VE-ASP-DS-0002 (Thermal Analysis and Thermal Design - I3R1)

8/3/2019 VE-ASP-DS-0002 (Thermal Analysis and Thermal Design - I3R1)

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ASPERA-4 VenusExpressReference : VE-ASP-DS-0002Issue : 3 Rev. : 1Date : 2004-04-22Volume : - Page: 1

Thermal Analysis and Thermal Design

Name and function Date Signature

Prepared by: Vitaly Lugenkov 2004-04-22

Verified by: Stas Barabash, Co-PI 2004-04-27

Issued by: Herman Andersson, EM 2004-04-28


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CHANGE RECORD

VersionIssue Rev

Date Changed Paragraphs Remarks

1 1 All New document

1 2 All

1 3 All

2 0 2003-04-14 All New document

2 1 2003-11-26 Fig 2 and 3, Table 3

2 2 2004-04-08

3 1 2004-04-22 All New document


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TABLE OF CONTENT

1 THERMAL MODEL DESCRIPTION .................................................................... 41.1 Technical Basis.........................................................................................................................4

2 IMA THERMAL ANALYSIS CASES..................................................................... 82.1.1 IMA Cold case 1.......................................................................................................................82.1.2 IMA Cold case 2.......................................................................................................................82.1.3 IMA Cold case 2A, Sensitivity analysis ...................................................................................82.1.4 IMA Hot case..........................................................................................................................102.1.5 IMA Hot case, Sensitivity to radiator ageing..........................................................................10

3 MU THERMAL ANALYSIS CASES.....................................................................123.1.1 MU Cold case 1 ......................................................................................................................12

3.1.2 MU Cold case 2 ......................................................................................................................123.1.3 MU Cold case 2A, Sensitivity analysis ..................................................................................123.1.4 MU Hot case...........................................................................................................................143.1.5 MU Hot case, Sensitivity to radiator (SSM CC/UVS) and silver tape ageing........................14 3.1.6 MU Hot case A .......................................................................................................................14

4 THERMAL DESIGN REQUIREMENTS.............................................................16

5 IMA THERMAL DESIGN AND MATHEMATICAL MODEL.........................18

6 MU THERMAL DESIGN AND MATHEMATICAL MODEL.......................... 25

7 THERMAL CALCULATIONS RESULTS........................................................... 347.1 Predicted temperatures for IMA nodes...................................................................................34

7.1.1 IMA Cold case 1 (2.1.1) .........................................................................................................347.1.2 IMA Cold case 2A, Sensitivity analysis (2.1.3)......................................................................367.1.3 IMA Hot case (2.1.4)..............................................................................................................377.1.4 IMA Hot case, Sensitivity to radiator ageing (2.1.5)..............................................................387.2 Predicted temperatures for MU nodes. ...................................................................................397.2.1 MU Non-operating cold case 1 (3.1.1) ...................................................................................397.2.2 MU Non-operating cold case 2 (3.1.2) ...................................................................................407.2.3 MU Non-operating cold case 2A (3.1.3) ................................................................................427.2.4 MU Operating hot case (3.1.4) ...............................................................................................447.2.5 MU Operating hot case, Sensitivity to radiator and silver tape ageing (3.1.5).......................467.2.6 MU Operating hot case A (3.1.6) ...........................................................................................48

8 CONCLUSIONS.......................................................................................................50


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1 THERMAL MODEL DESCRIPTION

1.1 Technical Basis

Analyzer of Space Plasmas and EneRgetic Atoms (ASPERA-4) experiment consists of two units:

1. Main Unit (MU), containing Scanner Box (motor, wheel, board, housing) and rotating Sensor

Head (ELS, NPI, DPU, NPD) with its mounting structure.

2. Ion Mass Analyser (IMA), containing DPU Box (boards, housing) and Sensor Head (boards,

housing).

Figures (next two pages): drawings of MU (ME-ASP-MD-1000) and IMA (IMA-002) from different

viewing geometrys. Radiators of IMA and MU are not shown on this drawings.

The following calculations were executed with finite difference computer program. The MU and IMA

units were approximated by the nodes systems (17 nodes for IMA and 32 nodes for MU). The results

are presented as tables with MU and IMA nodes predicted temperatures for different cases.

The mission data and calculation cases are based on the Reference No. VEX/IF/0016/T.ASTR, Issue 2

Venus Express/ASPERA Thermal Interface Requirements, dated 27.06.03.

The body of spacecraft is a box with 17001650 mm sides and 1600 mm height with two solar array

wings stretching out on both sides. High Gain Antenna (HGA) with diameter 1630 mm is mounted on

the third side of spacecraft box. External S/C Z walls surfaces are covered with Kapton MLI with

(BOL) = 0.39, (BOL) = 0.64 and (EOL) = 0.50, (EOL) = 0.64 thermo-optical coefficients.

Venus-EXPRESS spacecraft co-ordinate system is defined as follows:

The origin is located in the center of the s/c to launcher I/F adapter

The Z axis is perpendicular to the launcher I/F plane, directed positively

through the S/C body

The X axis is perpendicular to the Z axis and the solar array drive axis, directed positively

trough the of the S/C containing the HGA

The Y axis completes the right hand system (directed along the solar arrays)

The ASPERA-4 MU unit is accomodated on the lower part of s/c wall (-Y axis side) of Venus Express

spacecraft so that +Xu axis is co-aligned with -Zs/c axis. IMA unit is accommodated on -Z wall ofs/c.

Sun Aspect angle (the angle between the s/c longitudinal +Z axis and the Sun) can be from -100

deg. to +5 deg. at the Communication phase of flight.

The main parameters of Venus Observation phase are:

Inclination: 90 deg. (polar orbit)

Argument of pericenter: 110 deg.

Pericenter altitude: 400 km

Apocenter altitude: 66408 km (period 24h)

during nadir pointing phase around pericenter, the s/c is maintained with the +Z face pointedtowards Venus center.


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Figure 1 Operation orbit timeline

Sto 65 min ecli se

Start 65 min ecli se

Stop 4h high altitude imaging

Observation phase

(s/c altitude is below 10000 km)

Communication phase

Start 4h high altitude imaging


Sto 45 min ecli se


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Mass

IMA w/o thermal h/w 2182 g

Thermal h/w 227 g

IMA-MU interconnection cable 283 g

CoM wrt URF

Xu, Yu, Zu 110.5, -84, 64.7 mm, 3 mm

ToI wrt URF centered at CoM

Ix, Iy, Iz 0.0075, 0.0135, 0.0125 kgm

Materials

Enclosure AA6061 and AA7075

Aperture grids Stainless Steel

Fasteners 4 of M5x25 Ti Grade 5

Thermal isolators 4+4 of GE313 fibreglass

Surface treatment MIL-C-5541

Flight Cover

FC02 for J02 (green)

Figure 2 Ion Mass Analyser, IMA


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Mass

MU w/o thermal h/w 6819 g

Thermal h/w 441 g

CoM wrt URF in Parking position

Xu, Yu, Zu 135, -109, 101 mm, 3 mm

CoM wrt URF in CCW position

Xu, Yu, Zu 109, -86, 101 mm, 3 mmToI wrt URF centered at CoM in Parking position

Ix, Iy, Iz 0.0553, 0.0803, 0.0686 kgm2,15 %

ToI wrt URF centered at CoM in CCW position

Ix, Iy, Iz 0.0706, 0.0606, 0.0645 kgm2,15 %

Materials

Enclosure AA6061 and AA7075

Aperture grids Stainless Steel

Fasteners 6 of M4x25 Ti Grade 5

Thermal isolators 6+6 of GE313 fibreglass

Surface treatment MIL-C-5541

Flight Cover

FC04 for J04 (green)

Figure 3 Main Unit, MU


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2 IMA THERMAL ANALYSIS CASES

The following IMA thermal analysis cases have been considered:

2.1.1 IMA Cold case 1

Steady thermal state:

cruise phase

IMA unit is turn in switch OFF

solar constant is 1320 W/m2

spacecraft interface temperature is 223K

solar aspect angle is 0 deg. coatings are corresponded to BOL.

2.1.2 IMA Cold case 2

Transient thermal state:

orbit phase

IMA unit is turn in switch OFF



Earth pointing phase

o 50m Observation phase, IMA on the Sun

o 45m Venus eclipse

o 4h Observation phase (Figure 4)

coatings are corresponded to BOL.

2.1.3 IMA Cold case 2A, Sensitivity analysis


orbit phase IMA unit is turn in switch OFF



Earth pointing phase

o 50m Observation phase, IMA on the Sun

o 45m Venus eclipse

o 4h Observation phase (Figure 4)



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Figure 4 IMA Cold case (Venus orbit)


Observation phase

Communication phase



Sto 45 min ecli se


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2.1.4 IMA Hot case


orbit phase

IMA unit is turn in switch ON



Earth pointing

o 19m Venus eclipse & Earth pointing

o 46m Venus eclipse & Observations

o 5h IMA on the Sun (Figure 5)

o coatings are corresponded to EOL.

2.1.5 IMA Hot case, Sensitivity to radiator ageing


orbit phase

IMA unit is turn in switch ON



Earth pointing


o 46m Venus eclipse & Observationso 5h IMA on the Sun (Figure 5)

coatings are corresponded to EOL

coefficient for silver tape is 0.57 instead of 0.47.


