Epon product overview 2009 08

Product Overview

EPON™ and

EPI-REZ™

Epoxy Resins

EPON™ and EPI-REZ™ Epoxy Resins Introduction Qualifying a resin system that offers the best balance of performance and processability

can be a significant task. You not only need quality products from a reliable supplier; you need a company that is willing to share its technical expertise and who will provide services that help satisfy your unique requirements. That's where we come in. We're the Epoxy Business of Hexion Specialty Chemicals, one of the world’s leading suppliers of epoxy resins, curing agents, modifiers and epoxy systems. We offer a diverse line of epoxy resins that vary in chemical structure, molecular weight, viscosity and functionality - providing the formulator with a multitude of options. What's more, our products have over sixty years of innovation and success in a variety of markets and end-use applications. At our world-class technology centers in the U.S. and Europe, we pursue advanced processing technologies while creating new resin products and systems with broad performance ranges. By continually working on technical challenges in our application laboratories, we are able to translate real application requirements into high quality, production-oriented materials. The EPON™ and EPI-REZ™ families of resins were developed to provide superior overall performance in a variety of end-use applications. These products enable manufacturers to achieve practically any desired performance level, while optimizing processability and strength retention at elevated temperatures. EPON resins, in thermoset systems with our curing agents and modifiers, offer advantages such as: • Low room temperature viscosity • Very long working life • Low moisture absorption • Good epoxy performance characteristics • Flexibility • Reactivity • High elongation • Adjustable cure times • Good chemical and corrosion resistance • Heat resistance • Fire retardance • MIL-R-9300B specifications (in some resin systems)

Page At A Glance EPON™ - Liquid Epoxy Resins and Blends 4 – 5 This segment of our product line represents the most widely used products in a

number of industries. The most commonly used EPON Resin/Heloxy™ Modifier blends are available in several types and viscosity grades.

EPON - Epoxy Resin Solutions 5 – 6 These products are higher molecular weight standard or modified epoxies

which are cut in solvent to allow easier handling and formulation via lower viscosity.

EPON - Solid and Powder Grade Resins 7 These epoxy resins are in the molecular weight range most suitable for use in

epoxy solutions, powder coating and electronic applications. These products have a good balance of properties, including appropriate epoxy functionality for proper curing, good physical stability (sintering resistance), and good melt flow (low melt viscosity).

EPON - Epoxy Novolac Resins 8 These products are specifically designed to provide increased levels of thermal

stability and chemical resistance, and are used in composites, structural adhesives, electronics / electrical and coating applications.

EPON - Epoxy Polyacrylates 9 These are very low viscosity resins possessing excellent wetting characteristics

and rapid reaction rates with amine curatives over a broad temperature range.

EPON - Elastomer Modified Epoxy Resins 9 These products offer improved adhesive properties, thermal shock resistance

and toughness, with good fatigue resistant properties.

EPONEX™ – Cycloaliphatic Resin 9 This segment offers a low viscosity liquid epoxy based on hydrogenated

Bisphenol A for applications requiring UV resistance.

EPON and EPONOL™ - Electrical Laminating Resins 10 These products can be used to obtain fire retardance in a base epoxy resin

formulation. The ultra-high molecular weight resin can be used to improve flexibility and modify the flow properties of the system

EPON and EPIKOTE™ - Epoxy Resins for Composites 10 Epoxy resins that provide the property retention, toughness and corrosion

protection required in composite applications.

EPI-REZ™ - Epoxy Waterborne Resins 11 These non-ionic aqueous dispersions of our epoxy resins provide benefits such

a low or zero VOCs, extended potlife, high crosslink density, high temperature performance, very good chemical resistance, B-stage capability, low color, and complete water-reducibility. Many of the Hexion EPIKURE™ Curing Agents can be used with these epoxy dispersions. In addition, since dicyandiamide is water soluble, it may be used to provide extended potlife formulations.

