©2019 by System Plus Consulting | SP19455 - ABB LinPak 1700V 2x1000A Power Module 1
ABB Module 5SNG 1000X170300LinPak Phase-Leg IGBT Module 1700V 2x1000APower Semiconductor report by Amine ALLOUCHE March 2019 – Sample
22 bd Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr
REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT
©2019 by System Plus Consulting | SP19455 - ABB LinPak 1700V 2x1000A Power Module 2
SUMMARY
Overview / Introduction 4
o Executive Summary
o Market
o Reverse Costing Methodology
o Glossary
Company Profile 12
o ABB profile
o ABB Modules Portfolio
o Supply Chain
Physical Analysis 16
o Synthesis of the Physical Analysis
o Physical Analysis Methodology
o Product Datasheet
o Package Analysis
LinPak Technology by ABB Package View & Dimensions Package Opening Package Cross-Section
o Si IGBT Die
IGBT Die View & Dimensions IGBT Die Process IGBT Die Cross-Section
o Si Diode Die
Diode Die View & Dimensions Diode Die Process Diode Die Cross-Section
Manufacturing Process 95
o Si IGBT Process Flow & Fabrication Unit
o Si Diode Process Flow & Fabrication Unit
o Module BOM and Package Process Flow
o Final Test & Packaging Fabrication Unit
Cost Analysis 109
o Synthesis of the cost analysis
o Yields Explanation & Hypotheses
o IGBT die
IGBT Front-End Cost
IGBT Wafer Cost per Process Step
IGBT Die Probe Test & Dicing
IGBT Die Cost
o Diode die
Diode Front-End Cost
Diode Wafer Cost per Process Step
Diode Die Probe Test & Dicing
Diode Die Cost
o Packaging Cost
PCB Cost Calculation
Module BOM Cost
Package Assembly Cost
o Complete Module
Final Test Cost
Final Module Cost
Price Analysis 126
o Definition of Prices
o Estimation of Selling Price
Comparison 129
o Comparison with Cree 1700V Power Module
Feedbacks 134
Company services 136
©2019 by System Plus Consulting | SP19455 - ABB LinPak 1700V 2x1000A Power Module 3
Overview / Introductiono Executive Summaryo Marketo Reverse Costing
Methodologyo Glossary
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Plus
Executive Summary
The market for power modules will have a 7.6% compound annual growth rate (CAGR) from 2017 to 2023, reaching $5.5M in 2023. The power module market plays a key role in several industrial applications from electric and hybrid electric vehicles (EV/HEV) and motor drives, to megawatt (MW) solutions like converters for wind turbines, which have a standard power range from 100kW to 8MW.
The power module packaging material business is worth $1.2B, which represents about a third of the existing power module market.Yole predicts that this power module packaging material market will have a CAGR for 2017-2023 of 8.2%, approaching $2B in value by 2023.
Module packaging currently has several critical technical aspects, such as molding, high temperature die attach and connection. It must combine good thermal and electrical efficiency while keeping low mass and volume. Also, to remain competitive, power module makers must deliver high reliability while remaining cost efficient.
In the second quarter of 2017, ABB presented its new LinPak line that offers innovative solutions for all power conversion applications. It enables the design of converters with the lowest overall inductance. Fast, low switching loss chip-sets can therefore be used for the first time in high-current applications. ABB’s LinPak modules’ low inductance leads directly to their lowest switching losses and excellent robustness.
The 5SNG 1000X170300 is a unique LinPak 1700V IGBT module from ABB with ultra-low inductance, configured in a compact design, phase-leg topology. This module uses the latest ABB Soft Punch Through (SPT++) silicon IGBT and diode.
This report presents a deep technology analysis of the 5SNG 1000X170300 module and its cost. Supported by a full teardown of the module’s components and housing, this report reveals the innovative assets that enable ABB to assemble its SPT++ chipsets in the LinPak package.
This report provides insights into the structure, technical choices, design, processes, and supply chain positions. It also estimates manufacturing cost of all the module’s components and analyses its selling price. It also includes a detailed comparison with the CAS300M17BM2 1700V SiC power module from Cree. This comparison highlights differences in the electrical parameters, dies, packaging and production costs.
©2019 by System Plus Consulting | SP19455 - ABB LinPak 1700V 2x1000A Power Module 4
Overview / Introduction
Company Profile & Supply Chain o ABB Profileo ABB Modules Portfolioo Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Plus
ABB 1700V IGBT Power Modules Portfolio
• ABB’s IGBT power modules are available from 1700V to 6500V as single IGBT, dual / phase-leg IGBT, chopper and dualdiode modules.
