Neither the whole nor any part of the information contained in, or the product described in this manual, may be adapted or reproduced
in any material or electronic form without the prior written consent of the copyright holder. This product and its documentation are
supplied on an as-is basis and no warranty as to their suitability for any particular purpose is either made or implied. Future Technology
Devices International Ltd will not accept any claim for damages howsoever arising as a result of use or failure of this product. Your
statutory rights are not affected. This product or any variant of it is not intended for use in any medical appliance, device or system in
which the failure of the product might reasonably be expected to result in personal injury. This document provides preliminary information that may be subject to change without notice. No freedom to use patents or other intellectual property rights is implied by
the publication of this document. Future Technology Devices International Ltd, Unit 1, 2 Seaward Place, Centurion Business Park,
Glasgow G41 1HH United Kingdom. Scotland Registered Company Number: SC136640
Copyright © Bridgetek Limited 1
ME813A-WH50C Module Datasheet Version 1.0
Document Reference No.: FT_001347 Clearance No.: BRT#044
Future Technology
Devices International
Datasheet
ME813A-WH50C Display
Module
General Purpose Multi Media Controller
1 Introduction
The ME813A-WH50C is a development module for FTDI’s FT813, Embedded Video Engine (EVE)
graphics controller IC. This module behaves as an SPI slave, and requires a SPI Master for proper micro-controller interface and system integration.
The ME813A-WH50C module includes a 5.0 inch 800*480 TFT LCD panel with capacitive touch screen, and an audio amplifier to drive an 8Ω /
1W speaker.
1.1 Features
The ME813A-WH50C module utilises the FT813, FTDI’s 2nd generation EVE chip. Graphic, audio and
touch functions of the FT813 can be accessed with the ME813A-WH50C. For a full list of the FT813’s features, refer to the FT81x datasheet. The ME813A-WH50C has the following features:
Ready to use 5 inch WVGA LCD module.
Supports portrait and landscape display mode.
Bright backlight LED with dimming.
Supports capacitive touch up to 5 simultaneous points.
Supports mono audio from FT813 or external source.
On board audio amplifier for driving an external 8Ω /1W speaker.
+5.0V single power supply.
Support direct connectivity to MM900EV series modules as a display add-on.
Copyright © Bridgetek Limited 2
ME813A-WH50C Module Datasheet Version 1.0
Document Reference No.: FT_001347 Clearance No.: BRT#044
2 Ordering Information
Part No. Description
ME813A-WH50C FT813 module, with Quad SPI host connector, 5.0 inch 800*480 TFT LCD capacitive touch panel preinstalled.
CleO-SPK1 An 8Ω 1W speaker enclosure with connecting wires to ME813A-WH50C.
Table 2-1 – Ordering information
Note: This module is recommended as an accessory to the MM900EV series for development purposes.
For more information on the MM900EV series, refer to:
http://www.ftdichip.com/Products/Modules/MCUModules.htm.
Copyright © Bridgetek Limited 3
ME813A-WH50C Module Datasheet Version 1.0
Document Reference No.: FT_001347 Clearance No.: BRT#044
Table of Contents
1 Introduction .................................................................... 1
1.1 Features .................................................................................... 1
2 Ordering Information ...................................................... 2
3 Board Interface Description ............................................ 4
3.1 Board Profile ............................................................................. 4
3.2 JP1/JP2- power selection ......................................................... 4
3.3 J2/J3- SPI slave interface ......................................................... 5
3.4 CN13- Audio connector ............................................................. 5
4 Specifications .................................................................. 6
4.1 Electrical Specification .............................................................. 6
4.2 Display Specification ................................................................. 6
4.3 Optical Specification ................................................................. 7
5 Board Schematics ............................................................ 9
6 Mechanical Dimensions ................................................. 12
6.1 Module Dimensions ................................................................. 12
7 Application Example ...................................................... 14
7.1 Getting Start With an MM900EV Module .................................. 14
7.2 Hardware Setup ...................................................................... 14
7.3 Software Setup ....................................................................... 15
8 Contact Information ...................................................... 16
Appendix A – References ................................................... 17
Document References ..................................................................... 17
Acronyms and Abbreviations ........................................................... 17
Appendix B - List of Figures and Tables ............................. 18
List of Figures ................................................................................. 18
List of Tables ................................................................................... 18
Appendix C – Revision History ........................................... 19
Copyright © Bridgetek Limited 4
ME813A-WH50C Module Datasheet Version 1.0
Document Reference No.: FT_001347 Clearance No.: BRT#044
3 Board Interface Description
The ME813A-WH50C module is intended for direct use into existing applications that require a display.
