6th Generation Intel® CoreTM Processors Increased Performance for Intelligent Connected System

White Paper

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Introducing 6th Generation Intel® Core™ Processors – Flexible Performance from Edge to Cloud

6th Generation Intel® Core™ processors demonstrate the latest improvements in the pursuit of high performance, low power embedded systems. Highlighting the Internet of Things (IoT) focus of Intel’s embedded roadmap, this processor family delivers high performance, scalable, and energy-efficient options that are optimized for intelligent systems. IoT designs are boosted from the edge to the cloud, based on dramatically higher CPU and graphics performance compared to previous processor generations, coupled with a wide range of power and feature scalability.

Formerly codenamed Skylake, 6th Generation processors are manufactured on a 14nm microarchitecture using second generation 3D tri-gate transistors, ensuring ideal performance, power, density, and cost per transistor. Faster and more power-efficient than their predecessors, 6th Generation Intel® processors offer high-value features such as the ability to drive multiple 4K displays, enhanced performance on floating point applications, and the support of DDR4 memory for more flexible memory design. New features are designed to improve visual performance, ensure power efficiency and system responsiveness, and enable secure, flexible performance that enhances connected embedded platforms. These performance improvements are a boon to OEMs developing intelligent systems globally, scaling the entire Intel® product line and enabling high performance, low power systems in markets such as industrial automation, connected health, defense electronics and intelligent transportation. Powering ADLINK’s newest embedded building block platforms, 6th Generation Intel® Core™ processors increase design flexibility, performance and security vital for IoT innovation.

Intel® Tick-Tock spectrum Resource: Intel® Corporation

ADLINK Extends CPU and Graphics Performance in Building Block Platforms for IoT Development

6th Generation Intel® Core™ processors have arrived, in step with the company’s tick-tock cadence of development and heralding new levels of performance in graphics, security, wireless display and networking. Compelling advancements increase both performance and flexibility available to developers, enabling scalable power and advanced features that boost Internet of Things designs from the edge to the cloud. Illustrated by ADLINK’s broad spectrum of 6th Generation-based platforms, this white paper offers a closer look at Intel’s new processor family and its value across the range of connected embedded markets. As intelligent systems redefine market opportunities and demand innovation in design, ADLINK’s products will demonstrate 6th Generation Intel® Core™ advantages in visual performance, power efficiency, and flexible design ranging from small form factor mobile platforms to high performance workstations.

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Advancing the Industry with Flexible Processor Performance

Representing a tock in Intel’s tick-tock development cycle, the 6th Generation’s 14nm microarchitecture provides a 10 percent increase in performance over 5th Generation processors (formerly Broadwell). The contrast with earlier generations is even greater, including up to a 20 percent improvement over 4th Generation processors (formerly Haswell) and 30 percent improvement over the 3rd Generation architecture (formerly Ivy Bridge . )Because Intel’s 14nm production process remains the same as previous generation processors, development resources are focused entirely on architectural modifications, accelerated 4K media processing and next generation 3D graphics, and enhancements to existing features and new features such as faster memory performance. In addition, with Windows 10, Intel® Speed Shift is utilized to enable the OS to hand over control of frequency and voltage to the 6th generation Intel® processor.

Intel® 6th Generation processors are complex Systems-on-Chips (SoCs) integrating multiple CPU cores, higher-end Intel® processor graphics, and a range of other fixed functions all on a single shared silicon die. Billed as Intel’s “most scalable processor family to date” and including the first SoC in the Intel® Core™ family, numerous processor variants are available to developers; these include ultra low-power, 64-bit Intel® Core™ i3/i5/i7 multicore processors for mobile development, as well as Intel® Xeon options for high performance applications. Developed to differentiate embedded solutions and enable ideal management of price vs. performance, the 6th Generation debuted with 48 processors organized in four groups - Y-Series, U-Series, H-Series, and S-Series – with thermal design power (TDP) ratings from 4.5W to 91W.