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Figure 5 IMA Hot case

Sto 65 min ecli se



Observation phase

Communication phase



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3 MU THERMAL ANALYSIS CASES

The following MU thermal analysis cases have been considered:

3.1.1 MU Cold case 1

Steady thermal state:

cruise phase

MU unit is turn in switch OFF



solar aspect angle is 0 deg.


3.1.2 MU Cold case 2


initial data are corresponded with steady state for cold case 1 and solar constant 2570 W/m2

orbit phase



spacecraft interface temperature is 223K Earth pointing phase

o 50m Observation phase, MU is on the Sun

o 45m Venus eclipse

o 4h MU is in s/c eclipse (Figure 6)


3.1.3 MU Cold case 2A, Sensitivity analysis


initial data are corresponded with steady state for cold case 1 and solar constant 2570 W/m2,

spacecraft interface temperature 243K

orbit phase (transient thermal state)




Earth pointing

o 50m Observation phase, MU on the Sun

o 45m Venus eclipse

o 4h MU in s/c eclipse (Figure 6)

coatings are corresponded to BOL


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Figure 6 MU Cold case (Venus orbit)


Observation phase

Communication phase



Sto 45 min ecli se


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3.1.4 MU Hot case


orbit phase

MU unit is turn in switch ON



Earth pointing



o 5h MU on the Sun (Figure 7)

coatings are corresponded to EOL.

3.1.5 MU Hot case, Sensitivity to radiator (SSM CC/UVS) and silver tape ageing


orbit phase

MU unit is turn in switch ON



Earth pointing


o 46m Venus eclipse & Observationso 5h MU on the Sun (Figure 7)


coefficient for silver tape is 0.57 instead of 0.47.

coefficient for CC/UVS covering is 0.17 instead of 0.07.

3.1.6 MU Hot case A


orbit phase MU unit is turn in switch ON and Scanner is turn in switch OFF



Earth pointing



o 5h MU on the Sun (Figure 7)



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Figure 7 MU Hot case

Sto 65 min ecli se



Observation phase

Communication phase



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4 THERMAL DESIGN REQUIREMENTS

The thermal design both MU and IMA is mainly driven by constraints of their electronic parts and MUScanner motor. Operational temperature ranges for MU and IMA units are given in Table1 and

Table2.

Table 1 MU operational temperatures

Node Name Operational temp. [C]

1 ELS Top Plate -60 to +120

2 ELS Housing -60 to +120

3 ELS Deflector -80 to +100

4 ELS HVPS (upper board) -40 to +50

5 ELS HVPS (lower board) -40 to +50

6 ELS MCP -40 to +50

7 ELS FEE Board -40 to +50

8 NPI Housing -60 to +120

9 NPI Amplifier Board -40 to +50

10 NPI MCP -40 to +50

11 DPU Housing +Xu -60 to +200

12 DPU DC/DC -40 to +50

13 DPU Housekeeping Board -40 to +50

14 DPU HV Board -40 to +60

15 DPU Processor Board -40 to +60

16 NPD1 -40 to +50

17 NPD2 -40 to +5018 Motor Wheel -40 to +60

19 Motor Box -60 to +120

20 Motor -40 to +50

21 Motor Board -40 to +60

22 MLI Motor Box -250 to +290

23 MLI NPD+DPU -Xu -250 to +290

24 MLI NPD+DPU +Yu -250 to +290

25 MLI NPD +Zu -250 to +290

26 MLI NPD +DPU -Yu -250 to +290

27 Radiator -60 to +120

28 Mother Board -40 to +5029 DPU Housing -Zu -60 to +200

30 DPU Housing +Yu -60 to +200

31 DPU Housing -Yu -60 to +200

32 Radiation shield -60 to +120


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Table 2 IMA operational temperatures

Node Name Operational temp. [C]1 Aperture -60 to +120

2 Outer Deflector -60 to +200

3 Sensor Housing + Radiator -60 to +120

4 Inner Deflector -60 to +200

5 Outer plate -60 to +200

6 MCP -40 to +50

7 Amplifier Board -40 to +50

8 Digital Board -40 to +50

9 HVPS Board 1 -40 to +75

10 HVPS Board 2 -40 to +75

11 DPU Housing -60 to +20012 CPU + HK Boards -40 to +60

13 Sensor MLI (+Xs/c side) -250 to +290

14 Sensor MLI (-Xs/c side) -250 to +290

15 Sensor MLI (-Ys/c side) -250 to +290

16 DPU MLI -250 to +290

17 Ring radiator -60 to +120


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5 IMA THERMAL DESIGN AND MATHEMATICAL MODEL

The following main requirements for IMA thermal design have been considered in calculation:

the IMA unit should be thermally decoupled with s/c with 10 mm height special fibreglasses

plug and titanium screws of 4 M5 diameter using.

DPU unit surface should be covered with yellow Kapton MLI according to MLI design

description (Table3 and Figure 8)

Sensor structure (EQM-009) and Sensor Housing radiator surfaces are not covered with MLI,

the rest surface of sensor unit should be covered with MLI of the same type

part of Sensor Housing outer surface (Figure 9) is used as a radiator with 0.014 m2

area and

covered with Sheldahl 5 mil FEPsilverInconel 9703 Tape

outer surface of Sensor structure should be also covered with the same silver tape

inner surface of Sensor structure should be black anodized or painted with black paint

outer surface of Sensor Unit should be black anodized (excluding of radiator area) or

IRIDITED

inner surface of Sensor Unit should be black anodized

inner and outer surfaces of DPU Housing should be anodized black or painted with black paint

on the inner surface of Sensor Unit around the MCP holder should be mounted a heater (or

heaters) with 5.76W heat power

one thermostat with operating temperature range -24C -28C should be installed on the

Sensor Housing surface (node#3).

outer surfaces of rings (EQM-022, nodes #2, #4), rings (EQM-020, EQM-023) should be

covered with CuSO4black covering.

ring radiator with external diameter 148 mm, internal diameter 127 mm and thickness 1.5 mm

(area is 0.0045 m2) coupling with Sensor Housing is use. external surface of ring radiator should be covered with the same silver tape

Table 3 Multilayer insulation blanket design description

External Layer Material Yellow: 25m (1 mil) Kapton/Al, perforated

Internal Layer Material Al/50m (2 mil) Kapton/Al, perforated

Radiation Shield Material

and number of layers12m (0.5 mil) Crinckled Kapton vda, perforated, 5 layers

vda 12m (0.5 mil) Kapton vda, perforated, 20 layers

Spacer Material

And number of layers

Dacron net, 20 layers

Additional Comments 1) non-aluminized side of Crinckled Kapton (5 layers of yellow

colour side) should be pointed to the Space direction

Effective thermal

conductivity


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Space

Unit

Figure 8 Multilayer insulation blanket for IMA and MU

Figure 9 Area of radiator on IMA sensor housing

External Layer

Crinckled Kaptonvda,

5 layers

vdaKaptonvda, 20

layers

Spacer (Dacron net), 20

Layers

Internal Layer

Radiator area

60

15

+Zu

+Yu


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The IMA thermal mathematical model was created using a finite difference representation and nodes

method as detailed in Figure 10 and Table 4 to Table 10.

Table 4 IMA node list

Node Name

1 Aperture

2 Outer Deflector

3 Sensor Housing + Radiator

4 Inner Deflector

5 Outer plate

6 MCP

7 Amplifier Board

8 Digital Board9 HVPS Board 1

10 HVPS Board 2

11 DPU Housing

12 CPU + HK Boards

13 Sensor MLI (+Xs/c side)

14 Sensor MLI (-Xs/c side)

15 Sensor MLI (-Ys/c side)

16 DPU MLI

17 Ring radiator


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Figure 10 IMA unit nodes

2 4 5 3 6 7 8 9 10 13 - 15

1 17 11 12 16


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Table 5 IMA BOL surface properties

Node Name Material Thermal finish s sd ss h hd hs1 Aperture AL-6062 Silver tape 0.10 0.90 - 0.75 0.25 -

2 Outer Deflector AL-6062 CuSO4black 0.84 0.16 - 0.91 0.09 -

3 Sensor Housing + Radiator AL-6062 Silver tape 0.10 0.90 - 0.75 0.25 -

4 Inner Deflector AL-6062 CuSO4black 0.84 0.16 - 0.91 0.09 -

5 Outer plate Misc. Internal - - - - - -

6 MCP Misc. Internal - - - - - -

7 Amplifier Board Misc. Internal - - - - - -

8 Digital Board Misc. Internal - - - - - -

9 HVPS Board 1 Misc. Internal - - - - - -


11 DPU Housing AL-6062 Internal - - - - - -

12 CPU + HK Boards Misc. Internal - - - - - -13 Sensor MLI (+Xs/c side) MLI Kapton/Al 0.39 0.61 - 0.64 0.36 -

14 Sensor MLI (-Xs/c side) MLI Kapton/Al 0.39 0.61 - 0.64 0.36 -

15 Sensor MLI (-Ys/c side) MLI Kapton/Al 0.39 0.61 - 0.64 0.36 -

16 DPU MLI MLI Kapton/Al 0.39 0.61 - 0.64 0.36 -

17 Ring radiator AL-6062 Silver tape 0.10 0.90 - 0.75 0.25 -

Table 6 IMA EOL surface properties

Node Name Material Thermal finish s sd ss h hd hs1 Aperture AL-6062 Silver tape 0.47 0.53 - 0.75 0.25 -

2 Outer Deflector AL-6062 CuSO4black 0.85 0.15 - 0.91 0.09 -3 Sensor Housing + Radiator AL-6062 Silver tape 0.47 0.53 - 0.75 0.25 -

