www.fairchildsemi.com
Motion SPM™ Introduction
22st, Oct., 2007
Motion Control System TeamHV Functional Power Group
Advanced Information
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Motion SPM Portfolio
SPIM(CI)
SPM2
SPM3
SPM4
SPM5
6-IGBT/FRD for inverter + Gate Driver with Protection(SC, UV) + Thermistor + 3-phase Rectifier
6-IGBT / FRD for inverter + Gate driver with Protection (SC, UV, Soft Shut down) + Thermistor + TSD function (from V4)
6-IGBT / FRD for inverter + Gate driver with Protection (SC, UV, Soft Shut down) + Built-in Bootstrap diode & TSD function (from V4)
6-IGBT / FRD for inverter + Gate driver with Protection (SC, UV, Soft Shut down) + Thermistor
6-MOSFET for inverter + Gate driver with Protection( UV) + OT,OC, FO function + Bootstrap diode (from V2)
Basic Structure< 10kW
( 600V 75A 1200V 50A )
< 5kW(600V 75A)
< 2.2kW(600V 30A)
< 1kW(600V 15A)
< 0.1kW(500V 3A)-MOSFET
SPIM (Inv)
< 10kW( 600V 100A1200V 75A )
6-IGBT/FRD for inverter + Gate Driver with Protection(SC,UV) + Thermistor
SPM6 2-MOSFET for inverter + Gate driver with Protection( OC, OT, UV) + Bootstrap diode
< 0.5kW(500V 9A, 75V 75A)
- MOSFET
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SPM5 Series
External View
SPM3 Series
44x26.8
29x1254x29.545x28
60x31
SPIM Series SPM2 Series
SPM4 SIP2 SeriesSPM4 SIP1 Series SPM6 Series
26x10.5
95x55
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60x31 60x31 44x26.8 44x26.8 44x26.8
PKG SPM2 PKG with Ceramic substrate
SPM2 PKG with DBC
substrate
SPM3 PKG with Ceramic
substrate
SPM3 Full-pack PKG
SPM3 PKGWith DBC substrate
Developed SPM2 V1600V-10/15/20/30AFSAM10SH(M)60AFSAM15SH(M)60AFSAM20SH(M)60AFSAM30SH(M)60A
SPM2 V1600V-50A/75AFSAM50SM60AFSAM75SM60A
SPM3 V2600V-3/5/10/15AFSBS3/5/10/15CH60SPM3 MOSFET500V-5/6AFCBS0550FCBS0650
SPM3 V4(P6, ’07 code S)600V-3/5/10/15AFSBF3CH60BFSBF5CH60B(T)FSBF10CH60B(T)FSBF15CH60BT
SPM3 V2600V-15/20/30AFSBB15/20/30CH60SRM 1phase-SPM3 : 600V-50AFCAS50SN60PSCM-SPM3 : 600V-20AFSAB20PH60PFCM-SPM3 : 600V-20/30/50AFPDB20PH60,FPD(A)B30/50PH60SPM3 V4 (P7,’07 code S)600V-15/20/30AFSBB15CH60B(T)FSBB20CH60B(T)FSBB30CH60BBoost PFCM-SPM3 (P6,’07 code S) : 600V-30A FPAB30BH60
Developing SPM2 V4
(P10,’08 code S)
600V-15/20/30/5075A
FSAM15CH60C
FSAM20CH60C
FSAM30CH60C
FSAM50CH60C
FSAM75CH60C
SPM3 V5(P10, ’08 code S)600V-3/5/10/15AFSBF3CH60CFSBF5CH60CFSBF10CH60CFSBF15CH60C
SPM3 V5(P10, ’08 code S)600V-15/20/30AFSBB15CH60CFSBB20CH60CFSBB30CH60C
Line-up of SPM2 and SPM3
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Line-up :
- 600V/10A, 15A, 20A, 30A – with Ceramic Substrate,
(Inner Bonding)
- 600V/50A, 75A – with DBC Substrate
(Out Bonding) Major Applications :
- Consumer appliance inverters
(Air conditioner, Treadmill)
- Low power industrial inverters Feature :
- Built-in thermistor (NTC)
- Active Low
