HW-000097
Ver-G SmartMotion Hardware User Guide
InvenSense, Inc. reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
InvenSense, A TDK Group Company 1745 Technology Drive, San Jose, CA 95110 U.S.A
+1(408) 988–7339 www.invensense.com
Document Number: HW-000097 Revision: 1.0 Release Date: 04/22/2020
INTRODUCTION The DK-42688-P TDK SmartMotion Platform is a comprehensive development system for TDK InvenSense Motion Sensor devices. The platform designed around the Microchip SAMG55 MCU can be used by customers for rapid evaluation and development of InvenSense sensor-based solutions. The platform integrates an on-board Embedded Debugger so external tools are not required to program or debug with the SAMG55 MCU. Each InvenSense motion sensor has its own unique development kit.
The DK-42688-P SmartMotion platform comes with the necessary software including InvenSense Motion Link, a GUI based development tool and embedded Motion Drivers (eMD) for Invensense motion sensors.
Embedded Motion Drivers (eMD) consists of a set of APIs to configure various aspects of the platform including motion sensor parameters such as full-scale range (FSR), output data rate (ODR), low-power or low-noise mode, and sensor interface to host (I2C, SPI). eMDs will also provide the following enhanced motion functions that run on the MCU:
• Sensor Fusion
• Accelerometer and Gyroscope Calibration
• Android Functions: Game Rotation Vector, Gravity, Linear Acceleration
Motion Link is a GUI based development tool included with the platform. It can be used to capture and visualize the sensor data from the motion sensor.
The platform supports Atmel Studio and is compatible with Microchip Xplained Pro Extension boards. Xplained Pro extension series evaluation kits offer additional peripherals to extend the features of the board and ease the development of customer designs.
Figure 1. DK-42688-P SmartMotion Development Kit
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Document Number: HW-000097 Revision: 1.0
CONTENTS Introduction ............................................................................................................................................................................................... 1
Contents ..................................................................................................................................................................................................... 2
Overview .................................................................................................................................................................................................... 3
Features Overview ............................................................................................................................................... 3
Platform Overview ............................................................................................................................................... 3
Hardware user guide ........................................................................................................................................... 4
System Block Diagram ......................................................................................................................................... 4
Main MCU SAMG55 resource allocation ............................................................................................................. 4
Connectors ........................................................................................................................................................... 4
TDK Sensor to SAMG55 MCU connection ............................................................................................................ 5
Magnetic sensors connection .............................................................................................................................. 5
Jumper settings .................................................................................................................................................... 6
Schematics ........................................................................................................................................................... 7
Revision History ................................................................................................................................................. 10
Declaration Disclaimer ............................................................................................................................................................................. 11
Table 1. SAMG55 Resource Allocation ....................................................................................................................................................... 4
Table 2. Connectors ................................................................................................................................................................................... 5
Table 3. Jumper Setting ............................................................................................................................................................................. 6
Figure 1. DK-42688-P SmartMotion Development Kit ............................................................................................................................... 1
Figure 2. Platform Overview ...................................................................................................................................................................... 3
Figure 3. System Block Diagram ................................................................................................................................................................. 4
Figure 4. Top View ..................................................................................................................................................................................... 7
Figure 5. Main MCU ................................................................................................................................................................................... 7
Figure 6. Embedded Debugger .................................................................................................................................................................. 8
Figure 7. Ver G. Sensor ............................................................................................................................................................................... 8
Figure 8. Ver. G PCB ................................................................................................................................................................................... 9
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Document Number: HW-000097 Revision: 1.0
OVERVIEW
FEATURES OVERVIEW
• Integrated TDK InvenSense motion sensor
• Support for a magnetic sensor with plug in daughter boards (DB).
• Microchip SAMG55 microcontroller with 512KB Flash
• On-board Embedded debugger (EDBG) for Programming and debugging
• Built in FTDI USB to UART interface for fast motion sensor data transfer.
• USB Connectors for host interface to software debug and data logging
• Board Power Supply through USB
PLATFORM OVERVIEW
DK-42688-P SmartMotion Platform is a hardware unit for TDK sensor product evaluation and algorithm software development. The platform offers flexibilities for many different application developments.