This module is suitable for interfacing with an external microcontroller (e.g. MM900EV series) that has a
SPI Master channel (single, dual or quad data bus).
3.1 Board Profile
Figure 3-1 – ME813A-WH50C board connectors
3.2 JP1/JP2- power selection
JP1 and JP2 are used for power source selection. The board can take either 5V input power, or 3.3V input power. It is recommended to use a 5V power source for better power efficiency of the backlight LED and larger audio output power.
Table 3-1 shows the jumper position for power selection.
Power JP1 JP2 Description
5V_IN 1-2 (default) 1-2 (default) Select 5V single power source
3.3V_IN 2-3 2-3 Select 3.3V single power source
Table 3-1 – JP1/JP2 power selection
Copyright © Bridgetek Limited 5
ME813A-WH50C Module Datasheet Version 1.0
Document Reference No.: FT_001347 Clearance No.: BRT#044
3.3 J2/J3- SPI slave interface
J2 is an 8x2 pin header which provides power inputs and SPI slave interface signals. J3 is an alternative FPC connector which has the same power and signals as J2. An MCU board with an SPI master can easily
add a display panel by connecting to the ME813A-WH50C through J2 or J3. If an MM900EV series module is used, it can be directly plugged into J2 and secured with 4 screws at the mounting holes locations.
Pin No (J2)
Pin No (J3)
Name Type Description
1 3 MA_SCK I SPI clock input
2 8 MA_CS# I SPI chip select, active low
3 6 MA_MISO I/O SPI master input, slave output or Quad SPI
IO1
4 7 MA_MOSI I/O SPI master output, slave input or Quad SPI
IO0
5 4 MA_IO3 I/O GPIO1 or Quad SPI IO3
6 5 MA_IO2 I/O GPIO0 or Quad SPI IO2
7 - - - NC
8 - - - NC
9 1,2 3.3V_IN P 3.3V power supply input
10 15,16 MB_VBUS P 5V power supply input
11 11 GND P Ground
12 12,14 GND P Ground
13 10 MA_PD# I Power down input, active low. Connect to
3.3V if not used.
14 9 MA_INT# O Interrupts output, active low. On board
4.7kΩ pull-up to 3.3V.
15 13 AL_PWM O PWM audio output from FT813
16 - - - NC
Table 3-2 – J2 pin description
3.4 CN13- Audio connector
The ME813A-WH50C supports a mono speaker output through CN13. A PWM audio signal from the FT813 goes through a 3-stage RC filter and the audio amplifier, to drive the 8Ω speaker if connected. Maximum output power to the speaker is 1 Watt. A speaker module accessory (CleO-SPR1) is available from FTDI.
An alternative, mono line-in audio input is also provided on CN13. Users can drive in their own audio source to the on board power amplifier.
Pin No. Name Type Description
1 SP- O 8Ω speaker minus terminal
2 SP+ O 8Ω speaker plus terminal
3 AGND P Audio ground
4 AUD_IN I Audio Line IN
Table 3-3 – CN13 pin description
Copyright © Bridgetek Limited 6
ME813A-WH50C Module Datasheet Version 1.0
Document Reference No.: FT_001347 Clearance No.: BRT#044
4 Specifications
4.1 Electrical Specification
Parameter Description Minimum Typical Maximum Units Notes
VCC_5V 5V supply voltage 4.75 5.0 5.25 V J2 pin 9 or J3 pin 1,2
VCC_3.3V 3.3V supply voltage 3.0 3.3 3.6 V J2 pin 8 or J3 pin
15,16
Icc1_5V VCC=5V operating current
- 350 - mA With LCD and Backlight LED on
Icc2_5V VCC=5V operating
current
- 750 - mA Add 1W speaker
Icc1_3.3V VCC=3.3V operating current
- 460 - mA With LCD and Backlight LED on
Icc2_3.3V VCC=3.3V operating current
- 750 - mA Add 1W speaker
Voh Output Voltage High 2.4 - - V
Vol Output Voltage Low - - 0.4 V
Vih Input High Voltage 2.0 - - V
Vil Input Low Voltage - - 0.8 V
T Operating temperature
-20 - +70
Table 4-1 - Operating Voltage and Current
4.2 Display Specification
Item Spec Units Notes
LCD Type TFT active matrix -
Display Colours 16.7M -
Display active area 108.0(H) * 64.8(V) mm 5.0 inch diagonal
Number of Pixels 800(RGB)*480 dots
Pixel pitch 0.135(H) * 0.135(V) mm
Backlight 18 white LEDs -
Touch screen 5-finger capacitive touch -
Table 4-2 - LCD and Touch Information
Copyright © Bridgetek Limited 7
ME813A-WH50C Module Datasheet Version 1.0
Document Reference No.: FT_001347 Clearance No.: BRT#044
4.3 Optical Specification
Table 4-3 - 5.0” TFT Optical specification
Note: The definition of viewing angle: refer to the figures below (if looking at the reverse side of the
module the FTDI logo on the PCB is facing down).
