W TO ADAPTERS COM · enable testing or debugging. Adapters are used by anyone designing, testing, program- ming or prototyping with IC’s. Adapters can also provide innerconnect

1

Adapters.com Tel: 408.855.8527 Fax: 408.855.8528 Email: [email protected] web: http://www.adapters.com 2001

WELCOME TO ADAPTERS.COM

REFERENCE GUIDE CONTENTS

The Design Environment 2

Using the Interconnect Reference Guide 3

Package Types 4

Web Site & Web Tools 8

Custom Adapters 9

BGA Solutions 10

Emulator Adapters 14

Logic Analyzer Adapters 26

Programming Adapters 32

Production / Test Adapters 42

PLCC Bases 44

I.C. Socket Probes 45

Test Accessories 45

I.C. Sockets 46

Test Clips 52

Microclips 54

Scope Probes 55

Prototyping Adapters 56

Lab Cards & Bus Extenders 66

DOING BUSINESS WITHADAPTERS.COM

Adapters.com is easy to do business with. Tomake ordering easy we accept corporateP.O.s, VISA, MasterCard, American Expressor cash.

We will ship per your instructions or by “bestway” if not indicated. FOB Santa Clara, CA.

Hello. . .and welcome to the InterConnectReference Guide 2002. In the pagesthat follow you will be introduced to ourproducts and services that will get youconnected. Our real expertise is notwhat you find on these pages, but whatyou find when you call us, and needassistance. Our team leads the industryin technical support and adapter designexperience. To see the differencebrowse through our reference guide,visit our web site and call. You will seewhy we are #1 with our customers andwhy our customers are repeat custom-ers. The secret to our success has beenloving what we do and knowing ourindustry and customers.

Sincerely,

Adapters.com’ TeamEmployee owned and operated


2

The DesignEnvironmentA designers environment is complicated.Today, hundreds of complex packaging typesexist along with new variations of olderpackages. For example, a 100 pin QFP canbe square or rectangular, thick or thin, andhave a 0.025” or 0.5mm lead pitch.

UNDERSTANDING PACKAGINGThere are many package sizes and formfactors varing in complexity. Simply knowingthe package pin count may be sufficient todescribe a DIP or PLCC, but many otherintegrated circuits are designed in complicatedpackages that require you to know body size,body thickness, lead pitch and other uniquecharacteristics.

UNDERSTANDING THE APPLICATIONAt the diferent stages of your design cycle youwill use any combination of emulators, logicanalyzers, oscilloscope, device programmers,prototyping, or production boards. And youwill need to connect or adapt to the chip onyour target board. We understand the worldof interconnections.

UNDERSTANDING INTERCONNECTCHALLENGESWe invented the original Bug Catcher andhold patents on cutting edge adaptertechnology. Adapters.com’ support team hasmore than 40 combined years experience inthis industry solving design challenges fromvery basic to complex.

PROVIDING SOLUTIONSIf this is your world, then Adapters.com’Interconnect Reference Guide will assist youin your task of connecting to an I.C. oradapting from one package footprint toanother. It describes the types of packagesand applications you typially encounter. ThisInterconnect Reference Guide will help youchoose the adapter you need, and solveyour design challenges.

YOU WANT ONE THING, YOURINTERCONNECT SOLUTION.WE HAVE IT!

THE DESIGN ENVIRONMENT

Emulating

Logic Analysis

Programming

Custom adapters see page 9

Emulator adapterssee page 14

Programing adapterssee page 32

Bug-catchers see page 26

3


USING THE INTERCONNECT REFERENCE GUIDE

InterConnectReferenceGuide 2002Whether you’re an engineer or a purchaser,this guide will help you understand adapters,the differences in their classifications and howto specify the adapter you need.

DEFINING ADAPTERSAdapters.com’ definition of an adapter is anydevice that changes a package footprint toenable testing or debugging. Adapters areused by anyone designing, testing, program-ming or prototyping with IC’s. Adapters canalso provide innerconnect solutions for customapplications, so if your adapter is not coveredhere, call us and we’ll design one to meetyour needs.

CLASSIFYING ADAPTERSEmulator Adapters

When you want to remove an IC from acircuit and replace it with equipment thatmimics the IC’s function, an emulatoradapter connects the instrument to thetarget board you are testing.

Logic Analyzer AdaptersWhen you want to observe or debug anIC you may need a logic analyzeradapter. It connects to the device undertest, providing access to all signals. Alarge variety of logic analyzer adaptersare available for most package types.

Programming AdaptersWhen programming a device that is not ina DIP package, an adapter is necessarysince most programmers only have DIPsockets.

Prototyping AdaptersWhen creating a new design using otherthan a 0.1” thru-hole package, you needa prototyping adapter. These adaptersconvert the IC’s original package to afootprint that can be used in a prototypingenvironment.

Adapters.com’ technical support team or useour web search utility:http://www.adapters.com/E_search.html

ACCESSORIESAdapters.com also has a complete line ofaccessories to use with our adapters or inyour design environment. We offer everythingfrom handling tools to test probes.

TYPICAL ADAPTER CONSTRUCTIONAdapters.com’ adapters are designed to bemodular. This facilitates ease of use andreuseability with a replaceable targetinterface. Figure 1 above shows a typicaladapter. The bottom assembly or target eitherclips on, plugs in or solders down. The middlesub begins the pin breakout for the top testinterface, while the top interfaces with your testinstrument.

Figure 1: Standard assembly of PolyPod product line--one adapter, multiple use

Guide Post

Receptacle

Socket Cover(Optional)

Emulator Cover

BOTTOM

MIDDLE

TOP

Production AdaptersWhen shortages of a particular packageexist or you need a low-cost footprinttranslation, production adapters providethe solution.

Custom AdaptersIf a standard adapter won’t solve yourproblem, we can quickly design a customadapter for you. Adapters.com will workwith you to create and build an adapterusing stock products or we’ll design anadapter from scratch.

IDENTIFYING ADAPTERSOnce you’ve classified your application, youneed to find the adapter by describing theenvironment and the package types in it. ThePackage Type section details the differenttypes of packages and the critical datarequired to describe an adapter. Then, call


4

PACKAGE TYPES

TYPICAL CHARACTERISTICS

LEAD COUNT: 8 - 64LEAD PITCH: 0.1”BODY WIDTH: 0.300”, 0.400”,

0.600”, 0.900”BODY SHAPE: Rectangular

CRITICAL DATA:• Pin Count• Body Width -- Dimension W

w


LEAD COUNT: 68 - 450LEAD PITCH: 0.1”GRID SIZE: 10x10 to 24x24BODY SHAPE: SquareBODY SIZE: typical grid size

* 0.1” + 0.1”

CRITICAL DATA:• Pin Count• Grid Size• Grid Pattern

x by y

0.1

0.05

B

DUAL IN-LINE PACKAGE (DIP)Description

The most popular first generation ICpackage type. DIP is a thru-hole devicewith typical lead spacing of 0.100” on twosides of the package body. The bodywidth varies: 0.300”, 0.400”, 0.600” and0.900”. Other hybrid types are still found.Today many DIP devices translatedirectly to SOIC or TSOP packages forhigher density applications.

Package VariationsShrink DIP (SDIP):Shrink DIP packages usually have higherpin counts (i.e., 48 or 64 lead). Theyhave a lead pitch of 0.70” and a bodysize of either 0.600” or 0.750”.

PIN GRID ARRAY (PGA)Description

Second generation package. Still thru-hole, but package size is reduced bymoving pins to the underside of thepackage in a grid pattern. The pins arelocated on a 0.1” grid in various patterns.

Package VariationsInterstitial Pin Grid Array (IPGA): Thispackage type carries additional pins on a0.05” offset pattern in between the pins ofa regular PGA pattern. It almost doublesthe available pins on the same packagesize as a standard PGA.

5


PACKAGE TYPES

SMALL OUTLINE IC (SOIC) “A.K.A.GULL WING PACKAGE”Description

The first surface-mount package to replacesmall pin count (i.e., 8-16) DIP packages.They are also called “Gull Wing”packages, referring to the shape of theirpins. Lately, they are very popular forhigher pin count (up to 64 pins), mostlymemory types of ICs. At first, packageswith a 50 mil (1.27mm) lead pitchdominated, but over the last few yearsvarious higher density versions becamepopular. These have acronyms such asSSOP, TSOP, TSSOP and so on,indicating features such as smaller(shrunk) pitch or thin package height.

Package VariationsSOP Pitch: 1.27mmSSOP Pitch: 0.4, 0.5 or 0.65mmTSOPs: (see below)

THIN SMALL OUTLINE PACKAGE(TSOP)Description

The TSOP is a special variation of theSOIC, because the different versions ofbody width. Typically, “T” means a thinpackage. This is a very critical dimensionfor products like theDeltaClip. Note the twodifferent appearances of this package andthe three acronyms.

Package VariationsTSOP I Pitch: 0.5 or 0.55mmTSOP II Pitch: 0.65, 0.8 or 1.25mmTSSOP Pitch: 0.4, 0.5 or 0.65mm


LEAD COUNT: 8 - 100LEAD PITCH: 0.4, 0.5, 0.55, 0.65,

0.8, 1.0 and 1.27mm(0.05”)

BODY WIDTH: 3.9mm (0.155”) to15mm+

T

P

B

F

CRITICAL DATA• Pin Count• Pitch -- Dimension P• Body Width -- Dimension B• Body Thickness -- Dimension F• Tip to Tip Dimension -- Dimension T


LEAD COUNT: 8 - 100LEAD PITCH: 0.4 to 1.25”BODY SHAPE: RectangleBODY SIZE: grid size * 0.1” +

0.1”, typical

T F

P

B

T

B

F

P

CRITICAL DATA• Pin Count• Pitch -- Dimension P• Body Width -- Dimension B• Body Thickness -- Dimension F• Tip to Tip Dimension -- Dimension T


6

PACKAGE TYPES

SMALL OUTLINE J-LEADED (SOJ)Description

The SOJ package began as a surface-mount equivalent to a thru-hole DIP. Thelead pitch is reduced to 50 mil. Pinsprotrude on two sides of the plasticpackage body and curl under it. The leadlooks like the letter “J”, so this package issometimes referred to asJ-leaded.

PLASTIC LEADED CHIP CARRIER(PLCC) “A.K.A. J-LEADED”Description

Third generation packaging and the firsttrue surface-mount package. The PLCCpackage is a more popular version of theSOJ that has leads on all four sides.

Pitch and body sizes are fairly standard,so all you need is the pin count to specifyan adapter.

Package VariationsLeadless Chip Carrier (LCC):Ceramic body material with no physicalpins.

J Leaded Chip Carrier (JLCC):Ceramic body material with leads similar toPLCC package.


LEAD COUNT: 8 - 64LEAD PITCH: 0.050”BODY WIDTH: 0.300”, 0.350”,

0.400”BODY SHAPE: Rectangular

CRITICAL DATA:• Pin Count• Body Width -- Dimension W

W

0.5


LEAD COUNT: 18 - 84LEAD PITCH: 0.5”BODY WIDTH: typical pin count

/4 * 0.05” + 0.1”BODY SHAPE: Rectangular and

square

CRITICAL DATA:• Pin Count

7


PACKAGE TYPES

BALL GRID ARRAY (BGA)Description

One of the latest in high-density, surface-mount packages. The package is similar toPGA. BGA pin connections are solderballs, in a grid pattern, on the packagebottom.

Package VariationsMicro BGA:Same as BGA, except finer grids. Thereare three prevalent Micro BGA pitches:0.65, 0.75 and 0.8mm.

Interstitial Ball Grid Array (IBGA):This package type carries additional pins,in an offset pattern, in between the balls ofa regular BGA pattern. It almost doublesthe available connections on the samepackage size as a regular BGA.

PLASTIC QUAD FLAT PACK (PQFPOR QFP)Description

These are high-density, surface-mountpackages with leads protruding on all foursides of the package. The QFP has themost variations of any package type andmust be carefully specified for adapters.

Package VariationsCeramic Quad Flat Pack (CQFP):General characteristics are similar toPQFP, but the body size can differsubstantially.

Metal Quad Flat Pack (MQFP):Package material is metal, and body sizevaries from PQFP and CQFP.

Thin Quad Flat Pack (TQFP):A variant of the QFP package type with abody thickness of 2mm or less.

Very (small) Quad Flat Pack (VQFP):Same as TQFP.


LEAD COUNT: 16 - 2400+LEAD PITCH: 0.65, 0.75, 0.8, 1.0,

1.27, 1.5mmGRID SIZE: 4x4 to 50x50BODY SIZE: square/rectangularBODY WIDTH: Varies with grid size

and pitch

CRITICAL DATA• Pin Count• Lead Pitch -- Dimension P• Grid Size (x by y)• Grid Pattern• Ball Size -- Dimension N

B

P

N


LEAD COUNT: 32 - 304LEAD PITCH: 0.4, 0.5, 0.635

(0.025”), 0.65, 0.8,1.0mm

BODY SHAPE: square & rectangularBODY SIZE: 7mm to 40mm

CRITICAL DATA• Pin Count• Lead Pitch -- Dimension P• Body Size -- Dimension B• Body Thickness -- Dimension F• Tip-to-Tip Dimension -- Dimension T• Foot Length -- Dimension L

TB F

P L


8

WEB TOOLS

Web SiteWWW.Adapters.com is loaded with informationand utilities to assist in adapter selection.From packaging information to detailed searchengines to the adapter builder, you can findeveryting you need at one site.

ADAPTER BUILDERAn interactive tool that allows you to build anadapter on the web. After chosing yourrequirements from the menu you instantly seea rough drawing of the adapter you need.Submit the results and you will receive aquote based upon your selections within 48hours, in most cases. Or you can getinformation on the adapter by calling anAdapters.com tech support pro. They will beable to view the adapter you created anddiscuss with you directly your requirement.

ADAPTER HUNTERA search engine helps you to find an adapter.Make your search general to see a variety ofadapters, or be specific to narrow it down toonly a few part number selections. This isavailable 24 hours a day, 7 days a week.

DATA SHEETS ONLINEOnce you have a part number, you can viewa detailed drawing or a datasheet. Currently,not all parts are available, but will be addedcontinuously as they become available.

COMMAND CENTERSLearn about a product line and what isavailable with the new command centers.The first command center is the DeltaClipCommand Center where you can get lots ofinformation on the industries leading QFP clip-on adapter. PolyPod and PolyBGA commandcenters are on the way.

We update the Web information constantly,adding new products, new datasheets, newdrawings, so bookmark us and returnfrequently as your interconnect challengesarise.

Get a 2002 Catalog

On-Line search with the Adapter Hunter

Visit us at www.adapters.com

Build your own AdapterInteractively

9


CUSTOM ADAPTERS

CustomApplicationsFor one of any number of reasons the partyou need may not be an off-the-shelf item. Itcould be a new design, a specializedapplication, or the need for a low-lostproduction adapter that will require a custominterconnect. For this you will need to put aspecialist on your team.

CUSTOM ADAPTER TEAMThere could be several solutions, to find outthe right one for you, our team has moreexperience than anyone in the industry. First,you will be assigned a support specialist thatwill be with you on through every step of thedesign. You will also have a design engineerand a support team assisting on your project.

PERFORMANCEWhen speed, trace length, impedence, orboard area are an issue, we make yourpriority our priority. We have the engineeringknowledge to understand your issues and theexpertise to meet your requirements.

COSTThere are thousands of tricks in this industrythat will save you money and we know themall. Be it depopulating a socket to create astandard item, saving both time and money, orusing special manufacturing techniques, wewill give you a full set of options.

FASTHow does 2 weeks sound? This requires asolid specification, and that component partsare readily available, but we have deliveredseveral designs with lightening speed.Standard delivey is 4-6 weeks and is muchless expensive, and much more advisable.Every design is different, to find out how fastwe are, call us.

144 pin Emulator Adapter with highspeed flex-cable

Our fast delivery saves your project

Cost saving package converters

Large or small we have the solution

EMULATIONHEIGHT, SPACE LIMITATIONSHIGH SPEED SOLUTIONSMULTI-LAYER DESIGNS TOCONTROL SIGNALDEGREDATION

LOGIC ANALYSISADAPT TO TOMORROWSMOST ADVANCEDINSTRUMENTS

BGACHIPSCALE PROBINGPACKAGE CONVERTERSSURFACE MOUNT SOCKETS

PRODUCTIONCHIP SHORTAGESHIGH-RUN, LOW-COSTI.C. SOCKETSFAST DELIVERY

PROGRAMMINGHIGH VOLUME DEVICEHANDLERS

PROTOTYPINGLAB CARDS


10

PolyBGAOur PolyBGA product line is the most flexibleBGA test adapter solution in the industry.These products are designed to give the userthe option to connect the target board to testinstruments and/or use the actual device incircuit to test the proper functioning of thesystem. These high-tech solutions aredesigned to operate at high frequencies, byexhibiting very low parasitic capacitance andinductance, thereby reducing signal distor-tions and cross talk.

CS-SERIESThis configuration has solder balls on thetarget side and solders directly to your board.The CS-Pack provides a cavity for the D.U.T.with spring loaded contacts to eliminatecoplanarity issues. The CS-Pack can be usedas a surface mount socket or with anadditional male pin header to adapt to avariety of test instrumentation.

VS-SERIESThe VS-Pack has the same spring loadedpogo pin design of the DS-Pack but will alsohave built in access to the signals for testingand debugging of the D.U.T. The VS-Packtypically has a specific pin out, so theseadapters subsequently are made to order.

CS-Pack surface mount BGA socketadapter

VS-Pack socketable BGA analysisprobe

VS-SeriesAnalysis probe

Footprint Grid Body (mm) Part Number

256, 1.27mm 20 x 20 call call Adapters.com

256, 1.27mm 16 x 16 call call Adapters.com


216, .5mm 29 x 29 15 x 15 000-5080-30

100, .8mm 14 x 14 13 x 13 000-5050-50

112, .8mm 11 x 11 10 x 10 000-5052-50

121, .8mm 13 x 13 12 x 12 000-5055-50

144, .8mm 12 x 12 11 x 11 000-5060-50

144, .8mm 13 x 13 11 x 11 000-5060-60

144, .8mm 15 x 15 13 x 13 000-5060-70

157, .8mm 16 x 16 14 x 14 000-5064-50

176, .8mm 15 x 15 13 x 13 000-5069-60

176, .8mm 14 x 14 12 x 12 000-5069-50

199, .8mm 15 x 15 13 x 13 000-5076-50

224, .8mm 18 x 18 15 x 15 000-5081-50

256, .8mm 20 x 20 27 x 27 000-5087-30

304, .8mm 22 x 22 19 x 19 000-5101-20

480, .8mm 22 x 22 19 x 19 000-5141-00

108, 1.0mm 12 x 12 13 x 13 000-5051-00

315, 1.0mm 21 x 21 22 x 22 000-5103-00

255, 1.27mm 16 x 16 21 x 21 000-5086-40

256, 1.27mm 16 x 16 23 x 23 000-5087-10

256, 1.27mm 20 x 20 27 x 27 000-5087-00

BGA SOLUTIONS

CS-Series socket adapter

VS-series Analysis probe

CS-Series socket adapter

11


DS-Pack solderless BGA socketadapter

LS-Pack socketable BGAsocket adapter

DS-Series socket adapter

LS-Series socket adapter

Pogo pins

Pogo pins

PolyBGADS-SERIESThe DS-Pack uses spring loaded pogo pinson both the target and D.U.T. side. Thateliminates all the problems associated withsoldering your BGA devices to your targetsystems. No more expensive outsourcedcontract manufacturing services. The DS-pack uses a mechanical mounting and mustbe designed into your target system.

