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Organizational Chart● China
● Europe
● Japan
● Korea
● North America
● Taiwan
Last updated: March 3, 2014
1 / 33
SEMI China Photovoltaic TC Chapter
Photovoltaic
TC ChapterC: Guangchun Zhang -
CanadianSolar
C: Jun Liu - China Electronics
Standardization Institute
Crystalline Silicon PV
Module TF
L: Wei Zhou - Trina Solar
L: Qiang Huang - Trina Solar
L: Cheng Zhu - Suntech
L: Binglin Lu - ISTA-China
PV Silicon Wafer TF
L: Yuepeng Wan - LDK
L: Xiaoyong Wang - JAsolar
L: Jingang Lu - Suntech
Metal Paste for Crystalline
Silicon Solar Cells TFL: Rulong Chen - Suntech
L: Weiming Zhang - Heraeus
L: Mao Wang - DuPont
L: Shan Xu - Rutech
PV Diffusion Furnace Test
Methods TFL: Liangyu Liu - CETC-48th
L: Xianwu Cai - CETC-48th
L: Yu Si - Sevenstar
Polysilicon Packaging
Materials TFL: Lv Jinbiao - GCL Poly
L: Liu Xiaoxia - GCL
L: Binglin Lu - ISTA-China
Anti-Reflective Coated
Glass TF
L: Xiaogang Zhu - CPVT
L: Bing Yin - Suntech
Thin Film Silicon PV
Module TFL: Yaohua Mai - Baoding
Tianwei Solarfilms
L: Xinwei Niu - Chint Solar
L: Zhenyu Wu - Hanergy
PV Silicon Raw Materials
TF
L: Yan Dazhou - SINOSICO
L: Xiaoxia Liu - GCL
L: Dongxu Chu - SINOSICO
L: He Li - CPVT
PV Power Station Equipment
Integrated Performance TFL: Xiexiang Wu - GD Solar
L: Jie Miao - GD Solar
Crystalline Silicon PV Back
Contact Technology TF
L: Ton Schless - SIBCO
L: Fengming Zhang - Sunport
Crystalline Silicon Solar Cell TF
L: Dengyuan Song - YingLi Energy
2 / 33
Gas & Liquid Chemicals
TC ChapterC: J-M Collard - Solvay Chemicals
C: G. Ferrier - Air Products
VC: G. De Vos - FFEM
Photovoltaic Automation
TC ChapterC: E. Teichmann - PEER Group
Equipment Automation
TC ChapterC: A. Honold - InReCon (I&C, PIC,
Metrics)
C: L. Pfitzner - FhG IISB (Metrics)
C: F. Petzold - Trustsec (I&C, PIC)
Silicon Wafer T
C ChapterC: W. Bergholz - Jacobs University of
Bremen
C: P. Wagner - Consultant
C: F. Passek - Siltronic
Compound Semiconductor
Materials TC ChapterC: A. Weber - SiCrystal
Photovoltaic Materials
TC ChapterC: P. Wagner - Consultant
C: H. Aulich - Solar Valley
SEMI Europe Regional Standards OrganizationCo-chairs: Bert Planting - ASML, Werner Bergholz - Jacobs University of Bremen
Vice-chair: Frank Petzold - Trustsec
3 / 33
SEMI Europe PV, PV Automation, Compound
Semiconductor and Silicon Wafer TC Chapters
Photovoltaic Materials
TC ChapterC: P. Wagner - Consultant
C: H. Aulich - Solar Valley
Silicon Wafer
TC ChapterC: W. Bergholz - Jacobs University of
Bremen
C: P. Wagner - Consultant
C: F. Passek - Siltronic
International Terminology
TFL: P. Wagner - Consultant
L: M. Bullis - Materials &
Metrology
L: T. Nakai - SUMCO
International Advanced
Wafer Geometry TFL: J. Sinha - KLA-Tencor
L: S. Akiyama - Raytex
L: F. Passek - Siltronic
L: F. Riedel - Siltronic
PV Silicon Materials TF
L: Peter Wagner - Consultant
Int’l PV Analytical Test
Methods TFL: Hugh Gotts - Air Liquide
Electronics US
PV Wafer Traceability TF
L: TBD
Compound Semiconductor
Materials TC ChapterC: A. Weber - SiCrystal
Contactless Resistivity
and Mobility Mapping TFL: W. Jantz - Semimap
SiC TF
L: A. Weber - SiCrystal
Photovoltaic Automation
TC ChapterC: E. Teichmann - PEER Group
International Test
Methods TFL: P. Wagner - Consultant
L: M. Bullis - Materials &
Metrology
L: R. Takeda - GlobalWafers
International Advanced
Surface Inspection TFL: F. Riedel - Siltronic
L: K. Haller - KLA-Tencor
L: M. Ikota - Hitachi High
Technologies
International Polished
Wafers TFL: F. Riedel - Siltronic
L: M. Bullis - Materials &
Metrology
L: T. Nakai - SUMCO
Int’l PV Equipment Interface
Specification (EIS) TFL: C. Born - VITRONIC GmbH
4 / 33
Precursor Specifications
TFL: P. Williams - SAFC Hitech
Gas & Liquid Chemicals
TC ChapterC: J-M Collard - Solvay Chemicals
C: G. Ferrier - Air Products
VC: G. De Vos - FFEM
Equipment Automation
TC ChapterC: A. Honold - InReCon (I&C, PIC,