- Inner bonding/Out bonding
- Short-circuit protection with soft shut- down
control using sense-IGBTs
- Good thermal resistance and isolation capacity
with ceramic/DBC substrate
- 3 N-terminals for low-cost current sensing
SPM2 V1
COM(L)
VCC
IN(UL)
IN(VL)
IN(WL)
VFO
C(FOD)
C(SC)
OUT(UL)
OUT(VL)
OUT(WL)
NU (26)
NV (27)
NW (28)
U (29)
V (30)
W (31)
P (32)
(23) VS(W)
(22) VB(W)
(19) VS(V)
(18) VB(V)
(9) CSC
(8) CFOD
(7) VFO
(5) IN(WL)
(4) IN(VL)
(3) IN(UL)
(2) COM(L)
(1) VCC(L)
(10) RSC
RTH (25)
VTH (24)
(6) COM(L)
VCC
VB
OUTCOM
VSIN
VB
VS
OUT
IN
COM
VCC
VCC
VB
OUTCOM
VSIN
(21) VCC(WH)
(20) IN(WH)
(17) VCC(VH)
(15) IN(VH)
(16) COM(H)
(14) VS(U)
(13) VB(U)
(12) VCC(UH)
(11) IN(UH)
THERMISTOR
< Out Bonding >
COM(L)
VCC
IN(UL)
IN(VL)
IN(WL)
VFO
C(FOD)
C(SC)
OUT(UL)
OUT(VL)
OUT(WL)
NU (26)
NV (27)
NW (28)
U (29)
V (30)
W (31)
P (32)
(23) VS(W)
(22) VB(W)
(19) VS(V)
(18) VB(V)
(9) CSC
(8) CFOD
(7) VFO
(5) IN(WL)
(4) IN(VL)
(3) IN(UL)
(2) COM(L)
(1) VCC(L)
(10) RSC
RTH (25)
VTH (24)
(6) COM(L)
VCC
VB
OUTCOM
VSIN
VB
VS
OUT
IN
COM
VCC
VCC
VB
OUTCOM
VSIN
(21) VCC(WH)
(20) IN(WH)
(17) VCC(VH)
(15) IN(VH)
(16) COM(H)
(14) VS(U)
(13) VB(U)
(12) VCC(UH)
(11) IN(UH)
THERMISTOR
< Inner Bonding >
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Line-up :
- 600V/15A, 20A, 30A, 50A, 75A with DBC Substrate Major Applications :
- Consumer appliance inverters
(Air conditioner, Treadmill)
- Low power industrial inverters Feature :
- Built-in thermistor (NTC)
- Active Low
- Inner bonding
- Built-in TSD(Thermal Shut Down) function
- Short-circuit protection with soft shut- down control
- High efficiency & robust NPT IGBT adopted
- Good thermal resistance and isolation capacity with
ceramic/DBC substrate
- 3 N-terminals for low-cost current sensing
SPM2 V4 (under development)
< Inner Bonding >
COM(L)
VCC
IN(UL)
IN(VL)
IN(WL)
VFO
C(FOD)
C(SC)
OUT(UL)
OUT(VL)
OUT(WL)
NU (26)
NV (27)
NW (28)
U (29)
V (30)
W (31)
P (32)
(23) VS(W)
(22) VB(W)
(19) VS(V)
(18) VB(V)
(9) CSC
(8) CFOD
(7) VFO
(5) IN(WL)
(4) IN(VL)
(3) IN(UL)
(2) COM(L)
(1) VCC(L)
(10) NC
RTH (25)
VTH (24)
(6) COM(L)
VCC
VB
OUTCOM
VSIN
VB
VS
OUT
IN
COM
VCC
VCC
VB
OUTCOM
VSIN
(21) VCC(WH)
(20) IN(WH)
(17) VCC(VH)
(15) IN(VH)
(16) COM(H)
(14) VS(U)
(13) VB(U)
(12) VCC(UH)
(11) IN(UH)
THERMISTOR
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Line-up :
- 600V/3A, 5A, 10A, 15A – with Ceramic Substrate
- 600V/15A, 20A, 30A – with DBC Substrate Major Applications :
- Consumer appliance inverters
(Air conditioner, Washing machine, Refrigerator, etc)
- Low power industrial inverters
(Industrial inverter, Water pump, Treadmill, Sewing machine
Door Controller, etc) Feature :
- Good thermal resistance
- Active High
- Out bonding
- Small size & Large pin-to-pin spacing
with zigzag package structure
- 3 N-terminals for low-cost current sensing