Figure 2. Platform Overview
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Document Number: HW-000097 Revision: 1.0
HARDWARE USER GUIDE
DK-42688-P SmartMotion Platform is compatible with Microchip’s SAM G55 Xplained Pro. The link to the Atmel Xplained-Pro user guide is here:
http://www.atmel.com/Images/Atmel-42389-SAM-G55-Xplained-Pro_User-Guide.pdf
SYSTEM BLOCK DIAGRAM
On board EDBG MCU AT32UC3A4256HHB-C1UR allows user to do main MCU SAMG55 debug, trace and programming without using external tools. The Figure 3 shows system block diagram.
Figure 3. System Block Diagram
MAIN MCU SAMG55 RESOURCE ALLOCATION
SAMG55 resource Usage
UART 0 (PA9/10/25/26)
The UART0 is connected to FTDI input by default. In the use case of Extension-1 on J200, the UART0 to FTDI connection can be disconnected through jumper J3.
TW6 (I2C) (PB8/9)
TDK sensor is connected to this master I2C. On board sensor slave address = 0x69. Sensors on DB and EVB have slave address = 0x68.
SPI5 (PA11/12/13/14)
The SPI5 master is connected to TDK IMU sensor. On board IMU sensor /CS = PNCS0
GPIO (INTs) PA17/18/20/30 and PB15
The GPIOs are used for sensor interrupt inputs and other intelligent functions. Referring to the table in Figure 3.
TW4 (I2C) The master I2C communicates with EDBG MCU slave I2C.
UART6 The UART6 is used for EDBG DGI-UART interface.
UART7 The UART7 is used for EDBG CDC-UART interface.
Table 1. SAMG55 Resource Allocation
CONNECTORS
Error! Reference source not found. details the DK-42688-P SmartMotion Platform connector and header reference names and descriptions.
Connector Ref Name Connector Function descriptions
CN1 (Not loaded) External TDK sensor EVB connector
CN2/CN3 Daughter board connector for Mag. sensor. I2C interface only.
CN4/CN5 (Not loaded) Daughter board connector for TDK sensor. I2C and SPI interfaces.
CN6 USB connector for FTDI USB to serial UART interface
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Document Number: HW-000097 Revision: 1.0
Connector Ref Name Connector Function descriptions
J1 Select host I2C connections, for IMU sensor and mag. sensor, or mag. Sensor only.
J2 Board power source selection.
J3 Select VDDIO voltage level, 3V0 or 1V8.
J4 Digital signal test pins
J200 (Not loaded) Extension header 1. Has same function as J200 on Microchip’s Xplained-Pro board.
J301 MCU SAMG55 USB connector
J500 EDBG MCU USB connector
SW300 User button
SW301 RESET button.
Table 2. Connectors
TDK SENSOR TO SAMG55 MCU CONNECTION
TDK ICM-42688-P sensor can be connected to SAMG55 MCU I2C or SPI.
The sensor I2C slave address is 0x68. Its SPI /CS = NPCS0.
MAGNETIC SENSORS CONNECTION
Third party magnetic sensors can be connected to the same SAMG55 MCU I2C bus with TDK sensor through DB, assuming it has a different slave address.
CN2/3 are designed for the magnetic sensor DB plug in. It supports I2C only, not SPI.
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Document Number: HW-000097 Revision: 1.0
JUMPER SETTINGS
Jumper Description
J1 J1 is used to select input source for SAMG55 master I2C. Only two jumper shunts are allowed. Jumper shunts on pin-1/2 and 3/4: ICM-42688-P IMU Sensor primary I2C is connected to SAMG55 I2C master Jumper shunts on pin-5/6 and 7/8: Magnetic Sensor I2C is connected to SAMG55 I2C master. In this configuration ICM-42688-P IMU Sensor is connected to SAMG55 SPI master.
