110

FBC True Execution Time = (55 + .16 x) + m (21 + 8.7y) Where:

x = number of bits being comparedm = 0 if no mismatchesm = 1 if any mismatchesy = number of mismatches

FFL Local, N 15.30 17.60 54

FFU Local, N 15.87 17.73 55

FOR Local 41.20 1.0 If using label 1 - 127 56

If using label 128 - 1022 58

FSC - ANY Local, N 60 + 30.3 N 30.0 " 51*

Local, F 60 + 62.1 N 30.0 " 51*

GSB Local 30.91 1.25 If using label 1 -127 15


GTF Local 12.36 16.40 16

Global 20.36 24.70 16

GTN Local 23.21 15.33 Timebase 1.0 19

Local 19.97 15.33 Timebase 0.01 19

Local 18.27 15.33 Timebase scan 19

Global 32.51 22.23 Timebase 1.0 19

IIN I/O 12.27 18

Sync I/O 10.95 18

JMP Local 14.25 1.0 If using label 1 -127 15


JSR Local 70.78 1.0 If using file 0 -127 *39 1

If using file 128 - 999 *41 1

JSR/RET Local 73.63 1.0 0 parameters

JSR/RET Local 103.60 1.0 1 parameter Allen-Bradley Automation



A�6


FALSETRUE

LBL Local 0.50 - Two words for each label used. One word for each label unused. If youuse a label, you generate labels for that number and all numbers belowit. For example, if you use label 4 on a rung, you automatically create 1thru 4; if you do not use labels 1 thru 3, you use up a total of 5 words ofmemory.

LFL Local, N 14.97 17.60 54

LFU Local, N 16.27 19.13 55

MCR Local 0.7 1.33 1

MSG Scanner 12.9 14.9 These times are the times for the processor to actupon the instruction, not the total time to complete ablock transfer or message.

16

NOP Local 0.47 - 1

OSF Local 11.93 16.30 26

OSR Local 11.75 16.30 26

OTE Local 1.50 1.50 2

I/O 1.80 1.80 1

IS 2.10 2.10 1

Sync I/O 1.50 1.50 1

OTL Local 2.03 0.40 2

I/O 2.65 0.40 1

IS 2.90 0.40 1

Sync I/O 2.31 0.10 1

OTU Local 2.03 0.40 2

I/O 2.65 0.40 1

IS 2.90 0.40 1

Sync I/O 2.31 0.10 1

PID Local, N 1400.0 40.0 43

Local, F 1400.0 40.0 43

RES Local 8.80 0.63 17

Global 11.31 0.73 17

RET Local 8.30 1.0 23 --> 2

RTO Local 19.61 14.93 Timebase 1.0 19

Local 16.54 14.93 Timebase 0.01 19



SBR Local 5.45 - 16 --> 3



A�7


FALSETRUE

SQI Local, N 29.10 29.50 56

SQL Local, N 29.38 14.10 54

SQO Local, N 33.35 14.23 61

TOF Local 19.54 22.53 Timebase 1.0 19

Local 17.51 22.53 Timebase 0.01 19



TON Local 18.67 12.33 Timebase 1.0 19

Local 15.27 12.33 Timebase 0.01 19



TND Local 1.0 1.0 13

WIL Local 37.20 1.0 *40

XIC Local 1.28 0.50 2

IS 2.03 1.20 1

XIO Local 1.28 0.50 2

IS 2.03 1.20 1

*minimum amount of memory for the instruction.1 If you pass input parameters, you use an additional 2 words for overhead + 10 words for each parameter. If you pass return parameters, you use an additional 2 words for overhead + 8 words for each parameter.2 If you pass parameters, you use an additional 2 words for overhead + 10 words for each parameter.3 If you pass parameters, you use an additional 2 words for overhead + 8 words for each parameter.



AppendixB

B-1

I/O Modules Use of Data Table

See Table B.A when you are planning your I/O module placements andaddressing density.

Table B.AI/O Modules Use of Data Table

Cat. No. Input�Image Bits Output�Image Bits Read�Block Words Write�Block Words

1771�IA 8

1771�IA2 8

1771�IAD 16

1771�IB 8

1771�IBD 16

1771�IBN 32

1771�IC 8

1771�ICD 16

1771�ID 8

1771�IG 8

1771�IGD 16

1771�IH 8

1771�IM 8

1771�IMD 16

1771�IN 8

1771�IND 16

1771�IQ 8

1771�IT 8

1771�IV 8

1771�IVN 32

1771�OA 8

1771�OAD 16

1771�OB 8

1771�OBD 16

1771�OBN 32

1771�OC 8

1771�OD 8

Appendix Objectives

Appendix BI/O Modules Use of Data Table

B-2

Table B.A (continued)



1771�ODZ 8

1771�OG 8

1771�OGD 16

1771�OM 8

1771�OMD 16

1771�ON 8

1771�OND 16

1771�OP 8

1771�OQ 8

1771�OR 8

1771�OVN 32

1771�OW 8

1771�OX 8

1771�OYZ 8

1771�OZL 8

1771�IE 8 8 8

1771�IF 8 8 64

1771�E1 slave

1771�E2 slave

1771�E3 slave

1771�IFE 8 8 20 37

1771�IL 8 8 12 19

1771�IXE 8 8 12 27

1771�IR 8 8 8 14

1771�OF 8 8 1 60

1771�E4 slave

1771�DA 8 8 1-64 1-64

1771�DB 8 8 1-64 1-64

1771�DC 8 8 9 9

1771�OFE 8 8 5 13

1771�DE 8 8 2 20

1771�DL 8

1771�DR 8 8 10 64

1771�DS 8 8

1771�DW 8 8

1771�IJ, �IK 16 16Allen-Bradley Automation


Appendix BI/O Modules Use of Data Table

B-3

Table B.A (continued)



1771�M1**8 8 8 20 284

1771�OJ slave

1771�M3** 8 8 14 267

1771�ES slave

1771�QB*** 16 16 26 85

1771�QD 16 16 26 85

1771�IS 8 8 1-7

1771�PD* 8 8 18 25

1771�SN 8 8 24 24

1771�HS 32 32 64 64

1771�HSA 32 32 64 64

1771�HSAR 32 32 64 64

* 2 expanded loops** 3 axes, 1 moveset per axis*** 2 axes, one setpoint per axis

WorksheetsPyramid Integrator Design Manual

1

Worksheet 2.1Vision Application Questionnaire

Make one copy of this worksheet for each vision processor module.

Category Questions Responses

APPLICATIONCircle the application that most closelymatches yours.

Recognition

The system compares the image of the object to stored data and determines whether there is a match.The system outputs an appropriate identity code or a no�match code.

Location

The system locates a feature in X and Y, and may also acquire some angular information. If converted todelta�position format, this information can be used by an appropriate controller for guidance.

Gauging

The system locates a specified feature and measures it within 0.1% F.O.V. Possible measurementsinclude length and distance. Measurements can be further processed by a MicroVAX InformationProcessor module, PLC�5/250 controller, other computer, or PLC controller.

Inspection

The system compares the image of the object to stored data about that object and makes agood�part/bad�part decision.

Object Extraction

The system isolates features of a particular size. A go/no go decision can be made on the quantitypresent.

OBJECT(S) TO BE INSPECTED Will different objects be inspected? Yes No

What type of operation? Batch Continuous

What size is the largest object? H W D

What size is the smallest object? H W D

Answer the following questions for each object tobe inspected.

What is the name of the object?

What color is the object?

What material is the object made of?

What is the surface texture of the object? Smooth, polished Smooth, matte

Fine Medium Coarse

Grained Rough

What is the size of the object? H W D




2

Category ResponsesQuestions

POSITIONING How many parts per minute will move past thecamera?

What will be the distance between parts?

Is the object ever stationary? Yes No

If the object is continuously moving, what is itsspeed?

Will the object vary in horizontal or verticalpositioning under the camera?

Yes No

Horizontal variation =

Vertical variation =

Will the object vary in distance from the camera? Yes No

If yes, by how much?

Will the object ever be rotated? Yes No

If yes, by how much (deg)?

INSPECTION REQUIREMENTS How many features must be examined?

What size is the largest feature, includingtolerances?

H W D

What size is the smallest feature, includingtolerances?

H W D

What is the smallest change you need to detect(resolution)?

Are manufacturing or QA requirements ordocuments available?

Yes No

EVALUATION AND TESTING When will good and bad samples of objects beavailable for testing the system?

Are part drawings available?


3

Worksheet 2.1 (continued)Vision Application Questionnaire


COMMUNICATIONS What data will be passed to and from each of the following, and under what conditions?

PLC�5/250 controller:

MicroVAX Information Processor module:

Ethernet Interface module:

OSI interface module:

KA module:

RS�232 port on CVIM module:

Node adapter port on CVIM module:

INSTALLATION CONSTRAINTS Will any objects obstruct mounting of the cameraor lights?

Yes No

If yes, specify:

Will light shields be needed? Yes No

Can a strobe light be used? Yes No

Will the camera be more than 75 cable�feet fromthe CVIM module?

Yes NoAllen-Bradley Automation



4


ENVIRONMENT FOR CAMERAS AND LIGHTS What will be the ambient temperature?

What will be the humidity?

Will the camera need a NEMA enclosure? Yes No

If yes, what type?

Will the lights need a NEMA enclosure? Yes No

If yes, what type?

Will the camera or lights be exposed to shock orvibration?

Yes No

ENVIRONMENT FOR THE CVIM MODULE What will be the ambient temperature?

What will be the humidity?

Will the CVIM module need a NEMA enclosure? Yes No

If yes, what type?

Will the CVIM module be exposed to shock orvibration?

Yes No

Will a regulated power source be used? Yes No

MONITORING EQUIPMENT REQUIRED Circle the types of monitoring equipment required Monitors

Data displays or readouts

Warning lights

Alarms

Others (list)

What to Do Next: Give this questionnaire to a vision specialist and consult with that person to design your vision application.


5

Worksheet 2.2CVIM Information for Hardware Installer

Make one copy of this worksheet for each vision processor module.

Light Pen

B/WMonitor

ColorMonitor

Use credit card typememory to storeconfiguration data.

16908

Serial/Digital I/O BoxLocation

Install this module inSlotChassisLocation

Set pushwheel to

Node Adapter PortConnect toLocation

Install Color or B/W Monitor:ColorBlack & White

RS–232 Port:Connect toLocation

User Interface Box:Location

Camera A Location

Camera B Location

I/O Board (1771–JMB): connect Points as follows:

Point 0: Trigger InputPoint 1: Trigger InputPoint 2: OutputPoint 3: OutputPoint 4: OutputPoint 5: OutputPoint 6: OutputPoint 7: Output

Point 8: OutputPoint 9: OutputPoint 10: OutputPoint 11: OutputPoint 12: OutputPoint 13: OutputPoint 14: OutputPoint 15: Output

What to Do Next: Give this worksheet to the hardware installation team.Allen-Bradley Automation



6


7

Worksheet 2.3CVIM Hardware

Make one copy of this worksheet.

Fill out the following table to record the quantities of CVIM hardware components you require. Use this worksheetwhen completing Worksheet 11.1.

Item Specify Number Required perChassis

List SparesRequired

TOTALREQUIRED

A B C D E F G H

CVIM module (4 max. per chassis)

camera (2 max. per CVIM module)

2801�YB

2801�YC

2801�YD

1771�JMB user I/O module (1 max. per CVIM)

user interface box (1 max. per CVIM)

I/O interface box (1 max. per CVIM)

color monitors

black & white monitors

Important: Some CVIM hardware items are bundled under system and kit catalog numbers. See the Control, Communication and Information Product Guide (ICCG-1.1) for catalog number information.




8


9

Worksheet 3.1Identify Chassis Locations

Make one copy of this worksheet for each area of your plant in which I/O points must be tied to thePI system.

1. For each area, start with one chassis location. Add additional locations according to the following table.

If an area has: Then list a separate location for each:

I/O on different power disconnects power disconnect

I/O on different ac phases ac phase

both high voltage and low voltage I/O points type of I/O

I/O you want to separate logically orfunctionally

logical or functional group

2. List the results of step 1 in the Locations column below and add up the results.

Category: Locations:

start with one location for the area 1

add additional locations required for I/O points with :

different power disconnects

different ac phases

high and low voltage I/O points

different logical or functional groupings

TOTAL LOCATIONS FOR THIS AREA =

What to Do Next: Use Worksheet 3.2 to list I/O points for each location. Prepare a sketch of your plant thatshows the locations of PI systems and associated I/O chassis.




10


11

Worksheet 3.2List I/O and Select Modules

Make one copy of this worksheet for each chassis location identified on Worksheet 3.1.

1. For this chassis location, list each discrete digital and analog I/O and its electrical characteristics in the table onthe next page. Use the table below to determine which characteristics to list.

If the I/O is: Then list:

digital discrete input VoltageSpecial requirements: - Isolation - Proximity switch - Source or sink - Fast response - TTL

digital discrete output VoltageCurrentSpecial requirements: - Isolation - Protection (detection of failed triacs) - TTL - High current switching

analog discrete input Voltage or current rangeResolution requiredSingle�ended or differentialSpecial requirements - Thermocouple - RTD - Isolation

analog discrete output Voltage or current rangeResolution requiredSpecial requirements: - PID - Isolation

2. List I/O for intelligent I/O modules. See the Allen-Bradley Automation Products Catalog (AP 100) for a list ofspecial purpose modules available.

What to Do Next: Use Worksheet 3.3 to determine how many of each I/O module you need.




12

Input oroutput

I/O devicename

TimecriticalYes / No

Voltage orrange

Current orrange

Requiredresolution

Single�endedordifferential

Specialrequirements

I/O modulecatalognumber


13

Worksheet 3.3Tally I/O Modules

Make enough copies of this worksheet to record all modules for each chassis location.

1. In column A, list each module identified on Worksheet 3.2. Make separate entries for time-critical I/O points.2. In column B, tally the number of I/O points for which the module was selected on Worksheet 3.2.3. In column C, enter the number of spare points desired for the module.4. In column D, enter the number of I/O points each module of the type listed in column A can accommodate.5. In column E, enter the number of modules required. This is the sum of columns B and C divided by column D,

rounded up to the next whole number.

