UM10326LPC32x0 and LPC32x0/01 User manualRev. 3 22 July 2011 User manualDocument informationInfo ContentKeywords LPC3220, LPC3230, LPC3240, LPC3250, ARM9, LPC3220/01, LPC3230/01, LPC3240/01, LPC3250/01, 16/32-bit ARM microcontroller.Abstract User manual for LPC32x0.UM10326 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved.User manual Rev. 3 22 July 2011 2 of 721Contact informationFor more information, please visit: http://www.nxp.comFor sales office addresses, please send an email to: salesaddresses@nxp.comNXP Semiconductors UM10326LPC32x0 User manual Revision historyRev Date Description3 20110722 LPC32x0 user manualModifications: System control chapter added.2 20110504 LPC32x0 user manualModifications: Voltage domains updated in Table 671, Table 696, and Table 697. LCDENAB signal updated in LCD timing diagrams Figure 35 and Figure 36. Definition of Bus Keeper (BK) pins updated in Table 670. GPI_6 updated to input with bus keeper function. Power supply domain for pins SYSX_IN and SYSX_OUT updated in Table 671. Description of DBGEN pin function updated in Section 4.6.1 and Table 671. Explanation of simultaneous update mode for PWM Motor control Match and Limit register added in Section 30.7.7.1 Match and Limit shadow write and operating registers. Registers SERIAL_ID0 to 3 added for unique serial ID number (Section 3.1.3). Updated TAP ID and ETB ID (Table 710). Editorial updates. Pin functions for touch screen control controller updated: pin T14 has functions ADIN1/TS_XM and pin U15 has functions ADIN0/TS_YM (see Table 668, Table 669, Table 255, Table 229, Figure 37. Pin selection for touch screen control controller in manual mode updated (TS_YPC values in Table 231). Parts LPC3220/01, LPC3230/01, LPC3240/01, LPC3250/01 added.1 20090218 Initial LPC32x0 user manual release.UM10326 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved.User manual Rev. 3 22 July 2011 3 of 721 1.1 IntroductionNXP Semiconductor designed the LPC32x0 for embedded applications requiring high performance and low power consumption.NXP achieved their performance objectives using an ARM926EJ-S CPU core with a Vector Floating Point co-processor and a large set of standard peripherals, including USB On-The-Go. Figure 1 shows a block diagram of the LPC32x0. The LPC32x0 operates at CPU frequencies up to 266 MHz. The basic ARM926EJ-S CPU Core implementation uses a Harvard architecture with a 5-stage pipeline. The ARM926EJ-S core also has an integral Memory Management Unit (MMU) to provide the virtual memory capabilities required to support the multi-programming demands of modern operating systems. The basic ARM926EJ-S core also includes a set of DSP instruction extensions including single cycle MAC operations and native Jazelle Java Byte-code execution in hardware. The NXP implementation has one 32 kB Instruction Cache and one 32 kB Data Cache.For low power consumption, the LPC32x0 takes advantage of NXP Semiconductor's advanced technology development expertise to optimize Intrinsic Power, and software controlled architectural enhancements to optimize Power Management. The LPC32x0 also includes 128 to 256 kB of on-chip static RAM, a NAND Flash interface, an Ethernet MAC, an LCD controller that supports STN and TFT panels, and an external bus interface that supports SDR and DDR SDRAM as well as static devices. In addition, the LPC32x0 includes a USB 2.0 Full Speed interface, seven UARTs, two I2C interfaces, two SPI/SSP ports, two I2S interfaces, two single output PWMs, a motor control PWM, four general purpose timers with capture inputs and compare outputs, a Secure Digital (SD) interface, and a 10-bit A/D converter with a touch screen sense option.UM10326Chapter 1: LPC32x0 Introductory informationRev. 3 22 July 2011 User manualUM10326 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved.User manual Rev. 3 22 July 2011 4 of 721NXP Semiconductors UM10326Chapter 1: LPC32x0 Introductory information Fig 1. LPC32x0 diagramExternal Memory InterfacesSystem FunctionsCPU subsystemARM926EJInstr DataI-Cache 32kBD-Cache 32kBETB VFP9DMA ControllerETM9On-Chip MemoryROM256 kB SRAMOther PeripheralsBus matrix (Multi-layer AHB)WatchdogHigh Speed TimerMillisecond TimerPower ControlPLLsSystem ControlInterrupt ControllerPWM 1, 2Touch Screen/10-bit A/DKeyscanGPIOMotorControlPWM Communication PeripheralsUSB OTGUART6 IrDAUART1-5, 7I2C 1, 2I2S 0, 1SPI 1, 2SSP 0, 1NAND FlashSRAM andSDRAM(SDR/DDR) controlSD CardTimer LCDEthernetMACRTC0,1,2,3,4,5UM10326 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved.User manual Rev. 3 22 July 2011 5 of 721NXP Semiconductors UM10326Chapter 1: LPC32x0 Introductory information1.2 Features ARM926EJS processor, running at CPU clock speeds up to 266 MHz A Vector Floating Point coprocessor. A 32 kB instruction cache and a 32 kB data cache. Up to 256 kB of internal SRAM. Selectable boot-up from various external devices: NAND Flash, SPI memory, USB, UART, or static memory. A Multi-layer AHB system that provides a separate bus for each AHB master, including both an instruction and data bus for the CPU, two data busses for the DMA controller, and another bus for the USB controller, one for the LCD and a final one for the Ethernet MAC. There are no arbitration delays in the system unless two masters attempt to access the same slave at the same time. An External memory controller for DDR and SDR SDRAM, as well as static devices. The address bus provides up to 16 MB for each of the 4 static chip selects. The controller provides two dynamic memory chip selects addressing up to 512 MB each. Two NAND Flash controllers. One for single level NAND Flash devices and the other for multi-level NAND Flash devices. An Interrupt Controller, supporting 73 interrupt sources. An eight channel General Purpose AHB DMA controller (GPDMA) that can be used with the SD card port, the 14-clock UARTs, I2S ports, and SPI interfaces, as well as memory-to-memory transfers. Serial Interfaces: A 10/100 Ethernet MAC with dedicated DMA Controller. A USB interface supporting either Device, Host (OHCI compliant), or On-The-Go (OTG) with an integral DMA controller and dedicated PLL to generate the required 48 MHz USB clock. Four standard UARTs with fractional baud rate generation and 64 byte FIFOs. One of the standard UARTs supports IrDA. Three additional 14-clock UARTs intended for on-board communications that support baudrates up to 921,600 bps when using a 13 MHz main oscillator.All 14-clock UARTs provide 64-byte FIFOs. Two SPI controllers. Two SSP controllers. Two I2C-bus Interfaces with standard open drain pins. The I2C-bus Interfaces support single master, slave and multi-master I2C configurations. Two I2S interfaces, each with separate input and output channels. Each channel can be operated independently on 3 pins, or both input and output with one I2S interface can be done on only 4 pins. Additional Peripherals: LCD controller supporting both STN and TFT panels, with dedicated DMA controller. Programmable display resolution up to 1024x768. Secure Digital (SD) memory card interface.UM10326 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved.User manual Rev. 3 22 July 2011 6 of 721NXP Semiconductors UM10326Chapter 1: LPC32x0 Introductory information General purpose input, output, and I/O pins. Includes 12 general purpose input pins, 24 general purpose output pins, and 51 general purpose I/O pins. A touch screen controller, which can alternatively operate as a 10 bit, 400kHz A/D Converter with input multiplexing from 3 pins. Real Time Clock (RTC) with separate power pin. This RTC has a dedicated 32 kHz oscillator. NXP implemented the RTC in an independent on-chip power domain so it can remain active while the rest of the chip is not powered. The RTC also Includes a 32 byte scratch pad memory. A 32-bit general purpose high speed timer with a 16-bit pre-scaler. This timer includes one external capture input pin and a capture connection to the RTC clock. Interrupts may be generated using 3 match registers. Six enhanced Timer/Counters which are identical except for the peripheral base address. A minimum of two capture inputs and two match outputs are pinned out for four timers. Timer 1 brings out a third match output, while Timers 2 and 3 bring out all four match outputs, Timer 4 has one capture register and Timer 5 has no pin connections. A 32-bit Millisecond timer driven from the RTC clock. This timer can generate interrupts using 2 match registers. A Watchdog Timer. The watchdog timer is clocked by PERIPH_CLK. Two single output PWM blocks. One PWM designed for Motor Control. Keyboard scanner function allows automatic scanning of up to an 8x8 key matrix. Up to 18 external interrupts. Standard ARM Test/Debug interface for compatibility with existing tools. Emulation Trace Buffer with 2K x 24 bit RAM allows trace via JTAG. Stop mode saves power, while allowing many peripheral functions to restart CPU activity. On-chip crystal oscillator. An on-chip PLL allows CPU operation up to the maximum CPU rate without the requirement for a high frequency crystal. Another PLL allows operation from the 32 kHz RTC clock rather than the external crystal. Boundary Scan for simplified board testing. User-accessible unique serial ID number for each chip. 296 pin TFBGA package.1.3 Applications Consumer Medical Network Control Industrial CommunicationsUM10326 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved.User manual Rev. 3 22 July 2011 7 of 721NXP Semiconductors UM10326Chapter 1: LPC32x0 Introductory information1.4 Ordering Information [1] Available in Revision - and A. F = 40 C to +85 C temperature range. Note that Revision A parts with and without the /01 suffix are identical. For example, LPC3220FET296 Revision A is identical to LPC3220FET296/01 Revision A. [2] Available starting with Revision A.1.4.1 Ordering options Table 1. Ordering informationType number PackageName Description VersionLPC3220FET296[1]TFBGA296 plastic thin fine-pitch ball grid array package; 296 balls; body 15x15x0.7 mm SOT1048-1LPC3230FET296[1]TFBGA296 plastic thin fine-pitch ball grid array package; 296 balls; body 15x15x0.7 mm SOT1048-1LPC3240FET296[1]TFBGA296 plastic thin fine-pitch ball grid array package; 296 balls; body 15x15x0.7 mm SOT1048-1LPC3250FET296[1]TFBGA296 plastic thin fine-pitch ball grid array package; 296 balls; body 15x15x0.7 mm SOT1048-1LPC3220FET296/01[2]TFBGA296 plastic thin fine-pitch ball grid array package; 296 balls; body 15x15x0.7 mm SOT1048-1LPC3230FET296/01[2]TFBGA296 plastic thin fine-pitch ball grid array package; 296 balls; body 15x15x0.7 mm SOT1048-1LPC3240FET296/01[2]TFBGA296 plastic thin fine-pitch ball grid array package; 296 balls; body 15x15x0.7 mm SOT1048-1LPC3250FET296/01[2]TFBGA296 plastic thin fine-pitch ball grid array package; 296 balls; body 15x15x0.7 mm SOT1048-1Table 2. Part optionsType number SRAM (kB) 10/100 Ethernet LCD ControllerTemperature range (C) PackageLPC3220FET296 128 0 0 -40 to +85 TFBGA296LPC3230FET296 256 0 1 -40 to +85 TFBGA296LPC3240FET296 256 1 0 -40 to +85 TFBGA296LPC3250FET296 256 1 1 -40 to +85 TFBGA296LPC3220FET296/01 128 0 0 -40 to +85 TFBGA296LPC3230FET296/01 256 0 1 -40 to +85 TFBGA296LPC3240FET296/01 256 1 0 -40 to +85 TFBGA296LPC3250FET296/01 256 1 1 -40 to +85 TFBGA296UM10326 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved.User manual Rev. 3 22 July 2011 8 of 721NXP Semiconductors UM10326Chapter 1: LPC32x0 Introductory information1.5 Block diagramThe following block diagram shows the bus connections between the CPU, peripherals, and external memory. Fig 2. LPC32x0 block diagramARM 9EJSMMUD-Cache 32KB D-SideControllerI-Cache 32KB I-SideControllerData Instruction DMAcontrollerEthernet 10/100 MACUSB OTGcontroller LCDcontrollerEthernet PHYinterface USBtranceiver interface LCD panelinterfaceExternalMemorycontroller ROM16 KB SRAM256 KB MLCNAND SLCNAND SD CardSPIx 2I2Sx 2SSPx 2USBregs DMAregsETBregsSDRAM regsStandard UART x4I2C x2Timers x6Watchdog timer AHB to APBbridgeDebugSystemControl14C UART x3 KeyScanner 10-bitADC/TS UARTControlRTCPWM x2InterruptControlGPIOM1 M0 AHB to APBbridge AHB to APBbridgeMaster Layer 0 1 2 3 4 5 6Slave Port 0176532= Master/Slave connection supported by the multilayer AHB matrix32 bit, AHB MatrixAPB SlavesFAB SlavesAHB SlavesAHB Slaves APB SlavesPort 3Port 4Port 032-bit wideexternalmemoryETB ETM 9 VFP9LCDregsEthernet regs Motor Control PWMUM10326 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved.User manual Rev. 3 22 July 2011 9 of 721NXP Semiconductors UM10326Chapter 1: LPC32x0 Introductory information1.6 CPU Subsystem1.6.1 CPUNXP implemented the LPC32x0 using an ARM926EJ-S CPU core that has a Harvard architecture and a 5-stage pipeline. To the ARM926EJ-S CPU core, NXP added a 32 kB Instruction Cache, a 32 kB Data Cache and a Vector Floating Point coprocessor. The ARM926EJ-S core also has an integral Memory Management Unit (MMU) to provide the virtual memory capabilities required to support the multi-programming demands of modern operating systems. The ARM926EJ-S core V5TE instruction set includes DSP instruction extensions, and can execute native Jazelle Java Byte-code in hardware. The LPC32x0 operates at CPU frequencies up to 266 MHz.1.6.2 Vector Floating Point (VFP) coprocessor The LPC32x0 has a VFP co-processor providing full support for single-precision and double-precision add, subtract, multiply, divide, and multiply-accumulate operations at CPU clock speeds. It is compliant with the IEEE 754 standard for binary Floating-Point Arithmetic. This hardware floating point capability makes the micro controller suitable for advanced Motor control and DSP applications. The VFP has 3 separate pipelines for Floating-point MAC operations, divide or square root operations, and Load/Store operations. These pipelines operate in parallel and can complete execution out of order. All single-precision instructions execute in one cycle, except the divide and square root instructions. All double-precision multiply and multiply-accumulate instructions take two cycles. The VFP also provides format conversions between floating-point and integer word formats.1.6.3 Emulation and debuggingThe LPC32x0 supports emulation and debugging via a dedicated JTAG serial port. An Embedded Trace Buffer allows tracing program execution. The dedicated JTAG port allows debugging of all chip features without impact to any pins that may be used in the application.EmbeddedICEStandard ARM EmbeddedICE logic provides on-chip debug support. The debugging of the target system requires a host computer running the debugger software and an EmbeddedICE protocol converter. The EmbeddedICE protocol converter converts the Remote Debug Protocol commands to the JTAG data needed to access the ARM core.The ARM core has a Debug Communication Channel function built-in. The debug communication channel allows a program running on the target to communicate with the host debugger or another separate host without stopping the program flow or entering the debug state.Embedded Trace BufferThe Embedded Trace Module (ETM) is connected directly to the ARM core. It compresses the trace information and exports it through a narrow trace port. An internal Embedded Trace Buffer of 2 k 24 bits captures the trace information under software debugger control. Data from the Embedded Trace Buffer is recovered by the debug software through the JTAG port.UM10326 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved.User manual Rev. 3 22 July 2011 10 of 721NXP Semiconductors UM10326Chapter 1: LPC32x0 Introductory informationThe trace contains information about when the ARM core switches between states. Instruction trace (or PC trace) shows the flow of execution of the processor and provides a list of all the instructions that were executed. Instruction trace is significantly compressed by only broadcasting branch addresses as well as a set of status signals that indicate the pipeline status on a cycle by cycle basis. For data accesses either data or address or both can be traced.1.7 AHB Bus ArchitectureThe LPC32x0 has a multi-layer AHB matrix for inter-block communication. AHB is an ARM defined high-speed bus, which is part of the ARM bus architecture. AHB is a high-bandwidth low-latency bus that supports multi-master arbitration and a bus grant/request mechanism. For systems that have only one (CPU), or two (CPU and DMA) bus masters a simple AHB works well. However, if a system requires multiple bus masters and the CPU needs access to external memory, a single AHB bus can cause a bottleneck. In addition to the AHB matrix the LPC32x0 has two peripheral busses the APB and the FAB. A short description of the busses are described in the following sections.1.7.1 AHB MatrixTo increase performance, the LPC32x0 uses an expanded AHB architecture known as Multi-layer AHB. A Multi-layer AHB replaces the request/grant and arbitration mechanism used in a simple AHB with an interconnect matrix that moves arbitration out toward the slave devices. Thus, if a CPU and a DMA controller want access to the same memory, the interconnect matrix arbitrates between the two when granting access to the memory. This advanced architecture allows simultaneous access by bus masters to different resources with an increase in arbitration complexity. In this architectural implementation, removing guaranteed central arbitration and allowing more than one bus master to be active at the same time provides better overall micro controller performance. In the LPC32x0, the Multi-Layer AHB system has a separate bus for each of seven AHB Masters: CPU Data bus CPU Instruction bus General purpose DMA Master 0 General purpose DMA Master 1 Ethernet Controller USB Controller LCD ControllerThere are no arbitration delays unless two masters attempt to access the same slave at the same time.1.7.2 APB busMany peripheral functions are accessed by on-chip APB busses that are attached to the higher speed AHB bus. The APB bus performs reads and writes to peripheral registers in three peripheral clocks.UM10326 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved.User manual Rev. 3 22 July 2011 11 of 721NXP Semiconductors UM10326Chapter 1: LPC32x0 Introductory information1.7.3 FAB busSome peripherals are placed on a special bus called FAB that allows faster CPU access to those peripheral functions. A write access to FAB peripherals takes a single AHB clock and a read access to FAB peripherals takes two AHB clocks.1.8 Internal Memory On-Chip SRAM (IRAM)On-chip SRAM may be used for code and/or data storage. The SRAM may be accessed as 8, 16, or 32 bit memory. The LPC32x0 provides 256 kB of internal SRAM.On-Chip ROMAn on-chip 16 kB ROM contains the necessary code to load code from one of four sources, UART5, SSP0 (in SPI mode), EMC (CS0 SRAM) memory, or NAND FLASH, and copy it to IRAM. The code loaded to IRAM will typically be FLASH programming software. The boot process is handled by an on-chip bootloader that looks at the state of a pin (GPI_1) to see if it should attempt to download a program over a serial link (UART5) or one of three alternate sources, SSP0, EMC (CS0) memory, and NAND Flash and then branch to its entry point and execute. If the GPI_1 pin is low it will boot from UART5 (SERVICE_N boot), if it is set high, it will test in sequence each of the remaining possible sources for the presence of download code. The bootloader will first test for boot code in the SSP0, if this fails it will test for boot code in EMC memory and if this fails it will test the NAND Flash for boot code.The bootloader reserves a small portion (8kB from 0x0000 E000 to 0x0000 FFFF) on the Internal SRAM during the boot process. This space is no longer used once the boot loader has passed control to the downloaded code.1.9 External Memory InterfacesThe LPC32x0 includes three external memory interfaces. an interface supporting two NAND Flash controllers, an Multi-level and a Single-level. an external memory controller (EMC) interface for SDRAM, DDR SDRAM, and Static Memory devices. a Secure Digital Memory Controller (SDCARD) interface.1.9.1 NAND flash controller InterfaceThe LPC32x0 includes two NAND flash controllers, one for multi-level NAND flash devices and one for single-level NAND flash devices. The two NAND flash controllers use the same pins to interface to external NAND flash devices, so only one interface is active at a time.Multi-Level Cell (MLC) NAND flash controllerThe MLC NAND flash controller interfaces to either multi-level or single-level NAND flash devices. An external NAND flash device is used to allow the bootloader to automatically load a portion of the application code into internal SRAM for execution following reset.UM10326 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved.User manual Rev. 3 22 July 2011 12 of 721NXP Semiconductors UM10326Chapter 1: LPC32x0 Introductory informationThe MLC NAND flash controller supports up to 2 Gbit devices with small (528 byte) or large (2114 byte) pages. Programmable NAND timing parameters allow support for a variety of NAND flash devices. A built-in Reed-Solomon encoder/decoder provides error detection and correction capability. A 528 byte data buffer reduces the need for CPU supervision during loading. The MLC NAND flash controller also provides DMA support.Single-Level Cell (SLC) NAND flash controllerThe SLC NAND flash controller interfaces to single-level NAND flash devices up to 2 Gbit in size. DMA page transfers are supported, including a 20 byte DMA read and write FIFO. Hardware support for ECC (Error Checking and Correction) is included for the main data area. Software can correct a single bit error.1.9.2 External Memory Controller InterfaceThe LPC32x0 includes an External Memory Controller (EMC) that supports SDRAM, DDR SDRAM, and Static memory devices. The EMC provides an interface between the