4 Inner Deflector AL-6062 CuSO4black 0.85 0.15 - 0.91 0.09 -

5 Outer plate Misc. Internal - - - - - -

6 MCP Misc. Internal - - - - - -

7 Amplifier Board Misc. Internal - - - - - -

8 Digital Board Misc. Internal - - - - - -



11 DPU Housing AL-6062 Internal - - - - - -

12 CPU + HK Boards Misc. Internal - - - - - -

13 Sensor MLI (+Xs/c side) MLI Kapton/Al 0.50 0.50 - 0.64 0.36 -

14 Sensor MLI (-Xs/c side) MLI Kapton/Al 0.50 0.50 - 0.64 0.36 -15 Sensor MLI (-Ys/c side) MLI Kapton/Al 0.50 0.50 - 0.64 0.36 -

16 DPU MLI MLI Kapton/Al 0.50 0.50 - 0.64 0.36 -

17 Ring radiator AL-6062 Silver tape 0.47 0.53 - 0.75 0.25 -


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Table 7 IMA node properties

Node Name Material Area[m

2]

mCp[J/K]

Non-Op.heater [W]

Power diss[W]

1 Aperture AL-6062 0.0110 61.4 - 0.

2 Outer Deflector AL-6062 0.0080 4.2 - 0.

3 Sensor Housing+Radiator AL-6062 0.0830 358.6 5.76 0.

4 Inner Deflector AL-6062 0.0080 4.2 - 0.

5 Outer plate misc. 0.0500 954.0 - 0.

6 MCP misc. 0.0079 88.0 - 0.28

7 Amplifier Board misc. 0.0099 100.5 - 0.81

8 Digital Board misc. 0.0099 56.5 - 0.75

9 HVPS Board 1 misc. 0.0099 15.7 - 0.30

10 HVPS Board 2 misc. 0.0099 15.7 - 0.3011 DPU Housing AL-6062 0.0420 320.4 - 0.

12 CPU + HK Boards misc. 0.0213 45.2 - 1.10

13 Sensor MLI (+Xs/c side) MLI 0.0540 39.3 - 0.

14 Sensor MLI (-Xs/c side) MLI 0.0400 22.9 - 0.

15 Sensor MLI (-Ys/c side) MLI 0.0110 8.0 - 0.

16 DPU MLI MLI 0.0630 45.8 - 0.

17 Ring radiator AL-6062 0.0059 52.3 - 0.

Table 8 IMA interface conductive couplings

Type Number C [W/K] Node Conductive i/f node

Foot-1*M5-washer-s/c structure 1 0.0145 11 1

Foot-1*M5-washer- s/c structure 1 0.0145 11 1



Table 9 IMA internal conductive couplings

From To Coupling

Node Name Node Name GL [W/K]

1 Aperture 2 Outer Deflector 0.0541 Aperture 4 Inner Deflector 0.053

1 Aperture 17 Ring radiator 0.210

3 Sensor Housing + Radiator 5 Outer plate 0.200

3 Sensor Housing + Radiator 10 HVPS Board 2 0.226

3 Sensor Housing + Radiator 11 DPU Housing 0.400

3 Sensor Housing + Radiator 13 Sensor MLI (+Xs/c side) 0.0054

3 Sensor Housing + Radiator 14 Sensor MLI (-Xs/c side) 0.004

3 Sensor Housing + Radiator 15 Sensor MLI (-Ys/c side) 0.0011

3 Sensor Housing + Radiator 17 Ring radiator 0.650

5 Outer plate 6 MCP 1.250

6 MCP 7 Amplifier Board 0.1417 Amplifier Board 8 Digital Board 0.141

8 Digital Board 9 HVPS Board 1 0.113


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From To Coupling


9 HVPS Board 1 10 HVPS Board 2 0.07511 DPU Housing 12 CPU + HK Boards 0.113

11 DPU Housing 16 DPU MLI 0.0063

Table 10 IMA radiative couplings

Node Name Node Name GR [m2]

1 Aperture - Space 1.27*10-2

1 Aperture 2 Outer Deflector 0.05*10-2

1 Aperture 4 Inner Deflector 0.15*10-2

2 Outer Deflector - Space 0.32*10-2

2 Outer Deflector 4 Inner Deflector 0.32*10

-2

2 Outer Deflector 17 Ring radiator 0.05*10-2

3 Sensor Housing + Radiator - Space 0.81*10-2

3 Sensor Housing + Radiator 5 Outer plate 0.28*10-2

3 Sensor Housing + Radiator 6 MCP 0.27*10-2

3 Sensor Housing + Radiator 7 Amplifier Board 0.20*10-2

3 Sensor Housing + Radiator 8 Digital Board 0.25*10-2

3 Sensor Housing + Radiator 9 HVPS Board 1 0.34*10-2

3 Sensor Housing + Radiator 10 HVPS Board 2 1.01*10-2

4 Inner Deflector - Space 0.38*10-2

4 Inner Deflector 5 Outer plate 0.09*10

-2

4 Inner Deflector 17 Ring radiator 0.04*10-2

5 Outer plate 6 MCP 0.14*10-2

6 MCP 7 Amplifier Board 0.39*10-2

7 Amplifier Board 8 Digital Board 0.64*10-2

8 Digital Board 9 HVPS Board 1 0.62*10-2

9 HVPS Board 1 10 HVPS Board 2 0.57*10-2

11 DPU Housing 12 CPU + HK Boards 1.67*10-2

13 Sensor MLI (+Xs/c side) - Space 2.29*10-2

14 Sensor MLI (-Xs/c side) - Space 4.00*10-2

15 Sensor MLI (-Ys/c side) - Space 0.56*10-2

16 DPU MLI - Space 3.87*10

-2

17 Ring radiator - Space 0.14*10-2


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6 MU THERMAL DESIGN AND MATHEMATICAL MODEL

The following main requirements for thermal design of MU have been considered:

the MU should be thermally decoupled with s/c with special fibreglasses plug ME-ASP-MD-

5225, ME-ASP-MD-5226 and titanium screws of 6M4 diameter using

the DPU housing (excluding +Zu side and +Xu side), NPD-1 and NPD-2 housings, motor

box (excluding +Zu ) should be covered with yellow Kapton MLI according to MLI

design description (Nable3 and Figure 8)

external surfaces of DPU housing (excluding of radiator internal surface) should be Iridited

internal surface of DPU housing (excluding of radiator internal surface) should be painted

with paint or black anodized

special radiation shield is installed on the external surface of ELS cylindrical part

internal surface of radiation shield should be Iridited

external surface of radiation shield should be covered with Sheldahl 5 mil FEPsilverInconel

9703 Tape

external surface of DPU housing of +Xu side should be covered with Sheldahl 5 mil

FEPsilverInconel 9703 Tape

internal surface of DPU housing +Xu side should be painted with paint or black anodized

internal surface of motor box should be painted with paint or black anodized

part of external surface of motor box covered with MLI should be IRIDITED

part of external surface of motor box not covered with MLI (excluding screws heads surfaces)

should be covered with Sheldahl 5 mil FEPsilverInconel 9703 Tape

motor box screws heads surfaces should be painted with white paint

external surface of motor box bottom should be IRIDITED

internal surface of motor box bottom should be painted with paint or black anodized external and internal surfaces of NPD-1&2 housings should be IRIDITED

following electrical heaters with total power 17.33 W should be installed:

- on the Scanner motor box surface (node #19) with powers 0.75 W + 0.95 W + 0.47 W

- on the DPU housing surfaces and radiator surface (nodes #30,31,27) with power 15.16

W (5.22 W + 5.22 W+4.72 W)

the ELS Top Plate external surface should be covered with Sheldahl 5 mil FEPsilverInconel

9703 Tape

the ELS Top Plate internal surface should be covered with CuSO4black covering.

the ELS Housing external surface should be Iridited

NPI Housing external surfaces should be covered with Sheldahl 5 mil FEPsilverInconel

9703 Tape the ELS Housing internal surface and NPI Housing internal surface should be IRIDITED

two thermoswitches for heaters control are necessary

one thermoswitch should be installed on NPI housing surface

other thermoswitch should be installed on the Motor box surface

special radiator for sensor head cooling is necessary

special radiator VE-ASP-MD-6000 of 0.0186 m2

area should be coupled thermally with DPU

Housing sides

external surface of radiator should be covered with Low Absorptance Conductive Coated

SSMs (CC/UVS/SSMs) of 150 m thickness

internal surface of radiator should be painted with paint or black anodized


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The thermal mathematical model was created using a finite difference representation and nodes

method as detailed in Figure 11 and Table 11 to Table 17.