COM
VCC
IN(UL)
IN(VL)
IN(WL)
VFO
C(FOD)
C(SC)
OUT(UL)
OUT(VL)
OUT(WL)
NU (21)
NV (22)
NW (23)
U (24)
V (25)
W (26)
P (27)
(20) VS(W)
(19) VB(W)
(16) VS(V)
(15) VB(V)
(8) CSC
(7) CFOD
(6) VFO
(5) IN(WL)
(4) IN(VL)
(3) IN(UL)
(2) COM
(1) VCC(L)
VCCVB
OUTCOM
VSIN
VB
VS
OUT
INCOM
VCC
VCC
VB
OUTCOM
VSIN
(18) VCC(WH)
(17) IN(WH)
(14) VCC(VH)
(13) IN(VH)
(12) VS(U)
(11) VB(U)
(10) VCC(UH)
(9) IN(UH)
VSL
SPM3 V2
< Out Bonding >
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Line-up :
- 600V/3A, 5A, 10A, 15A – with Full-pack PKG
- 600V/15A, 20A, 30A – with DBC Substrate Major Applications :
- Consumer appliance inverters
(Air conditioner, Washing machine, Refrigerator, etc)
- Low power industrial inverters
(Industrial inverter, Water pump, Treadmill, Sewing machine
Door Controller, etc) Feature :
- Good thermal resistance
- Active High
- Inner bonding
- Small size & Large pin-to-pin spacing
with zigzag package structure
- Built-in Boot strap diodes
- Built-in TSD (Thermal Shut Down) function
- High efficiency & robust NPT IGBT adopted
- 3 N-terminals for low-cost current sensing
SPM3 V4
COM
VCC
IN(UL)
IN(VL)
IN(WL)
VFO
C(FOD)
C(SC)
OUT(UL)
OUT(VL)
OUT(WL)
NU (21)
NV (22)
NW (23)
U (24)
V (25)
W (26)
P (27)
(20) VS(W)
(19) VB(W)
(16) VS(V)
(15) VB(V)
(8) CSC
(7) CFOD
(6) VFO
(5) IN(WL)
(4) IN(VL)
(3) IN(UL)
(2) COM
(1) VCC
VCC
VB
OUTCOM
VSIN
VB
VS
OUT
IN
COMVCC
VCC
VB
OUTCOM
VSIN
(18) VCC
(17) IN(WH)
(14) VCC
(13) IN(VH)
(12) VS(U)
(11) VB(U)
(10) VCC
(9) IN(UH)
VSL
< Inner Bonding >
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Line-up :
- 500V/ 5A (1.35(typ.)), 6A (1.15(typ)) Major Applications :
- Low power consumer appliance inverters
(Refrigerator, Fan) Feature :
- 3-phase MOSFET inverter with driver IC
- Good thermal resistance
- Small size & Large pin-to-pin spacing
with zigzag package structure
- 3 N-terminals for low-cost current sensing
SPM3 MOSFET
COM
VCC
IN(UL)
IN(VL)
IN(WL)
VFO
C(FOD)
C(SC)
OUT(UL)
OUT(VL)
OUT(WL)
NU (21)
NV (22)
NW (23)
U (24)
V (25)
W (26)
P (27)
(20) VS(W)
(19) VB(W)
(16) VS(V)
(15) VB(V)
(8) CSC
(7) CFOD
(6) VFO
(5) IN(WL)
(4) IN(VL)
(3) IN(UL)
(2) COM
(1) VCC(L)
VCC
VB
OUTCOM
VSIN
VB
VS
OUT
INCOM
VCC
VCC
VB
OUTCOM
VSIN
(18) VCC(WH)
(17) IN(WH)
(14) VCC(VH)
(13) IN(VH)
(12) VS(U)
(11) VB(U)
(10) VCC(UH)
(9) IN(UH)
VSL
Chap. 2
SPM Introduction
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PSC-SPM (Partial switching PFC) Line-up :
- 600V/20A - SPM3 package with DBC
- 600V/30A - SPM3 package with DBC
(under development) Major Applications :
- Low/Medium power consumer
appliances such as Room air conditioner Feature :
- Good thermal resistance
- Same package as SPM3
- Built-in thermistor for temperature sensing
- LVIC with UVP, OCP
PSCM - SPM3 Package
CSC
CFOD
VFO
IN(S)
IN(R)
COM
VCC
OUT(S)
OUT(R)
NTCThermistor
Q1 Q2
D1