Metrics)
C: L. Pfitzner - FhG IISB (Metrics)
C: F. Petzold - Trustsec (I&C)
Process Control Systems
TFL: M. Schellenberger - FhG
IISB
SEMI Europe Equipment Automation,
and Gas & Liquid Chemicals TC Chapters
Solvents in Advanced
Processes TFL: G. De Vos - FFEM
International Reticle SMIF Pod
& Loadport Interoperability TFL: Astrid Gettel-GLOBALFOUNDRIES
L: Koji Ohyama - Dainichi Shoji
Permeation Tubes for Trace
Moisture Calibration TFL: J-M Collard - Solvay Chemicals
L: Jim Mc Kinley - KIN-TEK
5 / 33
Information & Control
TC ChapterC: Takayuki Nishimura -
SCREEN
C: Mitsuhiro Matsuda - Hitachi
Kokusai Electric
Physical Interfaces &
Carriers TC ChapterC: Tsuyoshi Nagashima -
Miraial
C: Tsutomu Okabe - TDK
C: Keni Yamagata - DAIFUKU
Traceability
TC ChapterC: Yoichi Iga - Renesas
Electronics
C: Hirokazu Tsunobuchi -
Keyence
Compound Semiconductor
Materials TC ChapterC: Masayoshi Obara - Shin-Etsu
Handotai
Silicon Wafer
TC ChapterC: Naoyuki Kawai - The
University of Tokyo
C: Tetsuya Nakai - SUMCO
Packaging
TC ChapterC: Kazunori Kato - AiT
C: Masahiro Tsuriya - iNEMI
C: Yutaka Koma - Koma
Consulting
Micropatterning
TC ChapterC: Morihisa Hoga - Dainippon
Printing
SEMI Japan Regional Standards OrganizationCo-Chair: Mitsuhiro Matsuda - Hitachi Kokusai Electric Co-Chair: Naoyuki Kawai - The University of Tokyo
Vice Chair: Supika Mashiro - TEL
Photovoltaic Materials
TC ChapterC: Takashi Ishihara -
Mitsubishi Electric
C: Kazuhiko Kashima -
GlobalWafers Japan
C: Tetsuo Fukuda - AIST
Special Groups
Reporting to the JRSC
Gases & Facilities
TC ChapterC: Hiromichi Enami - Hitachi
High-Technologies
C: Isao Suzuki - MKS Japan
Environmental Health &
Safety TC ChapterC: Hidetoshi Sakura - Intel
C: Supika Mashiro - TEL
C: Moray Crawford - Hatsuta
Seisakusho
Liquid Chemicals
TC ChapterC: Hiroshi Tomita - Toshiba
C: Hiroyuki Araki - SCREEN
FPD Materials & Components
TC ChapterC: Hisashi Aruga - Seiko Epson
C: Tadahiro Furukawa - Yamagata
University
C: Yoshihiko Shibahara - FUJIFILM
FPD Metrology
TC ChapterC: Ryoichi Watanabe - Japan
Display Central
C: Akira Kawaguchi - Otsuka
Electronics
FPD Coordination Group
L: Yoshitada Nogami - SK
Electronics
L: Makoto Yamamoto - Muratec
Standardization Process
Integration (SPI)L: Supika Mahiro -TEL
Photovoltaic Automation
TC ChapterC: Terry Asakawa -TEL
C: Emi Ishikawa - Atelier
Ishikawa
C: Makoto Ishikawa - Nisshinbo
Mechatronics
Test
TC ChapterC: Hirofumi Kaga - Renesas
Electronics
C: Takashi Umenaga -
Teradyne
Photovoltaic
TC ChapterC: Hiromu Takatsuka -
Mitsubishi Heavy Industries
C: Kazuhiko Kashima -
GlobalWafers Japan
C: Masaaki Yamamichi - AIST
C: Terry Asakawa - TEL
Metrics
TC ChapterC: Toshio Murakami -Murakami
Corporation
6 / 33
Micropatterning
TC ChapterC: Morihisa Hoga - Dainippon
Printing
C: open
SEMI Japan Compound and Micropatterning TC Chapters
5 Year Review TF
L: Morihisa Hoga - Dainippon
Printing
Compound Semiconductor
Materials TC ChapterC: Masayoshi Obara - Shin-Etsu
Handotai
C: open
5 Year Review TF
L: TBD
Global 200 mm GaAs
Wafer Specification TFL: TBD
Sapphire Substrate TF
L: Toshiro Kotaki - Namiki
Precision Jewel
Mask Data Format for
Mask Tools TFL: Toshio Suzuki - Dainippon
Printing
International SiC TF
L: Taizo Hoshino - Nippon Steel & Sumikin Materials
7 / 33
Environmental, Health &
Safety TC ChapterC: Hidetoshi Sakura - Intel
C: Supika Mashiro - TEL
C: Moray Crawford - Hatsuta
Seisakusho
S23 Revision TF
L: George Hoshi - TEL
L: Lauren Crane – KLA-Tencor
SEMI Japan EHS TC Chapter
STEP Planning WG
L: Kenji Sugihara - Panasonic
GHG Emission
Characterization TFL: George Hoshi - TELL: Tetsuya Kitagawa - Sony
Seismic Protection
TFL: Eiji Nakatani - Sokudo
FPD System Safety TF
L: Ikuo Goto - Muratec
Automation
L: Naokatsu Nishiguchi -
SCREEN
8 / 33
SEMI Japan FPD Materials & Components
and Metrology TC Chapters
FPD Materials & Components
TC ChapterC: Hisashi Aruga -
