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MESSAGE FROM THE DIRECTOR

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Volume 1 No. 3 Fall 2001A quarterly update from the Engineering Research Center for Wireless Integrated MicroSystems w w w. w i m s e rc . o rg

Message from the Director .................1Industrial Liaison ................................1Recent Events ....................................2Education Highlights .......................... 3Research Highlights ...........................4Personnel ........................................... 5SLC Report ..... . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..5Seminar Series .................................. 6Publications ........................................6

TABLE OF CONTENTS

University of MichiganMichigan State University

Michigan Technological University

to about 5000 with improved pressure sensi-tivity, decreased temperature sensitivity, andreduced power. Digital compensation nowallows the use of thinner diaphragms overlarger dynamic ranges and has pushed the fig-ure of merit to 40,000 or more. So pressuresensors have seen substantial progress and arebecoming integrated microsystems. One ofour current ERC projects is even developing acomplete vacuum-control system for usewithin the pressure reference cavity to ensurelong-term accuracy.

As with microelectronics itself, visibleimagers, and pressure sensors are maturing tobecome microsystems. Whether MEMSremains an identifiable field or disappearsinto its applications, helping components

become microsystems will be a major activi-ty for a long time to come. WIMS will endurebecause they are complete modules that solvecomplete problems. Driving this revolutionforward is the focus of this Center, and weappreciate all those who are working with usin this quest. It's going to be an excitingdecade ahead.

Ken D. WiseDirectorEngineering Research Center for WirelessIntegrated Microsystems

look at integrated sensors, however, one can-not help but ask what our drivers and metricsare? Do we have anything comparable to theDRAM? How much progress have we made?Where is our DRAM?

As we continue to evolve products based onMEMS, my guess is that some of the result-ing microsystems will become our DRAMs --- common platforms customized for particu-lar applications through stored-program intel-ligence. But they will be integrated systemsand not just components. Probably the firsti n t egrated silicon sensor was the visibleimager. Those devices today are finally chal-lenging the resolution of film, but they are nolonger just imagers. They are complete sys-tems on a chip.

Pressure sensors are the oldest and most suc-cessful MEMS product to date. If we definea figure of merit, by dividing desirable fea-tures by parameters we want to minimize, wemight put pressure sensitivity and dynamicrange in the numerator and power dissipation,measurement speed, cost, and temperaturesensitivity in the denominator. The first sili-con-diaphragm piezoresistive pressure sen-sors, back in the 1960s, were fabricated bythinning the entire wafer and gluing theresulting chips onto headers. Yields were lowand temperature coefficients were high.These early devices had a figure of merit ofabout 1. The appearance of anisotropicetchants and impurity-based etch-stops in themid-1970s pushed yield up and reducedpackaging problems, increasing the figure ofmerit to about 40. During the early 80s, theappearance of capacitive pressure sensors andon-chip circuitry improved the figure of merit

Last week someonea s ked me how big Ithought the field known as“MEMS” will get. Will it,perhaps, grow to rival oreven exceed microelec-tronics? I ventured that Idoubted it would get thatbig and then had thetemerity to suggest that it

may even disappear completely. I hastened toexplain what I meant. MEMS isn’t so mucha field unto itself but rather a way of doingthings. It is truly a pervasive technology.Witness the proliferation of sub-fields inMEMS over the last five yearsor so. MEMS started with afocus on mechanical-MEMS butn ow we also have optical-MEMS, bio-MEMS, and rf-MEMS. MEMS is pervading allkinds of fields, and as itbecomes accepted, it may justbecome part of those fields. Itwill just be the way things aredone. And that will, ultimately,be the badge of its success andmaturity.

While MEMS is far frommature today, we have neverthe-less come a long wa y, eve nthough it is sometimes hard tojudge our progress. MEMS hasbroad applications and lacks the easily-tracked metrics of microelectronics: featuresize, number of bits per chip, and so forth.Memory has been an especially powerfuldriver --- a single well-defined function withinsatiable market pull demanding continuousimprovements. The bits/chip metric provideda very visible benchmark on progress in thisarea and also hurled a challenge at the indus-try to keep up with Moore's Law. When we

INDUSTRIAL LIAISON

The next Centermeeting scheduled forMay14-16, 2002 willbe a combined NSFsite visit and Indus-

trial Advisory Board (IAB)meeting, thereby reducing theamount of travel required by IABmembers. Details will be madeavailable as the date approaches.The start of the school yearbrought our System Integratorsto campus. With offices in theWIMS ERC, they are hard at

work to insure that our testbedsare functional and hardware is ontime. Read more about Cathyand Evan on pg. 5.