D3
D2
D4
VTH
RTH
CSC
CFOD
VFO
IN(S)
IN(R)
COM
VCC
PR
S
R
ND
NR
NS
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PFCM - SPM3 Package
PFC-SPM (Full switching PFC) Line-up :
- 600V/20A, 30A, 50A - SPM3 package with DBC Major Applications :
- Medium/high power consumer appliance
such as Package/System air conditioner Feature :
- Good thermal resistance
- Built-in shunt resistor (Optional)
- Same package as SPM3
- Built-in thermistor for temperature sensing
- LVIC with UVP, OCP
- Tj = -20 ~ 150deg
CSC
CFOD
VFO
IN(S)
IN(R)
COM
VCC
OUT(S)
OUT(R)
VTH
RTH
CSC
CFOD
VFO
IN(S)
IN(R)
COM
VCC
PR
S
R
N
NSENSE
VAC-
ShuntResistor
NTCThermistor
Q1 Q2
D1
D3
D2
D4
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Boost PFCM - SPM3 Package
Line-up :
- 600V/30A – SPM3 package with DBC Major Applications :
- AC 85V ~ 264V single-phase front-end rectifier
- Mid-power application especially for an air conditioners Feature :
- Low thermal resistance due to Al2O3-DBC substrate
- Active High
- Single-phase rectifier diode
- single-phase IGBT PWM semi-converter including a drive IC
for gate driving and protection
- Typical switching frequency of 20kHz
- Built-in thermistor for temperature sensing
- LVIC with UVP, OCP
- Tj = -20 ~ 150deg
CSC
CFOD
VFO
IN(S)
COM
VCC
OUT
VTH
RTH
CSC
CFOD
VFO
IN
COM
VCC
P
S
R
NR
NTCThermistor
PR
L
N
VG
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Line-up :
- 600V/50A - SPM3 package with DBC
Major Applications :
- Single-phase SRM drives
(Vacuum cleaner)
Feature :
- Good thermal resistance
- Built-in thermistor (NTC)
- Small size & Large pin-to-pin spacing
with zigzag package structure
- Divided N-terminals for low-cost current sensing
SRM 1Phase - SPM3 Package
COM(L)
VCC
IN(UL)
IN(VL)
IN(WL)
VFO
C(FOD)
C(SC)
OUT(WL)
OUT(VL)
OUT(UL)
NB1 (23)
NA (24)
B (25)
A (26)
P (27)
(16) VS
(15) VB
(8) CSC
(7) CFOD
(6) VFO
(5) IN(L)
(4) NC
(3) NC
(2) COM
(1) VCC(L)
VCC
VB
OUTCOM
VSIN
(14) VCC(H)
(13) IN(H)
(11) NC
(9) G(L)
(10) E(L)
(17) G(H)
(18) E(H)
(12) NC
NB2 (21)
NC (22)
R(TH) (19)
V(TH) (20)
Chap. 2
SPM Introduction
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Line-up of SPM4, SPM5 and SPIM
54x29.5 45x28 29x12 95x55
PKG SPM4-SIP1 PKG SPM4-SIP2 PKG SPM5 PKG SPIM PKG
Developed SPM5 V1 DIP/SMD
500V - 2A(3.3(typ)), 4A(1.9(typ)), 5A(1.3(typ))
FSB50250(T/S),
FSB50450(T/S), FSB50550(T/S)
250V - 3A(1.4(typ))
FSB50325(T/S)
Developing SPM4-SIP1
(P11, ’07 code S)
600V-10/16A
FDAU1060A
FDAU1660A
(Q2, ’08 code S)
600V-20/30A
FDAU2060A
FDAU3060A
SPM4-SIP2
(P6, ’08 code S)
600V-10/15A
FSAU10/15CH60
SRM 2phase-SIP2
(P10, ’07 code S)
600V- 10/20/30A
FCAS20/30DN60B
SPM5 V2 DIP/SMD
(P5, ’08 code S)
500V- 2/4/5A, 250V - 3A
FSB50250A(T/S), FSB50450A(T/S), FSB50550A(T/S), FSB50325A(T/S)
MV SPM5 DIP/SMD
(P10, ’07 code S)
60V- 20A( 48m (typ))
FSB52006(S)
SPIM 1200V