LS-SERIESThe LS-Pack is designed to replace the bulkyZero insertion force (ZIF) sockets, wheremultiple insertions of a device is required. TheLS has plug pins on the target interface whichfit into most socket receptacles and springloaded pogo pins for the actual device. TheLS offers the user an SMT adapter/socket thatis not much larger than the actual device.

CS-SOCKET RECEPTACLEThe CS-Socket allows the user the flexibility ofnot having to mount the socket directly to thetarget PCB. Simply mount the inexpensiveCS-Socket directly to the PCB and plug theLS-Series socket onto one PCB, or with extraCS-Sockets multiple board testing is as easyas plugging in a socket.

CS-ICE SOCKET RECEPTACLEThe CS-ICE allows the end user to makeconnection with an ever widening selection ofthe top emulator manufactures or many otherdevelopment tools.


112, .8mm 11 x 11 10 x 10 000-5052-40

256, .8mm 16 x 16 15 x 15 000-5087-40

256, .8mm 20 x 20 27 x 27 000-5087-25

552, 1.0mm 29 x 29 31 x 31 000-5164-40

576, 1.27mm 30 x 30 40 x 40 000-5169-40


136, .8mm 13 x 13 17 x 17 000-5057-50

144, .8mm 12 x 12 11 x 11 000-5059-90

180, .8mm 15 x 15 13 x 13 000-5072-80

256, .8mm 16 x 16 15 x 15 000-5087-90

272, 1.27mm 20 x 20 27 x 27 000-5094-90

352, 1.27mm 26 x 26 35 x 35 000-5113-80

352, 1.27mm 26 x 26 35 x 35 000-5113-90

357, 1.27mm 19 x 19 25 x 25 000-5114-90

420, 1.27mm 26 x 26 35 x 35 000-5128-90

480, 1.27mm 29 x 29 37.5 x 37.5 000-5141-90

BGA SOLUTIONS

LS series socket adapter

DS series socket adapter

Utilizing the CS ICE Socketallows the uesrs to adapt to manyforms of development tools

13


Socketable adapters for testingand board evaluation

BGA PACKAGE TEST ADAPTERSMany products currently on the market allowyou to solder your BGA IC directly to a grid ofcontacts populated in a flat FR-4 material.That style is perfect for applications when theIC can be soldered directly to the testinterface. In most cases soldering the IC canbe expensive, with the prototype devicecosting up to $1,000 each, plus expensiveoutsourced labor cost makes our BGA testadapters the developers choice.

Adapters.com BGA test adapters consist of anoff the shelf Test and Burn-in socket fordevice placement. No soldering required.The off the shelf sockets are industrystandards that feature ease of use, broad-linedevice IC packaging support, insertion andextraction cycles up to 10,000, without anydamage to your expensive IC’s. Designs witheither open-top or lidded ZIF sockets areavailable and custom designs to suit yourrequirements are just a phone call away.

The surface mount base is made to emulatethe BGA IC package characteristics. Thekeep out area of the base is almost identical tothat of the actual IC. Constructed of FR-4material, gold plated male socket interfaceand eutectic solder balls are used for reliablemounting to the target footprint. Strict qualitycontrols and inspection make these adaptersreliable in any environment. The base issoldered to the PCB using the same methodsas you would use for the actual device.

Reliable, hands free time and money savingsolutions from the pro’s at Adapters.com Modular design for ease of use

and flexibility

BGA SOLUTIONS

QUICK ORDER GUIDE: DETERMINE• Acquire IC package mechanical specifications from the manufacture.• See IC package support table at www.adapters.com.• IC socket information from IC socket section on page 46-51.• Note extra requirements, i.e. size and height restrictions

SOCKET SELECTIONCLAMSHELLOPEN TOPLEVER ACTUATED

BGA IC SUPPORT1.27 MM1.0 MM0.8 MM

WORK THE WEBON-LINE AT ADAPTERS.COMSEARCH FOR SUPPORTED IC’SDATA SHEETSAND DRAWINGS

Surface Mount BGA Test Adapters


14

EmulatorAdaptersEmulators are one of the most widely usedinstruments during new system development.Emulators help debug the hardware and areeffective during software-hardware integra-tion. There are three types of emulatoradapters: device-specific, wired one-to-one,and PAL/EPROM.

GENERAL INFORMATIONThe emulator may connect to the packagedirectly or have a general purpose interface.In either case the IC needs an adapter for thepackage. Consequently, an emulator adapterhas an emulator interface on the top and adifferent package interface to the target board.Some adapters are general purpose, such asconverting a PGA package footprint to aPLCC socket or surface-mount pads and canbe used for emulators from multiple vendorsbut the majority are either device- oremulator-specific.

INTERCONNECTIONS

CLIP-ONSome microprocessors can be put into atri-state or transparent mode Thesedevices can remain soldered to the boardand you can clip onto it and have theemulator take over.

SOCKETABLEUse a socketable adapter when you havea socket on the target board for the devicethat you are emulating. You can also usethe socketable base of the PolyPod.

SOLDER-DOWNUse a solder-down adapter when yourtest board doesn’t have a socket for theprocessor.

EMULATING

Emulator adapters in all shapes, sizes, and configurations

Target System

Emulator Interface

Typical Emulator and Target Interface

15


EMULATING

EMULATOR ADAPTERTYPES

DEVICE SPECIFIC ADAPTERS Typically, device specific adapters work foronly one IC, and its compatible derivatives.As a general rule these adapters can work formore than one brand of emulator but thereare exceptions. Some adapters offer accessto the signals, and the ability to utilize anadapter with ground and power planes. Whynot call us, our sales staff, with a combined 40years in solving the interconnect challenges ofembedded developers worldwide, are waitingto assist you.

WIRED ONE TO ONEThese adapters translate package types withequal pin counts (i.e. 68 pin PGA to 68 pinPLCC or 44 pin PLCC to 44 pin QFP) andcan be used sometimes with many devicederivatives. Due to the pin assignments beinggeneric these adapters can also perform as atest adapter or in some cases to prototype orprogram a device.

POPULAR EMULATORS

I-SYSTEMSAPPLIED MICROSYSTEMSMICROTEKNOHAULAUTERBACHASHLING MICROYOKOGAWAADVANCED TRANSDATAPHYTON

QUICK ORDER GUIDE; DETERMINE:• Device under test• Emulator manufacturer and model (pod configuration and signal assignment)• Package type on target board (e.g., QFP, SSOP, or TSOP etc. see pages 3-10)• Measure keep out area, minimum required equals

C167 Clip-on Adapter

Clip-on EmulatorAdaptersEmulating with high density surface mountpackages mounted on your developmentboard used to be a process plagued withinconsistent contact and fraught with themechanical limitations of yesterday’s clip-ontechnology. Not anymore !

Let Adapters.com introduce you to consistent,reliable hands free emulating utilizing DeltaClip-on technology. We were the first todesign this technology into our line of emulatoradapters and we are constantly adding newdevices to our list of supported devices.

POPULAR DEVICES

MOTOROLANECHITACHIINFINIONMICROCHIPINTELATMELDALLASMITSUBISHI

Clip-on adapter for Lauterbach Emulator

DeviceI.C.E.

InterfaceTarget

I.C. PackagePart

Number

68336/376 * Nohau 160 Qfp .65mm 180-5970-00

C167 * Lauterbach 144 Qfp .65mm 180-5901-80


Clip-on Adapters


16

Socket-ableAdaptersAdapters.com offers a complete line of socket-able emulator adapters . These adapters areused when your target development boardhas a production style socket for the deviceyou are emulating. These adapters, typically,are for processors that are either in DIP,PLCC,PGA and in some cases QFPpackages. Adapters come in generic 1-1configurations and also in device specificconfigurations.

We offer hundreds of adapters. For yourconvenience we have selected some of theadapters that we are asked about mostfrequently and provided them here on thispage. Listed you will find your emulatorsinterface and your target IC packaginginformation. If you do not see exactly whatyou need, no problem, just call one of ourexperience technical sales professionals andchances are we already make what you arelooking for.

If we find your adapter is not available off theshelf . Adapters.com is the quick turn expert.In most cases from design to delivery is in twoweeks or less. Loss development time waitingfor device support is no longer a problem.Call today to receive your emulation solutionfrom adapters.comI.C.E.

InterfaceTarget

I.C. PackagePart

Number

28 Dip .600 (P) 28 PLCC 110-3051-00

28 Dip .600 (Z) 28 PLCC 110-3051-10

32 Dip .600 (P) 32 PLCC 110-2426-00

I.C.E.Interface

TargetI.C. Package

PartNumber

28 PGA 6*6 28 PLCC 110-2630-00

32 PGA 7*7 32 PLCC 110-2634-00

44 PGA 8*8 44 PLCC 110-2638-00

52 PGA 9*9 52 PLCC 110-2642-00

68 PGA 11*11 68 PLCC 110-2646-00

84 PGA 13*13 84 PLCC 110-2650-00

I.C.E.Interface

TargetI.C. Package

PartNumber

28 PLCC 28 PLCC 110-2704-00

32 PLCC 32 PLCC 110-2707-00

44 PLCC 44 PLCC 110-2710-00

52 PLCC 52 PLCC 110-2713-00

68 PLCC 68 PLCC 110-2716-00

84 PLCC 84 PLCC 110-2720-00

COMMONCONVERSIONS

PGA - DIPDIP - PLCCPLCC - PLCCEMULATOR SPECIFICDEVICE SPECIFICWIRED ONE - ONE

TECHNICAL SUPPORTWE HAVE THE KNOWLEDGEWE HAVE THE EXPERIENCEWE HAVE THE SOLUTIONS

CUSTOM DESIGNSWE ARE THE DESIGNSPECIALISTFAST DELIVERY

WORK THE WEBON-LINE ADAPTER SEARCHDATA SHEETSDRAWINGS

EMULATING

QUICK ORDER GUIDE; DETERMINE:• Device under test• Emulator manufacturer and model (pod configuration and signal assignment)• Package type on target board (e.g., PGA, BGA, PQFP, LCC, PLCC, etc. see page 4)• Connection type (clip-over, socketable, solder-down)

Note: If your chip under test is in a socket, we may have an adapter that plugs into thesocket. Otherwise, you need to solder-down a base and connect to it.

DIP-PLCC, 1-1

PLCC-PLCC, 1-1

WIRED ONE TO ONEThese adapters translate package types withequal pin counts (i.e. 68 pin PGA to 68 pinPLCC or 44 pin PLCC to 44 pin QFP) andcan be used sometimes with many devicederivatives. Due to the pin assignments beinggeneric these adapters can also perform as atest adapter or in some cases to prototype orprogram a device.

PGA-PLCC, 1-1

1-1 socketable adapters

17


POPULAR DEVICES

MOTOROLANECHITACHIINFINIONMICROCHIPINTELMITSUBISHIDALLASATMEL

DeviceI.C.E.

InterfaceTarget

I.C. PackagePart

Number

C541U 44 Pga 8*8 44 PLCC 180-3900-00

C515 * Nohau 68 PLCC 180-3960-10

C517A * Nohau 84 PLCC 180-3975-10

DeviceI.C.E.

InterfaceTarget

I.C. PackagePart

Number

27C 32 Dip .600 (P) 32 PLCC 110-1665-05

27C 32 Dip .600 (Z) 32 PLCC 110-1665-00

8031 40 Dip .600 40 Dip.600 180-1825-10

8051/87C 40 Dip .600 (P) 44 PLCC 110-1671-00

8051/87C 40 Dip .600 (Z) 44 PLCC 110-1671-10

80C196KX 68 Pga 11*11 68 PLCC 110-2647-00

DeviceI.C.E.

InterfaceTarget

I.C. PackagePart

Number

PIC16C64 40 Dip .600 (P) 44 PLCC 110-1670-00

PIC16C64 40 Dip .600 (Z) 44 PLCC 110-1670-10

PIC17C42 40 Dip .600 (P) 44 PLCC 110-1670-30

PIC17C42 40 Dip .600 (Z) 44 PLCC 110-1670-40

DeviceI.C.E.

InterfaceTarget

I.C. PackagePart

Number

68HC05C4 44 PGA (P) 40 Dip .600 110-2400-00

68HC705 40 Dip.600 (P) 44 PLCC 110-2430-00

68HC705 40 Dip.600( Z) 44 PLCC 110-2430-15

I.C.E.Interface

TargetI.C. Package

NoConnects

PartNumber

24 Dip .600 (P) 28 PLCC 5,8,11,19 110-1655-10

24 Dip .600 (Z) 28 PLCC 5,8,11,19 110-1655-20

28 Dip .600 (P) 32 PLCC 110-3052-00

28 Dip .600 (Z) 32 PLCC 110-3052-10

DeviceI.C.E.

InterfaceTarget

I.C. PackagePart

Number

8X931HX * Nohau 64 SDip 180-1849-10

PH8 * Nohau 84 Pga 13*13 180-3362-10

SR 208/32 Qfp 44 PLCC 180-3920-00

8X931HX * Nohau 68 PLCC 180-3950-10

EMULATING

Various device adapters

Microchip device adapters

Intel device adapters

Infineon device adapters

Dip-PLCC adapters with no-connects

Motorola device adapters

DEVICE SPECIFIC ADAPTERS Typically, device specific adapters work foronly one IC, and its compatible derivatives.As a general rule these adapters can work formore than one brand of emulator but thereare exceptions. Some adapters offer accessto the signals, and the ability to utilize anadapter with ground and power planes. Whynot call us, our sales staff, with a combined 40years in solving the interconnect challenges ofembedded developers worldwide, are waitingto assist you.

NOTE:In catalog tables where the star (*) appearsand is followed by the name of an emulatortype or device, that adapter only works forthat manufacturers emulator

Emulator & Device specific adapters


18

EMULATING

PLCC Plugheight

PartNumber

20 Pin 21.6, or 31.9mm 110-6925-00

28 Pin 21.6, or 31.9mm 110-6950-00

32 Pin 21.6, or 31.9mm 110-6975-00

44 Pin 21.6, or 31.9mm 110-7000-00

52 Pin 21.6, or 31.9mm 110-7025-00

68 Pin 21.6, or 31.9mm 110-7050-00

84 Pin 21.6, or 31.9mm 110-7075-00

PLCC EmulatorPods &ExtendersAnytime you use an emulator you need sometype of adapter to convert your target ICpackage to your test instrument. These PLCCPods are designed to convert your target to atest instrument interface and in some casesextend out of your chassis when you havestrict space limitations

Adapters.com PLCC Pods and Extenders fallin four categories: type1, type2, type3, andtype 4. These configurations are generally offthe shelf items, but custom configurations canbe created quickly. We stock all the hardwareand material.Tell us how you want the partwired and in some cases delivery can bewithin 2-3 days after receipt of your order..

Type-1This adapter consist of a male PLCC plug thatinserts into a production and or an auto ejectstyle socket, this is soldered to a breakoutboard that can have either male / femaleconnectors or unterminated cables( at yourdesired length).

Type-2This adapter only has the PLCC plug with theunterminated cable attached. These adaptersare used when surrounding componentsblock access to your target therefore yourPod will not fit.

Type-3These adapters are built like type-1 but thenwe add a PCB at the other end of the cable.No field configuration is need with this adapteryou just specify the cable length.

Type-4Type four is also a “plug and go” configura-tion. This is similar to type two, with no boardon the target end and then pre-wired on theother end for your emulator.

Emulator Pods and Extenders




Type 1

Type 2

Type 3

Type 4

NOTE:In catalog tables where the star (*) appearsfinish part number with the cable length yourapplication requires. (ie. 110-6940-08 = atype 4 Pod with 8 inches of cable).

PLCC Plugheights

PartNumber

20 Pin 16.5, 21.9mm 110-6930-06

28 Pin 16.5, 21.9mm 110-6955-"*"

32 Pin 21.6, or 31.9mm 110-6980-"*"

44 Pin 21.6, or 31.9mm 110-7005-"*"

52 Pin 21.6, or 31.9mm 110-7030-"*"

68 Pin 21.6, or 31.9mm 110-7055-"*"

84 Pin 21.6, or 31.9mm 110-7080-"*"

PLCC Plugheights

PartNumber

20 Pin 16.5, 21.9mm 110-6935-"*"

28 Pin 16.5, 21.9mm 110-6960-"*"

32 Pin 16.5, 21.9mm 110-6985-"*"

44 Pin 16.5, 21.9mm 110-7010-"*"

52 Pin 16.5, 21.9mm 110-7035-"*"

68 Pin 16.5, 21.9mm 110-7060-"*"

84 Pin 16.5, 21.9mm 110-7085-"*"

PLCC Plugheights

PartNumber

20 Pin 16.5, 21.9mm 110-6940-"*"

28 Pin 16.5, 21.9mm 110-6965-"*"

32 Pin 16.5, 21.9mm 110-6990-"*"

44 Pin 16.5, 21.9mm 110-7015-"*"

52 Pin 16.5, 21.9mm 110-7040-"*"

68 Pin 16.5, 21.9mm 110-7065-"*"

84 Pin 16.5, 21.9mm 110-7090-"*"

19


EMULATING

DIP - SOICAdaptersAdapters.com has surface mount adapters to!

These Dip-Soic adapters are used to converta small outline package footprint to an “oldfashioned” dual in line package type. Theadapter surface mounts to the target via amodular base in place of the DUT, andpresents the DIP footprint on top for thedeveloper.

They can be very helpful, for example,during firmware development, where the userwants to replace programs in EPROMs,which can be conveniently re-programmed inDIP packages, until the final version isavailable in an SO package.

Any package any pin count !

Adapters.com Dip-Soic adapters cover abroad section of devices that fall under thename Small Outline Package. We support all1.27mm pitch device body sizes, 3.8mm,5.1mm, 7.6mm , 9.1mm, 11.4mm, 13.5mm,and pin counts from 8-44. We also supporthigh density SO package types like SSOP,PSOP, TSOP-II. Call an Adapters.comTechnical Sales Support person today, startdeveloping tommorrow.

NOTE:The Dip-Soic adapters can be provided withboth .300 mil or .600 mil wide female DIPfootprints (where applicable).

Wherever noted in tables.(P) equals production IC socket.(Z) equals zero insertion force IC socket

3.8mm SOIC surface mount base



QUICK ORDER GUIDE; DETERMINE:• DIP footprint needed 8-44• Interface socket type Production or Zero insertion force• Package type on target board need Body size, Tip-Tip dimension, Lead pitch• Typically the dip and soic pin counts match, we can customize almost any combination


Dip-Soic, 7.6mm(.300) body size



I.C.E.Interface

SOIC1.27 / 5.1mm

PartNumber

8 Dip .300 (P) 8 Pin 110-4100-20

16 Dip .300 (P) 16 Pin Call factory

18 Dip .300 (P) 18 Pin 110-4113-20

20 Dip .300 (P) 20 Pin 110-4119-20

I.C.E.Interface

SOIC1.27 / 7.6mm

PartNumber

8 Dip .300 (P) 8 Pin 110-4100-30



18 Dip .300 (P) 18 Pin 110-4113-30

20 Dip .300 (P) 20 Pin 110-4119-30

28 Dip .300 (P)28 Dip .600 (P)

28 Pin28 Pin

110-4132-30110-4135-30

32 Dip .600 (P) 32 Pin 110-4144-30

I.C.E.Interface

SOIC1.27 / 3.8mm

PartNumber

8 Dip .300 (P) 8 Pin 110-4100-10

14 Dip .300 (P) 14 Pin 110-4107-10

16 Dip .300 (P) 16 Pin 110-4110-10

18 Dip .300 (P) 18 Pin 110-4112-10

20 Dip .300 (P) 20 Pin 110-4119-10


20

Emulator specific adapters

DeviceI.C.E.

