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Z Microsystems, Inc. · 9820 Summers Ridge Road, San Diego, CA 92121 · T: 858.831.7000 · F: 858.831.7001 · www.zmicro.com Rugged, ultra-compact, Multi Processing Unit (MPU)- The COMx MPU is a space-saving multi-processing unit driven by high- performance Commercial-Off-The-Shelf (COTS) electronics. This COM Express open architecture delivers a rugged command-centric computing station with plug-and-play modular performance in a durable and component-flexible footprint. Modular performance - Engineered to fit in a 4U rack space, the COMx MPU supports up to 7 Single wide (CM1x) or 3 Double wide (CM2x) fanless and conformal coated processing modules. An environmental control system monitors and displays module operating status on a forward facing display. CM1x modules support the latest i7 processors, while CM2x modules can integrate a x16 PCI Express slot for enhancements such as powerful GPU graphics capabilities. Protect your computing efficiency - “Hot-swappable” and dual- redundant, load-sharing power supplies protect operations from power failures. The 4U station also utilizes the cross-platform compatible TranzPak2 storage modules, standard in Z Microsystems’s computing devices. Featuring scalability, flexibility, and high-performance processing; the COMx MPU epitomizes Z Microsystems’s commitment to delivering Rugged Deployable Computing. Z MICROSYSTEMS – COMx MPU COMPUTING PLATFORM COMX 7X CHASSIS - RUGGED COMPUTE EXPRESS COMMAND STATION Z MICROSYSTEMS – COMx MPU 7x CHASSIS Rugged, lightweight, sealed aluminum chassis PICMG COM-Express standard architecture Supports Quad Core Intel i7 Processors Hosts up to 7 CM1x or 3 CM2x Processing Modules Supports up to 16GB RAM & dual-head graphics “Hot-swappable”, dual-redundant and load-sharing AC or DC power supplies Integrated display offers system monitoring I/O includes: PCI Express x4, (4) USB, dual RS232, dual GigE, dual video out (DVI-I), audio in/out Document # 27-0050DS Rev B Issued 11/14/2012

Z MICROSYSTEMS – COMx MPU COMPUTING …zmicro.com/downloads/Data/Computers/mpucomx.pdfTranzPak2 storage modules, standard in Z Microsystems’s computing devices. Featuring scalability,

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Page 1: Z MICROSYSTEMS – COMx MPU COMPUTING …zmicro.com/downloads/Data/Computers/mpucomx.pdfTranzPak2 storage modules, standard in Z Microsystems’s computing devices. Featuring scalability,

Z Microsystems, Inc. · 9820 Summers Ridge Road, San Diego, CA 92121 · T: 858.831.7000 · F: 858.831.7001 · www.zmicro.com

Rugged, ultra-compact, Multi Processing Unit (MPU)- The COMx MPU is a space-saving multi-processing unit driven by high-performance Commercial-Off-The-Shelf (COTS) electronics. This COM Express open architecture delivers a rugged command-centric computing station with plug-and-play modular performance in a durable and component-flexible footprint.

Modular performance - Engineered to fit in a 4U rack space, the COMx MPU supports up to 7 Single wide (CM1x) or 3 Double wide (CM2x) fanless and conformal coated processing modules. An environmental control system monitors and displays module operating status on a forward facing display. CM1x modules support the latest i7 processors, while CM2x modules can integrate a x16 PCI Express slot for enhancements such as powerful GPU graphics capabilities.

Protect your computing efficiency - “Hot-swappable” and dual-redundant, load-sharing power supplies protect operations from power failures. The 4U station also utilizes the cross-platform compatible TranzPak2 storage modules, standard in Z Microsystems’s computing devices. Featuring scalability, flexibility, and high-performance processing; the COMx MPU epitomizes Z Microsystems’s commitment to delivering Rugged Deployable Computing.

