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Organizational Chart● China
● Europe
● Japan
● Korea
● North America
● Taiwan
Last updated: March 13, 2015
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Global Technical
Committee and TC
Chapters
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Legend:
TCC — the Locale has a TC Chapter of the global technical committee.
CFG — the Locale has a TC Chapter Formation Group, as defined in PG 6.5, of the global technical committee.
Note 1: An underlined Locale has an RSC and may also be referred as “a Region” (e.g., “Europe Region”).
Note 2: Some TC Chapters of different global technical committees jointly hold a meeting (indicated in red rectangles).
CFG
CFG
CFG
4 / 37
Legend:
TCC — the Locale has a TC Chapter of the global technical committee.
CFG — the Locale has a TC Chapter Formation Group, as defined in PG 6.5, of the global technical committee.
Note 1: An underlined Locale has ab RSC and may also be referred as “a Region” (e.g., “Europe Region”).
Note 2: Some TC Chapters of different global technical committees jointly hold a meeting (indicated in red rectangles).
5 / 37
Legend:
TCC — the Locale has a TC Chapter of the global technical committee.
CFG — the Locale has a TC Chapter Formation Group, as defined in PG 6.5, of the global technical committee.
Note 1: An underlined Locale has an RSC and may also be referred as “a Region” (e.g., “Europe Region”).
Note 2: Some TC Chapters of different global technical committees jointly hold a meeting (red rectangles).
* In NA, Micropatterning is traditionally called Microlithography.
** In Japan, Assembly & Packaging is traditionally called Packaging.
*** In Japan, Automated Test Equipment is traditionally called Test.
CFG
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Regional Standards Committee (RSC) Organizations
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SEMI Europe RSC OrganizationCo-chairs: Bert Planting - ASML, Werner Bergholz - Jacobs University of Bremen
Vice-chair: Frank Petzold - Trustsec
Europe Chapter of Metrics Global Technical Committee
C: Alfred Honold - InReConC: Lothar Pfitzner - FhG IISB
Europe Chapter of PV Materials Global Technical Committee
C: Peter Wagner - ConsultantC: Huber Aulich - Solar Valley
Europe Chapter of Physical Interfaces & Carriers Global Technical Committee
C: Alfred Honold - InReConC: Frank Petzold - Trustsec
Europe Chapter of Gas Global Technical Committee
C: Jean-Marie Collard - Solvay ChemicalsC: Gordon Ferrier - Tiger Optics
Europe Chapter of Compound Semiconductor Materials Global Technical Committee
C: Arnd Weber - SiCrystal
Europe Chapter of Silicon Wafer Global Technical Committee
C: Werner Bergholz - Jacobs University of BremenC: Peter Wagner - ConsultantC: Fritz Passek - Siltronic
Europe Chapter of Liquid Chemicals Global Technical Committee
C: Jean-Marie Collard - Solvay ChemicalsC: Gordon Ferrier - Tiger Optics
Europe Chapter of Information & Control Global Technical Committee
C: Alfred Honold - InReConC: Frank Petzold - Trustsec
Europe Chapter of Automation Technology Global Technical Committee
C: Christian Hoffman - PEER Group
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SEMI Japan RSC OrganizationCo-Chair: Mitsuhiro Matsuda - Hitachi Kokusai Electric Co-Chair: Naoyuki Kawai - The University of Tokyo
Vice Chair: Supika Mashiro - TEL
Special Groups
Reporting to the JRSC
Japan Chapter of Gases & Facilities Technical Committee
C: Hiromichi Enami - Hitachi High-TechnologiesC: Isao Suzuki - MKS Japan
Japan Chapter of Environmental Health & Safety Global Technical Committee
C: Supika Mashiro - TELC: Hidetoshi Sakura - IntelC: Moray Crawford - Hatsuta Seisakusho
FPD Coordination Group
L: Yoshitada Nogami - SK ElectronicsL: Makoto Yamamoto - Muratec
Standardization Process Improvement (SPI)
L: Supika Mahiro -TEL
Japan Chapter of Micropatterning Global Technical Committee
C: Morihisa Hoga - Dainippon Printing
Japan Chapter of Compound Semiconductor Materials Global Technical Committee
C: Masayoshi Obara - Shin-Etsu Handotai
Japan Chapter of Physical Interfaces & Carriers Global Technical Committee
C: Tsuyoshi Nagashima - MiraialC: Tsutomu Okabe - TDKC: Kenji Yamagata - DAIFUKU
Japan Chapter of Test Global Technical Committee
C: Hirofumi Kaga - Renesas Electronics C: Takashi Umenaga -Teradyne
Japan Chapter of Automation Technology Global Technical CommitteeC: Terry Asakawa -TELC: Ken Sambu - Mitsubishi ElectricC: Makoto Ishikawa - Nisshinbo Mechatronics
Japan Chapter of PV Materials Global Technical Committee
C: Takashi Ishihara - Mitsubishi ElectricC: Kazuhiko Kashima - GlobalWafers JapanC: Tetsuo Fukuda - AIST
Japan Chapter of FPD Materials & Components Global Technical Committee
C: Tadahiro Furukawa - Yamagata UniversityC: Yoshihiko Shibahara - FUJIFILM