C: Tadahiro Furukawa - Yamagata
University
C: Yoshihiko Shibahara - Fujifilm
Backlight TF
L: Satoshi Kanazawa - Stanley
L: Masami Takagi - Harison
Toshiba Lighting
L: Kazuyoshi Yamaguchi -
Panasonic Photo & Lighting
Polarizing Film TF
L: Toshihito Otsuka - Sanritz
L: Yoshihiko Shibahara -
Fujifilm
L: Shigeo Kobayashi - Nitto
Denko
Flexible Display TF
L: Takashi Shiro - Teijin
L: Tadahiro Furukawa -
Yamagata University
FPD Metrology
TC ChapterC: Ryoichi Watanabe - Japan
Display Central
C: Akira Kawaguchi - Otsuka
Electronics
D31 Revision TF
L: Kose Tanahashi - Samsung
Electronics
L: Masao Kochi - Highland
L: Keizo Ochi - Konica Minolta
Optics
FPD Color Filter TF
L: Hisashi Aruga -
9 / 33
SEMI Japan Gases & Facilities and
Liquid Chemicals TC Chapters
Gases and Facilities
TC ChapterC: Hiromichi Enami - Hitachi High
Technologies
C: Isao Suzuki - MKS Japan
F1 Revision TF
L: Shuji Moriya - Tokyo Electron
Yamanashi
L: Yoshifumi Machii - Fujikin
Gas Panel Test Method TF
L: Yoshifumi Machii - Fujikin
L: Shuji Moriya - Tokyo Electron
Yamanashi
Liquid Chemicals
TC ChapterC: Hiroshi Tomita - Toshiba
C: Hiroyuki Araki - SCREEN
Diaphragm Valve TF
L: Shigeru Ohsugi - CKD
L: Kimihito Sasao - Advance
Electric
Welding Fitting TF
L: Kimihito Sasao - Advance
Electric
L: Takashi Hasegawa - KITZ
SCT
5-year Review TF
L: Koichi Ishikawa - ACE
Liquid Filter TF
L: Takuya Nagafuchi - Nihon
Entegris
L: Takehito Mizuno - Nihon Pall
5-year Review TF
L: Yoshifumi Machii - Fujikin
Liquid-Borne Particle
Counter TFL: Kaoru Kondo - RION
L: Kazutoshi Kato - PMS
Standardization of live Gas
Flow Rate Study GroupL: Shuji Moriya - Tokyo Electron
Yamanashi
10 / 33
Metrics
TC ChapterC: Toshio Murakami - Murakami
Corporation
Physical Interfaces & Carriers
TC ChapterC: Tsuyoshi Nagashima - Miraial
C: Tsutomu Okabe - TDK
C: Keni Yamagata - DAIFUKU
TA: Takao Nojima - Intel
SEMI Japan PI&C and Metrics TC Chapters
Int'l Environmental
Contamination Control TFL: Mikio Furukawa - Shin-Etsu
Polymer
ESD/ESC TF
L: Toshio Murakami -
Murakumi Corporation
Global PI&C Standards
Maintenance TFL: Shoji Komatsu - ActeonEMC Study Group
L: Koji Ochi - Noise Laboratory
450 mm International
PI&C TFL: Shoji Komatsu - Acteon
(PIC-Si) Int’l 450 mm
Shipping Box TFL: Yasuhiro Shimizu -
Consultant
Cycle Time Metrics TF
L: Kenichiro Mukai - Applied
Materials Japan
L: Supika Mashiro - TEL
International Reticle SMIF Pod
& Loadport Interoperability TFL: Koji Oyama - Dainichi Shoji
450 mm AMHS
TFL: Yoichi Motoori - Muratec
L: Kenji Yamagata - DAIFUKU
International Process Module
Physical Interface TFL: Supika Mashiro - TEL
Fiducial Mark Interoperability
TFL: Supika Mashiro - TEL
11 / 33
SEMI Japan PV, PV Materials,
and PV Automation TC Chapters
Photovoltaic Materials
TC ChapterC: Takashi Ishihara - Mitsubishi
Electric
C: Kazuhiko Kashima -
GlobalWafers Japan
C: Tetsuo Fukuda - AIST
Japan PV Materials TF
L: Tetsuo Fukuda - AIST
L: Takashi Ishihara - Mitsubishi
Electronic
Photovoltaic Automation
TC ChapterC: Emi Ishikawa - Atelier Ishikawa
C: Terry Asakawa - TEL
C: Makoto Ishikawa - Nisshinbo
Mechatronics
Photovoltaic
TC ChapterC: Hiromu Takatsuka - Mitsubishi
Heavy Industries
C: Kazuhiko Kashima -
GlobalWafers Japan
C: Masaaki Yamamichi - AIST
C: Terry Asakawa - TEL
Global PV Equipment Interface
Specification (PV-EIS) TFL: Takashi Murakami - TEL
L: Makoto Ishikawa - Nisshinbo
Mechatronics
12 / 33
Traceability
TC ChapterC: Yoichi Iga - Renesas Electronics
C: Hirokazu Tsunobuchi - Keyence
SEMI Japan Information & Control
and Traceability TC Chapters
5 Year Review
TFL: Hirokazu Tsunobuchi -
Keyence
Information and Control
TC ChapterC: Takayuki Nishimura - SCREEN
C: Mitsuhiro Matsuda - Hitachi
Kokusai Electric
Adviser: Mitch Sakamoto - TELTA
Hiroshi Kondo - Murata
Machinery
Tadashi Mochizuki - TEL
GEM300 TF
L: Yoshihisa Takasaki -
SCREEN
Japan PV Traceability TF
L: Yoichi Iga - Renesas
Electronics