The tragedies in Septemberinterrupted plans to visit ourmembers. If we have not con-tacted you, please contact me sothat a visit to your facility can bearranged. One goal of the Centeris to establish internships for ourERC students so that they can getto know our member companiesbetter. If you are seeking interns,please contact me so that we candiscuss how best to fill your

needs. Updated student resumesare available in the MembersOnly section on our Web siteh t t p : / / w w w. w i m s e r c . o rg. Whilethere you might check out semi-nars you may have missed thatare available via streamingvideo.I encourage you to visit theCenter whenever you can so thatwe can show you first hand theactivities going on.

Joseph M. GiachinoAssociate Director

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RECENT EVENTS

L E F T:M - P u l s e, UM’ssolar car entry in thisye a r ’s American SolarChallenge Race, crossingthe finish line inClaremont, Califo rn i a .Right: M-Pulse on thed ra g s t rip going throughprequalifying tests atHeartland Park in Topeka,K S. Good luck to theteam at the World SolarC h a l l e n g e, in Au s t ra l i athis November.

ERC STUDENTS TAKEBEST PAPER AWARDSJune 2-8 - C. J. Lu, EHS Ph.D. stu-dent doing work work closelyrelated to the WIMS µGC, wonBest Paper Award for his work,“Prototype design and LaboratoryPerformance Evaluation of aN ovel Near- R e a l - Time PortableAnalyzer for Indoor VOCs andS VOCs”, at the AmericanIndustrial Hygiene AssociationConference. EHS PhD(MDH) andMS (MH) students, M. D. Hsiehand M. Huang took both BestStudent Poster award as well as2nd place in the Best Ove r a l lPoster competition.

July 14-18 - Graduate studentReza Azadegan received 3rd placein the Best Paper contest at the2001 IEEE Antennas andPropagation Symposium held inBoston, MA. Reza’s paper enti-tled, “Design of miniaturized slotantennas” dealt with the develop-ment of an efficient miniaturizedplanar antenna apprpriate for anumber of wireless applications.The smallest antenna built to date,it occupies about 0.05 lambda X0.05 lambda (lambda is wave-length) and demonstrates a meas-ured gain of about 0dBi. Futureplans for the antenna include theincorporation of a miniaturizedarray of MEMS filters. ~ K.Sarabandi

M-PULSE SETS A BLIS-TERING PACEJuly 25 - Racing from Chicago,IL, to Claremont, CA, along oldRoute 66, the dedicated teamfought off 30 other teams from allover North Amercica for overall

v i c t o r y. Finishing in a totalelapsed time of 56:10:46, theUniversity of Michigan Solar CarTeam was crowned 2001 champi-ons of the American SolarChallenge.

Plagued with bad connections inthe past, the College ofEngineering provided use of am i c r owelder as well as staffmember Brendan Casey’s expert-ise in bonding the connections tothe solar cells on the skin of thecar.

As one of the Official sponsorsof the team, the WIMS ERCwould like to congratulate theteam on all their hard work, espe-cially after a disastrous crash dur-ing testing in June. Good luck inN ovember at the World SolarChallenge in Australia. Go Blue!~ LL

W I M S W E B S I T ER E L O C AT E S

September - Having finalized adomain name for the WIMS ERCWeb site - now known ashttp://www.wimserc.org - we arerunning stronger than ever. Dailyrequests for “Members Only”access lets us know there is plen-ty of interest out there.

Be sure to check out our eventssection on a regular basis for anup-to-date listing of all WIMS-related events. For the mostrecent news, watch for New sFlashes on our home page and inscrolling textboxes elsewhere onthe site. For new IAB members,sign up to gain advance access tostudent papers, and to viewresumes, project descriptions andmore. For those interested inlearning more about the industri-

al collaborations off e r e dthrough the Center, visit ourWeb site at www.wimserc.org~ LL

IAB CALLING

October 30-31 - The IndustrialAdvisory Board meeting will beheld at the Crowne Plaza, nearBriarwood Mall. For membersthat are unable to attend thisy e a r ’s meeting and wo u l dl i ke a copy of the CD,contact our AdministrativeDirector, Karen Richardson at:karenr@eecs.umich.edu. If youare not a part of the IAB andwould like to find out how topartner with WIMS, log onto http://www. w i m s e r c . o rg orcontact our Industrial Liaison,Joseph Giachino at,giachino@eecs.umich.edu ~ LL

NEW COMPA N YSETS UP SHOP

D r. Clark Nguyen, a WIMSResearch Thrust Leader, hasfounded, Discera, Inc. of AnnArbor, a company that utilizesmicromechanical vibrating res-onators to improve the perform-ance and reduce the size ofwireless devices. These MEMSdevices can easily be linked toexisting systems and performcomplex signal processing. Thec o m p a ny ’s lead investor isArdesta LLC, an IAB member.~ JG

N E W D E G R E EOFFERED INI N T E G R AT E DM I C RO S Y S T E M S

January 2002 - A 6th profes-sional degree will be offeredfrom the UM College of

Engineering, focusing on Micro-ElectroMechanical Systems(MEMS).