J2 The J2 is for board power source selection. Only one jumper shunt is allowed. Jumper shunt on pin-1/2: board power is from EDBG USB on J500. Jumper shunt on pin-3/4: board power is from FTDI USB on CN6 Jumper shunt on pin-5/6: board power is from SAMG55 USB on J301
J3 J3 is for system VDDIO level selection. Jumper shunts on pin-1/2: VDDIO=3V0 Jumper shunts on pin-3/2: VDDIO=1V8
J4 J4 have digital signals as test points. Pin-1: SPI /CS Pin-2: SPI SCLK, I2C SCL Pin-3: SPI MOSI, I2C SDA Pin-4: SPI MISO, I2C AD0 Pin-5: INT1 of ICM-42688-P Pin-6: INT2 of ICM-42688-P Pin-7: GND
Table 3. Jumper Setting
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Document Number: HW-000097 Revision: 1.0
SCHEMATICS
The schematics version is Ver-G.
Figure 4. Top View
Figure 5. Main MCU
EDBG_DGI_USART_RX
PB09_TWCK6
PB07_SWCLK
PB08_TWD6
EDBG_DGI_SCL
PA02_WKUP2
PA27_UART7_RXD
SN_CS0PA06_GPIO
Title
Size Document NumberRev
Date: Sheet of
Top G
SmartMotion G, PCBA=860-80009
TDK (Invensense)1745 Technology Dr.
Custom
2 5Friday , February 07, 2020
San Jose, CA 95110 www.inv ensense.com
Phone: 408-988-7339Fax: 408-988-8104
PA20_AD3
Main MCU
1. Main MCU
TRACESWO
SWDIOSWCLK
TARGET_RESET
DGI_GPIO0
TARGET_RESET_SENSE
DGI_GPIO1DGI_GPIO2
DGI_CLK
SDASCL
PA28_UART7_TXDPA27_UART7_RXD
ID1ID4
PA12_SPI5_MISO
PA11_SPI5_NPCS0
PB08_TWD6
PA14_SPI5_CLKPA13_SPI5_MOSI
PB09_TWCK6
PA30_GPIOPA17_AD0
DGI_TXDDGI_RXD
DGI_GPIO3
PA20_AD3PA18_AD1
PB15_GPIO
PB06_SWDIO
SN_MISO/AD0
SN_SCLK/SCL
INVN Sensor
3. INVN Sensor
SN_CS0SN_SCLK/SCLSN_MOSI/SDASN_MISO/AD0
INT1INT2_FSYNC_CLKIN
AUXDAAUXCL
AK_DRDYFSYNCALARM
EDBG_DGI_SDA
PA17_AD0
TARGET_RESET
EDBG_CDC_UART_RX
J1HEADER 4X2, Male, 180D
2 4 6 8
1 3 5 7
TARGET_RESET_SENSE
ID1
PB13_USART6_CLK
PA24_WKUP11
ID4
PB14_GPIO SN_MOSI/SDA
EDBG MCU
2. EDBG MCU and PWR
TARGET_RESET_SENSE
SWDIOSWCLK
TARGET_RESETTRACESWO
EDBG_DGI_GPIO0EDBG_DGI_GPIO1EDBG_DGI_GPIO2
EDBG_DGI_USART_RXEDBG_DGI_USART_TX_
EDBG_DGI_USART_CLK_
EDBG_CDC_UART_TX_EDBG_CDC_UART_RX
ID1ID4
EDBG_DGI_SDAEDBG_DGI_SCL
EDBG_DGI_GPIO3
PB15_GPIO
PB05_TRACESWO
PA30_GPIO
PA18_AD1
TARGET_USB_N TARGET_USB_NPA20_AD3
0.1uF
C301
R3014.7K
ID1
R6 0R
UART to USB
PA18_AD1
PA29_GPIO
GND
DGI_USART
PA25_GPIO_CTS0
PA28_UART7_TXD
VDDCORE_P1V2
R2021K
R9
1K
GND
PA18_AD1
PB09_TWCK6
PA09_UART_RXD0
4.7uF
C302
R2110K
GND
PB14_GPIO
PB11_TWCK4
TARGET_USB_P TARGET_USB_P
PB08_TWD6
TARGET_RESET_SENSE
Title
Size Document NumberRev
Date: Sheet of
Main MCU G
SmartMotion G, PCBA=860-80009
TDK (Invensense)1745 Technology Dr.
