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Micro Electro Mechanical
System [MEMS]TheTechnology
for
Everything!
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Definition
Microelectromechanicalsystems (MEMS) aremicron-size devices thatcan sense or manipulate
the physical world.
MEMS are made up ofcomponents between 10 to100 micrometers in size (i.e.0.01 to 0.1 mm) and MEMSdevices generally range insize from a 20 micrometers(20 millionth of a meter) to amillimeter (thousandth of ameter).
http://en.wikipedia.org/wiki/Meterhttp://en.wikipedia.org/wiki/Millimeterhttp://en.wikipedia.org/wiki/Millimeterhttp://en.wikipedia.org/wiki/Meter7/29/2019 MEMS technology seminar
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History of MEMS The invention of the transistor at
Bell Telephone Laboratories in1947 sparked the fast-growing
microelectronic technology
industry.
Jack Kilby of Texas Instruments
built the first integrated circuit (IC)in 1958 using germanium (Ge)
devices.
The first high-volume pressure
sensor was marketed by National
Semiconductor in 1974 - it
included a temperature controller
for constant-temperature operation.
Around 1982, the term
micromachining came into use to
designate the fabrication of moving
micromechanical parts.
First transistor
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History of MEMS
During 1987-1988, a turning point was reached in micromachining
-for the first time, techniques for integrated fabrication ofmechanisms (i.e. rigid bodies connected by joints for transmitting,
controlling, or constraining relative movement) were
demonstrated.
During a series of three separate workshops on micro dynamics
held in 1987, the term MEMS was coined.
First commercialization of MEMS occurred in the 1990s
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Components of MEMS
MEMS can includetwo or more
of the followingsubsystems: sensors,actuators, a power
supply, a centralprocessing unit(CPU)
or microprocessor,and/or acommunicationinterface.
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Materials
Silicon: The economies ofscale, ready availability ofcheap high-qualitymaterials and ability toincorporate electronicfunctionality make siliconattractive for a wide
variety of MEMSapplications.
The basic techniques forproducing all silicon basedMEMS devices aredeposition of materiallayers, patterning of these
layers by photolithographyand then etching to producethe required shapes.
Polycrystalline silicon
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Materials
Polymers
Polymers on the other hand can be produced in huge volumes, with agreat variety of material characteristics. MEMS devices can be madefrom polymers by processes such as injection moulding, embossingor stereolithography and are especially well suited to microfluidicapplications such as disposable blood testing cartridges.
Metals
Metals can also be used to create MEMS elements.While metals do not have some of the advantagesdisplayed by silicon in terms of mechanical properties,when used within their limitations, metals can exhibitvery high degrees of reliability.
Metals can be deposited by electroplating, evaporation,and sputtering processes.
Commonly used metals include gold, nickel, aluminum,
chromium, titanium, tungsten, platinum, and silver
http://en.wikipedia.org/wiki/Injection_mouldinghttp://en.wikipedia.org/wiki/Embossinghttp://en.wikipedia.org/wiki/Stereolithographyhttp://en.wikipedia.org/wiki/Microfluidichttp://en.wikipedia.org/wiki/Goldhttp://en.wikipedia.org/wiki/Nickelhttp://en.wikipedia.org/wiki/Aluminumhttp://en.wikipedia.org/wiki/Chromiumhttp://en.wikipedia.org/wiki/Titaniumhttp://en.wikipedia.org/wiki/Tungstenhttp://en.wikipedia.org/wiki/Platinumhttp://en.wikipedia.org/wiki/Silverhttp://en.wikipedia.org/wiki/Silverhttp://en.wikipedia.org/wiki/Platinumhttp://en.wikipedia.org/wiki/Tungstenhttp://en.wikipedia.org/wiki/Titaniumhttp://en.wikipedia.org/wiki/Chromiumhttp://en.wikipedia.org/wiki/Aluminumhttp://en.wikipedia.org/wiki/Nickelhttp://en.wikipedia.org/wiki/Goldhttp://en.wikipedia.org/wiki/Microfluidichttp://en.wikipedia.org/wiki/Stereolithographyhttp://en.wikipedia.org/wiki/Embossinghttp://en.wikipedia.org/wiki/Injection_moulding7/29/2019 MEMS technology seminar
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How MEMS are made?