1200V- 30/45A(CI) (P9,’08 code S)
FSSR30/45CH120
1200V- 45A (Inv.) (P6,’08 code S)
FSSN45CH120
1200V- 30/60A (Inv.) (P9,’08 code S)
FSSN30CH120
FSSN60CH120
SPIM 600V
600V- 50/75A (CI) (Q2,’08 code S )
FSSR75CH60
600V- 50/75/100A (Inv.) (P10,’07 code S )
FSSN50CH60
* Gray color: Not fixed development plan
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Line-up :
- 600V/10A, 16A, 20A, 30A Major Applications :
- Consumer appliance inverters
(Air conditioner, Washing machine,
Refrigerator, Water pump, etc)
- Low power industrial inverters
(Fan Motor, Industrial Inverter, etc) Feature :
- Large pin spacing and signal/power pins separation
- Single-In-Line package
- Active High
- 3 N-terminals for low-cost current sensing
- Built-in thermistor
- High efficiency & robust NPT IGBT adopted
SPM4 - SIP1 Package(under development)
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Line-up :
- 600V/ 10A, 15A Major Applications :
- Consumer appliance inverters
(Air conditioner, Washing machine, Refrigerator, Water pump, etc)
- Low power industrial inverters
(Fan Motor, Industrial Inverter, etc) Feature :
- Cross-Conduction Prevention Logic
- Single-In-Line package
- Active High
- 3 N-terminals for low-cost current sensing
- Built-in thermistor
- High efficiency & robust NPT IGBT adopted
SPM4 - SIP2 Package(under development)
(1) W,VS(W)
FO
VCC
LIN
HIN
VB
HO
VS
LO
CSC
COM
FO
VCC
LIN
HIN
VB
HO
VS
LO
CSCCOM
(2) VB(W)
(3) IN(WH)
(4) IN(WL)
(5) V,VS(V)(6) VB(V)
(7) IN(VH)
(8) IN(VL)
(9) U,VS(U)
(10) VB(U)
(11) IN(UH)
(12) IN(UL)
(13) VCC
(16) COM
(17) NV
(15) NU
(19) NW(20) P
FO
VCC
LIN
HIN
VB
HO
VS
LO
CSC
COM
VSS
VSS
VSS(18) VFO
(14) CSC
Thermistor
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ConfidentialSRM 2phase - SIP2 Package(under development)
Line-up :
- 600V/ 10A, 20A, 30A Major Applications :
- 2-phase SRM drives
(Vacuum cleaner) Feature :
- 2-phase asymmetric bridge converter
- Active High
- Single-In-Line package
- Built-in bootstrap diode
- Built-in thermistor (NTC)
- Low saturation voltage
- Large pin spacing and signal/power pins separation
- High efficiency & robust NPT IGBT adopted
COM(L)
VCC
IN(VL)
IN(UL)
Vfo
Cfod
Csc
OUT(VL)
OUT(UL)
(20) P
(12) CSC
(13) CFOD
(14) VFO
(16) IN(UL)
(18) COM
(17) VCC
VS
(7) V(TH)
OUT
COM
IN(UH)
VS
VBVCC
OUT
COM
IN(VH)
VS
VBVCC
(9) VS(U) / U+
(3) U-
(5) VS(V) / V+
(2) V-
(19) N
(10) VB(U)
(6) VB(V)
(11) IN(UH)
(8) IN(VH)
(15) IN(VL)
(4) U-
(1) V-
Gray color : Not fixed development plan
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Line-up :
- V1 SPM5 DIP:
500V/2A(3.3(typ)), 4A(1.9(typ)), 5A(1.3 (typ))
& 250V/3A(1.4 (typ))
- V1 SPM5 SMD: 500V/2A, 4A, 5A & 250V/3A
- MV SPM5 DIP and SMD : 60V/20A( 48m(typ) )
(Under development)
- Transfer-molded full-pack package Major Applications :
- Fan motor, water pump, etc.