Custom
3 5Friday , February 07, 2020
San Jose, CA 95110 www.inv ensense.com
Phone: 408-988-7339Fax: 408-988-8104
PA25_GPIO_CTS0
VCC_TARGET_USB_P5V0
PA00_TIOA0
PA19_AD2
PA13_SPI5_MOSI
SWCLK
VCC_P3V3
GND
PA02_WKUP2
0.1uF
C307
VCC_P3V3
PB05_TRACESWO_TDO
PB10_TWD4
PB15_GPIO
PA24_WKUP11
U300ATSAMG55J19B-AUT
VD
DIO
1
RESETN2
PB123
PA044 PA035
PA006
PA017
PA058
VD
DC
OR
E9
TEST10
XIN32/PA0711 XOUT32/PA0812
GN
D13
PB1514PB1415
PA3116
PA0617
PA1618
PA3019 PA2920 PA2821
PA1522
PA2323 PA2224 PA2125
VD
DU
SB
26
VD
DIO
27
VR
EF
P28
GN
D29
VD
DO
UT
30
VD
DIO
31
VD
DIO
32
PA1733
PA1834
PA1935
PA2036
PB0037
PB0138
PB0239
PB0340
PA1441 PA1342 PA1243 PA1144
VD
DC
OR
E45
PB1046
PB1147
PA1048 PA0949
TDO/TRACESWO/PB0550
PA2751 PA2652
GN
D53
TMS/SWDIO/PB0654TCK/SWCLK/PB0755
PA2556
PB1357
PA2458
PB0859
PB0960
PA0261
TDI/PB0462
JTAGSEL63
VD
DIO
64
PB01_UART_RXD6
PA23_TIOA1
C14
1uF
PA10_UART_TXD0
R315 0R
GND
VCC_P3V3
4.7uF
C309
9pFC400
R320
47K
0.1uF
C305
GND
PB06_SWDIO_TMS
GND
PA24_WKUP11
PA17_AD0
PA30_GPIO
DGI_RXD
PA13_SPI5_MOSI
GND
USER_BUTTON
PA06_GPIO
GND
PA16_WKUP7
{
PA30_GPIO
PA11_SPI5_NPCS0
PB07_SWCLK_TCK
PA29_GPIOGND
PB10_TWD4
VCC_P3V3
GND
TARGET_RESET
{PA27_UART7_RXD
VCC_P3V3
PB07_SWCLK_TCK
PB08_TWD6
PA17_AD0
PA18_AD1
R14
100K
PA10_UART_TXD0
SDA
PA01_TIOB0
DGI_GPIO
R3024.7K
R3004.7K
4.7uF
C308
0.1uF
C303
R31247K
R31710K
0.1uF
C310
VDDCORE_P1V2
PA11_SPI5_NPCS0
PB11_TWCK4
PA18_AD1
PA23_TIOA1
PA14_SPI5_CLK
DGI_GPIO1
PB04_GPIO_TDI
GND
PA06_GPIO
{
PA04_TWCK3
PB01_UART_RXD6
GND
PA12_SPI5_MISO
0.1uF
C314
D1
LE
D0402_R
ED
12
C13
0.1
uF
PA20_AD3
AH-32.768KDZF-TXC400
PB15_GPIO
R2 0R
{
TRACESWO
PA03_TWD3
R31130K
GND
R30439R
SW
300
SK
RA
AK
E010
1
4
2
3
VDDCORE_P1V2
GND
GND
TARGET_RESET
PB06_SWDIO_TMS
PA10_UART_TXD0
PA26_GPIO_RTS0
PA11_SPI5_NPCS0
0.1uF
C311
PA05_SPI5_NPCS1
PA28_UART7_TXD
PB15_GPIO
GND
0.1uFC312
PA16_WKUP7
PB10_TWD4
PB14_GPIO
{
PA21_USB_N
PA19_AD2
PB13_USART6_CLK
R305 1K
PA17_AD0
PB09_TWCK6
GND
TST
PB05_TRACESWO_TDO
GND
PA13_SPI5_MOSI
GND
PB11_TWCK4
PA07_XIN32
R316 0R
PA01_TIOB0
PB08_TWD6
TARGET_RESET
CN6
Conn. USB Micro AB SMT
GND5ID4DP3
VBUS1
DM2
NC
36/2
NC
47/2
NC
28/2
NC
19/2
R319
47K
J200NM HEADER 10X2
11/2
33/2
55/2
77/2
99/2
1111/2
1313/2
1515/2
1717/2
1919/2
22/2
44/2
66/2
88/2
1010/2
1212/2
1414/2
1616/2
1818/2
2020/2
C15
0.1
uF
DGI_TWI
PA26_GPIO_RTS0
C16
0.1
uF
PA27_UART7_RXD
R3 0R
PA26_GPIO_RTS0
SCL
GND
PA20_AD3
PA14_SPI5_CLK
VCC_P3V3
PA24_WKUP11
PB13_USART6_CLK