The Master of EngineeringDegree in Integrated Microsys-tems is geared towards profes-sionals working on WIMS-relat-ed activities in the microelectron-ics industry. The program willgive students the opportunity togain a more in-depth understand-ing of the field while allowingthem to expand their knowledgein complementary engineeringdisciplines as well as gaining val-ueable business skills for productand process development.

For more information seeEducation Highlights. ~ LL

JOINING HANDSWITH HANDS-ON

October - Members of theWIMS ERC faculty, staff andstudent leadership council metwith the administrators of theAnn Arbor Hands-On Museumto discuss the possibility of anafternoon workshop for K-12graders. Located in dow n t ow nAnn Arbor, the Museum hasmore than 250 fully-activeexhibits and educational pro-grams that feature chemistry,p hysics, geology, math, andmusic. The opportunity providedby the Museum for interactionbetween young minds and thoseof the graduate studentresearcher will open unique cre-ative and educational possibili-ties for all parties involved. TheERC is also working with theMuseum to establish a Hands-OnMEMS exhibit. If you wouldl i ke to know more about themuseum and its activities, go tohttp://www.aahom.org. ~ JG

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Engineering Research Center fo r Wireless Integrated MicroSystems

EDUCATION HIGHLIGHTS trate the real-life applications ofmath, physics, and chemistry,thereby, encouraging students topursue careers in those areas aswell as engineering. The coursesinvolved, seminars, lectures andengineering experiments. Semin-ars were offered in class, on theWeb, or via videoconferencingbroadcast across the campuses ofthe University of Michiga n ,Michigan Technological Univer-s i t y, and Michigan StateUniversity.Lectures and apperances by KenWise, Khalil Najafi, and DeanAslam highlighted the impor-tance of pre-college education asoutlined by the Education Thrust.A d d i t i o n a l l y, Craig Friedrich(MTU), provided a videoconfer-ence lecture, offering first-handdistance learning experience forthe students. A lab tour organizedby Dr. Wise provided an excel-lent learning opportunity for thestudents to see first hand whatadvances in technology the ERCis making.In addition to the WIMS shortcourse, AISRP participantslearned trigonometry, Unigraph-ics, technical writing, We bdesign, and MS Office 2000applications. Similarly, the one-week residential program partici-pants received instructions inalgebra, geometry, Web design,and MS Office applications. Theprograms were not only academ-ically rigorous, but demandedadherence to strict rules and reg-ulations that were designed tohelp students prepare for the pro-fessional world.In the past year, 11 out of 13 highschool seniors who prev i o u s l yparticipated in the AISRP atMSU were accepted into eitherthe University of Michigan, orMichigan State University, with afew gaining acceptance to bothu n iversities. The majority ofthese seniors declared theirmajors in engineering or medi-cine. Over the long term AISRPis looking to increase the numberof minorities and women “smalltech” engineers by prov i d i n gmore opportunities a quality edu-cation partnering with the WIMSERC. ~ D. Kim

OVERVIEWOver the summer nine studentsat UM were mentored or sup-ported by graduate students andfaculty under the following proj-ects: simulation of the operationof MEMS structures, simulatingMEMS for communicationapplications, characterizingmicro acoustic ejectors, scienceexperiments using microcon-trollers, code generation andtesting for microcontrollers, andan integrated microsystem withfield connectable sensors. Twoof the students are continuingtheir projects into the academicyear.Last year’s trial programs atO kemos H.S. have progressedinto experiential labs anddemonstrations being designedfor use in middle and elementaryschool classrooms in theOkemos area schools. This Fall,the first WIMS regular course isbeing piloted at RennaissanceH.S. in Detroit under the super-vision and guidance of DAPCEPteacher, Miriam Turner.We are also pleased to announceMs. Peggy Henderson hasaccepted the ProgramCoordinator’s position. Detailsin the next issue ~ L.C. McAfee