AModule Cat. No.(from Worksheet 3.2)

TimeCritical(yes/no)

BTally I/O from Worksheet 3.2

CSpare I/O Desired

DI/O per Module

EModulesRequired[(B+C)/D]

What to Do Next: Use Worksheet 3.4 to list all required I/O modules.




14

AModule Cat. No.(from Worksheet 3.2)

TimeCritical(yes/no)

BTally I/O from Worksheet 3.2

CSpare I/O Desired

DI/O per Module

EModulesRequired[(B+C)/D]


15

Worksheet 3.4List All I/O Modules

Make as many copies of this worksheet as required.

From Worksheet 3.3, list each module type and the total required at each location. Enter the grand total in thespace provided.

Module Cat. No. ____________________ Grand Total Required ________________

Locations and quantity for each:







What to Do Next: Use Worksheet 4.1 to help assign I/O modules to I/O chassis.Allen-Bradley Automation



16


17

Worksheet 3.5Selecting Power Supplies

Make one copy of this worksheet for each I/O chassis.

1. Record the module in each slot of the chassis in column A.2. Find the backplane current requirement for each module and enter the value in column B.3. Add the entries in column B. Use the total and table B on the next page

to select a power supply for the chassis. Record the result at the bottom of the next page.

Slot AModule

BBackplane current requirement

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

TOTAL BACKPLANE CURRENT REQUIRED:




18

If Backplane Current Requirement Is: Select This Power Supply: And One of These Cables:

9 - 16 A 1771�P7 1771�CP1 (1 ft) or 1771�CP2 (5 ft)

8 - 16 A two 1771�PS4, �PS6, �PS4A, or �PS6A in parallel

0 to 8 A 1771�PS4, �PS6, �PS4A, �PS6A

Important: Because they occupy slots in the I/O chassis, those chassis that contain 1771�PS4, �PS6, �PS4A, or �PS6A power supplies can have one or twoless I/O modules.

TOTAL BACKPLANE CURRENT = ____________________________

POWER SUPPLY SELECTED _________________________________

CABLE SELECTED _________________________________

What to Do Next: List all required I/O hardware on Worksheet 3.8. Use Worksheet 3.7 to record I/O addresses.


19

Worksheet 3.6Assign Rack and Group Numbers

Make one copy of this worksheet for each I/O channel.

1. For each chassis on the channel, assign rack numbers and group numbers. Record your assignments in thetable on the next page. Assign rack numbers in the order chassis are connected to the RS. Within each rack,assign group numbers 0 – 7.

2. For each chassis listed, specify how to set the last state switch. You can set this switch so that outputs arede-energized when the system enters fault mode, or so that they are left in the states they are found in when thesystem enters fault mode.

3. For each chassis listed, specify whether an adapter fault should be treated as a minor fault or as a major fault.A fault routine can be executed only if the fault is configured as major. See chapter 9 for more information about fault handling for the PI system.

RS2 pushwheel setting: Allowed rack numbers:

1 00 - 07

2 10 - 17

3 20 - 27

4 30 - 37



I/O racks addressed(in octal)

1�1 1 00 � 07

1�2 1, 2 00 � 17

1�3 1, 2, 3 00 � 27

1�4 1, 2, 3, 4 00 � 37

2�2 2 10 � 17

2�3 2, 3 10 � 27

2�4 2, 3, 4 10 � 37

3�3 3 20 � 27

3�4 3, 4 20 � 37

4�4 4 30 � 37




20

If addressingmethod is:

Assign racknumbers

Assign groupnumbers

2�Slot 1 per 16 slots 1 per 2 slots

1�Slot 1 per 8 slots 1 per slot

1/2�Slot 1 per 4 slots 2 per slot

What to Do Next: Give copies of this worksheet to the hardware installer, the PLC-5/250 programmer, andthe start-up and integration team. Use Worksheet 3.7 to record I/O addresses.

Chassis Racknumber

Groupnumber

Last stateswitch(last stateor de�en�ergize)

Adapterfault(major orminor)

Chassis Racknumber

Groupnumber

Last stateswitch(last stateor de�en�ergize)

Adapterfault(major orminor)

1 17

2 18

3 19

4 20

5 21

6 22

7 23

8 24

9 25

10 26

11 27

12 28

13 29

14 30

15 31

16 32


21

Worksheet 3.7I/O Addresses

Make sufficient copies of this worksheet to cover all I/O points.

In the table on the next page, enter the elements of each I/O address, according to the following rules.

Rules for I/O Image Addressing

For each I/O image address, specify:

I for Input or O for Output I/O rack number (00 – 37 octal) — You can assign only those rack numbers allowed

for the remote scanners you have installed. I/O group number (0 – 7) — Refer to the section titled Addressing Methods above. terminal number (0 – 7, 10 – 17)

Use the following format:

I:123/15

I for Input or O for Output

2�digit I/O rack number

I/O group number (0 - 7)

terminal number (0 - 7, 10 - 17)

Use these required : and/ delimiters

for RS logical scanner 1, use 00 � 07for RS logical scanner 2, use 10 � 17for RS logical scanner 3, use 21 � 27for RS logical scanner 4, use 31 � 37

What to Do Next: Provide this information to the PLC Programmer, start-up and integration team, and the hardware installer.




22

Input or Output I/O rack number I/O group number I/O terminal number Symbolic name Device


23

Worksheet 3.8I/O Hardware

Make one copy of this worksheet for each PI.

For each item in the table on the next page, enter the number required, the number of spares desired, and the total.

To determine the required number of: Do this:

I/O chassis See Worksheet 4.1 and Worksheet 3.7

adapter modules allocate one per I/O chassis

power supplies See Worksheet 3.5

remote scanner modules divide the number of channels by 2 and round up to the next whole number




24

Quantity

Item Catalog number Number required Number of spares Total

chassis 4�Slot 1771�A1B

8�Slot 1771�A2B

12�Slot 1771�A3B

16�Slot 1771�A4B

RS modules

I/O adapter modules Remote I/O 1771�ASB

Local I/O 1771�ALX

power supplies 1771�PS4

1771�PS6

1771�PS4A

1771�PS6A

1771�P7

cables 1771�CP1

1771�CP2

1771�CJ

1771�CK

1771�CD

1771�CE


25

Worksheet 4.1Assign I/O Modules to Remote I/O Chassis

Make one copy of this worksheet for each I/O chassis.

1. In the table on the next page, enter the module assigned to each slot of the chassis in the columnlabeled “Module.”

2. Calculate the block transfer time, if any, according to the formulas listed below.

We recommend that you use pencil for this form, or make extra copies, since you may have tore-arrange modules.

To Calculate Remote Block�Transfer Time:

If channel transmission rate is: Use this formula:

57.6k bit/s 3ms + (0.28 ms x no. of words)

115.2k bit/s 3 ms + (0.14 ms x no. of words)

230.4k bit/s 3 ms + (0.07 ms x no. of words)

Important: These formulas give only the time required for the transfer on the remoteI/O link. To compute the time involved in sending the request to the adapter or preparingfor transfer, see the section �Remote Block�Transfer Timing" in Chapter 4.

What to Do Next: Use Worksheet 4.2 to assign I/O chassis to I/O channels and calculate I/O scan time.




26

Slot Module Block�transfer time

0

1

2

3

4

5

6

7

10

11

12

13

14

15

16

17


27

Worksheet 4.2Calculate Worst Case Channel I/O Scan Time

Make one copy of this worksheet for each I/O channel.

1. In column A of the table on the next page, list each chassis on the channel.2. In column B, list the longest block transfer time for the modules in the chassis (from Worksheet 4.1).3. Add 4 ms to the time listed in column B and enter the result in column C.4. Add the values in column C. The result is total channel I/O scan time.5. If the scan time is acceptable, go on to Worksheet 3.5. If not, rearrange chassis or modules and repeat this

worksheet. See chapter 3 for more information.

What to Do Next: Use Worksheet 3.5 to select power supplies for your I/O chassis.




28

A B C (Select the appropriate column:)

Scan�list Entry Longest block�transfer time(from Worksheet 4.1)

B + 4 ms (for 230.4 kbit/s)

B + 6 ms(for 115.2 kbit/s)

B + 8 ms(for 57.6 kbit/s)

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

TOTAL WORST CASE SCAN TIME:


29

Worksheet 4.3RS Termination Resistors (RS2 only)

Pyramid Integrator Chassis____________Slot_______Make one copy of this worksheet for each RS module.

If transmission rate is and scanner is physically located then put the internal 150�Ohm termination�resistorjumper in the

57k bit/s or 115k bit/s middle of remote I/O link out position

end of remote I/O link in position

230k bit/s middle of remote I/O link out position

end of remote I/O link out position, and attach 82�Ohm termination resistorbetween pins 1 and 3

In the following table, specify whether the internal termination resistors for CH1 and CH2 are to be in or out.

Channel Termination Resistor

Channel

Channel

IN

IN

OUT

OUT

What to Do Next: Use Worksheet 4.4 to specify configuration parameters for the RS module.




30


31

Worksheet 4.4Configuration Parameters for RS

PI Chassis____________Slot_______Make one copy of this worksheet for each RS module.

For each RS module, fill out this worksheet to specify configuration parameters that are set in 6200 series software.

Configure Channel (Remote)

Parameter Description Your choice: remote channel

1 2 3 1 4 1

Data transferrate

57.6k bit/s: Choose this rate if the link is between 5,000 and 10,000 ft, and allother stations on the link communicate at this rate.

115.2k bit/s: Choose this rate if your link is between 2,500 and 5,000 ft long andall the other stations on the link communicate at this rate.

230.4k bit/s: Choose this rate if your link is less than 2,500 ft and all the otherstations on the link communicate at this rate.

Default is 57.6k bit/s

Channelmode

Toggles through I/O Scan, Direct, and Inactive modes.

I/O Scan: the module scans normally. Select this mode if you are using this portof the remote scanner to scan I/O adapters.

Direct: the port acts as an adapter on the remote I/O link. Select this mode if youare using the port to communicate with a supervisory scanner.

Inactive: the channel is not used.

Default is Inactive.

1 Applies to RS5 only.




32

Configure I/O Adapters (If Channel is in I/O Scan Mode)


1 2 3 1 4 1

I/O AdapterAddress list

Displays the I/O Adapter scan�order list. You can add or remove individual I/Oadapters from the list. You can also view the addresses added by Autoconfigure.

To add an adapter to the list, enter: RRM/i where: RR=rack number and M = I/O group

To delete an adapter from the list, enter: RRM/dwhere: RR=rack number and M = I/O group

Rack Number Rangesremote scanner 1: 00-07 octalremote scanner 2: 10-17 octalremote scanner 3: 20-27 octalremote scanner 4: 30-37 octal

To configure the length and fault mode of an adapter, type the adapter's listnumber.

See

Worksheet 3.6

See

Worksheet 3.6

See

Worksheet 3.6

See

Worksheet 3.6

ChassisLength

Switches chassis length2 = 2 I/O groups4 = 4 I/O groups6 = 6 I/O groups8 = 8 I/O groups

See

Worksheet 3.6

See

Worksheet 3.6

See

Worksheet 3.6

See

Worksheet 3.6

Fault Toggles between major and minor fault. If the adapter at this address faults, thisselection tells the system whether to declare a major or minor fault. Statusinformation is stored when the rack declares a fault.

Minor: if a minor fault occurs, a bit is set in a status table.

Major: If a major fault occurs, the resource manager continues communicatingand the remote scanner scans inputs but does not activate outputs.

Default is Minor.

See

Worksheet 3.6

See

Worksheet 3.6

See

Worksheet 3.6

See

Worksheet 3.6



33

Worksheet 4.4 (continued)Configuration Parameters for RS

Configure Direct Communication Addresses (If channel is set for Direct Communication mode)


1 2 3 1 4 1

Image Table Specify rack number and starting I/O group to designate the I/O image tableaddress that the local processor uses to communicate through this port.

AdapterAddresses

Specify the rack number and starting I/O group number that the supervisoryscanner on the link uses to address this port.

Length Switches chassis length2 = 2 I/O groups4 = 4 I/O groups6 = 6 I/O groups8 = 8 I/O groups

Fault Toggles between major and minor fault. If this scanner stops communicating, thisselection tells the supervisory scanner whether to declare a major or minor fault.Status information is stored when the rack declares a fault.


Major: If a major fault occurs, the resource manager continues communicatingand the remote scanner scans inputs but does not activate outputs.

Default is Minor.

Last Rack Toggles between Yes and No to let you specify whether this port, as adapter, hasthe highest number I/O group in the rack.

Default is No.


What to Do Next: Give a copy of this worksheet to the start-up and integration team to use in configuring the systemwith 6200 series software.




34


35

Worksheet 5.1Configuration Parameters for RS5

PI Chassis____________Slot_______Make one copy of this worksheet for each RS5 module.

For each RS5 module, fill out this worksheet to specify configuration parameters that are set in 6200 series software.

Configure I/O Adapters (If Channel is in I/O Scan Mode)

Parameter Description Local channel 1

I/O AdapterAddress list

Displays the I/O Adapter scan�order list. You can add or remove individual I/O adapters fromthe list. You can also view the addresses added by Autoconfigure.

To add an adapter to the list, enter: RRM/i where: RR=rack number and M = I/O group

To delete an adapter from the list, enter: RRM/dwhere: RR=rack number and M = I/O group

Rack Number Rangesremote scanner 1: 00-07 octalremote scanner 2: 10-17 octalremote scanner 3: 20-27 octalremote scanner 4: 30-37 octal

To configure the length and fault mode of an adapter, type the adapter's list number.

See Worksheet 3.6

Chassis Length 4�slot8�slot12�slot16�slot

SeeWorksheet 3.6

Fault Toggles between major and minor fault. If the adapter at this address faults, this selection tellsthe system whether to declare a major or minor fault. Status information is stored when therack declares a fault.


Major: If a major fault occurs, the resource manager continues communicating and theremote scanner scans inputs but does not activate outputs.

