WP9 ITS Mechanics and CoolingCorrado Gargiulo

17 February 2014

1. Finalization of IB geometry (inputs from WP1 and WP2) and layout (with WP6 and WP10). Finalization of OB geometry (with inputs from WP1 and WP2) and layout (with WP7-WP8 and WP10).

BP radius OR=18mm Vs 19.8mm (WP1,WP2 and MFT)

Layer 0 radius Distance from BP wall

Middle Layer radius TDR6/TDR7

Stave width Chip size i.e. Layer 0 radius, FPC layout

Stave length Layer radius, Power regulator

WP9 Objective 1

BP Outer Radius =………(19.8mm TDR)Layer 0 Mid Radius =……… (23.38mm TDR)

19.8 BeamPipe (BP) layout at C-side with an Outer Radius (OR) 19.8 mm has been finalized and proposed to MFT, with a possible disks distribution that should match MFT requirements.ITS/MFT InnerEnvelope OR 21.8mmBP ITS clearence 2mm; BP MFT clearence 2mm ‐ ‐BP alignment tolerance 3.3mm

18.0 BP OR reduction from 19.8 to 18mm imposes severe constraints on the BP installation tolerances that requires a feasibility study. Providing the layout above mentioned (19.8) is validated by MFT group, the BP OR of 18mm will not be anymore a requirement for MFT. ITS: BP OR reduction to 18mm will not bring evident gains, see today presentation from Andrea (WP1), Iouri (WP2). ITS/MFT InnerEnvelope OR 20.0mmBP ITS clearence 2mm ; BP MFT clearence 2mm ‐ ‐BP alignment tolerance 1.5mm

19.0 if both ITS and MFT will not need a BP OR 18mm we can assume ITS and MFT layout based on a 19.8mm BP OR (ITS/MFT InnerEnvelope OR 21.8mm). A compromise on the BP OR, 19mm, could be then considered. This will allow to enlarge the clerance between BP and ITS/MFT envelope from 2mm to 3mm and keep the installation tollerance of the BP at 2.5mm. This proposal is based on the fact that the distance of beampipe to the first layer of the ITS is much less important than assumed earlier.ITS/MFT InnerEnvelope OR 21.8mmBP ITS clearence 2.8mm; BP MFT clearence 2.8mm ‐ ‐BP alignment tolerance 2.5mm

5

21.36-18= 3.36mm23.38-19.8= 3.58mm

R 19,0

23.38-19.0= 4.58mm

19.8 (TDR)

19.0

18.0

Chip width 14,00mm

distance layer-0 (mid) from Beam Pipe Outer wall

Reduced beam pipe radius by 0.8mmNo change in the ITS layers radius (TDR)Solution endorsed by this

ITS plenary meetingSee Andrea presentation

6

Beam pipe layout: development of the two options 18mm, 19.8 inner radius

18mm outer radius

19.8 mm outer radius

Beam pipe layout and support vs MFT:Proposal sent to MFT, under evaluation…

01

23

4

5

η= -3,7 (3°)

Middle Layers Radius = …… (196.05; 245.45; TDR)

Layer n.

Stave number

Rmax (mm)

Rmin (mm)

Lenght active zone (mm)

Modules per half-stave

6 48 394,9 391,8 1475 75 42 345,5 342,3 1475 74 30 247,0 243,9 843 43 24 197,7 194,4 843 4

TDR 6 (TDR)

Layer n.

Stave number

Rmax (mm)

Rmin (mm)

Lenght active zone (mm)

Modules per half-stave

6 48 394,9 391,8 1475 75 42 345,5 342,3 1475 74 36 296,4 293,3 1054 53 30 247,0 243,9 1054 5

TDR 7

Increase number of stave Increase number of

modules per stave Increase stave length

TDR 6

TDR 7

Pseudo-rapidity coverage

-1.39-1.51

-1.31-1.51

-1.39-1.51

-1.34-1.50

The pseudorapidity coverage of the detector layers refers to tracks originating from a collision at the nominal interaction point (z= 0)

TDR 6

η= -2,5 (9.4°)

η= -3,7 (3°)

η= -1,22 (32.8°)

78

763 (1526) 450 (900)

900

455 493 531 569 688 768

absorber

STAVE LENGHT 1526, 900

beampipe

MFT disks

BP SUPPORT

430

TDR 7

900

812

455 493 531 569 688 768

763 (1526)548 (1096)

absorberSTAVE LENGHT 1526, 1096

beampipe

MFT disks

BP SUPPORT

430

Stave width=…… (15mm TDR)

• Chip size i.e. Layer 0 radius,

• FPC layout

Chip width 14.0mm needed for BP 18mm

Layer n.

Stave number

Rmax (mm)

Rmin (mm)

Lenght active zone (mm)

Modules per half-stave

6 52 394,5 391,5 1474.8 75 46 348,6 345,5 1474.8 74 34 258,2 255,0 842.7 43 28 212,3 209,1 842.7 4

Layer n.

Stave number

Rmax (mm)

Lenght active zone (mm)

2 20 35.9 2701 16 28.6 2700 12 35.9 270

The same chip adopted on the outer layers

Stave width=14mm

IB Stave width=15,7 mm

FPC width 15,7mmChip 15mm (TDR)

FPC

OB Stave width=15,7 mm

FPC width 15,7mm

1,41

Electronics components on the FPC will close this gap

TBD cold plate displacement to re-open the gapfrom 1.41 to 2mm?

