©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 1
22 bd Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr
Broadcom AFEM-8100 System-in-Package in the Apple iPhone 11 SeriesSP20522 – RF report by Stéphane ELISABETH
Laboratory Analysis by Nicolas RADUFE & Guillaume CHEVALIERMarch 2020 – SAMPLE
REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT
©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 2
Table of ContentsOverview / Introduction 4
o Executive Summary
o Reverse Costing Methodology
Company Profile 8
o Broadcom
o Company Major Customers in 2019
o Filter technologies
o Apple iPhone 11 Pro Max Teardown
Market Analysis 17
o RF Components Market Forecast
o Supply Chain
Physical Analysis 22
o Summary of the Physical Analysis 23
o Module 25
Package Views & Dimensions
Package Opening:
Power amplifier, Switch, RF IC, Filters
Bloc Diagram Estimation
Package Cross-Section:
Overview, Dimensions, Substrate, Internal & External Shielding
Summary of physical data
o Power Amplifier, Switch, LNA 62
Die Views & Dimensions
Die Cross-Section
Die Process Characteristics
o Filter Dies 99
High/Mid band repartition
Dies Views, Dimensions & Opening
Dies Overview: Cap, Substrate, Cells
Die Cross-Section:
Sealing Frame, Anchor, TSV, Holes, FBAR Structure
Die Physical Data Summary
Comparison with previous Mid/High band FEM from Broadcom 134
o Package Evolution with Technology Enabler
o Package Cross-Section
o Package Integration Evolution:
Die Number, Die Distribution, EMI Shielding, Die Area, Die Cost
o Supplier Evolution: Power Amplifier, Switches
Manufacturing Process 146
o Global Overview
o Switch & matching RFIC Die Front-End Process
o Filter Die Front-End Process & Fabrication Unit
o Filter Die Front-End Process Flow
o Packaging Process & Fabrication Unit
o Packaging Process Flow
Cost Analysis 178
o Summary of the cost analysis
o Yields Explanation & Hypotheses
o PA die
Die Front-End Cost
Die front Cost per process steps
Die Wafer & Die Cost
o Switch & LNA Die
Die Front-End Cost
Die Wafer & Die Cost
o Filter die
Die Front-End Cost
Die front Cost per process steps
Die Wafer & Die Cost
o Packaged Component
Packaging Cost
Packaging Cost per process steps
Component Cost
Filter & Front-End Module Estimated Price 216
Feedbacks 220
Company services 222
©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 3
Overview / Introductiono Executive Summaryo Reverse Costing Methodologyo Glossary
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Executive Summary
This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling priceof the Broadcom AFEM-8100.
In 2019, Broadcom remains the only supplier of the same module for several versions of the latest Apple iPhone series: 11, 11Pro and 11 Pro Max. Like its predecessor, the AFEM-8092, the AFEM-8100 is a Mid- and High-Band (MB and HB) Long TermEvolution (LTE) FEM. It features several dies, including Power Amplifier (PA), Silicon-on-Insulator (SOI) Switch and Film BulkAcoustic Resonator (FBAR) Filters. The filters are still using Avago’s Microcap bonded wafer Chip-Scale Packaging (CSP)technology with Through-Silicon Vias (TSVs) enabling electrical contacts and scandium doped aluminum nitride (AlScN) as apiezoelectric material.
For this special version, Broadcom has innovated in several directions. Thanks to the double side BGA technology, thepackaging is denser and the critical master switches and Low-Noise Amplifier dies have been completely isolated from thefiltering part. In the EMI Shielding, a new integration method has allowed a huge reduction in the packaging cost. Finally, withthe latest GaAs PA technology using Flip-Chip configuration, the PA area has shrunk by 30 %. Thanks to all these innovations,Broadcom is able to supply a cost-effective new component with fewer input/output (I/O) connections.
The report contains a complete analysis of the FEM SiP, including a detailed analysis of the PA, the LNA, the filtering dies, andthe internal/external EMI shielding. The report also features a cost analysis and a price estimation of the component. Finally, italso integrates a comparison with the AFEM-8072, MB/HB LTE FEM in the Apple iPhone X and the AFEM-8092, MB/HB LTEFEM in the Apple iPhone Xs.
©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 4
Overview / Introduction
Company Profile & Supply Chain o Broadcomo Major Customer in 2019o Filter technologyo Apple iPhone 11 Pro Max
Teardown
Market Analysis
Physical Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Broadcom Major Customers in 2019Extracted from RF Front-End Module Comparison 2020 – Vol 1.
