Zachary J. Davis, Senior Consultant, to J-FIL technology... · Zachary Davis, DTI Confidential IMPRIO 100 SPECS EBL J-FIL UV stepper Resolution ~10 nm < 30nm 250 nm Stitching < 50

Zachary J. Davis, Senior Consultant, [email protected]

Surface Acoustic Wave fabrication using nanoimprint

Zachary Davis, DTI Confidential

Center for Microtechnology & Surface Analysis

Surface Technology

Sensor Technology

Metrology

SERVICES AND PRODUCTS

Bottom Up

Micro and Nano Technology

Top Down


Surface Technology

Sensor Technology

Metrology

SERVICES AND PRODUCTS

Micro and Nano Technology Nanoimprint Lithography Physical Vapor Deposition Electron Beam Lithography Femtosecond Laser Excimer Laser CO2 Laser

SAW Sensors Wireless Systems Functional Coatings Antenna Design (cm-nm) System integration Lab-on-Chip

Molecular Imprinting Organic Synthesis Molecular Vapor Deposition Atomic Layer Deposition PE-CVD Inkjet dispense system

Focused Ion Beam Scanning Electron Microscopy QCM-D Gas Analysis Chamber TOF-SIMS XPS

Center for Microtechnology & Surface Analysis

MICRO / NANO FABRICATION SERVICE

DTI “owned” equipment at Danchip • J-FIL Nano Imprint Lithography (Pilot production/Low

volume production • Etchers (metal, DRIE, glass, polymer) • Ion beam milling/etching • Multi-Process Physical Vapor Deposition (unique) • Laser micromachining/wafer dicing • 2PP 3D-laser • New Electron Beam Lithography just intstalled Next-Generation JEOL E-beam: Top-three World-wide

1350 m2 class 1-1000 ISO 9001

JET AND FLASH NANOIMPRINT LITHOGRAPHY

Supplier Molecular Imprints

J-FIL (Jet and Flash Imprint Lithography)

The only lithographic method so far to be validated

for the 22 nm node by industrial user (Toshiba)

Room temparature nanoimprint by UV curing

Imprint resist (low voscosity monomers)

MonoMat

SilMat (~10% Si)

Other functional materials commercially

available

Template

In-house fabrication

Fused Silica block (65x65 mm2, 6 mm thick)


Imprio 55 Imprio 100 Imprio 300 (industry verified for 22 nm)

Imprio 1100 Imprio HD2200 Patterned media

Perfecta TR1100 Template replicator for Patterned media

NuTera HD7000 Patterned media



IMPRIO 100 SPECS

EBL J-FIL UV stepper

Resolution ~10 nm < 30nm 250 nm

Stitching < 50 nm < 350 nm 40 nm

Wafer size 100 mm 100-200mm 100-200 mm

Wafer flatness Simular 2 x CD Simular

Active area - 25 x 25 mm2 22 x 22 mm2

Capacity < 0.1 w/h 1-4 w/h (manual loading)*

100 w/h

Mask/template cost

- ~ $ 7k ~ $ 1-2k

* Throughput can be improved through installation of a automatic wafer loading system or through using the industrial imprio300 tool (our imprio100 is used for process development purposes)


1 - Cleaned Wafer

TYPICAL FABRICATION PROCESS FOR J-FIL & METAL LIFT-OFF


2 – Spin coat and bake adhesion/planarization/transfer-layer



3 – J-FIL imprint of Si containing resist



4 – Etch-back of imprint resist



5 – Dry develop to produce undercut



6 – PVD of metal



7 – Lift-off of all polymers and excess metal



FIB-SEM CROSS-SECTION BEFORE LIFT-OFF

5 nm Ti + 65 nm Al


Green is stamp protrusion and metal in final device

TYPICAL NIL TEMPLATE

200 nm lines

346 nm lines and spaces

346 nm lines and spaces

2.32 µm lines 1.25 µm spaces

Fabrication results

4” wafer with SAW resonators

SAW resonators on Langasite

1.5 mm Design: 346nm/346nm Template: 333.2/- Result: 355nm/335nm (+/-5nm) 5 nm Ti + 65 nm Al

500 µm

100 µm

Green is the stamp protrusion and in the end of the process the metal structures

Delay line devices

Design: 346nm/346nm Template: 333.2/- Result: 355nm/335nm (+/-5nm)

(5 nm Ti + 65 nm Al)

Metal IDTs on LiNb

100 nm lines (5 nm Ti + 65 nm Al) and spaces on LiNbO3

5 nm Ti / 40 nm Au on Si

Optical structures & lines

27

29

31

33

35

37

39

41

4.4010E+08 4.4015E+08 4.4020E+08 4.4025E+08 4.4030E+08 4.4035E+08

Ma

gn

itu

de

(arb

.)

Frequency (Hz)

Resonant curves of 5 SAW resonators on same wafer

3

20

23

26

43

Quartz resonator results

13 kHz

Q factor = 10000 with pure Al electrodes

AFM scan of 100nm thick Al IDT

In-house J-FIL templates

65mm2 Quartz block with 13mm x 13mm mesa area


30 nm lines



40 nm dots

PVD metallization optimization

Variation = 2.95 nm

Rotating plate with up to 12 wafers

Uniformity shield

Pocket with metal

Metal radiation

Cryofox with optimized shield

Variation = 2.95 nm Variation = 1.55 nm

Standard Shield Optimized Shield

GOAL = 0.5 nm

Metal lift-off of metal lines, CD > 30 nm Al Ti/Pt Ni AlCu (coming soon)

Small (<100 nm) and large (mm’s) features in same process

Metal thickness < 160 nm for 100 nm lines, (<1:1.5)

High uniformity batch metallization process to reduce fabrication tolerances

High fidelity + thickness variation control of IDTs result in low fabrication tolerances Various substrate materials:

Si ( > 95% yield) Quartz ( > 95% yield) Lithium Niobate ( > 95% yield) Langasite ( ~ 90% yield – surface polishing issues)

DTI can perform both J-FIL template fabrication & low /medium volume production

Template fabrication : ~ 4weeks ($7000 - $10000) Wafer throughput ~ 10-20 wafers /week (manual wafer loader)

DTI results with J-FIL

Thank You!

Documents

Zachary J. Davis, Senior Consultant, to J-FIL technology... · Zachary Davis, DTI Confidential IMPRIO 100 SPECS EBL J-FIL UV stepper Resolution ~10 nm < 30nm 250 nm Stitching < 50