Table 11 MU node list

Node Name

1 ELS Top Plate

2 ELS Housing

3 ELS Deflector

4 ELS HVPS (upper board)

5 ELS HVPS (lower board)

6 ELS MCP

7 ELS FEE Board

8 NPI Housing

9 NPI Amplifier Board

10 NPI MCP

11 DPU Housing +Xu

12 DPU DC/DC

13 DPU Housekeeping Board

14 DPU HV Board

15 DPU Processor Board

16 NPD1

17 NPD2

18 Motor Wheel

19 Motor Box

20 Motor21 Motor Board

22 MLI Motor Box

23 MLI NPD+DPU -Xu

24 MLI NPD+DPU +Yu

25 MLI NPD +Zu

26 MLI NPD +DPU -Yu

27 Radiator

28 Mother Board

29 DPU Housing -Zu

30 DPU Housing +Yu

31 DPU Housing -Yu32 Radiation shield


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Figure 11 Main Unit nodes

1 2 32 3 4 5 7 9 11,29-31 27 12 13

6 8 10 28


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Table 12 MU BOL surfaces properties

Node Name Material Thermal finish s sd ss h hd hs1 ELS Top Plate AL-6062 Silver tape 0.10 0.90 - 0.75 0.25 -

2 ELS Housing AL-6062 Internal - - - - - -

3 ELS Deflector misc. Internal. - - - - - -

4 ELS HVPS (upper board) misc. Internal - - - - - -

5 ELS HVPS (lower board) misc. Internal - - - - - -

6 ELS MCP misc. Internal - - - - - -

7 ELS FEE Board misc. Internal. - - - - - -

8 NPI Housing AL-6062 Silver tape 0.10 0.90 - 0.75 0.25 -

9 NPI Amplifier Board misc. Internal - - - - - -

10 NPI MCP misc. Internal - - - - - -

11 DPU Housing +Xu AL-6062 internal - - - - - -

12 DPU DC/DC misc. Internal. - - - - - -13 DPU Housekeeping Board misc. Internal. - - - - - -

14 DPU HV Board misc. Internal. - - - - - -

15 DPU Processor Board misc. Internal. - - - - - -

16 NPD1 misc. internal - - - - - -


18 Motor Wheel AL-6062 Silver tape 0.10 0.90 - 0.75 0.25 -

19 Motor Box AL-6062 Silver tape 0.10 0.90 - 0.75 0.25 -

20 Motor misc. Internal. - - - - - -

21 Motor Board misc. Internal. - - - - - -

22 MLI Motor Box MLI Kapton/Al 0.39 0.61 - 0.64 0.36 -

23 MLI NPD+DPU -Xu MLI Kapton/Al 0.39 0.61 - 0.64 0.36 -

24 MLI NPD+DPU +Yu MLI Kapton/Al 0.39 0.61 - 0.64 0.36 -25 MLI NPD +Zu MLI Kapton/Al 0.39 0.61 - 0.64 0.36 -

26 MLI NPD +DPU -Yu MLI Kapton/Al 0.39 0.61 - 0.64 0.36 -

27 Radiator AL-6062 SSM CC/UVS 0.05 0.95 - 0.80 0.20 -

28 Mother Board misc. internal - - - - - -

29 DPU Housing -Zu AL-6062 internal - - - - - -

30 DPU Housing +Yu AL-6062 internal - - - - - -

31 DPU Housing -Yu AL-6062 internal - - - - - -

32 Radiation shield AL-6062 Silver tape 0.10 0.90 - 0.75 0.25 -


29/50


Table 13 MU EOL surfaces properties

Node Name Material Thermal finish s sd ss h hd hs1 ELS Top Plate AL-6062 Silver tape 0.47 0.53 - 0.75 0.25 -

2 ELS Housing AL-6062 Internal - - - - - -

3 ELS Deflector misc. Internal. - - - - - -

4 ELS HVPS (upper board) misc. Internal - - - - - -

5 ELS HVPS (lower board) misc. Internal - - - - - -

6 ELS MCP misc. Internal - - - - - -

7 ELS FEE Board misc. Internal. - - - - - -

8 NPI Housing AL-6062 Silver tape 0.47 0.53 - 0.75 0.25 -

9 NPI Amplifier Board misc. Internal - - - - - -

10 NPI MCP misc. Internal - - - - - -

11 DPU Housing +Xu AL-6062 internal - - - - - -

12 DPU DC/DC misc. Internal. - - - - - -13 DPU Housekeeping Board misc. Internal. - - - - - -

14 DPU HV Board misc. Internal. - - - - - -

15 DPU Processor Board misc. Internal. - - - - - -



18 Motor Wheel AL-6062 Silver tape 0.47 0.53 - 0.75 0.25 -

19 Motor Box AL-6062 Silver tape 0.47 0.53 - 0.75 0.25 -

20 Motor misc. Internal. - - - - - -

21 Motor Board misc. Internal. - - - - - -

22 MLI Motor Box MLI Kapton/Al 0.50 0.50 - 0.64 0.36 -

23 MLI NPD+DPU -Xu MLI Kapton/Al 0.50 0.50 - 0.64 0.36 -

24 MLI NPD+DPU +Yu MLI Kapton/Al 0.50 0.50 - 0.64 0.36 -25 MLI NPD +Zu MLI Kapton/Al 0.50 0.50 - 0.64 0.36 -

26 MLI NPD +DPU -Yu MLI Kapton/Al 0.50 0.50 - 0.64 0.36 -

27 Radiator AL-6062 SSM CC/UVS 0.07 0.93 - 0.80 0.20 -

28 Mother Board misc. internal - - - - - -

29 DPU Housing -Zu AL-6062 internal - - - - - -

30 DPU Housing +Yu AL-6062 internal - - - - - -

31 DPU Housing -Yu AL-6062 internal - - - - - -

32 Radiation shield AL-6062 Silver tape 0.47 0.53 - 0.75 0.25 -


30/50


Table 14 MU node properties

Node Name Material Area [m2

] mCp[J/K]

Non op.heater [W]

Power diss[W]

1 ELS Top Plate AL-6062 0.010 21.6 - -

2 ELS Housing AL-6062 0.013 78.0 - -

3 ELS Deflector misc. 0.002 14.1 - -

4 ELS HVPS (upper board) misc. 0.005 126.9 - 0.263

5 ELS HVPS (lower board) misc. 0.007 126.9 - 0.263

6 ELS MCP misc. 0.001 56.5 - 0.014

7 ELS FEE Board misc. 0.009 56.5 - 0.15

8 NPI Housing AL-6062 0.024 107.9 - 0.

9 NPI Amplifier Board misc. 0.039 415.0 - 0.

10 NPI MCP misc. 0.019 114.2 - 0.43711 DPU Housing +Xu AL-6062 0.022 111.3 - 0.

12 DPU DC/DC misc. 0.033 37.7 - 5.78

13 DPU Housekeeping

Board

misc. 0.019 70.6 - 1.70

14 DPU HV Board misc. 0.033 122.6 - 1.31

15 DPU Processor Board misc. 0.033 122.6 - 2.50

16 NPD1 misc. 0.043 695.0 - 0.671

17 NPD2 misc. 0.075 695.0 - 0.671

18 Motor Wheel AL-6062 0.024 247.3 - 0.

19 Motor Box AL-6062 0.101 333.7 2.17 0.

20 Motor misc. 0.004 46.0 - 3.20

21 Motor Board misc. 0.009 24.9 - 0.8022 MLI Motor Box MLI 0.041 29.0 - -

23 MLI NPD+DPU -Xu MLI 0.040 28.4 - -

24 MLI NPD+DPU +Yu MLI 0.032 22.7 - -

25 MLI NPD +Zu MLI 0.024 17.0 - -

26 MLI NPD +DPU -Yu MLI 0.032 22.7 - -

27 Radiator AL-6062 0.018 166.5 4.72 -

28 Mother Board misc. 0.023 96.2 - -

29 DPU Housing -Zu AL-6062 0.041 143.6 - -

30 DPU Housing +Yu AL-6062 0.019 88.0 5.22 -

31 DPU Housing -Yu AL-6062 0.019 88.0 5.22 -

32 Radiation shield AL-6062 0.020 94.6 - -

Table 15 MU Interface conductive couplings

Type Number C [W/K] Node Cond. i/f node








31/50


Table 16 MU internal conductive couplings

From To CouplingNode Name Node Name GL [W/K]