InterfaceTarget

I.C. PackagePart

Number

AT90LS 28 Dip .300 32 Qfp .5mm 110-3105-00

AT90S4434 40 Dip .600 44 Qfp .8mm 110-3230-00

AT49F1024 44 PLCC 40 TS.5mm 110-3942-00

DeviceI.C.E.

InterfaceTarget

I.C. PackagePart

Number

8031/51 40 Dip .600 44 Qfp .8mm 110-3227-00

196KC 68 PGA 11*11 80 Qfp R .8mm 110-3605-00

486DX 168 Pga 17*17 208 Qfp .5mm 110-3700-00

8051XAS 68 PLCC 80 Qfp .5mm 110-3900-00

80186/88EB 84 PLCC 80 Qfp .8mm 110-3913-00

EMULATING

Surface MountAdaptersAdapters.com is the market leader in solderdown technology and product quality. Weoffer more pin counts and configurations in thisarea than anyone. Our engineering staffpioneered the first surface mount emulatoradapters and with the introduction of ourPolyPod surface moount line we arecontinuing the tradition of leading in markettechnology.

With the introduction of the PolyPod we alsotook the high cost out of multiple board testing.We are offering a product that is less than50% of the cost what our competition offers.Versatility is also a trademark of products. Theunique abliity to be used as a standalonesurface mount base with the option to be asurface mount socket makes this product likeno other.

If a custom solution is what you need thenAdapters.com has what it takes. In ourcompany everyone who is involved inproduct design has over ten years experi-ence in the adapter industry. We are anemployee owned company that cares and wehave the most experienced design staff -- barnone.

QUICK ORDER GUIDE; DETERMINE:• Device under test• Emulator manufacturer and model (pod configuration and signal assignment)• Package type on target board (e.g., PGA, BGA, PQFP, LCC, PLCC, etc. see page 4)• Connection type (clip-over, socketable, solder-down)


Motorola 68302 adapter

Atmel device adapters

Intel device adapters

NOTE:In catalog tables where the star (*) appearsand is followed by the name of an emulatortype or device, that adapter only works forthat manufacturers emulator

21


Device-specific adapters

DeviceI.C.E.

InterfaceTarget

I.C. PackagePart

Number

68302 132 Pga 13*13 132 Qfp .635mm 110-3661-00

68060 206 Pga 18*18 240 Qfp .5mm 110-3714-00

68360 241 Pga 18*18 240 Qfp .5mm 110-3731-00

68HC11E9 52 PLCC 64 Qfp .8mm 110-3886-00

68HC05B6 52 PLCC 64 Qfp .8mm 110-3887-00

68HC11F1 68 PLCC 80 Qfp .65mm 110-3903-00

68HC12 * Nohau (NQ) 80 Qfp .65mm 180-5550-00

68HC12 * Nohau (TQ) 80 Qfp .65mm 180-5550-10

68HC16Z1 * Nohau (TQ) 144 Qfp .5mm 180-5894-30

DeviceI.C.E.

InterfaceTarget

I.C. PackagePart

Number

C508 * Nohau 64 Qfp .8 mm 180-5450-00

C161 * Nohau (NQ) 80 Qfp .65mm 180-5550-15

C164C1 * Nohau (NQ) 80 Qfp .65mm 180-5550-20

C164C1 * Nohau (TQ) 80 Qfp .65mm 180-5550-25

C164C1 * Nohau (YP) 80 Qfp .65mm 180-5550-30

C515 * Nohau (NQ) 80 Qfp .65mm 180-5550-40

C515 * Nohau (TQ) 80 Qfp .65mm 180-5550-45

C515C * Nohau (NQ) 80 Qfp .65mm 180-5550-50

C515C * Nohau (TQ) 80 Qfp .65mm 180-5550-55

C505L * Nohau (NQ) 80 Qfp .65mm 180-5550-60

C505L * Nohau (TQ) 80 Qfp .65mm 180-5550-65

C1610 * Nohau (NQ) 80 Qfp .65mm 180-5550-70

C161RI * Nohau (NQ) 100 Qfp .5mm 180-5680-10

C517A * Nohau (NQ) 100 Qfp R.65mm 180-5690-20

C517A * Nohau (TQ) 100 Qfp R.65mm 180-5690-10

C161RI * Nohau (NQ) 100 Qfp R.65mm 180-5690-50

C161SI/C * Nohau (NQ) 128 Qfp .5mm 180-5785-10



DeviceI.C.E.

InterfaceTarget

I.C. PackagePart

Number

PIC16C74 40 Dip .600 (P) 44 Qfp .8mm 110-3228-00

PIC16C74 40 Dip .600 (Z) 44 Qfp .8mm 110-3228-05

PIC16C924 68 PLCC 64 Qfp .5mm 110-3905-00

PIC16C 18 Dip .300 20 Soic .65mm 110-3105-00

DeviceI.C.E.

InterfaceTarget

I.C. PackagePart

Number

M16C/62 * Nohau (NQ) 100 Qfp .5mm 180-5681-00

M16C/62 * Nohau (TQ) 100 Qfp .5mm 180-5681-10

M16C 100 Lcc/Qfp 100 Qfp .65mm 180-5691-00

M16C 100 Lcc/Qfp 100 Qfp .65mm 180-5691-05

M16C 100 Qfp .65mm 180-5691-10

DeviceI.C.E.

InterfaceTarget

I.C. PackagePart

Number

TMP87 64 SDip 64 Qfp R 1.0mm 110-3265-00

8XC196KC * Nohau (TQ) 80 Qfp .5mm 180-5540-10

80C552 68 PLCC 80 Qfp .8mm 110-3660-00

M37710 80 LCC 80 Qfp .8mm 110-3770-00

DS87C 52 PLCC 52 Qfp .65mm 110-3885-00

78C10 64 QIP 64 Qfp R 1.0mm 110-4040-00

EMULATING

Mitsubishi device adapters

Microchip device adapters

Infineon device adaptersVarious device adapters

Motorola device adapters

NOTE:(P) equals “Production IC socket”(Z) equals “ zero insertion force IC socket”(NQ, TQ) refer to the style of surface mount basethat is shipped with the product. for referencepurpose see pages 20 and 21


22

EMULATING

QFP EmulatorPodsPOLYPOD ADAPTERSThese adaoters allow easy and cost efficientaccess to your target board when you havea QFP device footprint. The PolyPod adapterline is the most versatile in the industry.Primary application is connecting an emulatorto the PC board under development. Theinterface board that is connected to thesurface mount bases can be customized forthe particular emulator, or we can provideyou with industry standard versions.

NQ-POLYPODThe NQ PolyPod is the only surface mountadapter line that allows connectivity to alltypes of test instrumentation and with optionalaccessories acts as a surface mount socketutilizing the same pad layout of your target ICpackage. The NQ can connect directly to youEmulator or with a conversion board (asshown in the illustration on the left) can beconverted to fit any make or model ofemulator. It does all this and still comes inunder the cost of some other products on themarket. Injection molding, and superior designensure that the product you receive is 100%tested and ready to emulate.

TQ-POLYPODThe TQ PolyPod adapter also allows directconnection to most types of test instrumenta-tion, or with conversion boards. This lowprofile injection molded surface mount basehas no equal for price and or versatility. TheTQ PolyPod base is also used in our line ofLogic Analyzer adapters so with one costefficient solution your test capabilities areendless.

The PolyPod adapter lines and theAdapters.com team of adapter designers andtechnical support profeesionals ensures thatyou receive the right products with the bla blabla

Stackable socket savers

YQ-PolyPod “Emulator cover”

NQ-PolyPod “Surface mount base”

Stackable socket savers

Tq-PolyPod “Surface mount base”

Target System

Target System

Emulator Interface

Emulator InterfaceNQ-POLYPODADAPTERS

TQ-POLYPODADAPTERS

NOTE:Please refer to the table on the next page tosee if your Qfp Ic package type is supportedby the PolyPod line of adapters.

23


PolyPodSurface-mountBasesA special type of surface mount base is thePolyPod. The PolyPod is a versatile, highperformance, low cost QFP solder downbase.Versatile because it can be reconfiguredfor a variety of testing situations. Highperformance because its compact designallows for high speed designs to workflawlessly. Low cost because replacementbases are up to 50% less than other units.It’s no mystery why leading emulator and testequipment manufacturers are switching to thePolyPod.

VersatilityIn the NQ version, the Polypod has a basethat solders down on the QFP footprint. Fromthere you can: Plug in a cable assembly toyour emulator, connect an adapter to it andplug in to various test equipment, OR put theIC directly on the base, put the special ICcover over it and verify that your designworks. You could even ship the unit to YOURcustomer. No other product in the market letsyou do more testing with one base solderedto the design.

Selection andDeliveryAdapters.com carries hundreds of PolyPodbases in stock. We have all the popular pincounts and pitches and many of the uncom-mon ones as well. Often your PolyPod basecan ship the same day you order it.

Work the WebEverything you need to know about thePolyPod is on www.adapters.com

• Search -- Type in as much as you knowabout your needs and find out what isavailable

• Data sheets -- A full set of data sheets onall PolyPod products are on the web

• Create -- The Adapter Builder lets youcreate your adapter on-line.

Click on the PolyPod Command Center

tnirptooF -NQ

-TQ ydoB tnirptooF -N

Q-T

Q ydoB tnirptooF -NQ

-TQ ydoB

mm8.nip23 * 0.7x0.7 mm5.nip08 * * 0.21x0.21 mm536.nip231 * 2.42x2.42

mm56.nip04 * 0.01x0.01 mm4.nip08 * 0.21x0.21 mm4.nip441 * 0.61x0.61

mm8.nip44 * * 0.01x0.01 mm8.nip001 * 0.22x0.22 mm5.nip441 * * 0.02x0.02

mm1nip44 * 0.41x0.41 mm5.nip001 * * 0.41x0.41 061/441 mm56.nip * * 0.82x0.82

mm5.nip84 * * 0.01x0.01 mm4.nip001 * 0.21x0.21 mm4.nip651 * 0.02x0.41

mm8.nip84 * 0.7x0.7 mm56.nip001 * 0.02x0.41 mm56.nip061 * * 0.82x0.82



mm1nip46 * * 0.02x0.41 mm5.nip021 * 0.61x0.61 mm5.nip671 * * 0.42x0.42


mm56.nip46 * * 0.21x0.21 441/021 mm5.nip * 0.02x0.02 mm5.nip802 * * 0.82x0.82




The PolyPod surface mount adapter

PolyPod supported I.C. packages

NQ style

TQ style

EMULATING


24

EMULATING

High SpeedCoaxial cableThese cables are used for high-speedcircuits, when the test instrument can notdirectly access the target board due to spacelimitations. Our state-of-the-art cables can beused up to 1 Ghz., and they are designed toeasily interface to our industry standardPolyPod and PolyBga surface mount adapterlines. Each signal line is routed through aminiature coaxial cable, eliminating noise andcross-talk completely. You have to see it tobelieve it.

.33MM COAXIAL SIGNAL LINESISOLATED GROUND LINES AND FLAMESCHARACTERISTIC IMPEDANCE 50 OHMSPLATED COPPER CENTER CONDUCTORTEFLON RESIN DIELECTRICWOUND COPPER OUTER CONDUCTOR

POLYESTER OUTER JACKET

PGA -PGAFlex CircuitsAdapters.com is committed to solving all yourinterconnection applications. Our PGA-PGAflex circuits are another product toward thatgoal. Not all applications are at the forefront oftechnology some of the reliable packagestypes of yesterday are still workhorses today.These flex circuits are designed with the samecommitment to quality as our other flex cablesbut are just designed to work at lower speeds,and offer a female-female PGA footprint. Wehave male to male interconnections foradapting to all types of test instruments. Thesecables are also compatible with our DeltaClip-on adapters.

High Speed Coaxial cable

PCB detail, High speed Coaxial

Footprint InterfacePart

Number

169 Pga 13*13 Female-Female 110-7960-00

256 Pga 16*16 Female-Female 110-7975-00


Number

100 .5mm NQ/TQ PolyPod 110-8145-00

120 .4mm NQ PolyPod 110-8150-00

144 .5mm NQ/TQ PolyPod 110-8195-00

The PolyCoaxial cables

The Pga-Pga--Flex circuits

PGA-PGA FLEX CHARACTERISTICS

SPEEDS UP TO 20 MHZ.158.8MM LENGTHMALE-MALE CONNECTORS AVAILABLE FOR PCBINTERCONNECTION

25


EMULATING

High Speed FlexCircuitsOften to get from your target board to theemulator, you will need some type of cableassembly. In the embedded environmentclock rates are commonly over 50 MHz. andaccess to your target is limited due to spacerestrictions, like computer chassis, cardiagnostic systems, disk drives and miniaturetelecommunication products.

The PolyFlex line of high speed, lowimpedance solutions were developed withthose situations in mind. The high speed flexcircuits were designed to handle clock speedsexceeding 100 MHz., using controlledimpedance technology, that is, transmissionline characteristics to reduce signal distortions,capacitative or inductive loading, and crosstalk.

The PolyFlex was also designed to interfacedirectly with the popular PolyPod adapter.Thus allowing connection to a wide variety ofEmulators, Logic Analyzers, and a host ofother test instruments.

The PolyFlex supports two level of testing.For signal speeds exceeding 20 MHz up to100 MHz use the parts in the upper table tothe right. For signal speeds lower than 20MHz use the parts listed in the lower table tothe right.

If your cable is not listed call us. Customdesigns are available

tnirptooF ecafretnI rebmuNtraP

mm5.PFQnip08erauqS

,QN,mm041epyteborp,QN,mm041

,QT,mm041epyteborp,QT,mm041

00-2318-01101-2318-01105-2318-01107-2318-011

PFQnip08ralugnatceRmm56.

QT/QN,mm041eborp,QT/QN,mm041

04-5318-01106-6138-011

PFQnip001erauqSmm5.



00-2418-01101-2418-01105-2418-01107-2418-011

PFQnip441erauqSmm5.



00-2918-01101-2918-01105-2918-01107-2918-011

PFQnip671erauqSmm5.



00-2328-01101-2328-01105-2328-01107-2328-011

The Poly-Flex

The Poly-Flex 60 Mhz or lower

QUICK ORDER GUIDE; DETERMINE:• Cable length needed• Speed requirements• Special grounding or sheilding needs• Interconnects needed on both sides of the cable


Number

44 pin .8mm NQ / TQ 110-8105-00

64 pin .5mm NQ / TQ 110-8115-00

64 pin .8mm NQ / TQ 110-8120-00

80 pin .8mmRectangular

NQ / TQ 110-8137-00

The Poly-Flex 30 Mhz or lower


26

LOGIC ANALYSIS

Logic AnalyzerAdaptersLogic Analyzer and scope adapters aredesigned to give access to each signal pin ona high-density IC. Some variations arespecifically adapted to connect to a specificlogic analyzer such as using MICTORconnectors for Agilent and Tektronixanalyzers.

INTERCONNECTIONS

SocketableUse a socketable adapter when you havea socket for the device on your targetboard. The adapter plugs into the socketand another socket exists on top to plug inthe IC.

Solder-DownIn some cases, you have to solder theadapter onto the target board in place ofthe actual IC. Then, place the IC in theadapter. For many QFP devices, we havethe PolyPod line that acts as a socket forthe device.

Clip-OnThe clip-on test clip attaches to the devicedirectly on the target and breaks its pinsout to .025 wire wrap test points or to AmpMictor connectors.

Pin IsolatorsPin Isolators allow you to isolate thedevice pins from the target and conditionthem according to your requirements.They also allow easy rewiring ofconnections if necessary.

Scope Probes and AccessoriesA full-line of Grabbers, Microclips, ScopeProbes, and Probe kits compliment ourcomplete support for logic analysis.

WHAT ARE YOU GOING TO DO?Let Adapters.com sales staff guide youthrough from start to finish. We offer a widearray of adapters to choose from and ourteam will deliver custom solutions to suitwhatever your requirements.

Scope adapters and probes

BGA Adapters for TLA700 Analyzers

Clip-on probing for QFP devices

Surface mount QFP Logic Analyzeradapters

MicroClips for fine pitch QFPdevices

Large variety of scope accessories

27


BGA Logic Analyzer Adapters

QUICK ORDER GUIDE: DETERMINE• Acquire mechanical spec’s of the device under test• Generic breakout or device specific pin assignment required• Logic analyzer manufacturer and probe model number and user’s guide .pdf• Additional requirements: ie size and height restrictions, electrical performance characteristics

BGA BugCatchersWith BGA packages the simple task ofbreaking out the signals for debuggingbecomes an overwhelming task for theunsuspecting engineer. How do I solder mydevice to the target? Will the adapter I boughthandle my testing speed? Will coplanarity bean issue? Adapters.com BGA adapters aredesigners best friend. BGA Bug Catcherstypically come in two categories. Genericbreak outs for signal access, probing anddevice and Analyzer specific for more indepth testing and signal monitoring.

TARGET INTERFACEBoth types begin with a surface mount basethat emulates the physical characteristics of theactual device to be tested. This virtuallyeliminates keep out area (some adaptersrequire more space), while at the same timemakes installing the adapter as easy asmounting the device. Gold plated interfacecontacts and eutectic solder balls make forreliable mounting and subsequent testing.

SIGNAL ACCESSThe break out or probe board can beprovide with generic .025 wire wrap postspaced on .100 mil or the 38 pin Amp Mictorconnectors depending on the application. Insome designs controlled impedance, andmatched pair signal traces are standard onthe probe boards.

SOCKETING THE DEVICEThe last assembly consist of the actual ICsocket. Due to our good association with theindustries leading socket designers andmanufactures no matter what your packageconforms to we can find a socket or have acustom one designed for you to get up tospeed ASAP.

PACKAGE SUPPORTDue to the ever expanding array of grids,body sizes and ball spacing we ask that yougo to our web site www.adapters.com andbrowse our complete list of the IC sizes andpackage types we support.

LOGIC ANALYSIS

Typical BGA LogicAnalyzer Adapter andTarget Interface


28

QFP BugCatchersAdapters.com has made a commitment to offerdevelopers a wide array of cost savingsolutions to fit in their ever changing world. Inthis case it means offering the most versatileproducts for standard QFP technologies andconstant innovations for newer emergingtechnologies.

THE POLYPODOur line of QFP logic analyzer adapters arejust that both innovative and versatile. First westart with the PolyPod surface mount base.This product revolutionized the QFP marketsince its introduction 5 years ago. With cost ofthese adapters at less than half the competi-tion, better reliability, and the ease ofinstallation -- we ask why buy another QFPsolder down base? With all the pin countssupported, and the large inventory we havegot what you need, and it’s in stock!

Adapters.com adapters are designed to bemodular in design to allow for multiple boardtesting with the minimum amount of extrahardware

TEST INTERFACEBreaking out the signals is done via the use ofprobe boards. These boards are similar indesign and concept as the probe boards forthe BGA adapters on the proceeding pages.They can be generic in design or have all thesignal integrity characteristics of our high-endadapters.