NEWEST INTERPRODEGREE FOCUSESON INTEGRATEDMICROSYSTEMSAnd then there were six...startingin January 2002, the College'sfive interdisciplinary profession-al degrees will be joined by onemore: this one focusing on theburgeoning field of microelectro-mechanical systems (MEMS).According to the program direc-t o r, Professor Stella Pang ofElectrical Engineering andComputer Science, the newMaster of Engineering (MEng)degree in Integrated Microsys-tems will enable students to gain"a deeper understanding ofMEMS while expanding thebreadth of their knowledge incomplementary engineering dis-ciplines. This degree also incor-porates courses in business man-agement and manufa c t u r i n g , "she continued, "as well as anopportunity to participate on a

team project within the micro-electronics, MEMS, or biomed-ical industry."Students who graduate from thisprogram are expected to guideproduct and process deve l o p-ment in the field with ease.The MEng degree program isclosely associated with the newEngineering Research Center forWireless Integrated Microsys-tems, based at UM but alsoi nvolving Michigan StateU n iversity and Michiga nTechnological University. "Thatmeans our students will haveaccess to the latest technologiesbeing utilized in the Center,including fabrication, materials,sensors and actuators, sensingsystems, power sources, andpackaging," Pang said. It alsomeans that students will haveaccess to the latest researchresults. "That's consistent withthe educational goals of theNational Science Foundation, theCenter's primary sponsor, "explained Pang.Students enrolling in the 30-hourMEng in Integrated Microsys-tems program must have anu n d e rgraduate degree in engi-neering, chemistry, physics, biol-ogy, or math. For more informa-tion about the program, contactthe InterPro office at (734) 763-0480 or hek@engin.umich.edu.~S. Pang

SCHOOL KIDS USEWIMS TO EXPLAINFUNDAMENTAL SCI-ENCEThe goal of the pre-college pro-gram, “elementary school toPh.D.”, is to combine WIMS ineducational laboratories - nowoperational at Michigan State,the University of Michigan andO kemos High School – withinstruction provided by precol-lege, undergraduate, and gradu-ate students. School children arei nvo l ved in innova t ive WIMSprojects designed to explain fun-damental science concepts relat-ed to physics, chemistry andBiology.All projects are built on the basicprogramming of WIMS robotsand microcontrollers using com-mercially available components.Examples of projects completedso far include: WIMS environ-

mental monitor (WEM) equippedwith flow, pressure and tempera-ture measurement, spring con-stant measurements and meas-urement of acceleration due togravity. Projects being developedinclude: WIMS robot for demon-stration of New t o n ’s laws ofmotion, extension of WIMSenvironmental monitor to includeO2 and CO2 sensors, WIMS bac-teria monitor, and WIMS chem-istry experiments using an on-chip spectrometer.

WIMS SPONSOREDSHORT COURSE FORMSU-DAPCEPThe Academic Intensive SummerResidential Program (AISRP)and the One-by-Four Programs(ObF) sponsored in part by theDetroit Area Pre-College Engin-eering Program (DAPCEP) andN S F ’s ERC for WIMS, withemphasis on the WIMS shortcourse recently concluded itssecond year with a series of pre-sentations and demonstrationsfor parents and administrators atM i c h i gan State Unive r s i t y.These “small tech” focused, resi-dential programs were organizedby MSU’s Engineering DiversityPrograms Office (DPO) andspearheaded by Dr. Aurles U.Wiggins, director.In 1999, with generous contribu-tions from the 3M Corporation,DAPCEP, technical experts fromWIMS ERC, Michigan State’sDean Aslam and DPO, devel-oped the nation’s first pre-collegeWIMS short course curriculum.Due to increased interest anddemand for WIMS education inthe AISRP, an additional pro-gram called the One-by-Fo u rProgram: Introduction to Wire-less Integrated Microsystems,was added to the curriculum.The new addition was designedto expose 8th and 9th graders tothe cutting edge technology ofWIMS. As a result, the numberof underrepresented participantsincreased from thirty students inthe summer of 2000 to 100 stu-dents in the summer of 2001.The WIMS short course consist-ed of lectures and lab experi-ments utilizing Lego Mindstormsin addition to microcontrollerprogramming.The objective of MSU’s summerresidential programs was to illus-

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RESEARCH HIGHLIGHTS recently demonstrated polysili-con micromechanical resonatorswith temperature coefficients onpar with that of quartz crystalsusing a combination of specialmaterials and design techniques.~CN