1 ELS Top Plate 2 ELS Housing 0.150

2 ELS Housing 3 ELS Deflector 0.970

2 ELS Housing 4 ELS HVPS (upper board) 0.034

2 ELS Housing 7 ELS FEE Board 0.075

2 ELS Housing 8 NPI Housing 1.030

3 ELS Deflector 4 ELS HVPS (upper board) 0.035

3 ELS Deflector 7 ELS FEE Board 0.014

7 ELS FEE Board 12 DPU DC/DC 0.026

4 ELS HVPS (upper board) 5 ELS HVPS (lower board) 0.172

6 ELS MCP 7 ELS FEE Board 0.2108 NPI Housing 9 NPI Amplifier Board 0.190

8 NPI Housing 10 NPI MCP 0.660

8 NPI Housing 11 DPU Housing +Xu 0.850

9 NPI Amplifier Board 10 NPI MCP 0.201

11 DPU Housing +Xu 27 Radiator 0.410

11 DPU Housing +Xu 29 DPU Housing -Zu 0.512

11 DPU Housing +Xu 30 DPU Housing +Yu 0.512

11 DPU Housing +Xu 31 DPU Housing -Yu 0.512

12 DPU DC/DC 13 DPU Housekeeping Board 0.281

12 DPU DC/DC 28 Mother Board 0.048

12 DPU DC/DC 30 DPU Housing +Yu 2.04012 DPU DC/DC 31 DPU Housing -Yu 2.040

13 DPU Housekeeping Board 14 DPU HV Board 0.281

13 DPU Housekeeping Board 28 Mother Board 0.051

14 DPU HV Board 15 DPU Processor Board 0.449

14 DPU HV Board 28 Mother Board 0.048

15 DPU Processor Board 28 Mother Board 0.021

16 NPD1 17 NPD2 0.900

16 NPD1 24 MLI NPD+DPU +Yu 0.00096

16 NPD1 25 MLI NPD +Zu 0.00120

16 NPD1 26 MLI NPD +DPU -Yu 0.00096

16 NPD1 28 Mother Board 0.02216 NPD1 30 DPU Housing +Yu 0.300

16 NPD1 31 DPU Housing -Yu 0.300

17 NPD2 23 MLI NPD+DPU -Xu 0.0032

17 NPD2 24 MLI NPD+DPU +Yu 0.00096

17 NPD2 25 MLI NPD +Zu 0.0012

17 NPD2 26 MLI NPD +DPU -Yu 0.00096

17 NPD2 28 Mother Board 0.022

18 Motor Wheel 19 Motor Box 0.300

18 Motor Wheel 20 Motor 0.005

18 Motor Wheel 29 DPU Housing -Zu 5.100

19 Motor Box 20 Motor 0.770


32/50


From To Coupling


19 Motor Box 21 Motor Board 1.25019 Motor Box 22 MLI Motor Box 0.0041

21 Motor Board 28 Mother Board 0.005

27 Radiator 30 DPU Housing +Yu 0.351

27 Radiator 31 DPU Housing -Yu 0.351

28 Mother Board 29 DPU Housing -Zu 2.300

29 DPU Housing -Zu 30 DPU Housing +Yu 0.417

29 DPU Housing -Zu 31 DPU Housing -Yu 0.417

32 Radiation shield 8 NPI Housing 1.110

Table 17 MU radiative couplings


1 ELS Top Plate - Space 0.86*10-2

1 ELS Top Plate 2 ELS Housing 0.79*10-2

32 Radiation shield - Space 1.35*10-2

2 ELS Housing 3 ELS Inner Dome Assy 0.35*10-4

2 ELS Housing 4 ELS HVPS (upper board) 0.05*10-2

2 ELS Housing 5 ELS HVPS (lower board) 0.88*10-4

2 ELS Housing 7 ELS FEE board 0.05*10-2

3 ELS Inner Dome Assy 4 ELS HVPS (upper board) 0.18*10-4

3 ELS Inner Dome Assy 5 ELS HVPS (lower board) 0.18*10-4

3 ELS Inner Dome Assy 6 ELS MCP 0.02*10

-2

4 ELS HVPS (upper board) 5 ELS HVPS (lower board) 0.54*10-2

5 ELS HVPS (lower board) 7 ELS FEE board 0.45*10-2

6 ELS MCP 7 ELS FEE board 0.64*10-2

7 ELS FEE board 8 NPI Housing 0.09*10-2

8 NPI Housing - Space 1.03*10-2

8 NPI Housing 9 NPI Sensor 1.28*10-2

8 NPI Housing 10 NPI MCP 0.10*10-2

9 NPI Sensor - Space 0.18*10-2

9 NPI Sensor 10 NPI MCP 1.05*10-2

10 NPI MCP 12 DPU DC/DC 1.01*10

-2

11 NPI MCP - Space 0.66*10

-2

11 DPU Housing +Xu 12 DPU DC/DC 0.03

11 DPU Housing +Xu 27 Radiator 0.04*10-2

11 DPU Housing +Xu 28 DPU Housing +Zu 0.02*10-2

11 DPU Housing +Xu 30 DPU Housing +Yu 0.04*10-2

11 DPU Housing +Xu 31 DPU Housing -Yu 0.04*10-2

12 DPU DC/DC 13 DPU HV board 0.02

12 DPU DC/DC 27 Radiator 0.15*10-2

12 DPU DC/DC 28 DPU Housing +Zu 0.14*10-2

12 DPU DC/DC 30 DPU Housing +Yu 0.11*10-2

12 DPU DC/DC 31 DPU Housing -Yu 0.11*10

-2


33/50



13 DPU HV board 14 DPU Housekeeping board 0.01

13 DPU HV board 27 Radiator 0.10*10-2

13 DPU HV board 28 DPU Housing +Zu 0.09*10-2

13 DPU HV board 30 DPU Housing +Yu 0.10*10-2

13 DPU HV board 31 DPU Housing -Yu 0.10*10-2

14 DPU Housekeeping board 15 DPU board 2.12*10-2

14 DPU Housekeeping board 27 Radiator 0.15*10-2

14 DPU Housekeeping board 28 DPU Housing +Zu 0.14*10-2

14 DPU Housekeeping board 30 DPU Housing +Yu 0.14*10-2

14 DPU Housekeeping board 31 DPU Housing -Yu 0.14*10-2

15 DPU board 16 NPD1 0.35*10-2

15 DPU board 27 Radiator 0.15*10-2

15 DPU board 28 DPU Housing +Zu 0.14*10-2

15 DPU board 30 DPU Housing +Yu 0.12*10-2

15 DPU board 31 DPU Housing -Yu 0.12*10-2

16 NPD1 - Space 0.07*10-2

16 NPD1 17 NPD2 0.10*10-2

16 NPD1 18 Motor Wheel 0.11*10-2

17 NPD2 - Space 0.07*10-2

17 NPD2 18 Motor Wheel 0.11*10-2

18 Motor Wheel - Space 0.10*10-2

18 Motor Wheel 19 Motor Box 1.89*10-2

18 Motor Wheel 20 Motor 0.09*10-2

18 Motor Wheel 21 Motor board 0.25*10-2

19 Motor Box - Space 0.50*10

-2

19 Motor Box 20 Motor 0.20*10-2

19 Motor Box 21 Motor board 0.46*10-2

19 Motor Box 23 MLI NPD+DPU -Xu 0.20*10-2

22 MLI Motor box - Space 1.91*10-2

23 MLI NPD+DPU -Xu - Space 1.53*10-2

24 MLI NPD+DPU +Yu - Space 1.22*10-2

25 MLI NPD +Zu - Space 1.74*10-2

26 MLI NPD +DPU -Yu - Space 1.22*10-2

27 Radiator - Space 1.50*10-2

27 Radiator 28 DPU Housing +Zu 0.05*10

-2

27 Radiator 30 DPU Housing +Yu 0.09*10

-2

27 Radiator 31 DPU Housing -Yu 0.09*10-2

28 DPU Housing +Zu 29 DPU Housing -Zu 1.75*10-2

28 DPU Housing +Zu 30 DPU Housing +Yu 0.11*10-2

28 DPU Housing +Zu 31 DPU Housing -Yu 0.11*10-2

30 DPU Housing +Yu 31 DPU Housing -Yu 0.22*10-4

32 Radiation shield 2 ELS Housing 0.02*10-2


34/50


7 THERMAL CALCULATIONS RESULTS.

7.1 Predicted temperatures for IMA nodes.

The following tables give the predicted temperatures for every nodes of the model.

7.1.1 IMA Cold case 1 (2.1.1)

Node Name Predicted temp. [C] Operational temp. [C]1 Aperture -35.92

-60 to +120

2 Outer Deflector -27.94

-60 to +200

3 Sensor Housing + Radiator -28.46 -60 to +1204 Inner Deflector -29.61 -60 to +200

5 Outer plate -28.47 -60 to +200

6 MCP -28.47 -40 to +50

7 Amplifier Board -28.47 -40 to +50

8 Digital Board -28.46 -40 to +50

9 HVPS Board 1 -28.46 -40 to +75

10 HVPS Board 2 -28.46 -40 to +75

11 DPU Housing -32.67 -60 to +200

12 CPU + HK Boards -32.67 -40 to +60

13 Sensor MLI (+Xs/c side) -140.73 -250 to +290

14 Sensor MLI (-Xs/c side) -152.40 -250 to +290

15 Sensor MLI (-Ys/c side) -142.19 -250 to +290

16 DPU MLI -140.45 -250 to +290

17 Ring radiator -30.60 -60 to +120

Thermal flux from IMA unit to s/c: Q = +1.01 W.


35/50


7.1.2 IMA Cold case 2 (2.1.2)

Node Name Predicted temp. insteady state [C],heaters are ON

Predicted temp. insteady state [C],heaters are OFF

Operationaltemp. [C]

1 Aperture -24.23 -25.30 -60 to +120


-4.55

-60 to +200

3 Sensor Housing + Radiator -24.05 -28.02 -60 to +120

4 Inner Deflector -7.04 -7.70 -60 to +200

5 Outer plate -25.14 -25.16 -60 to +200

6 MCP -25.16 -25.15 -40 to +50

7 Amplifier Board -25.18 -25.11 -40 to +50

8 Digital Board -25.02 -25.26 -40 to +50

9 HVPS Board 1 -24.70 -25.92 -40 to +7510 HVPS Board 2 -24.25 -27.20 -40 to +75

11 DPU Housing -29.42 -30.09 -60 to +200

12 CPU + HK Boards -29.63 -29.66 -40 to +60

13 Sensor MLI (+Xs/c side) -140.01 -140.11 -250 to +290

14 Sensor MLI (-Xs/c side) -151.71 -151.72 -250 to +290

15 Sensor MLI (-Ys/c side) -141.43 -141.46 -250 to +290

16 DPU MLI -139.75 -139.80 -250 to +290

17 Ring radiator -24.41 -27.24 -60 to +120

Thermal flux from IMA unit to s/c: Q = +1.15 W to +1.19 W.