L: Hirokazu Tsunobuchi -
Keyence
Equipment Information
System Security TFL: Mitch Sakamoto - TEL
Sensor Bus TF
L: Hideaki Ogihara - ALGO
System
Predictive Carrier
Logistics (PCL) TFL: Yuko Toyoshima - Hitachi
High-Technologies
L: Terry Asakawa - TEL
Japan I&CC Maintenance
TFL: Hideaki Ogihara - ALGO
System
L: Mitsuhiro Matsuda - Hitachi
Kokusai Electric
Fiducial Mark Interoperability
TFL: Mitsuhiro Matsuda - Hitachi
Kokusai Electric
Fiducial Mark Interoperability
TFL: Hirokazu Tsunobuchi - Keyence
13 / 33
Silicon Wafer
TC ChapterC: Naoyuki Kawai - The University of
Tokyo
C: Tetsuya Nakai - SUMCO
International Annealed
Wafers TFL: Koji Araki - GlobalWafers
Japan
SEMI Japan Silicon Wafer TC Chapter
International Terminology
TFL: Tetsuya Nakai - SUMCO
International Advanced
Wafer Geometry TFL: Satoshi Akiyama - Raytex
Japan JWG TF
L: Masanori Yoshise -
Freelance
L: Satoshi Akiyama - Raytex
International Test Method
TFL: Ryuji Takeda -
GlobalWafers Japan
International SOI Wafers
TFL: Atsushi Ogura - Meiji
University
L: Tetsuya Nakai - SUMCO
International Advanced
Surface Inspection TFL: Yusuke Tamaki - ATMI
Japan
L: Masami Ikota - Hitachi High
Technologies
JA Shipping Box TF
L: Shoji Komatsu - Acteon
L: Yasuhiro Shimizu - Shimizu
Consultant
International 450 mm
Wafer TFL: Masaharu Watanabe -
Semilab
L: Naoyuki Kawai - The
University of Tokyo
International 450 mm
Shipping Box TFL: Yasuhiro Shimizu - Shimizu
Consultant
GOI WG
L: Tsuyoshi Otsuki - Shin-Etsu
Handotai
Surface Organic
Contaminant Analysis WGL: Yoshimi Shiramizu -
Renesas Electronics
Surface Metal Chemical
Analysis WGL: Ryuji Takeda - GlobalWafers
Japan
L: Hitoshi Torayama -
KOBELCO
BMD DZ WG
L: Satoshi Akiyama - Raytex
L: Kazuo Moriya - Raytex
Bulk Heavy Metal Analysis
by Electrical Measurement
WGL: Shingo Sumie - KOBELCO
L: Kei Matsumoto - SUMCO
International Epitaxial
Wafers TFL: Takao Takenaka - Takenaka
Consultant
International Polished
Wafers TFL: Koji Izunome - GlobalWafers
Japan
Japan Test Method TF
L: Ryuji Takeda - GlobalWafers
Japan
L: Tsuyoshi Otsuki Shin-Etsu
Handotai
L: Mikako Omata - SCAS
Fiducial Mark Interoperability
TFL: Tetsuya Nakai - SUMCO
14 / 33
Test
TC ChapterC: Hirofumi Kaga - Renesas
Electronics
C: Takashi Umenaga -Teradyne
Packaging
TC ChapterC: Kazunori Kato - AiT
C: Masahiro Tsuriya - iNEMI
C: Yutaka Koma - Koma Consulting
Electromagnetic
Characterization SGL: Mikio Kiyono - AET
SEMI Japan Test and Packaging TC Chapters
Wafer Shipping Container for
Assembly &Packaging TF L:Yasuhiro Shimizu - Shimizu
Consultant
L: Kazuhiko Nakamura - Consultant
L: Tatsuya Yanagawa - Achilles
Packages & Packaging Materials
Eco-efficiency TFL: Shoichi Suzuki - Sumitomo Metal Mining
L: Kazuhiko Nakamura - Consultant
450 mm ATDP TF
L: Akihito Kawai - DISCO
L: Sumio Masuchi - DISCO
L: Kiyofumi Tanaka - SEP
L: Kenichi Watanabe - Lintec
DFM SG
L: Ichiro Anjo - Jisso Partners
3D-IC SG
L: Masahiro Tsuriya - iNEMIL: Haruo Shimamoto - AIST
Thin Chip (Die) Bending
Strength Measurement TF L: Haruo Shimamoto
L: Morihiro Kada - ASET
L: Shoji Yasunaga - Rohm
Fiducial Mark Interoperability
TFL: Sumio Masuchi - Disco
15 / 33
SEMI Korea Regional Standards Organization
Information & Control
TC ChapterC: Hyungsu Kim - Samsung SDS
C: Chul Hong Ahn - SK Hynix
C: Gun Woo Lee - Miracom Inc.
Facilities
TC ChapterC: Kwang Sun Kim - KUT
FPD Metrology
TC ChapterC: JongSeo Lee - Samsung
Display
C: II-Ho (William) Kim - Light
Measurement Solution
FPD
TC ChapterC: JongSeo Lee - Samsung
Display
C: II-Ho (William) Kim - Light
Measurement Solution
EHS WG
L: Seung Jong Ko - SK Hynix
L: Hyunsuk Kim - Samsung
Electronics
HB-LED WG
L: HyeongSoo Park - SEMES
L: Jong Hyeob Baek - KOPTI
16 / 33
SEMI Korea FPD and FPD Metrology TC Chapters
FPD
TC ChapterC: JongSeo Lee - Samsung
Display
C: II-Ho (William) Kim - Light
Measurement Solution
PDP Subcommittee
L: SeKwang Park - Kyungpook
Univ.
