High performance nano colloid palladium andits application in horizontal PTH
Journal of the HKPCA / 2017 / Summer / Issue No. 64
12 Technical Paper
Abstract: A new kind of nano colloid palladium activator with new
additive system and improved synthesis process is introduced here.
The activator is applied to horizontal electroless plating process of
PCB, compared with the traditional activated palladium system has
high reactivity, excellent bath stability, low cost, stable back light
performance and strong process capability. It can effectively
improve and enhance the electroless copper plating binding force,
which is suitable for the horizonal electroless copper plating process,
with intelligent automation transformation demand.
(Electroless copper plating)
(Plating Through Hole)
Cu Cu PCB
PCB
2015 5 8
2025
80
PCB
2013
14.1% 2015 16% PCB
2 +
[1 ]
2.1
Sn/Pd
40-100:1
Step 1: Pd + Sn + 6Cl [PdSn ]Cl
Step 2: [PdSn ]Cl Pd + Sn + Sn + 6Cl
-
[2 ]
2 + 2 + -
4 + 2 + -
2 6
2 6
[3 ,4 ]
0 2 + - 2 X- 2 +
2.2
{(Pd )m nSn 2(n+x)Cl } XSn - RXOH
1
www.hkpca.org
13Technical Paper
(a)
(b)
Pd=100ppm SnCl2= 6g/L
2
(a)
(b)
3
7-12nm
40-90nm
Journal of the HKPCA / 2017 / Summer / Issue No. 64
14 Technical Paper
3.1
3.2
-
(AUTOLAB PGSTAT30)
-
Pt
s 6.6 7.8
7.3s 8.2s
100ml (Pd 100ppm) 100 mL
25 C 50 L/h
5
1
4
O
(
)
5*5cm
( )
a. 200ml 20ml
b. 1min
c. 100ml
DI
d. 0.4g
e. AA
3.4.1
0.2mm 0.3mm
3.3 Pd
3.4
2
2
3
3.4.2
www.hkpca.org
15Technical Paper
0.2mm
12:1
18.5/
4min
50sec
0.3mm
8:1
9.5
4
50ppm
>100ppm
0.3mm
6:1
ppm
20.2/
4min 50sec10
45
80
19.3/
4min 50sec10
Journal of the HKPCA / 2017 / Summer / Issue No. 64
16 Technical Paper
3.4.4
5
HDI 12 58 ( TCU
75/75 m,110/100 m)
(1)
µ µ
6
7
(2) IR
(3)
8 IR
9
www.hkpca.org
17Technical Paper
Journal of the HKPCA / 2017 / Summer / Issue No. 64
18 Technical Paper
(4)
10
5
50%
[1] PCB 4.0
2016 (05) 5-8
[2] PCB
2014 33 (13) 457-459
[3]
1990
[4] PCB
2014 (5) 44-47