Default is Minor.

See Worksheet 3.6

What to Do Next: Give a copy of this worksheet to the start-up and integration team to use in configuring the systemwith 6200 series software.




36


37

Worksheet 6.1Logic Processors

Make one copy of this worksheet for each PI chassis.

Each PI chassis can contain up to 4 LP modules. Use the blocks on this and the next page to list the memory size andfunctions of each LP in a PI chassis.

LP #1

256K wordsFunctions: 512K words

1024K words 2048K words

Memory Size (from Worksheet 6.4)

LP #2

256K wordsFunctions: 512K words






38

LP #3

Functions: 256K words 512K words



LP #4

Functions: 256K words 512K words



What to Do Next: Give a copy of this worksheet to the PLC-5/250 programmer. Use this worksheet whencompleting Worksheet 11.1.


39

Worksheet 6.2Program Size and Execution Time

Make one copy of this worksheet for each ladder program, or for each time�critical step of your sequential function chart, or for the longest step in your sequential function chart.

Use this worksheet to estimate the size and performance of one ladder program or one step in a sequential functionchart. To evaluate the performance of a simultaneous path divergence in a sequential function chart, prepare oneworksheet for each of the steps that will be executed simultaneously and add the results of the steps that will run onone logic processor.

For each worksheet, follow these instructions:

1. Use the table on the next page, and for each category of instruction:

Estimate the quantity required and enter the number in column A. Include instructions used in SFC steps andtransitions, PII (Processor Input Interrupt), STI (Selectable Timed Interrupt), and IBP (IndependentBackground Program) routines.

Use the table in appendix A to determine a value for words per instruction based on your application. Enterthe value in column B. Multiply column A by column B to obtain an estimate of the total words of memoryrequired and enter the result in column C.

Use the table in appendix A to determine a value for instruction execution time based on your application.Enter your value in column D. Multiply column A by column D to obtain an estimate of the total executiontime and enter the result in column E.

2. Add columns C and E to obtain estimates of total program memory and execution time required.

Important: Many factors influence the number of words per instruction and, especially, execution time perinstruction. Use the table in appendix A to get an idea of the possible variation that may occur, and treat the resultsof this exercise as an approximation.




40

Instruction category AEstimated number

required

BWords perinstruction

(approximate)

CTotal words

DTime per

instruction(approximate)

ETotal execution

time(approximate)

Relay typeXIC XIO OTE OTL OTU

Timer/CounterTON TOF RTO GTN GTFCTU CTD RES

Compare/ComputeCMP CPT

Element manipulationRMW MVM MEQ LIM

FileFAL FSC

DiagnosticFBC DDT

SequencerSQI SQL SQO

Program flowMCR JMP GSB WILFOR?NEXT JSR

Process controlPID TPO

Block transferBTR BTW

MessageMSG

Approximate total words Approximate total time

What to Do Next: Use Worksheet 6.3 to estimate LP performance.


41

Worksheet 6.3Estimate LP PerformanceMake one copy of this worksheet for each LP.

Fill out the table below to estimate LP performance. In it, you will compare the time allowed for execution of the logicprocessor’s program with an estimate of the time required to execute the program.

Time requirement A

Input device delay

Input module delay

Maximum I/O scan time for input(from Worksheet 4.1)

Maximum I/O scan time for output(from Worksheet 4.1)

Output module delay

Output device delay

Total delays B

Time allowed for program scan C

Estimated program scan time(from Worksheet 6.2)

D

D < C

D > 60 to 75% of A

Consider a different architecture,such as:

distributed control orintelligent I/O

No need to addlogic processor modules

Add another LP moduleor

Consider using SFCor

Consider repeating the program segmentor

Make SFC steps smaller or restructure the SFC

Start

What to Do Next: Modify Worksheet 6.1 if results so indicate. Return to instructions in chapter 6.




42


43

Worksheet 6.4Select Memory Sizes for LP Modules and RM

Make one copy of this worksheet for each PI Chassis.

1. Estimate the number of sequential function chart (SFC) steps and transitions in your program. Multiply by 8words to determine approximate required SFC overhead (SFC overhead requirements vary depending on typeof step and other factors. Treat this value as an approximation to aid in decision making).

2. Estimate the words of memory required for program storage. See Worksheet 6.2.

3. Estimate the words of memory required for storage of data files locally on each logic processor but also inglobal memory on the resource manager module.

4. Estimate the words of memory required for future expansion.

5. Add the results of items 1 through 4. This is an approximation of the total memory requirement.

6. Use the tables on the next page to select memories for the LP and the RM. Record your results on Worksheet 6.1.

Item Number of words

LP 1 LP 2 LP 3 LP 4 RM

SFC overhead xxxxxxxxxxxx

program storage xxxxxxxxxxxx

data files

future expansion

APPROXIMATETOTAL REQUIREMENT




44

MEMORY SELECTION FOR LPs

If the total requirement Is: Then:

less than 256K words Select 5250�LP1/B

more than 256K words but less than 512K words Select 5250�LP2/B



more than 2048K words Add another LP or consider different architecture,such as distributed control or intelligent I/O, orreconsider programming strategy

Important: The maximum amount of LP memory that can be devoted to data table is 1024K words, regardlessof the LP memory size. So, if the memory required for data files is > 1024K words, add another LP.

MEMORY SELECTION FOR RM

If your requirement forglobal data storage is:

Then use this RM:

small 5130�RM1 (128K words)

large 5130�RM2 (384K words)

What to Do Next: Record your memory choices on Worksheet 6.1. Use this worksheet when filling out Worksheet 11.5.


45

Worksheet 6.5LP Information for Hardware Installer

PI Chassis____________Slot_______Make one copy of this worksheet for each LP module.

Complete the information on this worksheet and give it to the hardware installer. Attach a wiring diagram for theProcessor Interrupt Inputs.

16715

Install this module in PI chassis:

Slot:

Set the pushwheel switch to (1�4):

Device:

Location:

Device:

Location:

Device:

Location:

Device:

Location:

Connect common to:

Location:




46


47

Worksheet 6.6LP Configuration

PI Chassis____________Slot_______Make one copy of this worksheet for each LP module.

For each LP module, specify your choices for the parameters listed in the tables that follow.

Important: If you cannot specify values for these parameters, pass the worksheet to the PLC-5/250 programmer for completion.

Parameter Description Your choice

watchdog timer setpoint Enter the time limit (in ms) for 1 scan of the main program. If it takes themain program longer than the set time, the system generates a major fault .

Range: 10-32,000 ms (in 10 ms resolution). Default is 32,000 ms.

processing time Sets minimum percentage of time the processor runs the main program.

Range: 40% 50% 60% 70% 80%

When the processor is not running the main program, it is executingbackground tasks such as STIs and PIIs. The processor is also answeringcommunication requests from networks and other modules that involveaccess of this LP's data tables. If your application includes many accessesof the LP's data table by communication networks and other modules,consider decreasing your processor foreground processing time to improvecommunication and background task performance.

Default is 80%.

processing mode VARIABLE mode a percentage of time (default is 80%) is spent on ladderlogic and a percentage of time is spent performing background tasks (STIs,PIIs, etc). If there aren't that many background tasks to do and a lot of time isleft over, that extra time will be used to scan the program. Hence, you areguaranteed a maximum amount of time scanning the program with theVARIABLE mode.

FIXED mode a percentage of time is spent on ladder logic (default is80%) and a percentage of time is spent performing background tasks (STIs,PIIs, etc). If there aren't that many background tasks to perform and a lot oftime is left over, that time is lost; the extra time will not be spent on scanningthe program. When you select FIXED mode, realize that the percentage youselect is the amount of time the processor spends scanning the program.Although FIXED mode allows for consistent program scans, VARIABLEmode allows for maximum time to scan the program.

Default is VARIABLE.




48

Parameter Your choiceDescription

input mode Toggles between ASYNCHRONOUS and SYNCHRONOUS modes.

ASYNCHRONOUS: updates the output image table as the program scanprogresses.

SYNCHRONOUS: updates the input and output image table only immediately priorto each program scan.

Default is Asynchronous.

Last scan mode Toggles between LAST SCAN and POST SCAN modes to specify how the processorhandles non�retentive rung outputs during the transition between steps of asequential function chart.

Last Scan mode: executes the last scan normally and leaves all rung outputs in theirlast state.

Post Scan mode: turns off the non�retentive rung outputs by turning their rungs falseduring a post scan.

Default is Post Scan.

PII Processing Configuration Your Choice

Parameter Description PII 1 PII 2 PII 3 PII 4

Status Toggles status between ACTIVE andINACTIVE.Default is Inactive.

Priority Toggles between A and B. A = high priorityB = normal priority

Default is B.

Fault Toggles between whether a PII overlap shouldbe declared a Major or Minor fault.Default is Major.

File Number Name of filexSTEPyx = LP number range: 1 - 4y = File number range: 0 - 999

Default is 1STEP0.

PII Execution Your Choice

Parameter Description PII 1 PII 2 PII 3 PII 4

Filter Constant Sets the amount of time an input must be truebefore the PII is activated.

Range: 50 to 10000 µs in 5 µs resolution. Default is50 µs.


49

Worksheet 6.6 (continued)Logic Processor Configuration

STI Processing Configuration Your Choice (Enter STI file number)

Parameter DescriptionSTI ____ STI ____ STI ____ STI ____ STI ____ STI ____ STI ____ STI ____

Status Toggles status between ACTIVE andINACTIVE.Default is inactive.

Priority Toggles between A and B. A = high priorityB = normal priority

Default is B.

Fault Mode Toggles between whether an STI overlapshould be declared a Major or Minor fault.Default is Major.

File Number Name of filexSTEPyx = LP number range: 1 - 4y = File number range: 0 - 999

Default is 1STEP0.

Period Sets the amount of time (10-655350) in increments

of 10 µs, the Logic Processor should wait between

each run of this STI. This value should be longer

than the time it takes to for the STI to execute or

scan a program.

Range: 10 µs to 655350 ms in 10 µsresolution.Default is 10 ms.

What to Do Next: Give a copy of this worksheet to the PLC-5/250 programmer and to the start-up and integration team.




50


51

Worksheet 7.1Choosing Industrial Disks for the MicroVAX Information Processor(Cat. No. 5730�CPU1)

PI Chassis____________Slots_______Make one copy of this worksheet for each MicroVAX Information Processor module.

1. Fill in the blanks in the table below with the software you will be storing on the industrial disk. Include therequired storage capacity.

2. Add up the storage capacities required for all software you will be storing on the industrial disk, and use thetable on the next page to select the appropriate disk.

Software Disk Capacity Required

VMS System Software (includes VMS single user,DECnet VAX End Node, DECwindows, Local AreaVAXcluster); and C runtime libraries

62 Mbytes

INTERCHANGE Software 1 Mbyte

TOTAL CAPACITY REQUIRED:Allen-Bradley Automation



52

INDUSTRIAL DISK SELECTION

If total capacity required is: Then select: Checkyourchoice:

less than 159 Mbytes and allows enough room forfuture expansion and desired data storage

one industrial disk on Worksheet 7.2

more than 159 Mbytes, including room for futureexpansion and desired data storage

2 industrial disks on Worksheet 7.2

What to Do Next: Use Worksheet 7.2 to select hardware for the MicroVAX Information Processor module.


53

Worksheet 7.2Hardware for the MicroVAX Information Processor(Cat. No. 5730�CPU1)

PI Chassis____________Slot_______Make one copy of this worksheet for each MicroVAX Information Processor module.

Select hardware as described in chapter 7. Record your selections on this worksheet.

Important: Some of the items listed in the following table are bundled together as systems and kits undervarious catalog numbers. For more information about MicroVAX Information Processor systems and kits, seethe Pyramid Integrator Price Guide (5000-3.1).

HARDWARE FOR THE MicroVAX INFORMATION PROCESSOR

Item Quantity

MicroVAX Information Processor module

terminal (user supplied)

program loader, cat. no. 5710�PL/ A or 5710�PL/B (optional, one per site may be sufficient)

industrial disk drive (one or two; see Worksheet 7.1)(The first disk drive is included in MicroVAX Information Processor system and kit catalog numbers. Thesecond drive is optional and must be ordered separately.)

4�port distribution panel (included in system and kit catalog numbers)

Ethernet Transceiver Cable 2 meters

15 meters

Ethernet Transceiver thinwire

thickwire

ATTENTION: Ethernet connection must be secure while the PI system is controlling equipment; otherwise, the MicroVAX Information Processor module or the EI module may shut down the system’s power supply.




54

If the system power shuts down, follow these steps:

1. Make sure the Ethernet connection is secure.

2. Cycle power turning off the power from the power supply and then turning it back on.

What to Do Next: Return to the instructions in chapter 7.


55

Worksheet 7.3MicroVAX Information Processor (5730�CPU1)Information for the Hardware Installer

PI Chassis____________Slots_______Make one copy of this worksheet for each MicroVAX Information Processor module to be installed.

Complete the information on this worksheet by filling in the boxes. Give a copy of the worksheet to thehardware installer.

Pass/Fail

ErrorCode

ENETCHB

BackplaneProcessor

Serial

CH

B

ENET

CH

B

Hard

Disk

Loader

MicroVAXProcessor

ENETCHA

BatteryLow

Run BootConsole

SerialCHA

ENETCHA

16716

Set the keyswitch to theRUN/LOCK position

Battery

Connect Terminal?(User supplied)YES NO

Connect:

Connect:

Connect:

Install 4�PortDistributionPanel

Serial CH A

ENET CH A

50 feet maximum

Thickwire or Thinwire Ethernet

EthernetTransceiver

Install this MicroVAX InformationProcessor in PI chassis Slots & (required 2 slots)

Connect ProgramLoader?YES NO

Serial CH B

Connect Industrial Disk?YES NO 1 Disk 2 Disk

ENET CH B

ENET CH B and Serial CH B are unavailable

Install EthernetTransceiver Cable?YES No

Install Ethernet Transceiver?YES No Thinwire Thickwire

6 feet

Port 3(OPA0)

Port 2(TTA2)

Port 1(TTA1)

Port 0(TTA0)




56


57

Worksheet 7.4MicroVAX Information Processor (5730�CPU1)Information for the Software Installer

PI Chassis____________Slots_______ Make one copy of this worksheet for each MicroVAX Information Processor module to be installed.

