430
FUNCTION MODULES
Standard Type Toner Quantity Sensor
Part Number : ZHDA1319
< Standard type>
Applications
For color copier
For color laser printer
Characteristics Sensor output is not influenced by a color of toner and quantity of toner was detected by this sensor stably. Sensor output is analog voltage and can be gained in proportion of the toner unattached area. Nichicon can design custom-made toner quantity sensor, based on the specific demand from the customer.
For example) LED lights, the frequency and brightness can be adjusted The supported sensor output rate can be changed The sensor output values can be optionally configured
Miniaturized with high performance by COB technology. The sensor has a structure to prevent stray light and reduces error of the output. Adapted to the RoHS directive (2011/65/EU,(EU)2015/863).
The amount of attched toner above the detection was measured by this sensor. Usefull for
color copier and color laser printer.
Dimensions (Top mount connector)
2-φ3.5
0.45MAX.
(0.6) 35
22±0.1
14±0.20.2MIN.
36 MIN.
3±0.210
62±0.5
① ④
(7)C
(7) (3)
0.1 AA
3(+0.1/-0)
11.6(15.7)
(7.1)
(1.7)
(7)
311
(13)
C
25
(10)
(4)
(3.44)
(7)
B
B
1132
10
3 3
19.00018.948(19h9)
3.0253.00(3H9)
3.0253.00(3H9)
(Height of assembly compornents) 3MAX.
(Rear view)
(Front view)
BM04B-CZSS-TF(Top Assembly Type by JST)
431
FUNCTION MODULES
(Side mount connector)
(Thin form side mount connector)
2-φ3.5
35
22±0.1
14±0.20.2MIN.
40 MIN.
3±0.210
62±0.5
①
④
(7)C
(7) (3)
0.1 A11
(13)
C
25
(10)
(4)
(3.44)
(7)
B
B
1132
10
3 319.00018.948(19h9)
3.0253.00(3H9)
3.0253.00(3H9)
0.45MAX.
A
11.6(11.5)
(2.9)
3
(0.5)
①④
3(+0.1/-0)
(7)
(0.5)
(Rear view)
(Front view)
(Height of assembly compornents) 3MAX.
SM04B-SRSS-TB(Thin form Side Assembly Type by JST)
2-φ3.5
35
22±0.1
14±0.20.2MIN.
36 MIN.
3±0.210
62±0.5
(7)C
(7) (3)
0.1 A11
(13)
C
25
(10)
(4)
(3.44)
(7)
B
B
1132
10
3 3
19.00018.948(19h9)
3.0253.00(3H9)
3.0253.00(3H9)
(13.3)
④ ①
0.45MAX.
A
11.6
(4.7)
3 3(+0.1/-0)
(7)
(1.5)(1.5)
(Rear view)
(Front view)
(Height of assembly compornents) 3MAX.
SM04B-CZSS-TB(Side Assembly Type by JST)
432
0.45MAX.
(2.3) 35
(16.5)
14±0.2
3±0.210
50±0.4
① ⑤
(7) (7) (3)
A3(+0.1/-0)
11.6(13.3)
(4.7)
(0.8)
(7)
311
(13)
C
25
(10)
(4)
(3.44)
(7)
B
B
1132
10
3 319.00018.948(19h9)
3.025
3.00(3H9)3.0253.00(3H9)
(8.65)
36
0.1 A
C
2-φ3.5
(Front view)
(Rear view)
(Height of assembly compornents) 3MAX.
53398-0571(Top Assembly Type by molex)
FUNCTION MODULES
Part Number : ZHDA1350R
< Low price version>
Characteristics Low price version has the same performance as Standard type, and the cost is low. Sensor outputs are analog voltage separates P-polarized and S-polarized. Sensor outputs are not influenced by a color of toner and quantity of toner was
detected by this sensor stably. By calculating sensor output P voltage and S voltage ,can be gained in proportion of the toner unattached area.
Nichicon can design custom-made toner quantity sensor, based on the specific demand from the customer.
For example) The supported sensor output rate can be changed The sensor output values can be optionally configured LED lights, the frequency and brightness can be adjusted
Miniaturized with high performance by COB technology. The sensor has a structure to prevent stray light and reduces error of the output. Adapted to the RoHS directive (2011 /65/EU,(EU)2015/863).