- Small motor applications up to 150W Feature :
- High power density compared to small package
- Ruggedness (Switching and short-circuit)
- Low conducted and radiated EMI
(Slow dV/dt & dI/dt)
- HVIC with UVP
COM
VCC
LIN
HIN
VB
HO
VS
LO
COM
VCC
LIN
HIN
VB
HO
VS
LO
COM
VCC
LIN
HIN
VB
HO
VS
LO
(1) COM
(2) VB(U)
(3) VCC(U)
(4) IN(UH)
(5) IN(UL)
(6) VS(U)
(7) VB(V)
(8) VCC(V)
(9) IN(VH)
(10) IN(VL)
(11) VS(V)
(12) VB(W)
(13) VCC(W)
(14) IN(WH)
(15) IN(WL)
(16) VS(W)
(17) P
(18) U
(19) NU
(20) NV
(21) V
(22) NW
(23) W
SPM5 V1
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Line-up :
- V2 SPM5 DIP:
500V/ 2A(3.3(typ)), 4A(1.9(typ)), 5A(1.3 (typ))
& 250V/ 3A(1.4 (typ))
- V2 SPM5 SMD: 500V/ 2A, 4A, 5A & 250V - 3A
- Transfer-molded full-pack package Major Applications :
- Fan motor, water pump, etc.
- Small motor applications up to 150W Feature :
- High power density compared to small package
- Ruggedness (Switching and short-circuit)
- Low conducted and radiated EMI
(Slow dV/dt & dI/dt)
- HVIC with UVP
- Built-in bootstrap diode
- No external REH connection
- Multi-function I/O, FO
SPM5 V2(under development)
(1) COM
(2) VB(U)
(3) VCC(U)
(4) IN(UH)
(5) IN(UL)
(6) FO(U)
(7) VB(V)
(8) VCC(V)
(9) IN(VH)
(10) IN(VL)
(11) FO(V)
(12) VB(W)
(13) VCC(W)
(14) IN(WH)
(15) IN(WL)
(16) FO(W)
(17) P
(18) U
(19) NU
(20) NV
(21) V
(22) NW
(23) W
FO
COM
VCC
LIN
HIN
VB
HO
VS
LO
COM
VCC
LIN
HIN
VB
HO
VS
LOFO
COM
VCC
LIN
HIN
VB
HO
VS
LOFO
DIP SMD Double DIP
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ConfidentialSPIM-CI (under development)
Line-up :
- 1200V/ 30A, 45A
- 600V/ 50A, 75A
- Transfer-molded DBC package Major Applications :
- Industrial Inverter, System A/C Feature :
- High power density in a small package
- 3-phase Rectifier and IGBT inverter
- Built-in Thermistor for temperature sensing
- Good thermal resistance
- 3 N-terminals for low-cost current sensing
< 1200V >
< 600V >
Q1 Q3
Q6
Q5
Q2
P
NWNVCOM
D1 D3
D6
D5
D2
COM
LINU LOU
FO
IN(UH)
Q4
NU
D4
FO
VB(U)
IN(VL)
VB(V)IN(VH) IN(WH) VB(W)VCC
COM
LOV
LOW
VCC
LINV
LINW
IN(WL)IN(UL)
VS(U)
VCC
HIN