1. Supply the following information for each MicroVAX Information Processor module:

Item Options Description Your Choice

Default Boot Device DUA0 Local disk no. 1

DUA1 Local disk no. 2

ESA0 Any remote device

MUA0 Program loader

Default Recovery Mode when system software goesdown, the MicroVAXInformation Processor:

when powering up afterlosing power, the MicroVAXInformation Processor:

1 reboots hardware andsoftware to VMS level

reboots hardware andsoftware to VMS level

2 reboots hardware and comesup in console mode



reboots hardware and comesup in console mode

Will the MicroVAX InformationProcessor be a member of aVAXcluster?

Yes or No -- --




58

2. If the MicroVAX Information Processor will be a member of a Local Area VAXcluster, fill in thefollowing table.

Item Options Your choice

Node's DECnet node name 1 - 6 alphanumeric characters. No underscores ordollar signs. Name must be unique on network.

Node's DECnet address

Will Ethernet will be used for clustercommunications?

Yes or No. Ethernet is required for cluster (SCSinternode) communications in local areas andmixed�interconnect cluster configurations.

Cluster Group Number range: 1 - 4095 or 61440 - 65535

Cluster Password 1 to 31 characters. May include underscores anddollar signs.

Will this node be a disk server? Yes or No. In local area and mixed�interconnectconfigurations, the system disk is always served tothe cluster.

Will this node serve HSC disks? -- no

This node's ALLOCLASS parameter -- 0

Does this cluster contain a quorum disk? Yes or No.


59

Worksheet 7.4 (continued)MicroVAX Information Processor (5730�CPU1)Information for the Software Installer

3. In the following table, list software to be installed. For each package, list the medium on which the softwarewill be provided and any specific installation or licensing information.

Software Package Medium Installation and License Information

VMS System Software Tape Single user system license

INTERCHANGE software Tape Single system license




60

4. To the software installer: Record the Ethernet address of the MicroVAX Information Processor when it appearsduring system start-up. See Worksheet 7.8 or the INTERCHANGE Software (BPI version) Documentation(5730-DTLD).

Ethernet Address:

What to Do Next: Give this worksheet to the software installer.


61

Worksheet 7.5Choosing Industrial Disks for the MicroVAX Information Processors EP and EE(Cat. Nos. 5731�CPU1, �CPU2)

PI Chassis____________Slots_______Make one copy of this worksheet for each MicroVAX Information Processor module.

1. Fill in the blanks in the table below with the software you will be storing on the industrial disk. Include therequired storage capacity.

2. Add up the storage capacities required for all software you will be storing on the industrial disk, and use thetable on the next page to select the appropriate disk.

Software Disk capacity required

VMS System Software (includes VMS single user,DECnet VAX End Node, DECwindows Local AreaVAXcluster); and C runtime libraries

62 Mbytes

INTERCHANGE Software 1 Mbyte

TOTAL CAPACITY REQUIRED:Allen-Bradley Automation



62

Total Capacity 5710�ID4 5710�ID5 5710�ID6 5710�ID7 Check your choice:

209 Mbyte one

418 Mbyte two 1

480 Mbyte one 3

627 Mbyte one one 2

836 Mbyte two 2

960 Mbyte one one

1 You can also use one 5710�ID5.2 You can also use one 5710�ID6 and �ID7.3 You can also use one 5710�ID7.

What to Do Next: Use Worksheet 7.6 to select hardware for the MicroVAX Information Processor modules EP and EE.


63

Worksheet 7.6Hardware for the MicroVAX InformationProcessors EP or EE(Cat. Nos. 5731�CPU1,�CPU2)

PI Chassis____________Slot_______Make one copy of this worksheet for each MicroVAX Information Processor module.

Select hardware as described in chapter 7. Record your selections on this worksheet.

Important: Some of the items listed in the following table are bundled together as systems and kits undervarious catalog numbers. For more information about MicroVAX Processor systems and kits, see the PyramidIntegrator Price Guide (5000-3.1).

HARDWARE FOR THE MicroVAX INFORMATION PROCESSOR MODULE (EP or EE)

Item Quantity

MicroVAX Information Processor Module

terminal (user supplied)

program loader, cat. no. 5710�PL/B (optional, one per site may be sufficient)

industrial disk drive (one or two; see Worksheet 7.5)(The first disk drive is included in MicroVAX Information Processor system and kit catalog numbers. Thesecond drive is optional and must be ordered separately.)Note: Each industrial disk comes with a terminator and a cable.

4�port distribution panel (included in system and kit catalog numbers)

Ethernet Transceiver Cable 2 meters

15 meters

Ethernet Transceiver thinwire

thickwire

ATTENTION: The Ethernet connection must be secure while the PI system is controlling equipment; otherwise, the MicroVAX Information Processor module or the EI module may shut down the system’s power supply.




64



2. Cycle power by turning off the power from the power supply and then turning it back on.

What to Do Next: Return to the instructions in chapter 7.


65

Worksheet 7.7MicroVAX Information Processor EP or EEInformation for the Hardware Installer

PI Chassis____________Slots_______Make one copy of this worksheet for each MicroVAX Information Processor module to be installed.

Complete the information on this worksheet by filling in the boxes. Give a copy of the worksheet to the hardware installer.

18518

Install this MicroVAX Processormodule in Pyramid IntegratorChassisSlots &(Requires 2 slots)

Connect ProgramLoader?YES NO

Battery

Connect Terminal?(User supplied)YES NO

Connect:

Connect:

Connect:

Port 3(OPA0)

Port 2(TTA2)

Port 1(TTA1)

Port 0(TTA0)

6feet

Install EthernetTransceiver Cable?YES NO

Install Ethernet Cable Tap?YES NOThinwire Thickwire

EthernetTransceiver

Thickwire or Thinwire Ethernet

50 feetmaximum

Install 4 -PortDistributionPanel

Set the keyswitch to theRUN/LOCK position

Connect Industrial Disk?YES NO1Disk 2 DiskID4 ID5




66


67

Worksheet 7.8MicroVAX Information Processor EP or EEInformation for the Software Installer

PI Chassis____________Slots_______ Make one copy of this worksheet for each MicroVAX Processor module (EP or EE) to be installed.

1. Supply the following information for each MicroVAX Information Processor module (EP or EE):

Item Options Description Your choice

Default Boot Device DKA0 Local disk no. 1

DKA100 Local disk no. 2



ESA0 Ethernet

MKB100 Program loader

Default Recovery Mode when system software goesdown, the MicroVAXInformation Processormodule:

when powering up afterlosing power, the MicroVAXInformation Processormodule:

1 reboots hardware andsoftware to VMS level





reboots hardware and comesup in console mode

Will the MicroVAX InformationProcessor module be amember of a VAXcluster?

Yes or No -- --




68

2. If the MicroVAX Processor module will be a member of a Local Area VAXcluster, fill in the following table.

Item: Options: Your choice:

Node's DECnet node name 1 - 6 alphanumeric characters. No underscores ordollar signs. Name must be unique on network.

Node's DECnet address

Will Ethernet will be used for clustercommunications?

Yes or No. Ethernet is required for cluster (SCSinternode) communications in local areas andmixed�interconnect cluster configurations.

Cluster Group Number range: 1 - 4095 or 61440 - 65535

Cluster Password 1 to 31 characters. May include underscores anddollar signs.

Will this node be a disk server? Yes or No. In local area and mixed�interconnectconfigurations, the system disk is always served tothe cluster.

Will this node serve HSC disks? -- no

This node's ALLOCLASS parameter -- 0

Does this cluster contain a quorum disk? Yes or No.


69

Worksheet 7.8 (continued)MicroVAX Information Processor EP or EEInformation for the Software Installer

3. In the following table, list software to be installed. For each package, list the medium on which the softwarewill be provided and any specific installation or licensing information.

Software package: Medium: Installation and license information:

VMS System Software Tape Single user system license

INTERCHANGE software Tape Single system license

4. To the software installer: Record the Ethernet address of the MicroVAX Processor module when it appearsduring system start-up.

Ethernet Address:

What to Do Next: Give this worksheet to the software installer.




70


71

Worksheet 8.1Setting Switches on the RM and KA module

PI Chassis__________________Make one copy of this worksheet for each resource manager module and each KA module.

1. In the left column of the table, check the desired channel and protocol for the default communication channel.

Set Switches 1 - 3 in SB1as follows:

To Select This Channeland Protocol:

Switch1

Switch2

Switch3

CH 2, DH up up down

CH 2, DH+ up down down

CH 3, DH up up up

CH 3, DH+ up down up

CH 1, Master down up up

CH 1, Slave down up down

CH 1, DF1 down down up

None (Switch Bank Inactive) down down down

2. In the left column of the table, check the desired parity for the default communication channel.

To Select This Parity: Set Switch 4 inSB1 as follows:

None up

Even down

3. In the left column of the table, check the desired error checking method for the default communication channel.

To Select This ErrorChecking Method:

Set Switch 5 inSB1 as follows:

BCC up

CRC down

toggle pushed

on (closed)

toggle pushed

off (open)

Side View

toward bottom

toward top

RM

KA module




72

4. In the second column of the table, check the desired communication rate for the defaultcommunication channel.

Set switches 6 - 8 in SB1as follows:

If the defaultcommunication channelis:

And the desiredcommunication rate is:

Switch6

Switch7

Switch8

CH 1 19.2k bit/s up up up

9600 bit/s up up down

4800 bit/s up down up

2400 bit/s up down down

1200 bit/s down up up

600 bit/s down up down

300 bit/s down down up

110 bit/s down down down

CH 2 or CH 3 115.2k bit/s down down up

57.6k bit/s down down down

5. Use SB2 to specify the station address for the resource manager module on the default communication channel. Specify a number between 000 and 376 octal. Check the digits of the station address.

Most significant digit Middle digit Least significant digit

SW1 SW2 SW3 SW4 SW5 SW6 SW7 SW8

0 up up 0 up up up 0 up up up

1 up down 1 up up down 1 up up down

2 down up 2 up down up 2 up down up

3 down down 3 up down down 3 up down down

4 down up up 4 down up up

5 down up down 5 down up down

6 down down up 6 down down up

7 down down down 7 down down down


73

Worksheet 8.2Setting Jumpers on the RM and KA Module

PI Chassis__________________Make one copy of this worksheet for each resource manager moduleand each KA module.

1. Specify whether the termination resistors for CH 2 and CH 3 should be in or out. The resistor must be in whenthe RM is the last physical device on the DH or DH+ network. Otherwise, the resistor must be out. Check yourchoice in the following table. The hardware installer will set the jumpers as indicated.

TerminationResistor

Port

CH 2

CH 3

IN

OUT

OUT

IN

CH

2

3

JMPR IN OUT

JP10

JP9

2 31

2 31 2 31

2 31

TerminationResistor

2. Specify the electrical interface for CH 1. Your choice should match the characteristics of the device beingconnected to the CH 1 port. Check your choice in the following table. The hardware installer will set thejumpers as indicated.

Interface

RS�232

RS�423

RS�422

Channel 1 Interface

Jumper

JP5 JP6 JP7 JP8

2

3

1RS�232

RS�423

RS�422

2

3

1

2

3

1

2

3

1

2

3

1

2

3

1

2

3

1

2

3

1

2

3

1

2

3

1

2

3

1

2

3

1

RM

KA module




74


75

Worksheet 8.3RM Installation

PI Chassis_____________________Make one copy of this worksheet for each RM module.

Specify connection information for the RM by filling in the boxes in the figure below. Give a copy of the completedworksheet to the hardware installer.


slot: 1

Set keylock switch toREMOTE position

Connect programming terminal: YES NO

Terminal:

Terminal:

Connect serial device: YES NO

Connect to: DH link

DH+ link

(Must be DH+ link if programming terninal isconnected to CH 2A.)

Connect to: DH link

DH+ link

16717

What to Do Next: Give this worksheet to the hardware installer.




76


77

Worksheet 8.4KA Module Installation

PI Chassis____________Slot_______Make one copy of this worksheet for each KA Module.

Specify connection information for the KA Module by filling in the boxes in the figure below. Give a copy of thecompleted worksheet to the hardware installer.

Install this module inPI chassis:Slot:

Set pushwheel to:

Connect programming terminal: YES NO

Connect serial terminal: YES NO

Connect to: DH link

DH+ link

(Must be DH+ link if programming terminal isconnected to CH 2A.)

Connect to: DH link

DH+ link17972

Terminal:

Terminal:

What to Do Next: Give this worksheet to the hardware installer.




78


79

Worksheet 8.5Information for PLC ProgrammerMake enough copies of this worksheet to specify all messages.

Fill out a line on this worksheet for each message the PLC-5/250 controller must send or receive through RM orKA module communications ports. There are additional lines on the back of this page. Give a copy of this worksheet tothe PLC programmer.

Message TPC (X if YES)

Size Priority Local/Remote

LocalLink

RemoteLink

Station ID

TPC Timed Periodic Communication feature allows you to configure your RM or KA module to periodically perform a MSG instruction. TPC allows the PIsystem to initiate periodic communication operations without ladder programming or an INTERCHANGE application. You can set up eight TPCs per RM orKA module. See continuation of Worksheet 8.5.

Size Number of elements (1 to 10,000) to write to or read from the destination.

Priority High for special cases, otherwise normal (DH only).

Local/Remote Remote if bridge to another link is required to reach the destination, otherwise local.

Local Link DH link, DH+ link, DF1, Master, Slave, or ASCII. Must be DH+ for remote mode.

Remote Link DH link or DH+ link.

Station ID The destination station. For local mode, 0 � 255 (DH) and 0 � 77 (DH+) octal. For remote mode: bridge number (0 � 255 octal for DH and 0 � 77octal for DH+), link ID number (always set to 1), station number (0 - 255 octal for DH and 0 � 77 octal for DH+). Each station must have a unique ID number.