The Formulator’s Choice

All of our products are manufactured to high standards of quality and have very specific property ranges. To help you assess the many production and performance advantages of Hexion’s complete line of resins, we’ve summarized typical properties and resin characteristics in the technical charts below. The data in this brochure are intended to give only basic product information for quick reference – individual product technical data sheets with additional information are available for many of the products listed in the following pages. For additional information about any or all of these products, or to contact us, visit the Epoxy, Curing Agents and Modifiers section of the Hexion website at:

www.hexion.com/epoxy

Resin Solution Coding System

Epoxy resins employ a simple three-part coding system for designating the composition of resin solutions. The coding system consists of a number indicating the epoxy resin used in the particular solution, followed by one or more letters that describe the solvent or combination of solvents used to make up the solution. The last two numbers indicate the percent solids (by weight) of the composition. For example:

EPON™ Resin 1001-H-75 In this example, the base resin used to make this solution is the EPON Resin 1001F type. The solvent used is Propylene Glycol Monomethyl Ether (PM), as noted from the list below, and the solids content is 75% by weight. The coding system that is used to designate the solvents in resin solutions is as follows:

Letter Code Solvent Name Abbr Non HAPS VOC

Exempt A Acetone Yes Yes

B Methyl Ethyl Ketone MEK Yes

C Methyl Isobutyl Ketone MIBK

D Diacetone Alcohol DAA Yes

E Isopropyl Alcohol IPA Yes

F n-Butyl Alcohol (Converting to Code "N") NBA Yes

G n-Butyl Acetate NBAC Yes

H Propylene Glycol Monomethyl Ether PGMME / PM Yes

I iso-Butyl Alcohol Yes

J Ethyl 3-Ethoxy Propionate EEP

K t-Butyl Acetate TBAC Yes Yes

L Propylene Glycol Mono n-Butyl Ether PGMnBE / PnB Yes

M Ethylene Glycol Monobutyl Ether EGMBE / EB Yes

N n-Butyl Alcohol NBA Yes

O Methyl n-Amyl Ketone MNAK Yes

P n-Propyl Alcohol NPA Yes

Q Propylene Glycol Monomethyl Ether Acetate PGMMEA / PMA Yes

R Dimethyl Formamide DMF

S Cyclohexanone Yes

T Toluene

U Aromatic 100 A 100 < 5% HAPS

V Dipropylene Glycol Monomethyl Ether DPGME Yes

W Water Yes Yes

X Xylene

Y Ethylene Glycol Monopropyl Ether EGMPE / EP

Page 4

Table 1 / Typical Properties of EPON™ Unmodified Liquid Epoxy Resins

Product Chemical

Type Viscosity

@ 25°C (P) Weight per

Epoxide Color 1 Density(lb/gal) Comments

EPON 825 DGEBPA 50 – 65 175 – 180 < 50 9.7 Ultra high purity, low viscosity liquid epoxy used for high solids coatings and specialty composites.

EPON 826 DGEBPA 65 – 95 178 – 186 < 50 9.7 Low viscosity liquid epoxy used in coatings and composite applications.

EPON 827 DGEBPA 80 - 100 179 – 184 < 100 9.7 Medium viscosity liquid epoxy resin that falls between EPON 826 and EPON 828. It is used mainly in composite applications.

EPON 828 DGEBPA 110 – 150 185 – 192 < 50 9.7 Predominant liquid epoxy product, widely used in multiple applications.

EPON 830 DGEBPA 170 – 225 190 – 198 < 50 9.7 Higher molecular weight liquid epoxy. EPON 834 DGEBPA 3.5 – 9 2 230 – 280 < 50 9.7 Highest molecular weight liquid epoxy used in adhesives and as a

modifier of liquid epoxy systems. EPON 862 DEGBPF 25 – 45 165 – 173 < 50 9.8 Low viscosity Bisphenol F liquid epoxy used alone or in blends

with other resins. Allows high solids formulations with good chemical resistance. A high performance alternative to diluted EPON 828 resins.

EPON 863 DEGBPF 25 – 45 165 – 174 < 50 9.9 Comparable performance to EPON 862 with improved crystallization resistance.

1 Platinum-Cobalt Color Scale 2 70% by weight solution in Diethylene Glycol Monobutyl Ether

Table 2 / Typical Properties of EPON Modified Liquid Epoxy Resins

Product Chemical

Type Viscosity



EPON 824 Modified DGEBPA

40 – 70 192 – 204 < 200 9.6 Liquid epoxy modified for low viscosity and may be used as an alternative to diluted EPON 828 resins.


30 – 70 193 – 203 < 200 9.6 Liquid epoxy resin pre-catalyzed for subsequent up-staging.


110 – 150 185 – 195 < 50 9.7 Anti-foaming and anti-settling modified liquid epoxy resin for systems with fillers and pigments.


110 – 140 182 – 195 < 50 9.7 Anti-foaming and anti-settling modified liquid epoxy resin for silica filled systems.