system bus and external (off-chip) memory devices. The controller supports SDR SDRAM devices of 64/128/256/512 Mbit in size, as well as 16-bit wide data bus DDR SDRAM devices of 64/128/256/512 Mbit in size. Two dynamic memory chip selects are supplied, supporting two groups of SDRAM EMC_DYCS0_N in the address range 0x8000 0000 to 0x9FFF FFFF EMC_DYCS1_N in the address range 0xA000 0000 to 0xBFFF FFFF The memory controller also supports 8-bit, 16-bit, and 32-bit wide asynchronous static memory devices, including RAM, ROM, and Flash, with or without asynchronous page mode. Four static memory chip selects are supplied for SRAM devices. EMC_CS0_N in the address range 0xE000 0000 to 0xE0FF FFFF EMC_CS1_N in the address range 0xE100 0000 to 0xE1FF FFFF EMC_CS2_N in the address range 0xE200 0000 to 0xE2FF FFFF EMC_CS3_N in the address range 0xE300 0000 to 0xE3FF FFFF The SDRAM controller uses three data ports to allow simultaneous requests from multiple on-chip AHB bus masters and has the following features. Dynamic memory interface supports SDRAM, DDR-SDRAM, and low-power variants. It also supports Micron SyncFlash types of memory Read and write buffers to reduce latency and improve performance Static memory features include asynchronous page mode read programmable wait states bus turnaround cycles output enable and write enable delays extended wait Power-saving modes dynamically control EMC_CKE and EMC_CLK Dynamic memory self-refresh mode supported by softwareUM10326 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved.User manual Rev. 3 22 July 2011 13 of 721NXP Semiconductors UM10326Chapter 1: LPC32x0 Introductory information Controller supports 2K, 4K, and 8K row address synchronous memory parts. That is, typical 512Mb, 256Mb, 128Mb, and 16Mb parts, with 8, 16, or 32 DQ (data) bits per device Two reset domains enable dynamic memory contents to be preserved over a soft reset This controller does NOT Support Synchronous static memory devices (burst mode devices)1.9.3 SD card controllerThe SD interface allows access to external SD memory cards. The SD card interface conforms to the SD Memory Card Specification Version 1.01.Features Conformance to the SD Memory Card Specification Version 1.01. DMA is supported through the system DMA controller. Provides all functions specific to the SD memory card. These include the clock generation unit, power management control, command and data transfer.1.10 AHB Master PeripheralsThe LPC32x0 implements four AHB master peripherals, which include a General Purpose Direct Memory Access (GPDMA) controller, a 10/100 Ethernet Media Access Controller (MAC), a Universal Serial Bus (USB) controller, and an LCD Controller. Each of these four peripherals contain an integral DMA controller optimized to support the demands of the peripheral.1.10.1 General purpose DMA controller (GPDMA)The GPDMA controller allows peripheral-to memory, memory-to-peripheral, peripheral-to-peripheral, and memory-to-memory transactions. Each DMA stream provides unidirectional serial DMA transfers for a single source and destination. For example, a bidirectional port requires one stream for transmit and one for receives. The source and destination areas can each be either a memory region or a peripheral, and can be accessed through the same AHB master or one area by each master. The DMA controller supports the following peripheral device transfers. Secure Digital (SD) Memory interface 14-clock UARTs I2S0 and I2S1 Ports SPI1 and SPI2 Interfaces SSP0 and SSP1 interfaces MemoryThe DMA controls eight DMA channels with hardware prioritization. The DMA controller interfaces to the system via two AHB bus masters, each with a full 32-bit data bus width. DMA operations may be set up for 8-bit, 16-bit, and 32-bit data widths, and can be either big-endian or little-endian. Incrementing or non-incrementing addressing for source and UM10326 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved.User manual Rev. 3 22 July 2011 14 of 721NXP Semiconductors UM10326Chapter 1: LPC32x0 Introductory informationdestination are supported, as well as programmable DMA burst size. Scatter or gather DMA is supported through the use of linked lists. This means that the source and destination areas do not have to occupy contiguous areas of memory.1.10.2 Ethernet MACThe Ethernet block contains a full featured 10 Mbit/s or 100 Mbit/s Ethernet MAC designed to provide optimized performance through the use of DMA hardware acceleration. Features include a generous suite of control registers, half or full duplex operation, flow control, control frames, hardware acceleration for transmit retry, receive packet filtering and wake-up on LAN activity. Automatic frame transmission and reception with scatter-gather DMA off-loads many operations from the CPU. The Ethernet block and the CPU share a dedicated AHB subsystem that is used to access the Ethernet SRAM for Ethernet data, control, and status information. All other AHB traffic in the LPC32x0 takes place on a different AHB subsystem, effectively separating Ethernet activity from the rest of the system. The Ethernet DMA can also access off-chip memory via the EMC, as well as the SRAM located on another AHB. However, using memory other than the Ethernet SRAM, especially off-chip memory, will slow Ethernet access to memory and increase the loading of its AHB. The Ethernet block interfaces between an off-chip Ethernet PHY using the Media Independent Interface (MII) or Reduced MII (RMII) protocol and the on-chip Media Independent Interface Management (MIIM) serial bus.Features Ethernet standards support: Supports 10 Mbit/s or 100 Mbit/s PHY devices including 10 Base-T, 100 Base-TX, 100 Base-FX, and 100 Base-T4 Fully compliant with IEEE standard 802.3 Fully compliant with 802.3x Full Duplex Flow Control and Half Duplex back pressure Flexible transmit and receive frame options Virtual Local Area Network (VLAN) frame support Memory management Independent transmit and receive buffers memory mapped to shared SRAM DMA managers with scatter/gather DMA and arrays of frame descriptors Memory traffic optimized by buffering and pre-fetching Enhanced Ethernet features: Receive filtering Multicast and broadcast frame support for both transmit and receive Optional automatic Frame Check Sequence (FCS) insertion with Circular Redundancy Check (CRC) for transmit Selectable automatic transmit frame padding Over-length frame support for both transmit and receive allows any length frames Promiscuous receive mode Automatic collision back-off and frame retransmissionUM10326 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved.User manual Rev. 3 22 July 2011 15 of 721NXP Semiconductors UM10326Chapter 1: LPC32x0 Introductory information Includes power management by clock switching. Wake-on-LAN power management support allows system wake-up: using the receive filters or a magic frame detection filter Physical interface Attachment of external PHY chip through standard MII or RMII interface PHY register access is available via the MIIM interface1.10.3 USB interfaceThe LPC32x0 supports USB in either DEVICE, HOST, or OTG configuration.1.10.3.1 USB DEVICE controllerThe USB device controller enables 12 Mbit/s data exchange with a USB host controller. It consists of register interface, serial interface engine, endpoint buffer memory and DMA controller. The serial interface engine decodes the USB data stream and writes data to the appropriate end point buffer memory. The status of a completed USB transfer or error condition is indicated via status registers. An interrupt is also generated if enabled. The DMA controller when enabled transfers data between the endpoint buffer and the USB RAM.Features Fully compliant with USB 2.0 full-speed specification. Supports 32 physical (16 logical) endpoints. Supports control, bulk, interrupt and isochronous endpoints. Scalable realization of endpoints at run time. Endpoint maximum packet size selection (up to USB maximum specification) by software at run time. RAM message buffer size based on endpoint realization and maximum packet size. Supports bus-powered capability with low suspend current. Supports DMA transfer on all non-control endpoints. One duplex DMA channel serves all endpoints. Allows dynamic switching between CPU controlled and DMA modes. Double buffer implementation for bulk and isochronous endpoints.1.10.3.2 USB HOST controllerThe host controller enables data exchange with various USB devices attached to the bus. It consists of register interface, serial interface engine and DMA controller. The register interface complies to the OHCI specification.Features OHCI compliant. OHCI specifies the operation and interface of the USB host controller and SW driver. The host controller has four USB states visible to the SW driver: USBOperational: Process lists and generate SOF tokens. USBReset: Forces reset signaling on the bus, SOF disabled.UM10326 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved.User manual Rev. 3 22 July 2011 16 of 721NXP Semiconductors UM10326Chapter 1: LPC32x0 Introductory information USBSuspend: Monitor USB for wake-up activity. USBResume: Forces resume signaling on the bus. HCCA register points to interrupt and isochronous descriptors list. ControlHeadED and BulkHeadED registers point to control and bulk descriptors list.1.10.3.3 USB OTG ControllerUSB OTG (On-The-Go) is a supplement to the USB 2.0 specification that augments the capability of existing mobile devices and USB peripherals by adding host functionality for connection to USB peripherals.Features Fully compliant with On-The-Go supplement to the USB Specification 2.0 Revision 1.0. Supports Host Negotiation Protocol (HNP) and Session Request Protocol (SRP) for dual-role devices under software control. HNP is partially implemented in hardware. Provides programmable timers required for HNP and SRP. Supports slave mode operation through AHB slave interface. Supports the OTG ATX from NXP (ISP 1301) or any external CEA-2011OTG specification compliant ATX.1.10.4 LCD ControllerThe LCD controller provides all of the necessary control signals to interface directly to a variety of color and monochrome LCD panels. Both STN (single and dual panel) and TFT panels can be operated. The display resolution is selectable and can be up to 1024 768 pixels. Several color modes are provided, up to a 24-bit true-color non-palettized mode.An on-chip 512-byte color palette allows reducing bus utilization (i.e. memory size of the displayed data) while still supporting a large number of colors. The LCD interface includes its own DMA controller to allow it to operate independently of the CPU and other system functions. A built-in FIFO acts as a buffer for display data, providing flexibility for system timing. Hardware cursor support can further reduce the amount of CPU time needed to operate the display. Features AHB bus master interface to