PROCEEDINGS
OF THE TECHNICAL
PROGRAM
Conference: February 27 - March 4,1994 • Exposition: March 1-3, 1994
Anaheim Convention Center • Anaheim, California
TECHNICAL SESSION 12
DOE (Design of Experiments) and QFD (Concurrent Engineering)as Necessary Tools to Support and Enhance SPC
Chairman: Ronald Anjard
"An Overview and Inter-Relationships of QFD, SPS, DOE" 801
Ronald Anjard
"QFD - What It All Means and Where It's Headed" 805
Rick Norman, Leemak
"Optimizing Quality Function Deployment (QFD) - The Process" 814
Pam Dunham, QFD Systems Manager, NCR
"Application Advances in QFD" 821
William Riordan, Howard Johnson and Donald Murphy, GDE Systems, Inc.
"Taguchi Methods in the Semiconductor World: Concepts and Applications" 827
Marilyn Hwan, LSI Logic Corporation
"Why Experimental Designs Fail" 834
Tom Barker, Rochester Institute of Technology
"Process Integration of 200K Silicon Process with ThermocompressionTab Bonding Using Robust Design Methodology" 849
Brian Lynch, LSI Logic Corporation
"The Quality as a Management Strategic Tool"
Shin Ta Liu, Lynx System
TECHNICAL SESSION 13
The Environmental Challenge for PCB Assembly Processes
Chairman: Malcolm Warwick, Technical Director, Multicore Solders Ltd.
"Solder Safety and Disposal Management" 867
Peter Biocca, Technical Manager, Multicore Solders, Inc.
"Screening Studies on Lead-Free Solder Alloys" 874
M.E. Warwick and H.AH. Steen, Multicore Solders Ltd.; J.H. Vincent and
B.P. Richards, GEC-Marconi Ltd.; P.G. Harris and M.A. Whitmore,International Tin Research Institute; S.R. Billington and AC. Harman,
BNR Europe Ltd.
"Alternative Solders for Electronic Assemblies" 884
C.G. Tanner, B.M. Wright, S.R. Billington, AC. Harman, E. Knight,BNR Europe Ltd.; J.H. Vincent, B.P. Richards, D.R. Wallis, I.A. Gunter,GEC-Marconi Ltd.; M.E. Warwick, H.AH. Steen, Multicore Solders Ltd.;P.G. Harris, M.A Whitmore, International Tin Research Institute
"Cleaning Without CFC's: The Flux/Solvent Puzzle" 893
Dean Johnson, Western Regional Sales Manager, Accel Corp.
"Material Choices for No-Clean Process" 902
Kevin Posivy, IBM Canada Ltd.
"Design Considerations of No-Clean Fluxes Used to Eliminate VOC Emissions" 908
Bob Gilbert, Technical Manager, Multicore Solders, Inc.
"Precision Application of No-Clean Flux with Ink Jet Techniques" N/A
Brad Stoops, President, Precision Dispensing Equipment Inc.
TECHNICAL SESSION 14
Polymer Composite Use in High-Density Electronic PackagingChairman: Joe Fulton, Member of the Technical Staff, AT & T
"Nitto Denko Application Specific Material (ASMAT) Micro-Connector" 915Ronald Blankenhorn, Nikko Denko America, Inc.
"Repair Problems and Possible Solutions for Isotropic Conductive
Adhesive Interconnect" N/AY. Zaks and H.D. Rubin, AT&T Bell Laboratories
"Are Polymer 'Solders' Real? Metallurgical vs. Adhesive Joining" 922Ken Gilleo and Norbert Socolowski, Alpha Metals
"Unique Applications for New Low-Resistance Elastomeric Connectors" 931Nicholas Creighton and Hitoshi Ando, Shin-Etsu Polymer
TECHNICAL SESSION 15
High-Speed Circuitry Issues in Design, Assembly and Test
Chairman: W. Kinzy Jones, President, ISHM
"Issues in Designing High Speed ICs, PCB & MCMs" 947
Ravender Goyal, Mentor Graphics
"Facts on High Speed PCB Design" 955
James Blankenhorn, President, SMT Plus, Inc.