SOCKETING THE DEVICEOur adapters come with a most impressivearray of socket styles and choices. Typicallythe first choice is a lidded ZIF socket but somedevelopers prefer open-top designs. Ourdesigners utilize both styles to accommodateevery engineers preferences. Let one of oursales pro’s help you select the adapter thatbest fits your design environment.

MODULAR DESIGNMost of our adapters are designed withflexibility in mind, this allows you to fieldconfigure iyour solutions. Your design worldis ever changing and your test adaptersshould be able to adapt.

Typical QFP Analyzer adapter

The PolyPod Surface mountable Interface

The PolyPod

Device Zif Socket

Test Interface

Target board

Target Interface “ ThtPolyPod”

Mid Sub Assembly

Socketable board interface

LOGIC ANALYSIS


29


Footprint Body Part Number Footprint Body Part Number Footprint Body Part Number

32 pin .8mm 7.0 x 7.0 120-4262-00 80 pin .4mm 12.0 x 12.0 120-4325-00 144 pin .5mm 20.0 x 20.0 120-4414-00

40 pin .65mm 10.0 x 10.0 120-4272-00 100 pin .8mm 22.0 x 22.0 120-4360-00 144/160 pin .65m 28.0 x 28.0 120-4418-00


44 pin 1mm 14.0 x 14.0 120-4278-00 100 pin .4mm 12.0 x 12.0 120-4350-00 160 pin .65mm 28.0 x 28.0 120-4435-00




56 pin .65mm 10.0 x10.0 120-4293-00 120 pin .5mm 16.0 x 16.0 120-4372-00 176 pin .4mm 20.0 x 20.0 120-4442-00

64 pin 1mm 14.0 x 20.0 120-4308-00 120 pin .5mm 20.0 x 20.0 120-4373-00 208 pin .5mm 28.0 x 28.0 120-4450-00

64 pin .8mm 14.0 x 14.0 120-4306-00 120/144 pin .5mm 20.0 x 20.0 120-4373-00 240 pin .5mm 32.0 x 32.0 120-4464-00




80 pin .65mm 14.0 x 14.0 120-4329-00 132 pin .635mm 24.2 x 24.2 120-4388-00

80 pin .5mm 12.0 x 12.0 120-4327-00 144 pin .4mm 16.0 x 16.0 120-4410-00

The largest selection of QFP logic analyzer adapters,all featuring the PolyPod

QFP logic analyzer adapter selector (Call if your adapter is not listed)

QFP Bug LogicAnalyzerAdaptersAdapters.com offers one of the most extensivelines of QFP logic analyzer adapters in theindustry. By using the PolyPod surfacemountable base this line is the most fieldconfigurable adapter money can buy.

The engineer solders a modular surfacemount base to their target in place of the IC. tobe tested. Depending on the configuration thebase can also be used as a socket byinserting the IC. and using an optional cover.The top assembly or break out boardtranslates the signals to .100 mil spaced .025”wire wrap test points or with custom adaptershave the analyzers specific probe connectordesigned in.

LOGIC ANALYSIS


30

SOIC BugCatchersSmall Outline Integrated Circuits come inmany sizes , shapes, and package variationsand our sales and engineering staff is readyto adapt any to your design environment.These adapters allow you to perform in circuittesting, and signal probing.

TARGET INTERFACEThe developer begins by soldering a surfacemount base to the target board. The baseemulates the physical characteristics of thedevice under test. The base bases come into styles or types.

J-Lead FootA PCB roughly the same size as thedevice with bent and formed leads thatsolder to the target using the samemethods as the actual device.

Solder Column FootThis style uses solder column technologyfor mounting to the target PCB. This styleis typically run through a re-flow oven.

TEST INTERFACEThe test interface consist of a PCB withstandard .025 wire wrap post for easy signalaccess, and an off the shelf SOIC device Zifsocket for holding the D.U.T.. The individualsignals are numbered for ease of use andhands free testing.

MODULAR DESIGNLike most of our adapters these are modularin design and function. Utilizing modulardesign allows you the developer to testmultiple boards by purchasing extra targetinterfaces and utilizing the same probeassembly .

LOGIC ANALYSIS

LeadCount

ICBaseType

Part number

8 SOIC, 1.27mm J-lead 120-4500-00

16 SOIC, 1.27mm J-lead 120-4510-00

18 SOIC, 1.27mm J-lead 120-4515-00

20 SOIC, 1.27mm J-lead 120-4520-00

28 SOIC, 1.27mm J-lead 120-4530-00

32 TSOP, 0.5mm Leadless 120-4541-00

32 SSOP, 0.65mm Leadless 120-4542-00

36 TSSOP, 0.8mm Leadless 120-4548-00

44 SOIC, 1.27mm J-lead 120-4560-00

44 SOIC, 1.27mm T3 120-4560-50

48 TSOP, 0.5mm Leadless 120-4566-00

56 SOIC, 1.27mm Leadless 120-4580-00

SOIC, TSOP Bug CatchersCUSTOMER SERVICE

CALL US AND YOU WILL TALKWITH A LIVELY INTELLEGENTPERSON

ANY PACKAGE....ANY PACKAGE, ANY DEVICE,ANY ANALYZER


31


LOGIC ANALYSIS

PLCC Pin Isolator

DIP Pin Isolator

tnirptooF tekcoStraP

rebmuNtnirptooF tekcoS

traPrebmuN

ediwlim003.PIDnip42noitcudorP

fiZ00-6794-02110-6794-021

CCLPnip02 fiZ 01-0625-021


fiZ00-0894-02110-0894-021

CCLPnip82noitcudorP

fiZ00-1625-02101-1625-021


fiZ00-1894-02110-1894-021

CCLPnip23noitcudorP

fiZ00-6625-02101-6625-021


fiZ00-3894-02110-3894-021

CCLPnip44noitcudorP

fiZ00-1725-02101-1725-021


fiZ00-2994-02110-2994-021

CCLPnip25noitcudorP

fiZ00-6725-02101-6725-021

CCLPnip86noitcudorP

fiZ00-1825-02101-1825-021

tnirptoofAGProfllaCnoitceles

CCLPnip48noitcudorP

fiZ00-6825-02101-6825-021

Pin Isolators, PLCC and DIP, and socket configurations

Pin IsolatorsAdapters.com realizes at some point in timemost developers need to isolate a signal or agroup of signal to test one function of theirfirmware or another. We have designed ourpin isolators with that thought in mind. Theseadapters are typically socketable to the targetboard, then allow for the device to be placedin circuit and via conveniently placed dipswitches or jumper shunts allow for individualcircuits to be isolated.

DIP ISOLATORSDIP Isolators? Yes the tried and true are still incirculation today. Dip Isolator have a malesocketable dip footprint for adapting to thetarget, and then have a zif socket for theD.U.T.. The adapter has two boardsmounted vertically with dip switches for easyaccess to the signals that need to be isolated.

PLCC ISOLATORSAdapters.com PLCC isolator adapters use aunique two board design that not only allowsyou to isolate the signals but doubles as alogic analysis adapter for probing and signalverification. On the test interface board rows ofnumbered test points connected via jumpershunts allows easy manipulation of thedesired signals that need to be tested.

QFP ISOLATORSOur customers demanded that we includeadapters for QFP devices. Now we alsohave included them in to our line of Isolatoradapters. Although these adapters aretypically surface mount, socket version can bedesigned per your requirements. In somecases the adapters work with OEM suppliedconnectors with some of the industries leadingdevelopment tool makers, and work well withour PolyFlex line of high speed rigid flexadapters.

At Adapters.com our goal is to be a one stopshop for all your interconnect challenges.Start all your projects right by giving ourtechnical sales professionals a call, you will bethe one who gets it done fast, and has theleast amount of down time in your develop-ment.

PLCC ISOLATORSINNOVATIVE 2 BOARDDESIGN

EASY TO USEMULTIPURPOSE ADAPTER

QFP ISOLATORSUTILIZES POLYPODTECHNOLOGY

SUPPORTS MANYDEVELOPMENT TOOLCONFIGURATIONS

ANY PACKAGE....ANY PACKAGE, ANY DEVICE


32

PROGRAMMING

ProgrammingAdaptersProgrammers program a wide range ofdevice types including memories, logic andmicrocontrollers. Most programmers are builtwith zero insertion force (ZIF) DIP packagesockets. Programming adapters convert yourexisting package to a DIP package.

INTERCONNECTIONS:General Purpose

These adapters can accommodate a largenumber of devices which are consideredindustry standard. These adapters willwork with almost all programmers on themarket. These are typically low pin countdevices (44 and under) that wereoriginally available in DIP.

Device-SpecificThese adapters are unique to one deviceor device family. They are normallydevices with pin counts over 44 or thatwere never available in a DIP version.

Programmer-SpecificSome adapters are programmer-specific.If a device never had a DIP version it maybe programmer-specific as well.

Gang DescriptionYou also need to specify if you need gangcapability. Gang capability means that youhave a gang programmer and will beprogramming multiple devices at once. Todo this the adapter needs to be 0.9 incheswide or less.

QUICK ORDER GUIDE; DETERMINE:• Device to program• Programmer manufacturer and model (i.e., Data I/O)• Package type (i.e., PGA, BGA, PQFP, LCC, PLCC, etc. see page 4)• Single device or gang programming

Devices Footprint InterfacePart

Number

G28F008S38S5,16S3,S540 pin uBGAopen-top

40 pin DIP .600 mil wide 130-2673-00

GT28F160B3,016B348 pin uBGAopen-top

40 pin DIP .600 mil wide 130-2679-00

GT28F160B3,800B348 pin uBGAopen-top

44 pin DIP .600 mil wide 130-2680-00

G28F320J5,G28F640J556 pin uBGAopen-top

40 pin DIP .600 mil wide 130-2687-00

G28F320J5,640J556 pin uBGAopen-top

48 pin DIP .600 mil wide 130-2689-00

MACH5,5LV256 pin BGAopen-top

28 pin DIP .600 mil wide 130-2756-00

GT28F160B3352 pin BGAopen-top

28 pin DIP .600 mil wide 130-2772-00

Micro BGAProgramming adapters

48 pin micro BGA adapter

33


PROGRAMMING

56 pin SDIP for Motorola 68HC705

CUSTOMER SERVICECALL US AND YOU WILL TALKWITH A LIVELY INTELLEGENTPERSON

ANY PACKAGE....ANY PACKAGE, ANY DEVICE,ANY PROGRAMMER

CALL US IF YOUR DEVICE ISNOT LISTED WITH OVER1000 PROGRAMMINGADAPTERS, CHANCES ARE,WE HAVE IT!

Plcc Programming adaptersWiring &

no-connectsIC package &

socket typeInterface Part Number

1,3,5,7,9,11,12,13,15,16,18,19no connects

20 pin PLCC auto20 pin PLCC auto20 pin PLCC zif20 pin PLCC zif

8 pin DIP .300 mil wide8 pin DIP .600 mil wide8 pin DIP .300 mil wide8 pin DIP .600 mil wide

130-3550-00130-3563-00130-3550-03130-3563-03

1,3,5,6,9,10,11,12,15,16,18,19no connects



130-3552-00130-3565-03130-3552-03130-3565-03

1,3,5,6,7,11,13,14,15,16,17,19no connects



130-3554-00130-3567-00130-3554-03130-3567-03

1,6,11,16no connects



130-130-130-130-

1 to 1



130-3625-00130-3638-00130-3625-03130-3638-03




130-3725-00130-3738-00130-3725-03130-3738-03




130-3727-00130-3740-00130-3727-03130-3740-03




130-3729-00130-3742-00130-3729-03130-3742-03




130-3731-00130-3744-00130-3731-03130-3744-03

1,11,15,19no connects28-1,14-15 shorted



130-3733-00130-3746-00130-3733-03130-3746-03

1 to 128 pin PLCC auto28 pin PLCC zif

28 pin DIP .600 mil wide28 pin DIP .600 mil wide

130-3772-00130-3772-03


34

Devices Socket InterfacePart

Number

EPM5032BPMicro CP1128,PLD1128

28 pin PLCC auto28 pin PLCC zif


130-3766-00130-3766-05

EPM7032programmer specific consult factory



130-3953-10130-3953-20

EPM7064BPMicro 1200,1400,2100,2200



130-3955-05130-3955-00

EP900,EP910,EP121044 pin PLCC auto44 pin PLCC zif


130-3953-30130-3953-40

EP900,EP910,EP1210BPMicro CP1128,PLD112BP



130-3900-05130-3900-00

EP1810EETools Allmax,LDI CM2000,3000



130-3953-50130-3953-60

EPM7032programmer specific consult factory

44 pin TQFP zif44 pin PQFP zif


130-4308-00130-4308-05

EPM7032LDI Allpro programmer



130-4308-10130-4308-20

EPM7064BPMicro CP1128,PLD112BP



130-4308-30130-4308-40

Altera device adapters

Plcc Programming adapters “continued”

CUSTOMER SERVICECALL US AND YOU WILL TALKWITH A LIVING BREATHINGPERSON


ADAPTER BUILDERINTERACTIVE TOOL ALLOWSYOU TO SEE YOUR DESIGNINSTANTLY

SEARCHSEARCH FOR YOUR ADAPTERON-LINEWWW.ADAPTERS.COM

1,2,3,12,17,27,30,31no connects



130-130-130-130-

1,2,3,,12,17,26,27,30no connects



130-130-130-130-

1,12,17,262764-27512 EPROMs



130-3840-00130-3840-03

1 to 127010-27080 EPROMs



130-3871-0130-3871-03

1,13,23,3327C210-27C4096



130-3940-00130-3940-03

1 to 144 pin PLCC auto44 pin PLCC zif


130-3955-00130-3955-03

35



Number

MACH210,21144 pin PLCC auto44 pin PLCC zif


130-3905-05130-3905-00

MACH210,211LDI AllPro programmer



130-4077-00130-4077-05

MACH120,22068 pin PLCC auto68 pin PLCC zif


130-4140-05130-4140-00

MACH130,230,231,43584 pin PLCC auto84 pin PLCC zif


130-3905-10130-3905-20

MACH130,230,231,435LDI AllPro programme



130-4140-10130-4140-20

MACH130,230,231,435LDI Chipmaster3000 programmer



130-4140-30130-4140-40

MACH435EETools-Allmax,LDI Chipmaster 3000



130-4140-50130-4140-60

MACH110,111 44 pin QFP zif 28 pin DIP .600 mil wide 130-4301-00

AmPALCE16V8(HD)(Z)20 pin SOIC zif20 pin SOIC zif


130-4960-03130-4960-06

AmPALCE22V10(Z)24 pin SOIC zif24 pin SOIC zif


130-4883-03130-4883-06

Am29F200B(T),400B(t),800B(T) 44 pin SOIC open-top 44 pin DIP .600 mil wide 130-5090-06

Am27C(LV)010(B),27LV020(B)Am28F010(A),28F020(A),28F512Am29F010,020,040

32 pin TSOP open-top 32 pin DIP .600 mil wide 130-5994-00

Am27C256 32 pin TSOP open-top 28 pin DIP .600 mil wide 130-5992-10

Am29LV002,004,008 40 pin TSOP open-top 40 pin DIP .600 mil wide 130-6017-06

Am29F200,400,800 48 pin TSOP open-top 32 pin DIP .600 mil wide 130-6050-00

Am29F400ABprogrammer specific consult factory 48 pin TSOP open-top 40 pin DIP .600 mil wide 130-6055-00

Am29F(LV)200,400,800 (T/B)Am28F100 T/Bprogrammer specific consult factory


Am29F200,400,800B(T) 48 pin TSOP open-top 44 pin DIP .600 mil wide 130-6068-01

AMD / Vantisdevice adapters


PRODUCT SELECTIONOVER 1000 ADAPTERSOFF THE SHELF SOLUTIONSCUSTOM DESIGNSTOMORROWS PACKAGESTODAY

PACKAGE SUPPORTQFP, PQFP, TQFPBGA, MICRO BGA, CSPTSOP, SSOP, TSSOPPLCC, DIP, SHRINK DIP

DEVICE SUPPORTAMD VANTISINTELMICROCHIPMOTOROLAHITACHITOSHIBAST MICRO

PROGRAMMERSUPPORT

BP MICROEE TOOLSSYSTEM GENERALMOTOROLADATA I/OPHYTON


36

56 pin SSOP


Number

AT89C10518051 footprint

20 pin DIP production20 piin DIP zif20 pin DIP production20 pin DIP zif


130-2958-00130-2958-05130-3000-00130-3000-05

ATF1500Sytem General programmers



130-3950-00130-3950-05

ATV250044 pin PLCC auto44 pin PLCC zif


130-3951-10130-3951-20

ATV2500BP microsystems programmers



130-3951-30130-3951-40

ATV250068 pin PLCC auto68 pin PLCC zif


130-3951-50130-3941-60

AT87F51,52AT89C52,55,AT90S8515



130-4306-20130-4306-10

ATF1500Sytem General programmers 44 pin QFP zif 40 pin DIP .600 mil wide 130-4306-50

AT24C010(A).02N,04N,08NAT24C132,164,16N,32N,64NAT25C01,02,04AT93C46(A&R),56,57,66

8 pin SOIC zif8 pin SOIC zif


130-4854-00130-4854-01

AT27C080,27LV080,27LV256RAT27LV512R,28C17,28C256AT28C64(B)(/X),HC64B,LV256



130-5008-03130-5008-06

ATAT27LV512R-RC28 pin SOIC zif28 pin SOIC zif


130-5012-03130-5012-06

AT27C(LV)080 32 pin SOIC open-top 8 pin DIP .600 mil wide 130-5040-06

AT27LV010,27LV256R,27LV512RAT28C16-T,AT28C256,28C64/XAT28HC256,28HC64B,28LV256AT28LV64(B),29C(LV)256


AT27040,27BV010(/L),020,040AT27C020,040,080,AT27LV010,020,040,080,AT28C010,28C16-TAT29C010,020,512AT29LV010,020,040A,512


Atmel


PROGRAMMING

37



Number

CAT24WC128,128,256,32,64,65CAT25C256, CAT93C57,66,86,x61x,x62x,x63x



130-4864-00130-4864-05

CAT25C02,024,03,04,05,08,09CAT25C128,16,17,32,64



130-4901-00130-4901-01

CAT28C16A,16V324 pin SOIC zif24 pin SOIC zif


130-4983-03130-4983-06

CAT28C17A,64B,65A65BCAT28LV64,65



130-5008-03130-5008-06

CAT28C84B,65BCAT28LV256,64,65 28 pin TSOP open-top 28 pin DIP .600 mil wide 130-5956-00

CAT28C64B,65BCAT28F010(V),28F015,020,512CAT29F(N)002


CAT28F102 40 pin TSOP open-top 40 pin IP .600 mil wide 130-6004-06

CAT24WC01,02,CAT34WC02CAT93C46,56,66,86CAT93Cx16x,x62x,x63x

8 pin TSSOP open-top 8 pin DIP .600 mil wide 130-5654-05

CAT25C02,024,03,04,05,08,09CAT25C16,17,32,33 48 pin TSSOP open-top 14 pin DIP .600 mil wide 130-5662-05