Japan Chapter of Packaging Global Technical Committee
C: Kazunori Kato - AiTC: Masahiro Tsuriya - iNEMIC: Yutaka Koma - Koma Consulting
Japan Chapter of FPD Metrology Global Technical Committee
C: Ryoichi Watanabe - Japan DisplayC: Akira Kawaguchi - Otsuka Electronics
Japan Chapter of PV Global Technical Committee
C: Hiromu Takatsuka - PVTECC: Kazuhiko Kashima - GlobalWafers JapanC: Masaaki Yamamichi - AIST
Japan Chapter of Metrics Global Technical Committee
C: Toshio Murakami – Murakami Corporation
Japan Chapter of Traceability Global Technical Committee
C: Yoichi Iga - FreelanceC: Hirokazu Tsunobuchi - Keyence
Japan Chapter of Silicon Wafer Global Technical Committee
C: Naoyuki Kawai - The University of Tokyo C: Tetsuya Nakai - SUMCO
Japan Chapter of Information & Control Global Technical Committee
C: Takayuki Nishimura - SCREEN Semiconductor SolutionsC: Mitsuhiro Matsuda - Hitachi Kokusai Electric
Japan Chapter of Liquid Chemicals Global Technical Committee
C: Hiroshi Tomita - ToshibaC: Hiroyuki Araki - SCREEN Semiconductor Solutions
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NA Chapter of Metrics Global Technical Committee
C: David Bouldin - Fab ConsultingC: Mark Frankfurth - Cymer
NA Chapter of Silicon Wafer Global Technical Committee
C: Dinesh Gupta - STAC: Noel Poduje - SMSVC: Mike Goldstein - Intel
NA Chapter of Traceability Global Technical Committee
C: Win Baylies - BayTech-ResorC: Yaw Obeng - NIST
SEMI North America (NA ) RSC Organization - NA LocaleCo-Chairs: Steve Lewis – DPS Engineering & Chris Evanston – Salus Engineering
Vice-Chairs: Brian Rubow – Cimetrix, David Busing – Consultant
NA RSC Technical Architect Board
C: James Moyne - University of MichiganC: Yaw Obeng - NIST
NA Chapter of Information & Control Global Technical Committee
C: Jack Ghiselli - Ghiselli ConsultingC: Brian Rubow - CimetrixC: Lance Rist - Industry Consultant
NA Chapter of Flat Panel Display Global Technical Committee
C: Bill Colbran - Engenuity Systems
NA Chapter of Physical Interfaces & Carriers Global Technical Committee
C: Matt Fuller - EntegrisC: Stefan Radloff - Intel
NA Chapter of Automated Test Equipment Global Technical CommitteeC: Ajay Khoche - Khoche Consulting
NA Chapter of 3DS-IC Global Technical Committee
C: Richard Allen - NISTC: Sesh Ramaswami - Applied MaterialsC: Chris Moore - BayTech-Resor
NA Chapter of Facilities Global Technical Committee
C: Steve Lewis - DPS Engineering
NA Chapter of Liquid Chemicals Global Technical Committee
C: Frank Flowers - PeroxyChemC: Frank Parker - ICL
NA Chapter of HB-LED Global Technical Committee
C: Iain Black - PhilipsC: Mike Feng - SilianC: Chris Moore - BayTech-Resor
NA Chapter of Gases Global Technical Committee
C: Tim Volin - Parker HannifinC: Mohamed Saleem - Fujikin
NA Chapter of PV MaterialsGlobal Technical Committee
C: Lori Nye - Brewer ScienceC: John Valley - Sun EdisonC: Hugh Gotts - Air Liquide
NA Chapter of Photovoltaic Global Technical Committee
C: Win Baylies - BayTech-ResorC: James Moyne - University of Michigan
NA Chapter of MEMS/NEMS Global Technical Committee
C: Win Baylies - BayTech-ResorC: Steve Martell - Sonoscan
NA Chapter of Compound Semiconductor Materials Global Technical Committee
C: Russ Kremer - Freiberger Compound MaterialsC: James Oliver - Northrop Grumman
NA Chapter of Environmental Health & Safety Global Technical Committee
C: Chris Evanston - Salus EngineeringC: Sean Larsen - Lam ResearchC: Bert Planting - ASML
NA Chapter of Microlithography Global Technical Committee
C: Wes Erck - Wes Erck & AssociatesC: Rick Silver - NIST
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SEMI North America RSC Organization – China LocaleCo-Chairs: Steve Lewis – DPS Engineering & Chris Evanston – Salus Engineering
Vice-Chairs: Brian Rubow – Cimetrix, David Busing – Consultant
China Chapter of HB-LED Global Technical Committee
C: Yong Ji - Guizhou Haotian Optoelectronics Technology C: Weizhi Cai - San’an Optoelectronic
China Chapter of PV Global Technical Committee
C: Guangchun Zhang - CanadianSolarC: Jun Liu - China Electronics Standardization Institute
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Co-Chairs: Steve Lewis – DPS Engineering & Chris Evanston – Salus Engineering Vice-Chairs: Brian Rubow – Cimetrix, David Busing – Consultant
SEMI North America RSC Organization – Korea Locale
Korea EHS CFG
L: Seung Jong Ko - SK hynixL: Hyunsuk Kim - Samsung Electronics
Korea HB-LED CFG
L: HyeongSoo Park - SEMESL: Jong Hyeob Baek - KOPTI
Korea Chapter of FPD Global Technical Committee
C: JongSeo Lee - Samsung DisplayC: II-Ho (William) Kim - Light Measurement Solution
Korea Chapter of Information & Control Global Technical Committee C: Hyungsu Kim - Doople C: Chul Hong Ahn - SK hynixC: Gun Woo Lee - Miracom Inc.