Stave length Layer radius, Power regulator

300

320

IB Stave length=320mm

needed for IB 4th layer

Being considered in TDR7.

chip

290

9.6

IB Stave length=290mm (TDR)

270.8

1502 OL - 870 ML

15.7 OL

module

module

14.85 ML

OB Stave length

BP outer radius 18/ 19.8/ 19

Layer 0 mean radius 23.38 /21.36(BP18)

Middle Layer radius TDR6 / TDR7

Stave width 14 (BP 18)+1(FPC) / 15+1(FPC)

Stave length (cold plate) IL 320 (4th IB layer)

IL 290=9.6+270.8+9.6

ML 870= 14.85+840.3+14.85 1066

OL 1502=15.7+1470.6+15.7

Summary (TDR, endorsed in this meeting)

backup

24

staveInner barrel

Inner Barrel stave

o Stiffness test sag <10 µm (~7µm )

o Thermoelastic test on going

o Production of new stave with high dimensional accuracymoulds accuracy needs correction next

IB

QULIFICATION MODULE PRODUCTION (FINAL QUALITY)

DEVELOPMENT TEST (on EM)

o Thermal test OK

25

o Vibrational test >100Hz

167 Hz

status

o Dimensional next sag

On going

26

20µ

70µ

20µ

30µ

45µ

(30µ)

45µ

45µ

Alternative option under investigation to further improve stiffness and thermo-elastic stability

Change of Carbon fleece with K13D2U(same weight)

Inner Barrel stave

27

End wheelsInner barrel

See Antonello presentation for FPC and cable layout

next

Definition of end-wheel QM design and assembly procedure: joint with WP6

statusProto produced based non EM design

Inner Barrel end-wheels

Feed through for cable and pipes

Production of set-pins and stave connectors and dimensional check

29From Antonello, Antoine

30

StaveOuter barrel

o Produced Stave Full length Proto Baseline OK

Outer barrel stave

ENGINEERING MODULE PRODUCTION

o Cold plate 2 pipes ID=2.67mm full length for WP8

31

DEVELOPMENT TEST

o Bending test &FEA sag ≈95µm

o Thermal (150 and 300 mW/cm2), hydraulic test Ok

o Vibrational test 1st freq=51Hz; dynamic response ongoing

o Thermoelastic test αexp ~ 12 x 10-6 K-

1

On spaceframe (Carbon fiber K13 D2U)

On coldpalte

status

on going spaceframe

o Improve stave stiffness by replacing 2 M55j plies with K13D2U.

Full k13 spaceframe has shown to be too brittle Being prepared, spaceframe M55j baseline Being prepared, spaceframe M55j with additional layer Being prepared, spaceframe M55j with two layers K13d2U

o Further improvement of stave stiffness: increase stave section, need new mould

Outer barrel stave

3333

20µ

90µ

20µ

30µ

45µm

30µ

70/45µm

45µm

ID=2.67mm, wt=0.065mm

ID=2.00mm;wt=0.025mm

Cold plateo Alternative option under investigation to further

improve stiffness and thermo-elastic stability

Mould under modification (for ID 2mm), Grenoble New 2mm ID pipes arrived K13 form Berkley arrived

on going Outer barrel stave o Production of 1 cold plate 1,5m for WP8o Production of 1 cold plate 300mm for thermal test

34

End wheelsOuter barrel

EW

300mm

300mm

300mm

150mm

300mm

on going

statusEM design

Definition of cooling modularity and cooling schemeDefinition of electrical and hydraulic connection best location TBD

nextDefinition of end-wheel QM design and assembly procedure

Outer barrel end-wheels

36

cage

37

cage

Study on rails to optimize half barrels closure

on going

Reduce half barrel parallel translation to minimum

Structural shellITS CYSSs MFT service barrel Cage

TPC CageMFTservice Barrel ITS Outer Barrel

ITS Inner Barrel

Cage: Dav=1085mmMFT: Dav= 990mmITS_OB: Dav=908mmITS IB: Dav= 97mm

preliminary

Total 5-6mm carbon~ 2-2.3%

Cage (2-3mm*)

MFTService Barrel (1.6*) mm

ITS Outer Barrel (1.2mm*)

ITS Inner Barrel (0.2mm*)

Cage

MFT

ITS OB

ITS IB

preliminary

*skins: CFRP X0≈25cm

skin

skincore

core: closed cell foam X0 ≈ 1380cm

sandwich

41

Materials

“polyimide tubes”

o Fiber K13C2U received from Eric (Berkley) to be used in the cold plates proto production

o Core material: Airex R-82 foam Ongoing

o Water absorption and erosion resistance check Ongoing

“connectors”

“composite ”

o Evaluation of best material Macor, Durostom 203 –PEEK vs Accura Bluestone (3d print) Ongoing

CERN REFERENCE DOCUMENTS: • The Use of Plastics and other Non-Metallic Materials at CERN with respect to Fire Safety and Radiation

Resistance- (CERN-IS-41)• Compilation of radiation damage test data, Part I, II, III, IV ( CERN 79–04, CERN 79–08 , CERN 82–10,

CERN 89–12 )

on going Materials

Adhesive tape (60 µm) 3M 467Mp 200MP received from Eric (Berkley) to be evaluated for Module fixation

“glue-adhesive ”

Development of Material database and CERN standard conformity verification for all mechanical parts