4.7uF
C304
R30810K
9pFC401
VCC_P3V3
PA02_WKUP2
J301
Conn. USB Micro AB SMT
GND5ID4DP3
VBUS1
DM2
NC
36/2
NC
47/2
NC
28/2
NC
19/2
R318
47K
R2011K
PA
08_X
OU
T32
DGI_GPIO2DGI_GPIO3
PA28_UART7_TXD
DGI_GPIO0
D300 LED0402_RED
1 2
VCC_P3V3
{
GND
CDC_UART
SW
301
SK
RA
AK
E010
1
4
2
3
PB00_UART_TXD6
PB00_UART_TXD6
SWDIO
GND
R5 0R
PA25_GPIO_CTS0
PA17_AD0
PB09_TWCK6
PA12_SPI5_MISO
R30939R
GND
GND
VCC_FTDI_USB_P5V0
U5
FT232RLTXD
1
DT
R#
2
RTS#3
VCCIO4
RXD5
RI#
6
GND7
NC
8
DS
R#
9
DC
D#
10
CTS#11
CB
US
412
CB
US
213
CB
US
314
USBDP15 USBDM16
3V3OUT17
GND18
RE
SE
T#
19
VCC20
GND21
CBUS122CBUS023
NC
24
AGND25 TEST26
OS
CI
27
OS
CO
28
PA02_WKUP2
PA27_UART7_RXD
GND
PA09_UART_RXD0
DGI_TXD
VCC_P3V3
R3034.7K
0.1uFC300
R20310K
Together w/ SPI5Sensor/DB/EVB
GND
PA22_USB_P
PA09_UART_RXD0
DGI_CLK
GND
VDDCORE_P1V2
PA05_SPI5_NPCS1
PA30_GPIO
R200100K
PA14_SPI5_CLK
USER_LED
PA00_TIOA0
R31039R
PA12_SPI5_MISO
VCC_P3V3
VCC_P3V3
VCC_P3V3
VCC_P3V3
SWD
HW-00097
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Document Number: HW-000097 Revision: 1.0
Figure 6. Embedded Debugger
Figure 7. Ver G. Sensor
GND
TARGET_RESET_SENSE
0.1uF
C504
22pFC500
R51439R
L500
BLM18PG471SN1
VCC_TARGET_USB_P5V0
4.7uFC101
R10230K
EDBG_ADC0 TARGET_RESET_SENSE
VCC_P3V3
VCC_P3V3
0.1uFC511
22pFC501
2.2uFC515
EDBG_CDC_UART_TXEDBG_CDC_UART_TX_
GND
GND
VCC_P3V3
EDBG_DGI_SCL
0.1uFC512
PB06_SWDIO
1nFC506
EDBG_DGI_USART_CLK_
GND
GND
VCC_EDBG_USB_P5V0
EDBG_DGI_GPIO3
GND
STATUS_LED_CTRL
R10018K
PB05_TRACESWO
R5041K
GND
EDBG_DGI_SDA
R506 1M
1nFC507
PB07_SWCLK
R510 330R
R5031M
3.3V linear regulator
EDBG_DGI_GPIO0
GND
TARGET_RESET
GND
EDBG_CDC_UART_RX
SWCLK
R51339R
GND
EDBG_USB_HS_N
GND
VCC_P3V3
ID_4
R5001K
U500AT32UC3A4256HHB-C1UR
PA00/PA18G8
PA01/PA17G10
PA02/PX47E1
PA03F9
PA04E9
PA05G9
PA06/PA13E8
PA07/PA19H10
PA08F8
PA09D8
PA10C10
PA11C9
PA12/PA25G7
PA14/PX11K7
PA15/PX45J7
PA16E7
PA20/PX18H9
PA21/PX22K10
PA22/PX20H6
PA23/PX46G6
PA24/PX17J10
PA26/PB05F7
PA27A2
PA28A1
PA29B4
PA30A4
PA31C2
USB_VBUSA10
DMHSA9
DPHSA8
DMFSB9
DPFSB8
USB_VBIASC7
VD
DA
NA
J6
GN
DA
NA
H8
VD
DIN
D9
VD
DC
OR
EE
10
GN
DC
OR
EF
10
VD
DIN
D10
GN
DP
LL
B10
VD
DIO
E5
VD
DIO
B5
VD
DIO
J5
VD
DIO
B6
VD
DIO
F2
VD
DIO
F6
GN
DIO
F5
GN
DIO
C3
GN
DIO
H3
GN
DIO
E2
GN
DIO
C8
GN
DIO
E6
RESET_NJ9
TMSH7TDOJ8TDIK8TCKK9
PX00G4
PX01G2
PX02G3
PX03J1
PX04H1
PX05G1
PX06F3
PX07F4
PX08E3
PX09E4
PX10D2
PX15/PX32K4
PX12D1
PX13D3
PX16/PX53D4
PX19/PX59F1
PX21H2
PX23K1