MICROPACKAGINGThe micropackaging thrust hascontinued its research in severalareas dealing with hermetic andvacuum packaging. Most impor-tantly this thrust is developingseveral new technologies for vac-uum packaging of MEMS usingwafer-level approaches. Silicon-gold eutectic bonding is beingutilized to develop a wafer-levelapproach to reliably package avariety of sensors in va c u u m .While the silicon-gold eutecticapproach has been utilizedbefore, current research hasfocused on improving the repro-ducibility and reliability of thisapproach using a new techniquefor locally heating only the areas

SENSORS

Micro-GC

We continue to make excellentprogress toward a monolithicwireless microanalyzer for com-p l ex vapor mixtures (WIMS-µGC). Initial testing of the on-board calibrator prototypes hasshown good agreement with the-oretical predictions, and fabrica-tion of the MEMS version isunderway. Fabrication of a sin-gle-stage, high-aspect-ratio pre-concentrator heater is also nearlycomplete. Separate testing hasshown that the originally pro-posed three-stage preconcentra-tor will indeed have the capacityand desorption characteristicsrequired for efficiently trappingand releasing complex organic-vapor mixtures spanning a10,000-fold range in volatility.Etched-channel separation stagesh ave been successfully sealedwith anodically-bonded lids andthe fluidic parameters are closeto expectations from modeling.Uniform deposition of station-ary-phase polymers will permitcharacterization of separationparameters and temperature pro-gramming. Novel approaches tolow-power heating of the separa-tion channels are showing prom-ise.

More recent test results from thefirst array of chemiresistor sen-sors employing monolayer-encapsulated metal (MenM) nan-oclusters as chemically sensitiveinterfaces have confirmed earlierpreliminary data indicating thatdetection limits in the part-per-trillion concentration range canbe achieved for the majority oftarget analytes in a sample vol-ume of just 0.25 L. Fig. 1 showsa transmission electron micro-graph (TEM) of one of these Au-thiolate structures, which has anaverage diameter of 6 nm.Continuing studies of electrodestructures and scaling fa c t o r ssuggest that further improve-ments in sensitivity will be possi-ble. Integrated 4-sensor arrayshave been fabricated, along withmicromachined housings, to cre-ate an ultra-low - d e a d - vo l u m eµGC detector cell.

New projects to be launched thisyear will be concerned with thedesign, fabrication, and testing ofthe baffled µGC inlet to preventparticulate entrainment, andlatching valves for directing sam-ple flow within the system. ~EZ

WIRELESSResearchers under the WirelessI n t e r faces Task have recentlydemonstrated the first-ever func-tional micromechanical res-onators using CVD polycrys-talline diamond as the structuralmaterial. Polycrystalline dia-mond has an advantage over sili-con in that its acoustic velocity ishigher. Since the resonance fre-quency of a mechanical resonatoris generally directly proportionalto the acoustic velocity of itsstructural material, polydiamondhas great potential for more easi -ly achieving the coveted UHFfrequencies (0.3-3GHz) requiredfor use in present and futurewireless communication trans-ceivers. In addition, due to theinherent stability of diamondmaterial, for which very little dif-fusion can occur even at hightemperatures, diamond canpotentially offer better agingcharacteristics than polysilicon,which is extremely important forcommunication frequency refer-ence applications. Finally, as hasn ow been demonstrated byWireless Task researchers, poly-diamond can be machined nearlyas easily as polysilicon, makingit amenable to conventional sur-face micromachining, and withdeposition temperatures around540ºC, CVD polydiamond canbe more easily integrated withhighly conductive metal elec-trodes to allow lower losses andhigher power handling at GHzfrequencies.The figure at right presents thescanning electron micrograph(SEM) of a 3MHz CVD polydia-mond CC-beam micromechani-cal resonator fabricated via a sur-face micromachining processmodified for diamond material.From the measured plot, this dia-mond resonator has a Q ~6,000,which is on par with that of poly-silicon CC-beam resonators atsimilar frequencies.In related work, Wireless Taskresearchers have also ve r y

L e f t : Tra n s m i s s i o nelectron micrograph ofone of the Au-thiolatenanoclusters used aschemically sensitiveinterface layers in themicroGC chemiresistor-array detector. Averagecluster size is ~7 nm(some agglomeration isapparent in this sam-ple). Below: SEM of a3MHz CVD polydia-mond CC-beamµmechanical resonatorwith metal electrodes.The Q for this device is6,000.