CAT25C128,256,64 20 pin TSSOP open-top 20 pin DIP .600 mil wide 130-5694-06


Number

HD63701V0HD63705V0

40 pin DIP zif40 pin DIP zif


130-3004-10130-3004-20

HD63701X064 pin S-DIP production64 pin S-DIP zif


130-3030-10130-3030-00

HD63701Y064 pin S-DIP production64 pin S-DIP zif


130-3030-30130-3030-20

HD68701Y 68 pin PLCC zif 28 pin DIP .600 mil wide 130-4080-00

H8/532,H8/53484 pin PLCC auto84 pin PLCC zif


130-4142-10130-4142-00

H8/53684 pin PLCC auto84 pin PLCC zif


130-4146-10130-4146-00

H8/3332,H8/333480 pin PQFP zif80 pin TQFP zif


130-4386-00130-4386-10

H8/337,H8/33880 pin PQFP zif80 pin TQFP zif


130-4386-20130-4386-30

Catalyst

Hitachi

PROGRAMMING

PRODUCT SELECTIONOVER 500 ADAPTERSOFF THE SHELF SOLUTIONSCUSTOM DESIGNSTOMORROWS PACKAGESTODAY

PACKAGE SUPPORTQFP, PQFP, TQFPBGA, MICRO BGA, CSPTSOP, SSOP, TSSOPPLCC, DIP, SHRINK DIP

DEVICE SUPPORTAMD VANTISINTELMICROCHIPMOTOROLAHITACHITOSHIBAST MICRO

PROGRAMMERSUPPORT

BP MICROEE TOOLSSYSTEM GENERALMOTOROLADATA I/OPHYTON


38


Number

80C31,32,35,39,40,44,48,49,51,52,8344AH,83C51FA,FB,8741,-42,44,48,49,51(B)H,52BH87C251,C51,FA,FB,528,652,654



130-3938-06130-3938-06

80C54,58,83C51-FC,87C51-FC87C54,58,88F51-FC



130-3948-12130-3948-11

8044AH,8344AH,8744H44 pin PQFP zif44 pin TQFP zif


130-4306-10130-4306-20

28F001BX,28F010,020 32 pin TSOP open-top 32 pin DIP .600 mil wide 130-5994-00

E28F200,400,800CR/V 48 pin TSOP open-top 40 pin DIP .600 mil wide 130-6060-00

E28F200,400,800 CR/V 48 pin TSOP open-top 40 pin DIP .600 mil wide 130-6060-10


Number

PIC16C55,5728 pin PLCC auto28 pin PLCC zif


130-3772-03130-3772-00

PIC16C64,64A,65,65A,74,74A,-77



130-3942-00130-3942-10

PIC16C54,65,65A,74,74A44 pin TQFP zif44 pin PQFP zif


130-4304-10130-4304-20

PIC17C42,42A,43,4444 pin TQFP zif44 pin PQFP zif


130-4304-00130-4304-05

PIC12C508,509,670,671,F680,F681

8 pin SOIC zif8 pin DIP .300 mil wide8 pin DIP .600 mil wide

130-4858-00130-4858-01

PIC16CC52,54,54A,56,58A,61,620,621,622,71,710,711,83,84,C84A

18 pin SOIC zif18 pin DIP .300 mil wide18 pin DIP .600 mil wideBPmicro, CP1128,EP1140

130-4936-03130-4936-06130-4936-00

PIC16C55,57,62,62A,63,72,73,73A 28 pin SOIC zif 18 pin DIP .300 mil wide

BPmicro,CP1128,EP1140130-5008-10

PIC14000,16C55,57,62,62A,63,-72,73,73A 28 pin SOIC zif


130-5008-03130-5008-06

PIC16C54,54A,554,56,58A,558620,621,622,711,822 20 pin SSOP open-top

18 pin DIP .300 mil wide20 pin DIP, CP1128,EP1140

130-5279-03130-5282-06

PIC16C55,57 28 pin SSOP open-top 28 pin DIP .600 mil wideBPmicro,CP1128,EP1140

130-5331-05130-5331-07

Intel

Microchip

44 pin SOIC flip-top adapter

PROGRAMMING

Gang and non-gang adapters

CUSTOMER SERVICECALL US AND YOU WILL TALKWITH AN INDUSTY EXPERT



39


National


Number

NM27C128,256,512NM27LV512,NMC87C257



130-3840-03130-3840-00

NM27C010,020,NM27LV01232 pin PLCC auto32 pin PLCC zif


130-3871-03130-3871-00

NM27C(LV)210,24044 pin PLCC auto44 pin PLCC zif


130-3940-03130-3940-00

NM24C02,03,04,05,08,09,16,17,NM25C0NM9306,46,56,66,S06,46,5666,06



130-4854-00130-4854-01

COP620C,622,640,642,820C,CJCOP822C,840,842,8620,822CJ,COP8622C,40C,42C,L20C,L22COP8780C,81,82,920,922,940



130-5008-03130-5008-06

NM27C010,28F01032 pin TSOPopen-top

32 pin DIP .600 mil wide 130-5994-00


Number

80C54,58,87C5844 pin PLCC auto44 pin PLCC zif


130-3948-12130-3948-11

80C550,83C550,87C55044 pin PLCC auto44 pin PLCC zif


130-3948-22130-3948-21

51-XA-G3044 pin PLCC auto44 pin PLCC zif


130-3944-10130-3944-20

80C451,453,83C451,45387C451,453



130-4123-12130-4123-11

51-XA-3 68 pin PLCC auto 40 pin DIP .600 mil wide 130-4120-10

87C528 44 pin TQFP zif 40 pin DIP .600 mil wide 130-4306-20

51-XA-G3 44 pin QFP zif 40 pin DIP .600 mil wide 130-4306-30

51-XA-G3 44 pin QFP zif 44 pin DIP .600 mil wide 130-4306-35

N82S129AD16 pin SOIC zif16 pin SOIC zif


130-4913-03130-4913-06

Philips

PROGRAMMING

SOCKET SELECTIONFLIP-TOPOPEN-TOPAUTO EJECT

DEVICE HANDLERSPRODUCTION LINEPROGRAMMINGCUSTOM CONFIGURATIONS


CUSTOM DESIGNSWE ARE THE DESIGNSPECIALISTFAST DELIVERY

WORK THE WEBON-LINE ADAPTER SEARCHDATA SHEETSDRAWINGS


40


Number

M27C16044 pin SOICopen-top 44 pin DIP .600 mil wide 130-5090-06

M27C256B, M27C51228 pin TSOPopen-top 28 pin DIP .600 mil wide 130-5956-00

M27C001,1002,4001,405801,M28F040,101,201M28V201

32 pin TSOPopen-top

32 pin DIP .600 mil wide 130-5994-00

MC27C102440 pin TSOPopen-top

40 pin DIP .600 mil wide 130-6004-06

SGS

Devices Socket Interface Part Number

28LF040, 28SF020,28V040F29EE,LE,VE,010,020,512



130-3871-03130-3871-00

28LF020,28SF020,28VF04029EE010,020,51229LE010,020,51229VE010,020

32 pin TSOPopen-top 32 pin DIP .600 mil wide 130-5994-00

28F040,28LF040,28SF02028VF040

40 pin TSOPopen-top

32 pin DIP .600 mil wide 130-6000-06

SST


Number

TMS27C256,510,512TMS27PC256,510,512



130-3840-03130-3840-00

TMS27C010A,020,040TMS27PC020,040TMS28F010B,020



130-3871-03130-3871-00

TMS27C210A,240TMS27PC210A,240TMS28F210



130-3940-03130-3940-00

29F010,29F259,29F512TMS27C010A,PC010APC512,28F010B,020

32 pin TSOPopen-top

32 pin DIP .600 mil wide 130-5994-00

Texas Instruments

32 pin TSOP open-top adapter

PROGRAMMING

FAST DELIVERY

SELECTION

SERVICE

CUSTOM DESIGNS

WEB TOOLS

41



Number

TC54256AF,54512AF28 pin SOIC zif20 pin SOIC zif


130-5012-03130-5012-06

TC541000P,1001P32 pin SOICopen-top 32 pin DIP .600 mil wide 130-5040-06

TC534200F,544200F40 pin SOICopen-top 40 pin DIP .600 mil wide 130-5065-06

TC58F010FT, TR32 pin TSOPopen-top

32 pin DIP .600 mil wide 130-5994-00

Toshiba


Number

PSD301, 302, 303, 304311, 312, 313 ,314**EEtools Allmax & LDIChipmaster 2000



130-3947-00130-3947-10

PSD301, 302, 303, 304311, 312, 313, 314**BP EP1140 & LDIchipmaster 3000



130-3947-20130-3947-30

PSD301, 302, 303, 304311, 312, 313, 314** LDI AllPro



130-3947-40130-3947-50


Number

X28C010, 256, 264X68257, X88257



130-3840-03130-3840-00

X28C51232 pin PLCC auto32 pin PLCC zif


130-3871-03130-3871-00

X9221, X924120 pin SOIClidded zif socket


130-4960-03130-4960-06

X68C64, X88C6424 pin SOIClidded zif socket


130-5662-06130-5693-06

Devices Footprint InterfacePart

Number

XC1701,1718 / 17128XC17256D(L),X1736D(L)XC17512L, XC1765D(L)

20pin PLCC autoeject socket


130-3550-03130-3563-03

XC1701,1718 / 17128XC17256D(L),X1736D(L)XC17512L, XC1765D(L

20 pin PLCCclamshell zif socket


130-3550-00130-3563-00

XC1716, XC1736DXC17C65D

8 pin SOIC liddedzif socket

8 pin dip .300 mil wide8 pin dip .600 mil wide

130-4854-00130-4854-01

Waferscale Integration

Xicor

Xilinx

Adapters for high volume devicehandlers

Any device....Any package type

PROGRAMMING

ADAPTER BUILDERINTERACTIVE TOOL ALLOWSYOU TO SEE YOUR DESIGNINSTANTLY

SEARCHSEARCH FOR YOUR ADAPTERON-LINEWWW.ADAPTERS.COM


42

PRODUCTION

Chip Changers

Production/TestAdaptersIn today’s fast paced business cycles the timebetween design, development and productioncan be just a few short but hectic months oreven weeks. We understand that with J.I.T.schedules any problem with supply cancreate a huge bottleneck with significant cost toyour company. Most production adapterrequirements are caused by problems out ofour customers control and fall into four basiccategories described in better detail below.Typically because of volume these adaptersare low cost solutions that need to bedelivered quickly to avoid costly productionstoppages and cost overruns.

CHIP-CHANGERSOne of the most dreaded calls a productionmanager can ever receive is the one tellingthem that a particular IC has gone onallocation and is only available in a smaller orlarger footprint. In some cases the packagecould even be obsoleted right in the middle ofyour production run. In other cases the targetPCB is laid out for the mirrored image or“bottom view” so often displayed on devicemechanical drawings. Either way, with ourline of Chip-Changer adapters we take yourproblems and turn them into solutions.

Footprint converters, take your device andconvert it to smaller / larger package in thesame IC package family. ie: A 144 pin QFP.65mm target layout and you have a 144 pinQFP with .5mm lead spacing.

Footprint rotators, take your target PCBs’smirrored image and rotate it back to thecorrect “top view”.

DEVICE TEST ADAPTERSThe need for generic production line testadapters is more and more becoming aquestion we hear about everyday. A devicetest adapter is normally on a test board usedto run a final firmware test on the productionline itself. In most cases the IC needs to beinserted and extracted quickly, and thisrequires sockets with high cycle rates so azero insertion force socket is the norm. Wehave both surface mount and socketable offthe shelf solutions.

Device Test adapter for 112 pin QFP

CHIP-CHANGERS

OBSOLETE PACKAGESCHIP SHORTAGESLOW COSTLOW PROFILE SOLUTIONS

DEVICE TEST ADAPTERS

PRODUCTION LINE TESTINGEASY INSERTION ANDEXTRACTION OF D.U.T.

ANY BGA DEVICE

ANY QFP DEVICE

ANY SOIC DEVICE

ANY TSOP DEVICE

ANY PLCC DEVICE

LeadCount

PackageType

TargetLeadCount

TargetPackage

TypePart number

64 0.5mm QFP 64 0.8mm QFP 140-5430-00

80 0.5mm QFP 80 0.65mm QFP 140-5540-00

100-R 0.65mm QFP 100 0.5mm QFP 140-5690-00

120 0.4mm QFP 120 0.8mm QFP 140-5745-00

144 0.5mm QFP 144 0.65mm QFP 140-5894-00

161.27mm SOIC7.6mm body


140-7042-00



140-7043-00



140-7085-00

240.65mm TSSOP

4.4mm body24 1.27mm SOIC 140-7095-00

Chip Changers footprint converters

43


I.C. Package converters

I.C. Socket converters

I.C. PACKAGECONVERTERS

UTILIZE OLD PC-BOARDVERSIONSDISCONTINUED PACKAGESCONVERT SURFACE MOUNTTO THROUGH HOLE

I.C. SOCKETCONVERTERS

CAN’T WAIT 6 WEEKS FORSOCKET DELIVERY!CALL US!!

Production/TestAdaptersPACKAGE CONVERTERSPackage converters are a variation of theChip-Changers (that convert to a larger orsmaller footprint in the same IC package type)IC package converters on the other handconvert to a different IC package typealtogether. ie: DIP-SOIC, PLCC-DIP, QFP-PGA. The possible combinations are endless,and the reasons can be similar, discontinuedpackages, chip allocations and shortages, butthe fact still remains that you have boards thatare just too costly to scrap and we have timeand cost saving solutions that are just a phonecall away. Typically these adapters are forhigh volume applications but order quantitiesare application specific and can be as low as5 pcs.

SOCKET CONVERTERSUnlike IC’s, sockets for the same device canhave different base footprints ( through holepatterns ). This varies by socket manufac-turer and product design. We make theconverters that allow you to swap manufactur-ers. For example from a Yamaichi IC51series to a IC53 series, in the event that youcan’t get the socket that you specified in aboard layout. Again, these are made tominimize the cost and downtime associatedwith long lead times from the factory.

PRODUCTION

IC Package convertersLeadCount

PackageType

DeviceInterface

Target PackageType

TargetInterface

Part number

14 F 2.54 mm smt 14 dip .300 male 140-2120-00

20 plcc smt 20 dip .300 male

44 plcc smt 0.8mm QFP smt 140-3905-80

44 0.8mm QFPzif

socket48 pin, sdip male 140-5310-00

44 0.8mm QFPzif

socketplcc male 140-5400-00

64 0.8mm QFP 68 pga, 11*11 male

100 0.65mm R QFP smt 100 pga, 13*13 male 140-5695-00

100 0.635mm QFP smt 100 pga, 13*13 male 140-5730-00

PackageType

Socket toconvert

to

Socket toconvert

fromPart number

80, Qfp IC51-808 IC51-809 140-2225-00

64 42-807 yz-692 180-5435-00

132 qfp IC53 IC51 180-5826-00

IC Socket converters

QUICK ORDER GUIDE:DETERMINE

• Acquire IC package mechanicalspecifications

• If it is for device testing, footprintconversion or pin out rotation, ICpackage conversion or IC socketconversion.

• IC pinouts, aquire IC socket drawingsor IC socket mfg. part numbers.

• Note extra requirements, i.e. size andheight restrictions, required quantity, andsurface mount or through hole assembly.

note: The price of these adaptersdepends on the quantity ordered


44

A

B/C

A

B

C

A

BC

PRODUCTION

PLCC Test Adapters and Socketablebases

PLCC BasesAt Adapters.com we are the one stop solutionfor all our customers’ adapter requirements.Our PLCC plugs / bases are cost effectiveways, to increase height from daughterboards, or as a male interface for emulatordevice probes or emulation adapters. ThesePLCC plugs made using injection moldedhousings, and then assembled with goldplated contacts for reliable connections.

SOCKETABLE INTERFACEProvides a 5.5mm deep male plug on bothends, to plug into a socket, or soldereddirectly on one side. Heights range from15.2mm - 29.2mm

SURFACE MOUNT INTERFACESame male plug on one end, with a “L”shaped lead on the other for true SMT.interface. Low profile 9.3mm or standardheight at 15.7mm. See the table below for tip-tip dimensions.

THROUGH HOLE INTERFACEsocketable male plug on one end with astraight through hole pattern on the other.Great for adapting daughter boards.

LeadCount

A B / C Part numberLeadCount

A tip-tipPart

NumberLeadCount

AB

/ CPart

Number

2015.2mm21.6mm

5.5mm000-4314-10000-4314-50

209.3mm15.7mm

15.0mm000-4312-10000-4312-50

2010.8mm16.5mm

3.8mm3.5mm

000-4313-10000-4313-50

2815.2mm21.6mm

5.5mm000-4324-10000-4324-50

289.3mm15.7mm

17.4mm000-4322-10000-4322-50

2810.8mm16.5mm

3.8mm3.5mm

000-4323-10000-4323-50

3215.2mm21.6mm

5.5mm000-4334-10000-4334-50

329.3mm15.7mm

20.0mm000-4332-10000-4332-50

3210.8mm16.5mm

3.8mm3.5mm

000-4333-10000-4333-50

4415.2mm21.6mm

5.5mm000-4344-10000-4344-50

449.3mm15.7mm

22.5mm000-4342-10000-4242-50

4410.8mm16.5mm

3.8mm3.5mm

000-4343-10000-4343-50

5215.2mm21.6mm

5.5mm000-4354-10000-4354-50

529.3mm15.7mm

25.1mm000-4352-10000-4352-50

5210.8mm16.5mm

3.8mm3.5mm

000-4353-10000-4353-50

6815.2mm21.6mm

5.5mm000-4364-10000-4364-50

689.3mm15.7mm

30.1mm000-4362-10000-4362-50

6810.8mm16.5mm

3.8mm3.5mm

000-4363-10000-4363-50

8415.2mm21.6mm

5.5mm000-4374-10000-4374-50

849.3mm15.7mm

000-4372-10000-4372-50

8410.8mm16.5mm

3.8mm3.5mm

000-4373-10000-4373-50

Socketable Type Surface Mount Type Thru Hole Type

PLCC Bases Ordering Guide

QUICK ORDER GUIDE:DETERMINE

• PLCC pin count

• Application is surface mount, throughhole or socketable.

• Application is for OEM production,daughter card interface, increasedboard height.

• Note extra requirements, i.e. size andheight restrictions

TECH SUPPORTWE HAVE THE KNOWLEDGEWE HAVE THE SOLUTIONS

WORK THE WEBSEARCH ON-LINE

45


PRODUCTION

IC SocketProbesIn today’s high volume burn-in houses ICsocket failure is major cause of productiondown time. Adapters.com has a solutionthough. Our line of high speed socket probesare designed with your ever changing worldin mind. Machined and constructed with thebest raw materials, hardware and connectorsthese probes withstand whatever your testand development requirement might be.

SUPERIOR BY DESIGNNo line of socket probe’s handle moreinsertions, extractions, without failing. We usethe best raw materials, and high performancespring loaded, or machined contacts, and allat an advanced manufacturing facility. Thenthe probes are tested 100% to ensure yoursatisfaction.

TEST ACCESSORIESWe say look to Adapters.com for all your testand development needs, and we mean all!We have the best sales staff in the industry infinding you solutions, whatever yourdevelopment needs might be.