Node Name Min predicted

temperature in

transient state

[C]

Maxi predicted

temperature in

transient state

[C]

Operational

temp. [C]

1 Aperture -40.87

+0.76

-60 to +120


+65.67

-60 to +200


4 Inner Deflector -44.89 +56.79 -60 to +200

5 Outer plate -28.13 -25.04 -60 to +200

6 MCP -28.05 -25.06 -40 to +50

7 Amplifier Board -28.16 -24.76 -40 to +508 Digital Board -28.18 -24.12 -40 to +50

9 HVPS Board 1 -28.13 -22.61 -40 to +75

10 HVPS Board 2 -28.56 -20.05 -40 to +75

11 DPU Housing -28.71 -25.82 -60 to +200

12 CPU + HK Boards -28.57 -26.14 -40 to +60

13 Sensor MLI (+Xs/c side) -140.15 +34.21 -250 to +290

14 Sensor MLI (-Xs/c side) -151.92 +23.63 -250 to +290

15 Sensor MLI (-Ys/c side) -141.62 +47.98 -250 to +290

16 DPU MLI -139.81 -24.12 -250 to +290

17 Ring radiator -29.26 -14.76 -60 to +120


36/50


7.1.3 IMA Cold case 2A, Sensitivity analysis (2.1.3)




1 Aperture -24.00 -24.95 -60 to +120


-3.33

-60 to +200


4 Inner Deflector -6.05 -6.58 -60 to +200

5 Outer plate -25.03 -25.11 -60 to +200

6 MCP -25.06 -25.12 -40 to +50


8 Digital Board -24.93 -25.22 -40 to +50

9 HVPS Board 1 -24.87 -25.84 -40 to +7510 HVPS Board 2 -24.16 -27.13 -40 to +75

11 DPU Housing -27.54 -27.88 -60 to +200

12 CPU + HK Boards -27.17 -27.48 -40 to +60

13 Sensor MLI (+Xs/c side) -140.01 -140.13 -250 to +290

14 Sensor MLI (-Xs/c side) -151.65 -151.86 -250 to +290

15 Sensor MLI (-Ys/c side) -141.30 -141.59 -250 to +290

16 DPU MLI -139.21 -139.28 -250 to +290

17 Ring radiator -24.30 -27.18 -60 to +120

Thermal flux from IMA unit to s/c: Q = +1.28 W to +1.30 W.


temperature in

transient state [C]Max predicted

temperature in

transient state [C]Operational

temp. [C]1 Aperture -41.47

+2.70

-60 to +120


+67.64

-60 to +200



5 Outer plate -25.47 -23.49 -60 to +200

6 MCP -25.71 -23.43 -40 to +50


8 Digital Board -25.97 -22.17 -40 to +509 HVPS Board 1 -26.62 -20.42 -40 to +75

10 HVPS Board 2 -27.75 -17.38 -40 to +75

11 DPU Housing -28.48 -21.11 -60 to +200

12 CPU + HK Boards -28.31 -21.38 -40 to +60




16 DPU MLI -139.37 -23.80 -250 to +290

17 Ring radiator -28.76 -12.09 -60 to +120


37/50


7.1.4 IMA Hot case (2.1.4)

Node Name Predictedtemperature in steady

state [C]Operational temp.[C]

1 Aperture +13.85 -60 to +120

2 Outer Deflector +26.69

-60 to +200

3 Sensor Housing + Radiator +16.49 -60 to +120

4 Inner Deflector +23.52 -60 to +200

5 Outer plate +21.27 -60 to +200

6 MCP +22.08 -40 to +50

7 Amplifier Board +27.12 -40 to +50

8 Digital Board +27.90 -40 to +50

9 HVPS Board 1 +24.94 -40 to +7510 HVPS Board 2 +19.60 -40 to +75

11 DPU Housing +21.07 -60 to +200

12 CPU + HK Boards +26.27 -40 to +60

13 Sensor MLI (+Xs/c side) +86.41 -250 to +290



16 DPU MLI -129.02 -250 to +290

17 Ring radiator +15.25 -60 to +120

Thermal flux from s/c to IMA unit: Q = -1.68 W.


temperature in


temperature in



+56.38

-60 to +120


+115.30

-60 to +200

3 Sensor Housing + Radiator +6.04 +45.42 -60 to +120


5 Outer plate +17.03 +40.25 -60 to +200

6 MCP +17.77 +41.03 -40 to +50

7 Amplifier Board +22.25 +45.83 -40 to +50

8 Digital Board +22.23 +46.58 -40 to +509 HVPS Board 1 +17.81 +44.46 -40 to +75

10 HVPS Board 2 +18.20 +45.49 -40 to +75

11 DPU Housing +13.49 +43.85 -60 to +200

12 CPU + HK Boards +19.01 +48.41 -40 to +60




16 DPU MLI -130.06 -45.77 -250 to +290

17 Ring radiator -0.11 +46.63 -60 to +120


38/50


7.1.5 IMA Hot case, Sensitivity to radiator ageing (2.1.5)

Node Name Predictedtemperature in steady

state [C]Operational temp.[C]

1 Aperture +17.93 -60 to +120

2 Outer Deflector +29.65

-60 to +200

3 Sensor Housing + Radiator +18.85 -60 to +120

4 Inner Deflector +26.43 -60 to +200

5 Outer plate +23.61 -60 to +200

6 MCP +24.41 -40 to +50

7 Amplifier Board +29.40 -40 to +50

8 Digital Board +30.16 -40 to +50

9 HVPS Board 1 +27.22 -40 to +7510 HVPS Board 2 +21.94 -40 to +75

11 DPU Housing +23.11 -60 to +200

12 CPU + HK Boards +28.26 -40 to +60

13 Sensor MLI (+Xs/c side) +86.45 -250 to +290



16 DPU MLI -128.62 -250 to +290

17 Ring radiator +18.01 -60 to +120

Thermal flux from s/c to IMA unit: Q = -1.56 W.


temperature in


temperature in



+61.78

-60 to +120


+118.30

-60 to +200

3 Sensor Housing + Radiator +7.69 +52.01 -60 to +120


5 Outer plate +19.08 +43.59 -60 to +200

6 MCP +19.81 +45.01 -40 to +50

7 Amplifier Board +24.20 +49.71 -40 to +50

8 Digital Board +24.11 +49.82 -40 to +509 HVPS Board 1 +19.59 +48.43 -40 to +75

10 HVPS Board 2 +11.89 +44.44 -40 to +75

11 DPU Housing +15.02 +48.99 -60 to +200

12 CPU + HK Boards +20.52 +53.40 -40 to +60




16 DPU MLI -129.73 -45.50 -250 to +290

17 Ring radiator +1.44 +52.91 -60 to +120


39/50


7.2 Predicted temperatures for MU nodes.

The following tables give the predicted temperatures for every nodes of the model.

7.2.1 MU Non-operating cold case 1 (3.1.1)

Node Name Predicted temp. in steady state

[C]Operational temp.

[C]1 ELS Top Plate -35.70

-60 to +120

2 ELS Housing -28.01

-60 to +120

3 ELS Deflector -27.95 -80 to +100

4 ELS HVPS (upper board) -27.53 -40 to +50

5 ELS HVPS (lower board) -27.37 -40 to +50

6 ELS MCP -25.30 -40 to +50

7 ELS FEE Board -25.29 -40 to +50

8 NPI Housing -25.83 -60 to +120

9 NPI Amplifier Board -26.49 -40 to +50

10 NPI MCP -25.54 -40 to +50

11 DPU Housing +Xu -18.77 -60 to +200

12 DPU DC/DC -14.48 -40 to +50

13 DPU Housekeeping Board -14.71 -40 to +50

14 DPU HV Board -15.11 -40 to +60

15 DPU Processor Board -15.19 -40 to +60

16 NPD1 -15.44 -40 to +50

17 NPD2 -15.68 -40 to +5018 Motor Wheel -17.71 -40 to +60

19 Motor Box -23.19 -60 to +120

20 Motor -23.13 -40 to +50

21 Motor Board -23.13 -40 to +60

22 MLI Motor Box -133.47 -250 to +290

23 MLI NPD+DPU -Xu +101.44 -250 to +290

24 MLI NPD+DPU +Yu -139.92 -250 to +290

25 MLI NPD +Zu -134.07 -250 to +290

26 MLI NPD +DPU -Yu -139.92 -250 to +290

27 Radiator -14.94 -60 to +120

28 Mother Board -17.05 -40 to +5029 DPU Housing -Zu -17.25 -60 to +200

30 DPU Housing +Yu -14.10 -60 to +200

31 DPU Housing -Yu -14.10 -60 to +200

32 Radiation shield -28.30 -60 to +120

Thermal flux from MU unit to s/c: Q = +2.31W.


