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Virtual prototyping for EMC
Ing. Andrea Serra, Ph.D. [email protected]
EMC? Not a problem!
What is EMC
Emissions Couplings
Crosstalk
SSN
PI SI
RF signals
Signal lines PDN Circuit components
Antennas
EMC? Not THE problem!
What is EMC
Emissions Couplings
Crosstalk
SSN
PI SI
RF signals
Signal lines PDN Circuit components
Antennas
What is EMC
Emissions Couplings
Crosstalk
SSN
PI SI
RF signals
Signal lines PDN Circuit components
Antennas
EMC and product development
Component level
Module level
System level
Platform level
Proj
ect D
evelo
pmen
t Pha
se
EMC checks are often done here only…
…but they could be done here…
…here…
…and even here…
EMC system analysis PI
SI
RFI Emissions
Agenda •
•
•• Scale
• Discipline
• Domain
• System
•
Some Ws for numerical simulations…
Some Ws for numerical modeling and simulations…
Numerical virtual
prototype model
Designers, analysts.
At designer’s desktop
At any design
process stage
•
•
•
Some Ws for numerical modeling and simulations…
Because this
Is
from this
And the H…
Let me show!
ANSYS Technologies Electronics: High-Frequency and SI (HFSS, SIwave, Q3D Extractor)
Fluid Mechanics: From Single-Phase Flows
To Multiphase Combustion
Structural Mechanics: From Linear Statics
Systems: From Data Sharing
To High-Speed Impact
To Multi-Domain System Analysis
Low-Frequency/Electromechanical (Maxwell, Simplorer)
ANSYS Electronics capabilities - Geometry Full Wave Finite Element Method (FEM) Transient Finite Element Solver (HFSS TR) Integral Equation Solver (HFSS IE) with PO SBR+ solver (Ray Tracing)
MCAD ECAD
Automatic geometrical handling Simple and user-friendly editing interface Complete and customizable material library
Supported ECAD Translations Cadence
Allegro ⇒ 16.0, 16.1, 16.2, 16.3, 16.5, & 16.6 APD ⇒ 16.0, 16.1, 16.2, 16.3, 16.5, & 16.6 SiP Digital/RF ⇒ 16.0, 16.1, 16.2, 16.3, 16.5, & 16.6 Virtuoso ⇒ 5.10, 6.14, 6.15, & 6.16 (Linux only)
Mentor Graphics Expedition ⇒ v2005, v2007.1 thru EE7.9 (uses HKP design flow) Boardstation ⇒ 8.x (uses HKP design flow) Boardstation XE ⇒ v2007, v2007.1, v2007.2, v2007.3 and v2007.7 (uses HKP design flow) PADS ⇒ PowerPCB v5.2a, v2005 and v2007 (ASCII Flow)
Zuken (Sold by Zuken) CR5000 ⇒ 10 and higher (Zuken translator for .anf & .cmp) CR8000 ⇒ 2013 and higher (Zuken translator for .anf & .cmp)
ODB++ Altium Designer ⇒ R10 and greater Mentor Expedition ⇒ EE7.9.1 and greater Mentor PADS ⇒ 9.4 and greater Zuken Cadstar ⇒ 12.1 and greater
IPC-2581
Pulsonix ⇒ Revision 8.5 build 5905 and greater
Other ECAD Formats .anf ⇒ ANSYS neutral file format .gds ⇒ IC Chip format .xfl ⇒ Apache Sentinel format .dxf ⇒ AutoCad drawing format
ANSYS Electronics capabilities – Fields & Circuit Antennas & Radiation
• Near and Far Field Radiation • Arbitrary 3D antennas • Finite and Infinite Arrays • Frequency Selective Surfaces (FSS) & Photonic Band Gaps (PBG)
Microwave • Filters, Cavities, Resonators • Connectors, Components and Transitions
Signal Integrity/High-Speed Digital • Package Modeling – BGA, • PCB Board Modeling – Power/Ground planes, Mesh Grid Grounds, Backplanes • Connectors • Transitions
Radar systems • Period structures • Radar Cross Section (RCS) and Time Domain Reflectometry (TDR)
ANSYS Electronics capabilities – Fields & Circuit Antenna & Radiation
• Near and Far Field Radiation Patterns • Emission and immunity • S,Y,Z matrix • Frequency and time domain pre-post processing
Microwave • Gain, Insertion Loss • Power and thermal capabilities
Signal Integrity/High-Speed Digital • Eye diagrams • PCB Board Modeling – Power/Ground planes, Mesh Grid Grounds, Backplanes • Connectors • Transitions
ANSYS Electronics capabilities - RFI • Manage system performance data... • Simulate RFI/EMI effects…
• Identify the root-cause of RFI/EMI… • Resolve RFI/EMI issues…
ANSYS Electronics capabilities - RFI
• Complete RF System Modeling • Single and Multi-Transmitter Simulation Modes
• Linear and Non-Linear Analysis • Rx-generated Intermod • Inter-Tx Intermod • Amplifier Saturation
• Includes Wideband Effects • In-Band and Out-of-Band Interference
Tx-1
Tx-2
Tx-3
Rx-0
Signal at this point gets compared to Rx susceptibility
to determine EMI margin
For Fixed Channels Systems: • Peak In-band EMI Margin • Noise In-band EMI Margin •Point EMI Margin
For Frequency Hopping Systems: • Random Analysis Mode
Simulate RFI/EMI Effects
Scale: from component to platform
Scale: from component to platform
• Mobile device in kitchen to router in living room • Multiple wall penetrations • Multipath, polarization mismatch
Mobile Phone
Router
Coupled EM Solutions: Location Performance
Electronics numerical problem scales
21 20/04/2018
Decomposition Method
Geometry and Material Complexity
Elec
trica
l Size
FEM (Frequency & Time)
Advanced Ray Tracing
MoM
Discipline: Power & Temperatures Power map and temperature data accounting for copper resistive losses and packages
Current Density
Power Map
Temperature
Temperature
Domain: Multi-domain analysis An integrated, multi-purpose UI that incorporates various solvers (numerical, circuit, system) with bi-directional coupling and vertical capabilities.