"Assembly Constraints in High-Speed Packaging Applications" 960
Dr. Harris Charles, Supervisor, Engg. Fabrication, John Hopkins University
"Testing High Speed Circuits" 972
Dr. David Keezer, Associate Professor, EE, University of So. Florida,
College of Engineering
"Characterization of High-Speed Interconnects" 986
Scott Diamond and Stan Kaveckis, Tetronix
TECHNICAL SESSION 16
Design for TestabilityChairman: Tim Aspell, Manager, Innovative Technologies
Co-Chairman: Charles Masi, Technical Journalist, C. G. Masi Associates
"Emerging Technologies Support the Elimination of Product Testing" 995
Tim Lantz, Test Development Manager, Litton Industries
"Design for Test - Profit or Loss?" 1001
Jon Turino, President, Logical Solutions Technologies
"Automated DOT Analysis for Bare and Loaded Board Testing" 1010
Jack Luna, President, CADtest Inc.
"Design for Inspectability" 1018
Harold Wasserman, Director of Engineering, Control Automation, Inc.
"Analog Built-in Self-Test" 1036
Lahouari Sebaa, Mohammad S. Nejad, Andrew Ladick, and Henry Kuo,
Western Digital Corporation
TECHNICAL SESSION 17
Using Vision for Manufacturing Discrete Electronics
Chairman: Gary Wagner, Vice President, Automatix
"100% Inspection of Package Leads: Why it Pays to Demand it" 1047
Bill Schmidt, Product Marketing Manager, RVSI
'Vision-Guided Assembly" 2420
Philip Lamoreaux and Gary Wagner, Automatix, Inc.
"Detecting and Classifying Defects on the Surfaces of IC Packages" 1057
Dr. Larry Schmitt, Vice President of Marketing, AppliedIntelligent Systems, Inc.
"Application of Machine Vision in the Assembly of Discrete Electronics" 1067
Dan Krage, OEM Motion Accounts Manager, Adept Technology, Inc.
"Uses of Vision in SMT Process Control" • • •1080
Stephen Kress, Product Marketing Specialist, Cognex Corporation
This session is sponsored by the Automated Imaging Association (AIA).
TECHNICAL SESSION 18
New Developments in Solders and Solder Interconnections
Chairman: Dr. Jennie Hwang, President & CEO, IEM-Fusion, Inc.
"Ceramic Solder Grid Array Interconnections Reliability Over a
Wide Temperature Range" 1087
David Gerke, Motorola
"Reflow Cooling Rate vs. Solder Joint Integrity Part I" 1095
Dr. Jennie Hwang and Dr. Zhenfeng Guo, IEM-Fusion, Inc.
"Evaluating the Method of Measuring the Tackiness and Wettness of
Solder Paste" 1121
Tom Fujikawa, Malcom Instruments Corp.
"Fine Pitch Soldering Pad and Stencil Design" 1130
Richard Latta and Jess Asia, Micron CMS, Inc.
"Surface Mount Assembly Yield Improvement and PCB
Solderability Testing" 2399Bob Willis, Electronic Presentation Services; John Porter,Multicore Solders; Phil Hunter, Shipley UK Limited
TECHNICAL SESSION 19
VXIBus
Chairman: Ron Wolfe, VXI Product Manager, National Instruments
"VXI-Based System for Testing Satellite Sub-Assemblies:
The Next Generation" N/A
John Markowski, Honeywell, Satellite Systems Operation
"Circuit Card Test-System Modernization Using VXIbus and Lab Windows" 1145
Bo Halamandaris and Harry Kane, Litton Industries
"Test Executive Techniques for VXI-Based Systems-The Applicability of
Graphical Programming to Automated Test" 1153
Jack Barber and Michael Santori, National Instruments
"Hot Insertion/Removal of VXI Modules with a Powered VXI Mainframe" 1148
Robert Mahoney, Test Engineer, Hewlett-Packard Company
"A VXI Instrument for Primary Rate Telecommunications Test" 1165
Matthew Fichtenbaum and Robert M. Manlick, GenRad, Inc.
"Panasonic Repair Automation Tool Strategy--A User's Guide on
VXI Bus Implementation" 1176
Robert Jakaitis, Technical Liason, Panasonic
"The Evolution of VXI-Based Automatic Test Equipment (ATE)" 2413
Mike Zayac and Sean L. Kent, Westinghouse Electric Corp.