I.C. Socket Probes

IC SOCKET PROBES

ITT CANNON CONNECTORSFOR EACH SIGNAL

TRIPLE S COMPATIBLEINTERCONNECTION

Accessory DescriptionPart

Number

ESD wrist strap 2pc. kit 150-5475-00

IC Vacum Penincludes

3 cup sizes150-5450-00

DIP Extraction Tool metal 150-5260-00

PGA Extraction Tools, IC size10x10-25x25

2 claws,4mm clearance4 claws,2mm clearance4 claws,4mm clearance

150-5270-40150-5270-10150-5270-30

PGA Insertion Tool, IC size17x17-25x25

2 claws,4mm clearance 150-5350-00

PLCC Extraction ToolMolded plastic handle,

metal grabber150-5285-00

Test accessory part numbers

Full line of test accessories

ICSocket P/N / Manufacture

ICPackage

PartNumber

OTQ-44-0.8-03, Enplass 44 Qfp 0.8mm 140-8250-00

OTQ-64-0.5 64QFP 0.5mm 140-8275-00

7014-080-1-08, Wells/CTI 80 Qfp0 .65mm 140-8300-00

OTQ-100-0.5 100 Qfp 0.5mm 140-8350-00

OTQ-128-0.5 128 Qfp 0.5mm 140-8415-00

IC200-009-KS13072 208 QFP 0.5mm 140-9300-00

656-1082211, Wells/CTI 8 Soic 0.65mm 140-7500-00

OTS-(16)34-0.65-01 16 Soic 0.65mm 140-7515-10

OTS-(20)34-0.65-01 20 Soic 0.65mm 140-7520-10

OTS-(24)34-0.65-01 24 Soic 0.65mm 140-7525-00

OTS-(28)34-0.65-01, Enplass 28 Soic 0.65mm 140-7530-00

IC Socket Probes

QUICK ORDER GUIDE: DETERMINE• Acquire IC socket mechanical specifications• May be nescessary to acquire an IC sample for testing• Determine length of the probe connector cable• Note extra requirements, i.e. size and height restrictions


46

Open-top, Flip-top, Auto-eject, thru-hole, surface-mount andcustom I.C. sockets

IC SocketsSocketing expensive IC’s or holding thefirmware during the debugging phase of anew design is not only advisable, for mostapplications mandatory. The Adapters.comsales staff has over 50 years combinedexperience working with IC packaging andthere applications. In some cases we knowthe product better than the manufacturesthemselves.

PRODUCTIONThese sockets are usually installed on thetarget PCB and allow the user to remove thepackage only when necessary. They alsocan provide an interface between the targetboard and a test instrument. Insertion cyclesare typically 15-25 times.

ZERO INSERTION FORCE (ZIF)OR BURN-INThese sockets are designed so the packagescan be easily inserted and extracted,withstanding as many as 10,000 cycles.Variations include flip-top or “lidded” andopen-top. Flip-top sockets perform like a clamshell with a lid that closes on the package.Open-top or auto-eject sockets allow you todrop the IC into it. Most open-top and auto-eject sockets are spring-loaded to hold the IC.

SURFACE MOUNTThere are both surface mount sockets forproduction as well as burn in applications.Most SMT sockets have a mechanical orscrew type locking mechanism. If yourapplication requires constant insertion andextraction these socket would not beadvisable.

THROUGH HOLEThis style remains the most widely used typeof socket. Whether your looking for one ortwo, or a thousand we have the knowledge tolocate what will work best for your application.

POGO PIN OR SOLDERLESSWith today’s ever down sizing of high densitypackaging the solder less form or Pogo pinstyle socket is becoming a popular choice.Due to mounting requirements this must beselected very early in the development cyclebut can save time and expensive out sourcedassembly charges.

IC SOCKETS

Fine pitch BGA and SOIC Devices

Through hole and surface mount designs

Test and Burn in or Production styles

SOCKET SELECTIONFLIP-TOP (CLAMSHELL)OPEN-TOPAUTO EJECTSURFACE MOUNTTHROUGH HOLE


CUSTOM SOCKETSWE ARE THE DESIGNSPECIALIST

IC SOCKET PROBESANY SOCKET FORANY DEVICE

47


IC SOCKETS

Ball Grid ArraySocketing BGA devices has fast become oneof the more talked about areas for engineersand developers alike. Many hours can bespent looking for the correct socket at thesacrifice of valuable development time. AtAdapters.com we have the staff with experi-ence to get you the right one. Just send usyour IC package requirements and we canadvise you on the variety of sockets availableto you and find which is best for yourapplication.

SURFACE MOUNT

SCREW LOCK SOCKETSScrew Lock BGA sockets offer a cost effectivemethod for mounting 1.27mm, 1.0mm and0.8mm BGA devices. These sockets offer twotypes of SMD contacts . The standard contactis 1.2mm in height used in all standard off theshelf solutions, and a raised 5.0mm heightcontact is also available as a special orderitem . The SMD screw lock sockets solder tothe board same as the device withoutadditional mounting requirements and onlyoccupy 6.0mm beyond the outer ball row.

SCREW LOCK SOLDER TAIL SOCKETSAll the grids and patterns available to you inSMD style are also available in a solder tailscrew lock configuration. These sockets pluginto your target board like a true test & burn-insocket allowing you to test multiple boardswithout purchasing several sockets.

KNOB LOCK & ZIF LEVER LOCKSOCKETSIf your application requires the constantinsertion and extraction of your device thenthe Screw lock sockets may not be the best foryour application. The “Knob” or “Zif lever”lock type will serve your needs better. Withthese sockets the device is inserted and thenheld in place with either a single Knob lock ordual lever locking mechanism. They come inthe same IC package configurations, in boththe SMT or through hole target interface, andsupport the 1.27, 1.0, and 0.8mm ICfootprints.

NP280 series lidded zif BGA sockets

SOLDERLESS

COMPRESSION “SOLDERLESS”SCREW LOCK SOCKETSThe solderless or compression version ofsockets are easily mounted to the PCB using4 designed in mounting holes and properalignment is typically aided by optional guidepins. Coplanarity is either insured by theincluded assembly board the actual compres-sion when assembled, and reliable contact isachieved with the use of high performancegold plated, spring loaded contacts.

COMPRESSION “SOLDERLESS”KNOB LOCK SOCKETSThese sockets are the same as thosedescribed above but have a Knob LockSystem that allows for faster insertion andextraction of the BGA device.

Note: Due to the nature of the mechanicalrequirements involved in mounting oursolderless sockets, these must be designedinto your test environment.

THROUGH HOLE

1.0, 0.8MM, NP280 SERIESThe NP280 series sockets are a true test andburn in workhorse. Designed utilizing liddedinsertion method for ease of use andincreased life. Reliable two finger contactsmade of beryllium copper insure perfor-mance in any design environment. Throughhole mounted interface on injection moldedbodies and stainless steel hardware willproduce cycle counts well into the thousands.

0.75MM, NP291 SERIES SOCKETSThe NP291 series sockets offer similarfeatures in quality as the NP280 series in anopen top design. Finger touch accutuationaround the perimeter and molded body toinsure accurate device orientation. Throughhole interface with locator post and sliding pinsaver built in. Open top helps keep devicetemperature down during testing.

0.8MM, NP351 SERIESNP351 sockets are open top designs with thesame functions and range of features as theNP291 series just for 0.8mm devices.

1.27MM, NP276 SERIESNP276 sockets are open top designs for1.27mm IC’s. Open top designs helpsdissipate heat during testing and there areless problems finding a mate due to nothaving to worry about package thicknesswhen closing a lidded type socket.

FULL PRODUCT LINE SUPPORTAdapters.com for years has been associatedwith the top manufactures of high quality, highperformance test sockets. Our sales staff arefamiliar with sockets from Yamaichi, Wells/CTI,3M Textool, S.E.R., Plastronics, TET, TexasInstruments and many others.

Screw Lock BGA sockets

NP276seriesopentop BGAsockets

QUICK ORDER GUIDE: DETERMINE• Acquire IC package mechanical specifications from the manufacture• Application requires surface mount, through hole, open-top, or clamshell type socket• If applicable solderless mounting requiremnts need to be designed in.• Note extra requirements, i.e. size and height restrictions, electrical performance characteristics


48

IC SOCKETS

Dip SocketsNowhere in the industry will you find a moreknowledgable staff in understanding ICpackaging, and at the same time having apractical knowledge of IC socket applications.Try asking a big distributor for that kind ofsupport.

PRODUCTIONIn production applications using DIP socketswe see surface mount , through hole andboard to board design requirements from 1pc.- 10,000pcs. Most DIP sockets are designedwith machine screw pins and receptacles(0.018”) or wire wrap post (0.025”). Typicalinsulators are made from molded plastics ormilled FR-4 material. Board to boardapplications can be used to interface with testinstruments or daughter boards.

ZIF / TEST & BURN-INDIP test sockets are through hole in design,for ease of use and flexibility in assembling.Typically made from injection molded hightemperature plastics, gold plated berylliumcopper contacts, and stainless steel hardwareensure high performance, high insertion /extraction ratings.

PLCC SocketsPRODUCTIONThese sockets are typically made frominjection molded plastics with a wide variety ofmachine screw and stamped pin technology.PLCC sockets for production can be bothSMT or through hole, and low profile designscan be easily accommodated. In most pincounts we have a low amount of inventory foremergencies.

ZIF / TEST & BURN-INTest and burn in sockets for PLCC devicesare evenly divided between lidded clamshellor “flip-top” and auto-eject types. Theclamshell is an industry standard for ease ofuse, mechanical and electrical performance.The IC120 series auto-eject socket gives youeasy access in an open top design with verylow insertion force ratings and high cyclecounts. In most cases we have inventory ofthese sockets in low quantities.

SOCKET OPTIONS

PRODUCTION

ZIF-LEVER ACTUATED

SURFACE MOUNT

THROUGH HOLE

SHRINK DIP IC PACKAGES

SOCKET OPTIONS

TEST SOCKETS

SMT & THROUGH HOLE

OPEN-TOP, AUTO-EJECT

QUICK ORDER GUIDE: DETERMINE• Acquire IC package mechanical specifications or see IC packaging pages 2-12• If production application, through hole, SMT, board - board, and packaging ie. tubes, bulk.• If Test and Burn-in, lever actuated or auto eject .• Note extra requirements, i.e. size and height restrictions

QUICK ORDER GUIDE: DETERMINE• Acquire IC package mechanical specifications or see IC packaging pages 2-12• If production application, through hole, SMT, board - board, and packaging ie. tubes, bulk..• Determine the IC socket information from IC socket section on page 46-59.• Note extra requirements, i.e. size and height restrictions

DIP lever actuated ZIF sockets

IC51 series “clamshell” PLCC sockets IC120 series Auto-eject PLCC sockets

49


IC SOCKETS

PGA SocketsAs PGA devices come in a multitude of pincounts and a wide array of grids, andpatterns, so does the selection of socketsoffered at Adapters.com. Our wide selectioncomes from years of experience and longrelationships with all the worlds top socketmanufactures. Bringing all this informationtogether in one company.

PRODUCTIONA PGA production socket still has many use intodays designers world. We still use them asinterfaces to emulators, board to boardinterconnects and in the design of modularadapters. Typically the sockets are con-structed of plastic or FR-4 insulators, but hightemperature materials are also available. Therange of terminals for the PGA IC is also quitelarge.

ZIF / TEST & BURN-INThere is an available ZIF socket for everygird pattern possible for PGA devices anddue to the construction of most sockets, slightdifferences can be accommodated by justpopulating or depopulating existing designs.Constructed from the same high qualitymaterials, utilizing injection molded bodiesthese sockets stand up to the toughestenvironments. Terminal selection is broad andcontact plating ensure connectivity in any pincount.

IPGA SocketsInterstitial PGA: A PGA device who’s pins areon a staggered footprint on 1.27 mm spacingotherwise they are the same as a typical PGAdevice. Many of todays FPGA are offered inthis type of package so we hear aboutrequest for this form factor often. You can beconfident that our sales staff will know youapplication.

PRODUCTIONThese sockets are made of the same qualitymaterials as the PGA production sockets theyare just on a staggered footprint

ZIF / TEST & BURN-INThe classic lever actuated PGA ZIF socket isalso offered in the interstitial PGA footprint.

QUICK ORDER GUIDE: DETERMINE• Acquire IC package mechanical specifications or see IC packaging pages 2-12• If production application, through hole, SMT, board - board, and packaging ie. tubes, bulk.• if test and burn-in, lever actuated of clamshell.• Note extra requirements, i.e. size and height restrictions

QUICK ORDER GUIDE: DETERMINE• Acquire IC package mechanical specifications or see IC packaging pages 2-12• If production application, through hole, SMT, board - board, and packaging ie. tubes, bulk..• if test and burn-in, lever actuated or clamshell.• Note extra requirements, i.e. size and height restrictions

SOCKET OPTIONS

PRODUCTION

ZIF-LEVER

MALE - MALE

SURFACE MOUNT

SOCKET OPTIONS

PRODUCTION

ZIF-LEVER

SMT / THROUGH HOLE

INSERTION AND EXTRACTIONTOOLS IN OUR ACCESORIESSECTION

PGA ZIF sockets

Interstitial PGA sockets


50

IC SOCKETS

QFP SocketsThere are so many options in selectingsockets for QFP IC’s you need a tour guide topick your way through the mess. Let thesales pro’s at Adapters.com guide youthrough it right the first time.

PRODUCTIONThe IC149 series socket is the most popularQFP production socket on the market today.This socket is made from injection moldedmaterials, and utilizes both solder plate andgold plated contacts and can be provided withor without locating post. The IC149 series hasa larger SMT footprint than most of the ICpackages it supports , so this part must bedesigned in at an early stage.

Please also see the PolyPod section on page24 for our line of QFP surface mount socketsfor test applications.

ZIF / TEST & BURN-INThe IC51 series and our Open-top seriesQFP sockets have long been an industryworkhorse. The proven design of these partsallows our end user’s to confidently adapt toany QFP package with insertion / extractioncycle rating upwards of 10,000. Thesesockets are typically through hole but in somecustomer cases a surface mount socket canbe made for testing.

QFN / MLFSocketsQFN / MLF packages are firmly implanted inthe telecommunication industry and since weintroduced our line of QFN prototypeadapters (see page 72) it was a given that wecould support our customers with IC testsocket solutions.

ZIF TEST & BURN-INCurrently only test sockets are available forQFN IC packages. These sockets arethrough hole, clamshell ZIF sockets built toexacting quality standards. Most come pre-loaded with a dummy IC to insure safetransport from the factory.

SOCKET OPTIONS

CLAMSHELL & OPEN-TOPDESIGNS

CYCLE COUNTS UP TO 10K

OPEN-TOP

SOCKET OPTIONS

CLAMSHELL DESIGN

SHIPS WITH DUMMY IC FORPROTECTION

1000’S OF CYCLES

QUICK ORDER GUIDE: DETERMINE• Acquire IC package mechanical specifications• Application, production or test environment and if surface mount or through hole design.• Open-top or Clamshell design .• Note extra requirements, i.e. size and height restrictions

QUICK ORDER GUIDE: DETERMINE• Acquire IC package mechanical specifications• Application information, ie: prototyping, test and burn-in, production.• Note extra requirements, i.e. size and height restrictions

QFP Surface Mount Sockets

QFN / MLF Clamshell Sockets

QFP Clamshell Sockets

SOCKET OPTIONS

SURFACE MOUNT

PRODUCTION & TESTAPPLICATIONS

SCREW LOCK DESIGN

51


IC SOCKETS

SOIC SocketsAs a result of the proliferation of the SOICpackage type. Whether your a top engineer,student, or home hobbyist you will soonerthan later utilize some form factor of this ICpackage type. Adapters.com sells andsupports a full line of time and cost savingsolutions.

PRODUCTIONSOIC production sockets are typically 2 pc.surface mount designs that are low profile andlow cost solutions for high run usage. Thesesockets are meant to be picked and placed byautomation machines but we occasionally usethem in small run prototypes. Due to thenature of the manufacturing process minimumorder quantities exist for almost every type wecarry.

ZIF / TEST & BURN-INWhether you call it SOIC, SOP, SSOP, orTSSOP, QSOP, MSOP they are all a variationof the original SOIC design. AndAdapters.com has a test socket for any pincount or package type. We carry both open-top and clamshell variety from a who’s who ofthe socket manufactures.

TSOP SocketsOur customers typically request TSOPsockets only for test applications due to the factmost TSOP devices are soldered directly to aproduction board in manufacturing. The opentop style being the most popular for itsreliability and ease of use is our most popularseller.

PRODUCTIONWe carry the Meritec line of SMT. TSOPproduction sockets, and some 2 pc. styles thatare for high run usage and are subject tominimum order quantities.

ZIF TEST & BURN-INMost TSOP test sockets are open top designswhich feature auto eject style device lockingmechanisms and reliable performance in acost effective solution.

SOCKET OPTIONS

PRODUCTION AND TESTAPPLICATIONS

OPEN-TOP AUTO EJECT ANDCLAMSHELL DESIGNS

SURFACE MOUNT ANDTHROUGH HOLE

QUICK ORDER GUIDE: DETERMINE• Acquire IC package mechanical specifications• Production or Test application.• Socket type desired: surface mount or through hole , open-top auto eject or clamshell .• Note extra requirements, i.e. size and height restrictions

QUICK ORDER GUIDE: DETERMINE• Acquire IC package mechanical specifications• Application information, production or test environment, surface mount or through hole.• Determine the IC socket information from IC socket section on page 46-59.• Note extra requirements, i.e. size and height restrictions

SOIC Open Top Socket

SOIC Clamshell Socket

SSOP Clamshell Socket

TSOP type-1 Open Top Socket

SOCKET OPTIONS

PRODUCTION

OPEN TOP DESIGNS

SURFACE MOUNT

THROUGH HOLE


52

TEST CLIPS

The Delta-Clip, High density Clip-on adapters

QFP, SOIC, &TSOP TestClipsAdapters.com has NEW test clips

Our high density IC package TestClips are forQFP, SOIC, to TSOP packages. The Deltaclip is designed to wedge onto your IC withlittle or no IC keepout area, and then it doessomething no other IC testclip on the marketdoes -- it stays on.

True hands free testing. Reliable, consistentaccess to all your fine pitch high densitysurface mount IC’s.

IMPORTANT INFORMATION!What makes these test clips so unique?The problem of attaching to fine pitcheddevices has been an issue in the industry fora long time. The reason is that IC packagesstrictly adhere to footprint standards, but thereis enough deviation in the body molding fromone plant to the next that grabbing onto andmaintaining connections is tricky. Thus moreinformation about the chip is required toguarantee a perfect fit.

QFP-DELTA CLIPThe QFP-DeltaGrip Clip is an off-the-shelf clipfor popular QFP packages. It is tested to workwith popular pin counts. You will need toprovide all critical dimensions for your IC,including the thickness.

QUICK ORDER GUIDE; DETERMINE:• Package type and ALL critical dimensions including: pitch, package width

and pin count (see page 4)• Send a package sample if available

Detail of the unique wedgecontacts

The Delta-Clip Clip on adapter for QFP,SSOP and TSOP devices

Target board with Delta-Clipattached

Virtually no IC keep out area!