Dimensions(Top mount connector)
433
FUNCTION MODULES
Sensor output, toner quantity characteristics (example)6.0
5.0
4.0
3.0
2.0
1.0
0.0
0.00 2.00 4.00
Toner quantity (g/m2)
6.00 8.00 10.00
Sen
sor
outp
ut (
V)
Absolute maximum ratings (Ta : 25°C) Item Symbol Range Unit Supply voltege Vcc 0 to + 5.5 V Operating temperature Topr 0 to + 55 °C
Strage temperature Tstg -20 to + 70 °C
Recommendation operating conditions Item Symbol Range Unit
Supply voltege Vcc +5.0 ± 0.1 V
Detection distance Leng 6.5 to 7.5 mm
LED properties
Radiation frequency( lf = 20mA )
Peak radiation frequency( lf = 20mA )
619 to 629 nm
631 nm
Item Symbol Range Unit
LED properties can be altered upon request.
When setting each color of toner, regardless of the color it is possible to adjust to closely similar properties.
Low price version obtains the characteristics of the graph by calculating the output P voltage and the S voltage.
434
FUNCTION MODULES
Standard Type DC-DC Converter (1.5W 3W)
SIP type is resin coating for small space, and DIP type is resin case, steer cover and resin coating for low profile application.
Characteristics
Specification
(1) Thin and lightweight(2) Excellent heat radiation and miniaturization due to alumina substrate(3) Excellent isolation ability between input and output(4) No attachment necessary(5) Circuit with built-in excess current protection(6) Adapted to the RoHS directive (2011/65/EU,(EU)2015/863)
Output ToleranceOver Current ProtectionWithstanding Voltage
±5%Functions at 105% or more of the rated output current Automatically restoredBetween input and output AC500V for 1minute 5mA
:::
Insulation Resistance
Operating Temperature/HumidityStorage Temperature/Humidity
Between input and output terminals DC500V, more than 100MΩ(25˚C 70%)-10 to +71˚C 20 to 95%RH (No dewdrops)-40 to +85˚C 20 to 95%RH (No dewdrops)
:
::
OutputPower Input Voltage
OutputVoltage Output Current Part Number
Style No.
B C D E
MeasurementStyleNo.
Efficie-ncy L W H S
4.5 to 7.2V
(5VTYP)
8 to 16.5V
(12VTYP)
18 to 32V
(24VTYP)
4.5 to 7.2V
(5VTYP)
8 to 16.5V
(12VTYP)
18 to 32V
(24VTYP)
4.5 to 7.2V(5VTYP)
8 to 16.5V(12VTYP)
18 to 32V(24VTYP)
4.5 to 7.2V(5VTYP)
8 to 16.5V(12VTYP)
18 to 32V(24VTYP)
5V
12V
15V
5V
12V
15V
5V
12V
15V
±12V
±15V
±12V
±15V
±12V
±15V
5V
12V
15V
5V
12V
15V
5V
12V
15V
±12V
±15V
±12V
±15V
±12V
±15V
300mA
125mA
100mA
300mA
125mA
100mA
300mA
125mA
100mA
±63mA
±50mA
±63mA
±50mA
±63mA
±50mA
600mA
250mA
200mA
600mA
250mA
200mA
600mA
250mA
200mA
±125mA
±100mA
±125mA
±100mA
±125mA
±100mA
68%
70%
71%
72%
73%
74%
73%
76%
76%
70%
68%
71%
73%
72%
74%
72%
77%
77%
74%
80%
80%
76%
81%
81%
72%
75%
74%
75%
74%
76%
ZHRM1R50505
0512
0515
1205
1212
1215
2405
2412
2415
ZHRP1R50512
0515
1212
1215
2412
2415
ZHRM0300505
0512
0515
1205
1212
1215
2405
2412
2415
ZHRP0300512
0515
1212
1215
2412
2415
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
1.5W
3W
OutputPower
1.5W
B
C
D
E
B
C
D
3W
26.5 ±0.2
28.0 MAX
26.0 MAX
17.4 ±0.2
18.7 MAX
16.5 MAX
26.5 MAX
8.1 MAX
8.8 MAX
7.3 MAX
18.0 MAX
24.95 ±0.5
24.95 ±0.5
24.95 ±0.5
T=10.5MAX. (Single Output)
T= 9.0MAX. (Double Output)
34.5 ±0.2
36.0 MAX
34.0 MAX
24.7 ±0.2
26.0 MAX
23.5 MAX
8.8 MAX
9.5 MAX
7.5 MAX
32.95 ±0.5
32.95 ±0.5
32.95 ±0.5
: Style code Except : Accept an order
435
FUNCTION MODULES
2.5
4±
0.2
0.5
±0
.1
L
S
W
H =3.7±0.7
1
2
10
9
8
7
6
0.25±0.1
4
5
A
Enlarged figure of"A" part.
H
2.5
4±
0.2
0.5
±0
.1
S
0.25±0.1
H =3.7±0.7
Enlarged figure of"A" part.
H
L
W
1
2
10
9
8
7
6
4
5
A
=3
.7±
0.7
2.54±0.21 2 3 4 7 8 9
0.5±0.1 0.25±0.1
Enlarged figure of"A" part.