Thermal performance is maintained with a standardized envelope based on the processor variant, and also includes a flexible approach that enables adjustments in TDP values. The 6th Generation Intel® Core™ family’s configurable TDP illustrates significant progress in the art of low power design, and allows developers to modify processor behavior to the extent that power consumption and TDP are modified, as well. The Intel® Dynamic Platform and Thermal Framework (Intel® DPTK) project further enables thin, quiet, cool platform design by providing system builders with various platform level power and thermal management technologies for Chromium OS. In addition, support for JTAG over USB 3.0 allows for chip-level debugging without requiring direct access to the processor, increasing convenience for designers. OS support ranges from small footprint, real-time operating systems (RTOSs) to feature-rich OSs, helping developers remain flexible and protect long-term OS investments. Performance can be optimized for small form factor, energy-sensitive designs such as digital signage, point-of-sale terminals or medical tablets – or higher performance, computationally demanding end uses such as industrial control and automation, retail devices, and military, aerospace and government systems. With the right blend of processor and platform, as well as support for multiple options in choice of operating system, designers are armed with sophisticated tools for IoT development across the broad spectrum of embedded arenas.

6th Generation U-SeriesThe U-Series integrates an ultra low power CPU and platform controller hub (PCH) onto a common substrate package – creating a one-chip package that is smaller, lighter and ideal for devices such as portable diagnostic equipment, patient monitors and wearable PCs for civic or military deployment. Intel’s Internet of Things Group supports a 15W version of this one-chip processor family, although it is also available in a 28W version. The U-Series supports G23E high-end Iris graphics, with Intel® Core™ i5/i7 options supporting Iris vPro graphics.

6th Generation H-SeriesH-Series processors consist of a two-chip solution rated at 45W – although design value is extended greatly with configurable TDP, programmed through the BIOS to reduce wattage to 35W and potentially as low as 25W. The H-Series is a surface mounted SKU, optimized for high-end mobile applications and includes an Intel® Xeon® option supporting G24E Iris vPro graphics.

6th Generation S-Series The S-Series is the 6th Generation Intel® Core™ desktop processor family, paired with the Intel® C230 and 100-Series chipsets and using the new LGA 1151 socket. Optimized for applications that need low power but require a socketed option, the S-Series consists of several 95/65/35W chips featuring quad and dual core designs along with Gen9 GT2 graphics. Support for DDR4 , one of the biggest advancements in the 6th Generation processor family; faster and enabling twice the density, S-Series chips allow up to 64GB of DRAM instead of the 32GB maximum of previous processor generations, increasing memory design options and reducing power dissipation from memory components.

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Designing with 6th Generation Intel® Core™ Technology

Relying more and more heavily on sensor data, communicating between devices and the cloud, and fueling analytics that reshape the way business operates, embedded systems and devices are getting smarter and having more impact on how the world works. By revealing data that was previously hidden or not available in real time, connected systems are enabling new services, automating processes, and reducing long-term costs for business operations. Commercial and industrial opportunities within the Internet of Things are anticipated to create as much as US$15 trillion in market value by 2030.

Processing performance must keep pace, however, along with greater capabilities to handle applications that are often graphics-based or media intensive. Security controls must be state-of-the-art, tapping hardware-based features that not only accelerate processing but also ensure data assets remain protected and private from the edge to the cloud. ADLINK’s building block platforms take this into consideration, not only capitalizing on 6th Generation Intel® Core™ advancements for performance improvements but also creating a slate of options that help OEMs get to market quickly with IoT products.

COM Express® ModulesFor ADLINK’s COM Express Type 6 Basic and Compact platforms, developers can choose 6th Generation Intel® Core™ or Celeron® processors using the Intel® QM170 and HM170 chipsets, part of the Mobile Intel® 100-Series Chipset Family. The 100-Series brings Gen 3 PCI support for the first time to a platform controller hub (PCH), creating an opportunity for high performance in a very small footprint. Options using Intel® Xeon® processors and the CM236 chipset are also available, supporting designs requiring ECC. memory.