Copyright © Bridgetek Limited 8
ME813A-WH50C Module Datasheet Version 1.0
Document Reference No.: FT_001347 Clearance No.: BRT#044
Figure 4-1 – Viewing Angle definition
Figure 4-2 – Module orientation for viewing angle
Copyright © Bridgetek Limited 9
ME813A-WH50C Module Datasheet Version 1.0
Document Reference No.: FT_001347 Clearance No.: BRT#044
5 Board Schematics
Figure 5-1 – Board Schematic (page 1)
S_IN
T#
S_P
D#
S_IO
3S
_IO
2S
_C
S#
S_M
ISO
S_S
CK
S_M
OS
I
GN
D
B0
B1
B2
B3
B4
B5
B6
B7
R0
R1
R2R3R4R5R6R7G0G1G2G3G4G5G6G7
GP
IO3
BL_PWM
PC
LK
DIS
PH
SY
NC
VS
YN
CD
E
AU
D_
PD
#
GN
DG
ND
Y1
12M
Hz
C19
18pF
C18
18pF
C13
0.1
uF
GN
D
C14
0.1
uF
D3
V3
VO
UT
1V
2
C16
0.1
uF
GN
D
D3
V3
C15
0.1
uF
R2
R3
R4
R5
R6
R7
G2
G3
G4
G5
G6
G7
B2
B3
B4
B5
B6
B7
R1
33R
R0
R1
G0
G1
B0
B1
R31
100R
PC
LK
DIS
PH
SY
NC
VS
YN
CD
E
LE
DK
LE
DA G
ND
D3
V3
11
22
33
44
55
66
77
88
99
10
10
11
11
12
12
13
13
14
14
15
15
16
16
17
17
18
18
19
19
20
20
21
21
22
22
23
23
24
24
25
25
26
26
27
27
28
28
29
29
30
30
31
31
32
32
33
33
34
34
35
35
36
36
37
37
38
38
39
39
40
40
00
00
J1 0.5
B-4
0P
BS
CT
P_S
DA
CT
P_S
CL
CT
P_IN
T#
CT
P_R
ST
#
AL
_P
WM
GN
D
C4
0.2
2uF
R15 4.7
k
C1
2.2
nF
D1
1N
4148
R21
10k/1
%
C3
0.1
uF
R22
1.6
RL
ED
Curr
ent
Sen
se R
22
95m
V/1
.6R
= 6
0m
A
LE
DK
LE
DA
BL
_P
WM
GN
DG
ND
GN
DG
ND
GN
D
L1
NR
30
15
T2
20
M
VO
UT
1
VIN
2
FB
6E
N3
AGND4
SW
7
PGND8
EP9
U1
MIC
2289-3
4Y
ML
Backli
gh
t LED
driv
er
RP
1100R
X 4
RP
2100R
X 4
RP
3100R
X 4
RP
4100R
X 4
RP
5100R
X 4
RP
6100R
X 4
RP
7100R
X 4
R2
0R
GN
D
GN
D
1 2
CN
0
HE
AD
ER
1
Op
tion
al:
Con
nct
to T
FT
pan
el m
etal
fram
e
DN
M
C2
10uF
C12
10uF
Mo
du
le:
ALL
EV
E2
an
d L
CD
In
terfa
ce
Mo
du
le:
ALL
DN
M
GN
D1
SF
2
Shie
ld F
inger
AU
DIO
_L
3
GN
D4
SC
K5
MIS
O6
MO
SI
7
CS
_N
8
GP
IO0
/IO
29
GP
IO1
/IO
310
VC
CIO
111
GP
IO2
12
INT
_N
13
PD
_N
14
X1/CLK16
X217
GND18
VCC19
VOUT1V220
VCC21
VCCIO222
CTP_RST_N23
CTP_INT_N24
CTP_SCL25
CTP_SDA26
GND27
DE
29
VS
YN
C30
HS
YN
C31
DIS
P32
PC