• The 5SNG 1000X170300 module is the only one with LinPak package in the 1700V catalog. It is of a Phase-leg typedelivering 2x1000A.
ABB’s 1700V IGBT Modules CatalogSource: ABB Website
©2019 by System Plus Consulting | SP19455 - ABB LinPak 1700V 2x1000A Power Module 5
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis o Synthesiso Packageo IGBT Die Designo IGBT Die Cross-Sectiono Diode Die Designo Diode Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Plus
(xxx x) SPT++ IGBT:
o Dimension:
xxx mm² (xxx mm x xxx mm)
o Electrical Connection: Soldered on DBC + xxx µm wire bonding
(xxx x) SPT++ Si Diodes:
o Dimension:
xxx mm² (xxx mm x xxx mm)
o Electrical Connection:
Soldered on DBC + xxx µm wire bonding
AlN DBC substrate:
o Dimension: xxx cm² (xxx mm x xxx mm)
o Electrical Connection:
Soldered on Baseplate
AlSiC Baseplate:
o Dimensions:
Synthesis of the Physical Analysis
LinPak Package:
o Dimensions: 140mm x 99.8mm x 37.5mm
PCB
LinPak Package
M3 Screw (x4)M3 Screw (x6)
M8 Nuts (x6)
Silicone gel
PCB Plastic rivet
©2019 by System Plus Consulting | SP19455 - ABB LinPak 1700V 2x1000A Power Module 6
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis o Synthesiso Packageo IGBT Die Designo IGBT Die Cross-Sectiono Diode Die Designo Diode Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Plus
Phase-Leg Configuration
ABB 5SNG 1000X170300 Datasheet
Module Housing Removed – Top Optical ViewSPT++ Diode
NTC Thermistor
SPT++ IGBT
©2019 by System Plus Consulting | SP19455 - ABB LinPak 1700V 2x1000A Power Module 7
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis o Synthesiso Packageo IGBT Die Designo IGBT Die Cross-Sectiono Diode Die Designo Diode Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Plus
Package Opening – Housing Removal Steps
Housing removal Steps – Tilted Optical Views
M3 Screw/Nut (x4)
M3 Screw (x6)
M8 Nuts (x6)
“ The connection to the auxiliary terminals for gate, emitter, collector and thermistor are realized with M3 screws.In addition, four molded M3 nuts are positioned in the corners to mechanically fix the adapter board for harsh environmental applications like traction or CAV. The adapter-board connects the modules’ gates and auxiliary emitters in parallel. Thus, many modules can be connected in parallel with just one gate-unit. “
Source: “LinPak – the new standard phase-leg module with exceptional low inductance”
ABB Article by R. Schnell et al.
Plastic Rivet (x6)
o The PCB is fixed to the Package by Snap-Riveting technique (6 Rivets are used)
©2019 by System Plus Consulting | SP19455 - ABB LinPak 1700V 2x1000A Power Module 8
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis o Synthesiso Packageo IGBT Die Designo IGBT Die Cross-Sectiono Diode Die Designo Diode Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Plus
Package Opening – Housing Removal Steps
Housing removal Steps – Optical View
AlSiC base-plate
Housing
PCB
AlN DBC Substrates (x)
M3 Screw (x4)
Terminal (x6)
©2019 by System Plus Consulting | SP19455 - ABB LinPak 1700V 2x1000A Power Module 9
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis o Synthesiso Packageo IGBT Die Designo IGBT Die Cross-Sectiono Diode Die Designo Diode Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Plus
Package Cross-Section
Package Cross-section – Optical View
Package Cross-section – Optical View
DBC substrate
xxx
xxx
xxx
DBC substrate thickness: xxx mm
o Top xxx: xxx µm
o xxx : xxx µm
o Bottom xxx : xxx µm
IGBT die
AlSiC Baseplate
IGBT die
xx µm
xxx
xxx
xxx
DBC solder:
o DBC xxx thickness : xxx µm
xxx xx µm
©2019 by System Plus Consulting | SP19455 - ABB LinPak 1700V 2x1000A Power Module 10
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis o Synthesiso Packageo IGBT Die Designo IGBT Die Cross-Sectiono Diode Die Designo Diode Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Plus
Package Cross-Section – EDX
o The presence of xxx and xxx confirms the composition of the xxx substrate
©2019 by System Plus Consulting | SP19455 - ABB LinPak 1700V 2x1000A Power Module 11
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis o Synthesiso Packageo IGBT Die Designo IGBT Die Cross-Sectiono Diode Die Designo Diode Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Plus
IGBT die dimensions
IGBT Die – Optical View
o Die dimensions:xxx mm² (xxx mm x xxx mm)
o There is no marking on the die.