LCD Subcommittee
L: JongSeo Lee - Samsung
Display
OLED Subcommittee
L: Choonghoon Yi -
MODISTECH
FPD Metrology
TC ChapterC: JongSeo Lee - Samsung
Display
C: II-Ho (William) Kim - Light
Measurement Solution
Tone and Color TF
L: Kyung Jin Kang - LG
Electronics
Perceptual Image Quality
TFL: Jongho Chong - Samsung
Display
Perceptual Viewing Angle
TFL: Myongyoung Lee - LG
Electronics
Transparent Display TF
L:JongSeo Lee - Samsung
Display
17 / 33
SEMI Korea Information & Control,
Facilities TC Chapters, EHS and HB-LED WGs
Information & Control
TC ChapterC: Hyungsu Kim - Samsung SDS
C: Chul Hong Ahn - SK Hynix
C: Gun Woo Lee - Miracom Inc.
EHS WG
L: Seung Jong Ko - SK Hynix
L: Hyunsuk Kim - Samsung
Electronics
S2 Sub-WG
L: Deok Seop Shim - TUV
Rheinland
S23 Sub-WG
L: Sangyun Jung - Samsung
Electronics
GEM 300 TF
L: Jong Sub Shim - ASM
L: Chang Yul Cho - SEMES
L: Byoung Min Im - TEL Korea
DDA TF
L: Hyungsu Kim - Samsung
SDS
Facilities
TC ChapterC: Kwang Sun Kim - KUT
Equipment Cleanness TF
L: Insoo Cho - Shinsung ENG
HB-LED WG
L: HyeongSoo Park - SEMES
L: Jong Hyeob Baek - KOPTI
18 / 33
Information & Control
TC ChapterC: Jack Ghiselli - Ghiselli Consulting
C: Brian Rubow - Cimetrix
C: Lance Rist - Industry Consultant
Physical Interfaces & Carriers
TC ChapterC: Matt Fuller - Entegris
C: Mutaz Haddadin - Intel
Metrics
TC ChapterC: David Bouldin - Fab Consulting
C: Mark Frankfurth - Cymer
Microlithography
TC ChapterC: Wes Erck - Wes Erck &
Associates
C: Rick Silver - NIST
Compound Semiconductor
Materials TC ChapterC: Russ Kremer - Freiberger
Compound Materials
C: James Oliver - Northrop Grumman
Silicon Wafer
TC ChapterC: Dinesh Gupta - STA
C: Noel Poduje - SMS
VC: Mike Goldstein - Intel
Traceability
TC ChapterC: Win Baylies - BayTech Group
C: Yaw Obeng - NIST
Facilities
TC ChapterC: Steve Lewis - DPS Engineering
Gases
TC ChapterC: Tim Volin - Parker Hannifin
C: Mohamed Saleem - Fujikin
Liquid Chemicals
TC ChapterC: Frank Flowers - FMC
C: Frank Parker - ICL
MEMS/NEMS
TC ChapterC: Win Baylies - BayTech Group
C: Janet Cassard - NIST
Environmental Health & Safety
TC ChapterC: Chris Evanston - Salus
Engineering
C: Sean Larsen - Lam Research AG
C: Bert Planting - ASML
Flat Panel Display
TC ChapterC: Bill Colbran - Engenuity Systems
SEMI N.A. Regional Standards OrganizationCo-Chairs: Jackie Ferrell - Sematech & Sean Larsen - Lam Research AG
NA RSC Technical Architect
BoardC: James Moyne - University of
Michigan
C: Yaw Obeng - NIST
Photovoltaic
TC ChapterC: Win Baylies - BayTech Group
C: James Moyne - University of
Michigan
3DS-IC
TC ChapterC: Richard Allen - NIST
C: Urmi Ray - Qualcomm
C: Sesh Ramaswami - Applied
Materials
C: Chris Moore
HB-LED
TC ChapterC: Iain Black - Philips
C: Mike Feng - Silian
C: Bill Quinn - WEQ Consulting
C: Chris Moore
Automated Test Equipment
TC ChapterC: Ajay Khoche - Khoche Consulting
Photovoltaic Materials
TC ChapterC: Lori Nye - Brewer Science
C: John Valley - Sun Edison
19 / 33
Facilities
TC ChapterC: Steve Lewis - DPS Engineering
Analytical Methods TF
L: Frank Flowers - FMC
SEMI F57 Rewrite TF
L: James Henry - Arkema
Group
L: Ian Francisco - Lam
Research
Liquid Chemicals
TC ChapterC: Frank Flowers - FMC
C: Frank Parker - ICL
SEMI N.A. Facilities & Liquid Chemicals TC Chapters
F51 Revision TF
L: Dalia Vernikovsky - Applied
Seals North America
Building Information Modeling (BIM) for
Semiconductor Capital Equipment TFL: Ben Bruce - Applied Materials
Determining Roughness
of Polymer Surfaces TFL: Marty Burkhart - Hi Pure
Tech
L: Gunter Moeller - Arkema
Group
SEMI IX Resin TF
L: Slava Libman - Air Liquide
UPW Filter Performance
TFL: Slava Libman - Air Liquide
SEMI F63 Rewrite TF
L: Slava Libman - Air Liquide
SEMI F31, F39 & F41
Rewrite TFL: David Kandiyeli - Mega Fluid
Systems
L: Koh Murai - Mega Fluid
Systems
SEMI F40 Rewrite TF
L: Marty Burkhart -Hi Pure Tech
Liquid Chemicals
SubcommitteeC: Frank Flowers - FMC
C: Frank Parker - ICL