6th Generation Intel® Core™ Processor, Skylake-H (Mobile Workstation/Mobile) SKU plans Resource: Intel® Corporation

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As connected, highly visual applications find their way into more and more industrial and commercial settings, ADLINK’s COM Express platforms are ideal for driving performance in places where it was not previously possible. Consider the factory floor where vision systems are connecting in real-time, or emergency medical situations where increased accuracy in portable imaging will improve a patient’s diagnosis – COM Express platforms handle the sophisticated algorithms and graphics processing required for high-definition display without bottlenecking compute performance or draining battery life.

Express-SL/cExpress-SL: COM Express Basic Size Type 6 Module with 6th Gen Intel® Core™ Processors support ECC/non-ECC

IMB-M43: Intel® Core™ i7/i5/i3-based industrial ATX motherboard

Industrial and Embedded MotherboardsFlexibility and versatility are hallmarks of ADLINK’s motherboard products. For example, ADLINK’s industrial motherboard family enables a scalable, high performance platform for OEMs and developers. Incorporating 6th Generation Intel® Core™ processor technology, these platforms support high-speed data transfer interfaces such as PCIe Gen3, USB 3.0 and SATA 6Gb/s. Reliability of high speed connections is enhanced by the motherboard family’s robust I/O, supporting USB 3.0, LAN and SATA with maximum performance and compatibility. A wide spectrum of PCI and PCIe configurations allows developers to make smart decisions in choosing expansion interfaces, for example, bifurcation of the PCIe slot supports up to 5x PCIe expansion slots. ADLINK’s industrial motherboards are optimized for high performance industrial computing systems, such as machine automation, machine vision, and test and measurement applications.

ADLINK further supports versatile development with its Mini-ITX embedded board family, based on 6th generation Intel® Core™ i7/i5/i3 and Pentium® desktop processors with Intel® Q170/H110 Chipset. Supporting up to 32 GB memory with dual channel DDR4 SODIMM sockets, these products allow expansion capabilities via a range of PCIe and Mini PCIe slots. Optimized for applications that require high-level processing and graphics performance in a long-life platform, these products support a variety of audio and video technologies, and are, optimized for imaging-intensive applications with DisplayPort outputs, dual Gigabit Ethernet ports, USB 3.0 & USB 2.0 ports, SATA 6 Gb/s ports, and High Definition Audio with 7.1 channels.

AmITX-SL-G: Mini-ITX Embedded Board with 6th Gen Intel® Core™ i7/i5/i3 Desktop Processor

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Fanless Embedded Computing Platforms Using ADLINK’s MXC and MXE series of rugged, fanless embedded computers, OEMs can get to market quickly with a rugged system blending powerful computing and graphics performance with minimal power consumption. The MXC line offers expandable I/O, while MXE products are optimized for more compact, embedded applications. An array of I/O options increases design flexibility, including PCI/PCIe expansion slots that accept a variety of off-the-shelf PCI/PCIe cards for configurable applications, internal Mini PCIe, and 3G communication slots. Both MXC and MXE products handle high-end visual processing while ensuring non-stop performance, supporting UHD/4K resolution as well as hot swappable SATA technology. Platform options include an extended fanless operating temperature range of -20°C to 70°C, ideal for applications in harsh physical environments such as transportation or industrial automation.

In addition, ADLINK’s newly introduced Fanless Embedded Computing Platform Value Line, incorporating the 6th Generation Intel® Core™ Processor and providing one PCIe x16, one PCI slot, 1 Mini PCIe slot, and single-side access for I/O ports, optimizes easy maintenance in industrial automation environments, maintaining the same robust design as ADLINK’s MXC/MXE lines, at an extremely cost-effective price point.