53


TEST CLIPS

Qfp ICpackage

TestInterface

PartNumber

80 pin .5mm .1 WW test points 150-6926-10



100 pin .65mm R .1 WW test points 150-7033-00




132 pin "Jedec"Motorola

.1 WW test points 150-7135-00

132 pin "Jedec"Intel





208 pin .5mmPqfp


208 pin .5mmMqfp



FlexExtenders

InterfacePart

Number

169 Pga 13*1380-100 pin qfp

Female-Female 110-7960-00

256 Pga 16*16144-240 pin qfp

Female-Female 110-7975-00

208 pin .5mmwith Flex


240 pin .5mmwith Flex


QFP IC Testclips

SSOP & TSOP Testclips

Flex Extenders, Clip Combos

Cross-Flex adapters

Testclip with PGA-PGA flex cable

Qfp ICpackage

TestInterface

PartNumber

32 TSOP .5mm .050 Sq. test points 150-7968-00



56 SSOP .8mm .050 Sq. test points 150-8130-00

Transition Pcb32-48 tsop

.050 Sq. test points 210-7168-50

Transition Pcb56 ssop

.050 Sq. test points 210-7310-55

Qfp ICpackage

TestInterface

PartNumber

80 pin 11*11 cross flex 150-7655-00

100 pin 11*11 cross flex 150-7658-00

128 pin 13*13 cross flex 150-7660-00

132 pin 13*13 cross flex 150-7662-00

144 pin 13*13 cross flex 150-7665-00

160 pin 15*15 cross flex 150-7668-00

184 pin 15*15 cross flex 150-7671-00

208 pin 16*16 cross flex 150-7676-00

240 pin 16*16 cross flex 150-7680-00


54

TEST ACCESSORIES

New low cost Microclips

0.5-0.3mm Slim Body Microclips

0.8-0.5mm Slim Body Microclips

2.45-0.5mm Microclips

MicroClipsUse Adapters.com’ MicroClips to accessindividual leads while testing fine pitch high-density IC packages with an oscilloscope orlogic analyzer. The thin body design of theMicroClip allows side by side pin access onfine pitch devices.

The MircoClips are constructed of precisionmolded ABS, stainless steel, and nickel platedsteel wire. Easy to use color coding allows forquick and easy testing.

UNIQUE FEATURES• Side-by-side testing• Molded ABS construction• Nickel-plated steel wire• Stainless steel guides• 500 WVDC rating• 100 MHz frequency (max.)

ACCESSORIES (MICROCLIPS)Test Leads, Probes and Replacement Tips• 30mm, Female to Female colored• 300mm, Female to Female black• 300mm, Female to Alligator clip

Blue

Blue

150-5055-04

150-5057-04

10mm tip,blue,w/lead


BlackBrownRedOrangeYellowGreenBlueVioletGrayWhite10 pack

150-5052-00150-5052-01150-5052-02150-5052-03150-5052-04150-5052-05150-5052-06150-5052-07150-5052-08150-5052-09150-5052-10

30mm tip"""""""""30mm tip,10pk

YellowBlueBlackBlack

150-5080-04150-5080-06150-5083-00150-5085-00

Testlead, F-F.30mmTestlead. F-F,30mmTestlead,F-M,300mmTestlead,F-Ali-clip,300mm

n/a150-5550-00150-5551-00150-5555-00

Probe,QFP,.3mm-100MhzReplacement tipProbe,QFP,.3mm-100Mhz

6 colorsredblackblue,yellowgreenwhite

150-5071-06150-5071-12150-5071-18150-5071-24

6pk,clips/testleads12pk,clips/testleads18pk,clips/testleads24pk,clips/testleads

0.8-0.2mmNew low cost Microclips

0.5-0.3mm (slim body) part numbersand descriptions

0.5-0.3mm (slim body) part numbersand descriptions

2.54-0.5mm part numbers anddescriptions

Microclip accessories

Right

Left

150-5068-04

150-5068-06

8mm,tip,yellow,w/lead

8mm tip,blue,w/lead

Right

Left

150-5060-04

150-5060-06

0.8mm tip,yellow,w/lead

0.8mm tip,blue,w/lead

Right

Left

150-5061-04

150-5061-06

13mm tip,yellow,w/lead


55


TEST ACCESSORIES

Test ProbesAdapters.com understands that yourinstrumentation is only as accurate as thesignals it receives from the test accessories.Our line of oscilloscope probes offers equalperformance to the instrument manufacturers.

MANUFACTURER’S SUPPORTTektronix, Hewlett Packard, B&K, Hitachi,Phillips, Hameg, Test Probes Inc., Gould,Beckman, LeCroy, Kikusui, and Pomona.

Scope probes and accessories

HIGH PERFORMANCE SERIESThis family of oscilloscope probes offerexcellent performance at an economical price.The product line includes x1,x10, x100 and2&3 position switchable attenuation. Eachprobe kit is provided with an instruction cardand a full complement of accessories.

ADVANCED TECHNOLOGY SERIESAdvanced SMD technology gives thesprobes bandwidths from 30MHz to 450MHz(-3db). These probes have low inputcapacitance and fast rise times. Each probekit is provied with an instruction card and a fullcomplement of accessories.

DMM PROBESWhen yo need special probes for your DMMyou can either find them in the tables to theright, or call us.

SMD probes and kits

DMM probes and accessories

Advanced technology series probes

High performance series probes

Probe accessories

Type DescriptionPart

Number

Basic probe kit2-probes,2-mini clip, 2-rightangle sheath plugs

150-5590-10

Deluxe probe kit2-probes,2-mini & microclips,2-4mm jack testleads 2-right angle sheath plugs

150-5590-20

Accessory kit #12-probes,1-4mm tip, 2-sprunghooks & spade lugs, 2-aligatorclips,2-straight sheath plugs

150-5591-10

Accessory kit #22-probes,1-4mm tip, 2-sprunghooks & spade lugs, 2-aligatorclips,2-R.A. sheath plugs

150-5591-20

SMD kit2-stainless tip probes, extendedlength, 2-R.A. sheath plugs

150-5591-00


Number

Mini ProbesSpring tip, 1ea.-black/redalso available in yellow,green,blue andwhite

150-5580-10

SMD probebasic kit

500 mhz smd scope probe, withinsulated BNC connector

150-5581-10

SMD probedeluxe kit

500mhz smd scope probe,2-dmmlead wire,smd tweezers,6-microclips4mm jack testleads,2- miniflex clips4mm jack testleads

150-5582-20

(Mhz) Attn R(Mu) C(pF)Bandwidth

(mhz)Risetime

(ns)Input Comp.

Length(m)

PartNumber

150,switchable x10/x10 1/10 45/12 25/150 14/2.3 600 10.30 1.2 150-5570-40

150,readoutt Act. x10 10 12 150 2.3 600 10.30 1.2 150-5570-30

150,switchable x10/x10 1/10 65/14 17/135 21/2.6 600 10.30 2.0 150-5570-80

250,switchable x10/x10 1/10 45/12 25/250 14/1.4 600 10.30 1.2 150-5572-40

250,readout Act. x10 10 14 190 1.8 600 10.30 2.0 150-5572-70

450,readout Act. x10 10 8 450 0.78 600 8.13 1.2 150-5574-20

450,readout Act. x10 10 9.5 450 0.78 600 12.20 1.2 150-5574-40

SwitchableFixed

Attn R(Mu) C(pF)Bandwidth

(mhz)Risetime

(ns)Input Comp.

Length(m)

PartNumber

S, 3 position x1/x10 1/10 90/16 6/100 58/3.5 600 10.35 1.2 150-5561-10

S, 3 position x1/x10 1/10 90/14 10/200 35/1.8 600 10.35 1.2 150-5561-20

S, 3 position x1/x10 1/10 90/14 10/250 35/1.4 600 10.35 1.2 150-5561-30

F x10 10 15 200 1.8 600 10.35 1.2 150-5562-30

F,readout Act. x10 10 15 200 1.8 600 10.35 1.2 150-5562-40

S, 2 position x1/x10 1/10 46/16 15/100 27/3.5 600 10.35 1.2 150-5564-20

DescriptionPart

Number

BNC adapter 150-5560-00

Sprung hook,blackSprung hook,redSprung hook,grey

150-5560-01B150-5560-01R150-5560-01G

Ground lead 150-5560-02

Tip replacement 150-5560-03

Tip insulator 150-5560-04

IC tip 150-5560-05

Probe tip ground 150-5560-06

Trimmer tool 150-5560-07

Accessory kit 150-5560-10


56

PROTOTYPING

Prototyping adapters convert any package type to 0.1” pitch

PrototypingAdaptersA prototyping environment is designed to fit0.1” spacing, which worked well with DIP(dual-in-line) packages, but the proliferation ofnew, higher density package types created aneed for adapters.

Prototyping adapters are designed to accepta particular package type, either in a socketor directly mounted on the adapter, andconvert the package footprint to a 0.1”environment.

SURFACE MOUNT PADSThese adapters allow the user to mount theIC directly to the adapter. The user thenutilizes a pin map table to connect the ICsignals to the test interface. This style ofadapter offers the user the same convenientmethod of prototyping as our socketableadapters but at a much lower price point.High density ZIF sockets can be expensive.

SOCKETABLE ADAPTERSOur most popular form of prototype adaptersare ones that come with some form of ICsocket, which allows the user more flexibility intheir design environment. These adapterscan be provided with top of the line test andburn in sockets, auto-eject style, or low costproduction sockets.

VARIATIONSAnother configuration of prototype adaptersallows the user to convert their IC for testingon a UTI test instrument. These adaptersconvert the IC package to a 25 by 25standard PGA pattern. We can also help ifyou have already purchased the IC socketfrom another source thinking you were goingto be able to plug it into your breadboard.Chances are that we already have a boarddesigned for that particular socket pattern andsalvation is just a phone call away.

Adapter Variations• Surface-mount pads (no socket)• Socket provided by the user• Clamshell type of socket (ZIF or burn-in)• Auto-eject (ZIF) socket• Production socket

Machine screw pin Wire-wrap pin

0.3”

0.3”

0.1”

0.1”

0.1”

0.1” 0.1”

0.1”

0.1”

Type 1

Type 2

Type 3

Type 4

0.3”

Prototype board Interface Variations

Pin Types

Panel Types

MACHINE SCREW PINS0.018-0.020 DIAMETEROFF THE SHELF SUPPORTLOW PROFILE DESIGN

WIRE WRAP PINS0.025 SQUAREWE HAVE THE SOLUTIONS

PANEL TYPESSUPPORT FOR ALLBREADBOARD TYPES

57


PROTOTYPING

Prototyping boards for surface mount ICs

BGA PrototypingAdaptersBGA, Micro BGA, Mini BGA, TinyBGA, 1mm,1.27mm whatever the name, whatever thesize the Ball Grid Array has became the mostwidely used IC form factor for todaysdevelopment environment. With this in mindAdapters.com has put considerable effort intodeveloping broad line support for all forms ofBGA packages. Our technical sales staffexceeds in researching and problem solvingfor our customers to keep your developmenton time and on budget.

IC PACKAGINGBGA IC packages have some of the mostdetailed, tolerance sensitive mechanicalvariations of any IC form factor. With this inmind , and to recommend the best adapter foryour requirement it is imperative we see themechanical drawing of the IC package youare working with.

SURFACE MOUNT ADAPTERSAdapters that you mount the chip directly tooffer a low profile, low cost alternative toadapters with expensive IC sockets. Ifsoldering the device is preferable theseadapters perform just as well as all oursocketable ones. Although not our mostpopular style of adapter, in some cases theywork better than our socketable versionsdepending on your requirements.

ADAPTER SELECTIONIn most cases we advise that you forward usyour IC package information first, this allowsus to determine which adapter will provideyou with the best fit for your needs. In somerare cases we may even ask for packagesamples.

SURFACE MOUNT TYPE

OFF THE SHELF SUPPORTLOW PROFILE DESIGNIC MOUNTING SERVICE

TECH SUPPORT

WE HAVE THE KNOWLEDGEWE HAVE THE SOLUTIONS

WORK THE WEB

SEARCH ON-LINE

1.27mm SMT BGA Adapters

1.00mm SMT BGA Adapters

QUICK ORDER GUIDE: DETERMINE• Acquire the IC package mechanical specifications• Choose the pin configuration and panel type on page 56.• The desired socket type by looking at the IC socket section pages 46-51.• Note any extra requirements, ie: height and size restrictions

BallCount

ArrayBody(mm)

PanelType

Part number

119 7 x 17 14 x 22 T3 160-6154-00

128 12 x 12 call T3 160-6156-00

153 9 x 17 14 x 22 T3 160-6165-00

169 13 x 13 19 T3 160-6169-00

174 18 x 18 23 T3 160-6171-00

204 20 x 20 27 T4 160-6177-00

208 20 x 20 27 T4 160-6178-00

216 25 x 25 35 T4 160-6180-00

240 19 x 19 25 T3 160-6185-00

272 20 x 20 27 T3 160-6201-00

256 16 x 16 21 T3 160-6187-00

BallCount

ArrayBody(mm)

PanelType

Part number

324 20 x 20 call T4 160-6205-00

420 24 x 24 call T4 160-6228-00


58

PROTOTYPING

ZIF ADAPTERS

EASY TO USEFLIP-TOP SOCKETS

OPEN-TOP SOCKETS

AUTO-EJECT SOCKETS

CYCLE LIFES UP TO 10,000

BGA PrototypingAdaptersAdapters.com prides itself on being a one stopsolution for our customers. Our complete lineoffering of BGA development adapters goes along way in supporting that claim. We offerhundreds of off the shelf designs utilizing thewho’s who of todays top IC socket manufac-tures. In the case your IC is not normal weare the fast turn experts for custom designs.Need help finding a socket adapter for yourdevice? No problem, our technical sales staffwere all there when the BGA IC was firstintroduced and have many years ofexperience in problem solving with this highdensity form factor.

ADAPTER SELECTIONIn selecting a BGA adapter that will work foryou, much consideration is given to what typeof socket you prefer to work with. Due to thegrid array of BGA packages you can choosebetween several manufactures, and severalsocket configurations. Open -top, lidded orclamshell style being the most common, butothers, lever actuated, pogo pin, and screwlock lid type are also available.

In dealing with BGA IC’s day in and day outslight variations in packages can severelyaffect the ability of these adapters to perform.In determining what socket will work best foryou we would need to make sure of thepackage specifics. Which ever you decide on,all styles are offered with the machine screwpin or wire wrap pin options. Please refer topage 66 for the pin and panel type diagrams.

IC PACKAGINGWith no other IC package type is it asimportant that we start by looking at yourmechanical specs than with the BGA IC. Withso many variables, eliminating any mistakesby simply using information provided by thecustomer is critical. To accurately recommenda socket for your package type great care willbe paid to several dimensions, to ensure a fitthat will produce consistent reliable contact.The diagram on the following page highlightsthese points.A. Ball spacing “pitch” B. Package width,C. Grid Array, D. Package thickness, E. Balldiameter

1.5mm BGA ZIF Socket Adapters


BallCount

ArrayBody(mm)

PanelType

Part number

108 13 x 13 23 T3 160-6151-50

117 11 x 11 19 T3 160-6153-50

121 11 x 11 19 T3 160-6155-50

144 12 x 12 21 T4 160-6157-70

160 15 x 15 27 T4 160-6168-70

225 15 x 15 27 T4 160-6182-70

BallCount

ArrayBody(mm)

PanelType

Part number

32 7 x 4 13 T3 160-6118-50

56 13 x 13 10 T3 160-6130-50

64 11 x 11 13 T3 160-6133-50

80 11 x 11 13 T3 160-6140-50

100 10 x 10 call T4 160-6149-70

108 12 x 12 call T4 160-6151-70

144 12 x 12 13 T4 160-6157-70

160 14 x 14 15 T4 160-6167-70

196 14 x 14 15 T4 160-6176-70


BallCount

Array Body (mm)PanelType

Part number

46 6 x 8 6 x 8 T4 160-6105-70

48 6 x 8 6.9 x 7.2 T4 160-6109-70

48 6 x 8 7 T4 160-6105-85

74 call 12.9 x 8.1 T4 160-6130-75

BallCount

ArrayBody(mm)

PanelType

Part number

48 6 x 8 6 x 8 T4 160-6110-70

48 6 x 8 6 x 9 T4 160-6111-80

49 7 x 7 7 T4 160-6113-70

64 8 x 8 8 T4 160-6120-70

66 8 x 8 8 x 12 T4 160-6121-70

79 10 x 12 10 x 12 T4 160-6133-70

176 15 x 15 13 x 13 T4 160-6160-70

208 17 x 17 call T4 160-6165-70

288 22 x 22 19 x 19 T4 160-6198-70

324 18 x 18 16 x 16 T4 160-6205-70


Adapters with clamshell orflip-top ZIF sockets

Adapters for all BGA IC types

59


PROTOTYPING

TECH SUPPORTWE HAVE THE KNOWLEDGEWE HAVE THE SOLUTIONS

WORK THE WEBSEARCH ON-LINE

BGA PrototypingAdaptersNot sure of what or who to turn to? Makeyour first call to the adapter pros atAdapters.com and let your developmentsolution get on the fast track. With hundreds ofsolutions, top notch technical support, andquick turn custom designs our team will helpyou and your current and future projectssucceed.

BGA / UTI TEST ADAPTERSOur line of UTI (Unbelievable terrific andIncredible) test adapters started out as onephone call from an IC packaging house andhas turned into a full fledged product offering.We have know developed several adaptersthat are capable of being utilized on a widevariety of BGA IC package form factors. Withthis designed-in flexibility these adapters havefast become an integral part of our productoffering.

Adapters for all BGA ICtypes

Typical BGAdevice

1.27mm BGA Lidded ZIF SocketAdapters

QUICK ORDER GUIDE: DETERMINE• Acquire the IC package mechanical specifications• Choose the pin configuration and panel type on page 56.• Determine the desired socket type by looking at the IC socket section pages 46-51• Note any extra requirements like size and height restrictions

1.27mm BGA Open-Top ZIF SocketAdapters

BallCount

Array Body Part number

420 26 35 160-6226-75

484 22 23 160-6240-75

480 29 37 160-6242-75

580 160-6270-70

BGA - UTI Tester Adapters

A

B

Note1: “C” on the previous page, thegrid or array is usually listed as series ofnumbers like the following example20*20 or for rectangular packages 8*16

Note 2: “*” when an asterik appears in apart table, this signifies more than 2variations available and we request youcall us for assistance

E

D

BallCount

ArrayBody(mm)

PanelType

Part number

136 19 x 19 25 T3 160-6156-60

168 17 x 17 23 T3 160-6163-60

192 19 x 19 25 T3 160-6171-60

204 20 x 20 27 T3 160-6176-50

213 19 x 19 call T4 160-6178-80

224 18 x 18 23 T3 160-6179-60

240 19 x 19 25 T3 160-6184-60

255 20 x 20 27 T4 160-6186-

256 20 x 20 27 T4 160-6186-85

272 20 x 20 27 T4 160-6190-80

289 17 x 17 23 T4 160-6197-70

352 26 x 26 35 T3 160-6210-80

356 26 x 26 35 T4 160-6214-70

388 26 x 26 35 T4 160-6221-70

BallCount

ArrayBody(mm)

PanelType

Part number

52 14 x 14 19 T3 160-6112-**

64 17 x 17 23 T3 160-6116-**

72 11 x 11 15 T3 160-6120-**

96 11 x 11 15 T3 160-6123-**

119 7 x 17 14 x 22 T3 160-6154-75

144 20 x 20 27 T3 160-6157-**

256 20 x 20 27 T4 160-6186-**

272 20 x 20 27 T4 160-6190-**

276 26 x 26 35 T4 160-6196-80

289 17 x 17 23 T4 160-6197-70

292 20 x 20 27 T4 160-6199-70

352 26 x 26 35 T4 160-6210-70

388 26 26 35 T4 160-6220-70


60

PROTOTYPING

DIP, SDIPPLCC, PGA,and IPGAPrototypingAdaptersAdapting IC’s to a .100 form factor has been asignificant part of our business for manyyears. In some cases the IC form factor hasbeen around for ten even fifteen years but westill get request from students, engineers andhobbyist everyday to help them establishthere design environment. With this in mindwe have accumulated a vast inventory ofdesign for an incredible array of IC packagetypes. Whether you are looking for a PLCCadapter or even a DIP, chances are goodthat we have a solution to fit your needs.