PX24J2
PX25H4
PX26J3
PX27K2
PX28K3
PX29J4
PX30G5
PX31H5
PB
00
B1
PB
01
B2
PB
02
B3
PB
03
C4
PB
04
A3
PB
06
D7
PB
07
D6
PB
08
C6
PB
09
C5
PB
10
D5
PB
11
C1
PC
00/P
X14
K5
PC
01
K6
PC
02
A5
PC
03
A6
PC
04
B7
PC
05
A7
GND
GND
R11347K
ID1
J500
Conn. USB Micro AB SMT
GND5ID4DP3
VBUS1
DM2
NC
36/2
NC
47/2
NC
28/2
NC
19/2
DGI_GPIO0
POWER_LED_CTRL
EDBG_DGI_USART_RX
EDBG_DGI_SCL
VCC_P3V3
GND
VCC_P3V3
R512 330R
R509 330R
2.2uFC514
R5051K
EDBG_DGI_USART_TX_R518 330R
DGI_GPIO1
ID_1
VCC_P3V3
GND
VCC_P3V3
EDBG_USB_FS_P
EDBG_DGI_GPIO2
GND
Power multiplexer
EDBG_DGI_USART_TX
2.2uF
C509
R502 1K
R508 330R
GND
TRACESWO
VCC_EDBG_USB_P5V0
DGI_GPIO2
TARGET_RESET
VCC_P3V3
TARGET_RESET
D500
LE
D0402_G
RE
EN
12
C10010uF
Current limiters
0.1uF
C510
EDBG_USB_FS_N
R511 330R
SWDIO
GND
GND
Title
Size Document NumberRev
Date: Sheet of
EDBG (Embedded Debugger) G
SmartMotion G, PCBA=860-80009
TDK (Invensense)1745 Technology Dr.
Custom
4 5Friday , February 07, 2020
San Jose, CA 95110 www.inv ensense.com
Phone: 408-988-7339Fax: 408-988-8104
GND
Q5002N7002DW
G1
5
S1
4D
13
S2
1
G2
2
D2
6
VCC_FTDI_USB_P5V0
EDBG_DGI_USART_CLK
J2HEADER 3X2, Male, 180D
246
135
VCC_P5V0
0.1uFC5132.2uF
C505
L501
BLM18PG471SN1
ID4
EDBG_USB_HS_P
DGI_GPIO3
R5156.81k
10pC502
R507 330R
1nFC508
U100 SPX3819R2-L/TR
EN1
NC2
VIN3
NC4
VOUT5
NC6
GND7
ADJ/BYP8
GN
D9
XC50012.0 MHz
EDBG_CDC_UART_RX
VCC_P3V3
EDBG_DGI_SDA
GND
GND
GNDGND
XO
UT
0
GND
XIN
0
EDBG_DGI_USART_RX
D502
PRTR5V0U2X
11
22
33
44
10mA @ 3.3V
D501
LE
D0402_Y
ELLO
W12
500mA
R11247K
EDBG_DGI_GPIO1
GND
EDBG Power and Status LEDs
GND
GND
C190.1uF
ALARM
AUXCL_VDDIO
VDDIO
VDDIO
GND
GND
GND
MOSI/SDA_VDDIO
MISO/AD0_VDDIO
AK_DRDY_VDDIO
GND
/CS_VDDIO
INT2_VDDIO
MISO/AD0_VDDIO
GND
SIP-3 2.54mm
J3
1 2 3
INT1_VDDIO
AK_DRDY_VDDIO
MOSI/SDA_VDDIO
C90.1uF
INT1_VDDIO
AUXDA
U1
ICM-4268x/43607
AP_AD0/AP_SDO1
RESV2
RESV3
INT14
VD
DIO
5
GN
D6
FS
YN
C7
VDD8INT29RESV10RESV11
AP
_C
S12
AP
_S
CL
/ A
P_
SC
LK
13
AP
_S
DA
/ A
P_
SD
IO/A
P_
SD
I14
INT2_VDDIO
SCLK/SCL_VDDIO
AK_DRDY_VDDIO
INT2_FSYNC_CLKIN
GND
R1 10K
MOSI/SDA_VDDIO
VCC_P3V3
SN_MISO/AD0
SN_SCLK/SCL
ALARM
AUXDA
GND
VDDIO
VDDIO
SN_CS0
R1
710K
R810K
GND
GND
VDDIO
INT1_VDDIO
AUXDA_VDDIO
R12 47K
/CS_VDDIO
SN_SCLK/SCL
U7
MAX3378EEUD
VL1
IO-VL12
IO-VL23
IO-VL34
IO-VL45
NC6
GND7
/Tri-State8NC9IO-VCC410IO-VCC311IO-VCC212IO-VCC113VCC14
/Tri-State
FSYNC_VDDIOSCLK/SCL_VDDIO
AUXDA_VDDIO
CN2
HDR 5X2, 2.54mmX2.54mm
2468
10
13579
GND
U2