For IoT developers, the MXC and MXE platforms blend compact construction, flexibility, and rich I/O capacity with rugged design. Optimized for image-intensive applications in extreme computing conditions, these ADLINK products offer OEMs a fully-featured platform supporting factory and machine automation, surveillance, railway and maritime automation, and in-vehicle transportation systems.

MXC-6400: High Performance Fanless Expandable Embedded Computers / MXE-5500: High Performance Fanless Integrated Embedded Computers

MVP-6000: Value Series Fanless Expandable Embedded Computers

6th Gen Intel® Core™ Processor, S-Series and U-Series Resource: Intel® Corporation

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Embedded Vision SystemsADLINK's EOS rugged and compact embedded vision systems are equipped with 6th Generation Intel® Core™ processors, four independent Gigabit Ethernet ports for multiple GigE Vision device connections, and data transfer up to 4.0 Gb/s. EOS systems significantly enhance computing power and connectivity with minimal footprint, combining powerful computing with multi-channel connectivity, and a ready-to-deploy application platform, for embedded vision ideally suited to the challenges of machine vision applications.

CompactPCI® PlatformsADLINK’s CompactPCI® platforms capitalize on 6th Generation Intel® Core™ processors to offer high performance in transportation, defense, communications and other industrial applications that warrant superior data transfer capabilities and advanced computing power.

This high availability platform is optimized for a range of intelligent, networked systems in compute-intensive environments. Deployments could include secure and rugged transportation applications such as train management and wayside systems, automatic piloting, interlocking and control center systems, or communications applications requiring compact size and high density blade computing functionality such as video surveillance, video analytics, network acceleration and video transcoding.

Rackmount Industrial PCsADLINK’s NuPRO family of industrial PCs is ideally suited to applications requiring multi-tasking capabilities, high computing power, and high-speed data transfer rates for applications such as industrial control, machine vision and automation. NuPRO platforms tap 6th Generation Intel® Core™ performance to enable the high network throughput required in complex, non-stop industrial computing environments. With flexible features that maintain performance over a long product life cycle, NuPRO readily addresses the complex feature sets that vary dramatically from application to application, even as bandwidth for data processing and transmission continues to increase.

Rackmount Media Cloud ServersADLINK’s Media Cloud Servers are Application Ready Intelligent Platforms (ARiPs), designed from the ground up to handle high-bandwidth multimedia applications used over the network. General purpose rack servers are not specifically designed for media applications, usually integrating at most two CPUs and performing video transcoding using software, while ADLINK’s Media Cloud Servers meet the technical considerations specific to media servers while being scalable, cost-effective and easy to maintain.

The MCS-2080 is a 2U 19” Media Cloud Server with modular compute and switch nodes, which supports up to 16 Intel® Xeon® Processor E3-1500 v5 systems and hybrid combinations of 1/4 and 1/2 width compute nodes. With ADLINK MediaManager, it provides an end-to-end video server prototype solution to speed up product development.

Providing higher performance and computing density, ADLINK’s Media Cloud Servers ensure a high quality user experience for media-intensive applications such as video streaming and conferencing, remote education, remote medical services and real-time video analytics.

MCS-2080: 2U 19” Media Cloud Server with Modular Compute and Switch Nodes

NuPRO-E43 PICMG® 1.3 Full-Size LGA1150 Intel® Core™ i7/i5/i3 Processor-based SHB

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Smart Embedded Management Agent (SEMA) CloudADLINK’s building blocks for IoT systems come with an intelligent middleware stack called Smart Embedded Management Agent (SEMA), connecting seamlessly and securely to SEMA Cloud to enable remote monitoring, autonomous status analysis, custom data collection, and initiation of appropriate actions. System operators have anytime access to detailed system activities at the device level, including temperature, voltage, power consumption and other key information, allowing them to identify inefficiencies and malfunctions in real-time, preventing failures and minimizing downtime.