xxx
mm
xxx mm
xxxx
xxxxx
©2019 by System Plus Consulting | SP19455 - ABB LinPak 1700V 2x1000A Power Module 12
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis o Synthesiso Packageo IGBT Die Designo IGBT Die Cross-Sectiono Diode Die Designo Diode Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Plus
Die Cross-Section
Transistor Cross-Section – SEM View
xxx µm
o Die thickness: xxx µm
©2019 by System Plus Consulting | SP19455 - ABB LinPak 1700V 2x1000A Power Module 13
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis o Synthesiso Packageo IGBT Die Designo IGBT Die Cross-Sectiono Diode Die Designo Diode Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Plus
Transistor Cross-Section – Optical View
Die Process – Ring
xxx µm
xxx µm
Transistor process – Optical View
xxxxxx
©2019 by System Plus Consulting | SP19455 - ABB LinPak 1700V 2x1000A Power Module 14
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis o Synthesiso Packageo IGBT Die Designo IGBT Die Cross-Sectiono Diode Die Designo Diode Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Plus
Die Cross-Section
Transistor Cross-Section – SEM View
Transistor Cross-Section – SEM View
xxx µm
xxx µm
xxx µm
xxx : xxx µm
xxx µm
xxx
o xxx thickness: xxx µm
o xxx thickness: xxx µm
o xxx thickness : xxx µm
xxx: xxx µm
xxx
xxx µm
xxx
xxx x µm
xxxxxx µm
xxx
xxx
o xxx layer thickness: xxx µm
o xxx thickness: xxx µm
o xxx thickness: xxx µm
o Xxx thickness : xxx µm
xxx
xxx
xxx
©2019 by System Plus Consulting | SP19455 - ABB LinPak 1700V 2x1000A Power Module 15
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis o Synthesiso Packageo IGBT Die Designo IGBT Die Cross-Sectiono Diode Die Designo Diode Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Plus
Transistor Cross-Section – SEM View
Die Process
Transistor after delayering – SEM View
o Transistor pitch: xxx µm
xxx µm
xxx µmxxx
xxx
xxx xxx
xxx
©2019 by System Plus Consulting | SP19455 - ABB LinPak 1700V 2x1000A Power Module 16
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis o Synthesiso Packageo IGBT Die Designo IGBT Die Cross-Sectiono Diode Die Designo Diode Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Plus
Die Cross-Section – Active Area Doping Revelation
Transistor Cross-Section Doping revelation – SEM View
xxx
xxx
xxx
xxx
xxxxxx
xxx
©2019 by System Plus Consulting | SP19455 - ABB LinPak 1700V 2x1000A Power Module 17
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis o Synthesiso Packageo IGBT Die Designo IGBT Die Cross-Sectiono Diode Die Designo Diode Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Plus
Die Dimensions
Diode Die – Optical view
xxx mm
xxx
mm
o Die dimensions:xxx mm² (xxx mm x xxx mm)
Diode Die – Optical view
xxx
©2019 by System Plus Consulting | SP19455 - ABB LinPak 1700V 2x1000A Power Module 18
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis o Synthesiso Packageo IGBT Die Designo IGBT Die Cross-Sectiono Diode Die Designo Diode Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Plus
Die Cross-Section
Die Cross-Section – SEM View
xxx µm
o Die thickness: xxx µm
xxx
©2019 by System Plus Consulting | SP19455 - ABB LinPak 1700V 2x1000A Power Module 19
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis o Synthesiso Packageo IGBT Die Designo IGBT Die Cross-Sectiono Diode Die Designo Diode Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Plus
Die Cross-Section
Die Cross-Section – SEM View
Die Cross-Section – SEM View
xxx
xxx
xxx
xxx
xxx
xxx
xxx µm
xxx µm
xxx µm
o xxx layer thickness: xxx µm
o xxx thickness: xxx µm
o xxx thickness: xxx µm
xxx : xxx µmxxx
xxx
xxx
©2019 by System Plus Consulting | SP19455 - ABB LinPak 1700V 2x1000A Power Module 20
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis
Manufacturing Process Flowo Dies Process Flowo Dies Fab Unito Packaging Process Flowo Packaging Fab Unit
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Plus
IGBT Process Flow (1/3)
Implantation
• SiO2 deposition
•Pattern SiO2
•P-well implantation
Implantation
• SiO2 deposition
•Pattern SiO2
•N+ Emitter implantation
Gate oxide
•Thin Gate Oxide growth and pattern
Drawing not to Scale
0 00 000
0 00 000
0 00 000
Si Substrate N+
P well
©2019 by System Plus Consulting | SP19455 - ABB LinPak 1700V 2x1000A Power Module 21
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis
Manufacturing Process Flowo Dies Process Flowo Dies Fab Unito Packaging Process Flowo Packaging Fab Unit
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Plus
Module Process Flow
©2019 by System Plus Consulting | SP19455 - ABB LinPak 1700V 2x1000A Power Module 22
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Synthesiso IGBT Die Costo Diode Die Costo Packaging Costo Module Cost
Selling Price Analysis
Comparison
Related Reports
About System Plus
IGBT Front-End Cost
o The Front-End cost ranges from $xxx to $xxx accordingto yield variations.