H
A
W T
H
Phenol ResinCoating
L
W
1
2
16
15
11109
7
8
0.5
±0
.1
S
H =3.7±0.7
0.25±0.1
A
Enlarged figure of"A" part.
H2
.54
±0
.2
L
W
2.5
4±
0.2
0.5
±0
.1
12
16
15
11
10
9
S0.25±0.1
H =3.7±0.7
Enlarged figure of"A" part.
H
78
A
Exterior and Measurement Map (unit : mm)D
IP T
ype
SIP
Typ
e
Style No.B
Resin CaseStandard Type
Style No.D
Without Coating DIP Style
Style No.E
Resin Coating Horizontal Type, Space Saver
Style No.C
Steel Cover Reduce Radiation Noise
1.5W 3W notes
436
FUNCTION MODULES
• CIRCUIT DRAWING • PART CAN BE SUBSTITUTE • CIRCUIT DRAWING SURROUNDING
• SPECIFIC PARTS SHOULD BE • DESCRIPTION OF CIRCUIT TO THE SUBJECTED CIRCUIT
USED FUNCTION • DESCRIPTION OF SYSTEM
• QUANTITY BASIS • TEST METHOD / REGULATION FUNCTION SPECIFICATION
• STRUCTURE, DIMENSION, SHAPE, • PIN LAYOUT • INFORMATION OF SPACE REQUIREMENTS • APPLICABLE SPECIFICATION (UL, SURROUNDING THE POSITION ETC.) THAT HYBRID IC WILL BE • MARKING REQUIREMENT INSTALLED
• APPEARANCE REQUIREMENT • STRUCTURE INFORMATION OF
THE WHOLE UNIT
• PURPOSE OF USE • AMBIENT CONDITIONS • WHETHER SPECIAL CONTRACT
INFORMATION IS REQUIRED
• QUALITY ASSURANCE
REQUIREMENT
• SCREENING REQUIREMENT
• ANNUAL USAGE • TARGET LIFE TIME • TOTAL USAGE OF OTHER UNIT
• MASS-PRODUCTION STARTING • DEVELOPING SCHEDULE INCLUDED
DATE • NEW PROJECT OR CURRENT • PAST USAGE
MODEL
Notice:Confidential information given by the customer will be strictlykept secret without permission in writing.
Custom-made Function ModulesNichicon can design and manufacture custom-made Function Modules with special function, shape and rational design, based on thespecific circuitry from the customer.Function Modules is available with either miniature molded semiconductors or chip-bonded semiconductors for high density mounting.
Custom-made "Function Modules" is to be designed and manufactured in the following stages:
Planning of new model
Customer
Inquiry
NichiconInquiring with circuit drawing, specific parts required, quantitybasis, delivery schedule.
Pricing, structure, shape, dimension, etc. (Generally within 5 days)
Start of designing, Information on test method/regulations function of circuit requested.
Generally 10 pcs. of samples are to be submitted.(Generally within 3 weeks)
In case samples found good, final specifications for approval are to be submitted.
Final approval on samples and specifications
Study Quotation
Designing Sample order
Trial production Sample submission
Preparationfor mass production
Approvalof specifications
Pre-production Sample deliveryfor pre-production
INDISPENSABLE INFORMATION NEEDFUL INFORMATION INFORMATION FOR A MORE STRICT ESTIMATE
CIR
CU
IT
INF
OR
MA
TIO
NS
TR
UC
TU
RE
INF
OR
MA
TIO
N
RE
LIA
BIL
ITY
RE
QU
IRE
ME
NT
INF
OR
MA
TIO
N
PR
OD
UC
TIO
N
INF
OR
MA
TIO
N
437
FUNCTION MODULES
Mount Technology Segment Purpose and means Application technology
application case : Toner Quantity Sensor application case : Power Module
Signal Line Type Thin Wire Bonding Power Line Type
High Reliability
Mounting Board
High Density Mounting
Bare-Chip Mounting
High Density Wiring Multilayer Resin Board
Metal Base Board
Dissimilar Material composite Board
Functional Board
Extremely-compact Parts
Unique Shaped Parts
Wire Bonding
Ceramic Board
0.6 0.3mm Parts
CSP, BGA
Thin Wire
Thick Wire
Thick Wire Bonding
Use Aluminum WireUse Wedge BondingSurface mounting parts mixtured is available
Max. φ500μm wire usable Pb free solder jointHigh Density Materials compliant for Large electric power (Substrate and Heatsink)
Board
wirechip
Resin Joint
resin wirechip
2mm
Enlaged joint part
Metal Board Solder Joint
wirechip
Heatsink
Resin Case
resin wirechip
Enlaged joint partEnlaged joint part