Korea Chapter of Global Facilities Technical Committee
C: Kwang Sun Kim - KUT
Korea Gas & Chemicals CFG
L: TBD
Korea Chapter of FPD Metrology Global Technical Committee
C: JongSeo Lee - Samsung DisplayC: II-Ho (William) Kim - Light Measurement Solution
Taiwan TC Chapters
Taiwan Chapter of EHS Global Technical Committee
C:Shuh-Woei Yu - SAHTECHC: Fang-Ming Hsu - TSMC
ISC Taiwan Advisor
Tzeng-Yow Lin - CMS/ITRI
12 / 37
SEMI North America RSC Organization – Taiwan LocaleCo-Chairs: Steve Lewis – DPS Engineering & Chris Evanston – Salus Engineering
Vice-Chairs: Brian Rubow – Cimetrix, David Busing – Consultant
Taiwan Chapter of 3DS-IC Global Technical Committee
C: Tzu-Kun Ku - ITRIC: Wendy Chen - King Yuan ElectronicsC: Roger Hwang ASE
Taiwan Chapter of Photovoltaic Global Technical Committee
C : B. N. Chuang - CMS/ITRIC : J.S. Chen - TeraSolarC : Ray Sung - UL Taiwan
Taiwan Chapter of Information and Control Global Technical Committee
C:Robert Chien - TSMC
Taiwan Chapter of Flat Panel Display Global Technical Committee
C: Tzeng-Yow Lin - CMS/ITRIC: Jia-Ming Liu - TDMDA
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Organization of Each TC Chapter
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3DS-IC Global Technical Committee
Taiwan TC Chapter of 3DS-IC Global Technical Committee
C: Tzu-Kun Ku - ITRIC: Wendy Chen - King Yuan ElectronicsC: Roger Hwang - ASE
Test TF
L: Tzong-Tsong Miau - ITRIL: Roger Hwang - ASEL: Ming-Chin Tsai - KYEC
Middle End Process TF
L: Arthur Chen - NTUSTL: Erh Hao Chen - ITRIL: Jerry Yang - SEMATECH
NA TC Chapter of 3DS-IC Global Technical Committee
C: Richard Allen - NISTC: Sesh Ramaswami - Applied MaterialsC: Chris Moore - BayTech-Resor
3DS-IC Bonded Wafer Stack TF
L: Richard Allen - NIST
3DS-IC Inspection and Metrology TF
L: Victor Vartanian -SEMATECH L: David Read - NIST
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Electromagnetic Characterization SG
L: Mikio Kiyono - AET
Assembly & Packaging Global Technical Committee
450 mm ATDP TF
L: Akihito Kawai - DiscoL: Sumio Masuchi - Disco L: Kiyofumi Tanaka – Shin-Etsu PolymerL: Kenichi Watanabe - Lintec
3D-IC SG
L: Masahiro Tsuriya - iNEMIL: Haruo Shimamoto - AIST
Thin Chip Handling TF
L: Hideki Suzuki - Shin-Etsu PolymerL: Kazuhiko Nakamura - ConsultantL: Haruo Shimamoto - AIST
Packaging 5 Year Review TF
L: Masahiro Tsuriya - iNEMIL: Kazunori Kato - AiT
Japan TC Chapter of Packaging Technical Committee
C: Kazunori Kato - AiTC: Masahiro Tsuriya - iNEMIC: Yutaka Koma - Koma Consulting
Fiducial Mark Interoperability TF
L: Sumio Masuchi - Disco
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Automation Technology Global Technical Committee
Global PV Equipment Interface Specification (PV-EIS) TF
L: Makoto Ishikawa - Nisshinbo Mechatronics
Europe TC Chapter of Automation Technology Global Technical Committee
C: Christian Hoffman - PEER Group
Japan TC Chapter of Automation Technology Global Technical Committee
C: Makoto Ishikawa - Nisshinbo MechatronicsC: Ken Sambu - Mitsubishi ElectricC: Terry Asakawa - TEL
Global PV Equipment Interface Specification (EIS) TF
L: Carsten Born - VITRONIC GmbH
PV Wafer Traceability TF
L: TBD
17 / 37
Automated Test Equipment Global Technical Committee
NA TC Chapter of Automated Test Equipment Technical Committee
C: Ajay Khoche - Khoche Consulting
Standard Test Data Format (STDF) TF
L: Ajay Khoche - Khoche Consulting
Test Cell Communcations TF
L: Len Van Eck - LTX- CredenceL: Mark Roos - Roos Instruments
Japan TC Chapter of Test Technical Committee
C: Hirofumi Kaga - Renesas Electronics C: Takashi Umenaga -Teradyne
18 / 37
Compound Semiconductor Materials (CSM) Global Technical Committee
Europe TC Chapter of CSM Global Technical Committee
C: Arnd Weber - SiCrystal
Contactless Resistivity and Mobility Mapping TF
L: Wolfgang Jantz - Semimap
SiC TF
L: Arnd Weber - SiCrystal
Japan TC Chapter of CSM Global Technical Committee
C: Masayoshi Obara - Shin-Etsu HandotaiC: open
5 Year Review TF
L: TBD
Global 200 mm GaAs Wafer Specification TF
L: TBD
Sapphire Substrate TF
L: Toshiro Kotaki - Namiki Precision Jewel
International SiC TF
L: Taizo Hoshino - Nippon Steel & Sumikin Materials
NA TC Chapter of CSM Global Technical Committee
C: Russ Kremer - Freiberger Compound MaterialsC: James Oliver - Northrop Grumman
Electrical Properties TF
L: Austin Blew - LEI
SEMI M55 5-Yr Review TF
L: Judy Kronwasser - NOVASiC
Silicon Carbide TF
L: Open
GaN TF
L: Judy Kronwasser - NOVASiC
19 / 37
Japan TC Chapter of EHS Global Technical Committee
C: Supika Mashiro - TELC: Hidetoshi Sakura - IntelC: Moray Crawford - Hatsuta Seisakusho
Global S23 Revision TF
L: George Hoshi - TEL
Environmental, Health & Safety (EHS) Global Technical Committee
GHG Emission Characterization TF
L: George Hoshi - TELL: Tetsuya Kitagawa - Sony
