Ronald Lipton PMG June 7 2005
Layer 0 Status
• 48 modules, 96 SVX4 readout chips 6-fold symmetry• 8 module types different in sensor and analog cable length
Ronald Lipton PMG June 7 2005
L0 Status
• Layer 0 consists of:– 48 sensor/analog cable/readout
modules of 8 types• 7 and 12 cm sensors• x 4 analog cable lengths• SVX4 readout chips, BeO hybrids• Digital jumper cables
– Carbon Fiber Support structure– Readout Components
• Junction cards/twisted pair cables/adapter cards
– Installation components• Supports attached to the Run2a
SMT structure• Tooling to install and align Layer 0
and extract the Run2a beampipe
hybrid
Analogcable
SVX4
sensor
PitchAdapter
Ronald Lipton PMG June 7 2005
Module Quality
0
2
4
6
8
10
12
14
16
010
020
030
040
050
060
070
080
090
010
00
Current (na)
Mo
du
les
71 MicronModules
0
5
10
15
20
25
30
Bad Channels
Mo
du
les 71 Micron
Modules
All modules are built • 8 of each type (6 needed)• Require:
• <1.5 mA current• no pinholes• <4 bad or noisy channels
• Have one good spare for each type (one marginal)
Ronald Lipton PMG June 7 2005
Component Status
• Modules – done
• Digital jumper cables – done (spares still being assembled at KU)
• Carbon Fiber Support structure – done
• Readout Components
– Junction cards – done
– Twisted pair cables – done
– Adapter cards – done
• Installation components being fabricated
– Supports attached to the Run2a SMT structure
– Tooling to install and align Layer 0 and extract the Run2a beampipe
Ronald Lipton PMG June 7 2005
Module Installation
• 48 to install, started June 2• Problems with the stability of the
CMM slowed the start• Two sets of fixtures. Plan to install
two modules/day (north+south). Procedure– Remove vacuum, electrical test of
previously installed modules– Glue on foam spacers– Measure locations of previously
installed sensors– Glue on next sensor/hybrid pairs– Allow to cure overnight
• Scheduled for 6 weeks– Six facets (3 inner, 3 outer)– Stop after inner layer is complete
for ~2 week electrical test– Assumes 1 additional day/facet for
rotation and alignment
Ronald Lipton PMG June 7 2005
Module Installation
Ronald Lipton PMG June 7 2005
System Tests and Grounding• Layer 0 performance depends on the grounding scheme developed for Run2b
– Carbon fiber cocured with kapton ground mesh– Low inductance connections to sensors and hybrids– Isolation of adapter card grounds to break ground loops– Minimum gap between analog cables and conductors (mesh spacers)
• A series of system tests have been performed with pre-production modules beginning last fall. – Used mechanical prototype support structure (electrically good)– Installed 10 modules (in stages).
• Good overall noise performance• Effects of digital signals on hybrid coupling to analog cable (negligible
at 396ns bandwidth)• Pedestal splitting (also negligible at 396ns bandwidth)• Verified need for low impedance grounding
– Checked that there is no effect of adding modules on adjacent facets, opposite ends
– Tested effect of a signal generator on CF support
Ronald Lipton PMG June 7 2005
Full System Tests
Two parallel efforts:
• Full system test at Sidet
– Plan to read out full Layer 0 withfinal electronics.
• 10 electrical modules already read out
– First stage inner layer only end of June
– Found timing problems – addressed by sequencer firmware changes
• Hybrid strings installed at Dzero, test crate 79
– Testing with conditions similar to operations Use real DAQ with Trigger Framework
– Preparation and exercising of online software
– See similar timing problems which still need to be addressed
– Test crate progress slow – have now resolved interference with normal data taking – should make faster progress
ungrounded0.00
10.00
20.00
30.00
40.00
50.00
60.00
70.00
80.00
0 500 1000 1500 2000 2500 3000
channel
mean sigma*10 incoh noise
Ronald Lipton PMG June 7 2005
Dzero Installation Tooling
Layer 0 is installed by bringing the detector in through the EC beam pipe, a carbon fiber installation pole is passed through the SMT, picks up Layer 0 and guides it through the SMT.
• Carbon fiber insertion tools– Half of “long tool” built, second, tapered half
should take ~2 weeks• Stages and support tables designed, stages have
been received• Alignment and coupling tooling
– Reuse parts used for aperture survey last Fall– Junction card support being fabricated– Layer 0 to SMT couplings partially
fabricated, some redesign to provide more compliance in supports
• Need to fabricate Layer 0 to insertion tool coupling sections
• Expect to begin Lab 3 tests in the beginning of July
Ronald Lipton PMG June 7 2005
Installation SequenceLong tool inserted
Through SMTLayer 0 connected
to tool
L0 partially inserted in SMT
Layer 0 in installedposition
Ronald Lipton PMG June 7 2005
Cabling
Run 2a Support
DJ cables in insertion position
DJ cables ininstalledposition
JunctionCards (12/side)
Twisted pair cables(not shown)
Ronald Lipton PMG June 7 2005
Cabling
• Preparation– Decable and remove H disks– Remove outer H disk low mass cables– Install adapter cards, LV wire gauge transitions, temperature
monitor interface cards on horseshoe• Installation
– Connect DJCs to junction card/twisted pair assembly and secure to junction card ring
• Test readout– Connect 12 temperature
monitor cables– Insert and recable inner H
disks
4 ch. Adapter Card at HorseShoe
Ronald Lipton PMG June 7 2005
Schedule Summary
Ronald Lipton PMG June 7 2005
Schedule (April 05 update)
Milestones we are watching:• Begin module installation (June 2)
– Completion of inner layer (June 21)Two weeks of testing
– Completion of module installation (July 27)Four weeks of testing
Complete and ready to move (Sept 16)• D0 Installation
– Test fixtures at Lab 3 (June 20-July 20)– Modify and complete (July 21-Aug 30)Ready for mechanical installation Aug 30
We assume that Layer 0 needs to be available at the start of the shutdown