where the package is bonded tothe substrate. Details of thisapproach cannot be presentedhere since the technology is beingpresented for a possible patentapplication. In addition, anothertechnology is being deve l o p e dfor vacuum packaging of MEMSusing metal packages fabricatedin a batch process. It is anticipat-ed that results from both of theseapproaches will be available inthe next six months. In additionto vacuum packaging, we havecontinued our developed of a her-metic glass-silicon package andhave now obtained further long-term tests results in both biologi-cal and salt-water solutions.Biological tests have shown fullhermeticity and biocompatibilityof the glass-silicon package for atleast two years in animal models.This technology will be utilizedin the implantable prosthesesbeing developed at the Center.~KN

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Jaroslaw (Jarek)D re l i c h r e c e n t l yjoined the ERCvia Michiga nTe c h n o l o g i c a lUniversity wherehe has beenteaching since

1997. He is currently workingwith Ted Zellers’ group, usingthe laser-guidance depositionmethod to manufacture an arrayof sensors made of colloidal goldparticles. Their overall goal is todevelop a detector for the microgas chromatograph that is capa-ble of recognizing vapors andquantifying their concentrationsat detection limits relevant to arange of environmental monitor-ing problems.Once a Research AssistantProfessor with the Department ofMetallurgical Engineering at theU n iversity of Utah, Jarek hascome a long way from his nativePoland where he received hisM.S. in Chemical Te c h n o l o g yfrom the Technical University ofGdansk. Some of Jarek's currentresearch activities includeadsorption of surfactants at min-eral and metal surfaces, funda-mentals of wetting, spreadingand adhesion phenomena, adhe-sion force measurements for fineparticles using atomic forcemicroscopy, and most recentlyfabrication of microscopic andsub-microscopic 2D structuresusing unconventional techniques.Aside from teaching seve r a lcourses at MTU, Jarek has pub-lished over 80 technical papers,holds 8 patents and has morethan 30 conference presentationsto his credit.

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PERSONNEL

SLC REPORT

signatures then moving on toinstrumentation for a variety ofvapor and liquid phase acousticwave sensors applications. Sherecently joined the Integ r a t e dMicrosystems Department atSandia as Senior MemberTechnical Staff. Cathy's devel-opment interests includemicrosystems integration andsensor technologies.

Evan S. Gamblehas nearly twodecades of experi-ence in research-ing, deve l o p i n gand assessinge m e rging tech-

nologies. His areas of expertiserange from nanotechnology andMEMS to biotechnology andartificial intelligence. He is par-ticularly adept at identifying syn-ergies and integrating technolo-gies from diverse fields.His interest in nanotechnologyand MEMS was cultivated whilehe was a Ph.D. student in molec-ular biology and biochemistry atthe University of California LosAngeles. His research centeredon engineering proteins withs p e c i fic characteristics throughthe methods of directed evolu-tion and phage display.Most recently, he has been work-ing with entrepreneurs and edu-cational institutions around theworld interested in developingand commercializing technolo-gies related to MEMS and nan-otechnology. Technologies thathe has helped develop include: amicromolded fuel cell for cellphones and laptops with 20 timesthe energy density of existingbatteries; optically-encodedm i c r o t a g gants that are muchmore difficult to counterfeit thanholograms; an innovative cool-ing system allowing futuremicroprocessors of 10 GHz ormore to be stacked directly ontop of one another to maximizebandwidth; enzymatic synthesisof carbon nanotubes to yield uni-form properties of diameter, chi -rality, and conduction bandgap;and both SPM-assembled andself-assembled molecular cir-cuits to continue Moore’s Lawbeyond the capabilities of con-ventional electronics.

With the fall semester well underwa y, the Student LeadershipCouncil has been busy schedul-ing several exciting and valuableactivities for the Center.The Ann Arbor Hands-onMuseum has expressed interestin coordinating an afternoonelectronics workshop for K-12students. ERC volunteers wouldwork with young people on anelectronics project such as build -ing 'laser-tag' devices using