TECHNICAL SESSION 20
Design for the Environment (DFE): Product Take-back,
De-Manufacturing and Waste Minimization
Chairman: William Hoffman, III, Project Mgr., CMRC, Motorola, Inc.
"Design for the Environment-Getting Started" 1187
David Ufford, System Producibility Manager, Texas Instruments
"Profiting from Pollution Prevention through Design for the
Environment (DFM)" 1197
Edward Surette, Corp. Environmental Engr. Mgr., M/A-Com, Inc.
"Network and Data Support for DFE" N/A
Robert Ferrone, Corp. Env. Health and Safety, DigitalEquipment Corporation
"Refining and Smelting of Precious Metals from Printed Circuit
Boards: Part I" 1205
Ron Rosenson, Don Walsh and Peter Dietl, Behr Precious Metals
"Refining and Smelting of Precious Metals from Printed Circuit Boards:
Part H Environmental" 1209
Don Walsh, Executive Vice President, Behr Precious Metals
"Refining and Smelting of Precious Metals from Printed Circuit
Boards: Part III Electronic Component Retrieval from Unusable
Circuit Board Assemblies" 1212
Peter Dietl, President, Bruin Electronics
TECHNICAL SESSION 21
Successful Post-CFC Soldering and Cleaning Conversions
Chairman: William Kenyon, Du Pont Electronics
"Concurrent Implementation of Four Soldering/Cleaning Technologies for
Military Hardware Assembly" N/ACarole Ellenberger, and Joe R. Felty, Texas Instruments
"Evaluation of Water-Soluble Fluxes and Non-CFC Cleaning Alternatives
in a Cycling Humidity Environment" N/A
James Maguire, Boeing Electronics
"New Developments in Simplified, Low Cost, Semi-Aqueous Emulsion
Cleaning Technology" 1217
Rex Breunsbach, Pres. & Chief Tech. Officer, Electronic Controls Design, Inc.
"Novel Waste-Treatment Technology Applicable to Aqueous-Based Effluent
Streams from Alternative Cleaning Processes to Facilitate Compliancewith Environmental Regulations-Case Histories" 1226
Jeff Spira, President, Unit Design
"Maximizing Standard to Ultra-Fine Pitch Soldering Yields While
Minimizing Total Manufacturing Costs Through Solid-Solder-Deposit
(SSD) Technology" 1236
U. Biegcl, Peter Biegel GmbH
TECHNICAL SESSION 22
Ball Grid Array (BGA) Technology
Chairman: John Lau, Senior Engineer, Hewlett-Packard
"Development of the Slightly Larger Than IC Carrier (SLICC)" 1249
Kingshuk Banerji, Motorola, Inc.
"BGA Package Design Considerations for Solder Joint Reliability" N/A
Randy Johnson and Mike Petrucci, COMPAQ Computer Corp.
"Using Cross-Section X-Ray Techniques for Testing Ball-Grid-Array
Connections and Improving Process Quality" 1257
John Adams, Chief Scientist, Four Pi Systems
"Thermal Modeling of a Multichip BGA Package"1266
David Walshak, Jr. and Hassan Hashemi, MCC
"MCM-L Built on Ball Grid Array Formats"1277
Phil Rogren, Hestia Technologies, Inc.
TECHNICAL SESSION 23
Modern Memory Subsystems: A New Opportunity to Profit
Chairman: Cecil Ho, President, C.S.T., Inc.
"Market Trend - Memory Module and Memory Sub-Systems" N/A
Ron Seide, Director of Marketing, Kingston Technology
"Controlled Impedance Design in Memory Sub-Systems" 1285
Gary Smith, President, Momory X, Inc.
"Manufacturing Technique For Producing Memory Sub-Systems" N/A
Paul Emrick, Electro Surface Technologies
"High Volume Testing For Memory Sub-Systems" 1292
Cecil Ho, President, C.S.T., Inc.
"PCMCIA Memory Card Design & Applications" 1299
Nelson Chan, Director of Marketing, Sundisk
TECHNICAL SESSION 24
Chairman: Martin Jawitz, California Circuits Association
The chairman and speakers elected not to speak 1303
TECHNICAL SESSION 25
Conformal CoatingChairman: Dennis Derfiny, Engr. Manager-Advanced Engrg., Motorola, Inc.