access frame buffer Setup and control via a separate AHB slave interface Dual 16-deep programmable 64-bit wide FIFOs for buffering incoming display data Supports single and dual-panel monochrome Super Twisted Nematic (STN) displays with 4-bit or 8-bit interfaces Supports single and dual-panel color STN displays Supports Thin Film Transistor (TFT) color displays Programmable display resolution including, but not limited to: 320 200, 320 240, 640 200, 640 240, 640 480, 800 600, and 1024 768 Hardware cursor support for single-panel displays 15 gray-level monochrome, 3375 color STN, and 32 K color palettized TFT supportUM10326 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved.User manual Rev. 3 22 July 2011 17 of 721NXP Semiconductors UM10326Chapter 1: LPC32x0 Introductory information 1, 2, or 4 bits-per-pixel (bpp) palettized displays for monochrome STN 1, 2, 4, or 8 bpp palettized color displays for color STN and TFT 16 bpp true-color non-palettized, for color STN and TFT 24 bpp true-color non-palettized, for color TFT Programmable timing for different display panels 256 entry, 16-bit palette RAM, arranged as a 128 32-bit RAM Frame, line, and pixel clock signals AC bias signal for STN, data enable signal for TFT panels Supports little and big-endian, and Windows CE data formats LCD panel clock may be generated from the peripheral clock, or from a clock input pin1.11 System FunctionsTo enhance the performance of the LPC32x0 incorporates the following System Functions, an Interrupt Controller (INTC), a Watchdog timer, a Millisecond Timer, and several Power Control Features. These functions are described in the following sections1.11.1 Interrupt controllerThe interrupt controller is comprised of three basic interrupt controller blocks, supporting a total of 73 interrupt sources. Each interrupt source can be individually enabled/disabled and configured for high or low level triggering, or rising or falling edge triggering. Each interrupt may also be steered to either the FIQ or IRQ input of the ARM9. Raw interrupt status and masked interrupt status registers allow versatile condition evaluation. In addition to peripheral functions, each of the six general purpose input/output pins and 12 general purpose input pins are connected directly to the interrupt controller.1.11.2 Watchdog timerThe watchdog timer block is clocked by the main peripheral clock, which clocks a 32-bit counter. A match register is compared to the Timer. When configured for watchdog functionality, a match drives the match output low. The match output is gated with an enable signal that gives the opportunity to generate two type of reset signal: one that only resets chip internally, and another that goes through a programmable pulse generator before it goes to the external pin RESOUT_N and to the internal chip reset.Features Programmable 32-bit timer. Internally resets the device if not periodically reloaded. Flag to indicate that a watchdog reset has occurred. Programmable watchdog pulse output on RESOUT_N pin. Can be used as a standard timer if watchdog is not used. Pause control to stop counting when core is in debug state.UM10326 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved.User manual Rev. 3 22 July 2011 18 of 721NXP Semiconductors UM10326Chapter 1: LPC32x0 Introductory information1.11.3 Millisecond timerThe millisecond timer is clocked by 32 kHz RTC clock, so a pre-scaler is not needed to obtain a lower count rate.The millisecond timer includes three match registers that are compared to the Timer/Counter value. A match can generate an interrupt and the cause the Timer/Counter either continue to run, stop, or be reset.Features 32-bit Timer/Counter, running from the 32 kHz RTC clock. Counter or Timer operation. Three 32-bit match registers that allow: Continuous operation with optional interrupt generation on match. Stop timer on match with optional interrupt generation. Reset timer on match with optional interrupt generation. Pause control to stop counting when core is in debug state.1.11.4 Clocking and Power Control FeaturesClockingClocking in the LPC32x0 is designed to be versatile, so that system and peripheral requirements may be met, while allowing optimization of power consumption. Clocks to most functions may be turned off if not needed and some peripherals do this automatically. The LPC32x0 supports three operational modes, two of which are specifically designed to reduce power consumption. The modes are: RUN mode, Direct RUN mode, and STOP mode.These three operational modes give control over processing speed and power consumption. In addition, clock rates to different functional blocks may be changed by switching clock sources, reconfiguring PLL values, or altering clock divider configurations. This allows a trade-off of power versus processing speed based on application requirements. Crystal OscillatorThe main oscillator is the basis for the clocks most chip functions use by default. Optionally, many functions can be clocked instead by the output of a PLL (with a fixed 397x rate multiplication) which runs from the RTC oscillator. In this mode, the main oscillator may be turned off unless the USB interface is enabled. If a SYSCLK frequency other than 13 MHz is required in the application, or if the USB block is not used, the main oscillator may be used with a frequency of between 1 MHz and 20 MHz.PLLsThe LPC32x0 includes three PLLs: The 397x PLL allows boosting the RTC frequency to 13.008896 MHz for use as the primary system clock. The USB PLL provides the 48 MHz clock required by the USB block; and the HCLK PLL provides the basis for the CPU clock, the AHB bus clock, and the main peripheral clock.Power Control ModesUM10326 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved.User manual Rev. 3 22 July 2011 19 of 721NXP Semiconductors UM10326Chapter 1: LPC32x0 Introductory informationThe LPC32x0 supports three operational modes, two of which are specifically designed to reduce power consumption. The modes are: Run mode, Direct Run mode, and Stop mode.Run mode is the normal operating mode for applications that require the CPU, AHB bus, or any peripheral function other than the USB block to run faster than the main oscillator frequency. In Run mode, the CPU can run at up to 266 MHz and the AHB bus can run at up to 133 MHz.Direct Run mode allows reducing the CPU and AHB bus rates in order to save power. Direct Run mode can also be the normal operating mode for applications that do not require the CPU, AHB bus, or any peripheral function other than the USB block to run faster than the main oscillator frequency. Direct Run mode is the default mode following chip reset.Stop mode causes all CPU and AHB operation to cease, and stops clocks to peripherals other than the USB block.ResetReset is accomplished by an active low signal on the RESET_N input pin. A reset pulse with a minimum width of 10 main oscillator clocks after the oscillator is stable is required to guarantee a valid chip reset. At power-up, 10 milliseconds should be allowed for the oscillator to start up and stabilize after VDD reaches operational voltage. An internal reset with a minimum duration of 10 clock pulses will also be applied if the watchdog timer generates an internal device reset.The RESET_N pin is located in the RTC power domain. This means that the RTC power must be present for an external reset to have any effect. The RTC power domain nominally runs from 1.2 V, but the RESET_N pin can be driven as high as 1.95 V. The RESET_N pin is also used to isolate the RTC power domains from other on chip power domains.To minimize power consumption in the RTC power domain while power is removed from other power domains, the RESET_N pin must be held low.1.12 Serial communication peripheralsIn addition to the Ethernet MAC and USB interfaces there many more serial Communication peripheral interfaces on the LPC32x0. Here is a list of the available serial communication interfaces. seven UARTs; four Standard UARTs and three 14-clock UARTs two SPI Serial I/O Controllers two SSP Serial I/O Controllers two I2C Serial I/O Controllers two I2S Audio ControllersA short functional description of each of these peripherals is provided in the following sections.UM10326 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved.User manual Rev. 3 22 July 2011 20 of 721NXP Semiconductors UM10326Chapter 1: LPC32x0 Introductory information1.12.1 UARTsThe LPC32x0 contains seven UARTs. Four are standard UARTs, and three are 14-clock UARTs.Standard UARTs The four standard UARTs are downwards compatible with the INS16Cx50. These UARTs support rates up to 460800 bit/s from a 13 MHz peripheral clock.Features Each standard UART has 64 byte Receive and Transmit FIFOs. Receiver FIFO trigger points at 16 B, 32 B, 48 B, and 60 B. Transmitter FIFO trigger points at 0 B, 4 B, 8 B, and 16 B. Register locations conform to 16C550 industry standard. Each standard UART has a fractional rate pre-divider and an internal baud rate generator. The standard UARTs support three clocking modes: on, off, and auto-clock. The auto-clock mode shuts off the clock to the UART when it is idle. UART 6 includes an IrDA mode to support infrared communication. The standard UARTs are designed to support data rates of (2400, 4800, 9600, 19200, 38400, 57600, 115200, 230400, 460800) bit/s. Each UART includes an internal loopback mode.14-clock UARTs The three 14-clock UARTs are designed to support rates up to 921600 bit/s from a 13 MHz peripheral clock, for on-board communication in low noise conditions. This is accomplished by changing the oversampling from 16 to 14, and altering the rate generation logic.Features Each 14-clock UART has 64 byte Receive and Transmit FIFOs. Receiver FIFO trigger points at 1 B, 4 B, 8 B, 16 B, 32 B, and 48 B. Transmitter FIFO trigger points at 0 B, 4 B, and 8 B. Each 14-clock UART has an internal baud rate generator. The 14-clock UARTs are designed to support data rates of (2400, 4800, 9600, 19200, 38400, 57600, 115200, 230400, 460800, 921600) bit/s. Each UART includes an internal loopback mode.1.12.2 SPI serial I/O controllerThe LPC32x0 has two Serial Peripheral Interfaces (SPI). The SPI is a 3-wire serial interface that is able to interface with a large range of serial peripheral or memory devices (SPI mode 0 to 3 compatible slave devices).Only a single master and a single slave can communicate on the interface during a given data transfer. During a data transfer the master always sends a byte of data to the slave, and the slave always sends a byte of data to the master. The SPI implementation on the LPC32x0 does not support operation as a slave.UM10326 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved.User manual Rev. 3 22 July 2011 21 of 721NXP Semiconductors UM10326Chapter 1: LPC32x0 Introductory informationFeatures Supports slaves compatible with SPI modes 0 to 3. Half duplex synchronous transfers. DMA support for data transmit and receive. 