80

Message TPC (X if YES)

Size Priority Local/Remote

LocalLink

RemoteLink

Station ID

TPC Timed Periodic Communication feature allows you to configure your RM or KA module to periodically perform a MSG instruction. TPC allows the PIsystem to initiate periodic communication operations without ladder programming or an INTERCHANGE application. You can set up eight TPCs per RM orKA module. See continuation of Worksheet 8.5.

Size Number of elements (1 to 10,000) to write to or read from the destination.

Priority High for special cases, otherwise normal (DH only).

Local/Remote Remote if bridge to another link is required to reach the destination, otherwise local.

Local Link DH link, DH+ link, DF1, Master, Slave, or ASCII. Must be DH+ for remote mode.

Remote Link DH link or DH+ link.

Station ID The destination station. For local mode, 0 � 255 (DH) and 0 � 77 (DH+) decimal. For remote mode: bridge number (0 - 255 decimal for DH linkand 0 �77 decimal for DH+ link), link ID number (always set to 1), station number (0 - 255 decimal for DH and 0 �77 for DH+). Each station must have a uniqueID number.

What to Do Next: Give this worksheet to the PLC programmer.


81

Worksheet 8.5 (continued)Information for PLC ProgrammerMake one copy of this worksheet for each RM and KA module.

Timed periodiccommunication

Active/Inactive MSG address Time unit (seconds,minutes, hours, etc.)

Repeat count (everyhour, 30 sec, etc.)

Starting time

TPC #1

TPC #2

TPC #3

TPC #4

TPC #5

TPC #6

TPC #7

TPC #8




82


83

Worksheet 8.6Parameters for CH 1

PI Chassis_____________________Make one copy of this worksheet for each RM module and each KA module.

1. For each parameter listed in the table below, write in your choice in the Your Choice column.

Parameter Description Values Default Your choice

protocol protocol used for CH 1 communication ASCII, DF1, Master,Slave, or inactive

inactive

message timeout period time resource manager waits for an answerto a message before sending an errormessage to the user program

0 - 255 sec 5 sec

diagnostic counter file system integer file, created by the user andmaintained by the resource manger, thatstores diagnostic results

0 - 9999 none

PLC�2/privilege stationAddress

PLC�2 controllers on the network andprivilege classes for each (optional). This isused to specify which data table file aspecific PLC�2 controller will use or whichprivilege class a specific PLC controller (anytype, not just PLC�2 controllers) will use onthis particular highway. Any station not listedwill use the channel defaults.

addresses: 0 - 376octalprivilege classes: 1 - 8

none

2. If you selected ASCII protocol in step 1, choose one of the options in the following table.

Parameter Description Options Your choice

ASCII Parameters default settings or configure CRT (example: Allen�Bradley IndustrialTerminal)

TTY (example: Texas Instruments Silent 700)

Modem

Configure Parameters

RM

KA module




84

The following table shows the default settings for the CRT, TTY, and modem choices.

Parameter CRT TTY MODEM

signalling speed 9600 baud 300 baud 1200 baud

parity NONE EVEN NONE

stop bits 1.5 1.5 1.5

modem FULL FULL FULL

line length 80 80 80

pad characters 0 4 0

exp tab NOT EXP NOT

form feed NOT EXP NOT

XON/XOFF EN EN EN

bits/character 8 7 8

echo ACT ACT ACT

delete mode CRT TTY CRT

RTS to transmit delay 0 0 0

termination character�1 0D 0D 0D

termination character�2 0A 0A 0A

write append character �1 0D 0D 0D

write append character �2 0A 0A 0A


85

Worksheet 8.6 (continued)Parameters for CH 1

3. If you selected Configure Parameters in step 2, circle or write in your choice for each of the parameters in thefollowing table.


signalling speed speed of communication 110, 300, 600, 1200,2400, 4800, 9600, or19200 baud

9600

parity type of parity used none, even, or odd none

stop bits number of stop bits 1, 1.5, or 2 1.5

modem full or half duplex half duplex or fullduplex

full duplex

line length maximum length of a line of characters 0 to 255 characters 80

pad characters null characters sent after each carriagereturn/line feed combination

0 to 255 0

expand tabs transmit an equivalent number of spaces foreach programmed tab character

expanded or notexpanded

not expanded

form feed transmit 7 line feed characters for eachprogrammed form feed character

expanded or not expanded

not expanded

XON/XOFF respond to XON and XOFF characters enabled or disabled enabled

bits per character number of bits in each character 7 or 8 8

echo PLC�5/250 echo active or inactive active

delete mode CRT/TTY or printer CRT

RTS to XMIT delay used for devices that immediately return aCTS upon reception of an RTS even thoughtheir transmitter may not be ready. It's thetime between sending out an RTS and theactual transmission of data

0 to 255 increments of 10ms

0

termination character 1 indicate the end of an input line when anASCII read line instruction is used

hexadecimal number 0D

termination character 2 indicate the end of an input line when anASCII read line instruction is used

hexadecimal number 0A

write append character �1 characters that are sent after all thecharacters of a string have been sent usingthe ASCII write with append instruction

hexadecimal number 0D

write append character �2 characters that are sent after all thecharacters of a string have been sent usingthe ASCII write with append instruction

hexadecimal number 0A




86

4. If you selected DF1 protocol in step 1, enter a value for each parameter in the following table.


signalling speed speed of communication 110, 300, 600, 1200,4800, 9600, or 19200baud

9600

parity type of parity used none or even none

error detection method of error detection used BCC or CRC CRC

ACK timeout time the PLC waits for an ACK beforeconsidering a fault to exist

0 - 255 increments of 10ms each

4

NAKs receive/retries number of retries if an ACK is not received 0 - 255 3

ENQs send number of times the device asks a station tore�send its last ACK or NAK

0 - 255 3

privilege class privilege class assigned to the channel 1 - 8 1

5. If you selected Slave protocol in step 1, enter a value for each parameter in the following table.


signalling speed speed of communications 110, 300, 600, 1200,4800, 9600, or 19200baud

9600





4

modem type of modem control half duplex or full duplex

full duplex



0

retries number of retries if an ACK is not received 0 - 255 3

privilege class privilege class assigned to thechannel

1 - 8 1


87


6. If you selected Master protocol in step 1, enter a value for each parameter in the following table.


station address address of the resource manager on thenetwork

0 - 376 octal 003

signalling speed speed of communication 110, 300, 600, 1200,4800, 9600, or 19200baud

9600





4

modem type of modem control half duplex or full duplex

half



0

privilege class privilege class assigned to thechannel

1 - 8 1

priority MSG reply wait time the master will wait for a reply to apriority message it sends

0 - 255 ms 10

polling mode how the master polls the slaves standard (poll slaves insequence defined by pollconfiguration) or messagebased (only masterinitiates communication;sends message, waits forreply; stops after lastreply.)

standard

master message transmit(if standard polling mode)

when messages from the master station aretransmitted

in poll sequence (themaster is included in thenormal poll configurationand sends its messages inits turn as defined by thatfile) or between stationpolls (after each station ispolled, the master sendsall of its messages)

in pollsequence

node table file(if standard polling mode)

number of system integer file that storesaddresses of active slaves

file number 0 - 9999 none




88

Parameter Your choiceDefaultValuesDescription

normal poll configuration(if standard polling mode)

Defines the sequence of station polling;includes list of station addresses (mayinclude any address multiple times) andwhether to handle only one message fromeach station per poll or all messages.

for each station: address000 - 376 octal: multipleor single message polling

none

priority poll configuration Lists stations to be given priority polling.Master polls all priority stations, then somestations in normal poll configuration, thenpriority stations, etc. Group size specifieshow many stations in normal pollconfiguration are polled between each pollof priority stations.

for each station: address000 - 376 octal; multipleor single message polling;group size 0 - 999

Priority poll configurationmay contain up to 10stations. Sum of prioritypoll stations and normalpoll stations must be nomore than 64.

none


89


7. If you selected standard polling mode in step 6, list the normal poll configuration in the following table.

Circle desired polling mode: Standard Message based

Station addresses (000 - 376 octal) Station addresses (000 - 376 octal)

8. If you selected standard polling mode in step 6, list the priority poll configuration in the following table.

Circle desired polling mode: Standard Message based

Enter desired group size (0 - 999)

Station addresses (000 - 376 octal) Station addresses (000 - 376 octal)




90


91

Worksheet 8.7Communications Parameters for CH 2 and CH 3

PI Chassis____________Make one copy of this worksheet for each RM module and each KA module.

1. Enter values in the following table for each channel.

Parameter Description Values Default Your Choicefor CH 2

Your Choicefor CH 3

Protocol Communications protocol used DH link or DH+ link DH+ link

Message Timeout Time the resource manager waits foran answer to a message beforesending an error message to the userprogram

0 - 255 sec 5 sec

Diagnostic Counter File Number of the file used to storediagnostic results.

0 - 9999 none

PLC�2/Privilege StationAddresses

PLC�2 controllers on the network andprivilege classes for each (optional).This is used to specify which datatable file a specific PLC�2 controllerwill use or which privilege class aspecific PLC controller (any type, notjust PLC�2 controllers) will use on thisparticular highway. Any station notlisted will use the channel defaults.

for each station: stationaddress 000 - 376 octal;privilege class 1 - 8

none

Station Number (DH link andDH+ link)

PLC�5/250 Station Number on thelink

0 - 376 octal 003

Baud Rate(DH+ link only)

speed of communications 57.6k or 115.2k bit/s 57.6k

Node Table File (DH+ linkonly)

Number of the system integer file thatcontains the names of other activestations on the network

0 - 9999 (must beinteger file)

none

Privilege Class (DH link andDH+ link)

Privilege class assigned to thechannel

1 - 8 1

2. You can use the table on the next page to list the station numbers of PLC-2 controllers on the network and theprivilege classes to be assigned to them.

RM

KA module




92

CH 2 CH 3

PLC�2 station number(000 - 376)

Privilege class(1 - 8)

PLC�2 station number address(000 - 376)

Privilege class(1 - 8)


93

Worksheet 8.8Privilege Classes

PI Chassis____________Make one copy of this worksheet for each RM module and each KA module.

1. Mark the boxes that indicate the privileges you want to assign to each class. Use the table on the next page to assign passwords.

Include this privilege: In these privilege classes:

1 2 3 4 5 6 7 8

Privilege modification (cannot be deleted from privilege class 1) X

Data table file Create/Delete

Program file Create/Delete

ASCII Extended Address

Logical Write (cannot be deleted from privilege class 1) X

Physical Write

Physical Read

Public Status Write

Private Status Write (cannot be deleted from privilege class 1) X

Symbol Create/Delete

Input Image Write

Output Image Write

Internal Storage Write

BT Data Write

BT Control Write

Adapter Status Write

Shared data write

Mode change

Configuration

Program Edit

I/O Force

SFC Force

Clear Fault

Clear Memory

Save/Restore/Merge

SFC Edit

RM

KA module




94

2. Use the following table to assign passwords.

Assign This User: This Password:


95

Worksheet 8.9Record File Usage

FileNumber

Usage

FileNumber

Usage

RM

LP1

LP2

LP3

LP4

B

N

L

F

ST

T

C

PD

MSG

R

S

Module

Section

Page No.

CVIM

SD




96


97

Worksheet 8.10Record Structure/Word/Bit Usage

Structure/Word Bit Usage

B

N

L

F

ST

T

C

PD

MSG

R

S

Module

Section

Page No.

File No.

RM

LP1

LP2

LP3

LP4

CVIM

SD




98

Structure/Word UsageBit


99

Worksheet 8.11Determine Number of Required KA Modules

1. Determine the number of modules required for each type of connection.

Port type Number of ports needed Multiply by Number of modules required

Serial 1

DH link (hard�wired) 1

DH+ link (hard�wired) 1

DH link .51

DH+ link .51

1If the result ends in .5, add .5 to the result.

2. Take the largest number of required modules from the Number-of-Modules-Required column and enter it on Worksheet 11.1.




100


101

Worksheet 8.12Determine Station Number for DTL Port

PI Chassis____________Make one copy of this worksheet for either the MicroVAX Information Processor module orEI module.

MicroVAX Information Processor module

EI module

If the module’s station number is already being used by another device on the DH/DH+ link, you must change one ofthe addresses.

1. Collect Worksheet 8.7 for the chassis and copy that information below.

Module Channel Protocol Station Number for PIPrimary Port on DH/DH+Link

Default MicroVAX orEthernet Interface StationNumber(Add One)

New MicroVAX orEthernet Interface StationNumber

RM 2

3

KA 2

3

KA 2

3

KA 2

3

KA 2

3

2. Use 6200 series software or the module-configuration utility of the INTERCHANGE software to configureany new MicroVAX Information Processor or EI module station number(s) listed in the last column ofthis table.




102


103

Worksheet 8.13Setting Switches on the OSI Interface Module

PI Chassis____________Slot__________Pushwheel_______Make one copy of this worksheet for each OSI interface module.

Switch: Position: Description:

1 up if there is a valid image in non�volatile memory, the OSI interface module will enter fully operationalmode after:


preceding the reset• you enter a change mode to Fully Operational from the A�B MAP Station Manager

If there is not a valid image in non�volatile memory, the OSI interface module will not enter fullyoperational mode but will enter Partially Operational mode.

down the OSI interface module will enter partially operational mode after:


preceding the reset• you enter a change mode to Partially Operational from the A�B MAP Station Manager

2 up the OSI interface module uses user defaults, if available, at power�up or reset (see the PI OSI InterfaceSoftware User's Manual for a list of user defaults). If user defaults are not available, the interface willuse the A�B communication defaults.

down the OSI interface module uses A�B communication defaults at power�up or reset.

3 up reserved


4 up reserved


Important: Keep switches 3 and 4 in the up position, otherwise; PI system stays in power�up and will not initialize.Note: Bold indicates switches set at A�B Company, Inc.




104


105

Worksheet 8.14OSI Interface Installation

PI Chassis____________Make one copy of this worksheet for each OSI interface module.