Z MICROSYSTEMS – COMx MPU COMPUTING PLATFORMCOMX 7X CHASSIS - RUGGED COMPUTE EXPRESS COMMAND STATION

Z MICROSYSTEMS – COMx MPU 7x CHASSIS

• Rugged, lightweight, sealed aluminum chassis

• PICMG COM-Express standard architecture

• Supports Quad Core Intel i7 Processors

• Hosts up to 7 CM1x or 3 CM2x Processing Modules

• Supports up to 16GB RAM & dual-head graphics

• “Hot-swappable”, dual-redundant and load-sharing

AC or DC power supplies

• Integrated display offers system monitoring

• I/O includes: PCI Express x4, (4) USB, dual RS232,

dual GigE, dual video out (DVI-I), audio in/out

Document # 27-0050DS Rev B Issued 11/14/2012

Page 2: Z MICROSYSTEMS – COMx MPU COMPUTING …zmicro.com/downloads/Data/Computers/mpucomx.pdfTranzPak2 storage modules, standard in Z Microsystems’s computing devices. Featuring scalability,

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THIS DOCUMENT IS THE PROPERTY OFZ MICROSYSTEMS, INC. AND CONTAINS

INFORMATION WHICH IS PROPRIETARY TOZ MICROSYSTEMS, INC. NO PART OF THIS

DOCUMENT MAY BE COPIED, REPRODUCEDOR DISCLOSED TO THIRD PARTIES

WITHOUT PRIOR WRITTEN CONSENT OFZ MICROSYSTEMS, INC.

504

11/23/11C.M.

ASSY,COMX

03-30053

Phone: (858) 831-7000 Fax:(858) 831-70019830 Summers Ridge Rd, San Diego, CA 92121Z Microsystems, Inc.

1. COMX CHASSIS APPROX. WEIGHT 65 LBS.

DRAWN

INTERPRET DIMENSIONS & TOLERANCESPER ASME Y14.5M-1994

MATERIAL:

FINISH:

DO NOT SCALE DRAWING

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INFORMATION WHICH IS PROPRIETARY TOZ MICROSYSTEMS, INC. NO PART OF THIS

DOCUMENT MAY BE COPIED, REPRODUCEDOR DISCLOSED TO THIRD PARTIES

WITHOUT PRIOR WRITTEN CONSENT OFZ MICROSYSTEMS, INC.

504

11/23/11C.M.

ASSY,COMX

03-30053

Phone: (858) 831-7000 Fax:(858) 831-70019830 Summers Ridge Rd, San Diego, CA 92121Z Microsystems, Inc.

1. COMX CHASSIS APPROX. WEIGHT 65 LBS.

DRAWN

INTERPRET DIMENSIONS & TOLERANCESPER ASME Y14.5M-1994

MATERIAL:

FINISH:

DO NOT SCALE DRAWING

DECIMALSXX = XXX =

.02

.01

FRACTIONS1/32

ANGLES1

UNLESS OTHERWISE SPECIFIEDDIMENSIONS ARE IN INCHES

TOLERANCES ARE:

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17.01

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APPROVEDNONE 1

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THIS DOCUMENT IS THE PROPERTY OFZ MICROSYSTEMS, INC. AND CONTAINS

INFORMATION WHICH IS PROPRIETARY TOZ MICROSYSTEMS, INC. NO PART OF THIS

DOCUMENT MAY BE COPIED, REPRODUCEDOR DISCLOSED TO THIRD PARTIES

WITHOUT PRIOR WRITTEN CONSENT OFZ MICROSYSTEMS, INC.

504

11/23/11C.M.

ASSY,COMX

03-30053

Phone: (858) 831-7000 Fax:(858) 831-70019830 Summers Ridge Rd, San Diego, CA 92121Z Microsystems, Inc.

1. COMX CHASSIS APPROX. WEIGHT 65 LBS.

DRAWN

INTERPRET DIMENSIONS & TOLERANCESPER ASME Y14.5M-1994

MATERIAL:

FINISH:

DO NOT SCALE DRAWING

DECIMALSXX = XXX =

.02

.01

FRACTIONS1/32

ANGLES1

UNLESS OTHERWISE SPECIFIEDDIMENSIONS ARE IN INCHES

TOLERANCES ARE:

63

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19.01

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17.01

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APPROVEDNONE 1

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THIS DOCUMENT IS THE PROPERTY OFZ MICROSYSTEMS, INC. AND CONTAINS

INFORMATION WHICH IS PROPRIETARY TOZ MICROSYSTEMS, INC. NO PART OF THIS

DOCUMENT MAY BE COPIED, REPRODUCEDOR DISCLOSED TO THIRD PARTIES

WITHOUT PRIOR WRITTEN CONSENT OFZ MICROSYSTEMS, INC.