Seismic Protection TF
L: Eiji Nakatani - SCREEN Semiconductor Solutions
FPD System Safety TF
L: Naokatsu Nishiguchi- Dainippon Screen Manufacturing
Taiwan TC Chapter of EHS Global Technical Committee
C: S. W. Yu - SAHTECHC: F. M. Hsu - TSMC
IC Equipment Safety TF
L: Colin Shen - MXICL: C. C. Huang - SAHTECH
Gas and Chemical Safety TF
L: Benny Chen - AUOL: Heng-Li Sue - SAHTECHL: Moony Lee - UMC
Seismic TF
L: K. C. Tsai - NCREEL: J. S. Hwang - NCREEL: D. W. Sun - TSMC
FPD Safety Subcommittee
L: C. C. Huang - SAHTECH
Equipment Safety TF
L: Benny Chen - AUOL: Juo Cho - AUOL: Alice Lin - CMO
Environmental Sustainability TF
L: Tony C. H. Lu - ITRIL: C Y Huang - TSMC
PV Safety TF
L: Eddie Wu - Nexpower
LED Safety TF
L: Eric Lin - Epistar
EHS TC ChapterAdvisor
Roger Wu - UMC
STEP Planning WG
L: Kenji Sugihara - Panasonic
20 / 37
S2 Interlock Reliability TF
L: Bert Planting - ASMLL: Tom Pilz - Pilz GmbH
Ergonomics TF
L: Ron Macklin - Macklin & AssociatesL: Paul Schwab - Texas Instruments
NA TC Chapter of EHS Global Technical Committee
C: Chris Evanston - Salus EngineeringC: Sean Larsen - Lam ResearchC: Bert Planting - ASML
Environmental, Health & Safety Global Technical Committee
S2 Ladders & Steps TF
L: Ron Macklin - Macklin & Associates L: Carl Wong - AKTL: Lindy Austin - Salus Engineering
Fire Protection TFL: Eric Sklar - Safety GuruL: Matt Wyman - Koetter Fire
Lifting Equipment TF
L: Ron Macklin - Macklin & Associates
S2 Chemical Exposure TF
L: John Visty - Salus Engineering
S22 Revision TF
L: Chris Evanston - Salus EngineeringL: Sean Larsen - Lam Research
S6 Revision TF
L: John Visty - Salus EngineeringL: Glenn Holbrook - TUV SUD
S2 Non-Ionizing RadiationTF
L: Sean Larsen - Lam Research L: John Visty - Salus Engineering
S10 Revision TF
L: Bert Planting - ASMLL: Tom Pilz - Pilz GmbH
Manufacturing Equipment Safety Subcommittee
C: Cliff Greenberg - Nikon PrecisionC: Andrew Giles - ESTECC: Lauren Crane - KLA-Tencor
S1 Revision TF
L: Lauren Crane - KLA-TencorL: Edward Karl - Applied Materials
Seismic Liaison TF
L: Lauren Crane - KLA-Tencor
Korea TC Chapter of EHS CFG
L: Seung Jong Ko - SK hynixL: Hyunsuk Kim - Samsung Electronics
S2 Sub-WG
L: Deok Seop Shim - TUV Rheinland
S23 Sub-WG
L: Sangyun Jung - Samsung Electronics
S7 Revision TF
L: Chris Evanston - Salus Engineering
Energetic Materials EHS TF
L: Steve Trammell - SEMATECHL: Andy McIntyre - EORM
Hazardous Energy Control Isolation Devices TF
L: Andrew Giles - ESTEC L: Sean Larsen - Lam Research AG L: Mark Fessler - Tokyo Electron
Global S23 TF
L: Lauren Crane - KLA-Tencor
21 / 37
Facilities Global Technical Committee
Japan TC Chapter of Facilities Global Technical Committee
C: Hiromichi Enami - Hitachi High TechnologiesC: Isao Suzuki - MKS Japan
F1 Revision TF
L: Shuji Moriya - Tokyo Electron YamanashiL: Yoshifumi Machii - Fujikin
5-year Review TF
L: Yoshifumi Machii - Fujikin
Korea TC Chapter of Facilities Global Technical Committee
C: Kwang Sun Kim - KUT
Equipment Cleanness TF
L: Insoo Cho - Shinsung ENG
NA TC Chapter of Facilities Global Technical Committee
C: Steve Lewis - DPS Engineering
F51 Revision TF
L: Dalia Vernikovsky - Applied Seals North America
Building Information Modeling (BIM) for Semiconductor Capital Equipment TF
L: Ben Bruce - Applied Materials
D31 Revision TF
L: Kose Tanahashi - Samsung ElectronicsL: Masao Kochi - HighlandL: Keizo Ochi - Konica Minolta
22 / 37
FPD Metrology Global Technical Committee
Transparent Display TF
L:JongSeo Lee - Samsung Display
Perceptual Image Quality TF
L: Jongho Chong - Samsung Display
Perceptual Viewing Angle TF
L: Myongyoung Lee - LG Electronics
Liaison TF
L: YP Lan - ITRIL:DA Chang - KingbirdL:RJ Chuang - TDMDAL:Tony Chiu - CIPO
Flexible Display TF
L: WangWen - Tung - ITRI
LCD Subcommittee
L: Kerson Wang - AUO
E-Paper Display TF
L: Fang Hui - MeiL: Bor-Jiunn Wen - CMS/ITRI
Touch Screen Panel TF
L: Yen-Wen Fang - AUOL: S.Y. Chou - CMS/ITRI
Korea TC Chapter of FPD Metrology Global Technical Committee
C: JongSeo Lee - Samsung DisplayC: II-Ho (William) Kim - Light Measurement Solution
Japan TC Chapter of FPD Metrology Global Technical Committee
C: Ryoichi Watanabe - Japan DisplayC: Akira Kawaguchi - Otsuka Electronics
Taiwan TC Chapter of FPD Metrology Global Technical Committee
C: Tzeng-Yow Lin - CMS/ITRIC: Jia-Ming Liu - TDMDA
23 / 37
FPD Materials & Components Global Technical Committee
Polarizing Film TF
L: Toshihito Otsuka - SanritzL: Yoshihiko Shibahara - FujifilmL: Shigeo Kobayashi - Nitto Denko
Flexible Display TF
L: Haruhiko Itoh - Teijin L: Tadahiro Furukawa - Yamagata University
FPD Color Filter TF
L: Tadahiro Furukawa -Yamagata University
FPD Mask TF
L: Kaname Nitobe - HOYAL: Kazuya Shiojiri - SK Electronics
PDP Subcommittee
L: SeKwang Park - Kyungpook Univ.