Specify connection information for the OSI interface module by filling in the boxes in the figure below. Give a copy of the completed worksheet to the hardware installer.

CarrierbandModule

BroadbandModule

18392

Install this module inPI:

Slot::

Connect A�B MAP Station Manager: YES NO

Connect to: MAP 802.4 Network

Pushwheel:

OSI Interface MAC ADDR:

See the A�B MAP Station Manager Software User's Manual (6630�6.5.2) for moreinformation on MAC addresses




106


107

Worksheet 8.15EI Installation

PI Chassis____________Make one copy of this worksheet for each EI module.

Specify connection information for the EI module by filling in the boxes in the figure below. Give a copy of thecompleted worksheet to both the hardware installer and the person installing Network INTERCHANGE software.

Internet Address (ip):

Hardware Address (ha):

(Copy the hardware address (ha) from the sticker on the top edge of the board.)

Connect to: Ethernet

EthernetInterface 18523

00�00�BC�01�__ __�__ __

PI Host Name (ni name)


slot:

See the back of this worksheet for Attention.Allen-Bradley Automation



108

Important: If you’re not using a powered transceiver, make sure the Ethernetconnection is secure before cycling power.

ATTENTION: The Ethernet connection must be secure while thePI system is controlling equipment; otherwise, the MicroVAXInformation Processor module or the EI module may shut down thesystem’s power supply.



2. Cycle power by turning off the power from the power supply and thenturning it back on.

The EI module requires the IEEE 802.3 SQE (Signal Quality Error) test (alsoknown as Ethernet heartbeat). Make sure your Ethernet transceiver is set withthe SQE test enabled. For more information about the SQE test, refer to thedocumentation that came with your transceiver.

ATTENTION: Do not use a transceiver that has a disabled SQEtest to connect an EI module to an Ethernet network because it coulddisrupt network activity.

Connecting to an EthernetNetwork


109

Worksheet 9.1Configure DH+ Routing NetworksMake one copy of this worksheet for each chassis.

Complete Worksheet 9.1 and Worksheet 9.2 before you enter configuration information into 6200 series software.Using the DH+ network design information in chapter 9, determine whether you need basic or advanced routing, andfill in the appropriate table.

Basic Routing

Link Number1 Module(Type/Pushwheel)

Port2 Local

RM CH 2 local

CH 3 local

pushwheel 1 CH 2 local

KA module CH 3 local







1 Link number must be unique; the range is 1 � 65,535.2 Each port can only have one local link.

More on back




110

Advanced Routing

Link number1 Module(Type/Pushwheel)

Port Remote Bridge Station Number

remote

remote

remote

remote

remote

remote

remote

remote

remote

remote

remote

remote

remote

remote

1 Link number must be unique; the range is 1 � 65,535.

What to Do Next: Enter DH+ routing configuration information into 6200 series software. For instructions, see thePLC-5/250 Programming Software Manual (5000-6.4.7).


111

Worksheet 9.2Remote Addressing for each DH+ Programming DevicePI Chassis________________Make one copy of this worksheet for each programming terminal.

Complete Worksheet 9.1 and Worksheet 9.2 before you enter configuration information into 6200 series software.This worksheet helps you in entering the online configuration information required to program stations on remoteDH+ links.

Terminal stationnumber

Destination station description Destinationstation number

Destination linknumber1

Bridge stationnumber

1 Link number must be unique; the range is 1 � 65,535.

What to Do Next: Enter remote addressing configuration information into the online configuration screen of the 6200series software. For instructions, see the programming software manual for the destination station.




112


113

Worksheet 10.1User�Defined Major Faults

Make 1 copy of this worksheet for each PI chassis.

List the fault condition(List the specific condition, inputs,and/or outputs the PI systemmust monitor to detect the fault.)

Should a fault routine beexecuted when thisfault occurs?(Enter yes or no. If yes, identifyspecific fault routine.)

Should a fault routine clearthis fault?(Enter yes or no.)

List fault�Defined informationto be recorded when thefault occurs




114

List the fault condition(List the specific condition, inputs,and/or outputs the PI systemmust monitor to detect the fault.)

List fault�Defined informationto be recorded when thefault occurs

Should a fault routine clearthis fault?(Enter yes or no.)

Should a fault routine beexecuted when thisfault occurs?(Enter yes or no. If yes, identifyspecific fault routine.)

What to Do Next: Give a copy of the filled out worksheet to the PLC-5/250 programmer. Use Worksheet 10.2 tospecify actions to be taken by fault routines.


115

Worksheet 10.2Specify Fault Routines


Fault routine(xIBPyyy)

In what parts ofthe logic pro�

gram should thisfault routine Be

active?(List steps or

rungs)

Set alarm?Yes or No

if yes, specifyoutput

Try to clear thefault?

Yes or Noif yes, specifyfault type(s)

Store data?(Specify)

Shut down thesystem?Yes or No

if yes, specifyactions required

Specify other actions to be taken by fault routine








116

Fault routine(xIBPyyy)

Shut down thesystem?Yes or No

if yes, specifyactions required

Store data?(Specify)

Try to clear thefault?

Yes or Noif yes, specifyfault type(s)

Set alarm?Yes or No

if yes, specifyoutput

In what parts ofthe logic pro�

gram should thisfault routine Be

active?(List steps or

rungs)







What to Do Next: Give a copy of this worksheet to the PLC-5/250 Programmer.


117

Worksheet 10.3Fault Reporting Requirements


In the following table, specify the fault-related information to be gathered about minor, major, and critical faults. Givea copy of the completed worksheet to the PLC-5/250 programmer.

For this type of fault: Gather and report this information:

Minor

Major

Critical




118


119

Worksheet 11.1Selecting a PI ChassisMake one copy of this worksheet for each chassis.

1. If your application requires a MicroVAX Information Processor module, select an 8-slot chassis and 8-slot fanassembly. Record your selections on Worksheet 11.5 and skip the rest of this worksheet.

2. If your application does not include a MicroVAX Information Processor, see the worksheet listed in column B,and record the number of modules required.

3. Multiply the entry in column C by the entry in column D and enter the result in column E.

4. Enter the number of spare slots desired for future expansion in the box at the bottom of column E.

5. Add all the entries in column E and enter the result at the bottom of the column. This is the total number of slots required.

6. Use the chart on the next page to select the chassis for your PI system. Record your selection onWorksheet 11.5.

AFor this module

BRefer to

CRecord the quantity

required

DSlots per module

ESlots required (C x D)

RM -- 1 1

LP Worksheet 6.1 1

RS Worksheet 3.8 1

CVIM module Worksheet 2.3 1

OSI carrierband interfacemodule

1

OSI broadband interfacemodule

2

EI module 1

KA module Worksheet 8.11 1

Enter the number of spare slots desired ------

TOTAL SLOTS REQUIRED (add column E)------




120

If total slots required is: Then select this chassis:

1 - 4 4�slot chassis

5 - 8 8�slot chassis

More than 8 Reconsider your configuration. Use more than onePI system or consider other ways of accomplishing

your goals.

What to Do Next: Record your selection on Worksheet 11.5, then go to Worksheet 11.2 to assign modules toslots in the chassis.


121

Worksheet 11.2Assigning Modules to Chassis SlotsPI Chassis________________Make one copy of this worksheet for each chassis.

1. Record the module assignments in column A on the back of this page.

Important: The RM module must be in slot 1. Other modules may be in any slots. A MicroVAX InformationProcessor module occupies 2 slots.

2. Record the pushwheel setting in column B.

Important: For each module type, start with pushwheel setting 1 and go up in order (1, 2, 3, etc.).

3. Give a copy of this worksheet to the hardware installer.

If the module is: Set the Pushwheel to: Notes:

RM No Pushwheel Each chassis can have only one resource manager

LP 1 - 4 Number LP modules sequentially, starting at 1. (Settings 5 - 8 are not used)

RS2 1 - 4 Number RS2 modules sequentially, starting at 1.

RS5 1 � 4 The address can be spread among the RS5 modules, or all fouraddresses may be used on one RS5.

CVIM module 1 - 4 Number CVIM modules sequentially, starting at 1.

1MicroVAX Information Processor EP No Pushwheel Each chassis can have only one MicroVAX InformationProcessor EP.

1MicroVAX Information Processor EE No Pushwheel Each chassis can have only one MicroVAX InformationProcessor EE.

1MicroVAX Information Processor No Pushwheel Each chassis can have only one MicroVAX Information Processor .

OSI carrierband interface module 1 - 3 Number OSI interface modules sequentially, starting at 1.

OSI broadband interface module 1 Number OSI interface modules sequentially, starting at 1. Eachchassis can only have one OSI broadband interface module

1EI module No Pushwheel Each chassis can only have one Ethernet Interface module.

KA module 1 - 4 Number KA modules sequentially, starting at 1.

1Note: Only one of these modules can be in an 8�slot chassis at one time.




122

Slot AModule

BPushwheel Setting

1 1 5130�RM1 or �RM2 none

2

3

4

5

6

7

8

1 Must be 5130�RM1 or �RM2.

What to Do Next: Go to Worksheet 11.3 to select a power supply.


123

Worksheet 11.3Determining Power RequirementsMake one copy of this worksheet for each chassis.

1. Enter the number of modules of each type installed in the chassis in column D.

2. Determine current draws as indicated in columns E, F, and G, and enter the results.

3. Add the entries in columns E, F, and G. This is the total current drain for the chassis.

4. Compare your totals with the totals at the bottom of this page. Record your selection on Worksheet 11.5.

Module A+5V DCCurrent

B+12V DCCurrent

C-12V DCCurrent

DNumber

ofmodules

ETotal +5V

DC Current (A x D)

FTotal +12VDC Current

(B x D)

GTotal -12VDC Current

(C x D)

4�slot chassis (5110�A4/B) 2.0 A 0 0

8�slot chassis (5110�A8/B) 2.0 A 0 0









CVIM module (5370�CVIM) 4.5 A2 0.065 A2 .075 A2

OSI carrierband interface (5820�CC) 5.0 A 0.225 A 0.05 A

OSI broadband interface (5820�CBx) 5.8 A 0.55 A 0.1 A

MicroVAX Information Processor EP(5731�CPU1)

13.1 A 0.55 A .058 A

MicroVAX Information Processor EE(5731�CPU2)

13.4 A 0.55 A .058 A

MicroVAX Information Processor(5730�CPU1)

11.2 A 0.60 A 0.1 A

EI module (5820�EI/A) 5.0 A .50 A 0

KA module (5130�KA) 2.9 A 0.07 A 0.05 A

Total Chassis Current Drains------

1 Available power in a 60°C ambient environment without a fan chassis is 170 watts, with a fan chassis is 225 watts. 35 A 3 A 1 A

2 We assume you have one Allen�Bradley Ethernet transceiver. These current loads do not include the camera.




124

ATTENTION: You must install a fan assembly if the chassis contains a MicroVAX Information Processor, or if the power supply load is over 170 watts.

Use the following chart to determine whether or not your chassis needs an additional power supply cable.

If chassis contains: Needadditional

cable?

Then order: Notes:

no CVIM modules N If using fan assembly, use PI power supply to fanchassis cable (5120�CP1) that comes with fanassembly

1 or 2 CVIM modules and no othermodules

N Set the switch on the back of the CVIM module to usethe +12 and -12V dc outputs. If using fan assembly,use PI power supply cable (5120�CP1) that comes withfan assembly

at least 1 CVIM module and aMicroVAX Information Processormodule

Y PI power supply to fanchassis and external powersource cable (5120�CP2)

This cable:

• brings fan status to the power supply

• connects 24 volts from an external power supply tothe backplane

more than 2 CVIM modules or atleast 1 CVIM module with aPLC�5/250 controller and noMicroVAX Information Processormodule

Y PI power supply to externalpower source cable(5120�CP3)

This cable connects 24 volts from an external powersupply to the backplane

What to Do Next: Record your selections on Worksheet 11.5, then go to Worksheet 11.4 to select a fan assembly.


125

Worksheet 11.4Selecting a Fan Assembly

Make one copy of this worksheet for each chassis.

Use the following chart to determine whether or not your chassis needs a fan assembly.

If the chassis: Then select:

Contains a MicroVAX Information Processor module An 8�slot fan assembly

Power supply load is over 170 watts An 8�slot fan assembly

Does not have a MicroVAX Information Processor module andthe power supply load is 170 watts or less

No fan assembly is required.




126


127

Worksheet 11.5PI HardwareMake one copy of this worksheet for each system.

See Worksheet 11.1 to Worksheet 11.4 and record your hardware selections in the following table. Use this worksheet when placing your order.

Item: Quantity

MODULES RM with 128K word memory

(from Worksheet 11.1) RM with 384K word memory

LP with 256K word memory




RS2 with memory

RS5 with memory

CVIM module

MicroVAX Information Processor EP

MicroVAX Information Processor EE

MicroVAX Information Processor

OSI carrierband interface module

OSI broadband interface module

EI module

KA module

Spaces for the chassis, power supply, and fan assembly are provided on the back of this worksheet.