"Barrier Coatings for MCM Devices" 1307
Michael Lucey, President, Micro-Lite Technology
"Conformal Coating Over Soldermask, No-Clean Soldering and Alternative
Cleaning Technologies" 1312
Barry Ritchie, Senior Eng. Specialist, Loctite Corporation
"Quality Techniques for Optimizing Parylene Conformal Coating" 1332
Roger Olson, Dir. of New Business and Tech., Specialty Coating Systems Inc.
"Environmentally Compliant Application of Conformal Coatings" 1338
Hendrik Bok and Lamar Young, Specialty Coating Systems Inc.
"Excimer Laser Ablation of Flexible Dielectric Coatings" N/A
Christopher Schreiber, Adv. Tech. IR & D Staff, Hughes Interconnect Systems
TECHNICAL SESSION 26
Users Compliance with Environmental Regulations for Wastewater and HazardousSolid Waste from Cleaning Processes 1345
Chairman: John Russo, President, Separation Technologies, Inc.
"Lead Removal from a New Aqueous Cleaning Agent Before Discharge" 1346David Benton, Hughes Corporation
"Turnkey Installation of a Two-Stage Wastewater Treatment System used
on Saponifiers Cleaning PWA Operations" 1349
Steve Gaxiola and Felix Chou, Allied Signal Aerospace
"Membrane Closed-Loop Recycling of a Wastewater ContainingHydrocarbon Ester Solvent" 1351
John Tevels, Harris Corp.
"Closed-Loop Water Recycling of Wastewater from a
Relay-Cleaning Process" 2435
William Riser, Jr., United Technologies
"Compliance and Waste Minimization Makes 'Cents'" 1353
Marvin Sachse and Donna T. Chen, City of Los Angeles Public Works
TECHNICAL SESSION 27
Device and Board-level Inspection Issues and TechniquesChairman: John Flaherty, Technical Editor, Test and Measurement World
"Application of Reverse-Geometry X-Ray Technology to PCB Inspection" 1371
Tom Albert, Marketing Director, Digiray Corporation
"Using Cross-Sectional X-Ray Techniques for Testing Ball-Grid-ArrayConnections and Improving Process Quality" 1373
John Adams, Chief Scientist, Four Pi Systems
"Assessing and Solving Lifted Leads Under CoplanarityConsiderations in SMT" 1382
Yuan Guo and Peter C. Randklev, EMD Associates, Inc.
"Ultraboard: A Case Study Surrounding the Development of an Automated
C-Mode Scanning Acoustic Microscope (C-SAM) for Detecting Surface
Mounted Component Flaws" 1392
Donald Commare and Ray E. Thomas, Sonoscan, Inc.
"The Emerging Role of 3-D Measurement Technology on Ultra-Fine
Pitch Assembly" N/A
Earl Rideout, Vice President/General Manager, RVSI
"Infrared Inspection Technique for PCBs and Devices"
Jerry Schiagheck, Cincinnati Electronics
N/A
TECHNICAL SESSION 28
Electrostatic Discharge (ESD) Control in the 90's
Chairman: Steve Koehn, Advanced Engr., 3M
"US & Global ESD Standards" 1403
Ed Weggeland, Vice President, Richmond Technologies, Inc.
"The 4 Basic Rules for an Effective ESD Program" 1407
David Swenson, Int'l Technical Service Mgr., 3 M Corporation
"Packaging Fundamentals for ESD Sensitive Products" 1417
Ronald Gibson, Staff Engineer, IBM Canada, Ltd.
"Device Testing for ESD Standards" 1428
Les Avery, Senior Member-Technical Staff, David Sarnoff Research Ctr.
"Hands-on ESD Testing Laboratory Demonstration" 2419
Steve Koehn, Advanced Engr., 3M
This session is sponsored by the EOS/ESD Association.
TECHNICAL SESSION 29
Wave-Soldering with VOC-Free No-Clean Fluxes
Chairman: Alvin Schneider, Dir. Chemical Research & Dev., Alpha Metals, Inc.
"The Development of VOC-Free No-Clean Fluxes" 1444
Alvin Schneider, Dir. Chemical Research & Dev., Alpha Metals, Inc.
