Transcript

ART FILM - SILK_BOT

ART FILM - SILK_BOT

R256

VLDO

R280

R292

VIL_LDO

Q201

VIL_SD1

VIL_SD0

VIL_SD2

VFINE

R259

Q205

U205

C239

R252R257

R258

R250

R251

C238

C260C248

R295

R291

R38 Q206

U209

R290

R272R270

C257

C255

R271

J203

R216

U201

R212

C208R217 R213

R211

R210

C207

Q200

R203

R206

R209

U206

U200

C228

C201R207

R200R202

R201

C200

C230

VIL_FINEEN0

C244EN_EXT

C241

R253

R285R254

C243

R255

R336

U210

C246

TP3

C242

R334

R335

TP2C247

C259

R294

R296R293

C256

R274C258

C213

C210

R219

R218

R214

C212

R215

C211

C206

J201

C202

C229

R208

R263

R205

R204

R260R261

R224

R262

R279R264

C218

GND7

EN1

R314

R286

Q308

R317

R316

U207

LDO8

SD1

R277SD0

GND8

R278

R223

R222

R220

C215

R221

R276R275

C204

C214

C205

U202

R228

R227

C217

R225C219

SILK_BOT

J3

Q307Q306

R312

R315

R313

C245

R266

R268

LDO6 LDO7

R267R265

C220

R229

R226

J5

This document contains information considered proprietary,

and shall not be reproduced wholly or in part,

nor disclosed to others without specific written permission.

Q305

R310

R311R308

LDO5

R327

R328

R329

R331

R330

R5

SD2

J205

SHDN Q202

DESIGNER:LAKSHMI BHUJ

ODB++/GERBER:

R306

Q304Q303

R307

R309

C249

LDO3 LDO4

R325

R326

R39

R333

R332

R8

R319

R318

R7

R9

R6

SD3

J207

VIL_SD3

J1

R302

Q302

R304

R305

LDO2

R324

R322

R323

C250

U208

R321

R320

C227

R236

R239

Q203

Q301Q300

R303R300

R157R156

C113PO0

LDO0 LDO1

U104

C112

PO7

PO6PO5PO4PO3PO2PO1

U107

R143

R230

C222

C221

R237

R238

R281

R234

C225

GPIO6GPIO7

U103 C111

R161

R160

U101

Y101

C153 R301

C151

C152

C120

U100

R155

R118

R108

C115

C157

R148R100

R233

R231

U203

C226

C224

R282R235

R232

GPIO3GPIO4

GPIO5

05/08/2017

C110C118

C108

C156

U102

C155

C159

R115

C154

FB100

Q100

C129

R141 R138

C150

Q101

C134 R135

R136

R107

NIRQ

R139

R137AV_SD

IN_SD

INI2C

IN_SD3

NRST_IO

BBATT

IN_GPIOB

GPIO1GPIO2

1"

HARDWARE NAME:MAX77714_SOLDERDOWN_EVKIT_REVA

HARDWARE NUMBER:

ENGINEER:BRIAN ROSARIO

DATE:

C158

R159

R142

R158

R103

R123

R122

C114

J100

GND4

SCL

SDA

J6

GPIO0

ART FILM - FAB_DWG

ART FILM - FAB_DWG

A

REV

DATE

SHEET 1 OF 1

APPROVED

XX-XXXXXX-XX

TEMPLATE REV 1.7

FABRICATION DWG.

DRAWING NO.

TITLE:

MAX77714 EVALUATION KIT

E

SIZE

NOT TO SCALE

REVISIONS

5/08/2017

DESCRIPTION

DATE:5/08/2017

DATE:

DATE:

DATE:

RELEASE

UNLESS OTHERWISE SPECIFIED:

A

LAKSHMI

REV

(USE CHECKED ITEMS FOR TOOLING)

(USE CHECKED ITEMS FOR PLATING)

(USE CHECKED ITEMS FOR MATERIAL)

THE STARTING COPPER WEIGHT/THICKNESS CAN VARY AS LONG AS THE FINISHED COPPER

WEIGHT/THICKNESS IS NOT LESS THAN THE SPECIFIED VALUE. UNLESS OTHERWISE SPECIFIED.