40/50


7.2.2 MU Non-operating cold case 2 (3.1.2)




1 ELS Top Plate -33.41 -37.38 -60 to +120


-30.16

-60 to +120

3 ELS Deflector -25.40 -29.83 -80 to +100

4 ELS HVPS (upper board) -25.59 -28.57 -40 to +50

5 ELS HVPS (lower board) -25.51 -28.54 -40 to +50

6 ELS MCP -22.85 -25.22 -40 to +50

7 ELS FEE Board -22.79 -25.83 -40 to +50

8 NPI Housing -23.00 -29.77 -60 to +120

9 NPI Amplifier Board -23.88 -27.63 -40 to +5010 NPI MCP -22.75 -28.67 -40 to +50

11 DPU Housing +Xu -15.40 -26.07 -60 to +200

12 DPU DC/DC -10.97 -23.43 -40 to +50

13 DPU Housekeeping Board -11.20 -22.76 -40 to +50

14 DPU HV Board -11.62 -21.13 -40 to +60

15 DPU Processor Board -11.72 -20.57 -40 to +60

16 NPD1 -12.08 -17.78 -40 to +50

17 NPD2 -12.27 -15.54 -40 to +50

18 Motor Wheel -13.36 -22.66 -40 to +60

19 Motor Box -15.83 -21.03 -60 to +120

20 Motor -15.81 -20.91 -40 to +50

21 Motor Board -15.80 -21.00 -40 to +60

22 MLI Motor Box -131.81 -131.88 -250 to +290

23 MLI NPD+DPU -Xu +168.72 +168.69 -250 to +290

24 MLI NPD+DPU +Yu -139.35 -139.85 -250 to +290

25 MLI NPD +Zu -127.53 -127.63 -250 to +290

26 MLI NPD +DPU -Yu -139.35 -139.89 -250 to +290

27 Radiator -11.60 -26.66 -60 to +120

28 Mother Board -12.97 -22.64 -40 to +50

29 DPU Housing -Zu -13.11 -22.89 -60 to +200

30 DPU Housing +Yu -10.57 -23.51 -60 to +200

31 DPU Housing -Yu -10.57 -23.51 -60 to +200

32 Radiation shield -25.60 -31.89 -60 to +120

Thermal flux from MU unit to s/c: Q = +2.49 W to Q = +2.94 W.


41/50



temp. in transientstate [C]

Max predicted


Operational

temp. [C]1 ELS Top Plate -37.61

-19.68

-60 to +120

2 ELS Housing -30.15 -23.54 -60 to +120

3 ELS Deflector -29.75

-22.88 -80 to +100



6 ELS MCP -28.66 -23.36 -40 to +50

7 ELS FEE Board -28.74 -23.31 -40 to +50

8 NPI Housing -28.52 -22.59 -60 to +120

9 NPI Amplifier Board -28.76 -24.93 -40 to +50

10 NPI MCP -28.17 -23.28 -40 to +50

11 DPU Housing +Xu -29.54 -19.33 -60 to +200

12 DPU DC/DC -29.32 -16.52 -40 to +50


14 DPU HV Board -28.23 -18.41 -40 to +60


16 NPD1 -28.52 -19.37 -40 to +50

17 NPD2 -27.52 -19.22 -40 to +50

18 Motor Wheel -29.61 -20.08 -40 to +60

19 Motor Box -31.62 -22.25 -60 to +120

20 Motor -31.58 -21.84 -40 to +50

21 Motor Board -31.59 -21.69 -40 to +60

22 MLI Motor Box -135.26 -50.54 -250 to +29023 MLI NPD+DPU -Xu -114.02 +168.53 -250 to +290

24 MLI NPD+DPU +Yu -139.70 +177.02 -250 to +290

25 MLI NPD +Zu -129.91 -75.72 -250 to +290

26 MLI NPD +DPU -Yu -142.17 +176.36 -250 to +290

27 Radiator -31.36 -16.27 -60 to +120

28 Mother Board -29.37 -19.42 -40 to +50

29 DPU Housing -Zu -29.50 -19.50 -60 to +200

30 DPU Housing +Yu -29.41 -16.09 -60 to +200

31 DPU Housing -Yu -29.41 -16.09 -60 to +200



42/50


7.2.3 MU Non-operating cold case 2A (3.1.3)




1 ELS Top Plate -33.66 -36.65 -60 to +120


-29.33

-60 to +120

3 ELS Deflector -25.67 -29.16 -80 to +100



6 ELS MCP -23.36 -25.24 -40 to +50

7 ELS FEE Board -23.23 -25.70 -40 to +50

8 NPI Housing -23.00 -28.18 -60 to +120

9 NPI Amplifier Board -24.29 -26.50 -40 to +5010 NPI MCP -22.95 -27.16 -40 to +50

11 DPU Housing +Xu -15.20 -23.74 -60 to +200

12 DPU DC/DC -10.77 -20.95 -40 to +50


14 DPU HV Board -11.52 -17.93 -40 to +60


16 NPD1 -12.52 -16.65 -40 to +50

17 NPD2 -12.92 -15.05 -40 to +50

18 Motor Wheel -12.33 -19.17 -40 to +60

19 Motor Box -11.89 -14.79 -60 to +120

20 Motor -11.92 -14.69 -40 to +50

21 Motor Board -11.90 -14.79 -40 to +60

22 MLI Motor Box -131.00 -131.14 -250 to +290

23 MLI NPD+DPU -Xu +168.79 +168.72 -250 to +290

24 MLI NPD+DPU +Yu -139.58 -139.67 -250 to +290

25 MLI NPD +Zu -127.68 -127.84 -250 to +290

26 MLI NPD +DPU -Yu -139.58 -139.67 -250 to +290

27 Radiator -11.45 -24.28 -60 to +120

28 Mother Board -12.23 -19.42 -40 to +50

29 DPU Housing -Zu -12.29 -19.63 -60 to +200

30 DPU Housing +Yu -10.36 -21.07 -60 to +200

31 DPU Housing -Yu -10.36 -21.07 -60 to +200


Thermal flux from MU unit to s/c: Q = +1.31 W to Q = +1.56 W.


43/50




Max predicted


Operational

temp.[C]

1 ELS Top Plate -37.50

-19.41

-60 to +120

2 ELS Housing -30.07 -21.77 -60 to +120

3 ELS Deflector -29.98 -21.86 -80 to +100



6 ELS MCP -28.77 -22.23 -40 to +50

7 ELS FEE Board -28.86 -22.13 -40 to +50

8 NPI Housing -28.80 -21.37 -60 to +120

9 NPI Amplifier Board -28.30 -23.43 -40 to +50

10 NPI MCP -27.83 -21.29 -40 to +50

11 DPU Housing +Xu -29.49 -18.45 -60 to +200

12 DPU DC/DC -29.03 -16.05 -40 to +50


14 DPU HV Board -28.24 -18.11 -40 to +60


16 NPD1 -28.80 -18.88 -40 to +50

17 NPD2 -27.57 -19.56 -40 to +50

18 Motor Wheel -28.79 -18.55 -40 to +60

19 Motor Box -29.18 -20.74 -60 to +120

20 Motor -29.03 -19.30 -40 to +50

21 Motor Board -29.11 -19.21 -40 to +60


24 MLI NPD+DPU +Yu -139.28 +177.01 -250 to +290

25 MLI NPD +Zu -143.45 -75.58 -250 to +290

26 MLI NPD +DPU -Yu -142.18 +176.37 -250 to +290

27 Radiator -31.34 -15.90 -60 to +120

28 Mother Board -28.78 -18.24 -40 to +50

29 DPU Housing -Zu -28.85 -18.28 -60 to +200

30 DPU Housing +Yu -29.31 -15.55 -60 to +200

31 DPU Housing -Yu -29.31 -15.55 -60 to +200



44/50


7.2.4 MU Operating hot case (3.1.4).

Node Name Predicted temp. in steadystate [C] Operational temp. [C]

1 ELS Top Plate +21.07

-60 to +120

2 ELS Housing +38.02

-60 to +120

3 ELS Deflector +38.30 -80 to +100

4 ELS HVPS (upper board) +44.18 -40 to +50

5 ELS HVPS (lower board) +45.02 -40 to +50

6 ELS MCP +42.53 -40 to +50

7 ELS FEE Board +42.50 -40 to +50

8 NPI Housing +43.17 -60 to +120

9 NPI Amplifier Board +43.75 -40 to +50

10 NPI MCP +44.18 -40 to +5011 DPU Housing +Xu +44.00 -60 to +200

12 DPU DC/DC +48.93 -40 to +50

13 DPU Housekeeping Board +49.51 -40 to +50

14 DPU HV Board +56.56 -40 to +60

15 DPU Processor Board +58.82 -40 to +60

16 NPD1 +47.37 -40 to +50

17 NPD2 +47.07 -40 to +50

18 Motor Wheel +48.55 -40 to +60

19 Motor Box +53.94 -60 to +120

20 Motor +57.87 -40 to +50

21 Motor Board +54.45 -40 to +60

22 MLI Motor Box -117.39 -250 to +290

23 MLI NPD+DPU -Xu -73.08 -250 to +290

24 MLI NPD+DPU +Yu +187.65 -250 to +290

25 MLI NPD +Zu -118.18 -250 to +290

26 MLI NPD +DPU -Yu -128.14 -250 to +290

27 Radiator +39.38 -60 to +120

28 Mother Board +48.52 -40 to +50

29 DPU Housing -Zu +48.14 -60 to +200

30 DPU Housing +Yu +47.15 -60 to +200

31 DPU Housing -Yu +47.15 -60 to +200

32 Radiation shield +41.27 -60 to +120

Thermal flux from MU unit to s/c: Q = +0.34 W.