128

Item: Quantity

chassis 4�slot

(from Worksheet 11.1) 8�slot

power supplies(from Worksheet 11.3)

standard

power supply cables(from Worksheet 11.3)

PI power supply to fan chassis and external powersource cable (5120�CP2)

PI power supply to external power source cable(5120�CP3)

fan assemblies(from Worksheet 11.4)

8�slot

Symbols

**Empty**, 29

Numbers

4-port distribution panel, mounting, 12�5

6200 series software, 1�20, 8�27, 101communication channels, 1�10, 8�9fault-clearing function, 10�7routing configuration information, 9�1RS, 1�16specifying configuration parameters,

8�25

802.4 token-passing network, 1�24, 8�1, 8�5

A

A-B MAP Station Manager. See MAPStation Manager, 1�24

acwiring

fan chassis, 14�10industrial disk, 14�9power supply, 14�10, 14�11

wiring documentation, 14�1

adapter, mode, 4�5

addressing1771 I/O addressing concepts, 3�4allocating I/O groups, 3�7choosing a method, 3�12efficient use of memory, 3�8I/O, 3�4

advanced routing. See routing, 9�1

analog, I/O modules, 3�14

ASCII, 1�10, 8�24, 8�25, 8�26, 83

assigningI/O chassis, I/O channels, 4�3IBP file number, 10�9modules to chassis, 3�14privilege classes, 1�10rack address, 4�9

audience for manual, iii

B

backplane, 1�2communication, 1�4

power load, 14�8

basic routing. See routing, 9�1

block�transfer, 4�1, 5�1estimating times, 4�1limitations, 4�4request diagram, 4�1scan procedure, 5�2worst�case execution time, 5�4

broadband, 1�24, 8�2, 8�32system compatibility, 1�31transmit/receive, 8�5

C

cable, power supply, 124

calculatingsingle�transfer scan time, 5�4worst�case block�transfer execution time,

5�4

camera, grounding, 13�1

carrierband, 1�24, 8�2, 8�5, 8�32system compatibility, 1�31

catalog numbers, 7�2, 8�9

Cautions, connection to Ethernet, 53

CH1, 8�24KA module, 8�24RM, 8�24

chassis, 1�4, 12�15assigning modules to slots, 11�1Determining Power Requirements,

(Worksheet 9.3), 123determining power requirements, 11�2enclosure, 12�17fan, specifications, 14�10grounding, 13�2Identify Chassis Locations, (Worksheet

3.1), 9mounting, 1�4, 12�3power supply, 1�7Pyramid Integrator Hardware, (Worksheet

9.5), 127selecting, 11�1Selecting a Pyramid Integrator Chassis,

(Worksheet 9.1), 119size, 1�4, 3�14

Color CVIM, characteristics, physicalspecifications, 2�6

Color CVIM module, 2�1using, 2�1

Index



IndexI–2

communicationamong PI modules, 8�32channels (OSI interface module), 1�24configuring parameters, 8�9DECnet, 8�28DH, 8�2Ethernet link, 8�28Ethernet network, 8�1features, 8�3, 8�4, 8�5, 8�6, 8�7KA module, 8�2local area networks, 8�2MAP, 8�1mode, direct, 4�5, 4�6options, 8�8OSI interface module, 8�2planning for, 8�1specifying switch settings for KA module,

8�11with RM, 8�9

compatibility, system, 1�31

compiled programs, 1�13

componentschassis, 1�2determining the positions of, 12�1fan assembly, 1�2OSI Interface module, 1�3power supply, 1�2resource manager, 1�2

concurrent processing, 1�12

Configurable Vision Input Module. SeeCVIM module, viii, 2�1

configuringparameters, 6�7remote I/O, 3�4

convection cooling, 12�2

conventions, viii

creating, design specifications, v

critical faults, 10�2

CVIM, characteristics, physicalspecifications, 2�6

CVIM module, viii, 1�20adapter port, 1�22analysis capabilities, 1�21basic requirements, 1�2camera power, 2�6cameras, 12�13communication, 8�32

options, 8�8configuration, 1�20defining the vision application, 2�1design specification, example, 2�2Determining Power Requirements,

(Worksheet 9.3), 123determining power requirements, 11�2

determining the number of modules, 2�5faults, minor, 10�4, 10�5, 10�6features, (illustration), 1�22gaging, 1�20grounding, camera, 13�1hardware, (Worksheet 3.1), 7I/O, 2�5I/O methods, 2�5inspection, 1�20inspection rate, 1�22installation, 2�5line gages (64), 1�22locating features, 1�20machine operation, functional

specification, 2�3MATH-PAK, 1�20maximum number of modules in an

8-slot chassis, 1�30, 2�1memory, 1�20, 1�32, 8�32

cards, 1�21module I/O, 1�22node adapter port, 1�22object extraction, 1�20preparing a design specification, 2�2recognition, 1�20reference tools (12), 1�22RS-232-C serial port, 1�22selecting a chassis, (Worksheet 9.1),

119serial interface, 1�22shared memory, 1�22system compatibility, 1�31using, 2�1vision application, example, 2�3whether or not to use a power supply

cable, 124windows (48), 1�22

CVIM2, characteristics, physicalspecifications, 2�6

CVIM2 module, 2�1using, 2�1

D

data block, 8�36user-defined, 8�36

Data Highway network. See DH network, 8�1

Data Highway Plus network, DH+ routing,(Worksheet 10.1), 109

Data Highway Plus network. See DH+network, 8�1

Data Highway/Data Highway Interface PlusModule. See KA module, viii

Index I–3

data storagedata block, 8�36planning, 8�33selecting the module, 8�37selecting the section, KA module, 8�37sub-member, 8�36user-defined, 8�36

DECnet protocols, 1�27

defaultboot device, 57recovery mode, 57

default settings, OSI interface module, 8�27

designI/O interface, 3�1process, vspecification, v

DH network, 8�9choosing DH network versus direct

communication mode, 4�7communication, options, 8�8evaluating response time, 8�22node loading, 8�20, 8�21response time, 8�20, 8�21trunk loading, 8�20, 8�21

DH+ message routing. See routing, 9�1

DH+ network, 8�9choosing DH+ network versus direct

communication mode, 4�7communication, options, 8�8estimating network performance, 8�11evaluating node loading, 8�24evaluating response time, 8�23node loading, 8�20response time, 8�20routing, 9�6trunk loading, 8�20

DH+ routing, 109

DH/DH+ Interface module. See KA module, 11�2

dimensions1771-A3B 12-slot I/O chassis with power

supply, 12�154-port distribution panel, 12�54-slot chassis, 12�38-slot chassis, 12�3black/white monitor, 12�12camera mountings, 12�13I/O board, 12�10I/O interface box, 12�8I/O racks and power supplies, 12�14industrial disk, 12�4rack mount color monitor, 12�11user interface box, 12�6

direct communication mode, 4�5, 4�7assign data to transfer, 4�10assigning I/O image areas, 4�8assigning the channel, 4�8choosing methods, 4�7example, 4�5

single transfer of I/O data, 4�6planning for, 4�5tasks, 4�8

discrete I/O, 1�2modules, 3�4

distribution panel. See 4-port distributionpanel, 12�5

documentation, grounding, 13�4

documenting, processor input interrupts, 6�6

DTL software, 51, 61, 69

E

EI module, 1�25, 8�29, 8�32communication, options, 8�8communication features, 8�6, 8�7determining power requirements, 11�2faults, minor, 10�4, 10�5, 10�6illustration, 1�25maximum number of modules in an

8-slot chassis, 1�30memory, 1�32system compatibility, 1�31TCP/IP protocol, 1�25

EMI, 12�17, 13�2

enclosures, choosing, 12�17

environment, 12�2

estimatingblock�transfer times, 4�1network performance

internal processing time, 8�13message destination, 8�13size and number of messages, 8�12

throughput times, 8�14

Ethernet Interface module (EI module)Determine Station Number for DTL Port,

(Worksheet 7.18), 101Determining Power Requirements,

(Worksheet 9.3), 123Ethernet heartbeat, 108installing, (Worksheet 7.21), 107selecting a chassis, (Worksheet 9.1),

119

Ethernet Interface module. See EI module, 1�25Allen-Bradley Automation


IndexI–4

Ethernet link, 8�1, 8�28Ethernet DECnet port, 1�27MicroVAX Information Processor module,

1�27, 8�4transceiver cables, catalog numbers,

7�2

expansionfan assembly, 1�8filler plates, 1�4

F

fan assembly, 1�7expansion, 1�8mounting, 12�3options, 1�2Pyramid Integrator Hardware, (Worksheet

9.5), 127selecting, 11�2

(Worksheet 9.4), 125

fault handling, 1�31

faultscritical, 10�2, 10�10

handling, 10�8list of, 10�6

executing fault routines, 10�9Fault Reporting Requirements,

(Worksheet 8.3), 117major, 10�2

handling, 10�7, 10�8list of, 10�5

minor, 10�1, 10�10handling, 10�7list of, 10�4

remote I/O, 10�8reporting, 10�10response, 10�3routines, 10�9selecting major, minor, 10�8Specify Fault Routines, (Worksheet 8.2),

115status, 10�10system warnings, 10�1user-defined, 10�9User-Defined Major Faults, (Worksheet

8.1), 113

filler plates, purpose, 1�4

full duplex, modem type, 8�26

functional specification, iv

functionsinformation processing, 1�2machine vision, 1�2

G

grounding, 13�3additional information, 13�3chassis, 13�2diagram (example), 13�4documentation, 13�1, 13�4guidelines, 13�2what to ground, 13�1

groups, numbers, (Worksheet 3.6), 19

H

half duplex, modem type, 8�25

handshaking, 8�27

hardware(Worksheet 9.5), 127ac wiring documentation, 14�1grounding documentation, 13�1, 13�3Information for the Hardware Installer,

(Worksheet 6.7), 65mounting documentation, 12�1selecting, 11�1

I

I/O1771, addressing concepts, 3�4addresses, I/O Addresses, (Worksheet

3.7), 21addressing, 3�4addressing concepts, 3�5

2-slot, 1-slot, 1/2-slot, 3�7I/O groups, 3�6racks, 3�6

addressing methods, 3�7assigning, 3�11capacity, 1�12chassis with power supply, 12�15CVIM module, 2�5discrete, 1�2, 3�4groups, 3�6hardware, I/O Hardware, (Worksheet

3.8), 23interface, designing, 3�1interface box, 12�8List I/O and Select Modules, (Worksheet

3.2), 11list of, 2�3memory files for I/O, 3�5modules

16-bit, 3�31771, 3�3

Index I–5

32-bit, 3�38-bit, 3�3Assign I/O Modules to Remote I/O

Chassis, (Worksheet 4.1), 25density, 3�5List All I/O Modules, (Worksheet 3.4),

15Tally I/O Modules, (Worksheet 3.3),

13use of data table, B�1, B�3

power supplies, 12�14power supply, ac wiring diagrams,

14�10, 14�11racks, 3�7, 12�14recording addresses, 3�15remote, 3�1remote I/O, 10�8scan time, 4�3

Calculate Worst Case Channel I/OScan Time, (Worksheet 4.2), 27

single transfers, 4�6

I/O Addresses, (Worksheet 3.7), 21

I/O Hardware, (Worksheet 3.8), 23

I/O links, planning, 3�1

IBP file number, 10�9assigning, 10�9

independent background programs, 1�13

industrial diskac wiring, 14�9characteristics, physical specifications,

7�7combinations Allen-Bradley supports,

1�27drive, data storage, 7�2mounting, 12�4program storage and loading, 1�27specifications, 14�9

information-processing functions, 1�2

input, modules, 3�14

INTERCHANGE software, 1�27, 1�29, 7�3, 8�2

interlock relay wiring, power supply, 14�9

K

KA module, viii, 1�25(Worksheet 8.5), Timed Periodic

Communication (TPC), 81CH1, 8�24communication, local area networks, 8�2communication features, 8�3data storage, 8�37Determine Number of Required KA

Modules, (Worksheet 7.10), 99

Determining Power Requirements,(Worksheet 9.3), 123

determining power requirements, 11�2DH+ routing, 9�6, 109faults, minor, 10�4, 10�5, 10�6installation, (Worksheet 7.13), 77maximum number of modules in an

8-slot chassis, 1�30memory, 1�32Record Element and Bit Usage,

(Worksheet 7.9), 97Record File Usage, (Worksheet 7.8), 95routing, 9�2, 9�4selecting a chassis, (Worksheet 9.1),

119setting switches, (Worksheet 7.1), 71specify switch settings, 8�11system compatibility, 1�31

L

languages, supported by Allen-Bradley, 1�29

line voltage connections, power supply, 14�9

local scanner. See RS5, 1�14

logic processor, viiiconfiguring, (Worksheet 5.6), 47Determining Power Requirements,

(Worksheet 9.3), 123Estimate Logic Processor Performance,

(Worksheet 5.3), 41Information for Hardware Installer,

(Worksheet 5.5), 45memory sizes, (Worksheet 5.1), 37Program Size and Execution Time,

(Worksheet 5.2), 39Record Element and Bit Usage,

(Worksheet 7.9), 97Record File Usage, (Worksheet 7.8), 95Select Memory Sizes for Logic

Processors and Resource Manager,(Worksheet 5.4), 43

selecting a chassis, (Worksheet 9.1), 119

logic processor. See LP, 1�12See also Logic Processor Module

LP, 1�12characteristics, physical specifications,

3�15, 6�8communication, 8�32concurrent processing, 1�12configuring parameters, 6�7data storage, 8�37Allen-Bradley Automation


IndexI–6

determining number of LP modules youneed, 6�5

determining power requirements, 11�2determining the number for your

application, 6�3example of design specification, 6�2faults, minor, 10�4, 10�5, 10�6features, 1�12I/O capacity, 1�12IBPs, 6�4limits, 6�4maximum number of modules in an

8-slot chassis, 1�30memory, 1�13, 1�32, 6�4, 8�32PIIs, 6�4preparing a design specification, 6�1programming features, 1�13remote block-transfer timing, 4�1selecting a chassis slot, 6�6selecting memory for each module, 6�5STIs, 6�4system compatibility, 1�31using, 6�1

M

machine vision functions, 1�2

major faults, 10�2

MAP, 1�24, 8�1, 8�6, 8�8, 8�32

MAP Station Manager, 8�5, 8�9, 8�28, 103

software (cat. no.), 1�24

master, 8�25, 87

memoryblock transfer, 3�5CVIM module, 1�32, 8�32data storage, 8�33, 8�34DH/DH+ Interface module, 1�32EI module, 1�32files for I/O, 3�5I/O groups, 3�6I/O racks, 3�6illustration, system memory, 1�32input image file, 3�5KA module, 1�32LP, 1�32, 6�4, 6�5, 8�32MicroVAX Information Processor module,