1-bit to 16-bit word length. Choice of LSB or MSB first data transmission. 64 16-bit input or output FIFO. Bit rates up to 52 Mbit/s. Busy input function. DMA time out interrupt to allow detection of end of reception when using DMA. Timed interrupt to facilitate emptying the FIFO at the end of a transmission. SPI clock and data pins may be used as general purpose pins if the SPI is not used.1.12.3 SSP serial I/O ControllerThe LPC32x0 contains two SSP controllers. The SSP controller is capable of operation on a SPI, 4-wire SSI, or Microwire bus. It can interact with multiple masters and slaves on the bus. Only a single master and a single slave can communicate on the bus during a given data transfer. The SSP supports full duplex transfers, with frames of 4 bits to 16 bits of data flowing from the master to the slave and from the slave to the master. In practice, often only one of these data flows carries meaningful data.Features Compatible with Motorola SPI, 4-wire TI SSI, and National Semiconductor Microwire buses Synchronous serial communication Master or slave operation 8-frame FIFOs for both transmit and receive 4-bit to 16-bit frame Maximum SPI bus data bit rate of one half (Master mode) and one twelfth (Slave mode) of the input clock rate DMA transfers supported by GPDMA1.12.4 I2C-bus serial I/O controllerThere are two I2C-bus interfaces in the LPC32x0. The blocks for the I2C-bus are a master only implementation supporting the 400 kHz I2C-bus mode and lower rates, with 7-bit slave addressing. Each has a four word FIFO for both transmit and receive. An interrupt signal is available from each block.Features The two I2C-bus blocks are standard I2C-bus compliant interfaces that may be used in Single Master mode only. Programmable clock to allow adjustment of I2C-bus transfer rates. Bidirectional data transfer.UM10326 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved.User manual Rev. 3 22 July 2011 22 of 721NXP Semiconductors UM10326Chapter 1: LPC32x0 Introductory information Serial clock synchronization allows devices with different bit rates to communicate via one serial bus. Serial clock synchronization can be used as a handshake mechanism to suspend and resume serial transfer.1.12.5 I2S Audio ControllerThe I2S-bus provides a standard communication interface for digital audio applications The I2S-bus specification defines a 3-wire serial bus using one data line, one clock line, and one word select signal. Each I2S connection can act as a master or a slave. The master connection determines the frequency of the clock line and all other slaves are driven by this clock source. The two I2S interfaces on the LPC32x0 provides a separate transmit and receive channel, providing a total of two transmit channels and two receive channels. Each I2S channel supports monaural or stereo formatted data.Features The interface has separate input/output channels each of which can operate in masteror slave mode Capable of handling 8-bit, 16-bit, and 32-bit word sizes Mono and stereo audio data supported Supports standard pcm sampling frequencies (16, 22.05, 32, 44.1,48, 96) kHz Configurable word select period in master mode (separately for I2S input and output) Two 8 word FIFO data buffers are provided, one for transmit and one for receive Generates interrupt requests when buffer levels cross a programmable boundary Two DMA requests, controlled by programmable buffer levels. These are connected to the GPDMA block Controls include reset, stop and mute options separately for I2S input and I2S output1.13 General purpose I/OSome device pins that are not dedicated to a specific peripheral function have been designed to be general purpose inputs, outputs, or I/Os. Also, some pins may be configured either as a specific peripheral function or a general purpose input, output, or I/O. A total of 87 pins can potentially be used as general purpose input/outputs, general purpose outputs, and general purpose inputs.GPIO pins may be dynamically configured as inputs or outputs. Separate registers allow setting or clearing any number of GPIO and GPO outputs controlled by that register simultaneously. The value of the output register for standard GPIOs and GPO pins may be read back, as well as the current actual state of the port pins.There are 12 GPI, 24 GPO, and 38 GPIO pins. When the SDRAM bus is configured for 16 data bits, 13 of the remaining SDRAM data pins may be used as GPIOs.Features Bit-level set and clear registers allow a single instruction set or clear of any number of bits in one port.UM10326 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved.User manual Rev. 3 22 July 2011 23 of 721NXP Semiconductors UM10326Chapter 1: LPC32x0 Introductory information A single register selects direction for pins that support both input and output modes. Direction control of individual bits. For input/output pins, both the programmed output state and the actual pin state can be read. There are a total of 12 general purpose inputs, 24 general purpose outputs, and 38 general purpose input/outputs. Additionally, 13 SDRAM data lines may be used as GPIOs if a 16-bit SDRAM interface is used (rather than a 32-bit interface).1.14 Other PeripheralsIn addition to the Serial Communication peripherals and GPIO there are many general purpose peripherals available in the LPC32x0. Here is a list of the remaining peripherals on the LPC32x0. Keyboard Scanner 10-Bit Analog-to-Digital-Converter Real-Time Clock Millisecond Timer A High-speed Timer 4 General Purpose 32-Bit Timer/External Event Counters 2 simple Pulse-Width Modulators 2 Versatile Pulse-Width ModulatorsA short functional description of each of these peripherals is provided in the following sections.1.14.1 Keyboard ScannerThe keyboard scanner function can automatically scan a keyboard of up to 64 keys in an 8 8 matrix. In operation, the keyboard scanners internal state machine will normally be in an idle state, with all KEY_ROW[n] pins set high, waiting for a change in the column inputs to indicate that one or more keys have been pressed.When a keypress is detected, the matrix is scanned by setting one output pin high at a time and reading the column inputs. After de-bouncing, the keypad state is stored and an interrupt is generated. The keypad is then continuously scanned waiting for extra key pressed or key released. Any new keypad state is scanned and stored into the matrix registers followed by a new interrupt request to the interrupt controller. It is possible to detect and separate up to 64 multiple keys pressed.Features Supports up to 64 keys in 8 8 matrix. Programmable debounce period. A key press can wake up the CPU from Stop mode.UM10326 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved.User manual Rev. 3 22 July 2011 24 of 721NXP Semiconductors UM10326Chapter 1: LPC32x0 Introductory information1.14.2 10-bit ADCThe ADC is a three channel, 10-bit successive approximation ADC. The ADC may be configured to produce results with a resolution anywhere from 10 bits to 3 bits. When high resolution is not needed, lowering the resolution can substantially reduce conversion time.The analog portion of the ADC has its own power supply to enhance the low noise characteristics of the converter. This voltage is only supplied internally when the core has voltage. However, the ADC block is not affected by any difference in ramp-up time for VDD_AD and VDD_CORE voltage supplies.Features Measurement range of 0 V to VDD_AD (nominally 3 V). Low noise ADC. Maximum 10-bit resolution, resolution can be reduced to any amount down to 3 bits for faster conversion. Three input channels. Uses 32 kHz RTC clock1.14.3 RTCThe RTC runs at 32768 Hz using a very low power oscillator. The RTC counts seconds and can generate alarm interrupts that can wake up the device from Stop mode. The RTCCLK can also clock the 397x PLL, the Millisecond Timer, the ADC, the Keyboard Scanner and the PWMs. The RTC up-counter value represents a number of seconds elapsed since second 0, which is an application determined time. The RTC counter will reach maximum value after about 136 years. The RTC down-counter is initiated with all 1s.The Real-Time Clock has a special power domain independent of the rest of the chip and is designed both to be very low power as well as to work down to low voltage levels (follow a discharging battery). It has 32 words of SRAM that can be used to hold data between microcontroller power cycles. The RTC generates a one-second tick from a dedicated 32 kHz crystal oscillator and uses 32-bit registers which should never need resetting because it takes 136 years to reach the maximum register count.Two 32-bit match registers are readable and writable by the processor. A match will result in an interrupt provided that the interrupt is enabled. The ONSW output pin can also be triggered by a match event, and cause an external power supply to turn on all of the operating voltages, as a way to startup after power has been removed.The RTC block is implemented in a separate voltage domain. The block is supplied via a separate supply pin from a battery or other power source. The RTC block also contains 32 words (128 B) of very low voltage SRAM. This SRAM is able to hold its contents down to the minimum RTC operating voltage.Features Measures the passage of time in seconds. 32-bit up and down seconds counters. Ultra low power design to support battery powered systems.UM10326 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved.User manual Rev. 3 22 July 2011 25 of 721NXP Semiconductors UM10326Chapter 1: LPC32x0 Introductory information Dedicated 32 kHz oscillator. An output pin is included to assist in waking up when the chip has had power removed to all functions except the RTC. Two 32-bit match registers with interrupt option. 