There are threebasic buildingblocks in MEMStechnology.
A MEMS process isusually a structuredsequence of theseoperations to formactual devices.
Depositionprocesses
Photolithography
Etching processes
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Deposition processes
One of the basic building blocks inMEMS. MEMS deposition
technology can be classified in two
groups.
1. Depositions that happen because of a
chemicalreaction.
Chemical Vapor Deposition (CVD)
Electrodeposition
Epitaxy
Thermal oxidationThese processes exploit the creation of
solid materials directly from
chemical reactions in gas and/or
liquid compositions or with the
substrate material.
Chemical Vapor Deposition(CVD)
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Deposition processes
Depositions that happenbecause of a physical
reaction: Physical Vapor Deposition
(PVD)
Casting
Common for all theseprocesses are that thematerial deposited isphysically moved on to thesubstrate. In other words,there is no chemicalreaction which forms thematerial on the substrate.
Physical Vapor Deposition
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Photolithography
Lithography in
MEMS context istypically the transfer
of a pattern to a
photosensitive
material by selectiveexposure to a
radiation source
such as light.
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Photolithography
If we selectively expose a
photosensitive material
to radiation the pattern of
the radiation on the
material is transferred to
the material exposed, as
the properties of theexposed and unexposed
regions differs.
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Etching processes
In order to form a functional
MEMS structure on asubstrate, it is necessary toetch the thin filmspreviously deposited and/or
the substrate itself.
There are two basic categoriesof etching processes:
Wet Etching
Wet etching where the material
is dissolved when immersedin a chemical solution.
Wet etching of Si
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Dry Etching
Dry etching where the
material is sputtered or
dissolved using reactiveions or a vapor phase
etchant.
Types of dry etching
Non-plasma based dryetching
Plasma based dry
etching
Dry etching
S i i
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MEMS Fabrication
Techniques
Bulk Micromachining
Surface Micromachining
LIGA
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Bulk Micromachining
Bulk micromachining isthe oldest paradigm ofsilicon based MEMS.
The whole thickness of asubstrate is used forbuilding the micro-
mechanical structures. Bulk micromachining
has been essential inenabling highperformance sensors.
Can be formed by wetand dry etching of Sisubstrate.
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Surface Micromachining
It uses layers deposited
on the surface of a
substrate as the
structural materials,
rather than using thesubstrate itself.
Analog Devices have
pioneered the
industrialization of
surface micromachining
and have realized the co-
integration of MEMS
and integrated circuits.
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LIGA
LIGA, a German acronymfor (X-ray) lithography(Lithographie),Electroplating(Galvanoformung), andMolding (Abformung), is a
process in microtechnology. LIGA is a relatively
inexpensive fabricationtechnology.
LIGA is a technology
which creates small, butrelatively high aspectratio devices using x-ray lithography.
http://en.wikipedia.org/wiki/German_languagehttp://en.wikipedia.org/wiki/X-rayhttp://en.wikipedia.org/wiki/Photolithographyhttp://en.wikipedia.org/wiki/Electroplatinghttp://en.wikipedia.org/wiki/Microtechnologyhttp://en.wikipedia.org/wiki/Microtechnologyhttp://en.wikipedia.org/wiki/Electroplatinghttp://en.wikipedia.org/wiki/Photolithographyhttp://en.wikipedia.org/wiki/X-rayhttp://en.wikipedia.org/wiki/X-rayhttp://en.wikipedia.org/wiki/X-rayhttp://en.wikipedia.org/wiki/German_language7/29/2019 MEMS technology seminar
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Advantages of MEMS
pp cat ons
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pp cat ons Medical
Micro PowerGeneration
Space
Microcombustion
Automotive
Aeronautical
Communication
Chemical detection
MEMS-BASEDSTORAGE
Micro propulsion Defense
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Medical Applications Disposable Blood
Pressure SensorsMEMS transducer senses
blood pressure through
a silicon-based dielectric
gel between the sensor
and the saline solution. Drug delivery
MEMS devices can be
positioned in the
body by implantation
or by the traditional
pill.