ADLINK’s SEMA Cloud enables its various high performance platforms to connect legacy industrial devices and new IoT systems to the cloud, extract raw data, evaluate what information needs to be saved and used locally, and send the remaining information to a cloud interface for future analysis. By simplifying data management and analysis with built-in tools, developers can quickly access valuable information for decision making and to generate innovative business opportunities.

ADLINK SEMA Cloud Web Interface

Capitalizing on Sophisticated Visual Performance

The 6th Generation processor family incorporates a video engine updated from Gen8 to Gen9, driving refinements throughout the microarchitecture and its supporting software. Gen9 supports the latest graphics APIs DirectX 12 and OpenGL 4.5 for improved 3D rendering performance at low power – meeting an essential requirement for new connected applications in medical, military and industrial arenas. Video playback is also faster and smoother than previous generations, based on a new multiplane overlay capability; overall visual quality of applications is smooth and seamless, based on multi-codec support and improved ability to decode and transcode simultaneous video streams. 6th Generation Intel® Core™ processors support up to three independent audio streams and displays — without the need for a discrete graphics card — including native support for Ultra HD 4K with resolutions now up to 4096x2304 pixels; the resulting workload consolidation reducing BOM costs as well as energy output. These capabilities enhance high-density streaming applications and optimize 4K video conferencing, capitalizing on accelerated 4K hardware media codecs HEVC (8-bit), VP8, VP9, and VDENC encoding, decoding, and transcoding. Intel® Iris™ Pro Graphics (GT4e) offers a 40 percent performance improvement over the previous version to further enable a broad range of 3D rendering capabilities designed to fit low, medium, and high performance applications.

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An on-die integrated processor graphics architecture enables this performance. However, it is the underlying compute architecture, which also offers general purpose compute capabilities, that reaches near teraFLOPS performance. Encompassing memory hierarchy, compute capability and product configuration, the architecture of Intel® processor graphics delivers a full complement of high-throughput floating-point and integer compute capabilities, a layered high bandwidth memory hierarchy, and deep integration with on-die CPUs and other on-die SoC devices. Importantly, for OEMs and IoT developers working across a range of newly evolving connected applications and markets, it is a modular architecture intended for scalability across product families ranging from cellphones to tablets and laptops, to high end desktops and servers. This modularity enables exact product targeting to a particular market segment or product power envelope.

Power Efficiencies Scale Dramatically

6th Generation mobile processors promise up to 26 percent faster CPU performance and up to 22 percent faster graphics, with desktop versions offering up to 35 percent faster CPU performance and up to 49 percent faster graphics. The new Intel® Xeon® processor E3-1200 v5 family promises up to 35 percent faster CPU performance for the S-Series and up to 26 percent for the H-Series, and faster graphics of up to 49 percent for S and up to 22 percent for H. All these performance improvements occur at the same or similar TDP as the prior processor generation. For example, Intel® Core™ products offer a standardized thermal envelope for 65W and 35W desktop products, and Intel® Xeon® variants maintain a standardized thermal envelope for 95W and 35W land grid array (LGA) workstation products, with both processor families remaining consistent with the previous generation. The Intel® Xeon® line also includes ball grid array (BGA) parts for mobile workstation needs, offering a 25W TDP and a 45W TDP that is configurable to 35W.

As the processing demands of IoT applications continue to increase – more real-time data in more devices worldwide – this scalability is a key advantage for developers. Designs can be more flexible, with up to 40 percent more high-speed I/O than previous generations, including a jump from 18 up to 26 HSIO ports. Intelligent systems can tap into new, faster memory performance with a memory interface upgrade supporting DDR4 1.2V up to 2133, along with 64GB max capacity with 8GB density. In addition, the workstation products support error-correcting code (ECC) memory, detecting and correcting single-bit memory errors to keep a system up and running. Because the integrated memory controller supports DDR4, designs can support both ECC and non-ECC memory. DDR4 itself uses lower voltage, creating an additional advantage by reducing DRAM power dissipation. Compared to prior generations, memory read/write performance is maintained through efficient prefetching algorithms, lower latency and higher memory bandwidth.