100 MICRO INCHES MINIMUM OF ELECTROLESS NICKEL.

(KNOOP HARDNESS 130-200), CLASS 1 (50-100 MICRO INCHES THICK) IN ACCORDANCE WITH MIL-G-45204C.

GENERAL SURFACING REQUIREMENTS MUST MEET ANSI/IPC-A-600(CURRENT REV) SECTION 4.0,

CLASS 3 (50-100 MICROINCHES THICK) OVER ELECTRODEPOSITED NICKEL PLATE

IN ACCORDANCE WITH ANSI/IPC-A-600D, SECTION 4.0, CLASS 3 (200-600 MICROINCHES THICK).

118-236 MICRO INCHES MINIMUM OF ELECTROLESS NICKEL.

PER ARTWORK.

BASED INK PER ARTWORK.

BASED INK PER ARTWORK.

THE INFORMATION CONTAINED IN THIS DOCUMENT

IS PROPRIETARY TO MAXIM. THE INFORMATION IN

THIS DOCUMENT IS NOT TO BE SHOWN, REPRODUCED,

WITHOUT PRIOR WRITTEN PERMISSION FROM MAXIM.

OR DISCLOSED TO ANYONE OUTSIDE OF MAXIM

CHECKED BY:BRIAN

DRAWN BY:

APPR. BY:

APPR. BY:

UNLESS OTHERWISE SPECIFIED

(X) ISOLA 370HR OR EQUIVALENT

( ) ISOLA-FR408HR OR EQUIVALENT

( ) MEGTRON 6

( ) NELCO-4000-13

( ) ROGERS 4350B

( ) ROGERS 4003C

( ) OTHER ________________________

WORKMANSHIP SHALL CONFORM TO IPC-A-600, CLASS 2, CURRENT REVISIONS.

WITH FLAMMABILITY RATING OF 94V-O.

AFTER ALL LAMINATION AND PLATING PROCESSES. IT IS TO BE MEASURED FROM

TOP PCB METAL TO BOTTOM PCB METAL UNLESS OTHERWISE SPECIFIED.

BOW & TWIST SHOULD BE MEASURED PER IPC-TM-650, METHOD 2.4.22.

DRILL LOCATION AND SIZE CONTROLLED BY EXCELLON CNC DRILL FILE.

SHALL BE DETERMINED BY THESE LAYERS HAVING A CHARACTERISTIC

CONTROLLED IMPEDANCE LAYER IS FOR REFERENCE ONLY. FINAL ACCEPTANCE

IMPEDANCE OF +/-10% OHMS AS STATED IN THE LAMINATION DIAGRAM. THE

OVERALL BOARD THICKNESS IS MAINTAINED. ANY ADJUSTMENT MADE TO TRACE

VENDOR CAN MAKE ADJUSTMENTS AS LONG AS THE STATED IMPEDANCE AND

WIDTH OR SPACING MUST HAVE PRIOR WRITTEN APPROVAL FROM MAXIM.

WHERE SPACING PERMITS.

(X) NOT FILLETED

( ) FILLETED

LEGEND TO LEGEND +/- 0.007 INCHES

(X) FINISH CONDUCTOR SURFACES: IMMERSION GOLD, 3-8 MICRO INCHES OVER

(x) LEAD FREE AND RoHS COMPLIANT OR EQUIVALENT LEAD FREE PLATING

( ) ELECTODEPOSITED HARD GOLD PLATE, TYPE 1 (99.7% MIN GOLD), GRADE C

( ) FINISH CONDUCTOR SURFACES: IMMERSION GOLD, 2-5 MICRO INCHES OVER

( ) FINGERS TO BE GOLD PLATED.

( ) OTHER ________________________

MINIMUM BARREL PLATING OF .001 IN. PLATED HOLES SHALL NOT BE ROUGH OR IRREGULAR

SO AS TO HINDER PROPER SOLDER WICKING.

(REQUIRED UNLESS OTHERWISE SPECIFIED IN QUOTE)

THE PCB SHALL HAVE A VERIFICATION STAMP.

OF COMPLIANCE SHALL BE PROVIDED BY VENDOR AT TIME OF SHIPMENT.