IAM-20685/IIM-20670QFN24_4.5X4.5(0.5PITCH)
MOSI1
GND2
GND3
GND4
GND5
FL6
GN
D7
VD
DIO
8
MIS
O9
RE
GO
UT
10
VD
D11
FL
12
FL13GND14GND15GND16GND17RESETN18
AL
AR
M19
VP
P20
FL
21
GN
D22
nC
S23
SC
LK
24
Other Sensor DB
R410K
C10.1uF
GND
SN_CS0
SOT235TLV70218DBVT
U4
Vin1
OUT5
GND2
EN3
NC4
GND
VCC_P3V3
SN_MOSI/SDA
VCC_P3V3
U3
ICP-20100LGA10_2X2
CSB1
SCL/SCLK2
VS
S3
SD
A/S
DIO
/SD
I4
VD
D5
SDO/AD06INT7
RE
SV
8R
ES
V9
VD
DIO
10
C180.1uF
MISO/AD0_VDDIO
MISO/AD0_VDDIO
R1
810K
C60.1uF
VDDIO
AK_DRDY
INT2_VDDIO
SCLK/SCL_VDDIO
C11 0.1uF
1V8 J4
SIP7 2.54mm
1234567
R2010K
SCLK/SCL_VDDIO
R710K
AUXDA_VDDIO
R10 0R
GND
VDDIO
FSYNC_VDDIO
R19 10K
GND
INT2_VDDIO
AUXCL
VCC_P3V3
GND
GND
INT1
SCLK/SCL_VDDIO
VDDIO
C20.1uF
INT1_VDDIO
R1
610K
VCC_P3V3
VDDIO
AUXCL
/CS_VDDIO
300mA
GND
U6
MAX3378EEUD
VL1
IO-VL12
IO-VL23
IO-VL34
IO-VL45
NC6
GND7
/Tri-State8NC9IO-VCC410IO-VCC311IO-VCC212IO-VCC113VCC14
VDDIO
SN_SCLK/SCL
R11 0R
MISO/AD0_VDDIO
VCC_P5V0
AK_DRDY
VCC_P3V3
SN_MISO/AD0
GND
INT2_VDDIO
C8 0.1uF
VDDIO
C170.1uF
FSYNC
SN_MOSI/SDA
AUXCL_VDDIO
FSYNC
0.1uFC21
AUXCL_VDDIO
GND
VDDIO
MOSI/SDA_VDDIO
/CS_VDDIO
GND
GND
AUXDA_VDDIO
GND
C120.1uF
GND
CN4
HDR 5X2, 2.54mmX2.54mm
2468
10
13579
MOSI/SDA_VDDIO
VCC_P3V3
C30.1uF
GND
GND
SCLK/SCL_VDDIO
SN_MISO/AD0
FSYNC_VDDIO
/Tri-State
INT1_VDDIO
INV Sensor DB
CN3
HDR 5X2, 2.54mmX2.54mm
2468
10
13579
C7 0.1uF
VCC_P3V3
GND
AUXCL_VDDIO
GND
/CS_VDDIO
CN1
HDR 10X2, Female, RA, 2.54mmx2.54mm
135791113151719
2468
101214161820
CN5
HDR 5X2, 2.54mmX2.54mm
2468
10
13579
1uFC22
VCC_P3V3
GND
VCC_P3V3
MOSI/SDA_VDDIOU8
MAX3378EEUD
VL1
IO-VL12
IO-VL23
IO-VL34
IO-VL45
NC6
GND7
/Tri-State8NC9IO-VCC410IO-VCC311IO-VCC212IO-VCC113VCC14
SN_CS0
INT1
GND
SN_MOSI/SDA
VCC_P3V3
GND
/Tri-State
INT2_FSYNC_CLKIN
Title
Size Document NumberRev
Date: Sheet of
TDK (InvenSense Sensor) G
SmartMotion G, PCBA=860-80009
TDK (Invensense)1745 Technology Dr.
Custom
5 5Sunday , February 09, 2020
San Jose, CA 95110 www.inv ensense.com
Phone: 408-988-7339Fax: 408-988-8104
/CS_VDDIO
MOSI/SDA_VDDIO
INT1_VDDIO
C201uF
FSYNC_VDDIO
GND
C100.1uF
VCC_P3V3
1V8
EVB Connector
SCLK/SCL_VDDIO
MISO/AD0_VDDIO
HW-00097
Page 9 of 11
Document Number: HW-000097 Revision: 1.0
Board PCB
Figure 8. Ver. G PCB
HW-00097
Page 10 of 11
Document Number: HW-000097 Revision: 1.0
REVISION HISTORY
REVISION DATE REVISION DESCRIPTION
04/22/2020 1.0 Initial Release
HW-00097
Page 11 of 11
Document Number: HW-000097 Revision: 1.0