504

11/23/11C.M.

ASSY,COMX

03-30053

Phone: (858) 831-7000 Fax:(858) 831-70019830 Summers Ridge Rd, San Diego, CA 92121Z Microsystems, Inc.

1. COMX CHASSIS APPROX. WEIGHT 65 LBS.

DRAWN

INTERPRET DIMENSIONS & TOLERANCESPER ASME Y14.5M-1994

MATERIAL:

FINISH:

DO NOT SCALE DRAWING

DECIMALSXX = XXX =

.02

.01

FRACTIONS1/32

ANGLES1

UNLESS OTHERWISE SPECIFIEDDIMENSIONS ARE IN INCHES

TOLERANCES ARE:

63

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6.59

19.01

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17.01

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APPROVEDNONE 1

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THIS DOCUMENT IS THE PROPERTY OFZ MICROSYSTEMS, INC. AND CONTAINS

INFORMATION WHICH IS PROPRIETARY TOZ MICROSYSTEMS, INC. NO PART OF THIS

DOCUMENT MAY BE COPIED, REPRODUCEDOR DISCLOSED TO THIRD PARTIES

WITHOUT PRIOR WRITTEN CONSENT OFZ MICROSYSTEMS, INC.

504

11/23/11C.M.

ASSY,COMX

03-30053

Phone: (858) 831-7000 Fax:(858) 831-70019830 Summers Ridge Rd, San Diego, CA 92121Z Microsystems, Inc.

1. COMX CHASSIS APPROX. WEIGHT 65 LBS.

DRAWN

INTERPRET DIMENSIONS & TOLERANCESPER ASME Y14.5M-1994

MATERIAL:

FINISH:

DO NOT SCALE DRAWING

DECIMALSXX = XXX =

.02

.01

FRACTIONS1/32

ANGLES1

UNLESS OTHERWISE SPECIFIEDDIMENSIONS ARE IN INCHES

TOLERANCES ARE:

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Technical SpecificationsZ MICROSYSTEMS – COMx MPU 7x CHASSIS

Z Microsystems, Inc. · 9820 Summers Ridge Road, San Diego, CA 92121 · T: 858.831.7000 · F: 858.831.7001 · www.zmicro.com

Physical

7x Chassis PowerPak DC PowerPak AC CM1x Compute Module CM2x Compute Module

Dimensions HxWxD 6.63” x 17.00” x 17.5” 3.2” x 1.60“ x 12.18” 3.2” x 1.60” x 13.7” 6.0” x 1.75” x 12” 6.0” x 1.75” x 12”

Weight24 lbs(65 lbs with 7 modules, 2 power supplies)

3.0 lbs (each module)6.0 lbs (redundant pair)

3.8 lbs (each module)7.6 lbs (redundant pair)

3.4 lbs (add .66 lb for each TP2 storage module)

8.0 lbs (add .66 lb for each TP2 storage module)

Shock (Modules) 40 g’s, Saw-tooth, 11ms

Power

Options AC and DC Power options available

Environmental 40 g’s, Saw-tooth, 11ms

Operating Temp 0ºC to 45ºC; -20ºC to 45ºC with rotational disk pre-heaters; -20ºC to 45ºC with solid state disks

Non-Op Temp -40ºC to +70ºC

Humidity 5% to 95% non-condensing

EMI MIL-STD 461E* (*Call factory)

Operating Altitude Up to 10,000 ft with rotational disks; 40,000 ft with solid state disks.

Non-Op Altitude Up to 40,000 ft

Vibration MIL-STD 167 Extended capability with solid-state drives

Shock (Chassis) Non-Operating MIL-STD 810E (method 516), 30g’s saw-tooth

Fungus Non-Nutrients/Contaminants

MIL-SPEC

MIL-STD 901D (in isolated rack), extended capabilities with solid-state disks* (*Call your local Z Microsystems Sales Representative)*Subject to change without notice. For the most recent test data contact your local Z Microsystems Sales Representative.