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Medical Applications
MEMS devices firstwere used in medicalapplications in theearly 1970s
MEMS in Surgery
Tissue Sensing: This MEMSprevents cutting of thewrong tissue by sensingthe resistance of thetissue.
MEMS propeller submarine
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Micro applications
Micro Power GenerationGenerate power at the microscale to enable standalone
micro sensors and micro
actuators with wireless
communication Microcombustion
self-sustained combustion in
1 mm3 chamber. Micro Fuel Cells
fabrication of micro fuel cells
with built-in super capacitor &
PdH layer as H2 source
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Automotive Applications
Peripheralacceleration sensor
Oil conditionersensor
Corrosion sensor
GPS and inertialNavigation
Brake pressure andcontrol
Climate control
sensor Suspension control
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Aeronautical Application
Pressure Sensor Belt on
Jet Planes.
It is senses the difference
in air pressure above and
below the wings.
In engines MEMS are
mainly used as the
temperature sensor and
speed sensor.
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Communication Application
RF MEMS
They are new class of
devices and components
with low insertion loss,
high isolation, high Q,
small size, and low powerconsumption; and enable
new system capabilities.
MEMS Microphone Robust
design superior
temperature/humidity
performance
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chemical detection
MEMS fabricationof a mass sensitivegas detector allowsfor integration withCMOS circuitry,potentially leadingto fully integratedsensor arrays ofdifferent physicalmodalities fororganic vapors andbiological agents.
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MEMS-BASED STORAGE
The MEMS fabricationprocess can be integratedwith standard CMOSprocesses, opening thedoor to combineprocessing and
nonvolatile storage. MEMS-based storage
devices could beincorporated into futuredisk drives as very large(1-10 GB) non-volatile
caches.
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Space application
MEMS lowers launchcost by cutting the massof components onboardthe space vehicle.
Cosmic radiation canupset the operation of
solid state components,but MEMS structurescan withstand radiation.
MEMS can be used todesign satellites of mass1-10 kg classified asnanosatellites and 1kgsatellites aspicosatellites.
MEMS i D f
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MEMS in Defense Cyborg insects with
MEMS that will runremotely controlled
reconnaissance missionsfor the military. MEMSsensors, such as videocameras, audiomicrophones, andchemical sniffers so thatthey could move intoenemy territory inswarms to performreconnaissance missionsotherwise dangerous forsoldiers.
Smart dust: A tiny
wireless sensors(MEMS), robots anddevices, installed withwirelesscommunications, that candetect anything fromlight and temperature tovibrations.
Cyborg insect and Smart dust
MEM current c a enges
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MEM current c a enges Although some products
like pressure sensors havebeen produced for 30 years,MEMS industry in manyaspects is still a young
industry. The relatively long
development cycle for aMEMS component is also ahurdle that needs to belowered if we want morecompany to embrace the
technology. short introduction has
shown that specific trainingis needed for MEMSengineers, whereknowledge of mechanicaland material engineering
supplements electronicengineering.
Considering the smallermarket size of most MEMScomponent, standard is theonly way to bring thenumbers where unit
packaging price is reducedsubstantially.
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Future trend of MEMS Looking in the crystal ball for
MEMS market has shown to
be a deceptive work, butcurrent emerging tendenciesmay help foresee what willhappen in the medium term.
lowering manufacturing cost
will hopefully result instandardization of the MEMSinterfacing.
From the market side, MEMSwill undoubtedly invade moreand more consumer products.
A farthest opportunity forMEMS lies probably innanotechnology.
Combination withnanotechnology and
biotechnology
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Conclusion
By looking at all the
applications wecan say that
"There's plenty
of room atthe bottom"!
R f
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Reference www.memsnet.org
www.mems.sandia.gov
www.csa.com/discoveryguides/mems/overview.php
www.ee.udel.edu
clifton.mech.northwestern.edu
www.darpa.mil/MTO/MEMS
robotics.eecs.berkeley.edu/~pister/SmartDust
www.arri.uta.edu
www.eng.tau.ac www.inrf.uci.edu
www-micrel.deis.unibo.it
www. wps2a.semi.org
www.fys.uio.no
www. esamultimedia.esa.int www.matec.org
www.stormingmedia.us
www.mrs.org
www. fy.chalmers.se
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Thank you
!!!!!!