15 – 38 3 625 – 725 < 6 2 9.0 Liquid epoxy modified for flexibility and toughness. Used in applications where thermal shock or impact resistance is important.

1 Platinum-Cobalt Color Scale 2 Gardner Color Scale 3 75% by weight solution in Xylene

Page 5

Table 3 / Typical Properties of EPON™ Epoxy Resin Blends

Product Chemical

Type Viscosity


Epoxide Color 1 Density (lb/gal) Comments

EPON 235 DGEBPA/ DGEBPF

60 – 80 177 – 182 < 50 9.8 Blend of BPA and BPF liquid epoxy resins. It provides lower viscosity than standard LER as well as crystallization resistance.

EPON 813 Diluted DGEBPA

5 – 7 180 – 195 < 50 9.5 Liquid epoxy diluted with HELOXY 62 – Cresyl Glycidyl Ether, for good chemical and crystallization resistance.

EPON 815C Diluted DGEBPA

5 – 7 180 – 195 < 50 9.4 Liquid epoxy diluted with HELOXY 61 – Butyl Glycidyl Ether, providing superior wetting characteristics.


7 – 10 182 – 190 < 50 9.4 Similar to EPON 815C with slightly higher viscosity.


11 – 16 245 – 275 < 50 9.2 Liquid epoxy diluted with HELOXY 505 – Castor Oil Glycidyl Ether, for flexibility in flooring and adhesive applications.


5 – 7 195 – 215 < 50 9.2 Liquid epoxy diluted with HELOXY 8 – Alkyl Glycidyl Ether, utilized in a broad range of applications.

EPON CS 241 Diluted DGEBPA

22.5 – 27.5 190 – 200 < 50 9.6 Liquid epoxy diluted with HELOXY 8 – Alkyl Glycidyl Ether. A higher viscosity version of EPON 8132.

EPON CS 242 Diluted DGEBPA

13.5 – 18.5 195 – 205 < 50 9.4 Liquid epoxy diluted with HELOXY 8 – Alkyl Glycidyl Ether. A medium viscosity version of EPON 8132 most often used in flooring systems.

EPON CS 243 Modified DGEBPA Solution

52 – 58 187-195 < 1 9.6 Liquid epoxy diluted with HELOXY 8 – Alkyl Glycidyl Ether that provides easier handling with good overall performance.


50 – 65 180 – 195 < 50 9.7 Liquid epoxy diluted with HELOXY 62 – Cresyl Glycidyl Ether and modified for anti-settling and anti-foaming, primarily used in highly filled systems.

1 Platinum-Cobalt Color Scale

Table 4 / Typical Properties of EPON Liquid Epoxy Solutions

Product Chemical

Type Viscosity



EPON 828-X-95 DGEBPA Solution

15 – 45 193 – 204 < 1 9.5 Resin solution, 95% solids in Xylene.

EPON 834-F-90 DGEBPA Solution

46 – 148 225 – 265 < 1 9.3 Resin solution, 90% solids in n-Butanol.


4.5 – 18 230 – 280 < 1 9.2 Resin solution, 80% solids in Xylene.



EPON 836-C-75 DGEBPA Solution

3 – 6.5 280 – 335 < 1 8.9 Resin solution, 75% solids in MIBK.

EPON 8521-MX-60 Mod DGEBPA Solution

17.5 – 36 750 – 850 < 1 8.8 Modified resin solution, 60% solids in Ethylene Glycol Monobutyl Ether / Xylene, for improved surface tension characteristics.

EPON 872-X-75 Mod DGEBPA Solution

20 – 28 625 – 700 < 6 8.4 Modified resin solution, 75% solids in Xylene, for applications needing flexibility and toughness.

EPON 873-CX-80 Mod DGEBPA Solution

4.5 – 23

380 – 420 < 5 8.6 Modified resin solution, 80% solids in MIBK / Xylene, for applications needing flexibility, toughness, and reduced VOC levels.

EPON 874-B-90 Mod DGEBPA Solution

550 – 1290 245 – 275 < 6 9.1 Modified resin solution, 80% solids in MEK, for applications needing flexibility, toughness, and reduced VOC levels.

EPON 874-CX-90 Mod DGEBPA Solution

13 – 27 245 – 275 < 4 9.1 Modified resin solution, 90% solids in MIBK / Xylene, for applications needing flexibility, toughness, and reduced VOC levels.