( ) SILVER. FILL AND CAP ALL 0.XXXX INCH DRILLED VIAS.

( ) NON-CONDUCTIVE EPOXY. FILL AND CAP ALL 0.XXXX INCH DRILLED VIAS.

SURFACE. CONTACTS ARE TO BE AS FLAT AS POSSIBLE. NOT TO EXCEED +/- 0.001" OF FLATNESS.

OR OTHER DEFORMITIES THAT COULD EFFECT THE APPERANCE AND PERFORMACE OF THE CONTACT

(X) SUPPLIER MAY ADD THIEVING TO COMPENSATE FOR LOW COPPER DENSITY AREAS ON THIS DESIGN.

( ) SUPPLIER MAY NOT ADD THIEVING TO COMPENSATE FOR LOW COPPER DENSITY AREAS ON THIS DESIGN.

( ) PEMNUT TO BE INSTALLED BY SUPPLIER

( ) PEMNUT NOT TO BE INSTALLED BY SUPPLIER

1. DIMENSIONS ARE IN INCHES (EXCEPT WHERE NOTED).

MATERIAL:

2. BOARD MATERIAL:

3. THE PCB SHALL BE FABRICATED TO IPC-6012, TYPE X, CLASS 2.

4. BOARD MATERIAL & CONSTRUCTION SHALL MEET THE REQUIREMENTS OF UL796

5. OVERALL BOARD THICKNESS REFER TO LAMINATION DIAGRAM. TOLERANCE APPLIES

6. BOW & TWIST NOT TO EXCEED 0.0075 IN. (0.75%) PER LINEAR INCH.

7. PHOTO ETCH CIRCUITRY PER ENCLOSED GERBER RS274X OR ODB++ FORMAT FILE.

8. IF STATED IN THE LAMINATION DIAGRAM, THE DIELECTRIC THICKNESS OF ANY

11. FINISHED COPPER WEIGHT/THICKNESS:

(X) REFER TO LAMINATION DIAGRAM FOR FINISHED COPPER WEIGHT/THICKNESS REQUIREMENTS.

( ) OTHER ________________________

12. CHECK ALL THAT APPLY

(x) GREEN SOLDERMASK OVER BARE COPPER/BARE GOLD (BOTH SIDES) WITH LIQUID PHOTO IMAGEABLE INK (LPI)

( ) GREEN TAIYO PSR-4000

(x) APPLY SILKSCREEN TO BOTH SIDES USING A NON-CONDUCTIVE, WHITE EPOXY

( ) APPLY SILKSCREEN TO TOP SIDE USING A NON-CONDUCTIVE, WHITE EPOXY

( ) OTHER ________________________

TOOLING:

9. ALL TRACES FILLETED OPTION TO ENHANCE RELIABILITY AT PAD JUNCTIONS

10. LAYER TO LAYER REGISTRATIONS SHALL BE WITHIN .003 INCHES.

FINISH:

13. DRILL SIZES ARE FINISHED HOLE SIZES. ALL HOLES SHALL BE LOCATED WITHIN .005 DTP.

14. CHECK ALL THAT APPLY

15. CHECK ALL THAT APPLY

16. VENDOR LOGO & DATE CODE REQUIRED IN INK ON BOTTOM SIDE ONLY. DATE CODE FORMAT MUST BE YYWW ONLY

TESTING:

17. FINAL ELECTRICAL TEST TO BE PERFORMED USING PROVIDED IPC-D-356A NETLIST OR ODB++ FORMAT FILE.

18. A TIME DOMAIN REFLECTOMETER REPORT FOR EACH IMPEDANCE CONTROLLED LAYER AND A CERTIFICATE

MISCELLANEOUS:

19. FOR BLIND AND BURIED VIA INFORMATION REFER TO DRILL CHART.

21. ALL MICRO-VIAS LESS THAN 0.006 INCHES FHS WILL BE PLATED SHUT WITH COPPER, UNLESS OTHERWISE SPECIFIED.

22. FOR VIA SIZES XX.XX INCH USE NON CONDUCTIVE VIA FILL AND CAP

23. FINISHED SURFACE CONTACTS AND FILLED VIAS TO BE FREE OF ANY PITS. SCRATCHES PROBE MARKS

24. THIEVING:

25. PEMNUT

ANGLES

NOTES:

+/-

DECIMALS

.XXX +/- .005

.XX +/- .01

SEE NOTES

SEE NOTES

FRACTIONS

+/-

MATERIAL:

FINISH:

TOLERANCES UNLESS OTHERWISE SPECIFIED

4.00

MATERIALDIELECTRIC

FOIL

ISOLA 370HR/EQUIVALENT

ISOLA 370HR/EQUIVALENT

ISOLA 370HR/EQUIVALENT

FOIL

TBD

TBD

TBD

FAB_NOTES

THICKNESS (in.)DIELECTRIC

0.062" +/-0.010"

This document contains information considered proprietary,

and shall not be reproduced wholly or in part,

nor disclosed to others without specific written permission.

DESIGNER:LAKSHMI BHUJ

ODB++/GERBER:

4.00

LAMINATION DIAGRAM

(OZ,INCH)COPPER THICKNESS

0.5 OZ,0.007"

0.5 OZ,0.007"

05/08/2017

1"

1 OZ,0.0014" MIN

1 OZ,0.0014" MIN

HARDWARE NAME:MAX77714_SOLDERDOWN_EVKIT_REVA

HARDWARE NUMBER:

ENGINEER:BRIAN ROSARIO

DATE:

<-- PCB EDGE

NAMELAYER

1 TOP

2 INTERNAL2

3 INTERNAL3

4 BOTTOM

NUMBERLAYER

THE FINISHED PCB THICKNESS TO BE:

NOTES

NOTES

NOTES

NOTES

QTY

66

QTY

36

QTY

14

QTY

873

10

37

51

3

20

4

2

2

2

PLATED

PLATED

PLATED

PLATED

PLATED

PLATED

PLATED

PLATED

PLATED

PLATED

PLATED

PLATED

PLATED

PLATED

PLATED

PLATED

ALL UNITS ARE IN MILS

ALL UNITS ARE IN MILS

ALL UNITS ARE IN MILS

ALL UNITS ARE IN MILS

NON-PLATED

DRILL CHART: TOP to INTERNAL2

DRILL CHART: TOP to INTERNAL3

DRILL CHART: TOP to BOTTOM

TOLERANCE

+0.0/-4.0

TOLERANCE

+0.0/-4.0

TOLERANCE

+0.0/-4.0

TOLERANCE

+3.0/-6.0

+3.0/-3.0

+3.0/-3.0

+3.0/-3.0

+3.0/-3.0

+3.0/-3.0

+3.0/-3.0

+3.0/-3.0

+3.0/-3.0

+3.0/-3.0

DRILL CHART: INTERNAL2 to INTERNAL3

SIZE

4.0

SIZE

4.0

SIZE

4.0

SIZE

8.0

12.0

39.4

45.3

63.0

70.9

125.0

35.4

41.3x25.6

51.2x27.6

FIGURE

FIGURE

FIGURE

FIGURE

ART FILM - MASK_TOP

ART FILM - MASK_TOP

MASK_TOP

This document contains information considered proprietary,

and shall not be reproduced wholly or in part,

nor disclosed to others without specific written permission.

DESIGNER:LAKSHMI BHUJ

ODB++/GERBER:05/08/2017

1"

HARDWARE NAME:MAX77714_SOLDERDOWN_EVKIT_REVA

HARDWARE NUMBER:

ENGINEER:BRIAN ROSARIO

DATE:

ART FILM - TOP

ART FILM - TOP

TOP

This document contains information considered proprietary,

and shall not be reproduced wholly or in part,

nor disclosed to others without specific written permission.

DESIGNER:LAKSHMI BHUJ

ODB++/GERBER:05/08/2017

1"

HARDWARE NAME:MAX77714_SOLDERDOWN_EVKIT_REVA

HARDWARE NUMBER:

ENGINEER:BRIAN ROSARIO

DATE:

ART FILM - INTERNAL2

ART FILM - INTERNAL2

INTERNAL2

This document contains information considered proprietary,

and shall not be reproduced wholly or in part,

nor disclosed to others without specific written permission.