Liquid Chemical Distribution
SubcommitteeC: open
20 / 33
SEMI N.A. Compound Semiconductor
& Silicon Wafer TC Chapters
International Annealed
Wafers TFL: Dinesh Gupta - STA
International Epitaxial
Wafers TFL: Dinesh Gupta - STA
International Polished
Wafers (Substrate) TFL: Murray Bullis - Materials &
Metrology
International SOI Wafers
TFL: Bich-Yen Nguyen - SOITEC
International Advanced
Wafer Geometry TFL: Noel Poduje - SMS
L: Jaydeep Sinha - KLA-Tencor
International Advanced
Surface Inspection TFL: Kurt Haller - KLA Tencor
International Terminology
TFL: Murray Bullis - Materials &
Metrology
Specifications Metrology Committee
International 450 mm
Wafer TFL: Mike Goldstein - Intel
Compound Semiconductor
Materials TC ChapterC: Russ Kremer - Freiberger
Compound Materials
C: James Oliver - Northrop
Grumman
Electrical Properties TF
L: Austin Blew - LEI
SEMI M55 5-Yr Review TF
L: Judy Kronwasser - NOVASiC
Silicon Carbide TF
L: Open
GaN TF
L: Judy Kronwasser - NOVASiC
Silicon Wafer
TC ChapterC: Dinesh Gupta - STA
C: Noel Poduje - SMS
VC: Mike Goldstein - Intel
TE: Murray Bullis - Materials &
Metrology
International Test
Methods TFL: Dinesh Gupta - STA
21 / 33
S2 Interlock Reliability TF
L: Bert Planting - ASML
L: Tom Pilz - Pilz GmbH
Ergonomics TF
L: Ron Macklin - Macklin &
Associates
L: Paul Schwab - Texas
Instruments
Environmental Health & Safety
TC ChapterC: Chris Evanston - Salus Engineering
C: Sean Larsen - Lam Research AG
C: Bert Planting - ASML
SEMI N.A. Environmental, Health & Safety TC Chapter
S2 Ladders & Steps TF
L: Ron Macklin - Macklin &
Associates
L: Carl Wong - AKT
L: Lindy Austin - Salus
Engineering
International Fire
Protection TFL: Matt Wyman - Koetter Fire
Protection
Lifting Equipment TF
L: Ron Macklin - Macklin &
Associates
S2 Chemical Exposure TF
L: John Visty - Salus
Engineering
S2 Machinery Directive
Mapping TFL: Lauren Crane - KLA-Tencor
S22 Revision TF
L: Chris Evanston - Salus
Engineering
L: Sean Larsen - Lam Research
AG
S6 Revision TF
L: John Visty - Salus
Engineering
L: Glenn Holbrook - TUV SUD
S2 Non-Ionizing Radiation
TFL: Sean Larsen - Lam Research
AG
L: John Visty - Salus
Engineering
S10 Revision TF
L: Bert Planting - ASML
L: Tom Pilz - Pilz GmbH
Manufacturing Equipment Safety
SubcommitteeC: Cliff Greenberg - Nikon Precision
C: Andrew Giles - ESTEC
C: Lauren Crane - KLA-Tencor
Hazardous Energy Control
Isolation Devices TFL: Andrew Giles - ESTEC
L: Sean Larsen - Lam Research AG
L: Mark Fessler - Tokyo Electron
S1 Revision TF
L: Lauren Crane - KLA-Tencor
L: Edward Karl - Applied
Materials
Seismic Liaison TF
L: Lauren Crane - KLA-Tencor
Fail-Safe/Fault-Tolerant
TFL: Lauren Crane - KLA-Tencor
L: Chris Evanston - Salus
Engineering
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Microlithography
TC ChapterC: Wes Erck - Wes Erck &
Associates
C: Rick Silver - NIST
Terminology of Metrology
TFL: Jim Potzick - NIST
Extreme Ultraviolet (EUV)
Mask TFL: David Chan - SEMATECH
Mask Orders (P10) TF
L: Wes Erck - Wes Erck &
Associates
Data Path TF
L: Thomas Grebinski - OASIS
Tooling
L: Kurt Wampler - ASML
Traceability
TC ChapterC: Win Baylies - BayTech Group
C: Yaw Obeng - NIST
SEMI N.A. FPD, Microlithography
& Traceability TC Chapters
Standards for
Scatterometry TFL: Thomas Germer - NIST
Extreme Ultraviolet (EUV)
Fiducial Mark TFL: Long He - SEMATECH
Flat Panel Display
TC ChapterC:Bill Colbran - Engenuity Systems
5 Year Review TF
L: Win Baylies - BayTech
Group
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Gases
TC ChapterC: Tim Volin - Parker Hannifin
C: Mohamed Saleem - Fujikin
Mass Flow TF
L: Mohamed Saleem - Fujikin
Pressure Measurement TF
L: Justin Hough - Applied
Materials
L: David Colquhoun - BriskHeat
Filters & Purifiers TF
L: Mohamed Saleem - Fujikin
Materials of Construction
Gas Delivery Systems TFL: Tim Volin - Parker
Hannifin
L: Bill Kiikvee - AP TECH
SEMI N.A. Gases TC Chapter
Heater Jacket TF