1 Gardner Color Scale

Page 6

Table 5 / Typical Properties of EPON™ Solid Epoxy Solutions

Product Chemical

Type Viscosity



EPON 1001-A-80 DGEBPA Solution

27 – 148

450 – 550 < 1 9.2 Resin solution, 80% solids in Acetone (VOC exempt).

EPON 1001-B-80 DGEBPA Solution

27 – 148

450 – 550 < 1 9.1 Resin solution, 80% solids in MEK.

EPON 1001-CX-75 DGEBPA Solution

27 – 148

450 – 550 < 1 9.0 Resin solution, 75% solids in MIBK / Xylene.

EPON 1001-FT-75 DGEBPA Solution

27 – 148

450 – 600 < 1 9.1 Resin solution, 75% solids in n-Butanol / Toluene.

EPON 1001-G-70 DGEBPA Solution

36 – 99 450 – 500 < 1 9.2 Resin solution, 75% solids in n-Butyl Acetate.

EPON 1001-H-75 DGEBPA Solution

36 – 388 450 – 600 < 1 9.2 Resin solution, 75% solids in Propylene Glycol Monomethyl Ether.

EPON 1001-K-65 DGEBPA Solution

10 – 50 450 – 550 < 1 8.8 Resin solution, 65% solids in t-Butyl Acetate (VOC exempt).

EPON 1001-O-75 DGEBPA Solution

27 – 148

450 – 550 < 1 9.0 Resin solution, 75% solids in MNAK.

EPON 1001-T-75 DGEBPA Solution

36 – 388 450 – 550 < 1 9.1 Resin solution, 75% solids in Toluene.

EPON 1001-UY-70 DGEBPA Solution

36 – 64 450 – 500 < 1 9.0 Resin solution, 70% solids in Aromatic 100 / Ethylene Glycol Monopropyl Ether.



EPON 1004-O-65 DGEBPA Solution

23 – 99 850 – 1050 < 1 8.7 Resin solution, 65% solids in MNAK.

EPON 1007-CT-55 DGEBPA Solution

23 – 64 1600-2300 < 1 8.4 Resin solution, 55% solids in MIBK / Toluene.

EPON 1007-FMU-50 DGEBPA Solution

27 – 64 1600-2300 < 1 8.3 Resin solution, 50% solids in n-Butanol / Ethylene Glycol Monobutyl Ether / Aromatic 100.

EPON 1007-HT-55 DGEBPA Solution

27 – 64 1600-1900 < 1 9.0 Resin solution, 55% solids in Propylene Glycol Monomethyl Ether / Toluene.

EPON 1009-DU-40 DGEBPA Solution

11 – 27 2300-3500 < 1 8.3 Resin solution, 40% solids in Diacetone Alcohol / Aromatic 100.

EPON 1009-MX-40 DGEBPA Solution

6 – 23 2300-3000 < 1 8.3 Resin solution, 40% solids in Ethylene Glycol Monobutyl Ether / Xylene.


Table 6 / Typical Properties of EPON Solid Epoxy Custom Solutions

Product Chemical

Type Viscosity



EPON CS 258 DGEBPA Solution

40 – 65 1600-1900 < 1 8.9 Resin solution, 50% solids in Propylene Glycol Monomethyl Ether Acetate.


13 – 36 2700-3300 < 3 8.8 High molecular weight resin modified for high toughness, 65% solids in Propylene Glycol Monomethyl Ether Acetate / Toluene.


75 – 95 182-196 < 1 9.6 Resin solution, 96% solids with p-tert-Butyl Phenyl Glycidyl Ether.


Page 7

Table 7 / Typical Properties of EPON™ Solid Epoxy Resins – Fusion Grades

Product Chemical

Type

Solution Viscosity 1

@ 25°C (cP)

Weightper

Epoxide Color 1,2SofteningPoint (°C)

Melt Viscosity

@ 150°C (P) Comments

EPON 1001F DGEBPA 7.0 – 9.6 525 – 550 < 200 79 4 – 5 Lowest molecular weight solid epoxy with used to provide improved toughness, flexibility, flow control and tack. Basic resin for coatings and pre-preg. Susceptible to sintering. Density 1.20 g/ml.

EPON 1002F DGEBPA 9.2 – 13.6 600 – 700 < 200 85 12 – 25 Slightly higher molecular weight than EPON 1001F. Better sinter resistance. Density 1.20 g/ml

EPON 1004F DGEBPA 15 – 25 800 – 950 < 200 96 16 – 20 Medium molecular weight solid epoxy resin containing hydroxyl groups. Often reacted with vegetable oil acids to produce epoxy ester resins. Can also add toughness, flexibility and rheology control. Density 1.20 g/ml.