LK
33
B7
34
B6
35
B5
36
B4
37
B3
38
B2
39
GN
D42
G743
G644
G545
G446
G347
G248
R751
R652
R553
R454
R355
R256
GNDEP
R1
1
R0
2
GPIO315
BACKLIGHT28
B0
41
B1
40
G149
G050
U5
FT
813Q
CTP_SDACTP_SCLCTP_INT#CTP_RST#
AV
CC
FB
3
600R
/1A
GN
D
11
22
33
44
00
55
66
00
J4
CN
_6P
in_F
PC
CT
P_S
DA
CT
P_S
CL
CT
P_IN
T#
CT
P_R
ST
#
D3
V3
R65
1k
R66
1k
CTP
Con
necto
r
Copyright © Bridgetek Limited 10
ME813A-WH50C Module Datasheet Version 1.0
Document Reference No.: FT_001347 Clearance No.: BRT#044
Figure 5-2 – Board Schematic (page 2)
AL
_P
WM
R10
33
R
SH
DN
1
BY
PA
SS
2
IN+
3IN
-4
VO
+5
VD
D6
GN
D7
VO
-8
GN
D9
U3
TP
A6
20
5A
1
C11
1u
F
R51
10
k/1
%
R39
10
k/1
%
R52
36
k/1
%
R40
36
k/1
%
C20
0.4
7u
F
C21
0.2
2u
F
AG
ND
R53
47
k
R36
1k
C6
4.7
nF
R37
1k
C7
4.7
nF
R38
1k
C8
4.7
nF
AG
ND
AG
ND
AG
ND
VD
D_
AU
D
AG
ND
SP
-S
P+
124
35
OE
U2
SN
74L
VC
1G
125D
BV
R
D3
V3
GN
D
C9
0.1
uF
D3
V3
GN
D
AG
ND
C23
0.1
uF
VD
D_
AU
D
C24
10
nF
AG
ND
Max
pea
k c
urr
ent
~4
00
mA
fo
r 8
-oh
m s
pea
ker
GN
D
FB
1
60
0R
/1A
FB
2
60
0R
/1A
AG
ND
AG
ND
R50
33
R
AU
D_
PD
#
AV
CC
R58
0R
R54
0R
1234
CN
13
JST
HD
R1
X4
AG
ND
AU
D
C10
0.4
7u
F
C5
0.4
7u
F
R69
10
k/1
%
AUD_1
C22
10
uF
GN
D
MB
_V
BU
S3
V3
_IN
1
VIN
5B
S1
LX
6
FB
3
EN
4
GN
D2
U1
01
AO
Z1
28
2C
I
R12010K
C10410uF
+5
V
L1
00
22
uH
/1.4
A
D1
00
MS
S1P
3L
R122
12
.4K
/1%
R121
39
K/1
%
+3
V3
Vou
t=0
.8*
(1
+R
12
1/
R1
22
)
C114
0.1
uF
C1050.1uF
C1070.1uF
C10610uF
Au
dio
_Fil
ter a
nd
Am
plifi
er
Po
wer S
up
ply
Mo
du
le:
ALL
Mo
du
le:
: A
LL
GN
D
GN
D
LE
D1
Red
R60
47
0R
D3
V3
TP
2 SM
D
[V
in]
[V
ou
t]
1 2 3
JP1
1 2 3
JP2
MB
_V
BU
S
AV
CC
3V
3_
IN1
D3
V3
3.3
V_
IN
MB
_V
BU
S
3V
3_
IN1
AV
CC
D3
V3
Po
wer I
np
ut
Op
tion
ME8
13
AU
-WH
50
C
ME8
13
A-W
H5
0C
JP1
JP2
1-2
1-2
2-3
2-3
5V_IN
3V3_IN
(Only
)
PO
WER I
NPU
T
Copyright © Bridgetek Limited 11
ME813A-WH50C Module Datasheet Version 1.0
Document Reference No.: FT_001347 Clearance No.: BRT#044
Figure 5-3 – Board Schematic (page 3)
FB
100
600R
/1A
GN