LCD Subcommittee
L: JongSeo Lee - Samsung Display
OLED Subcommittee
L: Choonghoon Yi - MODISTECH
NA TC Chapter of FPD Technical Committee
C:Bill Colbran - Engenuity Systems
Japan TC Chapter of FPD Materials & Components Global Technical CommitteeC: Tadahiro Furukawa - Yamagata UniversityC: Yoshihiko Shibahara - Fujifilm
Korea TC Chapter of FPD Technical Committee
C: JongSeo Lee - Samsung DisplayC: II-Ho (William) Kim - Light Measurement Solution
24 / 37
NA TC Chapter of Gases Global Technical Committee
C: Tim Volin - Parker HannifinC: Mohamed Saleem - Fujikin
Mass Flow TF
L: Mohamed Saleem - Fujikin
Pressure Measurement TF
L: Joyce Chen - UCTL: Jeff Christian - WIKA
Filters & Purifiers TF
L: Mohamed Saleem - Fujikin
Materials of Construction Gas Delivery Systems TF
L: Tim Volin - Parker HannifinL: Bill Kiikvee - AP TECH
Gases Global Technical Committee
Heater Jacket TF
L: David Colquhoun - BriskHeat
Gas Specifications TF
L: Mark Ripkowski - CONSCI
Surface Mount Sandwich Component Dimensions TF
L: Matt Milburn - UCT
Europe TC Chapter of Gas Global Technical Committee
C: Jean-Marie Collard - Solvay ChemicalsC: Gordon Ferrier - Tiger Optics
Korea Gas & Liquid Chemicals CFG
L: TBD
Japan TC Chapter of Gases Global Technical Committee
C: Hiromichi Enami - Hitachi High TechnologiesC: Isao Suzuki - MKS Japan
Gas Panel Test Method TF
L: Yoshifumi Machii - Fujikin L: Shuji Moriya - Tokyo Electron Yamanashi
Standardization of live Gas Flow Rate Study Group
L: Shuji Moriya - Tokyo Electron Yamanashi
25 / 37
HB-LED Global Technical Committee
China TC Chapter of HB-LED Global Technical Committee
C: Yong Ji - Guizhou Haotian Optoelectronics Technology C: Weizhi Cai - San’an Optoelectronic
Single Crystal Sapphire TF
L: Yong Ji - Guizhou Haotian Optoelectronics Technology L: Xinhong Yang - AURORA
NA TC Chapter of HB-LED Global Technical Committee
C: Iain Black - PhilipsC: Mike Feng - SilianC: Chris Moore - BayTech-Resor
HB-LED Equipment Automation Interfaces TF
L: Daniel Babbs - Brooks AutomationL: Jeff Felipe - Entegris
HB-LED Assembly TF
L: Paul Reid - Kulicke & Soffa
HB-LED Wafer TF
L: Win Bayles - BayTech-Resor
HB-LED Impurities and Defects in Sapphire Wafers TF
L: Luke Glinski - GT Advanced Technologies
HB-LED Equipment Communication Interfaces TF
L: Brian Rubow - Cimetrix
Patterned Sapphire Substrate (PSS) TF
L: Win Bayles - BayTech-Resor
Korea HB-LED CFG
L: HyeongSoo Park - SEMESL: Jong Hyeob Baek - KOPTI
Test Methods TF
L: Peter Wagner - Self
HB-LED Tablet WG
L: Win Bayles - BayTech-ResorL: Chris Moore - BayTech-Resor
GaN based LED Epitaxial Wafer TF
L: Donghai Wu - THTF L: Xinhong Yang - AURORA
Sapphire Single Crystal Ingot TF
L: Hongo Zuo - AURORA
Process Control Systems TF
L: Martin Schellenberger - FhG IISB
26 / 37
Information & Control Global Technical Committee
TA
Hiroshi Kondo - Murata MachineryTadashi Mochizuki - TEL
GEM300 TF
L: Yoshihisa Takasaki - SCREEN Semiconductor SolutionsL: Yuko Toyoshima - Hitachi High-Technologies
Equipment Information System Security TF
L: Mitch Sakamoto - Freelance
Sensor Bus TF
L: Hideaki Ogihara - Reno Sub- Systems
Japan I&CC Maintenance TF
L: Hideaki Ogihara - Reno Sub- SystemsL: Mitsuhiro Matsuda - Hitachi Kokusai Electric
GEM300 TF
L: Jong Sub Shim - ASM L: Chang Yul Cho - SEMESL: Byoung Min Im - TEL Korea
DDA TF
L: Hyungsu Kim - Doople
Europe TC Chapter of Information & Control Global Technical Committee
C: Alfred Honold - InReConC: Frank Petzold - Trustsec
Japan TC Chapter of Information & Control Global Technical Committee
C: Takayuki Nishimura - SCREEN Semiconductor SolutionsC: Mitsuhiro Matsuda - Hitachi Kokusai ElectricAdviser: Mitch Sakamoto - Freelance
Korea TC Chapter of Information & Control Global Technical Committee
C: Hyungsu Kim - DoopleC: Chul Hong Ahn - SK hynixC: Gun Woo Lee - Miracom Inc.