EPON 1007F DGEBPA 50 – 100 1700-2300 < 200 125 ≈ 500 Moderately high molecular weight solid epoxy resin used for industrial coatings cured with urea-formaldehyde and phenol-formaldehyde resins. Density 1.19. g/ml.

EPON 1009F DGEBPA 100 – 250 2300-3800 < 200 135 > 500 High molecular weight solid epoxy resin for baked industrial coatings cured with urea-formaldehyde and phenol-formaldehyde resins. Density 1.19 g/ml.

1 40% by weight solution in MEK 2 Platinum-Cobalt Color Scale

Page 8

Table 8 / Typical Properties of EPON™ Solid Epoxy Resins – Powder Coating & Molding Grades

Product Chemical

Type


@ 25°C (cP) Weight per

Epoxide Color 1,2Softening Point (°C)

Melt Viscosity


EPON 2002 DGEBPA 10 – 17 675 – 760 < 50 80 – 90 20 – 40 Medium low molecular weight solid epoxy resin containing hydroxyl groups used primarily for thin film epoxy powder coating applications. Density 1.19 g/ml.

EPON 2003 DGEBPA 13.5 – 18 725 – 825 < 50 90 – 95 30 – 50 Medium molecular weight solid epoxy resin containing hydroxyl groups used primarily for thin or thick epoxy powder coating applications. Density 1.19 g/ml.

EPON 2004 DGEBPA 18 – 27 875 – 975 < 50 95 -105 70 – 120 Medium molecular weight solid epoxy resin used primarily for thin or thick epoxy powder coating applications. Density 1.19 g/ml.

EPON 2005 DGEBPA 25 – 55 1200-1400 < 50 110 – 120 > 300 Moderately high molecular weight solid epoxy resin used primarily for intermediate and thick film epoxy powder coating applications. Density 1.19 g/ml.


35 – 75 750 – 850 < 50 100 – 120 200 – 600 Moderately high molecular weight solid epoxy resin modified with epoxy phenol novolac used primarily in high performance powder coating applications to provide superior chemical and corrosion resistance. Density 1.19 g/ml.


17 – 26 850 – 950 < 50 95 – 105 60 – 120 Medium molecular weight solid epoxy resin modified with a flow control agent. Density 1.18 g/ml.


8 – 12 625 – 675 < 50 --- --- Medium low molecular weight solid epoxy resin modified for improved flow.


Table 9 / Typical Properties of EPON™ Solid Epoxy Resins – Electrical Grade

Product Chemical

Type



Epoxide Color 1,2Softening Point (°C)

Melt Viscosity



7.4 – 9.5 520 – 590 < 200 75 – 80 6 – 8 Solid epoxy resin flake, modified for low melt viscosity and high reactivity. Primarily used for electrical encapsulation.


Page 9

Table 10 / Typical Properties of EPON & EPIKOTE™ Epoxy Novolac Resins

Product Chemical Type Viscosity



EPON 1031 TGETPE Flake

39 2 195 – 230 > 18 10.4 Tetraglycidyl Ether of Tetraphenol Ethane with a functionality of 3.5. Used in applications requiring high temperatures and chemical resistance.

EPON 1031-A-70

TGETPE Solution 0.5 – 2.2

195 – 230 > 18 9.1 EPON 1031 solution, 70% solids in Acetone.

EPON HPT 1050

Epoxy Phenolic Novolac

310 – 400 3 176 – 181 < 1 10.3 Epoxy phenolic novolac resin with a functionality of 3.6. Produces high strength cured systems with good chemical resistance and elevated temperature stability.

EPON HPT 1050-A-85

Epoxy Ph Novolac Solution

5 – 12 176 – 181 < 1 9.0 EPON 1050 solution, 85% solids in Acetone.

EPON 154 Epoxy Phenolic Novolac

310 – 400 3 176 – 181 < 1 10.3 Epoxy phenolic novolac resin with a functionality of 3.6, providing high chemical and temperature resistance, and dimensional stability.

EPON SU-2.5 Epoxy BPA Novolac

20 – 60 3 180 – 200 < 2 9.8 Epoxy Bisphenol A novolac with a functionality of 2.5, providing good thermal stability and chemical resistance. Used in electrical, adhesive and composite applications.