©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 5
Overview / Introduction
Company Profile & Supply Chain o Broadcomo Major Customer in 2019o Filter technologyo Apple iPhone 11 Pro Max
Teardown
Market Analysis
Physical Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Apple iPhone 11 Pro Max Teardown
©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 6
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Summaryo Package Assembly
o Views & Dimensionso Opening & Overviewo Bloc Diagramo Cross-Section
o Power Amplifier Analysiso Switch Analysiso LNA Analysiso Filter Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Summary of the Physical Analysis
©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 7
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Summaryo Package Assembly
o Views & Dimensionso Opening & Overviewo Bloc Diagramo Cross-Section
o Power Amplifier Analysiso Switch Analysiso LNA Analysiso Filter Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Package Overview
Package Opened View – Optical View©2020 by System Plus Consulting
• Xxxxxx
• PA: X
• BAW Filter: XX
• Switch: X
©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 8
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Summaryo Package Assembly
o Views & Dimensionso Opening & Overviewo Bloc Diagramo Cross-Section
o Power Amplifier Analysiso Switch Analysiso LNA Analysiso Filter Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Package Overview
Package Bottom View – Optical View©2020 by System Plus Consulting
• XXX
• PMIC: X
• LNA: X
• Switch: X
©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 9
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Summaryo Package Assembly
o Views & Dimensionso Opening & Overviewo Bloc Diagramo Cross-Section
o Power Amplifier Analysiso Switch Analysiso LNA Analysiso Filter Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Component Overview – Bloc Diagram (Est.) – Rx
©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 10
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Summaryo Package Assembly
o Views & Dimensionso Opening & Overviewo Bloc Diagramo Cross-Section
o Power Amplifier Analysiso Switch Analysiso LNA Analysiso Filter Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Package Overview – Package Shielding
©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 11
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Summaryo Package Assembly
o Views & Dimensionso Opening & Overviewo Bloc Diagramo Cross-Section
o Power Amplifier Analysiso Switch Analysiso LNA Analysiso Filter Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Package Cross-Section
Package Cross-Section – Optical View©2020 by System Plus Consulting
• System in Package thickness: XXX µm
PCB substrate thickness: XXX µm
Filter dies height (without balls): XXX µm Package molding thickness: XXX µm
©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 12
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Summaryo Package Assembly
o Views & Dimensionso Opening & Overviewo Bloc Diagramo Cross-Section
o Power Amplifier Analysiso Switch Analysiso LNA Analysiso Filter Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Die Cross-Section – (Est.) HEMT Structure
©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 13
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Summaryo Package Assembly
o Views & Dimensionso Opening & Overviewo Bloc Diagramo Cross-Section
o Power Amplifier Analysiso Switch Analysiso LNA Analysiso Filter Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Die Cross-Section
• The switch dies are using SOI substrate with XX nm ofmono-cristal silicon on a XXX nm oxide BOX.
©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 14
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Summaryo Package Assembly
o Views & Dimensionso Opening & Overviewo Bloc Diagramo Cross-Section
o Power Amplifier Analysiso Switch Analysiso LNA Analysiso Filter Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Filter – Die Overview
©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 15
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Summaryo Package Assembly
o Views & Dimensionso Opening & Overviewo Bloc Diagramo Cross-Section
o Power Amplifier Analysiso Switch Analysiso LNA Analysiso Filter Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Filter – Die Overview – High-Band – SubstrateBecause of the size of the filter, we didn’t get all thesubstrate intact with the resonator.
©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 16
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Summaryo Package Assembly
o Views & Dimensionso Opening & Overviewo Bloc Diagramo Cross-Section
o Power Amplifier Analysiso Switch Analysiso LNA Analysiso Filter Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Filter – Die Cross-Section
©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 17
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparisono Evolutiono Die Number & Distributiono EMI Shieldingo Die Area and Costo Components Supply
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Package View & Dimensions – Evolution
©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 18
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparisono Evolutiono Die Number & Distributiono EMI Shieldingo Die Area and Costo Components Supply
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Package Opening – Die Number
AFEM-8072 AFEM-8092 AFEM-8100
Total Number of Dies XX +X % XX -X % XX
Power Amplifier X (XX mm²) -X % X (XX mm²) -X % X (XX mm²)
BAW Filter X (XX mm²) +X % X (XX mm²) +X % X (XX mm²)
Switch X (XX mm²) -X % X (XX mm²) +X % X (XX mm²)
RFIC X (XX mm²) +X % X (XX mm²) -X % X (XX mm²)
LNA X (XX mm²) -X % X (XX mm²) +X % X (XX mm²)
©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 19
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparisono Evolutiono Die Number & Distributiono EMI Shieldingo Die Area and Costo Components Supply
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Package Opening – EMI Shielding
AFEM-8072 AFEM-8092 AFEM-8100
Total Number of Shield Wire XX -X % XX +XX % XX
Number of Bridge Wire bond XX -X % XX +XX % XX
Number of Surrounded Wire Bond XX +X % XX -XX % -
Number of Fence Wire bond - - - +XX % XX
High-Band Area Low-Band Area Isolation
©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 20
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparisono Evolutiono Die Number & Distributiono EMI Shieldingo Die Area and Costo Components Supply
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Package Opening – Die Cost
©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 21
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparison
Manufacturing Process Flowo Summaryo PA Fabrication Unito PA Process Flowo Switch, LNA, and RFIC Process &
Fabrication Unito Filter Fabrication Unito Filter Process Flowo Packaging Fabrication Unito Packaging Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Global Overview
©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 22
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparison
Manufacturing Process Flowo Summaryo PA Fabrication Unito PA Process Flowo Switch, LNA, and RFIC Process &
Fabrication Unito Filter Fabrication Unito Filter Process Flowo Packaging Fabrication Unito Packaging Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Power Amplfier Front-End Process
©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 23
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparison
Manufacturing Process Flowo Summaryo PA Fabrication Unito PA Process Flowo Switch, LNA, and RFIC Process &
Fabrication Unito Filter Fabrication Unito Filter Process Flowo Packaging Fabrication Unito Packaging Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Power Amplifier – Process Flow (2/8)
©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 24
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparison
Manufacturing Process Flowo Summaryo PA Fabrication Unito PA Process Flowo Switch, LNA, and RFIC Process &
Fabrication Unito Filter Fabrication Unito Filter Process Flowo Packaging Fabrication Unito Packaging Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Filter Front-End Process
©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 25
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparison
Manufacturing Process Flowo Summaryo PA Fabrication Unito PA Process Flowo Switch, LNA, and RFIC Process &
Fabrication Unito Filter Fabrication Unito Filter Process Flowo Packaging Fabrication Unito Packaging Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Filters – Process Flow (1/8)
©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 26
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparison
Manufacturing Process Flowo Summaryo PA Fabrication Unito PA Process Flowo Switch, LNA, and RFIC Process &
Fabrication Unito Filter Fabrication Unito Filter Process Flowo Packaging Fabrication Unito Packaging Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Packaging Process
©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 27
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparison
Manufacturing Process Flowo Summaryo PA Fabrication Unito PA Process Flowo Switch, LNA, and RFIC Process &
Fabrication Unito Filter Fabrication Unito Filter Process Flowo Packaging Fabrication Unito Packaging Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Packaging Process Flow (1/4)
©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 28
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysiso Cost Analysis Summaryo Yields Explanation &
Hypotheseso PA Wafer and Die Costo Switch Wafer and Die Costo LNA Wafer and Die Costo Filter Wafer and Die Costo Packaging Costo Component Cost
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
PA Front-End Cost per process steps (1/3)
©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 29
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysiso Cost Analysis Summaryo Yields Explanation &
Hypotheseso PA Wafer and Die Costo Switch Wafer and Die Costo LNA Wafer and Die Costo Filter Wafer and Die Costo Packaging Costo Component Cost
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Switch #1 Front-End Cost
©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 30
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysiso Cost Analysis Summaryo Yields Explanation &
Hypotheseso PA Wafer and Die Costo Switch Wafer and Die Costo LNA Wafer and Die Costo Filter Wafer and Die Costo Packaging Costo Component Cost
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
LNA Wafer & Die Cost
©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 31
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysiso Cost Analysis Summaryo Yields Explanation &
Hypotheseso PA Wafer and Die Costo Switch Wafer and Die Costo LNA Wafer and Die Costo Filter Wafer and Die Costo Packaging Costo Component Cost
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Filter Front-End Cost
©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 32
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysiso Cost Analysis Summaryo Yields Explanation &
Hypotheseso PA Wafer and Die Costo Switch Wafer and Die Costo LNA Wafer and Die Costo Filter Wafer and Die Costo Packaging Costo Component Cost
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Component Cost
©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 33
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysiso Definition of Priceso Manufacturer Financialso Component Price
Feedbacks
Related Reports
About System Plus
Complete System Price
Broadcom AFEM-8100 System-in-Package in the Apple iPhone 11 Series
©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 34
Overview / Introduction
Company Profile & Supply Chain
Components Summary
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis
Feedbacks
Related Reports
About System Plus
Related Reports
MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT
RF• 5G’s Impact on RF Front-End Module and Connectivity for Cell phones 2019• Advanced RF System-in-Package for Cellphones 2019
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
RF & PACKAGING• RF Front-End Module Comparison 2020 – Volume 1• Qorvo QM76018 RFFEM in the Apple iPhone Xr• Broadcom AFEM-8092 System-in-Package in the Apple
iPhone Xs/Xr Series• Qualcomm’s First 5G mmWave Chipset: SDX50M and
QTM052• Murata Incredible High Performance (IHP) SAW Filter
©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 35
C o m p a nyS E RVI CES
©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 36
Overview / Introduction
Company Profile & Supply Chain
Teardown Analysis
Cost Analysis
Manufacturer Price Analysis
Feedbacks
Related Reports
About System Pluso Company serviceso Contact
Business Models Fields of Expertise
Custom Analyses(>130 analyses per year)
Reports(>60 reports per year)
Costing Tools
Trainings
©2020 by System Plus Consulting | SP20522 Broadcom AFEM-8100 SiP in the Apple iPhone 11 Series | Sample 37
Overview / Introduction
Company Profile & Supply Chain
Teardown Analysis
Cost Analysis
Manufacturer Price Analysis
Feedbacks
Related Reports
About System Pluso Company serviceso Contact
Contact
Headquarters22 bd Benoni Goullin44200 NantesFRANCE+33 2 40 18 09 [email protected]
Europe Sales OfficeLizzie LEVENEZFrankfurt am MainGERMANY+49 151 23 54 41 [email protected]
www.systemplus.fr
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