ADAPTER VARIATIONSFor all these package types we have awealth of surface mount adapters to choosefrom. If a socketable adapter is what youdesire our array of adapters featuring eitherOpen -top, lever actuated, auto-eject,production, lidded and or clamshell style willprovide you with more than one solution tochoose from.

IC PACKAGINGWith so many IC package types and adaptervariations it may be required to scan throughour convenient IC packaging section or visitour web-site to find out exactly what you mightrequire. If still unsure you will find a welleducated technical support person atAdapters.com, with every support personhaving at least 10 years of experience with ICpackaging

LeadCount

Sockettype

PanelType

Part number

28productionauto-eject

T3T1

160-8180-07160-8181-20


T1T4

160-8205-20160-8205-70


T1T4

160-8222-10160-8227-70


T1T3

160-8250-20160-8250-50

68 production T3 160-8271-50

84 production T3 160-8285-60

LeadCount

ArrayPanelType

Part number

325 35 x 35 T3 160-7063-50

503 43 x 43 T4 160-7103-75

559 43 x 43 T4 160-7109-70

599 47 x 47 T4 160-7110-70

LeadCount

Sockettype

PanelType

Part number

42 productionT1T2

160-6955-10160-6955-40

56 production T2 160-6970-30

64 productionT1T3

160-6975-00160-6975-05

Shrink DIP Prototyping Adapters

IPGA Prototyping Adapters

PLCC Prototyping Adapters

Adapters for PGA and IPGA

Adapters for PLCC

61


QUICK ORDER GUIDE: DETERMINE• Acquire the IC package mechanical specifications• Choose the pin configuration and panel type on page 56.• Determine the desired socket type by looking at the IC socket section pages 46-51• Note any extra requirements like size and height restrictions

QFN PrototypingAdaptersAt Adapters.com we realize that the ICpackaging industry rarely stands still. With thisin mind we must remain focused to findingemerging technologies and working closelywith packaging houses, IC companies, andsocket manufactures to stay on top. Our lineof QFN adapters came from this constantdevotion to being a one stop adapterwarehouse for our dedicated customers. TheQFN or “Micro lead frame” package is anemerging force for the developer in thetelecommunication industry and we have anunmatched selection to choose from.

ADAPTER VARIATIONSCurrently we offer only a lidded or “clamshellstyle” socket for our QFN adapters. We havedeveloped adapters for the 1.27mm and thehigher density form factors.

IC PACKAGINGThe QFN or Micro lead frame package hassimilar characteristics as the LCC packagefrom days past. The difference lay in the sizeof the overall package and the density of thelead spacing. As you can probably guess foryourself the differences are measured by howmuch smaller the size is and how muchdenser the lead spacing is.A. Ball spacing “pitch” B. Package width,C. Grid Array, D. Package thickness, E. Balldiameter

LeadCount

Body(mm)

PanelType

Part number

8 5 x 6 T4 160-9103-70

PROTOTYPING

1.27mm QFN/MLF ZIF PrototypingAdapters

LeadCount

Body(mm)

PanelType

Part number

12 3 x 3 T4 160-9105-70

16 3 x 3 T4 160-9109-70

20 4 x 4 T4 160-9113-70

24 4 x 4 T4 160-9117-70

28 5 x 5 T4 160-9121-70

32 5 x 5 T4 160-9125-70

44 7 x 7 T4 160-9137-70

48 7 x 7 T4 160-9140-70

68 10 x 10 T4 160-9160-70

0.5mm QFN/MLF Prototyping Adapters

Adapters for Micro LeadFrame or Quad Flat noLead IC packages

Typical QFN / MLF IC packaging


62

PROTOTYPING

QFP PrototypingAdapterAdapting todays high density IC packaginghas been one of our strengths for many yearsat Adapters.com. In development with highdensity IC packages the need to convertsignals to standard prototyping boards is acommon problem and a staple of our productline. These QFP prototyping adapters givethe user the ability to convert the signal of theD.U.T. to .100” pin grid array for circuitdevelopment and analysis. To make thingseasier a pin or signal map is provided to keepsetup time to a minimum. On these 2 pagesare just a sampling of the hundreds ofadapters we have to offer for QFP packages.

ADAPTER VARIATIONSIn most cases we have several solutions forthe same IC. Over the years we have built asubstantial library of designs for the mostpopular and rarest of IC package types.

If soldering the device to the board is not aproblem considerable cost saving can beachieved with this type of adapter, due to nothaving to provide a ZIF socket for the device.To use, the device is soldered to a landpattern on the top side of the adapter. The testinterface can be provided with “pga” stylemachine screw pins, or come ready to wirewrap with 1/2” by .025” square pins.

If you need to be able to insert and extractyour device an adapter with a true test andburn-in socket is the correct choice for yourrequirement. The high cycle counts along withthe quality of materials makes these adaptersthe workhorse of our industry. If youpurchased a ZIF socket with the intention ofplugging it directly to your prototyping cardand found out it has a staggered footprint, noproblem, chances are that we have a boardfor that socket, and we can configure theadapter so the socket just plugs in.

CHOOSING AN ADAPTERSelecting which adapter will work for you hasbeen our specialty for over 15 years now.We will earn your confidence with ourunderstanding of each designer’s specialenvironment.

0.65mm QFP Surface Mount Adapters



Adapters for all types of QFP ICpackages

ZIF ADAPTERSEASY TO USEFLIP-TOP SOCKETSOPEN-TOP SOCKETSAUTO-EJECT SOCKETSUP TO 10,000 CYCLES

CUSTOM DESIGNSWE ARE THE DESIGNEXPERTSCALL US0.4mm QFP Surface Mount Adapters

LeadCount

PanelType

Part number

120 T4 160-8670-70

128 T4 160-8691-08

LeadCount

PanelType

Part number

32 T4 160-8300-08

48 T4 160-8365-80

64 T3 160-8454-60

80 T4 160-8537-08

100 T3 160-8613-07

128/R T4 160-8703-08

144 T1 160-8754-00

144 T4 160-8754-08

160 T3 160-8831-07

176 T4 160-8895-80

208 T1 160-8958-01

208 T4 160-8958-09

240 T3 160-9013-00

256 T4 160-9033-70

304 T4 160-9060-03

LeadCount

PanelType

Part number

52 T3 160-8404-07

80 T4 160-8550-08

100/R T4 160-8625-00

100/R T1 160-8626-05

112 T4 160-8651-08

144 T1 160-8760-10

160 T1 160-8834-20

168 T4 160-8859-70

184 T4 160-8919-70

LeadCount

PanelType

Part number

32 T4 160-8320-08

44 T4 160-8351-08

64 T4 160-8463-04

80 T4 160-8559-05

128 T1 160-8705-10

63


PROTOTYPING

QUICK ORDER GUIDE: DETERMINE• Acquire IC package mechanical specifications• Determine interface pin and panel type from page 56.• Determine the IC socket information from IC socket section on page 46-51.• Note extra requirements, i.e. size and height restrictions

Adapters with or without sockets

QFP PrototypingAdapter TypesIC PACKAGINGMany times our customers will call us andwant help determining exactly which IC typeor package variety they have . In somecases packaging can vary from onemanufacturing plant to the next and can causeopens, shorts and the inability to gain goodconsistent access across all signals beingtested.

In working with these IC Packages daily youbegin to see several critical dimensions thatdetermine what type and exactly whichadapter will work for you. In looking at thediagrams pay special attention to the itemslisted below.

A. Lead spacing or “Pitch”, B. Package width,C. Tip - Tip measurement, D. Packagethickness, E. Foot length

0.5mm QFP ZIF Socket Adapters



CDB

A

Typical PQFP, QFP,TQFP

E

0.4mm QFP Surface Mount AdaptersLeadCount

SocketPanelType

Part number

120 ? T4 160-8670-80

128 Enplass T3 160-8690-60

176 T4 160-8891-70

LeadCount

SocketPanelType

Part number

32 IC51 T4 160-8301-70

48 T3 160-8370-50

64 IC51 T1 160-8454-20

80 IC51 T4 160-8538-70

100 IC51 T1 160-8613-10

100 IC51 T3 160-8614-60

128 Enplass T4 160-8700-70

144 yamaichi T3 160-8754-60

160 yamaichi T3 160-8830-00

176 yamaichi T3 160-8895-50

208 yamaichi T3 160-8957-50

208 yamaichi T4 160-8957-70

240 Enplass T3 160-9014-50

304 yamaichi T4 160-9063-70

LeadCount

SocketPanelType

Part number

52 Nepenthe T3 160-8370-60

64 yamaichi T4 160-8457-70

80 yamaichi T4 160-8549-70

100/R Enplass T4 160-8627-80

112 yamaichi T4 160-8652-70

144 ? ? ?

160 yamaichi T4 160-8833-70

LeadCount

SocketPanelType

Part number

32 yamaichi T3 160-8320-50

44 ?T1T4

160-8350-20160-8350-80

64 yamaichiT3T4

160-8462-60160-8463-80

80/R Enplass T4 160-8552-70

120 ? T4 160-8683-70

128 yamaichi T3 160-8704-10


64

Adapters for SOIC I.C. packages

PROTOTYPING

SOICPrototypingAdaptersWhether your breadboarding a controller fora new video game, developing cellular phonetechnology, or completing a school project theproliferation of the SOIC package type meansyou will sooner or later run into the need foran adapter that will convert this IC form factorto a .100 mil breadboard.

Our SOIC prototype adapters consist of .100”pin grid array signals of the D.U.T. (deviceunder test), mapped out for ease of use, thenhas either a surface mount land pattern, orone of several socket options for you to insertthe device.

ADAPTER VARIATIONSThese categories vary mainly based on howthe device interfaces with the adapter. SMTversions, the D.U.T. solders directly to theadapter. Socketable versions, for theD.U.T., we offer a vast array of socketoptions, open-top, lidded ZIF, and some SMToptions as well. With our broad selection ofadapters off the shelf we can solve themajority of interconnection problems fromstock. In the case your package type is newor not standard we can provide customsolutions within-in 2-3 weeks.

CHOOSING AN ADAPTERAdapters.com staff is very confident we will getyou the correct adapter the first time, time andtime again. We know the questions to ask andare familar with all the indusrty standards andmore importantly we know when IC’s don’tconform to standards. We’ve seen it all, sodon’t worry we are here for you be happy.

1.27mm SOIC Surface mount Adapters

0.65mmSSOP Surface Mount Adapters

0.5mm TSOP Surface Mount Adapters

ADAPTERS TYPESSURFACE MOUNT ADAPTERSLIDDED CLAMSHELL SOCKETADAPTERSOPEN-TOP SOCKETADAPTERSAUTO-EJECT SOCKETADAPTERS

LeadCount

BodyWidth

PanelType

Part number

8 3.8 T1 160-9213-00

14 3.2 T4 160-9230-80

16 3.8 T1 160-9245-00

16 7.6 T1 160-9244-00

20 7.6 T1 160-9258-05

24 7.5 T1 160-9260-10

28 7.5 T1 160-9288-05

32 7.1 T4 160-9233-08

44 13.3 T4 160-9442-08

LeadCount

BodyPanelType

Part number

20 5.2 T1 160-9252-05

24 5.3 T1 160-9265-08

28 5.3 T4 160-9282-00

32 6.1 T4 160-9321-70

38 6.1 T4 160-9371-80

LeadCount

BodyPanelType

Part number

32 18.4 T4 160-9323-08

40 18.4 T4 160-9379-03

48 18.4 T4 160-9465-08

65


PROTOTYPING

SOICPrototypingAdaptersSOIC packaging comes in a wide variety ofshapes, sizes, patterns and styles. We atAdapters.com have the knowledge to break itall down into terms that you understand andwill allow you to move forward with yourdevelopment. It is always help full that weimprove your understanding of some basic ICpackaging principles.

IC PACKAGINGSOIC packaging comes in many form factors.Names like SOP, SSOP, PSOP, MSOP,TSOP, and TSSOP are all derivatives of theoriginal SOIC concept. Adapters.com staffwas there in the beginning and are stillproviding solutions to your ever changingdevelopment environment. Please note thecritical dimensions illustrated and shownbelow.

A. Lead spacing, B. Package widthC. Tip-Tip measurement, D. Packagethickness

1.27mm SOIC Zif Socket Adapters

SSOP Zif Socket Adapters

TSOP Zif Socket Adapters

LeadCount

Body(mm)

Paneltype

Part number

83.95.3

T4130-4854-01130-4858-01

143.95.37.8

T4130-4877-00130-4882-01130-4882-06

163.95.37.8

T4130-4901-01130-4907-01130-4913-06

183.95.3

T4130-4931-06130-4936-06

203.95.37.8

T4130-4956-01130-4960-06130-4962-01

247.88.4

T4130-4983-06130-4985-01

287.88.4

T4130-5008-06130-5010-01

32 11.4 T4 130-5040-06

40 11.4 T4 130-5065-06

44 13.3 T4 130-5090-06

LeadCount

Body (mm) & pitch

Paneltype

Part number

8 3.0, 0.65 T4 130-4861-00

204.4, 0.655.3, 0.65

T4130-5693-06130-5694-06

24 3.9, 0.65 T4 130-5304-06

28 5.3, 0.65 T4 130-5331-05

54 6.1, 0.8 T4 160-9521-00

64 6.1, 0.5 T4 160-9600-00

TSOP type-II, MSOP, QSOP, PSOP, TSSOP

TSOP type-I

Typical SOIC IC packaging

CD

A

B

A

C

C

B

A

B

D

D

QUICK ORDER GUIDE: DETERMINE• Aquire IC package mechanical specifications• Determine interface pin and panel type from page 56.• Determine the IC socket information from IC socket section on page 46-51.• Extra Requirements, ground planes

LeadCount

BodyPanelType

Part number

32 18.4 T4 160-9323-08

40 18.4 T4 160-9379-03

48 18.4 T4 160-9465-08

ZIF socket adapters for allSOIC derivatives


66

PROTOTYPING

Lab CardsLab cards are used in prototyping environ-ments. They are ideal for assembling circuitsusing wire-wrap wires to verify a new circuitdesign before the final PCB is fabricated.These cards provide a standard 0.1” holespacing to accept DIP and PGA packages,and prototyping adapters.

Adapters.com Lab Cards also interface withour complete line of prototyping adaptersconverting the industries highest densitypackages to a 0.1” grid.

Lab Card configurations and sizes include:• Non-bus specific• B/C64• C/96• D32• E/F48• DIN41617

Extender BoardsWhen you need to extend your signals fromthe motherboard for testing and probingpurposes you will use an Extender Board.Many offer access to the bus signals viamarked probe points and some utilize multi-layer technology to control signal distortionsand crosstalk.

We currently support the following formfactors.VARIATIONS• VME• VXE• EuroBus• Non-bus specific• Eurocard – all form factors for VME/VXI,

Multibus II and Futurbus applications• Peripheral Component Interconnect

(PCI)• Accelerated Graphic Port (AGP)• Personal Memory Card International

Association (PCMCIA)• Industry Standard Architecture (ISA)

QUICK ORDER GUIDE: DETERMINE• Bus type• Size of card• Grid pattern requirements if any• Extra Requirements, ground planes

Size (mm) Grid type Plug typePart

Number

100 x 160

.100 x.100

.100 x.100, uncommited area

.100 x.100

.100 x.100

.100 x.100



B/C64, C96All types

B/C64, C96D32, E/F48

31, DIN41617All typesAll types

160-5901-00160-5903-00160-5907-00160-5908-00160-5909-00160-5911-00160-5930-00

100 x 220 .100 x .100, uncommited area All types 160-5935-10

233.4 x 160.100 x .100.100 x .100, uncommited area

B/C64, C96All types

160-5914-00160-5917-00

233.4 x 220 .100 x .100 B/C64, C96 160-5920-00

233.4 x 400 .100 x .100, uncommited area All types 160-5940-00

100 x 220 .100 x .100 B/C64, C96 160-5923-00

Lab Cards, Extender Boards, and Bus Extenders

Lab Cards (also known as breadboards, and vector boards)

67


PROTOTYPING

Bus ExtenderCardsBus extender cards for all types of bussesand configurations. Call us if you havequestions, or if what you need is not listedhere

PCMCIA active and passive extenders

ISA Postcard

noitpircseDtraP

rebmuN

dractsoP dractsoP 00-3685-061

retpadasuB edisstnenopmocnorotcennoC 01-3685-061

retpadasuB edisredlosnorotcennoC 02-3685-061

rednetxeASI reyal-2,mm0.5x7.6 00-0685-061

rednetxeASI reyal-4,mm0.5x7.6 04-0685-061

rednetxeASI rednetxeelgnathgir 00-1685-061

epytotorPdrac

draob-otorpASI,mm5.4x1.31dirgdetimmocnu1.0x"4.4x0.31

00-4685-061

eziS noitpircseDtraP

rebmuN

53.6x521.2,sseccarofslangisdekram,reyal-4

senalpdnuorg&ccVlanretni 00-2485-061

8.01x52.8rotinomCCV,draobgnipytotorp,reyal-2

sseccalangis,subCCVdna 00-1485-061

A/N&tnempolevederawdrahAICMCP

tikgnipytotorp 00-5485-061

0033rednetxEdetalumis,slangissubdelebal86,reyal-4wollasehctiwspid,noitresni-er&lavomer

noitalosilangis00-0485-061

0033dractropeR gnidocedelcycO/I&yromeM 01-0485-061

PCI AND COMPAQ PCIPCI is the next generation of bus cards. Forthis architecture we have both active andpassive bus cards. The active cards are hot-swappable. The passive cards are not.

PCMCIAWorking with PCMCIA can be very difficultbecause the cards must go into a slot where itcan not be probed. The PCMCIA prototypingcards give you access to the card externally.

ISAISA is still out there and being used. If youare prototyping with it, we have the card tomake your work much easier.

PCI and Compact PCI Bus Extenders

Assortment of ISA cards


Number

32 / 645.0V,hot swap,ext card3.3V,hot swap,ext card

160-5801-50160-5801-30

325.1x3.9",bus extender card, 4-layer,access to all PCI signals

160-5802-00

32 / 64 bit3.3 & 5.0V probe points,hot insertion,access to all PCIsignals

160-5803-00

32 / 64 bit

5.0V, 4-5.0V expansion slots5.0V, 4-3.3V expansion slots3.3V, 4-3.3V expansion slots3.3V, 4-5.0V expansion slots

160-5804-10160-5804-20160-5804-30160-5804-40

32 bit 5.1x3.9", bus extender card 160-5805-00

32 bitPCI prototyping board11.2x3.7"x0.1 grid uncommitedarea

160-5806-00

3U8 layer, 2-pwr & gnd,8 slots+backplanes7 periperal, 1-sytem slots

160-5825-00

3U, 32 / 64 bit4-layer,1-pwr & gnd, marked signalaccess

160-5826-00

AdapterAdapts CompactPCI - PCI(32bit)for use with CompactPCIbackplane

160-5827-00

AdapterAdapts CompactPCI add-on tostandard PCI form factor, usew/32bit motherboard or backplane

160-5827-50

ISA Extenders and Lab Cards

PCI and Compact PCI

PCMCIA Extenders


68

Notes:

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W TO ADAPTERS COM · enable testing or debugging. Adapters are used by anyone designing, testing, program- ming or prototyping with IC’s. Adapters can also provide innerconnect