EPON SU-8 Epoxy BPA Novolac

Flake

10 – 60 4 195 – 230 < 5 10.0 Epoxy Bisphenol A novolac with a functionality of 8, providing rapid development of green strength, with good high temperature performance. Used in electrical, adhesive and composite applications.

EPON 160 Epoxy BPF Novolac

345 – 485 168 – 178 < 1 9.9 BPF epoxy novolac with a functionality of 2.6 – a low viscosity version of EPON 154. High functionality with easy processing, good thermal stability and chemical resistance.


180 – 280 169 – 178 < 1 9.9 BPF epoxy novolac with a functionality of 2.5 – a lower viscosity version of EPON 160. High functionality with easy processing, good thermal stability and chemical resistance.


60 – 78 166 – 178 < 1 9.9 BPF epoxy novolac with a functionality of 2.2 – the lowest viscosity version of EPON 160. Adequate functionality with easiest processing, yet with good thermal stability and chemical resistance.

EPON 164 Epoxy Cresol Novolac Flake

35 – 50 5 200 – 240 < 2 10.0 Solid epoxy cresol novolac resin with a functionality of 4.1 and is used in high performance laminates, molding compounds, aerospace composites, special adhesives, and tooling systems.

EPON 165 Epoxy Cresol Novolac Flake

100 – 200 4 200 – 230 < 6 10.0 Solid epoxy cresol novolac resin with a functionality of 5.5 and is used in very high performance laminates, molding compounds, special adhesives, aerospace composites, and tooling systems.

EPIKOTE 496 Glycidyl Amine

30 – 60 6 111 – 117 ≤ 6 9.7 Low viscosity tetra-functional amine based epoxy resin. Exhibits high glass transition temperatures and excellent retention of mechanical properties at elevated temperatures when cured with suitable curing agents. Primarily used in high performance composites, adhesives and laminates. (TGMDA)

EPIKOTE 498 Glycidyl Amine

5.5 – 8.5 95 – 106 ≤ 3 10.1 High purity, low viscosity tri-functional amine based epoxy resin. Exhibits rapid cure rates and high glass transition temperatures when cured with suitable curing agents. Primarily used in rapid cure adhesives and laminates, and as a viscosity modifier for high temperature, high functionality composite and adhesive systems. (TGPAP)

1 Gardner Color Scale 2 @ 120°C 3 @ 52°C 4 @ 130°C 5 60% by weight solution in MEK 6 @ 50°C

Page 10

Table 11 / Typical Properties of EPON™ Epoxy Polyacrylates

Product Chemical

Type Viscosity

@ 25°C (cP) Equivalent

Weight Color 1 Density (lb/gal) Comments

EPON 8021 Epoxy Polyacrylat

e

85 – 115 150 < 1 9.2 Very low viscosity epoxy diacrylate resin that imparts high reactivity and superior wetting characteristics. 13 minute gel time with TETA.


e

800 – 1100 140 < 1 9.5 Low viscosity epoxy triacrylate resin that provides rapid reaction rates. Uses include high-build sealers, wear-resistant surfacing and low temperature cure applications. 2.5 minute gel time with TETA.


e

1800 – 2400 177 < 1 9.6 Moderate viscosity epoxy diacrylate resin with performance similar to EPON 828. Applications include flooring, grouts, adhesives, casting and encapsulation systems. 27 minute gel time with TETA.


Table 12 / Typical Properties of EPON™ Elastomer Modified Epoxy Resins

Product Chemical

Type Viscosity



EPON 58005 CTBN Modified DGEBPA

3000-8000 325 – 375 < 9 9.0 CTBN modified BPA epoxy resin with an elastomer content of 40%. Utilized in high performance adhesives for peel strength, thermal shock resistance, toughness and fatigue resistance.


1500-3000 330 – 360 < 9 8.9 CTBN modified BPA epoxy resin with an elastomer content of 40%, but a slightly lower acrylonitrile level than EPON 58005. For flexibility and fatigue resistance in adhesives and composites.

EPON 58034 CTBN Modified DGENPG

40 – 80 275 – 305 < 7 8.4 CTBN modified HELOXY 68 with an elastomer content of 50%. Provides a low viscosity and high toughness modifier for adhesives and sealants.

EPON 58042 CTBN Modified

DGECHDM

150 – 300 325 – 375 < 6 8.5 CTBN modified HELOXY 107 with an elastomer content of 50%. Used as a modifier in many epoxy systems for adhesive and flexibility characteristics in adhesives and composites.