photo-detectors and flashlights.Look for more details on theseactivities later this fall. We are continuing efforts to part-ner with local school districts formath and science tutoring as wellas WIMS outreach demonstra-tions. The next round of scienceand engineering fairs is quicklyapproaching, so WIMS volun-teers will be needed to serve asjudges or mentors. Please con-tact David Lemmer-hirt (dlem-merh@umich.edu) if you havesuggestions for education, out-reach, or service activities theWIMS SLC might conduct oractivities we could partner withyou in any activities you areplanning!The SLC Industrial Committee islooking for more ways toi m p r ove interaction betweenindustry and students within theERC. An industrial expert com-mittee, composed of volunteersfrom the various companies withd i fferent technology ex p e r t i s e ,was briefly discussed at the lastIAB meeting. Such a group ofvolunteers would provide aforum for students who haveu n r e s o l ved process or designissues to communicate withexperienced industrial memberswho could provide va l u a b l einsight. In addition, we are look-ing into setting up guidelines forstudent internships with membercompanies. We hope to pursueboth these issues further at theupcoming IAB meeting. If youwould like to be a part of thiscommittee or like to see it hap-pen, please contact, John Clark(jrclark@umich.edu).The SLC Social committee con-tinues its efforts to encouragestudent team building throughintramural sporting events suchas volleyball, basketball, rollerh o c key team and tennis. Ourmost recent success came on thetennis courts where the ERCteam (Manish Hamkar, T. J.Harpster, Sethu Palaniappan, andSohin Chinoy) celebrated victoryin the Graduate/Fa c u l t y / S t a ffleague tournament after a 4-0team win. For details orsuggestions on other Socialevents contact T. Harpster(tharpste@eecs.umich.edu).

Khalil Najafi willreceive a FacultyR e c o g n i t i o nAward at theUniversity AwardsCeremony in earlyOctober.Nominated by stu-

dents, faculty and staff, only fiveawards are granted each year to“distinguished faculty based onsubstantive contributions to theU n iversity through signifi c a n ta c h i evements in research andother scholarly activities, excel-lence as a teacher, advisor andmentor and distinguished partici-pation in service activities of theUniversity.”

WIMS gladly welcomes two newSystems Integrators to the Centerand would like to thank bothSandia National Laboratoriesand Ardesta, LLC, for their gen-erous support.

Joining the WIMSERC as SystemIntegrator for theC o c h l e a r / N e u r a lProsthesis testbed,Cathy Morgan ofSandia NationalLabs is ve r y

pleased to be on-site at the ERCfor a two year appointment asResident Engineer.Having worked at TRW Systems,Inc, in Redondo Beach, primarilyon radar and communicationshardware development and sys-tems analysis as well as onacoustic wave sensors, Cathywent on to received her PH.D. inBioengineering from Universityof Washington, Seattle, in 1999.Her Ph.D. work towards develop-ing an optoelectronic carbondioxide sensor for transcuta-neous monitoring of neonatesincorporated MEMS structuresand hybrid electronics andemphasized modeling of sensorperformance and design strate-gies. In 1999, Cathy joinedSandia National Labs,Albuquerque, as a PostdoctoralAppointee in the MicrosensorR&D Department, first workingon a biosensor to discriminatebacteria based on their fatty acid

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SEMINAR SERIES

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Contact us:WIMS WorldUniversity of MichiganWIMS ERC213 Engineering Programs Bldg.2609 DraperAnn Arbor, MI48109-2101Tel.: (734) 615-3098Fax: (734) 647-2342www.wimserc.orgEditor:Luke Lingemail: lukeling@umich.edu

The Regents of the Unive r s i t yof MichiganD avid A. BrandonLaurence B. DeitchDaniel D. HorningO l ivia P. MaynardRebecca McGowa nAndrea Fischer N ew m a nS. Martin Ta y l o rKatherine E. WhiteLee C. Bolinger (ex offi c i o )

Engineering Research Center fo r Wireless Integrated MicroSystems

Non-Profit Org.US Postage PaidPermit No. 144Ann Arbor, MI

WIMS World is published quar-terly by the Center for WirelessIntegrated Microsystems.

PUBLICATIONS

After a summer hiatus,the Seminar Series isb a ck in full sw i n g . Tofind out what semin-ars are scheduled logonto our Web site:http://www.wimserc.org.August 24, 2001Paul HarmonNew Technology Section of theAdvanced Research Lab in theInkJet Supplies Business ofHewlett PackardInkJet Technology; History, Future,and Spinoffs

September 12, 2001Prof. Tayfun AkinMiddle East TechnicalUniversityLow-Cost UncooledMicrobolometer Infrared DetectorArrays in Standard CMOS

September 18, 2001Prof. Dean AslamMichigan State UniverstyPoly-diamond/carbon FilmTechnology for Micro- and Nano-structures

October 4, 2001Prof. Y.C. LeeUniversity of ColoradoMEMS Design and Packaging

October 9, 2001Chang LiuCalifornia Institute ofTechnologyMagnetic MEMS for RFCommunication, Sensors andMicrofluidics

For more information go tow w w. w i m s e rc . o rg. To viewa rc h ived material viaMEonline contact:Karen S. RichardsonWIMS Administrative Managerkarenr@eecs.umich.edu(734) 647-1779

C o n t r i buted papers at theAmerican Industrial HygieneAssoc. Conference, New Orleans,LA.