Fiducial Mark Interoperability TF
L: Mitsuhiro Matsuda - Hitachi Kokusai Electric
27 / 37
Information & Control Global Technical Committee
GEM300 TF
L: Brian Rubow - CimetrixL: Gino Crispieri - Consultant
Diagnostic Data Acquisition (DDA) TF
L: Brian Rubow - CimetrixL: Gino Crispieri - Consultant
Process Control System Architecture (PCS) TF
L: James Moyne - University of MichiganL: Chris Maloney - Intel
Energy Saving Equipment Communication TF
L: Gino Crispieri - ConsultantL: Mike Czerniak - Edwards Vacuum
Equipment Engineering System (EES) TF
L : Ivan Chen - TSMCL: Jack Huang - MKS
Factory Integration TF
L : MT Yeh - PSCL: Robert Weng - TELL: H. S You - Energywell
Liaison - TSIA
Celia Shih - TSIA
Information & Control TC Chapter Advisor
Thomas W.Y Chen - TSMC
NA TC Chapter of Information & Control Global Technical Committee
C: Brian Rubow - CimetrixC: Jack Ghiselli - Ghiselli ConsultingC: Lance Rist - Industry Consultant
Taiwan TC Chapter of Information & Control Global Technical Committee
C: Robert Chien - TSMC
Sensor Bus TF
C: James Moyne - University of Michigan
Automated Material Handling System (AMHS) TFL :William Liu - UMCL: Hu Szn Fan - UMC
28 / 37
Precursor Specifications TF
L: Paul Williams - SAFC Hitech
Liquid Chemicals Global Technical Committee
Solvents in Advanced Processes TF
L: TBD
Analytical Methods TF
L: Frank Flowers - PeroxyChem
SEMI F57 Rewrite TF
L: James Henry - Arkema GroupL: Ian Francisco - Lam Research
Determining Roughness of Polymer Surfaces TF
L: Gunter Moeller - Arkema Group
SEMI IX Resin TF
L: Slava Libman - Air Liquide
UPW Filter Performance TF
L: Slava Libman - Air Liquide
SEMI F63 Rewrite TF
L: Slava Libman - Air Liquide
SEMI F31, F39 & F41 Rewrite TF
L: David Kandiyeli - Mega Fluid SystemsL: Koh Murai - Mega Fluid Systems
SEMI F40 Rewrite TF
L: Don Hadder Jr. - Intel
Liquid Chemicals Subcommittee
C: Frank Flowers - PeroxyChemC: Frank Parker - ICL
Liquid Chemical Distribution Subcommittee
C: open
Diaphragm Valve TF
L: Shigeru Ohsugi - CKDL: Kimihito Sasao - Advance Electric
Welding Fitting TF
L: Kimihito Sasao - Advance ElectricL: Takashi Hasegawa - KITZ SCT
Liquid Filter TF
L: Takuya Nagafuchi - Nihon EntegrisL: Takehito Mizuno - Nihon Pall
Liquid-Borne Particle Counter TF
L: Kaoru Kondo - RIONL: Kazutoshi Kato - PMS
Europe TC Chapter of Liquid Chemicals Global Technical Committee
C: Jean-Marie Collard - Solvay ChemicalsC: Gordon Ferrier - Tiger Optics
Japan TC Chapter of Liquid Chemicals Global Technical Committee
C: Hiroshi Tomita - ToshibaC: Hiroyuki Araki - SCREEN Semiconductor Solutions
NA TC Chapter of Liquid Chemicals Global Technical Committee
C: Frank Flowers - PeroxyChemC: Frank Parker - ICL
Permeation Tubes for Trace Moisture Calibration TF
L: Jean-Marie Collard - Solvay ChemicalsL: Jim Mc Kinley - KIN-TEK
Ultrapure Liquid Evaluation Study Group
L: Kaoru Kondo - Rion L: Hiroshi Sugawara - Organo
Korea Gas & Liquids Chemicals CFG
L: TBD
29 / 37
MEMS/NEMS Global Technical Committee
Packaging TF
L: Steve Martell - Sonoscan
Wafer Bond TF
L: Win Baylies - BayTech-ResorL: Richard Allen - NIST
Material Characterization TF
L: Kevin Turner - University of Pennsylvania
International MEMS Terminology TF
L: Steven Martell - Sonoscan
Reliability TF
L: Open
Microfluidics TF
L: Mark Tondra - Diagnostic Biosensors
NA TC Chapter of MEMS/NEMS Global Technical Committee
C: Win Baylies - BayTech-ResorC: Steve Martell - Sonoscan
Europe TC Chapter of Metrics Global Technical Committee
C: Alfred Honold - InReConC: Lothar Pfitzner - FhG IISB
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Metrics Global Technical Committee
Japan TC Chapter of Metrics Global Technical Committee
C: Toshio Murakami - Murakami Corporation
Int'l Environmental Contamination Control TFL: Mikio Furukawa - Shin-Etsu Polymer
ESD/ESC TF
L: Toshio Murakami - Murakumi Corporation
EMC Study Group
L: Koji Ochi - Noise Laboratory
Cycle Time Metrics TF
L: Kenichiro Mukai - Applied Materials JapanL: Supika Mashiro - TEL
Metrics Education & Adoption (MEA) Subc (inactive)
C: TBD
EMC TF
L: Vladimir Kraz - BestESD Technical ServicesL: Mark Frankfurth - Cymer
ESD/ESC TF
L: Arnold Steinman - Electronics WorkshopL: open
Factory Level Productivity Metrics TF (inactive)
L: Ron Billings - Georgia Tech/ FABQL: Jim Irwin - I/C Irwin Consulting
Equipment Training & Documentation TF
L: Mark Cohran - IntelL: Malthi Venkat - Nikon Precision
Wait Time Waste Metrics and Methods TF
L: Lance Rist - Industry Consultant
Equipment RAMP Metrics TF
L: David Busing - ConsultantL: Steven Meyer - Intel
Equipment Cost of Ownership TF (inactive)
L: Daren Dance - WWKL: David Bouldin - Fab Consulting