DECLARATION DISCLAIMER InvenSense believes the environmental and other compliance information given in this document to be correct but cannot guarantee accuracy or completeness. Conformity documents substantiating the specifications and component characteristics are on file. InvenSense subcontracts manufacturing, and the information contained herein is based on data received from vendors and suppliers, which has not been validated by InvenSense.
This information furnished by InvenSense, Inc. (“InvenSense”) is believed to be accurate and reliable. However, no responsibility is assumed by InvenSense for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications are subject to change without notice. InvenSense reserves the right to make changes to this product, including its circuits and software, in order to improve its design and/or performance, without prior notice. InvenSense makes no warranties, neither expressed nor implied, regarding the information and specifications contained in this document. InvenSense assumes no responsibility for any claims or damages arising from information contained in this document, or from the use of products and services detailed therein. This includes, but is not limited to, claims or damages based on the infringement of patents, copyrights, mask work and/or other intellectual property rights.
Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by implication or otherwise under any patent or patent rights of InvenSense. This publication supersedes and replaces all information previously supplied. Trademarks that are registered trademarks are the property of their respective companies. InvenSense sensors should not be used or sold in the development, storage, production or utilization of any conventional or mass-destructive weapons or for any other weapons or life threatening applications, as well as in any other life critical applications such as medical equipment, transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime prevention equipment.
©2017 InvenSense. All rights reserved. InvenSense, MotionTracking, MotionProcessing, MotionProcessor, MotionFusion, MotionApps, DMP, AAR, and the InvenSense logo are trademarks of InvenSense, Inc. The TDK logo is a trademark of TDK Corporation. Other company and product names may be trademarks of the respective companies with which they are associated.
©2017 InvenSense. All rights reserved.