6th Generation U-Series platforms now also include eDRAM support, providing a greater advantage in graphics performance. The onboard eDRAM controller essentially acts as a large level-four cache to both the CPU and GPU, boosting performance of onboard graphics. Optimized for handheld and portable device designs, eDRAM SOC designs reduce system size by substituting a single-chip solution for one requiring two or three chips. At the same time, eDRAM also provides a power-savings advantage, eliminating power-wasting off-chip signals. 6th Generation memory options are more flexible overall, and now include support of 32GB memory modules compared to the 16GB module limitation in previous generations. Increased module size allows for larger memory configuration, ideal for space-constrained dual memory solutions common in IoT deployments.

The 6th Generation Intel® Core™ platform is built for significantly lower power consumption, with a fully integrated voltage regulator enabling legacy power delivery onto the package/die. Intel® Power Optimization and processor c-states increase periods of silicon sleep across the platform ingredients, reducing power in the CPU, chipset and third-party system components; fine-grained power

Intel® Skylake Microarchitecture Resource: Intel® Corporation

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Key Features Enable Speed and Boost Performance Value

The 6th Generation Intel® Core™ platform is fast, featuring Intel® Advanced Vector Extensions2 (Intel®AVX2), and an optimized instruction set that enhances performance on floating point–intensive applications. Intel® AVX2 adds 256-bit integer instructions and new instructions for Fused Multiply Add (FMA), which delivers better performance on media and floating-point computations. By fusing multiply and add functions, the processing engine is fed very effectively; system tasks that once required two clock cycles can now be completed in a single clock cycle. This level of performance enhances applications requiring increased vectorization or advanced video processing capabilities, ideal for connected systems handling duties such as facial recognition, industrial or medical imaging, high performance embedded computing, or digital security surveillance. Performance is also improved with features such as Intel® Rapid Storage Technology, improving data reliability and expandability for PCIe storage, and Intel® Smart Cache, which dynamically allocates shared cache to each processor core based on workload, reducing latency and improving performance. 6th Generation Intel® Core™ processors also support next generation storage devices while protecting high performance. With PCI Express Gen3 bandwidth increased from 5GT/s to 8GT/s, less processing time is required to transfer data to and from PCI Express devices such as Ethernet or storage controllers; fast access to networking and peripheral devices is further assured with up to 16 lanes.

Intel® Turbo Boost Technology 2.0, enabled on Intel® Core™ i5/i7 processors, adds an extra burst of performance to connected platforms. Turbo Boost is a series of algorithms which manage current, power and temperature to ensure maximum performance and energy efficiency. As long as individual processor cores are operating below power, current and temperature specification limits, the technology reduces active power while automatically enabling individual processor cores to run faster than base operating frequencies. This dynamic increase in performance of individual cores builds on features of previous processor generations; the increase is activated when the system OS requests the highest processor performance state (P0). Workload and operating environment define the amount of time the processor spends in Turbo Boost mode.

Turbo Boost enables maximum performance by allowing the processor to operate at power levels higher than its rated upper power limit (TDP) for short durations – the processor is allowed to overclock as needed to complete more processing faster. By determining an intelligent use of thermal headroom for higher frequency operations, applications can run faster. Intel® Hyper-Threading Technology steps in to work in conjunction with Turbo Boost, delivering two processing threads per physical core, accelerating performance by allowing each core to work on two tasks simultaneously.

Capitalizing on Advanced Security and Manageability

Through hardware- and software-based security hardening, new 6th Generation Intel® Core™ processors protect IoT systems and data, both at rest and in transit. This higher level of data security is essential to the development of connected, intelligent systems – supporting systems handling anything from highly secure financial data to automating factory processes to transmitting medical records. To keep increasingly connected devices more secure, the 6th generation platform has enhanced the firmware trusted platform module (TPM) with Intel® Platform Trust Technology (Intel® PTT) with BIOS Guard, safeguarding credential storage and key management, while helping reduce BOM cost and board space. BIOS Guard augments existing chipset-based BIOS flash protection capabilities, helping defend the platform against low-level denial of service (DOS) attacks, and restoring the BIOS to a known good state after an attack.