NA TC Chapter of Metrics Global Technical Committee
C: David Bouldin - Fab ConsultingC: Mark Frankfurth - CymerTE: Carolyn Busing - Self TE: Chona Shumate - CymerTA: Greg Francis - Cymer
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Micropatterning Global Technical Committee
5 Year Review TF
L: Morihisa Hoga - Dainippon Printing
Mask Data Format for Mask Tools TF
L: Toshio Suzuki - Dainippon Printing
Terminology of Metrology TF
L: Jim Potzick - NIST
Extreme Ultraviolet (EUV) Mask TF
L: David Chan - SEMATECH
Mask Orders (P10) TF
L: Wes Erck - Wes Erck & Associates
Data Path TF
L: Thomas Grebinski - OASIS ToolingL: Kurt Wampler - ASML
Standards for Scatterometry TF
L: Thomas Germer - NIST
Extreme Ultraviolet (EUV) Fiducial Mark TF
L: Long He - SEMATECH
NA TC Chapter of Microlithography Global Technical Committee
C: Wes Erck - Wes Erck & Associates C: Rick Silver - NIST
Japan TC Chapter of Micropatterning Global Technical Committee
C: Morihisa Hoga - Dainippon PrintingC: open
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Photovoltaic Global Technical Committee
China TC Chapter of PV Global Technical Committee
C: Guangchun Zhang - CanadianSolarC: Jun Liu - China Electronics Standardization Institute
PV Silicon Wafer TF
L: Yuepeng Wan - LDKL: Xiaoyong Wang - JAsolarL: Jingang Lu - Suntech
PV Thin Film TF
L: Yaohua Mai - Baoding Tianwei SolarfilmsL: Xinwei Niu - Chint SolarL: Jian Ding - Hanergy
PV Silicon Raw Materials TF
L: Xiaoxia Liu - GCL
L: Dongxu Chu - SINOSICOL: He Li - CPVT
PV Power Station Equipment Integrated Performance TF
L: Xiexiang Wu - GD SolarL: Jie Miao - GD Solar
Taiwan TC Chapter of PV Global Technical Committee
C : B. N. Chuang - CMS/ITRIC : J.S. Chen - TeraSolarC : Ray Sung - UL Taiwan
Organic & Dye Sensitized Solar Cell TF
L : Der-Ray Huang - NDHUL: T.C. Wu - CMS/ITRI
PV Wafer Measurement Method TF
L : Samunine Chen - Chunson
PV Package Performance TF
L: C.C.Lin - PV GuiderL: Bor -Tsuen Wang - National Pingtung UnviersityL: T.C. Wu - CMS/ITRIL: Ivan Chou - DelsolarL: K.T.Lee - King Design
Building Integrated Photovoltaic (BIPV) TF
L: C.C.Lin - PV GuiderL: Der-Ray Huang - NDHUL: T.C. Wu - CMS/ITRIL: Ivan Chou - DelsolarL: K.T.Lee - King DesignL: K. Han Ke - Gran System
NA TC Chapter of Global PV Technical Committee
C: Win Baylies - BayTech-ResorC: James Moyne - University of Michigan
Japan TC Chapter of Global PV Technical Committee
C: Hiromu Takatsuka - PVTECC: Kazuhiko Kashima - GlobalWafers JapanC: Masaaki Yamamichi - AIST
Multi-Wire Saws TF
L: Jingying Jia - National Engineering Research Center for Photovoltaic EquipmentL: Xianwu Cai - CETC 48th InstituteL: Zhixin Li - LCT
Crystalline Silicon Solar Cell TF
L: Dengyuan Song - YingLi EnergyL: Ruling Chen - Suntech L: Xianwu Cai - 48th Institute
PV Diffusion Furnace Test Methods TF
L: Liangyu Liu - CETC-48thL: Xianwu Cai - CETC-48th
PV Module TF
L: Wei Zhou - Trina SolarL: Liang Luo - Hunan Red SolarL: Ton Schless - SibcoL: Jingbing Zhu - Suntech
EU TC Chapter of PV Materials Global Technical Committee
C: Peter Wagner - ConsultantC: Huber Aulich - Solar Valley
PV Silicon Materials TF
L: Peter Wagner - Consultant
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PV Materials Global Technical Committee
NA TC Chapter of PV Materials Global Technical Committee
C: Lori Nye - Brewer ScienceC: John Valley - Sun EdisonC: Hugh Gotts - Air Liquide Electronics US
JA TC Chapter of PV Materials Global Technical Committee
C: Takashi Ishihara - Mitsubishi ElectricC: Kazuhiko Kashima - GlobalWafers JapanC: Tetsuo Fukuda - AIST
Japan PV Materials TF
L: Tetsuo Fukuda - National Institute of AISTL: Takashi Ishihara - Mitsubishi Electronic
Int ’l PV Analytical Test Methods, Metrology, and Inspection TF
L: Hugh Gotts - Air Liquide Electronics USL: Ron Sinton - Sinton InstrumentsL: Chris Moore - BayTech-Resor
Int ’l PV Analytical Test Methods, Metrology, and Inspection TF
L: Peter Wagner - Consultant
International Reticle SMIF Pod & Loadport Interoperability TF
L: Jan Rothe - GLOBALFOUNDRIES
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Physical Interfaces & Carriers Global Technical Committee
Global PIC Maintenance TF
L: Shoji Komatsu - Acteon
International 450 mm PIC TF
L: Shoji Komatsu - Acteon
International Reticle SMIF Pod & Loadport Interoperability TF
L: Koji Oyama - Freelance
450 mm AMHS TF
L: Yoichi Motoori - MuratecL: Kenji Yamagata - DAIFUKU
International Process Module Physical Interface (IPPI) TF
L: Supika Mashiro - TEL
Fiducial Mark Interoperability TF
L: Supika Mashiro - TEL
Glboal PIC Maintenance TF
L: Larry Hartsough - UA Associates
EUV Reticle Handling TF
