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‘04.8
TEL : 031-777-3371~5 Fax : 031-777-3376
E-mail [email protected]
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( )
21C
, MEMS
Core-Technology
,
,

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MEMS : IT 404~5

2002 7 19

, , ,
- , 1D/2D Array(Image Sensor, Bio Sensor )
- (LED, LD )
-
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2002.10
2003.06 ( )
2003.09 iPacific & (10)
2002.11 LED, LD & T/F
2003.12 Nano
2003.03 2003 (NT ) (20)
2003.04 & (6)
2003.05 (MEMS)
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,
,
(
machine )
Thickness : 30 ( )
TTV : 1.5 ( )
Roughness : 5 ~ ()
5, 5
- Pattern Etching(Ion Milling)
( ) Ion beam etching (ABS , Mems )

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0.03~ 5.00mm
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5.
Wafer dicing
dicing
: Slicing/Dicing
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Zygo
Micro Scope
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: Wafer

Glass Wafer
(MEMS )
Quartz Wafer
( )
Ceramic Wafer
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VISION

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