o The main part of the wafer cost is due to the xxx (xx%).
©2019 by System Plus Consulting | SP19455 - ABB LinPak 1700V 2x1000A Power Module 23
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Synthesiso IGBT Die Costo Diode Die Costo Packaging Costo Module Cost
Selling Price Analysis
Comparison
Related Reports
About System Plus
Diode Wafer Cost per process steps
©2019 by System Plus Consulting | SP19455 - ABB LinPak 1700V 2x1000A Power Module 24
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Synthesiso IGBT Die Costo Diode Die Costo Packaging Costo Module Cost
Selling Price Analysis
Comparison
Related Reports
About System Plus
Diode Die Cost
The diode die cost ranges from $xxx to $xxx according to yield variations.
The Front-End manufacturing represents xxx% of the component cost(medium yield estimation).
Probe test, dicing and scrap account for xxx% of the component cost.
©2019 by System Plus Consulting | SP19455 - ABB LinPak 1700V 2x1000A Power Module 25
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Synthesiso IGBT Die Costo Diode Die Costo Packaging Costo Module Cost
Selling Price Analysis
Comparison
Related Reports
About System Plus
Packaging Cost
©2019 by System Plus Consulting | SP19455 - ABB LinPak 1700V 2x1000A Power Module 26
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Plus
Estimated Manufacturer Price
The module manufacturing cost ranges from$xxx to $xxx according to yield variations.
By taking into account a gross margin of 31%for ABB (2018 results), the module sellingprice is estimated to range from $xxx to $xxxaccording to yield variations.
©2019 by System Plus Consulting | SP19455 - ABB LinPak 1700V 2x1000A Power Module 27
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Plus
Comparison Between ABB and Cree 1700V Power Modules
Cree All-SiC 1700V Power Module CAS300M17BM2 ABB IGBT 1700V Power Module 5SNG 1000X170300
o Both modules use xxx AlN DBC substrates.
©2019 by System Plus Consulting | SP19455 - ABB LinPak 1700V 2x1000A Power Module 28
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Plus
Comparison Between ABB and Cree 1700V Power Modules
Cree All-SiC 1700V Power Module CAS300M17BM2 ABB Power Module 5SNG 1000X170300
o xxx power modules are xxx than xxx.
©2019 by System Plus Consulting | SP19455 - ABB LinPak 1700V 2x1000A Power Module 29
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Plus
Comparison Between ABB and Cree 1700V Power Modules’ Transistors
1700V IGBT in ABB Module1700V SiC MOSFET in Cree Module
Transistor in Module Die Area Current Density Die Thickness
MOSFET in Cree xxx mm² xxx A/mm² xxx µm
IGBT in ABB xxx mm² xxx A/mm² xxx µm
o xxx dies are more performant in delivering high current densities.
©2019 by System Plus Consulting | SP19455 - ABB LinPak 1700V 2x1000A Power Module 30
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Plus
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
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©2019 by System Plus Consulting | SP19455 - ABB LinPak 1700V 2x1000A Power Module 31
COMPANYSERVICES
©2019 by System Plus Consulting | SP19455 - ABB LinPak 1700V 2x1000A Power Module 32
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Pluso Company Serviceso Contact
Business Models Fields of Expertise
Custom Analyses(>130 analyses per year)
Reports(>40 reports per year)
Costing Tools
Trainings
©2019 by System Plus Consulting | SP19455 - ABB LinPak 1700V 2x1000A Power Module 33
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Pluso Company Serviceso Contact
Contact
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