The 6th Generation features a raft of new security advancements, including Intel® Software Guard Extensions (Intel® SGX) that protects data while in use. Application developers can now protect sensitive data from unauthorized access or modification by rogue software running at higher privilege levels, securing data while being used in a Windows or Linux environment. Intel® Memory Protection Extensions (Intel® MPX) protect memory from buffer-overload attacks by identifying errant pointer usage; if left unattended, applications remain at risk of data corruption or malicious attack. Intel® MPX adds extensions to the underlying architecture, which improves performance over software-based solutions. Intel® Boot Guard adds another level of hardware-based security, preventing unauthorized software and malware takeover of boot blocks critical to a system’s function.

management controls all aspects of the system and its peripherals, especially during power down and power up sequences and adjusting power consumption based on real-time processor loads. For example, Intel® Intelligent Power Technology reduces power consumption through automated energy efficiency, starting slower devices first, ensuring the entire system is fully started in sync. Intel® Ready Mode for PCIe storage further assures system responsiveness by improving OS boot time, and waking more quickly from deep sleep states than previous generations. For example, U-Series “active idle” power state wakes almost instantly, yet uses much less power than previous processor generation; at the same time, the new processors remain software-compatible with previous generations.

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6th Generation platforms deliver intelligent security, supporting OS-absent manageability, and down-the-wire security even when the system is powered off, the OS is unresponsive or software agents are disabled. Intel® vPro™ builds in an added layer of hardware-based security – available in a pre-boot environment, accessed and administered separately from the hard drive, OS and software applications. Its key features such as Intel® Trusted Execution Technology (Intel® TXT), Intel® Virtualization Technology and Intel® Active Management Technology (Intel® AMT) come together to create powerful and flexible security protocols behind the firewall. For system operators, this centralizes image management and administration, secures network storage, and provides out-of-band protection. Time and costs are reduced through centralized IT administration; the OS can be shut down remotely, allowing users to more easily activate, deploy and securely manage unattended systems. This capability optimizes threat management in intelligent, connected systems, helping protect against difficult-to-detect, penetrating rootkits and malware that threaten users working in cloud or virtual environments.

Enabling the Internet of Things with Performance and Scalability

Embedded systems continue to evolve and create business impact worldwide. As more connected devices rely on more sensors to collect more data, developers face a growing range of new application demands that define the Internet of Things. Because the spectrum of connected applications is so broad, scalable performance is essential – allowing developers to capitalize on a new level of effectiveness across a range of industries and applications. From industrial automation to portable medical imaging to intelligent vending to digital surveillance, connected platforms must offer high performance I/O and media processing, as well as a focus on securing, managing and analyzing data more effectively than ever before. By integrating 6th Generation Intel® Core™ processors into its platforms, ADLINK is delivering on the promise of the Internet of Things, enabling continued advancements in CPU, graphics and media performance, supported by low power options and flexible, integrated security and management functions. For questions or to speak with ADLINK regarding 6th Generation Intel® Core™ processor-based embedded solutions, visit www.adlinktech.com.

About ADLINK

ADLINK Technology is a Premier member of the Intel® Internet of Things Solutions Alliance. From modular components to market-ready systems, Intel and the 400+ global member companies of the Intel® Internet of Things Solutions Alliance provide scalable, interoperable solutions that accelerate deployment of intelligent devices and end-to-end analytics. Close collaboration with Intel and each other enables Alliance members to innovate with the latest technologies, helping developers deliver first-in-market solutions.

Learn more at: intel.com/iotsolutionsalliance

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