VB
HO
VS
VCC
HIN
VB
HO
VSCOM
VS(V)
VCC
HIN
VB
HO
VSCOM
VS(W)
CSC
CSCNR
R
S
T
VTH
RTH
D11 D13
D14 D16
PR
U V W
Q1 Q3
Q6
Q5
Q2
P
NWNV
D1 D3
D6
D5
D2
COM
VCC
LIN
HIN
VB
HO
VS
LO
FO
IN(UL)
IN(UH)
Q4
NU
D4
FO
VB(U)
IN(VL)
VB(V)IN(VH)
IN(WL)
IN(WH) VB(W)VS(U) VS(V) VS(W)
COM
VCC
CSC
CSC
COM
VCC
LIN
HIN
VB
HO
VS
LO
FO
CSC
COM
VCC
LIN
HIN
LO
FO
CSC
VB
HO
VS
NR
R
S
T
VTH
RTH
D11 D13 D15
D14 D16 D12
PR
VU W
Gray color : Not fixed development plan
21
ConfidentialSPIM-INV(under development)
Line-up :
- 1200V/ 30A, 45A, 60A
- 600V/ 50A, 75A, 100A
- Transfer-molded DBC package Major Applications :
- Industrial Inverter, System A/C Feature :
- High power density in a small package
- 3-phase IGBT inverter
- Built-in Thermistor for temperature sensing
- Good thermal resistance
- 3 N-terminals for low-cost current sensing
< 600V >
< 1200V >
Q1 Q3
Q6
Q5
Q2
P
NWNVCOM
D1 D3
D6
D5
D2
COM
LINU LOU
FO
IN(UH)
Q4
NU
D4
FO
VB(U)
IN(VL)
VB(V)IN(VH) IN(WH) VB(W)VCC
COM
LOV
LOW
VCC
LINV
LINW
IN(WL)IN(UL)
VS(U)
VCC
HIN
VB
HO
VS
VCC
HIN
VB
HO
VSCOM
VS(V)
VCC
HIN
VB
HO
VSCOM
VS(W)
CSC
CSC
VTH
RTHU V W
Q1 Q3
Q6
Q5
Q2
P
NWNV
D1 D3
D6
D5
D2
COM
VCC
LIN
HIN
VB
HO
VS
LO
FO
IN(UL)
IN(UH)
Q4
NU
D4
FO
VB(U)
IN(VL)
VB(V)IN(VH)
IN(WL)
IN(WH) VB(W)VS(U) VS(V) VS(W)
COM
VCC
CSC
CSC
COM
VCC
LIN
HIN
VB
HO
VS
LO
FO
CSC
COM
VCC
LIN
HIN
LO
FO
CSC
VB
HO
VSVTH
RTH
VU W
Gray color : Not fixed development plan
22
Confidential
Line-up : (Q2, ’08 code S)
- 500V/ 9A, 13A MOSFET (UNIFET)
- 600V/ 3A, 5A, 8A IGBT (NPT IGBT)
- 75V/ 75A MOSFET (ULTRAFET, PT3 MOSFET) Major Applications :
- Consumer appliance inverters
(Washing machine, Refrigerator, etc)
- E-Bike, Power Tools (B&D) Feature :
- Single-In-Line 9-SIP compact package
- Built-in fault-out and external shut-down functions
- Built-in Bootstrap diode
- OC, OT, UV protection Function
- FO function(not fixed)
- Thermal Shut-down(not fixed)
- Two kinds of Form Package(9-SIP-Y or 9-SIP-L)
SPM6(under development)
Not fixed
COM
VCC
LIN
HIN
VB
HO
LO
(2) VCC
(3) HIN
(4) LIN
(1) P
(9) U
(7) N(6) COM
(8) VB
VS
FO(5) FO
10.5x26
23
Confidential
Thank You.