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ULTRA TEC FA Ads --- over the years
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A.S.A.P. - 1Automated Selected
Area Polisher
Selected AreaPolishing...
6170.1 QuickRelease
Microscopy Fixture
Package mountedin 6304.1 Cross-sectioning fixture
MULTIPOL 8 FA Precision Polisher
Close-up ofA.S.A.P. Tool
1025 E Chestnut Ave
Santa Ana, CA 92701
Toll Free (US) 1 877 542 0609
Tel: 1 714 542 0608 Fax: 1 714 542 0627
e-mail: [email protected]
www.ultratecusa.com
Cross-Sectioning,Delayering andBack-Grinding
Cross-sectioning
Delayering
Back-grinding for backside analysis
Polishing wafers
Thinning TEM samples
Pre-FIB thinning
‘True flat lapping’ mechanism makes sub-micron work a reality
Quick Release fixture provides fast, easy transfer of sample to/from the microscope
Standard 3" Capability (4" max. when using 10 inch polishing plates)
THE CUTTING & POLISHING SPECIALISTS...
Backside-thinning of packages for photo emission, thermal emission and i-r microscopy
Thinning single dies on wafers, multi-chip modules and hybrids
Frontside decapsulation (makes subsequent chemical decapping more controllable)
Retains ‘Live’ Parts - i.e. lead-frame left intact
Small Footprint, ‘Benchtop’ design
Easy to operate - no software or CNC-machine code knowledge required
Clean, quiet operation
Affordable for all f.a. labs
Scratch-free flat mirror finishes
Call for moreinformation or to
schedule ademonstration
advancedsample preparation
solutions...
advancedsample preparation
solutions...
ASAP - 1Selected Area
Preparation System
Selected Area Preparation
6170.1 QuickRelease
Microscopy Fixture
Package mountedin 6304.1 Cross-sectioning fixture
MULTIPOL 8 FA Precision Polisher
Toll Free (US) 1 877 542 0609
Tel: 1 714 542 0608 Fax: 1 714 542 0627
e-mail: [email protected]
www.ultratecusa.com
Delayering andCross-Sectioning
True flat lapping approach allows for unsurpassed flatness
Significant flatness improvement over ‘off the lap’ machinery
Advanced Delayering
Cross-sectioning for optical, SEM, TEM and DUV microscopy
‘Quick Release’ Fixtures
Standard 3” wafer capability (optional 4” max)
Prepares All sizes of die — both packaged and wafer-level
Accurately removes package and wafer materials, and then polishes
Substrates thinned to less than 25 microns
Pre-FIB thinning (saves time and money)
Provides key advantages for decapsulation applications
(for example on BGA, ceramic, flip chip, power device, MCM)
Fast, Intuitive Operation
‘Die tilt’ is easily accommodated during the process
Bench-top and quiet
Call usfor a freeCD-ROM!
enabling
failure analysisenabling
Single die mountedin 6307.1 Stub-type
cross-sectioningfixture
