-
Model
Process
Define
Series
HO2
GIass iwatch, 2. 5D)
0.5un-10um, White. Pink
EVEN (D50.90)'Jser
(25Kg. PE Bucket)
O1,FP '
,
W 3 ge
Application
Optical GIass, Lens
Optical GIass,
Mob Ie GIass
2. 0--0. 4 Touch Panel
-
Define
Series
GA01 -1 2
BIue F Ier GIass
0.5, 0.8, 1.0, 1.2 seriesEVEN (D50.90)'Jser
(25Kg. PE Bucket)
GA 05
GA-08
GA- 1 0
GA-1 2
1.1
1.5
3. 2
3. 8
-
Model
Process
Define
Series
G G-80
C.G CelI Cutting, Hole
1. Lock Ga1'net Cutting
Cuttng 2. Low Dusting : 6 , 3 , 3 Filter3. Non toxic : no s
icosis hazard, leachaUe heav y
metals or radioactive contan inants.
{typi :u )' uatlve 9 eainedu s /e /4 I'50n h !''; ',13 OOg 120
25 20 Og 65 O 13 0g $0 s 54 425 9 }$ 1S , 7 5 } 3009 S 2 o99 90
2129'80 130980 1 9911 12550 g6
: :
:, ;
':
: :
-
Pocess
Define
Series
GH-44P(B)
Cover GIass
1. Na Fnee, Na : 0 PPM
2. Bead 3. Quality(G4) CS 750 Mpa
DOL 72 uml,
, 'ij : ':', '
i ':
' : * .
GH -44P GH -44B
-
Pocess
Define
Series
G LJ04
3D GIass ( Edge, iwatch, 2.5D)
Scratch Crack , 1. , 1 WOek
-) Even 2. WOt 3. Low Hardness , 6-84. CeO2
CeO2
Bod'y HEPU PI Silicon
Handness 6-8 1 0-1 5 3-8
Pad
-
G F-1 000
Filtering Pocess
Def ne
Series
Ftering Capacity
3
50L/min 10urn
2
25L/min 8um
Scratch Crack , 1. Non Fter
2. 8(10)unn Ra''ticle Rerfect filte''ing
3. Maintenance .
Descri pton 2 3
Operating Pr'
(P S I)30-40 40-45
FIow late
iter/min)1 9-38 57-95
Filter ng Limit
(urn)7-10 10-1 2
Din ension
(L* D)260*50 360*75
| n/Outlet Size 1 2. 5/1 8. 25/37. 5
Cyclone F lter, F lter
-
Define
Series
C.G CelI Cutting, Hole
1. Filtering Chip, , .etc
2. Tonk . 3. ouble 4. Scratch, Crack
: Rotary :
-
Model
Pocess
Define
Series
GINZ-05(1 27)
Woterjpt GIass Cut ( ie, R, Pienc ng)
1. Spot 2. Longer Life time
3. 0.5-1.27 full series
OD DL mP'ch mHD,nch mmL ,nchm' 'nch rnm 'nch mm 'nch
9
-
GSTP-820
Pocess Wter jet Cutting & Stripping
Define
Stripped
Pictu e
1. 1.5-2.5mm, Jig 2. Gell 3. Amine 1.5% under
4. .Bubble
GSTP-820
.
1 0
-
Define
Series
GC-1 00A
PoIish ng Cerium
.
1. 40 nde'' GIass Peeling 2. CeO2 3. Micro CIass 4. SUS, PVC, P
/A, Nylon , 5. No need UItrasonic
6. ,
GC-1 00C
GC-1 00A
4. 5
5. 3
1 1
-
G PSR4
PoIishing Cerium
GIass Polishing Cerium . Coating
1.
2. .
: SS, PVC, Paint
Coating
Effects
GPSR -4
-
Define
GHC-1 0
KNo3 Na
Na .
1. Gl=S 2. Na , 168hi' I (1 ' 'eek)3. Particle Zeno4. : A1'm n
2% under
:- :-:
1 3
-
Process
Define
C R-1 00
LCD.TSP ACF Bond ng rework
At N.G COG/FOG/PCB Bonding, Thermal cured
resin should be clean without remain ng.
Rernain sludge! lt will be make 2nd trouble
1. COG/FOG/PCB all available
2. AII ACF ava lable
Dexerial( Sony). TACI . H&S3.
2r'nin under
4. No hazad cornponents
MEK.NMP etc.
CF Rernover
-
GC-50/90
Process LCM+TSP(CG), CG+Senor Rework
Harden G'ass
Define
Series
OCR. OCA availableUrethane, Silicon Son'y. Henkel. Kyoritsu / MT
V. A. LH No hazand components
GC-50 U ethane GC-90 Silicon
,: :, ,
'