50 – 200 2 850 – 1050

Straw --- CTBN modified solid epoxy resin with an elastomer content of 20%. Straw color. Used for adhesion, thermal shock, fatigue and impact resistance in functional pipe and thick film powder coatings as well as for electrical powders.


1000-5000 195 – 210 < 5 9.6 CTBN modified BPA epoxy resin with an elastomer content of 5%. Provides flexibility and tack for early green strength, and also provides flow control for adhesives, prepregs and sealants.

1 Gardner Color Scale 2 @ 150°C

Table 13 / Typical Properties of EPONEX™ Cycloaliphatic Resin

Product Chemical

Type Viscosity



EPONEX 1510 Hydrogenated DGEBPA

1800-2500 210-220 < 80 9.1 Low viscosity Cycloaliphatic Glycidyl Ether. Used to obtain epoxy performance in coatings, electronics and specialty composites where UV resistance is a requirement.

1 Platinum-Cobalt Color Scale

Page 11

Table 14 / Typical Properties of EPON™ Electrical Laminating Resins

Product Chemical

Type Viscosity



EPON 1124-A-80 DGETBBPA 1200 – 2000 425 – 445 < 2 10.2 Acetone solution of brominated resin for flame retardant electrical laminates. Bromine Content – 19.5% by weight. Slightly higher molecular weight than EPON 1123-A-80.

EPON 1163 DGETBBPA 100 – 1200 2 380 – 410 < 100 4 15.4 Low melting solid epoxy with 48% by weight bromine. Softening point at 64°C. Imparts fire retardancy in laminating, casting and molding applications.

EPON 1183 DGETBBPA 1000-3000 3 625 – 725 < 200 4 14.4 Higher melting solid epoxy with 42% by weight bromine. Softening point at 95°C. Designed for sintering resistance and moderate flammability resistance.

EPON CS 373 Modified Brominated

Epoxy

100 – 600 350 – 400 < 12 10.0 One-pack, DICY-free, brominated epoxy resin and curing agent solution supplied as 70% by weight solids in a blend of Methyl Ethyl Ketone (MEK) and Propylene Glycol Monomethyl Ether (PGME). Used for high Tg applications at 180°C. Bromine Content – 13.5% by weight.

1 Gardner Color Scale 2 @ 120°C 3 @ 150°C 4 Platinum-Cobalt Color Scale

Table 15 / Typical Properties of EPONOL™ Ultra High Molecular Weight Resin

Product Chemical

Type Viscosity

@ 25°C (cP) Viscosity

@ 25°C (Gardner) Color 1 Density(lb/gal) Comments

EPONOL 53-BH-35 DGEBPA 600-3600 U – Z2 < 2 7.8 Ultra high-molecular-weight epoxy resin used for adhesives and prepreg laminates to impart flexibility and to modify flow properties of the system.


Table 16 / Typical Properties of EPON & EPIKOTE™ Epoxy Resins for Composites

Product Chemical

Type Viscosity



EPON 9504 DGEBPA 1300 – 2000 169 – 177 < 1 9.5 For VARTM and SCRIMP processes needing low system viscosity with low temperature curing capability.

EPON 9215 DGEBPA 3000 – 5000 187 – 207 < 1 9.6 For CIPP (Cured In Place Pipe) applications where long term physical integrity, durability and resistance to chemical attack is needed. Typically used with EPIKURE 9270.


Page 12

Table 17 / Typical Properties of EPI-REZ™ Waterborne Epoxy Resin Dispersions Product

Chemical Type

Viscosity @ 25°C (cP)

Weight per Epoxide pH

Density (lb/gal) Comments

EPI-REZ 3510-W-60 DGEBPA Dispersion

500-5000 185-215 4-7 9.0 Waterborne dispersion of a low molecular weight liquid Bisphenol A epoxy resin (EPON Resin 828 type).


4000-15000 225-275 4-7 9.2 Waterborne dispersion of a semi-solid Bisphenol A epoxy resin.

EPI-REZ 3520-WY-55 DGEBPA Dispersion

7000-17000 485-555 7-9 9.1 Waterborne dispersion of a semi-solid Bisphenol A epoxy resin (EPON 1001 type) with an organic co-solvent. Primarily used in coatings systems.


8000-18000 615-715 7-9 9.2 Waterborne dispersion of a solid Bisphenol A epoxy resin (EPON 1002 type). Typically used in film and fiber adhesives and finishes, FRP, and electrical dip coatings.