32 words (128 B) of very low voltage SRAM. The RTC and battery RAM power have an independent power domain and dedicated supply pins, which can be powered from a battery or power supply.1.14.4 High-speed timerThe high-speed timer block is clocked by the main peripheral clock. The clock is first divided down in a 16-bit programmable prescale counter which clocks a 32-bit Timer/Counter. The high-speed timer includes three match registers that are compared to the Timer/Counter value. A match can generate an interrupt and cause the Timer/Counter to either continue to run, stop, or be reset. The high-speed timer also includes two capture registers that can take a snapshot of the Timer/Counter value when an input signal transitions. A capture event may also generate an interrupt.Features 32-bit Timer/Counter with programmable 16-bit prescaler. Counter or Timer operation. Two 32-bit capture registers. Three 32-bit match registers that allow: Continuous operation with optional interrupt generation on match. Stop timer on match with optional interrupt generation. Reset timer on match with optional interrupt generation. Pause control to stop counting when core is in debug state.1.14.5 Millisecond timerThe Millisecond timer is clocked by the 32 kHz RTC clock. The registers are accessed on a different clock domain while the counter is counting on. This solution speeds up accesses to the Millisecond timer. Reads and writes to registers in the Millisecond timer are clocked by the HCLK. It takes a maximum of three HCLK before the writes are performed to the register. Features 32-bit Timer/Counters. Counter or Timer operation. Two 32-bit match registers that allow: Continuous operation with optional interrupt generation on match. Stop timer on match with optional interrupt generation. Reset timer on match with optional interrupt generation. Pause control to stop counting when core is in debug state.UM10326 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved.User manual Rev. 3 22 July 2011 26 of 721NXP Semiconductors UM10326Chapter 1: LPC32x0 Introductory information1.14.6 General purpose 32-bit timers/external event countersIn addition to the High Speed Timers the LPC32x0 includes four 32-bit Timer/Counters. The Timer/Counter is designed to count cycles of the system derived clock or an externally-supplied clock. It can optionally generate interrupts or perform other actions at specified timer values, based on four match registers. The Timer/Counter also includes four capture inputs to trap the timer value when an input signal transitions, optionally generating an interrupt.Features A 32-bit Timer/Counter with a programmable 32-bit prescaler Counter or Timer operation Up to four 32-bit capture channels per timer, that can take a snapshot of the timer value when an input signal transitions. A capture event may also optionally generate an interrupt Four 32-bit match registers that allow Continuous operation with optional interrupt generation on match Stop timer on match with optional interrupt generation Reset timer on match with optional interrupt generation Up to four external outputs corresponding to match registers, with the following capabilities Set LOW on match Set HIGH on match Toggle on match Do nothing on match1.14.7 8-bit Pulse width modulatorsThe LPC32x0 provides two 8-bit PWMs. They are clocked separately by either the main peripheral clock or the 32 kHz RTC clock. Both PWMs have a duty cycle programmable in 255 steps.Features Clocked by the main peripheral clock or the 32 kHz RTC clock. Programmable 4-bit prescaler. Duty cycle programmable in 255 steps. Output frequency up to 50 kHz when using a 13 MHz peripheral clock.1.14.8 Motor control pulse width modulatorThe Motor Control PWM (MCPWM) provides a set of features for three-phase AC and DC motor control applications in a single peripheral. At the same time, the MCPWM is highly configurable for other generalized timing, counting, capture, and compare applications.Features a 32-bit timer (TIM)UM10326 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved.User manual Rev. 3 22 July 2011 27 of 721NXP Semiconductors UM10326Chapter 1: LPC32x0 Introductory information a 32-bit period register (PER) a 32-bit pulse-width (match) register (PW) a 10-bit dead-time register (DT) and an associated 10-bit dead-time counter (DTIM) a 32-bit capture register two PWM (match) outputs (MCnA and MCnB) with opposite polarities a period interrupt, a pulse-width interrupt, and a capture interrupt1.14.9 Timer/counters and Real-Time Clock (RTC)A 32-bit Watchdog timer can generate internal as well as external resets. This capability allows synchronizing hardware system resets with internal ones. It serves to notify the system that a Watchdog Reset took place as well, which can be a sign that a software or hardware malfunction has occurred.1.15 System control and analog blocksThese are the blocks responsible for Clock generation, Reset, Power-up and Booting of the chip. There is also a 10-bit A/D converter on-chip that can run at up to 400 kHz sampling frequency.Clock generation: There are 2 main clock sources. The main crystal oscillator which shares the power domain of the microcontroller and a 32 kHz oscillator which drives the RTC and has its own power domain to keep the RTC alive. The main clock is multiplied up by a PLL to generate the high-speed CPU clock (max. 266 MHz). The RTC 32 kHz clock can also be multiplied up and used as an input to the main PLL so that the entire microcontroller can run from the RTC oscillator clock. Note that having two PLLs in series increases the jitter. Therefore the main crystal oscillator must be used to generate the USB clock. All other sub-systems can use the up-multiplied RTC clock.Boot-up on Powering on the chip is handled by an on-chip bootloader in ROM that looks at the state of a pin to see if it should attempt to download a program over a serial link (UART) or download a program from NAND Flash and then branch to it. Since the bootloader is in ROM it takes no user memory space.1.16 Debug and trace blocksThe microcontroller uses the standard ARM Enhanced JTAG Debug interface and, therefore, works with all standard ARM Development tools and hardware. Evaluation and development boards will be available from third party vendors. Software development and debugging tools and compilers from many vendors including ARM are available now and are well proven and mature.Embedded Trace support is provided through use of an ETB (Embedded Trace Buffer) RAM block which stores Trace information in on-chip RAM to be read out later via the CPU or the E-JTAG interface. This saves over 20 pins and enables true Real-time operation over the Trace window. Both Data and Instruction values can be traced. The trace information is saved to a 45-byte FIFO whose contents are transferred to the ETB in Real-time.UM10326 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved.User manual Rev. 3 22 July 2011 28 of 721NXP Semiconductors UM10326Chapter 1: LPC32x0 Introductory information1.17 Architectural power managementSeveral techniques are employed to allow full user control and customizing of power management as follows:1. Programmable clock enabling: Each peripheral and AHB matrix has a selectable Clock Enable bit. Thus the user can control which combinations of peripherals he enables for his particular system design and also when to enable them. Further, several peripherals have local power savings means (such as sleep modes) for more power savings.2. Low-Voltage Operation: The microcontroller is able to operate down to 0.9 Volts which reduces power tremendously (dynamic power is reduced by more than 50 % over 1.2 V operation) but requires operation at lower clock frequencies. This is suitable for very low power standby modes where system operation is required but performance can be compromised. The chip has a pin indicating that the chip is in a low power state so that the software can manage the system accordingly.3. PLL Clock control: The system has full control over the PLL multiplier and can therefore manage this aspect of power. Note that high-speed DRAM control must be taken into account so that Refresh rates are maintained in low speed modes.4. STOP mode: In this mode, the AHB matrix clock is disabled and the ARM clock is stopped. This is basically a Static-power-only mode.5. AHB Bus Matrix Clock Control: The ARM CPU clock can be divided by a factor of 2, 4, or 8 to derive the Peripheral Bus clock. This can be used as a power control mechanism if only low bandwidth transfers are to be handled. Note that the CPU can execute out of its local 64 kB of SRAM and does not need to access the DRAM continuously (of course it also has caches).6. System operation on RTC Clock: The RTC oscillator uses a 32 kHz crystal and runs at much lower power than the main crystal oscillator. A dedicated PLL is available which multiplies the RTC clock to a frequency where it can be further multiplied by the main PLL to generate the > 200 MHz CPU clock. In the case where the increased jitter caused by cascading PLLs is acceptable, this allows for lower power operation.7. Power domain switching: The RTC clock is on a separate power domain and also has 32 words of low-power SRAM. To save the maximum amount of power, the microcontroller power can be turned off altogether while keeping the RTC alive with some critical system information that can be saved between power cycles. This also eliminates leakage current power consumption.Using all the power management techniques allows for very flexible power management and permits power consumption to be tailored to required computational and peripheral operation requirements.UM10326 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved.User manual Rev. 3 22 July 2011 29 of 721 2.1 Bus architecture2.1.1 Block diagram, AHB matrix view UM10326Chapter 2: LPC32x0 Bus architecture and memory mapRev. 3 22 July 2011 User manualFig 3. LPC32x0 block diagram, AHB matrix viewARM 9EJSMMUD-Cache 32KB D-SideControllerI-Cache 32KB I-SideControllerData Instruction DMAcontrollerEthernet 10/100 MACUSB OTGcontroller LCDcontrollerEthernet PHYinterface USBtranceiver interface LCD panelinterfaceExternalMemorycontroller ROM16 KB SRAM256 KB MLCNAND SLCNAND SD CardSPIx 2I2Sx 2SSPx 2USBregs DMAregsETBregsSDRAM regsStandard UART x4I2C x2Timers x6Watchdog timer AHB to APBbridgeDebugSystemControl14C UART x3 KeyScanner 10-bitADC/TS UARTControlRTCPWM x2InterruptControlGPIOM1 M0 AHB to APBbridge AHB to APBbridgeMaster Layer 0 1 2 3 4 5 6Slave Port 0176532= Master/Slave connection supported by the multilayer AHB matrix32 bit, AHB MatrixAPB SlavesFAB SlavesAHB SlavesAHB Slaves APB SlavesPort 3Port 4Port 032-bit wideexternalmemoryETB ETM 9 VFP9LCDregsEthernet regs Motor Control PWMUM10326 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved.User manual Rev. 3 22 July 2011 30 of 721NXP Semiconductors UM10326Chapter 2: LPC32x0 Bus architecture and memory mapThe AHB Bus matrix connects AHB Masters to AHB slaves. One benefit of using an AHB bus matrix is parallel AHB transfers. The maximum parallelism occurs when the five masters perform an AHB transfer at the same time. However, the 3 AHB slave ports connected to the EMC controller converge to a single external memory device which limits memory access to one data transfer at a time. The EMC controller takes advantage of this architecture as it can overlap a data transfer with a command for the next transfer. The AHB matrix implements the AHB Lite bus standard. This means that there is no Bus request / grant arbitration and no split/retry signaling.2.1.2 Multi-layer AHB MatrixThe AHB bus matrix runs from HCLK and schedules Master requests for each slave port as follows:1. The master with the highest priority requesting the slave port will receive it regardless of the underlying uniform scheduling algorithm.2. If all masters have the same priority, then the master selected by the uniform scheduler is given the slave port.3. If no master is requesting the slave port, the slave port will generate idle cycles with all HSEL signals inactive. No address or data signals will toggle.4. When a master asserts its LOCK signal, once it has been granted the slave port it will remain granted until the lock is removed.Whenever a slave ports current master issues a non sequential or idle access, and the LOCK signal is inactive, the slave port is re-arbitrated.The AHB matrix has the following attributes: No memory space access check. (All the 4 GB address range is valid). 