L: David Colquhoun - BriskHeat
Gas Specifications TF
L: Mark Ripkowski - CONSCI
Surface Mount Sandwich
Component Dimensions TFL: Matt Milburn - UCT
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Information & Control
TC ChapterC: Brian Rubow - Cimetrix
C: Jack Ghiselli - Ghiselli Consulting
C: Lance Rist - Industry Consultant
GEM300 TF
L: Brian Rubow- Cimetrix
L: Gino Crispieri - Consultant
Diagnostic Data
Acquisition (DDA) TFL: Brian Rubow - Cimetrix
L: Gino Crispieri - Consultant
Sensor Bus TF
C: James Moyne - University of
Michigan
Process Control System
Architecture (PCS) TFL: James Moyne - University of
Michigan
L: Chris Maloney - Intel
Automated Test Equipment
TC ChapterC: Ajay Khoche - Khoche Consulting
Standard Test Data
Format (STDF) TFL: Ajay Khoche - Khoche
Consulting
SEMI N.A. Information & Control
and Automated Test Equipment TC Chapters
Test Cell Communcations
TFL: Len Van Eck - LTX-
Credence
L: Mark Roos - Roos
InstrumentsEnergy Saving Equipment
Communication TFL: Gino Crispieri - Consultant
L: Mike Czerniak - Edwards
Vacuum
25 / 33
SEMI N.A. 3DS-IC & MEMS/NEMS TC Chapters
MEMS/NEMS
TC ChapterC: Win Baylies - BayTech Group
C: Janet Cassard - NIST
Packaging TF
L: Steve Martell - Sonoscan
Wafer Bond TF
L: Win Baylies - BayTech
Group
L: Richard Allen - NIST
Material Characterization
TFL: Janet Cassard - NIST
L: Kevin Turner - University of
Pennsylvania
International MEMS
Terminology TFL: Steven Martell - Sonoscan
Reliability TF
L: Open
3DS-IC
TC ChapterC: Richard Allen - NIST
C: Urmi Ray - Qualcomm
C: Sesh Ramaswami - Applied
Materials
C: Chris Moore
3DS-IC Bonded Wafer TF
L: Richard Allen - NIST
3DS-IC Inspection and
Metrology TFL: Victor Vartanian -
SEMATECH
L: David Read - NIST
3DS-IC Thin Wafer
Handling TFL: Urmi Ray - Qualcomm
L: Raghunandan Chaware -
Xilinx
L: Richard Allen - NIST
Microfluidics TF
L: Mark Tondra - Diagnostic
Biosensors
26 / 33
SEMI N.A. HB-LED TC Chapter
HB-LED
TC ChapterC: Iain Black - Philips
C: Bill Quinn - WEQ Consulting
C: Mike Feng - Silian
C: Chris Moore
HB-LED Equipment
Automation Interfaces TFL: Daniel Babbs - Brooks
Automation
L: Jeff Felipe - Entegris
HB-LED Assembly TF
L: Paul Reid - Kulicke & Soffa
HB-LED Wafer TF
L: Win Bayles - BayTech Group
HB-LED Impurities and Defects
in Sapphire Wafers TFL: Luke Glinski - GT Advanced
Technologies
HB-LED Equipment
Communication Interfaces TFL: Brian Rubow - Cimetrix
Patterned Sapphire
Substrate (PSS) TFL: Win Bayles - BayTech Group
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Metrics
TC ChapterC: David Bouldin - Fab Consulting
C: Mark Frankfurth - Cymer
TE: Carolyn Busing - Self
TE: Chona Shumate - Cymer
TA: Greg Francis - Cymer
SEMI N.A. Physical Interfaces & Carriers
and Metrics TC Chapters
Physical Interfaces & Carriers
TC ChapterC: Matt Fuller - Entegris
C: Mutaz Haddadin - Intel
Global PIC Maintenance
TFL: Larry Hartsough - UA
Associates
Metrics Education & Adoption
(MEA) Subc (inactive)C: TBD
EMC TF
L: Vladimir Kraz - BestESD
Technical Services
L: Mark Frankfurth - Cymer
ESD/ESC TF
L: Arnold Steinman - Electronics
Workshop
L: open
Factory Level Productivity
Metrics TF (inactive)L: Ron Billings - Georgia Tech/
FABQ
L: Jim Irwin - I/C Irwin Consulting
EUV Reticle Handling TF
L: Long He - SEMATECH
L: David Chan - SEMATECH
L: John Zimmerman - ASML
L: David Halbmaier - Entegris
L: Kazuya Ota - Nikon
International 450 mm PIC
TFL: Mutaz Haddadin - Intel
L: Shoji Komatsu - Acteon
NA 450mm Shipping Box
TFL: Tom Quinn - Intel
Equipment Training &
Documentation TFL: Mark Cohran - Intel
L: Malthi Venkat - Nikon Precision
International 450 mm
Shipping Box TFL: Tom Quinn - Intel
L: Yasuhiro Shimizu -
Consultant
450mm ATDP TF
L: Stefan Radloff - Intel
Wait Time Waste Metrics
and Methods TFL: Jackie Ferrell - Sematech
L: Lance Rist - Industry
Consultant
Equipment RAMP Metrics
TFL: David Busing - Consultant
L: Steven Meyer - Intel
International Reticle SMIF Pod