"Wave-Soldering Machine Issues For The No-Clean Process" 1452
William Down, Technical Director, Electrovert USA Corporation
"Wave-Soldering Performance and Optimization of VOC-Free No-Clean Flux" 1456
Eric Fremd, Solectron and John Ivankovits and Christine Dong,Air Products and Chemicals
"Implementing VOC-Free Low Solids Flux Into Manufacturing" 1481
Mark Walker and Vince Thompson, Mitel Corporation
"Use of VOC-Free No-Clean Fluxes in Manufacturing: The Next
Environmental Success Story" , N/A
Cheryl Tulkoff, Senior Associate Eng., IBM
TECHNICAL SESSION 30
Direct Chip Attach on Low-Cost Substrates
Chairman: John Lau, Senior Engineer, Hewlett-Packard
"Robust Encapsulation for Chip-On-Board Applications" 1493
Larry White and Darbha Suryanarayana, IBM
"New General Encapsulants for Chips on Low-Cost First-Level Substrates" 1503
Art Burkhart, Chris Naito and Bradley Goodrich, Dexter Electronics Materials
"Techniques for Optimizing DCA Encapsulation Process" 1512
Robert Pennisi, Bobby Dean Landreth, and Dale Robinson, Motorola, Inc.
"Organic Carrier Requirements for Flip-Chip Assemblies" 1519
Julian Partridge and Puligandla Viswanadham, IBM PC Company
"Development of Large High I/O Flip-Chip Technology" 1527
Tom Chung, David Carey and Bob Gardner, MCC
"Flip Chip on Flexible Substrates" N/ABarbar Gibson, Cherry Semiconductors
"Competing Technologies for SMT: Direct-Chip-Attach Using Flip Chip,
Wirebond, or TAB" 1537
Don Franck and Michael Testani, DOVatron International
TECHNICAL SESSION 31
Thermal Management in Electronics
Chairman: Richard Nelson, MCC Corp.
"Thermal Management of C4 Surface-Mount-Array Interconnect
Technologies: A One-Dimensional Model" 1553
Gary Kromann, Motorola
"Adhesives for Thermal Enhancement of Surface-Mount Plastic
Electronic Packages"1560
Michael Gaynes, H. Shaukatullah, IBM Corporation
"Thermal Management of High-Power Multi-Chip Modules for Next
Generation Workstations" 1^70
Thomas Dolbear, Jon Zimmerman and Richard Nelson, MCC
"Combining System-, PCB- and MCM-level Thermal Analysis: At Last, a
Look at the Whole Picture"15S0
Dan Wolff, Mentor Graphics Corp.
TECHNICAL SESSION 32
Fine- and Ultra-Fine-Pitch TechnologyChairmen: Phil Zarrow and Debra Kopp, Integrated Technology Group
"Improved Productivity through Fine-Pitch Dispensing" 1589
Patricia Waitkus and Kevin Gaugler, ESP Solder Plus
"Comparative Analysis of Stencil Technologies for Fine-Pitch and
Ultra-Fine-Pitch Printing" N/A
Richard Clouthier, AMTX-Advanced Micro Tech.
"Alternative Solder Paste Application for Ultra Fine Pitch" 1596
Donald Burr and Mike Buscman, Unisys Corporation
"Fine Pitch Rework and Repair-Process Modeling" 1601
Joe Mearig, Electronic Manufacturing Productivity Facility
TECHNICAL SESSION 33
Advances in UV Processes for Electronics
Chairman: John Beasley, California Sales Manager, EFOS Inc.
"Technology of UV-Cured, Coating, Decorating and Bonding in Electronic
Manufacturing"Richard Stowe, Mgr, of Product Development, Fusion Systems, Inc.
"New Developments in ODC-Free UV Curing, Coatings and Adhesives"..
Dr. Steve Cantor and Farre Huang, Dymax Corporation
"Process Control and Measurement: Key Factors Insuring the Success of
UV-Curing Adhesives, Sealants and Encapsulants" 1635
Christy Marinelli and Gregory Marinelli, Loctite Corporation
"UV-Curable Barrier Coatings for MCM's" , . , .1648
Michael Lucey, President, Micro-Lite Technology
"Automation In UV Process for Electronics: How to Design for Them" 1655
Robert Alvarez, President, Base Technology and Pierre Metivier, ASI
"Ultra-Violet Spot Curing: An In-Line and Off-Line Spot-Cure Approach" 1661
John Beasley, California Sales Manager, EFOS Inc.
1611
1620