L: Long He - SEMATECHL: David Chan - SEMATECHL: John Zimmerman - ASMLL: Kazuya Ota - Nikon
International 450 mm PIC TF
L: Melvin Jung - IntelL: Shoji Komatsu - Acteon
NA 450mm Shipping Box TF
L: Tom Quinn - Intel
International 450 mm Shipping Box TF
L: Tom Quinn - Intel
450mm ATDP TF
L: Stefan Radloff - Intel
International Reticle SMIF Pod & Loadport Interoperability TF
L: Jan Rothe - GLOBALFOUNDRIES
International Process Module Physical Interface (IPPI) TF
L: Richard Oechsner - Fraunhofer
NA TC Chapter of Physical Interfaces & Carriers Global Technical Committee
C: Matt Fuller - EntegrisC: Stefan Radloff - Intel
Japan TC Chapter of Physical Interfaces & Carriers Global Technical Committee
C: Tsuyoshi Nagashima - Miraial C: Tsutomu Okabe - TDKC: Kenji Yamagata - DAIFUKUTA: Shoji Komatsu - Acteon
Europe TC Chapter of Physical Interfaces & Carriers Global Technical Committee
C: Alfred Honold - InReConC: Frank Petzold - Trustsec
E84 Revision TF
L: Alfred Honold - InReCon
(PIC-Si) Int ’l 450 mm Shipping Box TF
L: Shoji Komatsu - Acteon
Japan Shipping Box TF
L: Shoji Komatsu – ActeonL: Tsuyoshi Nagashima - Miraial
Europe TC Chapter of Si Wafer Global Technical Committee
C: Werner Bergholz - Jacobs University of BremenC: Peter Wagner - ConsultantC: Fritz Passek - Siltronic
International Terminology TF
L: Peter Wagner - Consultant
International Advanced Wafer Geometry TF
L: Fritz Passek - SiltronicL: Frank Riedel - Siltronic
International Test Methods TF
L: Peter Wagner - Consultant
International Advanced Surface Inspection TF
L: Frank Riedel - Siltronic
International Polished Wafers TF
L: Frank Riedel - Siltronic
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Silicon Wafer Global Technical Committee
International Annealed Wafers TF
L: Dinesh Gupta - STA
International Epitaxial Wafers TF
L: Dinesh Gupta - STA
International Polished Wafers (Substrate) TF
L: TBD
International SOI Wafers TF
L: Bich-Yen Nguyen - SOITEC
International Advanced Wafer Geometry TF
L: Noel Poduje - SMSL: Jaydeep Sinha - KLA-Tencor
International Terminology TF
L: TBD
NA TC Chapter of Si Wafer Global Technical Committee
C: Dinesh Gupta - STAC: Noel Poduje - SMSVC: Mike Goldstein - IntelTE: Murray Bullis - Materials & Metrology
International Test Methods TF
L: Dinesh Gupta - STA
International 450 mm Wafer TF
L: Mike Goldstein - Intel
International Automated Advance Surface Inspection TFL: Kurt Haller - KLA Tencor
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Japan TC Chapter of Si Wafer Global Technical Committee
C: Naoyuki Kawai - The University of TokyoC: Tetsuya Nakai - SUMCO
International Annealed Wafers TF
L: Koji Araki - GlobalWafers Japan
Silicon Wafer Global Technical Committee
International Terminology TF
L: Tetsuya Nakai - SUMCO
International Advanced Wafer Geometry TF
L: Satoshi Akiyama - Raytex
Japan JWG TF
L: Masanori Yoshise - FreelanceL: Satoshi Akiyama - Raytex
International Test Method TF
L: Ryuji Takeda - GlobalWafers Japan
International SOI Wafers TF
L: Atsushi Ogura - Meiji UniversityL: Tetsuya Nakai - SUMCO
International Advanced Surface Inspection TF
L: Yusuke Tamaki - ATMI JapanL: Masami Ikota - Hitachi High Technologies
JA Shipping Box TF
L: Shoji Komatsu - Acteon
International 450 mm Wafer TF
L: Masaharu Watanabe - SemilabL: Naoyuki Kawai - The University of Tokyo
International 450 mm Shipping Box TF
L: Shoji Komatsu - Acteon
GOI WG
L: Tsuyoshi Otsuki - Shin-Etsu Handotai
Surface Organic Contaminant Analysis WGL: Mikako Omata - Sumika Chemical Analysis Service
Surface Metal Chemical Analysis WG
L: Ryuji Takeda - GlobalWafers JapanL: Ryo Machida - Sumika Chemical Analysis Service
BMD DZ WG
L: Satoshi Akiyama - RaytexL: Kazuo Moriya - Raytex
Bulk Heavy Metal Analysis by Electrical Measurement WG
L: Shingo Sumie - KOBELCOL: Masaru Akamatsu - KOBELCO
International Epitaxial Wafers TF
L: Naohisa Toda - Shin-Etsu Handotai
Japan Test Method TF
L: Ryuji Takeda - GlobalWafers JapanL: Tsuyoshi Otsuki Shin-Etsu HandotaiL: Mikako Omata - SCAS
International Polished Wafers TF
L: Koji Izunome - GlobalWafers Japan
Fiducial Mark Interoperability TF
L: Tetsuya Nakai - SUMCO
37 / 37
Traceability Global Technical Committee
5 Year ReviewTF
L: Hirokazu Tsunobuchi - Keyence
Japan PV Traceability TF
L: Yoichi Iga - FreelanceL: Hirokazu Tsunobuchi - Keyence
NA TC Chapter of Traceability Global Technical Committee
C: Win Baylies - BayTech-ResorC: Yaw Obeng - NIST
5 Year Review TF
L: Win Baylies - BayTech-Resor
Japan TC Chapter of Traceability Global Technical Committee
C: Yoichi Iga - FreelanceC: Hirokazu Tsunobuchi - Keyence
Fiducial Mark Interoperability TF
L: Hirokazu Tsunobuchi - Keyence