•
•
•
•
Domain: Multi-domain analysis
Non-Linear Circuit
EM-Fields
Push-Excitations
Dynamic Link
S-Parameters
System/Circuit
Dynamic Link
Push-Excitations
Domain: Multi-domain analysis RF and μwave frequency domain circuit design
Harmonic Balance Load-Pull Envelope Oscillator TV Noise/Phase Noise RFI
RF Spice based time domain circuit designs for Signal Integrity and Power Integrity Simulations
Transient, Quick-Eye, Verif-Eye AMI Analysis Q2D enabler
SI
Power integrity
PI solution example
( ) Ω=== m 800mA 87.376V 18.0
* pkdrivers
MaxSwingTarget AN
VZ
VV 8.1CC =
VVV 18.010/CCMaxSwing ==
Peak current = 37,87mA
PI solution example
PI solution example Capacitor Library Browser
1. More than 20,000 Cap & Inductor models included
2. Enables viewing multiple capacitor impedances curves
3. Calculates parallel impedance of multiple Caps
4. Enables creation of Customer Defined Libraries
PI solution example
0.00 10.00 20.00 30.00 40.00 50.00 60.00 70.00 80.00 90.00 100.00Time [ns]
1.20
1.40
1.60
1.80
2.00
2.20
2.40
Y1
[V]
U o eCurve Info pk2pk
V(VCC_U41-2)Transient 0.2177
V(VCC_U41-21)Transient 0.2295
V(VCC_U41-42)Transient 0.2418
V(VCC_U41-44)Transient 0.2549
V(VCC_U41-63)Transient 0.2729
V(VCC_U41-84)Transient 0.2169
Max peak to peak noise 273 mV 24% < limit
Time-domain noise specification met
Automated PI advisor STEP 1 • Select reference port locations
• Set VRM parameters
• Define impedance mask
Automated PI advisor STEP 2 - Select Candidate Capacitors for Optimization
1.
2. 3.
4.
5. 6. 7.
Automated PI advisor
STEP 3 – Setup optimization criteria • Total Price
• Total Number of Capacitors
• Total Number of Capacitors types
• Total Capacitor Area
Signal integrity
IBIS model – IBIS-AMI analysis IBIS-AMI
• AMI stands for Algorithmic Modeling Interface
• It allows users to specify their own transmitter and receiver models as C-interface compiled
libraries • ANSYS supports Matlab as well as compiled DLLs
• faster signal processing algorithms
• intellectual property protection
• Mainly used in convolution (fast) transient engines for channel simulation
• Designed to be used with fixed time step data
Signal Integrity analysis Models can be used for any time/frequency analysis
• SSO
• Verify signaling with non-ideal power delivery to drivers
• Eye diagrams
• Verify signal is clean enough for proper detection
• Cross-talk
• Verify neighbors do not cause excessive noise
SI analysis setup
Step 2: Assign IBIS TX/RX Buffers
Step 3: Identify Component Pwr/Gnd Nets
Step 4: Set VRM Parameters
Step 5: Set Transient Simulation
Step 1: Select Signal Nets
TX Circuit Module PCB Connector PCB Module RX Circuit
Signal Integrity – Serial channel example
Modules
Connectors
Signal Traces
Signal Integrity – Serial channel example
What is a Full System ANSYS EMI/EMC Methodology ANSYS EMI/EMC simulation method that
• Utilizes the best in class tools (accuracy, reliability, speed)
• Incorporates physical layouts and full 3D enclosures
• Uses actual real world transient signals
• Seamlessly combines frequency and time domain simulations
• Combines electromagnetic/circuit/system solvers with full bi-directionality
• Calculates quantities for regulation compliancy
What are the steps? 1. Import PCB layout and components.
2. Perform analysis of PCB to calculate S matrix.
3. Dynamically link results to the circuit solver and create driving circuit (attach drivers and receivers).
4. Perform a time/frequency domain analysis of entire system in Electronics Desktop.
5. Push voltage/excitation back and dynamically link to the EM solver.
6. Solve the full system with real signals.
Geometry Import Numerical solution for S matrix
Circuit solve with drivers and receivers
Push real excitations back
Solve full 3D system
The full system simulation
Push real excitations back
1.00 10.00 100.00 1000.00Freq [MHz]
-90.00
-80.00
-70.00
-60.00
-50.00
-40.00
-30.00
-20.00
-10.00
0.00
10.00
20.00
3m S
pher
e (dB
uVolt
s)
Ansoft Corporation HFSSModel1XY Plot 1
Curve Info
3M Sphere Max E Field valuesSetup1 : Sw eep1
Numerical FEM solution Solve driven circuit with S matrix model
Solve FEM model with real excitation Dynamically link to FEM