D
MB
_V
BU
S
MB
_S
CK
MB
_M
ISO
MB
_M
OS
IM
B_IO
2M
B_IO
3
GN
DM
B_V
BU
S
R111
47k
R110
10K
D3
V3
D3
V3
MB
_V
O3V
3
GN
D
US
B_
D_
NU
SB
_D
_P
R102
12K
1%
GN
D
VCCIO7
MIS
O9
SC
K8
IO2
11
SS
0O
17
GP
IO2
15
GP
IO3
16
DP
23
RE
SE
T3
VCC5V26
GP
IO1
14
GP
IO0
13
DM
22
DC
NF
15
XS
CO
19
SS
32
IO3
12
MO
SI
10
DGND28
AGND27
DGND6
DC
NF
04
DE
BU
GG
ER
1S
TE
ST
_R
ES
ET
N2
VPP29
BC
D_D
ET
31
VOUT3V325
UGND24
UGND20
XS
CI
18
VB
US
_D
ET
30
RR
EF
21
Gn
d33
U1
00
FT
4222H
Q
GN
DG
ND
C109
27pF
C108
27pFR
117
1M
MB
_V
BU
S
D3
V3
GN
D
MB
_V
O3V
3
GN
D
C111
0.1
uF
C112
0.1
uF
MB
_V
BU
S
GN
DC110
0.1
uF
C103
0.4
7uF
Y1
00
12M
Hz
C113
4.7
uF
D3
V3
R109
10K
R112
10K
R107
10K
R101
10K
R103
33R
R104
33R
R105
33R
R106
33R
R108
33R
S_M
OS
IS
_M
ISO
S_S
CK
S_IO
3S
_IO
2
R113
0R
MB
_G
PIO
_1
MB
_P
D#
MB
_G
PIO
_2
R114
33R
S_C
S#
R115
33R
R116
33R
S_P
D#
S_IN
T#
R118
33R
MB
_G
PIO
3
DN
M
VB
US
1
D-
2
D+
3
GN
D5
ID4
CN
100
US
B M
icro
-B
FT4
22
2_
US
B T
O Q
SP
I B
RID
GE
Mo
du
le:
ME8
13
AU
-WH
50
C
GN
D
MA
_IO
3
MA
_S
CK
MA
_M
ISO
MA
_M
OS
IM
A_IO
2
MA
_C
S#
MA
_P
D#
MA
_IN
T#
AL
_P
WM
11
22
33
44
55
66
77
88
99
10
10
11
11
12
12
13
13
14
14
15
15
16
16
J2 8x2 P
in H
eader
R4
0R
MB
_V
BU
S
MA
_IO
3
MA
_S
CK
MA
_M
ISO
MA
_M
OS
I
MA
_IO
2
MA
_C
S#
MA
_P
D#
MA
_IN
T#
R45
33R
R46
33R
R47
33R
R48
33R
R49
33R
R55
33R
R56
33R
R57
33R
R444.7k
D3
V3
R4347k
R4247k
S_IN
T#
S_P
D#
S_IO
3S
_IO
2
S_C
S#
S_M
ISO
S_S
CK
S_M
OS
I
MM
90
0 I
NTER
FA
CE
MO
DEL:
ME8
13
A-W
H5
0C
GN
D1
SF
1
Shie
ld F
inger
AL_PWM
11
22
33
44
55
66
77
88
99
1010
1111
1212
1313
1414
1515
1616
J3
CN
_16pin
_F
PC
Bott
om
3.3
V_IN
GN
D
MA_IO3MA_SCK
MA_MISOMA_MOSI
MA_IO2
MA_CS#
MA_PD#MA_INT#
GL H
OS
T I
NTER
FA
CE
Mo
du
le:
ME8
13
A-W
H5
0C
3.3
V_IN
R3
0R
MB
_V
BU
S
R130
0R
Copyright © Bridgetek Limited 12
ME813A-WH50C Module Datasheet Version 1.0
Document Reference No.: FT_001347 Clearance No.: BRT#044
6 Mechanical Dimensions
6.1 Module Dimensions
All units are in millimeters (mm).