32 bit wide data busses. Master bus access control enabled. Each master only has access to the slave ports shown in the block diagram.The Master bus access control functionality is mainly used for stopping masters from doing AHB transfers when the ARM enters debug mode. The ARM DBG_ACK signal is used to activate the disable_req signals going into the AHB matrix. The AHB matrix allows the current transfer for each master to complete before it inactivates the AHB_GRANT signal to the master, so that no data is lost. It also activates the disable_grant signal for the ARM to read status. Software may also force the AHB matrix to disable AHB_GRANT to the masters.Note: A Fetch Abort or a Data Abort resulting from an access to any AHB slave is considered a software bug. Software must treat such exceptions as unrecoverable errors.2.1.3 Bus bridges2.1.3.1 AHB to FAB bridgeA Fast Access Bus (FAB) bridge interfaces a number of FAB slaves to AHB matrix Slave Port 7. The registers in these slaves are clocked by HCLK. UM10326 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved.User manual Rev. 3 22 July 2011 31 of 721NXP Semiconductors UM10326Chapter 2: LPC32x0 Bus architecture and memory mapWrite accesses to FAB peripherals take a single HCLK cycle, read accesses take two HCLK cycles. Write accesses are accomplished using write holding registers. Read accesses are done directly from the slave. Logic is included to prevent read-back of registers that have a write in the process of being completed.FAB slaves are clocked by PERIPH_CLK even though they are connected to a bus running at full HCLK speed.2.1.3.2 AHB to APB bridgesThere are two AHB to APB bridges, one on Slave Port 7 and one on Slave Port 5.2.1.4 Transfer performance2.1.4.1 AHB Matrix throughputBandwidth is reduced if two or more Masters compete for the same slave layer. This situation is likely to happen on SDRAM accesses even though there are 3 SDRAM slave ports. To maximize CPU performance, one Slave Port is assigned to instruction fetch, and another to data access.2.1.4.2 SDRAM throughputThe SDRAM controller will have the highest throughput if many AHB slave ports are used because it can buffer single write accesses and it may overlap the end of one transfer with the start of a new one.2.1.5 ArbitrationIf there is more than one master accessing the same slave port, the AHB matrix schedules the accesses using an arbiter. The arbitration scheme used by the AHB matrix is a round robin scheduling. In general this is a good algorithm for avoiding extremely long latencies since no master can occupy any slave port for more than one burst period. The longest burst is 8. Masters with the same priority level will be arbitrated using round robin.In addition to the AHB matrix arbiter, the SDRAM controller also has an arbiter prioritizing among requests from the four AHB data ports. AHB port 0 has highest priority. In addition, each data port has a time-out counter with programmable time-out. Whenever a time-out occurs, the priority is raised.2.1.6 Data coherency2.1.6.1 SDRAMData coherency between different AHB data ports is only guaranteed if write buffering is disabled. This is done by programming the E bit to 0 in EMCAHBControl0-4 registers. However this will reduce write performance.2.1.6.2 ARM CPUAny cache region defined as copy-back may have a data coherency problem. There is no insurance that other masters will access correct data. A solution for this configuration is to change the cache policy to write-through for the data region or to force cache write-backs using software before allowing access by the other masters.UM10326 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved.User manual Rev. 3 22 July 2011 32 of 721NXP Semiconductors UM10326Chapter 2: LPC32x0 Bus architecture and memory map2.2 Memory mapFigure 4 shows the memory map for the AHB matrix. This view represents all address sources except the USB interface. 2.2.1 CPU memory spaceThe following table gives the address space for the LPC32x0, as seen by the AHB matrix.Fig 4. Overall LPC32x0 memory mapon-chip memory0x4000 00000x0000 00000.0 GB768 MB1.0 GB4.0 GBperipherals on AHBmatrix slave port 50x0FFF FFFF0x2000 00000x3000 00000x2FFF FFFF0x1FFF FFFF0x8000 00000xFFFF FFFF0x1000 00000x3FFF FFFF0x4FFF FFFF0x5000 00000x7FFF FFFFperipherals on AHBmatrix slave port 6peripherals on AHBmatrix slave port 7IROM or IRAM 0x0000 0000 to 0x03FF FFFFdummy for DMA garbage 0x0400 0000 to 0x07FF FFFFIRAM 0x0800 0000 to 0x0BFF FFFFIROM 0x0C00 0000 to 0x0FFF FFFFAHB peripherals 0x2000 0000 to 0x2007 FFFFAHB peripherals 0x200A 0000 to 0x200B FFFFAPB peripherals 0x2008 0000 to 0x2009 FFFF(RESERVED)AHB peripherals 0x3000 0000 to 0x31FF FFFF(RESERVED)FAB peripherals 0x4000 0000 to 0x4007 FFFFAPB peripherals 0x4008 0000 to 0x400F FFFF(RESERVED)(RESERVED)(RESERVED)(RESERVED)(RESERVED)0x9FFF FFFF0xA000 00000xBFFF FFFF0xC000 00000xDFFF FFFF0xE000 00000xE0FF FFFF0xE100 00000xE1FF FFFF0xE200 00000xE2FF FFFF0xE300 00000xE3FF FFFF0xE400 00002.0 GBEMC_DYSC0EMC_DYSC1EMC_CS0EMC_CS1EMC_CS2EMC_CS3off-chip memoryUM10326 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved.User manual Rev. 3 22 July 2011 33 of 721NXP Semiconductors UM10326Chapter 2: LPC32x0 Bus architecture and memory map 2.2.2 Peripheral addressesTable 4 shows the base addresses of the peripheral devices present on the LPC32x0. Table 3. Overview of LPC32x0 memory spaceAddress Function0x0000 0000 to 0x0FFF FFFFOn-Chip Memory on AHB matrix slave 3 (see Figure 3):0x0000 0000 to 0x03FF FFFF = IROM or IRAM.0x0400 0000 to 0x07FF FFFF = Dummy space for DMA. Reads as all zeroes, write has no effect.0x0800 0000 to 0x0BFF FFFF = IRAM (128 - 256 kB populated).0x0C00 0000 to 0x0FFF FFFF = IROM (16 kB populated).0x1000 0000 to 0x1FFF FFFFReserved0x2000 0000 to 0x2FFF FFFFPeripherals on AHB matrix slave 5 (see Figure 3):0x2000 0000 to 0x2007 FFFF = AHB peripherals.0x2008 0000 to 0x2009 FFFF = APB peripherals.0x200A 0000 to 0x200B FFFF = AHB peripherals.0x3000 0000 to 0x3FFF FFFFPeripherals on AHB matrix slave 6 (AHB peripherals)0x4000 0000 to 0x4FFF FFFFPeripherals on AHB matrix slave 7 (see Figure 3):0x4000 0000 to 0x4007 FFFF = FAB peripherals.0x4008 0000 to 0x400F FFFF = APB peripherals.0x5000 0000 to 0x7FFF FFFFReserved0x8000 0000 to 0xFFFF FFFFOff-Chip MemoryTwo dynamic memory banks, 512 MB each0x8000 0000 - 0x9FFF FFFF EMC_DYCS0_N0xA000 0000 - 0xBFFF FFFF EMC_DYCS1_NFour static memory banks, 16 MB each0xE000 0000 0xE0FF FFFF EMC_CS00xE100 0000 0xE1FF FFFF EMC_CS10xE200 0000 0xE2FF FFFF EMC_CS20xE300 0000 0xE3FF FFFF EMC_CS3Accessed as follows: ARM 9 instruction fetch via AHB matrix slave port 0 to EMC port 3. ARM 9 data access via AHB matrix slave port 1 to EMC port 4. DMA controller (both channels) via AHB matrix slave port 2 to EMC port 0.Table 4. Peripheral devices on the LPC32x0Base Address Peripheral AHB Slave Port Peripheral Type0x2002 0000 SLC NAND Flash controller 5 AHB0x2008 4000 SSP0 5 APB0x2008 8000 SPI1 5 APB0x2008 C000 SSP1 5 APB0x2009 0000 SPI2 5 APB0x2009 4000 I2S 0 5 APBUM10326 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved.User manual Rev. 3 22 July 2011 34 of 721NXP Semiconductors UM10326Chapter 2: LPC32x0 Bus architecture and memory map0x2009 8000 SD card interface 5 APB0x2009 C000 I2S 1 5 APB0x200B 0000 MLC NAND Flash controller 5 AHB0x3100 0000 DMA controller 6 AHB0x3102 0000 USB interface 6 AHB0x3104 0000 LCD interface 6 AHB0x3106 0000 Ethernet interface 6 AHB0x3108 0000 EMC configuration 6 AHB0x310C 0000 ETB configuration 6 AHB0x310E 0000 ETB data 6 AHB0x4000 4000 System control functions 7 FAB0x4000 8000 Master interrupt controller (MIC) 7 FAB0x4000 C000 Slave interrupt controller 1 (SIC1) 7 FAB0x4001 0000 Slave interrupt controller 2 (SIC2) 7 FAB0x4001 4000 UART 1 7 FAB0x4001 8000 UART 2 7 FAB0x4001 C000 UART 7 7 FAB0x4002 4000 RTC 7 FAB0x4002 4080 RTC internal SRAM 7 FAB0x4002 8000 GPIO 7 FAB0x4002 C000 Timer 4 7 FAB0x4003 0000 Timer 5 7 FAB0x4003 4000 Millisecond timer 7 FAB0x4003 8000 High speed timer 7 FAB0x4003 C000 Watchdog timer 7 FAB0x4004 0000 Debug 7 FAB0x4004 4000 Timer0 7 FAB0x4004 8000 ADC (Touch screen controller) 7 FAB0x4004 C000 Timer1 7 FAB0x4005 0000 Keyboard Scan 7 FAB0x4005 4000 UART control register (general UART control)7 FAB0x4005 8000 Timer2 7 FAB0x4005 C000 PWM1 and PWM2 7 FAB0x4006 0000 Timer3 7 FAB0x4008 0000 UART 3 7 APB0x4008 8000 UART 4 7 APB0x4009 0000 UART 5 7 APB0x4009 8000 UART 6 7 APBTable 4. Peripheral devices on the LPC32x0Base Address Peripheral AHB Slave Port Peripheral TypeUM10326 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved.User manual Rev. 3 22 July 2011 35 of 721NXP Semiconductors UM10326Chapter 2: LPC32x0 Bus architecture and memory map0x400A 0000 I2C1 7 APB0x400A 8000 I2C2 7 APB0x400E 8000 MCPWM 7 APBTable 4. Peripheral devices on the LPC32x0Base Address Peripheral AHB Slave Port Peripheral TypeUM10326 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved.User manual Rev. 3 22 July 2011 36 of 721 3.1 System control blockThe System Control Block includes system features and control registers that are not directly related to specific chip functions. These include chip reset and Boot Map control.3.1.1 ResetReset is accomplished by an active LOW signal on the RESET_N input pin. A reset pulse with a minimum width of 10 oscillator clocks after the oscillator is stable is required to guarantee a valid chip reset. At power-up, 10 milliseconds should be allowed for the oscillator to start up and stabilize after VDD reaches operational voltage.An internal reset with a minimum duration of 10 clock pulses will also be applied if the watchdog generates an internal device reset. Details of Watchdog Timer operation may be found in the Watchdog Timer chapter.Most on-chip registers are loaded with a pre-defined value upon occurrence of an internal or external reset. Note that only a few bits in the Real Time Clock are affected by an internal or external reset. Other RTC registers and bits are not modified by reset so that the RTC can continue operation independent of chip reset. 