1�32, 8�32modules, 1�2OSI interface module, 1�32, 8�32output image file, 3�5PLC-5/250 controller, requirements, A�1RM, 1�32, 6�6, 8�32RS, 1�32, 8�32words, viii

message routing. See routing, 9�1

MicroVAX Information Processor module, 1�27

(illustration), PI system, 1�28abbreviations, viiicharacteristics, 7�5

physical specifications, 7�7choosing industrial disks

(Worksheet 6.1), 51(Worksheet 6.5), 61

communication, 8�2, 8�32options, 8�8

communication features, 8�4communication with PI modules, 1�27configurations

local network, 7�2standalone, 7�2VAX cluster, 7�2

data storage, 8�37DECnet, 8�28DECnetwork, 1�27Determine Station Number for DTL Port,

(Worksheet 7.18), 101Determining Power Requirements,

(Worksheet 9.3), 123determining power requirements, 11�2disk drives, 1�27disk storage requirements, 7�3distribution panel, 1�29Ethernet DECnet port, 1�27Ethernet link, 1�27, 8�28Ethernet network, 8�4fan assembly, 1�7faults, minor, 10�4, 10�5, 10�6hardware

(Worksheet 6.2), 53(Worksheet 6.3), 55, 65(Worksheet 6.6), 63

Information for the Hardware Installer,(Worksheet 6.3), 55

Information for the Software Installer(Worksheet 6.4), 57, 59(Worksheet 6.8), 67, 69

maximum number of modules in an8-slot chassis, 1�30

memory, 1�32, 8�32module configurations, 7�2preparing a design specification, 7�3program loader, 1�29selecting hardware, 7�3serial ports, 1�29software, 1�29, 7�3supported languages, 1�29system compatibility, 1�31system utilities, 1�30using, 7�1

Index I–7

minor faults, 10�1

mode control, 1�11

modems, 84

modules1771 I/O, 3�3analog I/O modules, 3�14assigning modules to chassis, 3�14data storage, 8�33high/low power, 3�14I/O, density, 3�5input/output, 3�14memory, 1�2

mounting4-slot chassis, 12�38-slot chassis, 12�3chassis, 1�4diagram, 12�17diagram (example), 12�18dimensions, 12�3distribution panel, 12�5documentation, 12�1fan assembly, 12�3guidelines, 12�2I/O interface box, 12�8industrial disk, 12�4user interface box, 12�6

multidrop networks, 8�24

N

National Electrical Code, 13�2

network performance, estimating, 8�11

no handshaking, 8�27

node loading, 8�23

nodes, estimating network performance, 8�11

noise, 1�4

O

off-line programming, 1�13

on-line programming, 1�13

Open Systems Interconnect (OSI) InterfaceModule or Cx. See OSI interfacemodule, viii

operating temperature, 12�2

operational modes, OSI interface module, 1�24, 8�28, 103

optional components, fan assembly, 1�2

OSI interface module(Cx), viii

broadband, 1�24carrierband, 1�3, 1�24, 8�5communication

local area networks, 8�2options, 8�8

communication channels, 1�24communication features, 8�5configuring software, 1�24default settings, 8�27definition of, 1�23Determining Power Requirements,

(Worksheet 9.3), 123determining power requirements, 11�2faults

minor, 10�4, 10�5, 10�6responses, 10�3

fully operational, 1�24, 8�28, 103illustration, 1�3, 1�24installing, (Worksheet 7.20), 105maximum number of modules in an

8-slot chassis, 1�30memory, 1�32, 8�32multi-vendor environment, 1�23operational modes, 1�24, 8�28, 103partially operational, 1�24, 8�28, 103RS-232 connection, local station

management, 1�24RS-232 port, 8�5selecting a chassis, (Worksheet 9.1),

119setting switches, (Worksheet 7.19), 103software (cat. no,), 1�24switch settings, 8�27using user defaults, 8�28, 103

OTW. See overtemperature warning, 10�1

output, modules, 3�14

overtemperature warning (OTW), systemwarning, 10�1

P

PLC-5/250 controllerinstruction execution times, A�1memory requirements, A�1

PLC-5/250 processorcommunication, options, 8�8data storage, 8�33modules used in, 1�18sample configuration, 1�19system compatibility, 1�31

point-to-point networks, 8�24

polling, 88, 89

powerbackplane, 14�8Allen-Bradley Automation


IndexI–8

distributing, 14�5distribution, 14�5

grounded ac, 14�6ungrounded ac, 14�7

specifications, 1�6

power supply, 1�5, 14�8for I/O, 14�10, 14�11frequency, 14�8input voltage range, 14�8interlock relay wiring, 14�9isolation, 14�8line voltage connections, 14�9operating voltage, 14�8Pyramid Integrator Hardware, (Worksheet

9.5), 127relay connection, 14�8selecting, 3�15, 11�1

Selecting Power Supplies, (Worksheet3.5), 17

specifications, 14�8

preparation for PI design, iv

privilegesassigning privilege classes, 1�10classes

(Worksheet 7.7), 93CH2 and CH3, 91

configurable, 8�31guidelines for assigning privileges, 8�29hierarchy example, 8�29

processor input interrupts (PII), 1�13, 6�4, 10�8

configurable privileges, 8�31documenting, 6�6

program loader, 1�29

protocolschoosing, 8�24DF1, 86master, 87slave, 86TCP/IP, 8�29

publications, related publications, viii

R

racks, numbers, (Worksheet 3.6), 19

related publications, v, viii

relative humidity, 12�2

remote block-transfer timing, 4�1

remote I/Oconfiguring, 3�1, 3�4faults, 10�8

remote scanner, viiiconfiguring parameters, (Worksheet 4.4),

31, 33Determining Power Requirements,

(Worksheet 9.3), 123selecting a chassis, (Worksheet 9.1),

119

remote scanner. See RS2, 1�14

remote/local scanner. See RS, 1�14

resource manager, viiiCommunication Parameters for CH 2 and

CH 3, (Worksheet 7.6), 91Determining Power Requirements,

(Worksheet 9.3), 123DH+ routing, 109Information for PLC Programmer,

(Worksheet 7.4), 79installation, (Worksheet 7.3), 75Parameters for CH 1, (Worksheet 7.5),

83Record Element and Bit Usage,

(Worksheet 7.9), 97Record File Usage, (Worksheet 7.8), 95Select Memory Sizes for Logic

Processors and Resource Manager,(Worksheet 5.4), 43

selecting a chassis, (Worksheet 9.1), 119

setting jumpers, (Worksheet 7.2), 73setting switches, (Worksheet 7.1), 71timed periodic communication (TPC),

79

resource manager. See RM, 1�9

response time, 8�21, 8�22, 8�23

RM(Worksheet 8.5), Timed Periodic

Communication (TPC), 816200 series software, 1�10basic requirement for a chassis, 1�2communication, 8�2, 8�9, 8�32communication channels, 1�10communication features, 8�3data storage, 8�38determining power requirements, 11�2DH+ routing, 9�6fault handling, 1�9faults, minor, 10�4, 10�5, 10�6maximum number of modules in an

8-slot chassis, 1�30memory, 1�10, 1�32, 8�32placement of, 1�9recording, 1�9routing, 9�2, 9�4

Index I–9

selecting a chassis slot, 6�6selecting memory, 6�6Standalone vision systems, 1�2system compatibility, 1�31system mode control, 1�11system privilege control, 1�10

routing, 9�1advanced, 9�6application timeout, 9�8basic, 9�6bridge address, 9�7communication errors, 9�1, 9�8, 9�9DH+ protocol, 9�1diagnostic counters, 9�9fault reporting, 9�1, 9�10link diagnostic counters, 9�10link ID numbers, 9�8maximum number of links per PI system,

9�4maximum number of modules per PI

system, 9�4minor faults, 9�10programming terminals, 9�4station address, 9�1, 9�7

RS6200 series software, 1�16block�transfer limitations, 4�4block�transfer request diagram, 4�2communication, 8�2, 8�32configurability, 1�16configuration parameters, 4�10configure chassis and I/O channel, 3�2data storage, 8�37determining power requirements, 11�2difference, 1�14faults, minor, 10�4, 10�5, 10�6maximum number of modules in an

8-slot chassis, 1�30, 3�13memory, 1�32, 8�32pushwheel range, 1�17rack address, 4�9recording I/O addresses, 3�2remote block-transfer timing, 4�1selecting I/O devices, 3�1, 3�3selecting power supplies, 3�2selecting remote I/O devices, 3�3setting pushwheel range, 1�17specify configuration, 4�10specify I/O fault type and setting of

last-state switch, 3�2specify scanner configuration, 3�2starting I/O group numbers, 4�9system compatibility, 1�31

RS-232, 1�10

RS-422, 1�10

RS-423, 1�10

RS2block transfer, 1�15configuring termination resistors,

(Worksheet 4.3), 29direct communication mode, 1�15I/O capacity, 1�15I/O racks addressed, 1�17jumpers for termination resistors, 4�10pushwheel numbers, 1�17

RS5, 5�1block�transfers, 5�1communication features, 8�4configuring parameters, (Worksheet 5.1),

35direct communication mode, 1�15I/O capacity, 1�15I/O racks, 3�7I/O racks addressed, 1�18jumpers for termination resistors, 4�10local block transfer, 1�15planning, 5�1pushwheel numbers, 1�18remote block transfer, 1�15single�transfers, 5�1

S

scan procedureblock�transfer, 5�2single�transfer, 5�1

scanner. See RS, 1�14

selectable timed interrupts (STI), 1�13, 6�4, 10�8

sequential function charts, programmingfeatures, 1�13

set, switches, OSI interface module, 8�27

setting, RS pushwheel range, 1�17

signalling speed, I/O channels, 3�14

single�transfer, 5�1calculating scan time, 5�4scan procedure, 5�1

slave, 8�26, 86

software6200 series software, 1�20, 6�7, 8�9,

8�27, 101configuration parameters, 4�10configuring communciation

parameters, 8�25fault-clearing function, 10�7

DEC Windows, 7�3DECnet, 7�3INTERCHANGE software, 1�29, 8�2Local Area VAXcluster, 7�3Allen-Bradley Automation


IndexI–10

MAP Station Manager, 8�5, 8�28, 103

MAP Station Manager (cat. no.), 1�24MicroVAX Information Processor module,

1�29MicroVAX Information Processor module

software, (Worksheet 6.4), 57, 59, 67, 69

OSI interface modulecatalog number, 1�24configuring, 1�24

VAXcluster, 8�28VMS, 7�3VMS system software media, 1�29

specificationsac wiring, 14�8chassis, 12�17Color CVIM, 2�6CVIM, 2�6CVIM2, 2�6design, creating, vfunctional, ivfunctional spec of machine operation,

CVIM module, 2�3industrial disk, ac power, 14�9industrial disks, 7�7LP, 3�15, 6�8MicroVAX Information Processor

modules, 7�6, 7�7

storage temperature, 12�2

sub-member, data storage, 8�36

supervisory processorrack address, 4�9starting I/O group numbers, 4�9

System compatibility, 1�31

System Layout, raceway layoutconductors, 14�1routing conductors, 14�2

system warnings, 10�1, 10�2

T

tape loader. See program loader, 1�29

TCP/IP protocol, 8�29EI module, 1�25

termination resistors, (Worksheet 4.3), 29

throughput times, 8�14

timed periodic communication (TPC), 79, 81

token passing, 8�11

transformers, 14�5, 14�12

transmission time, 8�11

trunk loading, 8�21

U

user interface box, mounting, 12�6

using, user defaults, OSI interface module, 8�28, 103

V

VAXcluster, 57, 68

VMS system software media, 1�29, 51, 61, 69

system utilities, 1�30

W

WarningsPI system, 10�2system, overtemperature warning (OTW),

10�1

wiring, 13�4, 14�1fan chassis, 14�10interlock relay, 14�9line voltage, 14�9power supply, 14�10, 14�11

words, memory, viii

Pyramid Integrator, Data Highway Plus, DH+, INTERCHANGE,ControlView, Color CVIM, CVIM, CVIM2, MATH-PAK, PLC-5/25,PLC-5/250, RediPANEL are trademarks of Allen-Bradley Company,Inc., a Rockwell International company.PLC and PLC-5 are registered trademarks of Allen-BradleyCompany, Inc., a Rockwell International company.DEC, DECnet, MicroVAX, VAX are registered trademarks of DigitalEquipment Corporation.VAXcluster and VMS are trademarks of Digital EquipmentCorporation.IBM is a registered trademark of International Business MachinesCorporation.Ethernet is a registered trademark of Digital Equipment Corporation,Intel and Xerox Corporation. HP-UX is a trademark of Hewlett Packard Company.



130

With major offices worldwide.

Algeria • Argentina • Australia • Austria • Bahrain • Belgium • Brazil • Bulgaria • Canada • Chile • China, PRC • Colombia • Costa Rica • Croatia • Cyprus • Czech

Republic • Denmark • Ecuador • Egypt • El Salvador • Finland • France • Germany • Greece • Guatemala • Honduras • Hong Kong • Hungary • Iceland • India •Indonesia • Israel • Italy • Jamaica • Japan • Jordan • Korea • Kuwait • Lebanon • Malaysia • Mexico • New Zealand • Norway • Oman • Pakistan • Peru • Philippines

• Poland • Portugal • Puerto Rico • Qatar • Romania • Russia-CIS • Saudi Arabia • Singapore • Slovakia • Slovenia • South Africa, Republic • Spain • Switzerland •Taiwan • Thailand • The Netherlands • Turkey • United Arab Emirates • United Kingdom • United States • Uruguay • Venezuela • Yugoslavia

World Headquarters, Allen�Bradley, 1201 South Second Street, Milwaukee, WI 53204 USA, Tel: (1) 414 382�2000 Fax: (1) 414 382�4444

Allen�Bradley has been helping its customers improve productivity and quality for 90 years.

A�B designs, manufactures and supports a broad range of control and automation products

worldwide. They include logic processors, power and motion control devices, man�machine

interfaces and sensors. Allen�Bradley is a subsidiary of Rockwell International, one of the

world's leading technology companies.

Publication 5000-6.2.1—April 1994Supersedes publication 5000-6.2.1—June 1992

PN 955114-74Copyright 1994 Allen-Bradley Company, Inc. Printed in USA

Documents

ucc.colorado.eduucc.colorado.edu/allen-bradley/5000621.pdfBecause of the variety of uses for the products described in this publication, those responsible for the application and use