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ANALYSIS OF MICROCHANNEL
HEAT-EXCHANGERPresented by:-1)Rohit Dey2)Niladri Das3)Vishal Kumar4)Debojyoti Biswas -ME 4th Year -Under guidance of Abhishek Tunga
“ HISTORY AND DEVELOPEMENT :-
Microchannels were first proposed for electronics coolingapplications by Tuckerman and Pease 1981.
Phillips provided detailedequations for designing microchannel geometries .
Colgan provided the results of a practical implementation of enhanced microchannels with a strip-fin geometry.
Kandlikar and Upadhye presented a detailed optimization procedure for selecting microchannel flow geometries.
Publication histogram showing papers related to single-phase liquid heat transfer and fluid flow in microchannels
History, Advances, and Challenges in Liquid Flow and Flow Boiling Heat
Transfer in Microchannels A Critical Review by Satish G. Kandlikar
APPLICATION :-◇ Cooling of electronics component
◇ Microchannel heat exchanger
◇ Microchannel reactor
◇ High-performance aircraft gas turbine engines
◇ Heat pumps
◇ Air conditioning
Relatively new topic of disscussion,so their is vast scope of developement.
Miniaturization of electronic component requires more efficient way of optimizing microchannel flows
Unique multiphase flow in microchannels
Microchannel-based MicroFluid devices using electric fields are of recent research interest for various purposes
Field of Interest in Microchannel Flow
Scope of Developement Geometric Optimization of the design of microchannels in heat sinks and heat exchanger.
Establishing a stabilised study on multi phase flow in microchannel.
Further study and developement on the behaviour and effect of flow boiling.
Controlled initiation of turbulent flow in microchannel.
Design and analysis of internally
finned microchannels
OUR OBJECTIVE :-
Analysis of single phase flow through
Different microchannels
Analysis of flow boiling
and control in microchannels
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PROJECT UPDATE:- Software used :-For Designing :- CREO 3.0
For Analysis :- ANSYS Fluent 16.0
Microchannel model we created in Creo
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COLOR CODE PARTS
Sky blue(transparent)
Air flow domain
Grey color Microchannel
Red Chip (heat source)
Blue Fluid domain
Cross sectional view of the model assembly