3.1.2 Boot Map control register (BOOT_MAP - 0x4000 4014)On reset, the ARM executes code beginning at address 0x0000 0000. The Boot Map control register aliases either Internal ROM or Internal RAM to start at address 0x0000 0000 to provide support options for the ARM vector table. By default this address maps to IROM memory containing instructions from the boot code. Both IROM and IRAM are available at other addresses at all times (see the Bus Architecture and Memory Map chapter). IRAM can be mapped in during the boot process so the application has IRAM for all exception vectors. Code execution must not be within the switched address space when the memory switch takes place.UM10326Chapter 3: LPC32x0 System control blockRev. 3 22 July 2011 User manualFig 5. Power-up resetOscillator startup timeSYSCLKReset_nMainOscillatorPowerMinimum 10clock timesUM10326 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved.User manual Rev. 3 22 July 2011 37 of 721NXP Semiconductors UM10326Chapter 3: LPC32x0 System control block Additional information about the Boot procedure may be found in the Boot Process chapter.3.1.3 Unique serial ID registers (SERIAL_ID0 - 0x4000 4130 to SERIAL_ID3 - 0x4000 413C)Every LPC32x0 chip contains a unique 128-bit serial ID number hard-coded into the four SERIAL_ID registers. Table 5. Boot map control register (BOOT_MAP - 0x4000 4014)Bit Function Reset value0 0 = IROM located at address 0x0000 00001 = IRAM located at address 0x0000 00000Table 6. Serial ID register (SERIAL_ID0 - 0x4000 4130)Bit Access Function Reset value31:0 RO Serial ID, bits 31 to 0. part dependentTable 7. Serial ID register (SERIAL_ID1 - 0x4000 4134)Bit Access Function Reset value31:0 RO Serial ID, bits 63 to 32. part dependentTable 8. Serial ID register (SERIAL_ID2 - 0x4000 4138)Bit Access Function Reset value31:0 RO Serial ID, bits 95 to 64. part dependentTable 9. Serial ID register (SERIAL_ID3 - 0x4000 413C)Bit Access Function Reset value31:0 RO Serial ID, bits 127 to 96. part dependentUM10326 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved.User manual Rev. 3 22 July 2011 38 of 721 4.1 IntroductionThe LPC32x0 provides detailed control of clock usage among chip functions, allowing fine tuning of power consumption in the target application. Most clocks can be disabled either globally or at an individual peripheral. Clock frequencies can be separately controlled through the use of PLLs, multiplexers, and dividers.This section describes the generation of the various clocks needed by the LPC32x0 and options of clock source selection, as well as power control and wake-up from reduced power modes. Functions described in the following subsections include: Clocking and power control Clock identification Default clock settings Power reduction modes RUN, Direct RUN, and STOP modes Start controller Autoclocking Oscillators PLLs Clock dividers Clock usage in peripheral blocks Register description4.2 OverviewClocking in the LPC32x0 is versatile, so system and peripheral requirements may be met while still permitting optimization of power consumption. By default, the Main Oscillator is the source for the clocks used in most chip functions. Optionally, many functions can be clocked by the output of a PLL (with a fixed 397x rate multiplication) which is sourced from the Real Time Clock oscillator. In this mode, the Main Oscillator may be turned off unless the USB interface is enabled.Whichever clock source is selected, a programmable PLL allows the CPU clock to be raised as high as 266 MHz. The AHB bus clock (HCLK) can be derived from that clock and may be as high as 133 MHz.Clocks to most functions may be individually turned off when those features are not required in the application. In addition, many functions have dedicated clock dividers that may be tuned to provide the required performance without using power unnecessarily.Another form of power reduction is provided in the form of alternate operational modes. Typically, the CPU is operated from a high frequency clock provided by a PLL. This option is called RUN Mode. At times when the application does not require such performance, UM10326Chapter 4: LPC32x0 Clocking and power controlRev. 3 22 July 2011 User manualUM10326 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved.User manual Rev. 3 22 July 2011 39 of 721NXP Semiconductors UM10326Chapter 4: LPC32x0 Clocking and power controlthe PLL may be bypassed and the CPU run at a slower rate. This is called Direct RUN Mode. When the CPU has nothing to do but wait for an external event, clocking can be stopped entirely until the event occurs. This is called STOP mode.Switching between RUN mode and Direct RUN Mode is accomplished entirely under software control. Since the CPU is halted in STOP Mode, hardware must restart clocking when a selected event occurs. This hardware is called the Start Controller.Details of clocking and power control are found in the following section.4.3 Clocking and power controlThe LPC32x0 includes three operational modes that provide control over processing speed and power consumption. In addition, clock rates to different functional blocks may be controlled by changing clock sources, re-configuring PLL values, or altering clock divider configurations. This allows a trade-off of power versus processing speed based on application requirements. The LPC32x0 also implements a separate power domain in order to allow turning off power to the bulk of the device while maintaining operation of the Real Time Clock and a small static RAM.Power consumption is determined primarily by the clock frequencies selected and by which functional blocks are being clocked at any time. Therefore, to minimize power consumption, it is important to turn off clocks to any unused functional blocks. Most functional blocks have a clock enable/disable control contained in a register that is described in this chapter. Some blocks also have more elaborate clock controls.4.3.1 Clock identificationAll clocks in the LPC32x0 are derived from one of two base clock sources. These are OSC_CLK, the output of the main oscillator, and the 13.008896 MHz clock, which is generated by multiplying the 32 kHz RTC clock by 397. This clock is referred to as the 13 clock.The 13 MHz clock has a nominal frequency of 13.008896 MHz and has more jitter than the crystal-based OSC_CLK. Table 10 describes the major clocks in the LPC32x0 and summarizes how they are used. Figure 6 shows the major clock sources and their distribution in the LPC32x0. Table 10. Clocks and clock usageClock Name DescriptionOSC_CLK Main oscillator clock This clock runs from an external crystal in the range of 1 MHz to 20 MHz, typically 13 MHz.Used by: USB PLL, HCLK PLL, SYSCLK.RTC_CLK RTC clock Based on 32.768 kHz RTC oscillator.Used by: PLL397, Keyscan, ADC, PWM, MS Timer.SYSCLK System Clock Based on the main oscillator frequency (OSC_CLK) or the 13 MHz PLL397 output.Used by: clock generation logic.UM10326 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved.User manual Rev. 3 22 July 2011 40 of 721NXP Semiconductors UM10326Chapter 4: LPC32x0 Clocking and power controlThe Main oscillator and the RTC oscillator are shown at the lower left of the diagram. To the right of the Main oscillator may be found the clock mode logic, governed by the Start Controller. To the right of the clock mode logic is the HCLK PLL, clock switching logic and clock dividers, which provide clocks to most of the chip. Certain peripherals that are partly clocked by the RTC clock are shown at the lower right of Figure 6, while the USB block and its special clocking logic are shown at the top.ARM_CLK ARM Clock Based on the HCLK PLL output, SYSCLK, or PERIPH_CLK. Clock switching and HCLK PLL settings give ARM_CLK a very wide range of potential frequenciesUsed by: ARM9 CPU, MSSDCLK.HCLK AHB Bus Clock Based on PERIPH_CLK, SYSCLK, or HCLK PLL output divided by 1, 2, or 4.The AHB HCLK will typically be ARM_CLK divided by 2 but can run at the same frequency as the ARM or be divided by 4. The AHB HCLK frequency should not be set higher than 133 MHz or lower than SYSCLK.Used by: the AHB matrix and USB AHB, AHB slaves, FAB slaves, and APB slaves.PERIPH_CLK Peripheral Clock Based on SYSCLK or HCLK PLL output divided by 1 to 32. The maximum supported frequency of PERIPH_CLK is 20 MHz, typically 13 MHz.Typically, the PERIPH_CLK divider setting is chosen such that the PERIPH_CLK frequency remains the same when switching from Direct RUN mode to RUN mode, taking into account the HCLK PLL settings. This case occurs when the PERIPH_CLK frequency equals the SYSCLK frequency in RUN Mode.Used by: Many peripheral functions.clk48mhz USB 48 MHz clock Based on OSC_CLK.The USB interface must be run from a 48 MHz clock. The USB specification has strict requirements for frequency (500 ppm) and jitter (500 ps). For this reason, the crystal-based OSC_CLK is used as the source for this clock, and must be running while the USB is active. OSC_CLK is divided by n before it enters the USB PLL, which must multiply the frequency up to 48 MHz when the USB is to be used.Used by: USB block.DDRAM_CLK DDR SDRAM Clock Based on the HCLK PLL output or SYSCLK, divided by 1 or 2.If DDR SDRAM is used, this clock must be programmed to be twice the HCLK frequency. In RUN mode this is typically the same as the ARM_CLK frequency, but there is support for ARM clocking 4 times as fast as HCLK as well. In Direct RUN mode, it is not possible to generate this clock, so DDR SDRAM cannot be accessed in Direct RUN mode.Used by: EMC controller.MSSDCLK SD Card Clock Based on ARM_CLK, divided by 1 to 15.Table 10. Clocks and clock usageClock Name DescriptionUM10326 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved.User manual Rev. 3 22 July 2011 41 of 721NXP Semiconductors UM10326Chapter 4: LPC32x0 Clocking and power control Details of how clocks are enabled, switched, and otherwise controlled are contained in the remainder of this chapter.4.3.2 Default clock settingsAt reset, the main oscillator is turned on, providing OSC_CLK, which is routed to SYSCLK. SYSCLK is then routed to all of the clocks that are enabled at reset: ARM_CLK; HCLK; and PERIPH_CLK.Following is a summary of clock related settings and other information: OSC_CLK: Running, frequency determined by external crystal RTC_CLK: Running, frequency = 32.768 kHz if the correct external crystal is present SYSCLK: Running, frequency = OSC_CLK ARM_CLK: Running, frequency = OSC_CLK HCLK: Running, frequency = OSC_CLK PERIPH_CLK: Running, frequency = OSC_CLK clk48mhz: Stopped DDRAM_CLK: Stopped MSSDCLK: Stopped PLL397x: Running, frequency = 13.008896 MHz if RTC_CLK is running and loop control components are present HCLK PLL: Powered down, output offFig 6. Clock generation for the LPC32x0UM10326 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved.User manual Rev. 3 22 July 2011 42 of 721NXP Semiconductors UM10326Chapter 4: LPC32x0 Clocking and power control USB PLL: Powered down, output off4.4 Operational modesThe LPC32x0 supports three operational modes, two of which are specifically designed to reduce power consumption. The modes are: RUN mode, Direct RUN mode, and STOP mode.4.4.1 RUN modeRUN mode is