M. D. Hsieh, E. T. ZellersPersonal Direct-Reading Instrumentfor Monitoring Exposures toMultiple Organic vapors

C. J. Lu, E. T. ZellersPrototype Design and LaboratoryPerformance Evaluation of a NovelNear-Real-Time Portable Analyzerfor Indoor VOCs and SVOCsBest Paper Award Winner

Papers presented at the 2001IEEE Antennas and PropagationSymposium, Boston, MA.

R Azadegan, K. SarabandiDesign of miniaturized slot anten -nas3rd place, Best Paper Contest

I nvited presentation at the 3rdAnnual Acoustic-Wave SensorsWorkshop, Taos, NM.

E. T. Zellers, C. J. Lu, J. Grate, A.Hierlemann, A. RiccoNew perspectives on modelingresponses from polymer-coated sur -face-acoustic-wave vapor sensors

Paper published in IEEE Trans.Biomed. Engr., pp. 911-920,August 2001

Q. Bai and K. D. WiseSingle-Unit Recording with ActiveMicroelectrode Arrays

Paper presented at the 27thE u ropean Solid-State Circ u i t sC o n f e rence, Villach, Au s t r i a ,September 2001. The paper ispublished in the Technical Digestof conference.

K. K. Das and R. B. Brown,Analysis of the Floating VoltageTransfer Characteristic andComparison of Circuit Styles inPartially Depleted SOI-CMOS

Contributed papers at the 200thElectrochemical Society Meeting,San Francisco, CA.

Q. Y. Cai and E. T. ZellersChemiresistor vapor sensor arrayemploying monolayer encapsulatedmetal nanoclusters

A. Hierlemann, E. T. Zellers, A. J.Ricco

Use of linear solvation energy rela -tionships to model acoustic wavevapor sensor responses

C. J. Lu, E. T. ZellersA dual-stage preconcentrator for aportable indoor-VOC microsensorsystem

J. J. Whiting, C. J. Lu, E. T. Zellers,R. D. SacksToward a portable, high-speed, vac -uum-outlet GC vapor analyzeremploying air as carrier gas andsurface acoustic wave detection

Q.-Y. Cai and E.T. ZellersChemiresistor vapor sensor arrayemploying monolayer-encapsulatedmetal nanoclusters

Paper published in Sensors andActuators, A, pp. 266-277, 2001.

K. L. Kraver, M. R. Guthaus, T. D.Strong, P. L. Bird, G. S. Cha, W.Hold, and R. B. Brown,A Mixed-Signal Sensor InterfaceMicroinstrument

2001 IEEE International SOIConference, Durango, CO.

K. K. Das and R. B. BrownCircuit Style Comparison based onthe Variable Voltage TransferCharacteristic and Floating RatioConcept of Partially Depleted SOI To be published.

Paper submitted to the IEEESSCS Workshop on Low - Pow e rCircuits, Arlington, VA.

R. BrownLow-Power Mixed-SignalMicrocontrollersTo be published.

The following paper will be pre-sented at the International IEEEEngineering in Medicine andBiology Conference (EMBC),Istanbul, Turkey.

H. Yu, and K. NajafiCircuitry For A WirelessMicrosystem For Neural RecordingMicroprobes

Paper presented at theInternational Sensor Conference -2001, Korea.

K. WiseThe Coming Revolution in WirelessIntegrated MicroSystems

COMPLETED DOCTORALDISSERTATIONS 2001Demetrios P. PapageorgiouA Shuttered Probe with In-LineFlowmeters for Chronic In-VivoDrug DeliveryThe University of Michigan 2001Advisor: Prof. Ken Wise

This thesis reports the developmentof drug-delivery probes incorporat-ing integrated microfluidic cables,on-chip microchannels, in-lineflowmeters, and outlet shutters. Thef l owmeters resolve dose to betterthan 5pL. Process-compatible valveand pump structures are also present-ed.

Ark-Chew WongVHF MicroelectromechanicalMixer-FiltersThe University of Michigan 2001Advisor: Clark T.-C. Nguyen

This research reports microelectro-mechanical spring-coupled clamped-clamped beam resonators and filtersoperating from 10MHz to 70MHz.Localized annealing and vo l t a g e -based passband tuning are explored,and successful low-loss down-con-version and mixing of RF signals isdescribed. The use of wafer bondingto combine the micromechanical ele-ments with integrated BiCMOS cir-cuits is also reported.

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