Figure 6-1 – Module Dimensions
Figure 6-2 – PCB Dimensions
Copyright © Bridgetek Limited 13
ME813A-WH50C Module Datasheet Version 1.0
Document Reference No.: FT_001347 Clearance No.: BRT#044
Figure 6-3 – Touch and Display Dimensions
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ME813A-WH50C Module Datasheet Version 1.0
Document Reference No.: FT_001347 Clearance No.: BRT#044
7 Application Example
7.1 Getting Start With an MM900EV Module
For a quick start with the ME813A-WH50C development board, connecting to an MM900EV module development platform is recommended. Demo applications are provided for users to experiment and experience the FT813 in the MM900EV+ME813A system. The following paragraphs provide a short description of the development procedures.
The MM900EV series of FT900 MCU evaluation platforms allows users to develop various applications with rich peripheral interfaces. The following MM900EV modules are compatible:
MM900EV1A: FT90x development module. Fitted with a 32-bit high performance FT900 MCU, 10/100Mbps Ethernet, USB2.0 Host, USB2.0 Device, SD3.0, Audio Codec, SPI Master Quad Interface, and 40-pin external GPIOs.
MM900EV-Lite: Lite version of the FT90x development module with a 32-bit high performance
FT900 MCU, USB2.0 Device, SD3.0, SPI Master Quad Interface, and 40-pin external GPIOs.
Detailed information of MM900EV module can be found at: http://www.ftdichip.com/Products/Modules/MCUModules.htm
7.2 Hardware Setup
Figure 7-1 shows the ME813A-WH50C module connected to an MM900EV1A module.
Figure 7-1 – ME813A-WH50C connects to MM900EV1A Module
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ME813A-WH50C Module Datasheet Version 1.0
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The ME813A-WH50C J2 pin header connects to the MM900EV module J2 dual-enter socket (See Error!
Reference source not found. for pin mapping).
Connect a USB cable or Power Supply to the MM900EV module to power the system.
Pin number ME813A J2 Signal
MM900EV J2 Signal
1 MA_SCK SPIM_SCK
2 MA_CS# SPIM_SS0
3 MA_MISO SPIM_MISO
4 MA_MOSI SPIM_MOSI
5 MA_IO3 SPIM_IO3
6 MA_IO2 SPIM_IO2
7 - DCX
8 - CS1#
9 3.3V_IN VDD_3V3
10 MB_VBUS VDD_5V
11 GND GND
12 GND GND
13 MA_PD# PWD#
14 MA_INT# INT#
15 AL_PWM AUD_LIN
16 - DISP
Table 7-1 – ME813A-WH50C J2 and MM900EV J2 pin mapping
7.3 Software Setup
Download the FT90x toolchain and sample application for ME813A-WH50C from the FTDI website at http://www.ftdichip.com/Products/ICs/FT90x.html.
Install the FT90x toolchain on a Windows PC.
Download the sample application binary file to the MM900EV module.
The sample applications will demonstrate display, touch and audio functions of the ME813A-WH50C module. Refer to http://www.ftdichip.com/Support/SoftwareExamples/FT800_Projects.htm for more details.
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ME813A-WH50C Module Datasheet Version 1.0
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8 Contact Information
Head Office – Glasgow, UK Unit 1, 2 Seaward Place, Centurion Business Park Glasgow G41 1HH United Kingdom Tel: +44 (0) 141 429 2777 Fax: +44 (0) 141 429 2758 E-mail (Sales) [email protected] E-mail (Support) [email protected] E-mail (General Enquiries) [email protected]
Branch Office – Taipei, Taiwan 2F, No. 516, Sec. 1, NeiHu Road Taipei 114 Taiwan, R.O.C. Tel: +886 (0) 2 8797 1330 Fax: +886 (0) 2 8751 9737 E-mail (Sales) [email protected] E-mail (Support) [email protected] E-mail (General Enquiries) [email protected]
Branch Office – Tigard, Oregon, USA 7130 SW Fir Loop Tigard, OR 97223 USA Tel: +1 (503) 547 0988 Fax: +1 (503) 547 0987 E-Mail (Sales) [email protected] E-Mail (Support) [email protected] E-Mail (General Enquiries) [email protected]
Branch Office – Shanghai, China Room 1103, No. 666 West Huaihai Road, Changning District Shanghai, 200052 China Tel: +86 21 62351596 Fax: +86 21 62351595 E-mail (Sales) [email protected] E-mail (Support) [email protected] E-mail (General Enquiries) [email protected]
Web Site http://www.ftdichip.com
Distributor and Sales Representatives
Please visit the Sales Network page of the FTDI Web site for the contact details of our distributor(s) and sales representative(s) in your country.