45/50




Max predicted

temp in transientstate [C]

Operational

temp. [C]1 ELS Top Plate +5.00

+71.42

-60 to +120

2 ELS Housing +18.85 +47.91 -60 to +120

3 ELS Deflector +19.57 +47.96 -80 to +100

4 ELS HVPS (upper board) +33.91 +50.89 -40 to +50

5 ELS HVPS (lower board) +35.31 +51.42 -40 to +50

6 ELS MCP +28.95 +48.06 -40 to +50

7 ELS FEE Board +28.54 +48.07 -40 to +50

8 NPI Housing +19.69 +43.31 -60 to +120

9 NPI Amplifier Board +22.07 +41.56 -40 to +50

10 NPI MCP +22.18 +43.57 -40 to +50

11 DPU Housing +Xu +28.43 +42.91 -60 to +200

12 DPU DC/DC +36.19 +47.53 -40 to +50

13 DPU Housekeeping Board +39.42 +50.23 -40 to +50

14 DPU HV Board +45.38 +54.98 -40 to +60

15 DPU Processor Board +47.93 +57.25 -40 to +60

16 NPD1 +38.69 +46.34 -40 to +50

17 NPD2 +39.45 +46.43 -40 to +50

18 Motor Wheel +35.22 +45.91 -40 to +60

19 Motor Box +38.91 +47.99 -60 to +120

20 Motor +43.01 +51.97 -40 to +50

21 Motor Board +39.51 +48.57 -40 to +60


24 MLI NPD+DPU +Yu -105.69 +188.51 -250 to +290

25 MLI NPD +Zu -122.66 -38.54 -250 to +290

26 MLI NPD +DPU -Yu -128.15 +187.46 -250 to +290

27 Radiator +26.90 +38.11 -60 to +120

28 Mother Board +35.52 +46.28 -40 to +50

29 DPU Housing -Zu +34.91 +45.81 -60 to +200

30 DPU Housing +Yu +34.45 +45.72 -60 to +200

31 DPU Housing -Yu +34.45 +45.72 -60 to +200

32 Radiation shield +14.97 +41.35 -60 to +120


46/50


7.2.5 MU Operating hot case, Sensitivity to radiator and silver tape ageing (3.1.5)

Node Name Predicted temp. in steadystate [C] Operational temp.[C]


-60 to +120


-60 to +120




6 ELS MCP +51.02 -40 to +50

7 ELS FEE Board +50.99 -40 to +50

8 NPI Housing +52.44 -60 to +120



12 DPU DC/DC +56.86 -40 to +50


14 DPU HV Board +64.19 -40 to +60


16 NPD1 +55.13 -40 to +50

17 NPD2 +54.75 -40 to +50

18 Motor Wheel +56.35 -40 to +60

19 Motor Box +61.26 -60 to +120

20 Motor +65.18 -40 to +50

21 Motor Board +61.77 -40 to +60

22 MLI Motor Box -116.06 -250 to +290

23 MLI NPD+DPU -Xu -69.26 -250 to +290

24 MLI NPD+DPU +Yu +188.34 -250 to +290

25 MLI NPD +Zu -117.12 -250 to +290

26 MLI NPD +DPU -Yu -126.84 -250 to +290

27 Radiator +47.23 -60 to +120

28 Mother Board +56.37 -40 to +50

29 DPU Housing -Zu +56.00 -60 to +200

30 DPU Housing +Yu +55.09 -60 to +200

31 DPU Housing -Yu +55.09 -60 to +200


Thermal flux from MU unit to s/c: Q = +0.97 W.


47/50




Max predicted


Operational

tem. [C]1 ELS Top Plate +9.24

+86.60

-60 to +120

2 ELS Housing +23.77 +53.00 -60 to +120

3 ELS Deflector +24.56 +54.77 -80 to +100



6 ELS MCP +34.82 +57.18 -40 to +50

7 ELS FEE Board +34.35 +57.20 -40 to +50

8 NPI Housing +24.44 +52.22 -60 to +120


10 NPI MCP +27.19 +52.26 -40 to +50

11 DPU Housing +Xu +33.37 +50.26 -60 to +200

12 DPU DC/DC +41.33 +54.49 -40 to +50


14 DPU HV Board +50.77 +61.61 -40 to +60


16 NPD1 +44.87 +53.02 -40 to +50

17 NPD2 +45.75 +53.01 -40 to +50

18 Motor Wheel +40.21 +52.33 -40 to +60

19 Motor Box +43.03 +52.91 -60 to +120

20 Motor +47.14 +56.90 -40 to +50

21 Motor Board +43.65 +53.51 -40 to +60


24 MLI NPD+DPU +Yu -105.03 +188.51 -250 to +290

25 MLI NPD +Zu -121.59 -38.06 -250 to +290

26 MLI NPD +DPU -Yu -126.89 +188.54 -250 to +290

27 Radiator +31.68 +45.05 -60 to +120

28 Mother Board +40.63 +52.87 -40 to +50

29 DPU Housing -Zu +40.00 +52.39 -60 to +200

30 DPU Housing +Yu +39.61 +52.67 -60 to +200

31 DPU Housing -Yu +39.61 +52.67 -60 to +200



48/50


7.2.6 MU Operating hot case A (3.1.6).

Node Name Predicted temp. in steadystate [C] Operational temp. [C]


-60 to +120


-60 to +120




6 ELS MCP +37.41 -40 to +50

7 ELS FEE Board +37.37 -40 to +50

8 NPI Housing +38.08 -60 to +120



12 DPU DC/DC +42.37 -40 to +50


14 DPU HV Board +50.01 -40 to +60


16 NPD1 +40.79 -40 to +50

17 NPD2 +40.50 -40 to +50

18 Motor Wheel +40.33 -40 to +60

19 Motor Box +41.32 -60 to +120

20 Motor +41.30 -40 to +50

21 Motor Board +41.30 -40 to +60

22 MLI Motor Box -119.75 -250 to +290

23 MLI NPD+DPU -Xu -79.00 -250 to +290

24 MLI NPD+DPU +Yu +185.34 -250 to +290

25 MLI NPD +Zu -119.11 -250 to +290

26 MLI NPD +DPU -Yu -129.26 -250 to +290

27 Radiator +33.43 -60 to +120

28 Mother Board +40.83 -40 to +50

29 DPU Housing -Zu +40.34 -60 to +200

30 DPU Housing +Yu +40.55 -60 to +200

31 DPU Housing -Yu +40.55 -60 to +200


Thermal flux from s/c to MU unit: Q = -0.74 W.


49/50




Max predicted

temp in transientstate [C]

Operational

temp. [C]1 ELS Top Plate +0.63

+68.01

-60 to +120

2 ELS Housing +13.75 +43.09 -60 to +120

3 ELS Deflector +14.47 +43.13 -80 to +100



6 ELS MCP +23.62 +42.49 -40 to +50

7 ELS FEE Board +23.20 +42.55 -40 to +50

8 NPI Housing +14.26 +38.20 -60 to +120


10 NPI MCP +16.67 +38.35 -40 to +50

11 DPU Housing +Xu +21.98 +36.66 -60 to +200

12 DPU DC/DC +29.46 +40.92 -40 to +50


14 DPU HV Board +38.67 +48.36 -40 to +60


16 NPD1 +32.01 +39.71 -40 to +50

17 NPD2 +32.79 +39.83 -40 to +50

18 Motor Wheel +31.01 +37.63 -40 to +60

19 Motor Box +30.41 +35.12 -60 to +120

20 Motor +30.43 +35.15 -40 to +50

21 Motor Board +30.43 +35.16 -40 to +60


24 MLI NPD+DPU +Yu -106.35 +188.30 -250 to +290

25 MLI NPD +Zu -123.63 -38.04 -250 to +290

26 MLI NPD +DPU -Yu -129.29 +187.21 -250 to +290

27 Radiator +20.72 +32.11 -60 to +120

28 Mother Board +27.65 +38.53 -40 to +50

29 DPU Housing -Zu +26.92 +37.96 -60 to +200

30 DPU Housing +Yu +27.67 +39.07 -60 to +200

31 DPU Housing -Yu +27.67 +39.07 -60 to +200



50/50


8 CONCLUSIONS

1. The IMA unit thermal control allows good results on keeping representative IMA nodes intheir required temperature range for the all its cold cases.

2. For the hot case (2.1.4) all temperatures of the IMA nodes are corresponded to its

operational levels on the Communication phase. On the Observation phase all

temperatures of the IMA nodes are corresponded to its operational levels but temperatures

of nodes ## 6,7,8 are not satisfied to margin requirements (10 deg.).

3. For the hot case (2.1.5) all temperatures of the IMA nodes are also corresponded to its

operational levels on the Communication phase. On the Observation phase all

temperatures of the IMA nodes are corresponded to its operational levels but temperatures

of nodes ## 6,7,8,12 are not satisfied to margin requirements (10 deg.).

4. The MU unit thermal control allows good results on keeping representative MU nodes in

their required temperature range for the all cold cases.

5. For the hot operational case (3.1.4) temperature of scanner motor (57.87) is great than

required (50) on steady state before beginning of the Observation phase. At the same

state temperatures of electronics boards are some lower than their operational limits but

not satisfy to margin requirements (10 deg.). On the Observation phase temperatures of

nodes #4(50.89), #5(51.42), #13(50.23), 20(51.97) are great than required (50) and

temperatures of nodes ## 6,7,9,10,12,14,15,16,17,21,28 are lower than their operational

limits but not satisfy to margin requirement (10 deg.).

6. In hot operational case (3.1.6 / scanner motor is OFF) on steady state at the

Communication phase temperatures of nodes ##5,12,13,15,16,17,28 are lower than their

operational limits but not satisfy to margin requirements (10 deg.). On the Observation

phase temperatures of nodes ## 4,5,6,7,12,13 are also lower than their operational limits

but not satisfy to margin requirements (10 deg.).

7. In hot operational case (sensitivity to radiator and silver tape aging) temperatures of motor

and electronic boards are get out of their required temperature range both steady state and

transient state on the all phases of orbital flight.

Documents

VE-ASP-DS-0002 (Thermal Analysis and Thermal Design - I3R1)