& Loadport Interoperability TFL: Astrid Gettel-GLOBALFOUNDRIES
L: Koji Oyama - Dainichi Shoji
International Process Module
Physical Interface TFL: Supika Mashiro - TEL
L: Richard Oechsner - Fraunhofer
Equipment Cost of
Ownership TF (inactive)L: Daren Dance - WWK
L: David Bouldin - Fab Consulting
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SEMI N.A. Photovoltaic
& Photovoltaic Materials TC Chapters
Photovoltaic Materials
TC ChapterC: Lori Nye - Brewer Science
C: John Valley - Sun Edison
PV Electrical & Optical
Properties Measurements TFL: Austin Blew - LEI
L: Chris Moore
International PV Analytical
Test Methods TFL: Hugh Gotts - Air Liquide
Electronics US
Photovoltaic
TC ChapterC: Win Baylies - BayTech Group
C: James Moyne - University of
Michigan
29 / 33
SEMI Taiwan Regional Standards Organization
Information and Control
TC ChapterC:Robert Chien - TSMC
Environmental Health & Safety
TC ChapterC:Shuh-Woei Yu - SAHTECH
C: Fang-Ming Hsu - TSMC
Flat Panel Display
TC ChapterC: Tzeng-Yow Lin - CMS/ITRI
C: Jia-Ming Liu - TDMDA
Photovoltaic
TC ChapterC : B. N. Chuang - CMS/ITRI
C : J.S. Chen - TeraSolar
C : Ray Sung - UL Taiwan
ISC Taiwan Advisor
Tzeng-Yow Lin - CMS/ITRI
3DS-IC
TC ChapterC: Tzu-Kun Ku - ITRI
C: Wendy Chen - King Yuan
Electronics
C: Yi-Shao Lai - ASE
30 / 33
SEMI Taiwan 3DS-IC & Environmental, Health & Safety TC
Chapters
Environmental Health & Safety
TC ChapterC: S. W. Yu - SAHTECH
C: F. M. Hsu - TSMC
IC Equipment Safety TF
L: Colin Shen - MXIC
L: C. C. Huang - SAHTECH
Gas and Chemical Safety
TFL: Benny Chen - AUO
L: Heng-Li Sue - SAHTECH
L: Moony Lee - UMC
Seismic TF
L: K. C. Tsai - NCREE
L: J. S. Hwang - NCREE
L: D. W. Sun - TSMC
FPD Safety Subcommittee
L: C. C. Huang - SAHTECH
Equipment Safety TF
L: Benny Chen - AUO
L: Juo Cho - AUO
L: Alice Lin - CMO
EHS TC Chapter
AdvisorRoger Wu - UMC
Environmental
Sustainability TFL: Tony C. H. Lu - ITRI
L: C Y Huang - TSMC
3DS-IC
TC ChapterC: Tzu-Kun Ku - ITRI
C: Wendy Chen - King Yuan
Electronics
C: Yi-Shao Lai - ASE
Test TF
L: Tzong-Tsong Miau - ITRI
L: Roger Hwang - ASE
L: Ming-Chin Tsai - KYEC
PV Safety
TFL: Eddie Wu - Nexpower
LED Safety
TFL: Eric Lin - Epistar
Middle End Process TF
L: Arthur Chen - NTUST
L: Erh Hao Chen - ITRI
L: Jerry Yang - SEMATECH
31 / 33
SEMI Taiwan Flat Panel Display TC Chapter
Flat Panel Display
TC ChapterC: Tzeng-Yow Lin - CMS/ITRI
C: Jia-Ming Liu-TDMDA
Liaison TF
L: YP Lan - ITRI
L:DA Chang - Kingbird
L:RJ Chuang - TDMDA
L:Tony Chiu - CIPO
ACG TF
L: S.P. Wang - DTC/ITRI
L: Garfield Pan - AUO
Flexible Display TF
L: WangWen - Tung-ITRI
LCD Subcommittee
L: Kerson Wang - AUO
3D Display Metrology TF
L: Wen-Chuan Tsai - AUO
L: Bao-Jen Pong - CMS/ITRI
L: Kuen Lee - EOL/ITRI
E-Paper Display TF
L: Fang Hui - Mei
L: Bor-Jiunn Wen - CMS/ITRI
Touch Screen Panel TF
L: Yen-Wen Fang - AUO
L: S.Y. Chou - CMS/ITRI
32 / 33
SEMI Taiwan Information & Control and
Photovoltaic TC Chapters
Photovoltaic
TC ChapterC : B. N. Chuang - CMS/ITRI
C : J.S. Chen - TeraSolar
C : Ray Sung - UL Taiwan
Organic & Dye Sensitized
Solar Cell TFL : Der-Ray Huang - NDHU
L: T.C. Wu - CMS/ITRI
PV Wafer Measurement
Method TFL : Samunine Chen - Chunson
Information & Control
TC Chapter
C: Robert Chien - TSMC
Equipment Engineering
System (EES) TFL : Ivan Chen - TSMC
L: Jack Huang - MKS
Factory Integration TF
L : MT Yeh - PSC
L: Robert Weng - TEL
L: H. S You - Energywell
Liaison - TSIA
Celia Shih - TSIA
Information & Control TC
Chapter AdvisorThomas W.Y Chen - TSMC
PV Package Performance
TFL: C.C.Lin - PV Guider
L: Bor -Tsuen Wang - National
Pingtung Unviersity
L: T.C. Wu - CMS/ITRI
L: Ivan Chou - Delsolar
L: K.T.Lee - King Design
Automated Material Handling
System (AMHS) TFL :William Liu - UMC
L: Hu Szn Fan - UMC
Building Integrated
Photovoltaic (BIPV) TFL: C.C.Lin - PV Guider
L: Der-Ray Huang - NDHU
L: T.C. Wu - CMS/ITRI
L: Ivan Chou - Delsolar
L: K.T.Lee - King Design
L: K. Han Ke - Gran System
33 / 33