System and equipment manufacturers and designers are responsible to ensure that their systems, and any Future Technology Devices International Ltd (FTDI) devices incorporated in their systems, meet all applicable safety, regulatory and system-level
performance requirements. All application-related information in this document (including application descriptions, suggested
FTDI devices and other materials) is provided for reference only. While FTDI has taken care to assure it is accurate, this
information is subject to customer confirmation, and FTDI disclaims all liability for system designs and for any applications
assistance provided by FTDI. Use of FTDI devices in life support and/or safety applications is entirely at the user’s risk, and the
user agrees to defend, indemnify and hold harmless FTDI from any and all damages, claims, suits or expense resulting from
such use. This document is subject to change without notice. No freedom to use patents or other intellectual property rights is
implied by the publication of this document. Neither the whole nor any part of the information contained in, or the product
described in this document, may be adapted or reproduced in any material or electronic form without the prior written consent
of the copyright holder. Future Technology Devices International Ltd, Unit 1, 2 Seaward Place, Centurion Business Park, Glasgow G41 1HH, United Kingdom. Scotland Registered Company Number: SC136640
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ME813A-WH50C Module Datasheet Version 1.0
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Appendix A – References
Document References
For module related documentations, please refer to URL below:
FT81x datasheet: DS_FT81x
FT81x software programming guide: FT81x_Programmer_Guide
FT90x Toolchain: http://www.ftdichip.com/Firmware/FT90xToolchain.htm
FT81x sample applications: http://www.ftdichip.com/Support/SoftwareExamples/FT800_Projects.htm
Acronyms and Abbreviations
Terms Description
EVE Embedded Video Engine
IC Integrated Circuit
LCD Liquid Crystal Display
LED Light Emitting Diode
MCU Micro-Controller Unit
PC Personal Computer
PCB Printed Circuit Board
PWM Pulse Width Modulation
SPI Serial Peripheral Interface
TFT Thin Film Transistor
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ME813A-WH50C Module Datasheet Version 1.0
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Appendix B - List of Figures and Tables
List of Figures
Figure 3-1 – ME813A-WH50C board connectors ................................................................................ 4
Figure 4-1 – Viewing Angle definition .............................................................................................. 8
Figure 4-2 – Module orientation for viewing angle ............................................................................. 8
Figure 5-1 – Board Schematic (page 1) ........................................................................................... 9
Figure 5-2 – Board Schematic (page 2) ......................................................................................... 10
Figure 5-3 – Board Schematic (page 3) ......................................................................................... 11
Figure 6-1 – Module Dimensions ................................................................................................... 12
Figure 6-2 – PCB Dimensions ....................................................................................................... 12
Figure 6-3 – Touch and Display Dimensions ................................................................................... 13
Figure 7-1 – ME813A-WH50C connects to MM900EV1A Module ......................................................... 14
List of Tables
Table 2-1 – Ordering information .................................................................................................... 2
Table 3-1 – JP1/JP2 power selection ................................................................................................ 4
Table 3-2 – J2 pin description......................................................................................................... 5
Table 3-3 – CN13 pin description .................................................................................................... 5
Table 4-1 - Operating Voltage and Current ....................................................................................... 6
Table 4-2 - LCD and Touch Information ........................................................................................... 6
Table 4-3 - 5.0” TFT Optical specification ......................................................................................... 7
Table 7-1 – ME813A-WH50C J2 and MM900EV J2 pin mapping ......................................................... 15
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ME813A-WH50C Module Datasheet Version 1.0
Document Reference No.: FT_001347 Clearance No.: BRT#044
Appendix C – Revision History
Document Title: ME813A-WH50C Module
Document Reference No.: FT_001347
Clearance No.: BRT#044
Product Page: http://www.ftdichip.com/eve.htm
Document Feedback: Send Feedback
Revision Changes Date
1.0 Initial Release 2016-10-18
Mouser Electronics
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