DESIGNER:LAKSHMI BHUJ

ODB++/GERBER:05/08/2017

1"

HARDWARE NAME:MAX77714_SOLDERDOWN_EVKIT_REVA

HARDWARE NUMBER:

ENGINEER:BRIAN ROSARIO

DATE:

ART FILM - INTERNAL3

ART FILM - INTERNAL3

INTERNAL3

This document contains information considered proprietary,

and shall not be reproduced wholly or in part,

nor disclosed to others without specific written permission.

DESIGNER:LAKSHMI BHUJ

ODB++/GERBER:05/08/2017

1"

HARDWARE NAME:MAX77714_SOLDERDOWN_EVKIT_REVA

HARDWARE NUMBER:

ENGINEER:BRIAN ROSARIO

DATE:

ART FILM - BOTTOM

ART FILM - BOTTOM

BOTTOM

This document contains information considered proprietary,

and shall not be reproduced wholly or in part,

nor disclosed to others without specific written permission.

DESIGNER:LAKSHMI BHUJ

ODB++/GERBER:05/08/2017

1"

HARDWARE NAME:MAX77714_SOLDERDOWN_EVKIT_REVA

HARDWARE NUMBER:

ENGINEER:BRIAN ROSARIO

DATE:

ART FILM - SILK_TOP

ART FILM - SILK_TOP

VLDO

ELFINE

ELLDO

J208

LB 05/17

J202

ELSD0

VIL_SD1

J200

ELSD1

VFINE

J210

VIL_LDO

J203

J201

R13

C34

VIL_SD0

R12L0

C37

C41

C42

C36

VIL_SD2C40 C54

EN0 VIL_FINE

EN_EXT

TP3

TP2

IN_SDS

SD0S

SD1S

C43

C46

C55

C56

C25

C28

C10 C18

C21

C12

C13

C22

C33

C26

L1

C29

U1

C35

R40

L2

R14

C39

C38

J204 GND7

EN1

GND

INLDO01

LDO8

C1

GND6

SD1

GND1

C50

GND8

GND0

SD0

C49

C14

C15

C16

C17C23

C24

C27C31

C32C19C20

C30

Y1

C59

R15 L3

ELSD2

J5

GND

SILK_TOP

J3

R3

R11VLOGIC

EN1

INLDO78

LDO7LDO6

C3 C2

GND2

SD2S

J205

R35

VLOGIC SHDN

This document contains information considered proprietary,

and shall not be reproduced wholly or in part,

nor disclosed to others without specific written permission.

SW1

INLDO2

LDO5

C4

SD2

C47

C44

C51

SHDN R36

DESIGNER:LAKSHMI BHUJ

ODB++/GERBER:

R2

Q2

SW1

INLDO46

LDO4LDO3

C5C6

REVA

SD3

C45

C48C52

J207

VIL_SD3

J1

R4

R10

EN0

SW3

INLDO35

LDO2

C7

www.maximintegrated.com

MAX77714 EVKIT

1-408-601-1000

R41

GND3

SD3S

ELSD3

J206

LDO1

C135

C8C9

PO7

PO5

PO3

PO1

IN_SD3S

R29R28 R30

R31

R32R33

GPIO5GPIO6

GPIO7

SW3

D100

R164

R162

LDO0

U108R165

R166

R163

PO6

PO4

PO2

PO0

NIRQ

AV_SD

R113

R140

IN_SD

C57

C58

SW2

IN_SD3

R24

R25

R26

R27

R17

GPIO3GPIO4

05/08/2017

+1.8V+3.3V

R109

R111

D101

D102

QSDA

R117R116

D103

SDA

SCL

R1

R34

INI2CR37

BT1

R16

BBATT

R21 R23R20 R22

GPIO1GPIO2

1"

HARDWARE NAME:MAX77714_SOLDERDOWN_EVKIT_REVA

HARDWARE NUMBER:

ENGINEER:BRIAN ROSARIO

DATE:

J101

R110

J102

GND4

R114

J100

D104

QSCL

J103

MBATT

C11

GND5

NRST_IO

J6

IN_GPIOB

C53

R18

R19

GPIO0