7000-17000 1600-2000 7-10 9.0 Waterborne dispersion of a solid Bisphenol A epoxy resin (EPON 1007 type) with an organic co-solvent. Generally used in baked industrial finishes, fiber finishes/binders, and as a modifier for ambient cure systems.

EPI-REZ 3546-WH-53 DGEBPA Dispersion

1000-15000 1900-2200 7-10 9.0 Waterborne dispersion of a solid Bisphenol A epoxy resin (EPON 1007 type) similar to EPI-REZ 3540-WY-55 with a non HAPS co-solvent.

EPI-REZ 5003-W-55 BPA Novolac Dispersion

2000-15000 195-215 3-5 9.2 Waterborne dispersion of an epoxidized Bisphenol A novolac modified epoxy resin with an average functionality of 3 (EPON SU-3 type). Promotes wetting and adhesion to a variety of fibers and enhances chemical resistance in coatings.


2000-15000 480-560 3-5 9.2 Waterborne dispersion of a urethane-modified Bisphenol A epoxy resin. Provides improved chemical resistance and thermal performance for fiber finishes and industrial textile applications.


8000-19000 550-700 7-9 9.0 Waterborne dispersion of a novolac modified Bisphenol A epoxy resin (EPON 1002 type) with an organic co-solvent. Used for high performance coatings where higher chemical resistance and corrosion protection are required.

EPI-REZ 6006-W-68 OCN Novolac Dispersion

500-2000 230-270 8.5-9.5 9.0 Waterborne dispersion of an epoxidized o-cresylic novolac resin with an average functionality of 6. It provides high temperature stability, abrasion and chemical resistance in coatings, composites, adhesive and electronic applications.

EPI-REZ 6520-WH-53 DGEBPA Dispersion

1000-6000 500-600 7.5-9.5 8.9 NewGenTM Waterborne dispersion of a solid Bisphenol A epoxy resin (EPON 1001 type) with a non HAPS co-solvent. Provides exceptional corrosion protection for metal substrates as primers, DTM and topcoats.

Table 18 / Typical Properties of EPI-REZ Water Reducible Epoxy Resins

Product Chemical

Type Viscosity



EPI-REZ WD 510 Water Red. DGEBPA

80-120 190-205 < 1 9.6 Water dispersible Bisphenol A epoxy resin.

EPI-REZ WD 512 Water Red. DGEBPA

150-600 195-210 < 1 9.7 Water dispersible Bisphenol A epoxy resin.


Safety, Storage & Handling Please refer to the MSDS for the most current Safety and Handling information. Please refer to the Hexion web site for Shelf Life and recommended storage information. Exposure to these materials should be minimized and avoided, if feasible, through the observance of properprecautions, use of appropriate engineering controls and proper personal protective clothing and equipment, and adherence to proper handling procedures. None of these materials should be used, stored, ortransported until the handling precautions and recommendations as stated in the Material Safety DataSheet (MSDS) for these and all other products being used are understood by all persons who will workwith them. Questions and requests for information on Hexion Specialty Chemicals, Inc. ("Hexion") productsshould be directed to your Hexion sales representative, or the nearest Hexion sales office. Information and MSDSs on non-Hexion products should be obtained from the respective manufacturer. Packaging Available in bulk and drum quantities. Contact Information For product prices, availability, or order placement, call our toll-free customer service number at: (866) 443-9466 For literature and technical assistance, visit our website at: www.hexion.com/epoxy Form Number EPON Product Overview 2009-08

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The information provided herein was believed by Hexion Specialty Chemicals (“Hexion”) to be accurate at the time of preparation or prepared from sourcesbelieved to be reliable, but it is the responsibility of the user to investigate and understand other pertinent sources of information, to comply with all laws andprocedures applicable to the safe handling and use of the product and to determine the suitability of the product for its intended use. All products supplied by Hexion are subject to Hexion’s terms and conditions of sale. HEXION MAKES NO WARRANTY, EXPRESS OR IMPLIED, CONCERNING THE PRODUCT OR THEMERCHANTABILITY OR FITNESS THEREOF FOR ANY PURPOSE OR CONCERNING THE ACCURACY OF ANY INFORMATION PROVIDED BY HEXION, except that the product shall conform to Hexion’s specifications. Nothing contained herein constitutes an offer for the sale of any product.

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Epon product overview 2009 08